Abstract: System and method of producing multi-layered aluminum alloy products are disclosed. A multi-layered aluminum alloy product may be formed by first heating a first aluminum alloy to a first temperature where the first temperature is at least about 5° C. lower than the eutectic temperature of the first aluminum alloy, second heating a second aluminum alloy to a second temperature where the second temperature is at least about 5° C. higher than the liquidus temperature of the second aluminum alloy, and coupling the second aluminum alloy to the first aluminum alloy to produce a multi-layered aluminum alloy product.

Abstract: Briefly, a novel material process is disclosed wherein one or more nucleation modifiers are added, in trace amounts, to a lead-free tin-rich solder alloy to produce a solder composition with reduce or suppressed undercooling temperature characteristics. The modifier being a substance which facilitates the reduction of extreme anisotropic properties associated with body-centered-tetragonal tin based lead-free solder. The addition of the nucleation modifiers to the solder alloy does not materially effect the solder composition's melting point. As such, balls of solder with the nucleated composition freeze while other solder balls within the array remain in the melt. This effectively enables one substrate to be pinned to another substrate by one or more predetermined solder balls to secure the package while the remaining solder joints are in the liquid state.

Abstract: Disclosed is a method of producing a wear resistant layer on a substantially planar metal surface which is directly impacted in a comminution process, such as the impact surface of a grinding roller. A plurality of spaced apart wear plates are applied to the metal surface. The wear plates are anchored to the metal surface by a metallic welding material that forms a weld bond with the metal surface and a mechanical bond with the wear plates.

Abstract: A method and apparatus for batch brazing jet stacks in a diffusion furnace. The method may include inserting fusible parts into slots of quartz boats and transporting the quartz boats into an interior of a reaction chamber of a diffusion furnace. An operator may seal the interior of the reaction chamber and an atmosphere of the interior of the reaction chamber may be adjusted according to a brazing recipe. A preheated furnace heating element may be moved toward the reaction chamber to increase a temperature and the fusible parts may be brazed according to the brazing recipe. The furnace heating element may then be moved away from the reaction chamber, the chamber unsealed, and the brazed parts removed.

Abstract: Briefly, a novel material process is disclosed wherein one or more nucleation modifiers are added, in trace amounts, to a lead-free tin-rich solder alloy to produce a solder composition with reduced or suppressed undercooling temperature characteristics. The modifier being a substance which facilitates the reduction of extreme anisotropic properties associated with body-centered-tetragonal tin based lead-free solder. The addition of the nucleation modifiers to the solder alloy does not materially effect the solder composition's melting point. As such, balls of solder with the nucleated composition freeze while other solder balls within the array remain in the melt. This effectively enables one substrate to be pinned to another substrate by one or more predetermined solder balls to secure the package while the remaining solder joints are in the liquid state.

Abstract: An airplane wing has a lower wing cover, an upper wing cover and a wing spar. A first end portion of the wing spar is welded to the lower wing cover and/or a second end portion of the wing spar is welded to the upper wing cover.

Abstract: The invention discloses a method and a production installation for producing a sub-assembly consisting of a plurality of parts joined together, in which the first part (1) and second part (2) are removed from a parts delivery site in the vicinity of a transport device and deposited oriented in position on one of a plurality of parts transport carriers of the transport device, and subsequently together with the parts transport carrier transported to an assembly station. The parts transport carrier is stopped in the assembly station in a holding position, whereupon the parts (1, 2), oriented towards one another, are moved by means of a vertical positioning device (200a, 200b) together from a transport position on the parts transport carrier into a preparation position, then positioned relative to one another, clamped and then joined to form a sub-assembly, whereupon the joined subassembly is again deposited on one of a plurality of parts transport carriers and transported away thereby.

Abstract: Connector between a reaction pipe and a cooling pipe and method for connecting a reaction pipe to a cooling pipe. The cooling pipe is a double pipe having an inner pipe, disposed in the extension of the reaction pipe, and an outer pipe that surrounds the inner pipe to form an intermediate cooling space between them. A supply chamber is connected to the cooling space for supplying coolant thereto. A transition piece, connected to the reaction pipe, has a fork-shaped end portion composed of an inner portion and an outer portion with heat-insulating material between them. The outer portion is secured to the base of the supply chamber coaxially relative to the longitudinal axis of the cooling pipe. The supply chamber, transition piece and half shells form a prefabricated unit. An inner tube section is welded to, and extends out of, the supply chamber and is aligned with the inner portion of the transition piece.

