Abstract: A braze joint is made between two workpieces by first forming a thermal shrink fit region between the two workpieces adjacent to, or around, a braze or filler region in which a filler metal is located adjacent to, or within. The filler metal is suitably heated so that it flows in the braze or filler region to form the braze joint of the two workpieces. Cutouts may be formed in the thermal shrink fit region adjacent to the braze or filler region to extend the braze joint region or provide paths for gas byproducts in the brazing process.

Abstract: Microfeature workpieces having alloyed conductive structures, and associated methods are disclosed. A method in accordance with one embodiment includes applying a volume of material to a target location of a microfeature workpiece, with the volume of material including at least a first metallic constituent. The method can further include elevating a temperature of the volume of material while the volume of material is applied to the microfeature workpiece to alloy the first metallic constituent and a second metallic constituent so that the second metallic constituent is distributed generally throughout the volume of material. In further particular embodiments, the second metallic constituent can be drawn from an adjacent structure, for example, a bond pad or the wall of a via in which the volume of material is positioned.

Abstract: A sealing material includes a metallic glass

Abstract: Disclosed herein are a solder sheet and a soldering method using the same. The solder sheet includes: a plurality of solder rods arranged to have a uniform height h and an area density N; and a support having an adhesive formed on one surface thereof and supporting the plurality of solder rods such that one end of each of the plurality of solder rods is attached to be perpendicular to the surface on which the adhesive is formed. Solder bumps can be formed on soldering portions of the substrate by using the solder sheet through a single process without a mask, and thus, the process can be simplified, costs can be reduced, and a defect rate can be lowered, thereby enhancing reliability.

Abstract: Devices and methods for assembling co-planar electrical contacts in a connector are provided herein. In one aspect, an exemplary method of assembly comprises depositing solder in a connector plug enclosure, positioning electrical contacts on the solder deposits, advancing the hotbar toward the enclosure contacting each of the electrical contacts so as to planarize a top surface of each of the electrical contacts with the enclosure and melting the solder with the heated hotbar to solder the electrical contacts to the enclosure. In one aspect, an exemplary hotbar device includes a magnet for releasably coupling the electrical contacts to the hotbar. In another aspect, the hotbar includes metallic portions for heating the electrical contacts and insulated ceramic portions for contacting the enclosure. In another aspect, an electrically conductive hotbar includes side portions that extend away from the bottom heating surface facilitating more uniform current flow through the hotbar.

Abstract: A brazing method includes the steps of providing a first part and a second part, at least a first portion of the first part configured to fit inside a second portion of the second part, preplacing a non-self-fluxing braze alloy on one or more of the first portion and the second portion, thermally treating at least one of the first portion and the second portion, to create a temperature differential between the first portion and the second portion, inserting the first portion into the second portion, and heating at least one of the first portion and the second portion to melt the non-self-fluxing braze alloy. The first portion is joined by brazing to the second portion.

Abstract: A solder layer, a substrate for device joining utilizing the same and a method of manufacturing the substrate are provided whereby the device joined remains thermally unaffected, an initial bonding strength in solder joint is enhanced and the device can be soldered reliably. The solder layer formed on a base substrate (2) consists of a plurality of layers (5a) of a solder free from lead, which are different in its phase from one another. They are constituted by a layer of a phase that is completely melted, and a layer of a phase that is not completely melted at a temperature not less than a eutectic temperature of the solder. The solder layer (5) can be applied to a device joining substrate (1) comprising an electrode layer (4) formed on the base substrate (2) and the solder layer (5) formed on the electrode layer.

Abstract: Provided are an oven controlled crystal oscillator in which in a case where a metal lead is soldered to a substrate, even if cracks occur in the solder, its reliability is not reduced, and a production method. That is, an oven controlled crystal oscillator in which pre-tinning solders are formed around openings on a front surface and a rear surface of a substrate in which of a through hole for passing a metal lead therethrough is formed; and in a state where a metal lead including a solder layer (a pre-tinning solder) formed on its surface is inserted into the through hole of the substrate, the metal lead extending from the openings is soldered to the openings on the front surface and the rear surface of the substrate, so as to form a main solder, and a production method of the oven controlled crystal oscillator are provided.

