Abstract: A manufacturing method for a metal mark plates is disclosed. In this manufacturing method, a welding flux layer is firstly disposed onto a metal base plate, and a plurality of metal mark parts are arranged on corresponding regions of the metal base plate on which the welding flux layer is disposed. Thereafter, a laser spot welding step is performed to assemble the metal mark parts with the metal base plate by heating the backside of the metal back plate at a location corresponding to the welding flux layer. This manufacturing method therefore provides a fast and stable welding way for manufacturing the metal mark plate. Besides, this manufacturing method can be applied for automatic production and precise mass production could thereby be accomplished.

Abstract: The present invention relates to a composite assembly of plastic (1, 3) and metal films (2.1, 2.2) which can be used for the interconnection and connection of light-emitting diodes (LEDs) (5). For this purpose, a flexible printed circuit board is provided, to which at least one radiation source is applied and which consists of a film system. The flexible printed circuit board has a thermal connection (6) to a heat sink (4) and the film system is composed at least of an insulating carrier layer and a metal film. The insulating carrier layer is opened at the locations at which the thermal connection to the heat sink is produced, and the metal film is subdivided into different sections.

Abstract: A manufacturing technique includes creating stud bumps on the electrical contacts on a die, either in wafer or die form. A separate stencil or carrier is provided with cavities that correspond to the electrical contacts on the die. The cavities are filled with solder paste and the die is brought into close proximity with the stencil so that the stud bumps extend into the cavities and come into contact with the solder paste. When the die is removed, the solder paste stays affixed to the stud bumps and thereby the solder paste is transferred and delivered to the stud bumps. The die can then be affixed to a substrate such as a PCB.

Abstract: A back contact solar module and an electrode soldering method therefor are disclosed. The back contact solar module includes a substrate, two solar cells formed on the substrate, and a curved solder part. The curved solder part is soldered onto an electrode solder pad of each solar cell. The curved solder part has a curved portion between the two solder pads. The curved portion curves parallel to the substrate. Therefore, the invention utilizes the elasticity in structure or the allowable deformation of the curved portion to release the internal stress induced by the soldering on the electrode pads or by a following lamination packaging, which solves the problem in the prior art that the internal residual stress in an electrode solder part harmfully affects the electrical connection between solar cells.

Abstract: Connections can be made to microwires comprising a conductor of a lower melting point metal (e.g., indium 290) in a sheath of higher melting point polymer (e.g., PETG) by placing a small diameter spring, slightly larger in inside diameter than the outer diameter of the microwire, and of a readily solderable material over the distal end of the microwire. The conductor of the microwire is then soldered to the distal end of the spring in any of several ways that result in a solid member at the distal end of the microwire. The flexible spring provides a flexible support for the microwire, so that as the microwire flexes in use, the spring provides a strain relief; that is, the proximal portion of the spring flexes along with the microwire, so that the microwire bends over some distance rather than at a single point.

Abstract: A system for automated assembly and welding is disclosed. The system includes a pallet for receiving incoming workpieces; a workpiece holder having a plurality of electromagnets; a handling robot configured to transport incoming workpieces from the pallet to the workpiece holder; and a controller in communication with the workpiece holder and the handling robot. The controller is configured to determine an orientation of a workpiece positioned on the workpiece holder, and to selectively adjust an activation state of one or more electromagnets of the workpiece holder based upon the orientation of the workpiece. A method of assembling and welding workpieces is also disclosed.

Abstract: In a method for manufacturing a substrate, connections are provided through metal columns of bumps press-fitted into an insulating resin layer between metal foils contact-bonded to a thermosetting insulating resin layer. Bumps of a conductive paste containing metal fillers are formed on a metal foil which is to be contact-bonded to an insulating resin layer, the bumps are heated to bound the metal fillers to each other, and form a metallic bond between the bumps and the metal foil, the metal columns are press-fitted into the insulating resin layer to contact-bond the metal foil to the insulating resin layer, and join the tips of the metal columns to a metal foil, the metal columns are then reheated to form a metallic bond between the metal columns and the metal foil.

Abstract: A solder resist coating for a rigid-flex circuit board contains one or more conductor tracks and at least one flex area. The solder resist coating has one or more movement gaps in the flex area of the circuit board. In addition, an electronic module is formed having at least one rigid-flex circuit board with a solder resist coating.

