Chemical Deposition Patents (Class 228/209)
  • Patent number: 5209388
    Abstract: A diffusion bonding process for bonding one rhenium-coated carbonaceous body to another. The rhenium-coat surfaces 18,20 of the bodies are coated with ruthenium, and the bodies are diffusion bonded at the interface formed by adjoining ruthenium coats 22,24.
    Type: Grant
    Filed: September 26, 1991
    Date of Patent: May 11, 1993
    Assignee: Allied-Signal Inc.
    Inventors: Donald L. Mittendorf, Gary A. West
  • Patent number: 5132351
    Abstract: A chemical solder is described that includes an organometallic which thermally degrades within a predetermined temperature range to a metal and volatile compounds. The solder also includes a polymeric matrix that decomposes within the same temperature range to volatile fractions, thereby leaving only the metal.A method for bonding first and second bodies is disclosed wherein a chemical solder, as above-described, is disposed between the first and second bodies and heat is applied to elevate the solder to the predetermined temperature range to thermally degrade the organometallic compound and to decompose the polymeric matrix. The remaining metal bonds the first and second bodies.
    Type: Grant
    Filed: July 11, 1991
    Date of Patent: July 21, 1992
    Assignee: International Business Machines Corporation
    Inventors: Martin J. Goldberg, Hiroshi Ito, Caroline A. Kovac, Michael J. Palmer, Roger A. Pollak, Paige A. Poore
  • Patent number: 5110035
    Abstract: Methods for fabricating and repairing heat exchange tubing are provided including depositing an integral solderable coating onto a surface oxide of a tubular member and then soldering a plurality of spaced fins onto the integral solderable coating. The methods described herein provide economical techniques for fabricating heat exchange tubing suitable for use in extremely corrosive environments.
    Type: Grant
    Filed: February 1, 1990
    Date of Patent: May 5, 1992
    Assignee: Westinghouse Electric Corp.
    Inventors: Samuel D. Reynolds, Jr., Homer G. Hargrove
  • Patent number: 5058799
    Abstract: A metallized ceramic substrate having an enhanced bond strength between the ceramic substrate and a conductive metal layer bonded thereto is disclosed. The metallized ceramic substrate includes a heterogeneous juncture band between a ceramic workpiece and a layer of electrically conductive material. The metallized ceramic substrate is made by a process which includes an acid etchant step that increases the actual surface area of the treated surface of the ceramic workpiece without undermining the integrity of the ceramic surface while at the same time selectively attacking vitreous binder phase present between substrate grains and creating even deeper penetration at the relatively higher energy triple joint junctures. In this manner, metal anchor sites that enhance adhesion are provided. During subsequent high temperature firing these anchors hold the resulting composite together as a chemical bond is formed in addition to a mechanical bond or interlock.
    Type: Grant
    Filed: April 23, 1990
    Date of Patent: October 22, 1991
    Inventor: Kalman F. Zsamboky
  • Patent number: 5044546
    Abstract: First and second aluminum members are joined by the steps of(a) dissolving and removing completely the aluminum oxide layer from the surface of each of the first and second members to be joined and replacing each of the aluminum oxide layers with a layer consisting essentially of zinc;(b) plating at least one of the zinc layers with a non-alloy cadmium;(c) assembling and retaining together the first and second aluminum members so that the surfaces to be joined are held in contact with one another and placing the aluminum members in a vacuum; and(d) heating the members while in the vacuum thereby forming a bond between the first and second aluminum members.
    Type: Grant
    Filed: December 18, 1989
    Date of Patent: September 3, 1991
    Assignee: Hazeltine Corporation
    Inventor: Charles E. De Clerck
  • Patent number: 4989776
    Abstract: Articles of aluminum, or of an aluminum alloy, can be brazed satisfactorily, employing an aluminum alloy as the brazing material, by removing any surface oxide layers from bodies comprising the articles, and preforms of the brazing material, simultaneously with providing initial films of zinc, or tin, thereon. Then coatings of silver and/or of gold, or a suitable alloy containing silver or gold, are provided on the articles, and on the preforms of the brazing material, to protect the surfaces of these aluminum containing bodies from reoxidizing. The required brazing operation then is performed in a high vacuum, or in an inert atmosphere. Any oxygen produced inadvertently, for example, by the decomposition of any silver oxide present, is removed before it can contact any aluminum. The zinc or tin, the materials of the coatings, and the aluminum of the bodies, interdiffuse, and this interdiffusion proceeds rapidly when the brazing alloy melts.
