Abstract: Systems and methods for the removal of electronic chips and other components from PWBs using liquid heat media are generally described. According to certain embodiments, PWBs comprising solder can be positioned within a rotatable housing. The rotatable housing can, in some embodiments, be at least partially immersed within a liquid heat medium. The liquid heat medium can be heated and/or maintained at a temperature sufficiently high to melt the solder. In some embodiments, the rotatable housing can be rotated while it is at least partially immersed in the liquid heat medium. The rotational force can aid, according to some embodiments, in the removal of solder, electronic chips (including those in which an integrated circuit is positioned on a piece of semiconductor material, such as silicon), and/or other electronic components attached to one or more surfaces of the PWB.

Abstract: The invention provides an apparatus and a method for recovering good solder for re-use from dross. Dross is introduced into a chamber (108) which is heated, whilst agitation is provided by means e.g. of an impeller (116). Recovered solder is drained through a drain valve (118) which is suitably thermally activated. Waste can be collected by inversion of the vessel via a motorised pivot.

Abstract: An apparatus for manufacturing a thermoelectric module includes an alignment mechanism for aligning a plurality of thermoelectric elements with respect to a plurality of electrodes attached to a substrate, wherein the alignment mechanism includes a dispenser having a plurality of injection portions and the plurality of thermoelectric elements is inserted into the plurality of injection portions.

Abstract: A process and tools for forming spherical metal balls is described incorporating molds, injection molded solder, a liquid or gaseous environment to reduce or remove metal oxides and an unconstrained reflow of metal in a heated liquid or gas and solidification of molten metal in a cooler liquid or gas.

Abstract: An apparatus for disconnecting solder joints between two welded surfaces includes a laser device for emitting laser beams to a solder joint, and a solder material removal device. And the solder material removal device includes a nozzle device having a first passage, a holder holding the nozzle device and having a second passage communicated with the first passage, and at least two pumping devices connected to the holder to pump the melted solder material out from the nozzle device and the holder. The laser device and the solder material removal device are separated, a glass cover with a hole formed thereon is covered on the top of the holder, and the laser device is located above the glass cover and separated from the holder. The present invention can shorten maintenance time and maintenance workload and improve work efficiency, furthermore reduce and stabilize the laser energy.

Abstract: Provided are a soldering device and a soldering method which allow for soldering at low cost with high yield and high reliability. The soldering device has: first organic fatty acid-containing solution bath 21 in which workpiece member 10 having a copper electrode is immersed in organic fatty acid-containing solution 31a; space section 24 having a steam atmosphere of organic fatty acid-containing solution 31b, the space section horizontally having ejection unit 33 to spray a jet stream of a molten solder to the copper electrode provided on workpiece member 10 and ejection unit 34 to spray a liquid to an excess of the molten solder for removal; and second organic fatty acid-containing solution bath 23 in which workpiece member 10 from which the excess of the molten solder is removed in space section 24 is immersed again in organic fatty acid-containing solution 31c.

Abstract: The present invention relates to a method and to a device for separating solder material deposits (12) from a substrate (10), in which a receiving sleeve (19) having a receiving opening (22) is positioned to overlap with a solder material deposit arranged on the substrate in such a manner that an opening edge (21) of the receiving opening is brought into abutment against the substrate in an essentially sealing manner, the solder material deposit is subjected to thermal energy and a sleeve lumen (23) that is defined by the receiving sleeve and that is disposed transverse to a longitudinal axis (30) of the receiving sleeve is subjected to an air flow (28) that is directed to an output device (29) of the receiving sleeve.

Abstract: A method for quantitatively determining flux material residues remaining on a heat exchanger after a preceding soldering process is provided. To this end, a fluid is applied to the heat exchanger, wherein the remaining quantity of flux material on the heat exchanger after the preceding soldering process is derived from the concentration of soldering agent in the fluid.

Abstract: Apparatus and methods for removing components soldered to a printed circuit board (PCB). Embodiments presented generally include a contact plate having a component specific platform offset from the contact plate body. The offset platform may be substantially identical in size and shape as the component to be removed. Accordingly, contact between a heated platform and component may allow for conductive heating to occur based on contact with the component. Thus, forced air or convective heating of the component does not occur such that solder joint defects in adjacent components may be prevented. A vacuum retention port may be provided at an interface of the platform and component when in contact. The vacuum retention port may allow the freed component to be removed from the PCB using vacuum to hold the freed component to the platform. Also, apparatus for automation of a process according to the forgoing are presented.

