Abstract: A layer or layers for use in package substrates and die spacers are described. The layer or layers include a plurality of ceramic wells lying within a plane and separated by metallic vias. Recesses within the ceramic wells are occupied by a dielectric filler material.

Abstract: Disclosed is a heat exchanger comprising a boiling passage and cooling passage defined by opposite sides of metal walls. Layers of brazing material between the metal walls and a spacer member bond components of the heat exchanger together. It has been found that good quality brazed joints can be made by modifying the brazing thermal cycle to first employing a temperature of about 500° C. for an extended period of time and then elevating the temperature to about 590° to 600° C.

Abstract: Activated resinous composition contains, on the basis of epoxy resin being solid at a room temperature of 100 parts by weight, carboxylic acid compound of 1 to 10 parts by weight, hardening agent of 1 to 30 parts by weight, a hardening reaction initiation temperature of said hardening agent being 150° C. or higher, and solvent of 10 to 300 parts by weight.

Abstract: A bond free of an anti-stiction layer and bonding method is disclosed. An exemplary method includes forming a first bonding layer; forming an interlayer over the first bonding layer; forming an anti-stiction layer over the interlayer; and forming a liquid from the first bonding layer and interlayer, such that the anti-stiction layer floats over the first bonding layer. A second bonding layer can be bonded to the first bonding layer while the anti-stiction layer floats over the first bonding layer, such that a bond between the first and second bonding layers is free of the anti-stiction layer.

Abstract: An optical device may include a movable body holding a lens, a fixed body movably holding the movable body, a drive magnet and a drive coil for relatively moving the movable body with respect to the fixed body, and a metal member fixed to the drive magnet. The drive magnet is fixed to one of the movable body and the fixed body and the drive coil is fixed to the other of the movable body and the fixed body. A nickel plating layer containing at least nickel is formed on a surface of the drive magnet and a surface of the metal member, and the drive magnet and the metal member are joined to each other by a joining layer which is made of tin-based metal containing at least tin and is disposed between the drive magnet and the metal member.

Abstract: An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22, the thickness of which is reduced (to 3 ?m) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an opening 20a can be formed in the resin 20 if the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resin 20 which forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be prevented. Thus, the reliability of the connection of the via holes can be improved.

Abstract: A method of bonding a stainless steel part to a titanium part by heating a component assembly comprised of the titanium part, the stainless steel part, and a laminated titanium-nickel filler material placed between the two parts and heated at a temperature that is less than the melting point of either the stainless steel part or the titanium part. The component assembly is held in intimate contact at temperature in a non-reactive atmosphere for a sufficient time to develop a hermetic and strong bond between the stainless steel part and the titanium part. The bonded component assembly is optionally treated with acid to remove any residual free nickel and nickel salts, to assure a biocompatible component assembly, if implanted in living tissue.

Abstract: A method of forming an electronic device bond pad includes providing an electronic device substrate having an Al bond pad located thereover. An aluminum layer is formed over the Al bond pad. A metal layer is formed located between the Al bond pad and the aluminum layer. The metal layer comprises one or more of Ni, Pd and Pt and has a total concentration of Ni, Pd and/or Pt of at least about 50 wt. %. A gold bond wire may be attached to the aluminum layer.

Abstract: A practical bonding technique is provided for solid-phase room-temperature bonding not requiring a profile irregularity of the order of several nanometers, in which a high-vacuum energy wave treatment and continuous high-vacuum bonding are not required. Since an adhering substance layer is thin immediately after a surface activating treatment using an energy wave, a bonding interface is spread by crushing the adhering substance layer to perform bonding, so that a new surface appears on a bonding surface, and objects to be bonded are bonded together. In order to crush the adhering substance layer more easily, a bonding metal of a bonding portion of the object to be bonded requires a low hardness. According to the results of various experiments conducted by the present inventors, it was found that the hardness of the bonding portion which is a Vickers hardness of 200 Hv or less is particularly effective for room-temperature bonding.

Abstract: Disclosed herein are a power module using sintering die attach and a manufacturing method of the same. The power module includes: a substrate having an insulating layer formed on a surface of a metal plate; a circuit layer formed on the substrate and including a wiring pattern and an electrode pattern; a device mounted on the wiring pattern; a sintering die attach layer applying a metal paste between the wiring pattern and the device and sintering the metal paste to bond the wiring pattern to the device; and a lead frame electrically connecting the device to the electrode pattern, whereby making it possible to to simplify and facilitate the process, increase electrical efficiency and improve radiation characteristics, and manufacture firm and reliable power module.