Abstract: Solder can be used to wet and bind glass substrates together to ensure a hermetic seal that superior (less penetrable) than conventional polymeric (thermoplastic or thermoplastic elastomer) seals in electric and electronic applications.

Abstract: Embodiments of a method for controllably reducing of the flow area of a turbine nozzle component are provided, as are embodiments of turbine nozzle components having reduced flow areas. In one embodiment, the method includes the steps of obtaining a turbine nozzle component having a plurality of turbine nozzle flow paths therethrough, positioning braze preforms in the plurality of turbine nozzle flow paths and against a surface of the turbine nozzle component, and bonding the braze preforms to the turbine nozzle component to achieve a controlled reduction in the flow area of the turbine nozzle flow paths.

Abstract: In joining an Fe-based metallic member comprising an Fe-based material and an Al-based metallic member comprising an Al-based material by a Zn-based filler metal, a joined part of the Fe-based metallic member is heated at a temperature higher than a melting point of the Fe-based material.

Abstract: An adhesive layer forming step of forming an adhesive layer on a surface of a substrate; a solder layer forming step of forming a solder layer on the adhesive layer by loading plural solder powders with in-between spaces; and a filler supplying step of supplying fillers to the in-between spaces of the solder powders that have been formed on the adhesive layer are included.

Abstract: A brazing method includes the steps of providing a first part and a second part, at least a first portion of the first part is configured to fit inside a second portion of the second part, preplacing a first self-fluxing braze alloy on one or more of the first portion and second portion, preplacing a non-phosphorous braze alloy on the first self-fluxing braze alloy, preplacing another layer of the first self-fluxing braze alloy on the non-phosphorous braze alloy, thermally treating at least one of the first portion and second portion, to create a temperature differential between the first portion and second portion, inserting the first portion into the second portion, and heating at least one of the first portion and second portion to melt both layers of the first self-fluxing braze alloy and the non-phosphorous braze alloy. The first portion is joined by brazing to the second portion.

Abstract: A method of joining at least two parts includes steps of dispersing a joining material comprising a multi-phase magnetic metal-aluminum powder at an interface between the at least two parts to be joined and applying an alternating magnetic field (AMF). The AMF has a magnetic field strength and frequency suitable for inducing magnetic hysteresis losses in the metal-aluminum powder and is applied for a period that raises temperature of the metal-aluminum powder to an exothermic transformation temperature. At the exothermic transformation temperature, the metal-aluminum powder melts and resolidifies as a metal aluminide solid having a non-magnetic configuration.

Abstract: Disclosed are an electronic component mounting system and an electronic component mounting method capable of reducing the space occupied by equipment and equipment cost and ensuring high connection reliability. An electronic component mounting system (1) includes a solder printing device (M1), a coating/inspection device (M2), a component mounting device (M3), a bonding material supply/substrate mounting device (M4), and a reflow device (M5). The electronic component mounting system (1) mounts an electronic component on a main substrate (4) and connects a module substrate (5) to the main substrate (4). A cream solder is printed on the main substrate (4) to mount an electronic component, a bonding material in which solder particles are contained in thermosetting resin is supplied to a first connection portion of the main substrate (4), and a second connection portion of the module substrate (5) is landed on the first connection portion through the bonding material.

Abstract: A method for joining two ceramic parts, or a ceramic part and a metal part, and the joint formed thereby. The method provides two or more parts, a braze consisting of a mixture of copper oxide and silver, a diffusion barrier, and then heats the braze for a time and at a temperature sufficient to form the braze into a bond holding the two or more parts together. The diffusion barrier is an oxidizable metal that forms either a homogeneous component of the braze, a heterogeneous component of the braze, a separate layer bordering the braze, or combinations thereof. The oxidizable metal is selected from the group Al, Mg, Cr, Si, Ni, Co, Mn, Ti, Zr, Hf, Pt, Pd, Au, lanthanides, and combinations thereof.