Abstract: A solder paste comprising a solder alloy powder and a flux. The volumetric expansion at the time of melting of the solder alloy is at most 0.5%. The flux contains a bisphenol A epoxy resin and a curing agent selected from a carboxylic anhydride and a dicarboxylic acid. The solder paste can be used in applications suitable for high-temperature solders. The solder alloy has an alloy composition comprising, in mass percent, 70-98% of Bi, a total of 0-0.5% of at least one substance selected from Ag, Cu, Sb, In, Zn, Ni, Cr, Fe, Mo, P, Ge, and Ga, and a remainder of Sn.

Abstract: A method is provided for solder reflow which includes the steps of providing a receptacle having receptacle pads formed on an upper surface and placing a component on the receptacle, the component having a ball grid array of solder balls attached thereto. The component is placed on the receptacle in a manner which aligns the solder balls with the receptacle pads on the receptacle. The method further includes the steps of placing a weight having a predetermined size and a predetermined mass on top of the component to form a stack of the receptacle, the component and the weight, and reflowing the stack to attach the component to the receptacle by exposing the stack to high temperature to reflow the solder balls.

Abstract: A system and method for manufacturing welded structures comprises components to be welded, a welding additive material which, before the welding, has a shaped profile and the shaped profile is disposed between components to be welded and conforms with at least one of the components to be welded. At least one heat source is used in the method to weld the components, producing a weld seam on at least one side of one of the components.

Abstract: A production method of a heat exchanger member to be brazed includes spraying particulate powder of metal less noble in corrosion potential than Al, an alloy of the metal, or a composition of the metal, at 150° C. or less at high speed onto a surface of a substrate of aluminum or its alloy to thereby make the particulate powder adhere to the surface. The metal is diffused in the surface layer portion of the substrate by the brazing heating to form a sacrificial corrosive layer.

Abstract: [Problems] To accommodate a plurality of optical semiconductor elements in one package with their optical axes aligned highly precisely. [Means for Solving the Problems] An optical transmission module includes an optical transmission unit, a carrier to become a base, a semiconductor optical amplification element mounted on the carrier through a first sub-carrier, first and second lenses fixed on the carrier through first and second lens holders, an element supporting member and an optical isolator fixed on the carrier, a third lens holder supported by the element supporting member, a third lens and a small carrier individually fixed in the third lens holder, and a semiconductor laser element mounted on the small carrier through a second sub-carrier.

Abstract: Reusable printing forms and thermal image setting on the printing forms is optimized in terms of performance. A method for manufacturing the printing form, in particular a rewritable printing form, having a thermally insulating layer, is distinguished by the fact that the thermally insulating layer is produced by the configuration of individual layers to form a layer sequence as a multilayer system. A printing form which is manufactured by the method according to the invention can have images set on it with a low power image setting device, as it is possible to effectively prevent heat from dissipating in an undesirably pronounced manner, for example into a metallic carrier.

Abstract: The present invention provides a method of bonding steel members by bonding a plurality of steel members made of a Cr-containing steel material to each other. The method includes a united body forming step S10 in which a united body is formed by making the plurality of steel members butted to each other and by heating the plurality of steel members to a first temperature while pressing the plurality of steel members under a predetermined pressure condition; and a bonding strength enhancing step S30 in which the united body is heated to a second temperature equal to or above an A1 transformation point of the steel material and, subsequently, is gradually cooled to a third temperature equal to or below 600° C. under a condition that lowering of temperature to 600° C. from A1 transformation point takes 10 hours or more in this order.

Abstract: A flip-chip packaging process is disclosed. The present invention is featured in forming a copper pillar on a wafer, forming a solder on a substrate; and enabling the solder to substantially cover the entire externally-exposed surface of the copper pillar, thereby connecting the copper pillar to the substrate. The copper pillar of the present invention can be such as a prism or a cylinder.

Abstract: A method and a device produce a fleece of metallic fibers in a layer in which the metallic fibers are welded to one another to form the fleece. A welding process is repeatedly carried out with regard to a portion or section of the fleece. Such metallic fiber fleeces are used, in particular, for exhaust gas treatment units in the automobile industry.