    Type: Grant
    Filed: July 28, 1989
    Date of Patent: February 5, 1991
    Assignee: GEC Ferranti Defence Systems Limited
    Inventor: William D. Hepburn
  • Patent number: 4978054
    Abstract: A method of forming diffusion bonds between aluminum and aluminum alloy saces by coating the surfaces with molten AgNO.sub.3 and then decomposing the AgNO.sub.3 to form a thin uniform layer of silver on the surfaces before forming the diffusion bond. The AgNO.sub.3 coating and decomposition in treatment permanently breaks up the Al.sub.2 O.sub.3 coatings on the aluminum or aluminum alloy surfaces, making diffusion bonding possible.
    Type: Grant
    Filed: July 3, 1990
    Date of Patent: December 18, 1990
    Assignee: The United States of America as represented by the Secretary of the Navy
    Inventors: William A. Ferrando, Amarnath P. Divecha, Subhash D. Karmarkar
  • Patent number: 4961818
    Abstract: A process for producing a single crystal object made of a nickel-base, O.D.S., gamma prime strengthened alloy which involves diffusion bonding a seed crystal to a mass of such alloy in recrystallizable state and thereafter zone annealing to grow a single crystal through the mass of alloy.
    Type: Grant
    Filed: June 21, 1985
    Date of Patent: October 9, 1990
    Assignee: Inco Alloys International, Inc.
    Inventor: Raymond C. Benn
  • Patent number: 4948031
    Abstract: A process for joining first and second aluminum sheets in which the bonding surfaces of the aluminum sheets have their aluminum oxide layer replaced by a zinc layer and the zinc layers are plated with a non-alloy metal bonding material such as cadmium. The first and second aluminum sheets are then assembled and fastened together with an engaging means for holding the sheets together, and then the assembled sheets are placed in a vacuum. The sheets are subsequently heated in the vacuum thereby creating a bond of cadmium between them, removed from the vacuum, and then passivated.
    Type: Grant
    Filed: January 19, 1988
    Date of Patent: August 14, 1990
    Assignee: Hazeltine Corporation
    Inventor: Charles E. De Clerck
  • Patent number: 4946090
    Abstract: A seal between two ceramic articles, or between a ceramic article and a metal article, is formed by providing a sealing member comprising an aluminum body, and a film of zinc or tin being deposited threon, with the inevitable aluminum oxide surface film removed, and subsequently a coating of silver and/or gold, or a suitable alloy containing silver or gold, being provided. The sealing member is positioned between the articles, and the bonding operation comprises heating the assembly in an inert atmosphere, or in a high vacuum, to melt the composite sealing member, there being obviated the need to apply pressure during the bonding operation. Any oxide film on silver readily decomposes at a temperature of, at most, 250.degree. C. No oxide film is formed on gold. The zinc or tin film, and the coating, are readily absorbed into the molten aluminum produced during the bonding operation. Subsequently, the bonded assembly is out-gassed at a temperature up to 600.degree. C.
    Type: Grant
    Filed: August 9, 1988
    Date of Patent: August 7, 1990
    Assignee: Ferranti International Signal, plc
    Inventor: William D. Hepburn
  • Patent number: 4907733
    Abstract: A method is disclosed for creating a strong point for the attachment of carbon composites to metallic bodies that is suitable at high temperatures (1600.degree. F.) as well as ambient temperatures. A pocket of suitable dimensions and depth is molded into the carbon composite structure on both sides at an edge, with the edge relieved and rounded. A hole for a fastening member is molded or drilled in the approximate center of the pocket. After preparation of the surface the pocket, through hole, and relieved edge are nickel-plated to produce a rigid strong point. A doubler can be brazed to the nickel plate to strengthen the bond. The disclosed method can be used for attaching any type of electrically conductive composite material to a metallic structure.