Abstract: In order to lower the substantial heating temperature of a thermosetting adhesive and to realize favorable connection reliability during connecting an electrical element to a circuit board by anisotropic conductive connection with using solder particles, a product in which solder particles having a melting temperature Ts are dispersed in an insulating acrylic-based thermosetting resin having a minimum melt viscosity temperature Tv is used as an anisotropic conductive adhesive in producing a connection structure by connecting the circuit board and the electrical element to each other by anisotropic conductive connection.

Abstract: A manufacturing method for an electronic device joining a first metallic bond part formed on a first electronic component and a second metallic bond part formed on a second electronic component includes a first process for placing the first metallic bond part directly against the second metallic bond part, applying pressure to the first electronic component and the second electronic component, joining the first metallic bond part to the second metallic bond part with solid-phase diffusion, and releasing the applied pressure, and a second process for heating the first electronic component and the second electronic component at a predetermined temperature such that the first metallic bond part and the second metallic bond part are joined together by melting at least one of the first metallic bond part and the second metallic bond part.

Abstract: The invention is directed to fluid-containing pouches and to methods for forming fluid-containing pouches. In one embodiment, the invention is to a fluid-containing pouch, comprising first and second opposing sheets, and a fluid (e.g., a calibrant fluid, a reactant fluid or a wash fluid) disposed between the first and second opposing sheets. The first sheet and the second sheet have a substantially liquid and gas impermeable perimeter seal. The sheets may be sealed, for example, by one or more of heat crimping, pressure crimping, heat and pressure crimping, ultrasonic welding, metal-to-metal welding or laser welding. Fluid-containing pouches sealed according to the disclosed methods and apparatuses show substantially improvement in terms of reduced gas exchange, notably CO2 pressurization levels.

Abstract: A sound-damped vehicle panel assembly, such as a dash panel, is attached to a structural member with one or more weld joints. The vehicle panel assembly may include a main panel member, a sound-damping patch, and a sound-damping adhesive layer arranged therebetween, where the patch covers at least a portion of an acoustically active region of the main panel member. The weld joints that attach the vehicle panel assembly to the structural member are preferably located at weld openings formed in the sound-damping patch and/or the sound-damping adhesive layer so that the weld joint can be formed without melting and vaporizing the adhesive during the welding operation, as such an operation would likely require additional ventilation equipment and could impact the quality of the weld joint.

Abstract: There are provided a joint structure for a fiber reinforced resin and a metal, and a joining method for a fiber reinforced resin and a metal. In the joint structure, a plurality of single elements each constituted by a metallic material, which includes a step-shaped structure having an end portion that gradually becomes thinner in a direction of an end surface of the end portion so as to form the step-shaped joint surface, and a fiber rein forced plastic, which is laminated such that end portions thereof cover the step-shaped structure smoothly, are laminated such that the step-shaped structures are superposed in a thickness direction, whereupon the metallic material and the fiber reinforced plastic are adhered to each other and adjacent elements are joined to each other by superposed surfaces thereof. The metallic materials are then welded to each other.

Abstract: Method for fabricating a heat exchanger which, in one aspect, includes providing a stack of a plurality of lamina each of which defines a pattern of lamina apertures, the apertures being substantially alignable in the stack; disposing a plurality of microtubes through respective aligned lamina apertures extending through and defined by the stack of lamina so as to form a subassembly, a clearance existing between each of the microtubes and their respective aligned apertures when the microtubes are so disposed; and adhering together the lamina in the stack and the plurality of microtubes so disposed while forming a seal at the clearances.

Abstract: An aluminum bonding alloy is an Ni—Mg alloy for bonding aluminum and a non-aluminum metal selected from steel, copper, nickel or titanium. The Ni—Mg alloy consists essentially of 0.08-0.90 mass % Mg, and the balance of Ni and inevitable impurities. A clad material includes a non-aluminum metal layer made of the non-aluminum metal and a bonding alloy layer made of the aluminum bonding alloy. The non-aluminum metal layer and the bonding alloy layer are bonded together by pressure welding and diffusion bonding.