Abstract: A reflow furnace using a conventional heater for blowing hot air has difficulty in reducing ?t and in stabilizing the oxygen concentration at a low level. In addition, it is difficult to uniformly discharge hot air from the discharge holes in a perforated plate of a conventional heater for blowing hot air. In a reflow furnace according to the present invention, the total area per unit area of discharge holes formed in a perforated plate in a heater for blowing hot air installed in a main heating zone is 1.5-5 times the total area per unit area of the discharge holes formed in a perforated plate of a heater for blowing hot air installed in a preheating zone. A heater for blowing hot air has a body divided into three chambers by partitions.

Abstract: The present invention relates to a method and to a device for separating solder material deposits (12) from a substrate (10), in which a receiving sleeve (19) having a receiving opening (22) is positioned to overlap with a solder material deposit arranged on the substrate in such a manner that an opening edge (21) of the receiving opening is brought into abutment against the substrate in an essentially sealing manner, the solder material deposit is subjected to thermal energy and a sleeve lumen (23) that is defined by the receiving sleeve and that is disposed transverse to a longitudinal axis (30) of the receiving sleeve is subjected to an air flow (28) that is directed to an output device (29) of the receiving sleeve.

Abstract: A bonding apparatus (10) that bonds an electrode of a semiconductor die (12) and an electrode of a circuit board (19) using a metal nano paste includes a bump formation mechanism (20) that forms bump by injecting microdroplets of a metal nano paste on each electrode, a primary bonding mechanism (50) that carries out primary bonding to the electrodes in a non-conductive state by pressing the bump of the semiconductor die (12) against the bump of the circuit board (19), and a secondary bonding mechanism (80) that includes a pressurizing unit that pressurizes the primary bonded bump in bonding direction, and that carries out secondary bonding so that the electrodes become conductive by heating the bump up to a temperature higher than a binder removal temperature of the metal nano paste and a dispersant removal temperature of the metal nano paste, removing the binder and the dispersant, and pressurizing and sintering the metal nanoparticles in the bump.

Abstract: The heating apparatus allows an outlet of a heating nozzle to get opposed to an electronic component during detachment of the electronic component from a printed wiring board. Hot air blown out of the outlet of the heating nozzle is utilized to heat the electronic component. Electrically-conductive terminals thus melt between the electronic component and the printed wiring board. An air discharge nozzle is located in the vicinity of the heating nozzle. The air discharge nozzle serve to generate airflow at a location distanced from the heating nozzle. The airflow serves to suppress rise in the temperature in the vicinity of the electronic component. Other electronic component in the vicinity of the electronic component is reliably prevented from rise in temperature. The other electronic component is thus prevented from destruction.

Abstract: A reflow furnace includes a suction pipe extending within a heating region along a rail on which a conveyor travels. Suction ports are formed on the inner side of the suction pipe. Flux fumes inside the reflow furnace are sucked into the suction ports and transported to the exterior of a tunnel of the furnace by the suction pipe. The flux fumes are removed by a flux fumes removal apparatus on the exterior of the tunnel, and cleaned gas is returned to the interior of the tunnel at the entrance and the exit of the tunnel, where it forms air curtains which prevent the ingress of outside air.

Abstract: A soldering apparatus has a conveyor which conveys an electronic circuit board, a fluxer which applies a flux having water as a solvent to a surface of the electronic circuit board to be soldered, a first heating device which heats the electronic circuit board, a water removal device which removes water attached to the electronic circuit board, a second heating device which heats the electronic circuit board to maintain the electronic circuit board at a temperature at which the flux exerts its activating action, a flow soldering bath in which molten solder is attached to the electronic circuit board, and a cooler. The water removal device includes a gas blowing portion having a first jig which blows a gas to an electronic component disposition surface, and a drawing portion having a second jig which draws water from the surface to be soldered.

Abstract: There is provided a conductive ball mounting apparatus. The conductive ball mounting apparatus includes: a conductive ball mounting mask disposed to oppose a substrate having a plurality of pads coated with an adhesive flux, the conductive ball mounting mask having a plurality of ball mounting through holes for mounting each of conductive balls on each of the plurality of pads, the plurality of ball mounting through holes being arranged to oppose to the plurality of pads; and a conductive ball supplying unit for moving or removing the conductive balls on the conductive ball mounting mask by sucking an air on an upper surface side of the conductive ball mounting mask. The conductive ball mounting mask includes through portions formed to block passing of the conductive balls.