    Type: Grant
    Filed: March 28, 1988
    Date of Patent: March 13, 1990
    Assignee: General Dynamics, Pomona Division
    Inventors: Wilson N. Pratt, Robert M. Haner
  • Patent number: 4875619
    Abstract: A first surface of a first metal component of an ink jet print head is bonded to a second surface of a second metal component of the ink jet print head, the first and second surfaces being of materials having the same or similar coefficients of thermal expansion. A layer of filler material is electroplated or otherwise placed on at least one of these surfaces. The filler material has a melting point which is below the melting point of the first and second components, and the total thickness of the filler material on the surfaces together is in the range of from approximately one-sixteenth micron to approximately five microns, with one-eighth micron to two microns being a preferred range. These surfaces are placed together and brazed under low pressure. Preferably, the braze pressure is from about one-half psi to no more than about one hundred psi, with about ten psi being most preferred.
    Type: Grant
    Filed: September 1, 1988
    Date of Patent: October 24, 1989
    Inventors: Jeffrey J. Anderson, John S. Moore
  • Patent number: 4871108
    Abstract: A method of preparing a surface of a silicon carbide article for joining by metal brazing to metal by micro-roughening that surface of the silicon carbide which is to be brazed, applying catalyst consisting essentially of aqueous PdCl.sub.2 directly to the micro-roughened surface, in the absence of pretreatment of said surface with stannous chloride, and electrolessly depositing a thin layer of metal selected from the group consisting of Ni, Cr, Au, Ag and Cu on said catalyst-treated surface.
    Type: Grant
    Filed: November 16, 1987
    Date of Patent: October 3, 1989
    Assignee: Stemcor Corporation
    Inventors: Wolfgang D. G. Boecker, Laurence N. Hailey
  • Patent number: 4860941
    Abstract: An improved method is described for ball bonding an aluminum wire to a contact pad of a microelectric device. In ball bonding, the wire is fed through and protrudes from a capillary hole in a bonding head, an electric arc melts the protruding wire into a ball, the solid ball thus formed is pressed and flattened onto the contact pad by the bonding head and the ball-contact surface interface is subjected to ultrasonic vibrations to form a bond between the flattened ball and the contact pad. Aluminum wire has presented a problem in forming asymmetric, porous, faceted balls that ball-bond very poorly. By using an aluminum wire coated with an electrically insulating layer that melts above the melting temperature of aluminum and has an electrical resistance sufficient to prevent the electric arc from shifting up the wire and away from the tip, the problem of poor quality balls is solved and a round, axisymmetric ball is formed which ball-bonds consistently well.
    Type: Grant
    Filed: March 19, 1987
    Date of Patent: August 29, 1989
    Assignee: Alcan International Limited
    Inventor: Alexander J. Otto
  • Patent number: 4852791
    Abstract: A method for producing corrosion resistance heat exchangers having a plurality of aluminum tubular elements and fin members, the method comprising immersing the tubular elements in a bath with passing an electric current so that the surfaces thereof are covered with zinc layers of 0.3 .mu.m or more in thickness; combining the zinc plated tubular elements with fin members covered with a brazing sheet so that a core is provisionally formed; painting the provisional core with a non-corrosive flux; and placing the provisional core in a furnace to braze the fin members to the tubular elements, and also to enable the zinc layers to diffuse over the surfaces of the tubular elements.