Abstract: A layered structure comprising a base structure having a major surface, and a brazing layer secured to the major surface of the base structure, where the brazing layer is applied to the major surface prior to positioning the layered structure in contact with a turbine engine component.

Abstract: A system and method for manufacturing welded structures comprises components to be welded, a welding additive material which, before the welding, has a shaped profile and the shaped profile is disposed between components to be welded and conforms with at least one of the components to be welded. At least one heat source is used in the method to weld the components, producing a weld seam on at least one side of one of the components.

Abstract: Embodiments of a method for manufacturing a turbine engine component are provided, as are embodiments of a thermal growth constraint tool for the manufacture of turbine engine components. In one embodiment, the method includes the steps of obtaining a plurality of arched pieces, arranging the plurality of arched pieces in a ring formation, and bonding the plurality of arched pieces together to produce a monolithic ring by heating the ring formation to a predetermined bonding temperature while constraining the outward radial growth thereof.

Abstract: A method having a step of heating a mass forming a braze. Before the heating step, the method includes steps of arranging the mass and the member on the support. In particular, it includes a step of positioning the mass on the support and a step of applying a first compressive force on the mass so as to compress said mass against the support, the intensity of the first force increasing up to a predetermined first value chosen so as to flatten the mass. Next, the method includes a step of positioning the member on the flattened mass and a step of applying a second compressive force to the member so as to compress said member against the flattened mass and the support, the intensity of the second force increasing up to a second predefined value, the second predefined value being lower than the first predefined value.

Abstract: A method for making a tripping ball comprising configuring two or more parts to collectively make up a portion of a tripping ball; and assembling the two or more parts by adhering the two or more parts together with an adherent dissolvable material to form the tripping ball, the adherent dissolvable material operatively arranged to dissolve for enabling the two or more parts to separate from each other. A method of performing a pressure operation with a tripping ball is also included.

Abstract: The method and apparatus serve to treat a multi-walled glass body, in particular a glass body (20) with a glass membrane (25) for a chemical sensor or measuring probe, wherein a portion of at least one wall or of an interior tube (21) is to be fused, and wherein the fusing can have the purpose of closing off a first chamber (291). A glass element (286) which serves to absorb radiation energy is inserted in the vicinity of the portion (210) of either the wall or of the interior tube (21) that is to be fused. The glass element (286) is exposed to the radiation energy of at least one energy radiator (17), whereby the glass element (286) and the portion (210) of either the wall or the interior tube (21) are fused together.

Abstract: The present invention relates to a method and apparatus of forming a sputter target assembly having a controlled solder thickness. In particular, the method includes the introduction of a bonding foil, between the backing plate and the sputter target, wherein the bonding foil is an ignitable heterogeneous stratified structure for the propagation of an exothermic reaction.

Abstract: The present invention relates to a transfer device (10) for receiving and transferring a solder ball arrangement (28). Said transfer device comprises a discharge container (11) and a transfer substrate (12) that interacts with the discharge container in order to obtain a flat solder ball arrangement and that can be subjected to a negative pressure. The discharge container comprises an at least partially perforated base wall (14) and the transfer substrate has a hole pattern for receiving the solder ball arrangement. The discharge container comprises an ultrasound device (37) for subjecting said discharge container to ultrasound vibrations.

Abstract: A component assembly for use in living tissue comprises: a ceramic part; a metal part, e.g., a titanium metal; and a palladium (Pd) interlayer for bonding said ceramic part to the metal part. By applying sufficient heat to liquify a palladium-titanium interface, the Pd interlayer is used to braze the ceramic part to the titanium part to yield a hermetic seal.