Abstract: This invention discloses a method, using pure niobium as a transient liquid reactive braze material, for fabrication of cellular or honeycomb structures, wire space-frames or other sparse builtup structures or discrete articles using Nitinol (near equiatomic titanium-nickel alloy) and related shape-memory and superelastic alloys. Nitinol shape memory alloys (SMAs), acquired in a form such as corrugated sheet, discrete tubes or wires, may be joined together using the newly discovered technique. Pure niobium when brought into contact with Nitinol at elevated temperature, liquefies at temperatures below the melting point and flows readily into capillary spaces between the elements to be joined, thus forming a strong joint. A series of diagrams of the interface at various stages of brazing is illustrated by FIG. 10.

Abstract: A method for assembling, and the resultant electronic module, includes attaching a chip to a substrate using a first solder interconnection array, and attaching a board to the substrate using a second solder interconnection array, which may be a single-melt or a dual-melt solder array. The second solder interconnection array resides entirely within a space defined between the board and substrate. A creep resistant structure is provided within this space for maintaining the defined space and optimizing integrity of the second solder interconnection array. The creep resistant structure may include an underfill material, balls, brackets, frames, collars or combinations thereof. Wherein the creep resistant structure is an underfill material, it is crucial that the substrate be attached to the board before either entirely encapsulating the second interconnection array with underfill material, or partially encapsulating the second solder interconnection array at discrete locations with underfill material.

Abstract: A filter underdrain apparatus and a method for manufacturing such apparatus. The apparatus includes a cover member, a water orifice member and a bottom member, each being individual pieces. The cover is placed over the water orifice member and connected thereto by welding. The bottom member is likewise connected to the cover and water orifice members by welding. A water passageway and an air passageway are defined in the inside of the assembled members. Water egress from the water passageway is provided by holes in the water orifice member and the cover. Air egress from the air passageway is provided by holes in the cover.

Abstract: A method for fine positioning a component through the use of fusible elements having two or more melting points so as to establish intermediate displacements between totally melted fusible elements and unmelted fusible elements. Because of the use of non-eutectic fusible materials, fine adjustments in the displacement may be achieved.

Abstract: One embodiment of a welding apparatus includes a stationary welding device that defines a stationary weld zone, and a support that moves a weld member through the stationary weld zone.

Abstract: Motor-vehicle bodies or sub-assemblies thereof are assembled in a welding-assembly station with the aid of frames arranged at the two sides of the conveying line that traverses the station, said frames being provided with fixtures for locating and clamping the various parts of the body. The side frames are moved between their operative position in the station and an inoperative position at a distance from the station with the aid of multi-axis manipulating robots. Said robots, however, do not carry the frames up to their final operative position for assembling the body, but rather unload them on two rigid structures, which are prearranged at the two sides of the line and are movable in a transverse direction with respect thereto between an open condition and a closed condition. The movable structures, once they have received the frames from the robots in their open condition, displace into their closed condition, thus carrying the frames into their final operative position.

Abstract: A conductive ball arraying apparatus includes an arraying jig having ball insertion parts at a predetermined array pattern, a ball cup that has an opening part on a lower surface thereof and is capable of housing a plurality of conductive balls, moving means that moves the arraying jig and the ball cup relatively and moves the ball cup relatively along an upper surface of the arraying jig and dropping off the conductive balls into the ball insertion parts of the arraying jig. The apparatus includes means for detecting a quantity of the conductive balls in the ball cup and detects as to whether the quantity of the conductive balls in the ball cup reaches at least one of an upper limit and a lower limit and/or means for detecting leakage of the conductive balls from a clearance between the ball cup and the arraying jig.

Abstract: Methods of manufacturing optical transceiver modules using lead frame connectors that connect optical sub-assemblies to printed circuit boards are disclosed. The lead frame connector includes an electrically insulating case having a first part separated from a second part and a plurality of conductors that are electrically isolated one from another by the electrically insulating case. Each of the plurality of conductors can form an electrical contact restrained in a fixed position with respect to the first part and a contact point extending from the second part. The electrical contact is aligned with and soldered to the leads that protrude from the back end of an optical sub-assembly. The contact points can then be connected to electrical pads on a PCB.