Abstract: A double-sided substrate includes a ceramic substrate, a first metal layer formed on one surface of the ceramic substrate and having a plurality of subsidiary metal layers which are laminated on the surface of the ceramic substrate and whose purities differ from each other and a second metal layer formed on the other surface of the ceramic substrate, wherein the closer to the ceramic substrate any subsidiary metal layer is located, the lower purity the subsidiary metal layer has. Additionally, a semiconductor includes the above double-sided substrate, a power element and a heat sink.

Abstract: A method for weldbonding at least two work-pieces together includes applying an adhesive to a first surface of a first work-piece, and bringing the first surface of the first work-piece into contact with a surface of a second work-piece. The first work-piece and second work-piece are then friction stir or friction stir spot welded together, and the adhesive is cured. The use of bonding tools to maintain the two work-pieces together during curing of the adhesive is eliminated.

Abstract: A process for assembling two parts of an integrated electronic circuit has two successive steps. During a first step, the two circuit parts are made into a single unit by molecular bonding, realized on respective application surfaces of the two parts. During a second step, electrical connections are formed from connection portions already present in the application surfaces of the two circuit parts. The connections formed extend across the bonding interface, and are compatible with a high reliability and a high level of integration of the circuit.

Abstract: According to one example there is a printed circuit board having a first surface and a solder mask over said first surface. There is a layer of sealing material having a shape and location covering a zone of the solder mask which is vulnerable to degradation.

Abstract: A sealing and bonding material structure for joining semiconductor wafers having monolithically integrated components. The sealing and bonding material are provided in strips forming closed loops. There are provided at least two concentric sealing strips on one wafer. The strips are laid out so as to surround the component(s) on the wafers to be sealed off when wafers are bonded together. The material in the strips is a material bonding the semiconductor wafers together and sealing off the monolithically integrated components when subjected to force and optionally heating. A monolithically integrated electrical and/or mechanical and/or fluidic and/or optical device including a first substrate and a second substrate, bonded together with the sealing and bonding structure, and a method of providing a sealing and bonding material structure on at least one of two wafers and applying a force and optionally heat to the wafers to join them are described.

Abstract: A solder ball loading method capable of securely loading solder balls on connection pads includes applying flux on each connection pad group of a printed wiring board flux is not applied to a contact portion between a spacer and the printed wiring board to keep the flux from attaching to the spacer. Because the flux is not attached to the spacer, when the mask is detached from the printed wiring board, the printed wiring board need not be inverted, and damage to the solder resist layer 70 is minimized. Further, the heights of the solder balls and the upper surface of the mask are made equal by using the spacer, making it possible to securely load the solder balls on the electrode pads, one solder ball for each connection pad, and to reduce a probability that solder balls are not loaded or that a plurality of the solder balls are loaded onto a single connection pad.

Abstract: [Object] Provided are a connection method and an electronic device, in which the manufacturing process can be simplified, and a connection structure using an adhesive can be produced at low cost. [Solution] A connection method according to the present invention includes a step (a1) of preparing base materials 10 and 21 each including an electrode for connection using an adhesive, a step (b1) of covering electrodes 12 and 22 for connection using an adhesive with organic films 15 configured to prevent oxidation, the electrodes 12 and 22 being located on the base materials, a step (c1) of removing or thinning the organic films, and after the step (c1), a step (d1) of bonding the electrodes for connection using an adhesive to each other with an adhesive 30 mainly containing a thermosetting resin to establish electrical connection.

Abstract: A welding alignment and spacing article is provided for forming a welding gap between two structures to be welded together. The article includes a body having first and second surfaces that are spaced from each other at a selected spacing distance to define a region of selected body thickness. The body is formed from a non-metallic degradable body material in the region that can be wholly or partially degraded by exposure to a degrading agent to reduce the body thickness. The body is also formed from a non-degradable body material in the region. The degradable body material and the non-degradable body material are sufficiently incompressible to be useable as a spacer that maintains a specified welding gap distance between the two structures to be welded.

Abstract: A packaging substrate includes: a dielectric layer unit having top and bottom surfaces; a positioning pad embedded in the bottom surface of the dielectric layer unit; at least a passive element having a plurality of electrode pads disposed on upper and lower surfaces thereof, the passive element being embedded in the dielectric layer unit and corresponding to the positioning pad; a first circuit layer disposed on the top surface of the dielectric layer unit, the first circuit layer having first conductive vias electrically connected to the electrode pads disposed on the upper surface of the passive element; and a second circuit layer disposed on the bottom surface of the dielectric layer unit, the second circuit layer having second conductive vias electrically connected to the electrode pads disposed on the lower surface of the passive element. Through the embedding of the passive element, the overall structure may have a reduced height.