Abstract: The invention provides clad billet for hot working plastic deformation processes for the production of clad products, including, but not limited to, clad pipe and tubing by extrusion of a hollow, bicomponent composite billet having a fully dense structural component and a partially dense component of a specialty alloy at a fraction of porosity predetermined to provide a flow stress compatible with that of the structural component. The components are diffusion bonded to the predetermined fraction of porosity in the specialty component by application of heat and pressure over time, including by hot isostatically pressing the billet components. Computer modeling techniques can be used to determine processing conditions for obtaining flow stress compatibility.

Abstract: Plate consisting of a steel substrate (1) and a precoat (2) consisting of a layer of intermetallic alloy (3) in contact with said substrate, topped by a layer of metal alloy (4), characterized in that, on at least one precoated face of said plate, an area (6) situated at the periphery of said plate has said metal alloy layer removed.

Abstract: Electronic assemblies including coreless substrates and their manufacture using electrolytic plating, are described. One method includes providing a core comprising a metal, and forming a dielectric material on the core. The method also includes forming vias in the dielectric material, the vias positioned to expose metal regions. The method also performing an electrolytic plating of metal into the vias and on the metal regions, wherein the core is electrically coupled to a power supply during the electrolytic plating of metal into the vias and delivers current to the metal regions. The method also includes removing the metal core after the electrolytic plating of metal into the vias. Other embodiments are described and claimed.

Abstract: A semiconductor chip mounting layer of a package substrate unit includes an insulation layer, a conductive seed metal layer formed on the top surface of the insulation layer, conductive pads formed on the top surface of the conductive seed metal layer, metal posts formed substantially in the central portion on the top surface of the conductive pads, and a solder resist layer that is formed to surround the conductive pads and the metal posts.

Abstract: A dual brazing alloy element for a materially integral connection of a ceramic surface to a metallic surface includes a first layer having a Ni-based brazing alloy with a Ni content of at least 50% by weight and having at least one component configured to lower a melting point of the Ni-based brazing alloy selected from the group consisting of Si, B, Mn, Sn and Ge. A second layer includes an active brazing alloy material having a total content of 1-15% by weight of at least one active element selected from the group consisting of Ti, Hf, Zr and V.

Abstract: A method of sealing a package includes plating a perimeter of a hole formed in a package and attaching a solder film to the plated perimeter, the solder film covering the hole. The method further includes assembling a device in the package and sealing the package to define an interior and an outside, the device being contained within the interior. Next, the method includes heating the assembled package in a vacuum oven to a predetermined temperature where the solder film bonds to the plated perimeter, evacuating the vacuum oven to form a vacuum until the solder film fractures as a gas contained in the interior escapes to the outside, and further heating the assembled package in the vacuum oven after the gas in the interior escapes to the outside and until the solder film re-melts and seals over the hole.

Abstract: In the formation of sheet material from molten glass, molten glass is formed in a melting furnace and transported through a precious metal delivery system to the forming apparatus. Disclosed herein is a method to mitigate carbon contamination of individual components of the precious metal delivery system prior to and/or during their use. The method involves coating portions of the precious metal with an oxygen generating material prior to assembly of the component, and may comprise one or more heat treating steps of the component in an oxygen-containing atmosphere.

Abstract: An assembly of two objects integral with each other through at least one linking element provided between both objects, said linking element including at least a first material portion comprising intermetallic compounds of a phase formed with a first brazing metal and a second metal the melting point of which is higher than that of the first brazing metal, said linking element further including at least a second material portion composed of at least a third metal, said second material portion contacting both objects.

Abstract: A method of bonding a stainless steel part to a titanium part by heating a component assembly comprised of the titanium part, the stainless steel part, and a laminated titanium-nickel filler material placed between the two parts and heated at a temperature that is less than the melting point of either the stainless steel part or the titanium part. The component assembly is held in intimate contact at temperature in a non-reactive atmosphere for a sufficient time to develop a hermetic and strong bond between the stainless steel part and the titanium part. The bonded component assembly is optionally treated with acid to remove any residual free nickel and nickel salts, to assure a biocompatible component assembly, if implanted in living tissue.