    Type: Grant
    Filed: June 2, 1988
    Date of Patent: August 1, 1989
    Assignee: Showa Aluminum Kabushiki Kaisha
    Inventors: Tatsuo Otsuka, Ichiro Iwai, Noboru Yamaguchi
  • Patent number: 4818728
    Abstract: A method for making a semiconductor device of a type comprising at least first and second semiconductor circuit units, which method comprises the step of forming a plurality of connecting electrodes on an upper surface of each of at least first and second semiconductor substrates; forming an electrically insulating layer entirely over the upper surface of each of the first and second substrates so as to cover the respective connecting electrodes; partially removing the insulating layer on each of the first and second substrates to permit the respective electrodes to be exposed to the outside; forming metal studs on the first substrate in contact with the electrodes so as to protrude outwardly of the respective insulating layer to complete the first semiconductor unit and forming solder deposits on the second substrate in contact with the respective electrodes on such second substrate to complete the second semiconductor unit; combining the first and second semiconductor units with the metal studs in the first
    Type: Grant
    Filed: December 3, 1987
    Date of Patent: April 4, 1989
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Akiteru Rai, Keiji Yamamura, Takashi Nukii
  • Patent number: 4737418
    Abstract: A lid for closing an electronics package exhibits a high corrosion resistance. The lid is formed of a metal substrate which is clad with rolled or worked nickel, and covered with a layer of gold or precious metal electroplate. At edges of the lid, which are not covered with cladding, a layer of nickel is electroplated, employing the dogbone effect to concentrate the metallization at the edges. The rolled or worked metal has a much smaller porosity than an electroplated layer, and the nickel cladding can be applied to the desired thickness in much less time than nickel electroplate.
    Type: Grant
    Filed: December 22, 1986
    Date of Patent: April 12, 1988
    Assignee: Advanced Materials Technology Corp.
    Inventor: James A. Slattery
  • Patent number: 4702969
    Abstract: A laminated aluminum fluidic device is constructed by sequentially coating the facing side surfaces of the aluminum laminae with layers of zinc, nickel and solder, positioning the facing pairs of solder layers in intimate contact, and heating the coated laminae to fuse the facing solder layers.
    Type: Grant
    Filed: July 2, 1986
    Date of Patent: October 27, 1987
    Assignee: The Garrett Corporation
    Inventors: Bela Bunkoczy, James A. Wendorff, Walt W. Battin
  • Patent number: 4650108
    Abstract: A firmly adherent film 16 of bondable metal, such as silver, is applied to the surface 10 of glass or other substrate by decomposing a layer 14 of a solution of a thermally decomposable metallo-organic deposition (MOD) compound such as silver neodecanoate in xylene. The MOD compound thermally decomposes into metal and gaseous by-products. Sealing is accomplished by depositing a layer 18 of bonding metal, such as solder or a brazing alloy, on the metal film and then forming an assembly with another high melting point metal surface 20 such as a layer of Kovar. When the assembly is heated above the temperature of the solder, the solder flows, wets the adjacent surfaces and forms a hermetic seal between the metal film 14 and metal surface 20 when the assembly cools.
    Type: Grant
    Filed: August 15, 1985
    Date of Patent: March 17, 1987
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventor: Brian D. Gallagher
  • Patent number: 4647477
    Abstract: A process for preparing a ceramic substrate for metallization wherein a surface of the ceramic substrate is contacted with an admixture comprised of an inert solid material and a composition containing one or more alkali metal compounds. The admixture and the substrate are heated at least to a temperature at which the alkali metal composition becomes molten. The molten alkali metal composition is kept in contact with the ceramic surface for a time period sufficient to etch the surface and thus prepare it for adherent deposition of metal. The presence of the inert solid material in the admixture prevents coalescence of the alkali metal composition on the ceramic surface. Uniform surface coverage with catalyst and metal and an adherent bond of metal to the ceramic surface are ensured by treatment with the admixture. Furthermore, an article comprised of metal directly and adherently bonded onto a ceramic substrate is provided.
    Type: Grant
    Filed: December 7, 1984
    Date of Patent: March 3, 1987
    Assignee: Kollmorgen Technologies Corporation
    Inventor: Michael A. DeLuca
  • Patent number: 4643347
    Abstract: A permanent magnet of a hard magnetic material, such as rare earth-cobalt intermetallic compounds or AlNiCo, is joined to a mounting surface by way of intermediate layers. These layers avoid heating the magnet above the maximum service temperature of the magnetic material, and thus prevent losing the magnetic properties.