Abstract: Reactive foils and their uses are provided as localized heat sources useful, for example, in ignition, joining and propulsion. An improved reactive foil is preferably a freestanding multilayered foil structure made up of alternating layers selected from materials that will react with one another in an exothermic and self-propagating reaction. Upon reacting, this foil supplies highly localized heat energy that may be applied, for example, to joining layers, or directly to bulk materials that are to be joined. This foil heat-source allows rapid bonding to occur at room temperature in virtually any environment (e.g., air, vacuum, water, etc.). If a joining material is used, the foil reaction will supply enough heat to melt or soften the joining material, which upon cooling will form a strong bond, joining two or more bulk materials.

Abstract: A metal foil connection of first and second metal foils having a thickness of less than 0.05 mm includes a connecting point in which the metal foils are brazed to one another. The connecting point forms a wedge which is filled with brazing medium. A mass of the brazing medium, and a mass of sections of the metal foils which the brazing medium contacts in the wedge, have a given ratio. A honeycomb body, a brazing medium particle fraction and a method for manufacturing metal foil connections with a thickness of less than 50 micrometers, are also provided.

Abstract: An automated soldering system includes a robotic soldering machine and a plurality of feed lines for delivering workpieces to be soldered by the soldering machine. Each of the feed lines transports workpieces such as LCD modules from an input end to a soldering area, and from the soldering area to an outlet end. The soldering areas are arranged within the range of motion of a soldering arm of the soldering machine are preferably arranged in a bilateral triangle having the pivot axis of the soldering are at its apex. The soldering arm is programmed to work reciprocally among the soldering areas, thus increasing the yield of the robotic soldering machine so that the soldering machine is more cost effective. The soldering machine may be programmed to perform different soldering operations at different soldering areas.

Abstract: Methods for producing toughness-optimized weld joints are provided. A welding procedure that will provide adequate toughness for the center-weld of the weld-joint is developed and used, and a welding procedure that will provide adequate toughness for the surface-weld of the weld-joint is developed and used.

Abstract: Methods of welding two pieces of metal to produce a weld joint having excellent fracture toughness are provided. Two pieces of metal are positioned for welding so as to form a narrow weld groove having two sidewalls with bevel angles of less than about 10°. Two or more layers are applied to the weld groove to produce the weld joint such that the heat-affected-zone of the weld joint is substantially free of rogue grains.

Abstract: A method is described for the manufacture of a Copper-Aluminium-Copper component (C-A-C “sandwich”) which can be used in the production of multilayer printed circuit boards, obtained by means of joining two external sheets of copper to one internal sheet of aluminium by means of a process of electro-mechanical joining, which does not require the use of additional material (such as, for example, an adhesive) and guarantees a consistently high level of quality. The joining process, normally continuous, is based on the use of a sonotrode to effect ultrasonic welding, wherein a single ultrasonic weld provides two joining zones between the two external copper sheets and the one internal aluminium sheet. According to a further embodiment, the component is manufactured with at least one layer of resin deposited externally on one of the external faces of the two copper sheets, which are not into contact with the internal aluminium sheet.

Abstract: A method of forming solder connections on a circuitized substrate having connection pads is provided. A laser ablatable solder mask material, preferably an epoxy, is degassed and then dispensed as a liquid onto the substrate over the circuitization. The surface of the solder mask material as applied is leveled, and the solder mask material is then cured to form a solder mask. Openings are laser ablated in the solder mask material to reveal those connection pads which are to receive solder to form the solder connections. Liquid solder is dispensed under pressure in a confined space into the openings as blades move laterally on top of the solder mask to fill the openings in the solder mask. The solder material is then solidified to form domed solder bumps in the openings.

Abstract: An automated soldering system includes a robotic soldering machine and a plurality of feed lines for delivering workpieces to be soldered by the soldering machine. Each of the feed lines transports workpieces such as LCD modules from an input end to a soldering area, and from the soldering area to an outlet end. The soldering areas are arranged within the range of motion of a soldering arm of the soldering machine are preferably arranged in a bilateral triangle having the pivot axis of the soldering are at its apex. The soldering arm is programmed to work reciprocally among the soldering areas, thus increasing the yield of the robotic soldering machine so that the soldering machine is more cost effective. The soldering machine may be programmed to perform different soldering operations at different soldering areas.