Abstract: Various circuit board interconnect conductor structures and methods of making the same are disclosed. In one aspect, a method of manufacturing is disclosed that includes forming a conductor post on a side of a circuit board. The conductor post includes an end projecting away from the side of the circuit board. A solder mask is applied to the side of the circuit board to cover the conductor post. A thickness of the solder mask is reduced so that a portion of the conductor post projects beyond the solder mask.

Abstract: An electronic board including an area forming a BGA type electronic component backing, and an electric heating resistor which supplies an amount of heat for soldering the component onto the plate is disclosed. The board includes a plurality of conductive layers alternating with electrically insulating layers, the resistor forming one of the conductive layers immediately underlying the surface layer. The board may also include a thermal drain. A facility for implementing the method is also disclosed. It allows for an electronic board to be repaired through replacing defective members without risking to unsolder or to damage adjacent members.

Abstract: In a method for producing a joint between a hollow profile made from steel and a component made from an aluminum material, a positive and material joint is produced by a braze welding process in conjunction with a pressing operation. The hollow profile is first pressed on a seating region of the component. Subsequently, a weld layer with an additive is applied by thermal joining, producing a positive and material joint between the hollow profile and the component. The positive joint is facilitated by first forming an end of the hollow profile to be pressed on. Preferably, forming is done by widening the end to be pressed on into the shape of a collar.

Abstract: A multi-layer seal arrangement includes a dissolution barrier between a braze alloy and a ceramic component. The inventive seal is useful for joining a ceramic component to another ceramic component or a metal component, for example. In one example, the braze comprises a gold alloy and the dissolution barrier comprises a layer of alumina on the order of 2-3 microns thick. A titanium wetting layer is provided between the alumina layer and the alloy. A metallization layer provided between the dissolution barrier and the ceramic component in one example comprises a layer of gold between two thin layers of titanium. In one particular example, a platinum mesh is included with the gold of the braze alloy to control braze flow during the brazing operation.

Abstract: The present invention provides technology for mounting components with simple processing and with comparatively high dimensional precision. Welding sections (21) and non-welding sections (31) are formed on a surface of a substrate (1) by transferring a mask pattern. Next, fusing material (4) is arranged on the welding sections (21), and the fusing material (4) is fused to the welding sections (21). The fusing material (4) is positioned with comparatively high dimensional precision using the non-welding sections (31). Next, a component (5) is mounted on the substrate (1) with the fusing material (4) that has been fused to the welding sections (21) as positioning guides. In this way, it is possible to mount the component (5) on the substrate (1) with high dimensional precision.

Abstract: A simple technique to solder submicron sized, ohmic contacts to nanostructures has been disclosed. The technique has several advantages over standard electron beam lithography methods, which are complex, costly, and can contaminate samples. To demonstrate the soldering technique graphene, a single atomic layer of carbon, has been contacted, and low- and high-field electronic transport properties have been measured.

Abstract: A threaded weld fitting and a method of welding a threaded weld fitting to the tank wall of a water storage tank are provided. The threaded weld fitting comprises a body defining an aperture and having a facing surface configured to be positioned facing the tank wall. A female thread is formed along the aperture. A first beveled surface portion of the facing surface extends from an edge of the body. A landing surface portion of the facing surface extends from the first beveled surface portion toward a longitudinal axis of the aperture. A second beveled surface portion of the facing surface extends from the landing surface and to the female thread. The landing surface portion and the second beveled surface portion together define an open annular area positioned to receive a portion of a weld formed by welding the threaded weld fitting to the tank wall.

Abstract: Described herein are a method and an apparatus for removing metal oxides and/or forming solder joints on at least a portion of a substrate surface within a target area. In one particular embodiment, the method and apparatus form a solder joint within a substrate comprising a layer having a plurality of solder bumps by providing one or more energizing electrodes and exposing at least a portion of the layer and solder bumps to the energizing electrode.

Abstract: The invention relates to a device for determining the combustion chamber pressure. The device includes a tubular base, a glow filament which projects from the tubular base, and at least one sensor element arranged in the tubular base. The invention is characterized in that the sensor element inserted between a front face of the glow filament and a prestressing element that is welded to the tubular base.

