Preplacing Solid Filler Patents (Class 228/245)
  • Patent number: 7967183
    Abstract: The invention relates to a method for repairing components comprising a base material with an oriented microstructure, wherein the repair point comprises a correspondingly oriented microstructure as the surrounding base material. According to the inventive method, solder is applied in the region of a point which is to be repaired and is soldered to the component by means of a heating effect produced by a device. A temperature gradient, i.e., approximately a temperature characteristic, is produced during the heating effect, said temperature characteristic ranging from a high to a low temperature in the region of the point which is to be repaired.
    Type: Grant
    Filed: January 28, 2005
    Date of Patent: June 28, 2011
    Assignees: Siemens Aktiengesellschaft, MTU Aero Engines GmbH
    Inventors: Dirk Goldschmidt, Matthias Oechsner, Michael Ott, Uwe Paul, Ursula Pickert, Eckart Schumann, Beate Seiler, Robert Singer, Jan Steinbach, Andreas Volek, Volker Vosberg
  • Patent number: 7946471
    Abstract: A brazing composition for the brazing of superalloys including a base material with at least one initial phase is provided. The initial phase has a solidus temperature that is below the solidus temperature of the base material and, above a certain temperature, forms with the base material and/or with at least one further initial phase at least one resultant phase, the solidus temperature of which is higher that the solidus temperature of the initial phases. Heat treatment takes place in two stages, wherein the temperature of the second heat treatment is preferably 800-1200° C. The brazing composition may likewise be of the type MCrAlX, and the power particles of the initial phase may be in the form of nanoparticles.
    Type: Grant
    Filed: February 6, 2007
    Date of Patent: May 24, 2011
    Assignee: Siemens Aktiengesellschaft
    Inventors: Brigitte Heinecke, Volker Vosberg
  • Patent number: 7934635
    Abstract: A body has at least one first metallic body part and one second metallic body part. The first body part is coated with a nickel-phosphor layer. The first and second body parts are assembled. The first and second body parts are heated such that a soldered connection is produced between the first and second body part as a result of the nickel-phosphor layer.
    Type: Grant
    Filed: May 10, 2007
    Date of Patent: May 3, 2011
    Assignee: Continental Automotive GmbH
    Inventors: Claus Anzinger, Willibald Schürz, Martin Simmet
  • Patent number: 7926701
    Abstract: The invention relates to an aluminum alloy strip or sheet with the following composition (% by weight): Si 0.3-1.0; Fe<1.0; Cu 0.3-1.0; Mn 0.3-2.0; Mg 0.3-3.0; Zn<6.0; Ti<0.1; Zr<0.3; Cr<0.3; Ni<2.0; Co<2.0; Bi<0.5; Y<0.5, other elements <0.05 each and 0.15 total, the remainder being aluminum, coated on at least one face with an aluminum brazing alloy containing 4 to 15% of silicon and 0.01 to 0.5% of at least one of the Ag, Be, Bi, Ce, La, Pb, Pd, Sb, Y elements or mischmetal. Sheets and strips according to the invention can be used particularly for fluxless brazing of heat exchangers.
    Type: Grant
    Filed: November 24, 2004
    Date of Patent: April 19, 2011
    Assignees: Alcan Rhenalu, Alcan Rolled Products—Ravenswood, LLC
    Inventors: Sandrine Dulac, Sylvain Henry
  • Patent number: 7926699
    Abstract: Method and device for transferring a solder deposit configuration having multiple solder deposits onto a terminal surface configuration of a contact surface of a substrate (36) using a removal of multiple solder deposits from a solder deposit reservoir (25) accommodated in a solder deposit receptacle unit (11) via an isolation unit (12), which is implemented like a template and is situated above the solder deposit reservoir, to implement the solder deposit configuration implemented corresponding to the terminal surface configuration, and using a subsequent transfer of the solder deposit configuration onto the terminal surface configuration of the substrate, the solder deposit reservoir being impinged by partial vacuum through template openings (15) of the isolation unit to transfer the solder deposits from the solder deposit reservoir into the isolation unit, the solder deposit reservoir (25) being ventilated via a floor wall (20) situated diametrically opposite the isolation unit during the partial vacuum im
    Type: Grant
    Filed: September 24, 2009
    Date of Patent: April 19, 2011
    Assignees: Pac Tech—Packaging Technologies GmbH, Smart Pac GmbH Technology Services
    Inventors: Elke Zakel, Ghassem Azdasht
  • Publication number: 20110067911
    Abstract: In this method of bonding a part to a substrate using a solder paste, the solder paste is mounted or applied between a metallization layer formed on the substrate and a metallization layer formed on the part, and the part is bonded to the substrate by performing a reflow process in a non-oxidizing atmosphere to bond the substrate and the part. The metallization layer formed on the surface of the substrate is planar and includes a metallization layer main portion that has an area smaller than that of the metallization layer of the part and a solder guide portion that protrudes from a periphery of the metallization layer main portion.