Abstract: Methods of welding two pieces of metal to produce a weld joint having excellent fracture toughness are provided. Two pieces of metal are positioned for welding so as to form a narrow weld groove having two sidewalls with bevel angles of less than about 10°. Two or more layers are applied to the weld groove to produce the weld joint such that the heat-affected-zone of the weld joint is substantially free of rogue grains.

Abstract: A structural material includes a plurality of discrete, interwoven wires disposed between and fastened to two solid face sheets. Each of the plurality of wires further includes at least two points of contact with each of the two face sheets. Methods for fabricating the aforementioned structural material include an automated methodology for fabricating a relatively inexpensive truss core sandwich panel.

Abstract: An axle connection device designed to be welded to an axle housing to permit a vehicle suspension system to be connected to the axle housing is disclosed. The device includes a generally flat baseplate having curvilinear ends separated by a relatively long and narrow waist. Each end includes a curvilinear side rim and two rounded corners from which longitudinally extending edges positioned on opposite sides of the device smoothly taper towards the waist. The device also includes a generally horizontally projecting plane having a waist aligned with the waist of the baseplate to divide the plane into two distinct portions. The plane also has two supporting sidewalls. Both sidewalls extend from just inside the rounded corners of a respective end of the baseplate and taper towards associated corners of the horizontally projecting plane. Each portion of the plane includes a generally rounded boss extending from the plane.

Abstract: A multi-layered metal plate with excellent damping capacity and particularly, to a multi-layered metal plate with excellent damping capacity and a method for manufacturing it, is less costly since the plate can be simply manufactured by simply attaching a thin plate on a main metal plate by the methods such as welding and the like, has excellent damping capacity and especially can be easily shaped. In addition, in the plate, the secondary plate is attached on one or both surfaces of the main metal plate.

Abstract: A rotor assembly comprising: a circular iron core having a top and bottom side spaced from each other; extruded aluminum bars inserted into and around the circumference of the circular iron core; and a pair of extruded circular end rings attached to the top and bottom of the iron core. The circular end rings are configured to have a plurality of openings configured to align with and receive a portion of the extruded aluminum bars when they are inserted into the iron core. A manufacturing process for manufacturing the rotor assembly is also described.

Abstract: A process is disclosed for brazing plate/plate and plate/fin multi-channeled structures using an amorphous brazing foil as a brazing filler metal between the parts in order to form uniform joints having optimal dimensions, shape and strength. The parts are assembled in an unconstrained stack, and a controlled load is applied to the top of the stack. The stack is then heated to a temperature at which the interlayer melts and reacts with the base metal to form the joints. The stack is cooled resulting in a brazed structure having the desired characteristics, wherein the brazed joints are optimally formed and the strength of the structure is equal to the underlying strength of the base metal.

Abstract: A metal foil connection of first and second metal foils having a thickness of less than 0.05 mm includes a connecting point in which the metal foils are brazed to one another. The connecting point forms a wedge which is filled with brazing medium. A mass of the brazing medium, and a mass of sections of the metal foils which the brazing medium contacts in the wedge, have a given ratio. A honeycomb body, a brazing medium particle fraction and a method for manufacturing metal foil connections with a thickness of less than 50 micrometers, are also provided.

Abstract: An apparatus including a backing plate and at least one “U” shaped structure emanating from and secured to the backing plate to form a closed loop, and a method for attaching a pad of friction material to a backing plate are disclosed. The apparatus comprises at least one rigid structure attached to the backing plate in at least two places. These structures form at least one closed loop with the backing plate. The pad is formed around the structures, completely surrounding the structures. In the preferred embodiment, the structures are two “U” shaped loops made of friction material, so that the pad can continue to be used when the pad wears down to the level of the loops.

Abstract: In an arrangement for determining the relative position of two bodies (3, 7) that are movable relative to each other, a separate measuring tape (29) is attached to a first (3) of the two bodies (3, 7). The measuring tape includes at least one track of measuring markings, distributed in the longitudinal direction of the tape. The second (7) of the two bodies (3, 7) carries a sensor arrangement (31) which responds to the measuring markings and travels along the track, in the course of relative movement between the two bodies (3, 7). The measuring tape (29) is attached to the first body (3), at at least two attachment points that are arranged at a distance from each other in the longitudinal direction of the tape, and is elastically stretched between the attachment points in the longitudinal direction of the tape.