Abstract: Compressible grounding pads with two conductor layers separated by a compressible foam layer comprise: (A) A first conductor layer, e.g., copper foil; (B) A first adhesive layer in direct contact with a part of the first conductor layer, the first conductor layer extending beyond the first adhesive layer; (C) A foam layer in direct contact with one facial side of the first adhesive layer; (D) A second adhesive layer in direct contact with the opposite facial side of foam layer; (E) A second conductor layer, e.g., copper foil, in direct contact with the second adhesive layer, the second conductor layer extending beyond the second adhesive layer such that the second conductor layer joins with the first conductor layer; (F) An electrically conductive third adhesive layer in direct contact with the facial surface opposite the facial surface that is in direct contact with the second conductor layer; and (G) An optional release liner in direct contact with the third adhesive layer.

Abstract: An embodiment of the present invention is an interconnect technique. Carbon nanotubes (CNTs) are prepared. A CNT-solder composite paste is formed containing the CNTs and solder with a pre-defined volume fraction.

Abstract: To permanently apply lead terminals to corresponding electrodes of electronic or electro-optic components, the following steps are carried out: a. providing a frame including at least one tensioned wire, b. providing a holding jig including at least one seat in which a respective one of the components can be removably and temporarily retained, c. applying the components to the seats with the respective electrodes aligned along a respective longitudinal direction; in this way a row of aligned components is obtained, each component having a corresponding electrode aligned to the subsequent one in the row, d. applying the holding jig to the frame and orienting the same so that the longitudinal direction corresponds to the direction of the tensioned wire, the tensioned wire being thereby brought substantially in contact with (all) the electrode(s) aligned to each other on a corresponding row of components, e.

Abstract: Provided is a layered electronic circuit device capable of realizing high-density/high-function mounting, easily inspecting and repairing the respective constituent elements, and improving the electronic connection characteristic. The layered electronic circuit device includes a first circuit substrate (101) and a second circuit substrate (102) which are arranged in parallel such that their substrate surfaces are opposed to each other. The peripheral portion of the first circuit substrate (101) and the peripheral portion of the second circuit substrate (102) are connected to each other by connection members (10a to 10d) having a wiring member (103) and a thermal hardening anisotropic conductive sheet (107), thereby performing electric connection.

Abstract: Disclosed is a battery casing manufacturing method which comprises: providing a casing film; providing a casing body; aligning the casing film and the casing body; and connecting the casing film and the casing body by using a welding process. The welding process transmits energy to the predetermined joint area of the casing film and/or the casing body in a non-physical contact way to make them connected.

Abstract: A conductive ball mounting apparatus for mounting conductive balls by providing an array mask having through holes, into which conductive balls are to enter, above a mounting target placed on a stage, by arranging a ball reservoir having an opening for reserving a plurality of conductive balls, in the bottom, by moving the ball reservoir along the array mask, by dropping the conductive balls into the individual through holes of the array mask, adopts the following means. Firstly, the conductive ball mounting apparatus comprises moving means for moving the array mask and the stage relative to each other in horizontal directions. Secondly, the positions of the conductive balls in the through holes are arranged by finely moving at least one of the array mask and the stage relative to each other in the horizontal directions after the balls were dropped.

Abstract: An electrolyte containment structure for an electrode jelly roll and electrolyte in a portable power source is described. The electrolyte containment structure comprises metal foil, such as metal foil sleeve, coupled to and partially surrounding a rigid frame. The rigid frame can protect the electrode jelly roll edges from crush events. To prevent shorts, the metal foil can be coated in plastic, which can insulate the metal foil from the electrode jelly roll. Further, the plastic can serve as a bonding and sealing agent. For instance, the metal foil can be coupled to the rigid frame using a thermal bonding method involving melting of the plastic. The rigid frame can provide a platform for connector pads and safety circuitry associated with the portable power source.

Abstract: An exemplary combining method includes the following. Firstly, providing two components and a connector. Secondly, welding the connector to one of the two components, and securing the other one of the two components to the connector.