Abstract: A minute ball array apparatus includes: an array jig including insert parts, into which minute balls are to be inserted, and which are formed in a predetermined pattern; a ball moving unit, which comprises a thrust surface, and which moves the thrust surface along an upper surface of the array jig so as to move the minute balls supplied onto the upper surface of the array jig to drop the minute balls into the insert parts of the array jig; a collapsing member, which is provided in a vicinity of the thrust surface, and which collapses a buildup of the minute balls rising along the thrust surface when the thrust surface is moved by the ball moving unit; and a motion imparting unit that imparts the collapse member with motion for collapsing the rising buildup of the minute balls.

Abstract: Microfeature workpieces having alloyed conductive structures, and associated methods are disclosed. A method in accordance with one embodiment includes applying a volume of material to a target location of a microfeature workpiece, with the volume of material including at least a first metallic constituent. The method can further include elevating a temperature of the volume of material while the volume of material is applied to the microfeature workpiece to alloy the first metallic constituent and a second metallic constituent so that the second metallic constituent is distributed generally throughout the volume of material. In further particular embodiments, the second metallic constituent can be drawn from an adjacent structure, for example, a bond pad or the wall of a via in which the volume of material is positioned.

Abstract: A lead-free solder joint is formed between a tin-silver-copper solder alloy (SAC), SACX, or other commonly used Pb-free solder alloys, and a metallization layer of a substrate. Interaction of the SAC with the metallization layer forms an intermetallic compound (IMC) that binds the solder mass to the metallization layer. The IMC region is substantially free of any phosphorous-containing layers or regions.

Abstract: A micro-bump forming apparatus includes: a film attachment mechanism that attaches a film on a surface of a substrate; exposure and developing mechanisms that provide openings in the film on electrodes formed on the substrate; a solder ball loading mechanism that loads solder balls into the openings, a flux printing mechanism that prints flux through the openings loaded with the solder balls; a reflow part that heats the solder balls to form solder bumps; and a film detachment mechanism that detaches the film from the surface of the substrate. After a loading head loads the solder balls into the openings of the film, a controller of the solder ball loading mechanism allows a line sensor to operate to check a loading state of the solder balls, and determines, based on the check result, whether to reload the solder balls.

Abstract: A back metal layer (16, 31) has a plurality of stress relaxation spaces (17). Each stress relaxation space (17) is formed to open at least at one of the front surface and the back surface of the back metal layer (16, 31). A region in the back metal layer (16, 31) that is directly below a semiconductor device (12) is defined as a directly-below region (A1), and a region outside the directly-below region (A1) that corresponds to and has the same dimensions as the directly-below region (A1) is defined as a comparison region (A21). The volume of the stress relaxation spaces (17) in the range of the directly-below region (A1) is less than the volume of the stress relaxation spaces (17) formed in the range of the comparison region (A21).

Abstract: This invention provides methods and systems for brazing. One aspect of the invention provides a method of brazing cutter teeth. The method includes providing a bit body, pressing at least one cutter against the bit body with a spring device, placing the bit body and the at least one cutter in an inert gas filled chamber with about 10% H2, and heating the chamber to a temperature above the melting point of the filler metal thereby melting the filler metal. A quantity of filler metal is held between each of the at least one cutters and the bit body.

Abstract: A joining jig 5 is constituted of a pair of flat-plate sandwiching portions 17, 18 including sandwiching faces 15 which sandwich therebetween a plate member laminate 4 prepared by laminating two plate members 2, 3 with providing a solder on a joined face between the plate members. The joining jig has a plurality of vapor inflow ports provided in the sandwiching face 15 so that surplus solder vapor on the joined face flows into the vapor inflow ports in a case where the plate member laminate 4 is heated while sandwiching the plate member laminate between the pair; vapor flow paths provided so that the vapor flow paths communicate with the vapor inflow ports; and vapor discharge ports 42 provided in the side surface of the joining jig so that the vapor discharge ports communicate with the vapor flow paths to discharge the vapor of the solder to the outside.