Abstract: A multi layer printed circuit board with a 3-load topology is disclosed. First, second, and third integrated circuit (IC) printed wiring board packages having first, second, and third sets of terminals respectively are mounted on opposite sides of the board so that the second set of terminals are directly opposite the third set of terminals. Each package contains an IC die coupled to the respective set of terminals. The IC die in the first package is substantially identical to the one contained in the second package, and different than the one contained in the third package. For improved fanout of the metal lines that interconnect the first package to the second and third packages, each of the first, second, and third sets of terminals in the packages is arranged in substantially a U-shape. Each set of terminals has the same set of signal assignments of a parallel bus implemented by metal lines in the board.

Abstract: This invention relates to a method for producing a full face vehicle wheel and comprises the steps of: (a) providing a rim including an inboard tire bead seat retaining flange, an inboard tire bead seat, a well portion, an outboard tire bead seat, the inboard tire bead seat retaining flange including an outer surface, the inboard tire bead seat including an outer surface, an the outboard tire bead seat including an outer surface; (b) providing a disc including a generally centrally located inner wheel mounting portion and an outer annular portion, the outer annular portion including an inner surface and an outer surface, the inner wheel mounting portion including at least one of a fully formed center pilot hole and a plurality of fully formed lug bolt mounting holes, the center pilot hole defining a pilot hole axis and each of the lug bolt holes defining a lug bolt hole axis; (c) providing a wheel fixture tooling assembly for supporting the rim and the disc relative to one another, the wheel fixture tooling a

Abstract: A method and system are disclosed for protecting an electrical component from electrostatic discharge prior to its electrical connection to an additional component. Specifically, a flex on suspension circuit of a disc drive that is electrically connected to the read/write head is disclosed as having exposed leads for connection to a printed circuit cable assembly. The exposed leads are shunted with a solder conductor such as solder tape after testing of the circuit and head to prevent electrostatic build-up across the read and write elements. The flex on suspension circuit is then electrically connected to the printed circuit assembly cable by reflowing the solder conductor to bond the exposed leads of the flex on suspension circuit to the electrical contacts of the printed circuit assembly cable and also to remove the electrical short established between the exposed leads by the solder conductor.

Abstract: A method of making an electrically conductive contact on a substrate by applying a layer of solder paste to a circuitized feature on a substrate and selectively heating and melting the solder paste over the feature to form a solder bump. The excess solder paste is removed. A focused energy heat source such as a laser beam or focused Infrared heats the solder paste. A reflective mask with apertures may be used to allow focused heating source to selectively melt areas of the solder paste layer applied to a circuitized feature. The mask and excess solder paste are removed.

Abstract: A method for soldering pipes configures the pipes being soldered such that water running through the pipes is not permitted to pool in the pipes. The method also configures the pipes to facilitate sealing of the pipes after the soldering is completed.

Abstract: Torch tip for a torch, the tip adapted to be in fluid communication with a fuel gas and oxygen source for generating a flame, the torch tip including a tubular or substantially tubular body having a plurality of flame emitting spaced orifices, wherein the tubular body preferably is substantially U-shaped and includes a pair of spaced substantially parallel elongated legs. The torch tip can be used to simultaneously heat a plurality of closely spaced pipes for ease of removal or attachment to an object such as a reversing valve.

Abstract: A method for soldering pipes configures the pipes being soldered such that water running through the pipes is not permitted to pool in the pipes. The method also configures the pipes to facilitate sealing of the pipes after the soldering is completed.

Abstract: The invention provides a process for the production of a composite structural part which can withstand high thermal stress, consisting of at least one graphite part and at least one metal part made of a hardenable copper alloy. In accordance with the invention, the metal part is bonded, by a hot isostatic press process, with the graphite part, which has a layer made of copper or a copper alloy on the bonding surface. In this way, it is possible to use copper-chromium-zirconium alloys with more complex composite structural part constructions and with thin-wall parts of the metal component, without the good mechanical characteristics of the copper-chromium-zirconium alloy being destroyed.