Abstract: A manufacturing method for an electronic device joining a first metallic bond part formed on a first electronic component and a second metallic bond part formed on a second electronic component includes a first process for placing the first metallic bond part directly against the second metallic bond part, applying pressure to the first electronic component and the second electronic component, joining the first metallic bond part to the second metallic bond part with solid-phase diffusion, and releasing the applied pressure, and a second process for heating the first electronic component and the second electronic component at a predetermined temperature such that the first metallic bond part and the second metallic bond part are joined together by melting the first metallic bond part and the second metallic bond part.

Abstract: The invention is a method for permanent connection of two components by soldering employing a glass or metal solder as the solder material. A layer system providing adhesion is applied to both components, between which the solder material is introduced. the layer system is heated to a soldering temperature characteristic for the solder material and results in a permanent solder connection between both components after cooling. The layer system providing adhesion has an adhesive layer applicable directly to the component and a solderable layer. The adhesive layer, if a glass solder is used, contains oxidic, carbidic, or nitridic components or mixed compounds thereof and, if a metal solder is used, the adhesive layer contains carbidic or nitridic components or mixed compounds thereof.

Abstract: A method of joining a first component and a second component is provided. The first component has a surface that comprises at least about 75% by volume of a refractory metal. The second component has a coefficient of thermal expansion greater than a coefficient of thermal expansion of the first component. The method includes disposing a coating on the surface of the first component. The coating includes an adhesion layer and a wetting layer disposed over the adhesion layer. The method further includes disposing a bonding material between the first and second components and joining them. The bonding material has a melting temperature lower than a melting temperature of the second component. An article made using the method is also presented.

Abstract: A specialized tool is provided for the removal of components in a microwave module in which a fixed tool having a channeled tip is positioned adjacent the component to be removed, with a hot stream of gas, forced through the channel to the top of the component which serves to heat the component, the component being removed through shearing when the component is forced against the tip.

Abstract: After a wiring substrate having, on its lower surface, an opening and terminals arranged therearound is provided, a sealing material is supplied to the lower surface of the wiring substrate, and a sensor chip is flip-chip mounted on the lower surface of the wiring substrate. The sensor chip has, on its front surface, a sensor surface and bump electrodes, and each bump electrode is thermocompression-bonded onto each terminal of the wiring substrate and the sensor surface is exposed from the opening. The sensor chip has, in its outer peripheral portion of the front surface, a first region where the bump electrodes are arranged and a second region where no bump electrode is arranged. The sealing material is supplied to a region planarly overlapped with the first region when the sensor chip is mounted later, and no sealing material is supplied to a region planarly overlapped with the second region.

Abstract: A honeycomb body includes at least one housing and metal foils forming a channel structure. The channel structure is fastened to the housing by a multiplicity of linear brazed connections. A production method for providing the linear brazed connections between the channel structure and the housing and an exhaust gas treatment component having the honeycomb body in an exhaust system of a motor vehicle, are also provided.

Abstract: The present invention is directed to a fluid conduit assembly. In accordance with one embodiment of the present invention, the inventive fluid conduit assembly includes a fluid conduit having an inlet, at least one outlet and a fluid flow passageway therebetween configured to allow for fluid to be communicated between said inlet and said at least one outlet. The inventive fluid conduit assembly further includes at least one damper disposed within the passageway of the fluid conduit. The damper includes a sealed vent configured to vent gases captured by the damper during a brazing process performed on the fluid conduit when unsealed.

Abstract: A high yield in a manufacture of an HDD having a high recording density and using a patterned medium by a trench-like or a dot-like pattern is realized. In this HDD manufacturing method, a magnetic field size (writing and reading) of a head in a head manufacturing process is measured in a head unit inspection process. According to the result of the measurement, the head is classified into a plurality of groups in a head classifying process. In a patterned medium manufacturing process, a plurality of types of the patterned media which are designed so as to correspond to the classified head groups are manufactured. In an HDD assembly process, the HDD is manufactured by combining the plurality of head groups and the plurality of patterned media following a predetermined rule.

Abstract: A method is provided for reclaiming a suspension from a disk drive head gimbal assembly (HGA). An ultrasonic probe is applied to the HGA's read/write head slider on a side opposite that of its solder balls. Ultrasonic oscillations are transmitted through the ceramic slider to the side with the solder balls. The oscillations break the brittle intermetallic compound of the slider balls and free the slider. The ultrasonic energy also weakens the epoxy adhesive between the slider and suspension. The method can be used with heat to further weaken the solder balls and adhesive.