    Type: Grant
    Filed: October 9, 1984
    Date of Patent: February 17, 1987
    Assignee: North American Philips Corporation
    Inventors: Robert L. Bronnes, Richard C. Sweet, James K. McKinlay
  • Patent number: 4620661
    Abstract: A lid for closing an electronic package that exhibits high resistance to corrosion. The lid includes a metal substrate and a multi-layered protective coating which has low porosity when compared to a single layer coating of the same thickness yet has good soldering properties that enables the lid to be hermetically sealed to the package container. The multi-layer coating includes an initial electroplated layer of nickel followed by a thin interlayer of a noble metal and a second layer of nickel electroplated over noble metal. A top layer of gold is then electroplated over the nickel-noble metal-nickel sandwich to complete the lid structure.
    Type: Grant
    Filed: April 22, 1985
    Date of Patent: November 4, 1986
    Assignee: Indium Corporation of America
    Inventor: James A. Slatterly
  • Patent number: 4603805
    Abstract: Nickel layers used in electronic devices are frequently plated in solutions containing phosphorus. Residual phosphorus trapped in the plated nickel layer reduces solderability with respect to Pb-Sn solders. Voids are frequently found in the soldered joints. Solderability of such phosphorus containing nickel layers is enhanced and the number of voids is much reduced by heating the nickel surface first in an oxidizing atmosphere and then in a reducing atmosphere prior to soldering. The oxidation temperature should exceed 347.degree. C. in order to oxidize the residual phosphorus and drive off the volatile phosphorus oxides. Hydrocarbons and volatile sulfides are also removed. The reducing step removes the non-volatile nickel oxides, leaving a clean surface for soldering which is substantially free of nickel oxide, phosphorus and phosphorus oxides, sulfides, and organics.
    Type: Grant
    Filed: May 20, 1985
    Date of Patent: August 5, 1986
    Assignee: Motorola, Inc.
    Inventor: William O. Rogers
  • Patent number: 4568014
    Abstract: A method of bonding a first thin crystalline metal to a second thin metal ch as metallic glass is disclosed. Initially, the metallic glass is coated with a thin thermal barrier layer. Next, the first metal is heated to a temperature sufficient for diffusion bonding. Finally, the metallic glass is maintained at ambient temperature as the metallic glass is diffusion bonded to the crystalline metal. The thermal barrier layer prevents the metallic glass from reaching a phase transition temperature during the diffusion bonding. Consequently, a composite product having a base layer of crystalline metal and an outer layer of metallic glass is produced. Preferably, the diffusion bonding is produced by evacuated roll-bonding and the coating is attached to the metallic glass by electroplating. A plurality of metallic glass layers and crystalline metal layers can be bonded together to produce a sandwiched composite product.
    Type: Grant
    Filed: September 29, 1983
    Date of Patent: February 4, 1986
    Assignee: The United States of America as represented by the Secretary of Interior
    Inventor: Brent W. Madsen
  • Patent number: 4426404
    Abstract: A process for producing and intermediate layer between a high-melting dental alloy and a dental porcelain which comprises applying to said high-melting dental metal alloy a composition comprising.(a) at least a metal or a metal alloy which is thermally stable at a temperature of at least 800.degree. C.;(b) gold or a gold compound which decomposes to metallic gold, or a gold alloy;(c) at least one flux; and(d) aluminum and/or solver or an aluminum-silver alloy or a silver compound which decomposes two metallic silver, in a liquid vehicle (A) in which component (c) is at least partially soluble, drying the so-treated high-melting dental metal alloy and sintering said composition and thereafter treating the so-sintered composition with a liquid (B) in which the non-metallic components of said composition are at least partially soluble.
    Type: Grant
    Filed: November 25, 1981
    Date of Patent: January 17, 1984
    Assignee: Etablissement Dentair Ivoclar
    Inventors: Itzhak Shoher, Aaron Whiteman
  • Patent number: 4362903
    Abstract: An electrical conductor interconnect is disclosed which permits hard-to-contact substrates, such as the glass substrate in liquid crystal display cells, to be connected to electrical apparatus by conventional soldering techniques. The interconnect conductor involves the use of a polymer loaded with both a conducting powder and a non-noble metal powder whose top surface is coated with a contiguous layer of an adherent solderable metal by an augmentation replacement reaction.