Abstract: A solder-flux composition is sprayed onto a substrate by rotating the solder-flux composition inside a spray cap, and before the solder-flux liquid exits the spray cap, perturbing the flow thereof with a fluid.

Abstract: Systems and methods are provided for improved brazing. A system includes a gap filling compound (GFC). The GFC includes a brazing alloy. The system also includes a GFC retention screen. The GFC retention screen configured to be disposed over the GFC to retain the GFC within the gap during brazing. The GFC retention screen is also configured to enable gas to escape from the GFC during brazing.

Abstract: A method of joining at least two parts includes steps of dispersing a joining material comprising a multi-phase nanocrystalline magnetic metal-aluminum powder at an interface between the at least two parts to be joined and applying an alternating magnetic field (AMF). The AMF has a magnetic field strength and frequency suitable for inducing magnetic hysteresis losses in the metal-aluminum powder and is applied for a period that raises temperature of the metal-aluminum powder to an exothermic transformation temperature. At the exothermic transformation temperature, the metal-aluminum powder melts and resolidifies as a metal aluminide solid having a non-magnetic configuration.

Abstract: The present invention aims at providing an electronic component mounting apparatus and an electronic component mounting method that perform automated setting of a thickness of a paste film.

Abstract: A multiple substrate system, a method, and structure for adapting solder volume to a warped module. An illustrative embodiment comprises a method for joining a first substrate to a second substrate. A deviation from a nominal gap between the first substrate and the second substrate at a first region of the first substrate is ascertained. A volume of solder paste necessary to compensate for the deviation from a nominal gap is determined. The volume of solder paste necessary to compensate for the deviation at the first region of the first substrate is applied. Further, the second substrate is bonded to the first substrate using, at least in part, the solder paste applied at the first region of the first substrate.

Abstract: A method in which no voids occur during the soldering processes is provided. A component with a soldering material is heated using a first temperature plateau for a first time duration such that the solder material is completely melted. Each subsequent heating is at a temperature plateau with a temperature that is lower than a temperature of the previous plateau.

Abstract: A component mounting method of a multilayer printed wiring board includes a plurality of solder bumps to mount electronic components formed on both of or either of the front and back thereof, wherein when the solder bumps are formed of any of first, second, third and fourth solders, the first, second, third and fourth solders have different melting points and the melting points of the first, second, third and fourth solders are arranged as the melting point of the first solder, the melting point of the second solder, the melting point of the third solder and the melting point of the fourth solder in order of high melting point and the first, second, third and fourth solders are sequentially used to solder electronic components and the like in order of high melting point. Further, in that case, it is preferable that the solder bump having large volume should be soldered earlier than other solder bumps.

Abstract: An embodiment of the present invention is an interconnect technique. Carbon nanotubes (CNTs) are prepared. A CNT-solder composite paste is formed containing the CNTs and solder with a pre-defined volume fraction.

Abstract: A substrate manufacturing apparatus manufactures a ball-mounted substrate and has a ball mounting apparatus which includes a ball vacuum chucking apparatus including a vacuum chucking head that carries out a vacuum chucking process to chuck balls at edges of inlets formed in a vacuum chucking surface and which mounts the balls vacuum-chucked by the vacuum chucking head on a substrate, the ball vacuum chucking apparatus further including: a holding vessel that holds the balls; and a vacuum chucking/holding unit that vacuum chucks and holds the balls held in the holding vessel on a front end thereof, and carrying out a supplying process that brings the vacuum chucking/holding unit that holds the balls on the front end thereof and the vacuum chucking surface of the vacuum chucking head relatively close to supply the balls to the vacuum chucking head while air is being drawn through the inlets.