Abstract: A catalytic converter cartridge comprises multiple square, rectangular or other flat sided catalyst coated substrates, each substrate of which has each of its flat sides covered by a compressible mat material. These multiple mat covered substrates or modules are arranged into a multiple module array enclosed within a metal shell with each module preferably separated from adjacent modules by sheet metal spacers.

Abstract: A method including disposing a first end plate adjacent to a second end plate, wherein the first end plate and second end plate each define a pattern of apertures. The first end plate is aligned with the second end plate such that the pattern of apertures in the first end plate is substantially aligned with the pattern of apertures in the second end plate. The method includes placing an end portion of each of a plurality of micro tubes in contact with the first end plate, the micro tubes being substantially vertically disposed and substantially perpendicular to a top surface of the first end plate, so as to place the micro tubes on the first end plate, and vibrating at least one of the micro tubes while the micro tubes are on the first end plate, thereby causing the micro tubes to insert into and through respective aligned apertures of the patterns of apertures in the first end plate and the second end plate.

Abstract: A self-assembly process is disclosed for integrating free standing microcomponents onto a template having a plurality of binding sites, an interconnect network, and trapping structures disposed downstream of the binding sites. The self-assembly is accomplished by flowing a fluid medium containing the microcomponents over the template such that some of the microcomponents are trapped at binding sites. The template may be simultaneously (or subsequently) heated to melt a binder such as a solder spot at each of the binding sites, and then cooled to connect the trapped microcomponents to the interconnect network. In one embodiment, removable blocking elements are disposed upstream of some of the binding sites, for example formed from photoresist. After assembling a first set of microcomponents, the blocking elements are removed, and a second set of microcomponents in a fluid medium are flowed over the template for assembly into the newly unblocked binding sites.

Abstract: An electronic device includes a semiconductor chip includes a functional area at a desired position and a board mechanically and electrically joined to the semiconductor chip board, with the board layered over the semiconductor chip. An electronic device includes at least one first joint member that joins the semiconductor chip and the board to each other and a second joint member that joins the semiconductor chip and the board to each other.

Abstract: After disposing bonding material including thermosetting resin containing solder particles in a region that covers at least land part on an upper surface of base wiring layer and holding electronic component by base wiring layer by positioning terminal part with respect to land part and adhesively bonding at least terminal part to bonding material that covers at least land part, bonding material is semi-cured by heating. Therefore, warp deformation of the base wiring layer can be suppressed and bonding reliability can be secured.

Abstract: A preform and method for forming a structural assembly are provided. The preform can be formed by friction welding structural members to a base member and subsequently providing a connection material to join the structural members. The resulting preform can be formed with dimensions and a configuration that approximate the dimensions and configuration of the structural assembly. Thus, the structural assembly can be formed by joining multiple members that are generally smaller than the finished assembly.

Abstract: A planar transformer or balun device, having small trace spacing and high mutual coupling coefficient, and a method of fabricating the same is disclosed. The method may comprise providing a first and a second inductor on a primary and a second substrate respectively, interleaving at least partially the first inductor with the second inductor, coupling the primary and the secondary substrates to form a unitary structure, and providing electrical contacts to couple the first and second inductors with another device or circuit.

Abstract: An autogenously welded structure is provided that includes a first face sheet, a plurality of individual stiffener elements, and a second face sheet. The stiffener elements each have a first edge disposed against the first face sheet and an opposed second edge. Each stiffener element has a central portion extending between the opposed edges. The central portion is disposed at an angle to the first face sheet. The stiffener elements include at least some stiffener elements that are disposed at an angle to at least some of the other stiffener elements. The second face sheet is disposed against the second edges of the stiffener elements and the first and second face sheets are autogenously welded to the edges of the stiffener elements.

Abstract: A method for producing an electronic part unit, the method includes: mounting a first electronic part on a first surface of a first substrate by reflow soldering; mounting a second electronic part on a second surface of a second substrate by reflow soldering; adhering a second surface of the first substrate to a first surface of a third substrate; and adhering a second surface of the second substrate to a second surface of the third substrate.