    Type: Grant
    Filed: December 29, 1980
    Date of Patent: December 7, 1982
    Assignee: General Electric Company
    Inventors: Charles W. Eichelberger, Wesley K. Waldron, Robert J. Wojnarowski
  • Patent number: 4223826
    Abstract: A method of brazing a stainless steel with a stainless steel or another metal wherein, in brazing the stainless steel with a stainless steel or another metal, the stainless steel side of both opposed jointing parts is plated with copper, then a copper base-tin alloy of a melting point of 850.degree. to 1081.degree. C. is used as a brazing material and said brazing material is heated together with the jointing parts to a temperature lower than the melting point of copper in a nonoxidizing gas atmosphere such that the brazing material may be melted at said temperature.The brazed stainless steels are cooled by being quickly passed through a temperature range of 850.degree. to 600.degree. C. The bonding force of the resulting stainless steels is much higher than heretofore obtained.
    Type: Grant
    Filed: January 29, 1979
    Date of Patent: September 23, 1980
    Assignee: Usui Kokusai Sangyo Kabushiki Kaisha
    Inventor: Masayoshi Usui
  • Patent number: 4162758
    Abstract: A long length clad steel pipe which is in the extremely superior metallurgically bonded state and having good qualities can be manufactured easily at an inexpensive cost by using as a base metal, a carbon steel including a low alloyed steel and as a cladding metal, a stainless steel, nickel or a nickel alloy by the steps comprising welding at least one end part of double pipes consisting of a base metal and a cladding metal, and subjecting the processed double pipes to hot rolling at a temperature between 850.degree. C. to 1300.degree. C. with a reduction ratio of at least 15% in the first step rolling.
    Type: Grant
    Filed: July 26, 1977
    Date of Patent: July 31, 1979
    Assignees: Asahi Kasei Kogyo Kabushiki-Kaisha, The Japan Steel Works, Ltd.
    Inventor: Makoto Mikarai
  • Patent number: 4098452
    Abstract: A bond between a refractory metal or semiconductor and a ductile metal and a method for making the same includes forming a layer of a refractory metal wetting agent such as titanium on the refractory metal before bonding to allow wetting of the refractory metal by the ductile metal.
    Type: Grant
    Filed: October 7, 1976
    Date of Patent: July 4, 1978
    Assignee: General Electric Company
    Inventors: Harold F. Webster, Dominic A. Cusano
  • Patent number: 4059217
    Abstract: A liquid interface diffusion process is provided where a thin deposit (from 1/2 to 4 mils) of nickel (and/or cobalt) having 4-12 weight percent boron is plated on the nickel or cobalt based alloy faying surfaces. In the case of honeycomb sandwich, the plating is applied to the edge of the core or on the facing sheets and the assembly held together in intimate contact and exposed to a temperature sufficient to cause the Ni-B eutectic to melt. At the eutectic temperature a liquid is formed which makes a metallurgical joint. Upon further time at temperature the boron is diffused into the substrate so that isothermal solidification occurs and the boron is diluted to a small concentration. Sufficient time is allowed (on the order of one or more hours) so that the melting point at the joint area is essentially the same as the substrate and the joint is comparable to a diffusion bond.
    Type: Grant
    Filed: December 30, 1975
    Date of Patent: November 22, 1977
    Assignee: Rohr Industries, Incorporated
    Inventor: James R. Woodward
  • Patent number: 3949122
    Abstract: To produce resisting metal coatings containing at least one brazing metal surfaces formed of titanium or another refractory metal having at least one volatile halide, a coating of this halide of the brazing metal is applied to this surface, this halide being stable in the isolated state and when applied to the surface, the halogen of the said halide being able to form the volatile halide with the refractory metal; the surface thus coated is heated to a temperature which is sufficient to permit the reaction of the metal halide with the refractory metal to form the volatile halide, which escapes and to form the metal coating, bounded by diffusion of the brazing metal to the surface of the refractory metal.
    Type: Grant
    Filed: June 24, 1974
    Date of Patent: April 6, 1976
    Assignee: Office National d'Etudes et de Recherches Aerospatiales (O.N.E.R.A.)
    Inventors: Pierre T. Lepetit, Andre R. Hivert