Abstract: An apparatus and a method for the removal of excess solder or contaminant, which are encountered on the surfaces of injection mold prior to the transfer of a solder on a silicon wafer. More particularly, there is provided for the removal of excess solder, which may be present on a mold surface, without removing any solder, which is located in cavities formed in the mold, and wherein the solder is applied through an injection molded soldering process.

Abstract: This invention provides a system capable of melting solder and removing the melted solder from a substrate. The heating system includes a desoldering tool having at least two handles, a first handle and a second handle. This way, an operator may grip the first handle or the second handle depending on the operator's preference of gripping the desoldering tool. The first handle has a cavity adapted to releaseably receive a storage where the melted solder can be deposited and stored. The storage may have a divot adapted to receive a key from the first handle so that the storage may be orientated in a predetermined position relative to the cavity. The cavity in the first handle is exposed so that the storage can be readily inserted or replaced. This allows the operator to easily replace and maintain the desoldering tool without a significant downtime.

Abstract: An apparatus for removing an image sensor from a printed circuit board. The apparatus includes a hot-air nozzle for producing hot air and a hot-air tube connected to the hot-air nozzle to transfer the hot air produced by the hot-air nozzle. The hot-air tube surrounds the image sensor and is formed with a plurality of outlets for outputting the hot air toward the image sensor so as to melt the solder.

Abstract: A heating head for soldering and de-soldering surface mount devices (SMD's) using hot inert gas or air is comprised of a handle in which there is placed a heater sub-assembly on which there is secured a quick connect mechanism for mounting a heating nozzle. The heater sub-assembly is enclosed in a shroud and is secured to the end of the handle by a thermal insulating ring, such shroud housing a ceramic rod having elongated bosses on which a heating element is secured, while a laminar flow equilizer is used to provide more uniform gas flow across the heating element. Quick connect mechanism is secured to the heater sub-assembly shroud and uses a spring loaded winged locking mechanism to the secure heating nozzles to the heater head. In one embodiment, the heating nozzles have a truncated pyramid shaped chamber to which individual end nozzles are attached for directing gas flow.

Abstract: A fluxer applies powdered flux to an object. The fluxer includes an enclosure that defines a chamber where the object is fluxed. The enclosure includes an inlet for receiving the object into the chamber prior to application of the flux and an outlet for discharging the object from the chamber after the flux has been applied. A conveyor extends through the enclosure for traversing the object into and out of the chamber. The fluxer also includes a hopper for storing the flux and an applicator in fluid communication with the hopper for applying the flux to the object. A flux recovery system is in fluid communication with the chamber to introduce and maintain a negative pressure within the chamber. As a result, excess flux is retained within the enclosure. This excess flux can then be recovered and recycled to the hopper.

Abstract: Discarded printed circuit boards are sorted according to the alloying elements in solder used on the printed circuit boards. After sorting, the printed circuit boards are heated to melt the solder, and the molten solder is collected.

Abstract: A nozzle device of a surface mounting device including a holder mounted and adhered closely to socket shafts by an elastic force of elastic members connected to both ends of the socket shafts, and a holder shaft formed on the bottom surface of the holder is disclosed. The nozzle device further includes a nozzle having a moving member assembled to the inside of the holder shaft, and moved in an upward or downward direction due to a pressure of air flown through the holder shaft, for picking up or placing a parts.

Abstract: A Die Bonder or a Wire Bonder contains a device for holding down a substrate. The device comprises a table with drill holes. The drill holes are mechanically programmable with regard to whether vacuum can be applied to them or not. The mechanical programming enables a fast and easy adaptation of the device to different substrates.

Abstract: An integral heating nozzle and a syringe needle pickup vacuum tube where the nozzle moves relative to the pickup tube, FIG. 4, and where the nozzle does not move relative to the pickup tip, FIG. 1. The relative movement allows the heating gas to be directed to the solder connections while the vacuum tube may be independently moved so as to attach to the component body for removal and replacement, even when the component body is small and of different contours. In both cases the nozzle size allows components of cross section 0.01×0.01 inch to 0.05×0.05 inch to bereplaced. The opening of the nozzle accommodates removing and placing these smaller components through the nozzle. In some embodiments helium rather than air or nitrogen is used as a heating gas.