Abstract: A flux for use in soldering comprises a primary solids constituent present in an amount greater than about 50 wt. % and one or more secondary constituents that is selected from solvents, thickeners, and/or metal oxide reducing agents. The flux has a temperature profile in which the flux is in a non-flowable inactive state at temperatures at and below a maximum storage temperature that is above about 27° C., a liquid active state at an activation temperature, and a flowable inactive state in a deposition temperature range above the maximum storage temperature and below the activation temperature. A solder material comprises solder particles dispersed in the flux.

Abstract: In supplying flux to a brazing heat exchanger member, a given amount of the flux is stably adhered to brazing portions without interposing any substance which becomes unnecessary for the brazing such as binder. In manufacturing a heat exchanger member, particles containing flux are injected to a surface of a substrate made of aluminum or its alloy at a temperature lower than a melting point of the flux by 30° C. or more to collide against the surface at an average speed of 100 m/sec or higher to thereby mechanically adhere the particles thereto.

Abstract: In some embodiments, a printed circuit board (PCB) comprises a substrate comprising an insulating material. The PCB further comprises a plurality of conductive tracks attached to at least one surface of the substrate. The PCB further comprises a multi-layer coating deposited on the at least one surface of the substrate. The multi-layer coating (i) covers at least a portion of the plurality of conductive tracks and (ii) comprises at least one layer formed of a halo-hydrocarbon polymer. The PCB further comprises at least one electrical component connected by a solder joint to at least one conductive track, wherein the solder joint is soldered through the multi-layer coating such that the solder joint abuts the multi-layer coating.

Abstract: A manufacturing method for an electronic device joining a first metallic bond part formed on a first electronic component and a second metallic bond part formed on a second electronic component includes a first process for placing the first metallic bond part directly against the second metallic bond part, applying pressure to the first electronic component and the second electronic component, joining the first metallic bond part to the second metallic bond part with solid-phase diffusion, and releasing the applied pressure, and a second process for heating the first electronic component and the second electronic component at a predetermined temperature such that the first metallic bond part and the second metallic bond part are joined together by melting the first metallic bond part and the second metallic bond part.

Abstract: Methods and associated structures of forming a package structure including forming a low melting point solder material on a solder resist opening location of an IHS keep out zone, forming a sealant in a non SRO keep out zone region; attaching the IHS to the sealant, and curing the sealant, wherein a solder joint is formed between the IHS and the low melting point solder material.

Abstract: A bonding structure that a bonding region can endure a high temperature environment and the bonding can be maintained with high reliability is provided as a bonding material capable of maintaining reliable bonding in high temperature environment in place of solder including Pb. In the bonding structure for a first member and a second member, solder and glass are used to bond the first member and the second member together and the glass seals the solder. Thereby, electrical conductivity is ensured and the outflow of melting solder in high temperatures can be inhibited to improve the durability.

Abstract: A method for making thermally conductive high aspect ratio large area contact between devices with different coefficients of thermal expansion. The method of the invention includes the creation or placement of sparse structures on at least one of two surfaces or between the surfaces to maintain enough thickness that an interposed bonding material remains sufficiently compliant that relative thermal motion of the two devices can occur without damage to the devices or the bond during changes in temperature.

Abstract: Various circuit boards and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes applying a solder mask to a first side of a first circuit board. The first side of the first circuit board includes a first conductor structure and a second conductor structure. A first opening is formed in the solder mask that extends to the first conductor structure. The first opening has a first area. A second opening is formed in the solder mask that extends to the second conductor structure and has a second area larger than the first area.

Abstract: Process for the manufacture of a heat exchanger, in particular an evaporator, comprising the preparation, assembling and brazing of components of the heat exchanger, the brazing being carried out under given temperature conditions. Prior to the assembling and to the brazing, a surface treatment operation is carried out that includes applying a coating to a chosen component, the coating including a support, at least one active agent suitable for giving the heat exchanger chosen properties during its operation, and at least one thermal protection agent suitable for enabling the coating to withstand the brazing temperature conditions.

Abstract: A method of manufacturing a magnet system (101, 201) for an electro-acoustic transducer (100, 200) comprising a magnet element (105, 205) and at least one pole plate (106, 107, 206, 207), is described, wherein the method comprises providing the magnet element (105, 205) having a first coating layer comprising a first corrosion resistant material, providing the at least one pole plate (106, 107, 206, 207) having a second coating layer comprising a second corrosion resistant material, and connecting said magnet element (105, 205) and said at least one pole plate (106, 107, 206, 207) by fusing the first coating layer and the second coating layer.