Abstract: The present invention includes a step of cooling a molten metal within a fine space present in the inside of an object and hardening it while applying a forced external force exceeding atmospheric pressure to the molten metal. The fine space is opened on the outer surface of the object in terms of one end thereof. The forced external force is given by at least one member selected among a pressing pressure, an injection pressure and a rolling compaction and applied to the molten metal from the opening surface side on which the fine space is opened, in a state that the other end side of the fine space is closed.

Abstract: A conductive ball mounting apparatus for mounting conductive balls by providing an array mask having through holes, into which conductive balls are to enter, above a mounting target placed on a stage, by arranging a ball reservoir having an opening for reserving a plurality of conductive balls, in the bottom, by moving the ball reservoir along the array mask, by dropping the conductive balls into the individual through holes of the array mask, adopts the following means. Firstly, the conductive ball mounting apparatus comprises moving means for moving the array mask and the stage relative to each other in horizontal directions. Secondly, the positions of the conductive balls in the through holes are arranged by finely moving at least one of the array mask and the stage relative to each other in the horizontal directions after the balls were dropped.

Abstract: A bearing assembly comprises at least one bearing element abutting against at least one adjacent part at a contact surface. The bearing assembly can be manufactured by disposing a reactive nano-crystalline layer between the bearing element and the adjacent part in the area of the contact surface and then initiating an exothermic reaction in the reactive nano-crystalline layer, so that the bearing element bonds to the adjacent part in a materially-connected manner. The exothermic reaction involves at least partially heating the surface area of the bearing element and/or of the adjacent part that is located in the area of the contact surface.

Abstract: A method of fabricating a turbomachine rotor disk is disclosed. In the method, a metal container is defined, made up of a plurality of parts that define between them at least one annular cavity, an insert made of composite material is positioned in the at least one cavity, the assembly is subjected to hot isostatic compacting, and a rotor disk is machined.

Abstract: A method for joining first and second components, using brazing material to enable the formation of a brazed joint by heating the brazing material when the first and second components are in a juxtaposed position, comprises bringing the first and second components into a juxtaposed position so that the brazing material is in contact with the first and second components and plastically deforming the brazing material to interlock the first and second components.

Abstract: The present invention provides a solder ball printing apparatus in which solder balls are uniformly dispersed on a mask surface and are loaded into an opening area of the mask. A solder ball shaking and discharging unit includes a solder ball reception unit which receives solder balls from a solder ball reservoir unit, a wire member in a convex shape which is attached to surround a solder ball shaking and discharging port of the solder ball shaking and discharging unit and in which a plurality of wire members are arranged at predetermined intervals, and solder ball rotating and collecting mechanisms which sweep and collect the solder balls at the wire member in a convex shape.

Abstract: When a friction stir weld tool penetrates the interface of two workpieces of dissimilar metal alloy materials, the resultant weld of the different alloy materials may produce a weak weld joint. Such weak joints are often experienced, for example, when attempting to form spot welds or other friction stir welds between a magnesium alloy sheet or strip and an aluminum alloy sheet or strip. It is discovered that suitable coating compositions including an adhesive placed at the interface of assembled workpieces can alter the composition of the friction stir weld material and strengthen the resulting bond. In the example of friction stir welds between magnesium alloy and aluminum alloy workpieces, it is found that combinations of an adhesive with copper, tin, zinc, and/or other powders can strengthen the magnesium-containing and aluminum-containing friction stir weld material.

Abstract: A system, apparatus, and method, are provided to deposit conductive bonding material into cavities in a mold. A fill head is placed in substantial contact with a mold that includes cavities. The fill head includes a sealing member that substantially encompasses an entire area to be filled with conductive bonding material. The conductive bonding material is forced out of the fill head toward the mold. The conductive bonding material is provided into at least one cavity of the cavities contemporaneous with the at least one cavity being in proximity to the fill head.

Abstract: An apparatus and system, as well as fabrication methods therefor, may include a thermal intermediate structure with metal decorated carbon nanotubes incorporated in solder.