Abstract: An array of solder balls is formed on a first substrate for interconnecting with conductive sites on another substrate. A ball pickup tool picks up balls with a vacuum suction from a fluidized ball reservoir and utilizes a puff of gas to release the solder ball(s) carried thereon to conductive sites of a substrate for bonding thereto. In another embodiment, the bond pads of a substrate are coated with a flux or adhesive and lowered into a fluidized ball reservoir for direct attachment of solder balls.

Abstract: A method and apparatus for desoldering electronic components from a substrate. A vacuum is used to enhance the flow of a hot gas under an electronic component to reflow the solder connections attaching the electronic component to a substrate. Water vapor is added to the hot gas to increase the heat capacity of the hot gas. A system for periodically changing the direction of flow of the hot gas and vacuum under the electronic component is used to uniformly heat the solder connections. A method and apparatus for depositing underfill material between an electronic component and the substrate on which the electronic component is mounted. A vacuum is applied to enhance the flow of underfill material into the space between the electronic component and the substrate.

Abstract: A solder receiving method for a printed circuit board having electronic components soldered thereon includes the steps of forming, in a recovering apparatus body, a solder alloy layer, a metal particle layer and a liquid heat medium layer according to differences in specific gravity thereof, and dipping the printed circuit board having the electronic components soldered thereon into the recovering apparatus. An additional step includes spraying, onto the printed circuit having the electronic components soldered thereon, a mixed fluid composed of metal particles and a liquid heat medium, kept at a temperature above the melting point of a solder alloy, to scrape a solder alloy and the electronic components off the printed circuit board, so that it is possible to efficiently recover solder from the printed circuit board having the electronic components soldered thereon.

Abstract: The present invention relates to a solder ball shaping tool and a method for using the tool. In a substrate there is formed a series of depressions. The tool is pressed onto a ball grid array and the ball grid array is realigned either with simple pressure or pressure assisted by heating. Where a solder ball may have been deposited upon a die or a chip package in a diameter that exceeds that of the designed diameter, a corral tool is used to substantially conform the solder ball to design dimensions and a design location. As the corral tool is pressed against the solder ball, portions of the solder ball will reflow both into the substrate depression and into the corral. Where the total volume of the solder ball does not exceed that of both the corral and the substrate depression, the corral tool is adequate to achieve a designed solder ball height.

Abstract: A safety switch device for a gas jet soldering gun includes a ignition push button having an outer periphery provided with a locking drive block, a housing having an inner wall defining an L-shaped drive slot mating with the locking drive block, and a spring mounted in the ignition push button for providing an axial thrust and a rotational torque. In such a manner, the user has to rotate the ignition push button to a proper position so that the ignition push button can be pressed to drive the igniter to ignite the fire, thereby preventing a child from freely opening the gas jet soldering gun.

Abstract: Method and apparatus for desoldering electronic compo from a substrate. A vacuum is used, to enhance the f a hot gas under an electronic component to reflo solder connections attaching the electronic compo o a substrate. Water vapor is added to the hot gas t ease the heat capacity of the hot gas. A system for p cally changing the direction of flow of the hot gas a uum under the electronic component is used to unifo eat the solder connections.

Abstract: Air knives 109,110 for a solder leveller each comprises an air knife tip 111. The tip has a nozzle slot 114, up-and down-stream lands 119, 115, which are parallel to a back surface 130. Beyond the lands, the tip has a wing 120 and a lip 117, with a wing face 121 and a lip face 118 Downstream from the lip face 118, an extension 131 is provided. This is set back 132 sufficiently far from the land 115 to have no fluid dynamic effect on a board being processed. The geometry of the wing and tip faces 121, 118 is such that the bulk of air from the slit passes over the wing and back towards solder applicators, carrying with it excess solder. The tips 111, that is an upper and a lower one for upper and lower air knives are mounted on plenum chambers 133 via their back datum surfaces 130. The plenum chambers are mounted in the solder leveller with the back surfaces 130 parallel to the board path.