Abstract: In joining an Fe-based metallic member comprising an Fe-based material and an Al-based metallic member comprising an Al-based material by a Zn-based brazing filler metal, a joined part of the Fe-based metallic member is heated at a temperature higher than a melting point of the Fe-based material.

Abstract: An ultra low permeability fluid member for conveying a fluid (e.g., a hose, tube, etc.) having a metal vapor barrier layer (22) formed around an inner tube (14). The metal vapor layer (22) is formed from one or more metal strips (40a, 40b) having edge portions (44) that are bonded so as to seal the vapor barrier layer (22) preventing permeation of vapor.

Abstract: A method of forming an interconnect joint includes providing a first metal layer (210, 310), providing a film (220, 320) including metal particles (221, 321) and organic molecules (222, 322), placing the film over the first metal layer, placing a second metal layer (230, 330) over the film, and sintering the metal particles such that the organic molecules degrade and the first metal layer and the second metal layer are joined together.

Abstract: A lead-free solder joint is formed between a tin-silver-copper solder alloy (SAC), SACX, or other commonly used Pb-free solder alloys, and a metallization layer of a substrate. Interaction of the SAC with the metallization layer forms an intermetallic compound (IMC) that binds the solder mass to the metallization layer. The IMC region is substantially free of any phosphorous-containing layers or regions.

Abstract: System and method of producing multi-layered aluminum alloy products are disclosed. A multi-layered aluminum alloy product may be formed by first heating a first aluminum alloy to a first temperature where the first temperature is at least about 5° C. lower than the eutectic temperature of the first aluminum alloy, second heating a second aluminum alloy to a second temperature where the second temperature is at least about 5° C. higher than the liquidus temperature of the second aluminum alloy, and coupling the second aluminum alloy to the first aluminum alloy to produce a multi-layered aluminum alloy product.

Abstract: A manufacturing method for manufacturing an electronic device includes a first electronic component and a second electronic component; and a bond part for the first electronic component joined to another bond part for the second electronic component. In a first process of this manufacturing method, the metallic bond part for the first electronic component is placed directly against the metallic bond part for the second electronic component, pressure is applied to the first electronic component and the second electronic component and, after metallically joining the above two bond parts, the pressure applied to the first electronic component and the second electronic component is released. In a second process in the manufacturing method, a clamping member affixes the relative positions of the joined first electronic component and second electronic component, and heats the first electronic component and the second electronic component to maintain a specified temperature.

Abstract: A process for producing a coated article, which has (i) at least one electrically non-conductive base layer, (ii) at least one layer of copper and/or a copper alloy, and (iii) a layer which contains at least one electrically conductive polymer. The article is characterized in that the copper or copper alloy layer (ii) is positioned between the base layer (i) and the layer (iii) containing the conductive polymer.

Abstract: It is an object to provide a water-soluble preflux containing a low-volatile solubilizing agent excellent in performance to dissolve an imidazole compound in water and capable of bringing out an excellent film-forming property of the imidazole compound and also to provide a treating method for the surface of a metal conductive part which comprises bringing the surface into contact with the above water-soluble preflux.

Abstract: Systems and methods are disclosed for joining two or more parts together via cold spraying. In one embodiment, a first part and second part may be aligned together to create a joint. The parts are joined by cold spraying a material on the first metal part and the second metal part to create a bond at the joint.

Abstract: A method for setting a protective coating on the inner wall of a tube includes providing a cylindrical sleeve, then setting on the outer surface of the sleeve a layer of a thermo fusible material, then machining the sleeve to provide it with an external diameter corresponding to the tube internal diameter, positioning the sleeve in the tube, and finally soldering the sleeve on the tube by applying heat.

Abstract: This invention relates to for devices, systems, and methods for separating dross, carried by molten solder, into solder and residue.

Abstract: A method of manufacturing irregular shapes of solder wires comprising the steps of: (a) acquiring materials of solder wire; (b) placing the materials into wire manufacturing machines to form solder wires into specifically designed profiles; (c) transporting the resulted solder wires to forming equipment and tools to form solder wires into specific shapes. The invention also provides products made with above-mentioned methods of manufacturing irregular shapes of solder wires.