Abstract: A solder-removing apparatus includes a heating portion for heating the object having the solder adhered thereto, a measuring portion for measuring the distance from the measuring portion to the object, a solder-drawing portion for drawing the molten solder on the object by suction, an X-Y moving portion for moving the object in an X-direction or a Y-direction, a Z moving portion for moving the object relative to the solder-drawing portion in a Z-direction, and a control portion for controlling the X-Y moving portion and the Z moving portion. During the time when the molten solder on the object is drawn by the solder-drawing portion, the control portion causes the X-Y moving portion to move the object, and also causes the Z moving portion to move the object relative to the solder-drawing portion in accordance with the distance, measured by the measuring portion, so that the distance between the solder-drawing portion and the object can be kept constant.

Abstract: A safety switch device for a gas jet soldering gun includes a ignition push button having an outer periphery provided with a locking drive block, a housing having an inner wall defining an L-shaped drive slot mating with the locking drive block, and a spring mounted in the ignition push button for providing an axial thrust and a rotational torque. In such a manner, the user has to rotate the ignition push button to a proper position so that the ignition push button can be pressed to drive the igniter to ignite the fire, thereby preventing a child from freely opening the gas jet soldering gun.

Abstract: Preferred embodiments for methods of removing an integrated circuit (“IC”) from a substrate, where the IC is attached to the substrate by multiple solder connections are disclosed. One preferred embodiment of the inventive methods provides the steps of heating the IC and substrate to the reflow temperature for the solder connections and pulling the IC from the substrate by means of a vacuum force. Another preferred embodiment of the inventive method provides the step of shearing the IC from the substrate after the substrate and IC are heated, but before solder reflow temperature has been reached, and where the shearing force may be programmed through a computer controlled servomotor. Preferred embodiments of certain apparatus applying the inventive methods for removing an integrated circuit from a substrate are also disclosed.

Abstract: A method and apparatus is described for reworking a printed circuit board having plugged vias and plated through holes. The printed circuit board, supported by a movable local support, is heated from only the bottom side by a heating device near the area on the PCB that contains the plated through hole or holes to be reworked. The heating device is removed when the solder in the plugged PTH is completely melted. At that time, blast air is turned on to remove and blow off the excess solder in the PTH. The compressed air is more effective in displacing the molten solder than is vacuuming, and has less chance of damaging the PCB than do conventional reworking methods, due to the non-contact nature of the invention.

Abstract: The invention is directed to techniques for installing a module on a circuit board by simultaneously heating a perimeter portion of the module, and bringing an inner portion of the module to temperature that is lower than that of the perimeter portion. Heating the perimeter portion of the module melts solder disposed between contact members of the module and corresponding contact members of the circuit board in order to form solder connections. Bringing the inner portion of the module to temperature that is lower than that of the perimeter portion reduces the likelihood of causing heat-related damage to the module itself. One arrangement of the invention is directed to a module installation system for installing a module on a circuit board. The module has a perimeter portion and an inner portion. The module installation system includes a heating source, a cooling source, and a nozzle coupled to the heating and cooling sources.

Abstract: A method for breaking off solder bridges between pins of a through-hole component on a printed circuit board, comprises the following steps: (1) providing a soldering apparatus, the apparatus having an opening corresponding to the through-hole component, the opening defining an opening wall surface, providing a slit at a predetermined position of the opening wall surface; and (2) blowing a gas of a predetermined temperature and a predetermined pressure at a predetermined time to the position of the solder bridges through the slit for removing the solder bridges from the through-hole component.

Abstract: An apparatus is provided for the drying of electronic components. The invention provides multiple holes through which air is passed before striking the components. This provides the apparatus of the invention with multiple air knives, thereby breaking major air flow into multiple eddy currents whereby these eddy currents have a low enough air pressure gradient such that the electronic components are not damaged or lifted from the conveyer belt on which they are transported.

Abstract: An apparatus and a method for attaching conductive balls by which the tact time necessary for the positional recognition of a substrate before the conductive balls are attached onto a substrate can be greatly reduced. A first camera and a second camera are moved together a suction head. After the suction head picks up the conductive balls in a conductive ball supply section, the suction head is moved to a position above a flux supply section so that flux can be attached to the conductive balls 10, and concurrently the first camera recognizes a positional recognition mark on a substrate. Then, during when the suction head is moved to a position above the substrate, the second camera recognizes another positional recognition mark on the substrate. In accordance with the positional recognition conducted above, the suction head is positioned accurately with respect to the substrate, and then the conductive balls are attached onto the electrodes on the substrate.

Abstract: A soldering/desoldering device, in particular for integrated circuits with electric/electronic components, comprises a heater nozzle having a substantially bell-shaped housing formed with a lower nozzle opening. A heat distribution plate which can be acted upon by hot gas is arranged in the heater nozzle. An edge of the heat distribution plate and the housing have formed thereinbetween at least one passage opening for hot gas flowing towards the nozzle opening. In order to attain a uniform heat distribution for soldering or desoldering purposes and to simultaneously reduce the discharge of hot gas from the heater nozzle, at least one return opening for hot gas flowing through the passage opening is disposed in spaced-apart relationship with the passage opening in the heat distribution plate.

Abstract: In a conveyor system with a radiant heating system, convection is provided with hollow elongated tubes having small holes for providing a gentle air flow toward a workpiece to heat the workpiece with convection and radiation.

Abstract: A method and apparatus for desoldering electronic components from a substrate. A vacuum is used, to enhance the flow of a hot gas under an electronic component to reflow the solder connections attaching the electronic component to a substrate. Water vapor is added to the hot gas to increase the heat capacity of the hot gas. A system for periodically changing the direction of flow of the hot gas and vacuum under the electronic component is used to uniformly heat the solder connections.

Abstract: A flow control nozzle for hot gases includes an input end to receive a hot gas. An output end of the flow control nozzle delivers the hot gas to a surface mount device attached with solder to a printed circuit board. A gas distribution mechanism is positioned between the input end and the output end. A gas flow control mechanism is positioned in the gas distribution mechanism to selectively alter the flow of the hot gas through the gas distribution mechanism such that the gas distribution mechanism and the gas flow control mechanism operate to deliver the hot gas to the output end in a substantially uniform manner that facilitates substantially uniform melting of the solder.

Abstract: A method and apparatus is described for reworking a printed circuit board having plugged vias and plated through holes. The printed circuit board, supported by a movable local support, is heated from only the bottom side by a heating device near the area on the PCB that contains the plated through hole or holes to be reworked. The heating device is removed when the solder in the plugged PTH is completely melted. At that time, blast air is turned on to remove and blow off the excess solder in the PTH. The compressed air is more effective in displacing the molten solder than is vacuuming, and has less chance of damaging the PCB than do conventional reworking methods, due to the non-contact nature of the invention.

Abstract: A disposable solder receiving capsule for a hand held vacuum solder extracting desoldering tool is formed of an outer tube which is closed at one end by a porous filter and is open at its opposite end, and a hollow solder collection chamber part having a tubular member with an open end and a closed end forming a solder receiving space within it. The solder collection chamber part is concentrically positioned within the outer tube with an air plenum disposed between the closed end of the chamber part and the filter and with at least one air channel extending the length of solder collection part for providing a path for gases entering the open end of the outer tube to the plenum and the filter that is separated from said solder receiving space. For facilitating solder reclamation, the capsule can be formed entirely of materials which are shape-sustaining when exposed to a temperature of 400° F.

Abstract: A nozzle is provided for the reworking of printed circuit boards with CBGA and CCGA solder containing chips comprising a housing having an internal hot gas chamber and configured to hold at the lower end of the nozzle a chip to be attached to the printed circuit board. The nozzle is provided with a support member and resilient means on the lower surface thereof which resilient means contacts the upper surface of the chip when the chip is placed in the nozzle. When a vacuum is applied to the nozzle the chip is held against the resilient means and compresses the resilient means so that the lower portion of the solder array is below the lower end of the nozzle. When the nozzle is then placed against a printed circuit board, the resilient means provides a pressure force against the chip and the printed circuit board which enables rework of the printed circuit board even though the printed circuit board may be warped.

Abstract: A debridging tool incorporated into an automated wave soldering system adjacent to and after a wave soldering station removes bridges and/or excess solder formed during the wave soldering process by emitting, at a desired temperature which can be set using a heater and one or more thermo measuring devices, a pressurized stream of air, inert gas or other fluid only under selected areas of a printed circuit board, including a flexible circuit. The tool comprises a movable nozzle from which the stream is emitted and a means for transporting the nozzle under the printed circuit board. The tool targets only those areas of the board where bridges or excess solder repeatedly form during the soldering process without disturbing solder joints where no bridges or excess solder form.