    Type: Application
    Filed: June 12, 2009
    Publication date: March 24, 2011
    Applicant: Mitsubishi Materials Corporation
    Inventors: Masayuki Ishikawa, Sho Nakagawa
  • Patent number: 7896223
    Abstract: Solder bumps formed on an electrode portion of a semiconductor chip are recently miniaturized, and when printing by using solder balls, the solder balls are also miniaturized. Therefore, it is required to print solder balls for printing with accuracy. Instead of a conventional squeegee, a solder ball loading member including a plurality of semi-spiral wire rods is provided at a print head portion for printing solder balls, and by pressing the solder ball loading member to a mask surface with a predetermined pressing force, turning forces of the solder balls are added by spaces formed by the wire rods. Accordingly, the solder balls are moderately dispersed, and are squeezed into an opening portion of the mask.
    Type: Grant
    Filed: August 19, 2009
    Date of Patent: March 1, 2011
    Assignee: Hitachi Plant Technologies, Ltd.
    Inventors: Makoto Honma, Noriaki Mukai, Shinichiro Kawabe, Akio Igarashi, Naoaki Hashimoto
  • Patent number: 7891537
    Abstract: A method for aligning the sputter target onto a backing plate having a peripheral arcuate-shaped flange on its bonding surface to provide an aligned and uniform solder bonded interface; and the sputter target/backing plate assembly so produced.
    Type: Grant
    Filed: April 6, 2010
    Date of Patent: February 22, 2011
    Assignee: Praxair S. T. Technology, Inc.
    Inventors: Joseph C. Facey, Ivan Ward
  • Publication number: 20110019062
    Abstract: Provided is an optical element assembly which is composed of two or more optical members and can prevent one optical member from being separated from another even if the optical element assembly is subjected to reflow processing, and also provided are an image pickup module using the optical element assembly, and a method for manufacturing an electronic apparatus including the image pickup module. There is provided an optical element assembly in which a first optical member formed of glass or curable resin and a second optical element formed of curable resin are joined together, and the following expression (1) is satisfied, where ?1 (×10?6 ppm/° C.) is a coefficient of linear expansion of the first optical member and ?2 (×10?6 ppm/° C. ) is a coefficient of linear expansion of the second optical member: |?1??2|?100 ??(1).
    Type: Application
    Filed: March 23, 2009
    Publication date: January 27, 2011
    Inventor: Mika Honda
  • Patent number: 7857194
    Abstract: A method of joining metals to a ceramic material such as a ceramic matrix composite is provided which utilizes a compliant interlayer having a coefficient of thermal expansion between the coefficient of thermal expansion of the metal and that of the ceramic matrix composite. The compliant interlayer is bonded to the metal, and the ceramic matrix composite is then bonded to the bonded interlayer/metal. The method results in a high strength joint between a metal having a high coefficient of thermal expansion and a ceramic material having a low coefficient of thermal expansion.
    Type: Grant
    Filed: May 1, 2008
    Date of Patent: December 28, 2010
    Assignee: University of Dayton
    Inventor: Daniel P. Kramer
  • Patent number: 7854366
    Abstract: A method of mounting a conductive ball according to the present invention includes the steps of, disposing a mask on a substrate including connection pads, the mask having opening portions corresponding to the connection pad, supplying conductive balls on the mask, arranging the conductive balls on the connection pad of the substrate through the opening portions of the mask by moving the conductive balls to one end side of the mask by ball moving member (a brush), and removing excess conductive balls remaining on a region of the mask where the opening portions are provided, by bonding the excess conductive balls to a ball removal film (adhesive film).
    Type: Grant
    Filed: August 8, 2008
    Date of Patent: December 21, 2010
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Hideaki Sakaguchi, Kiyoaki Iida
  • Patent number: 7854367
    Abstract: An apparatus for arranging magnetic solder balls includes: a stage for placing and fixing the substrate thereon; a magnet which is incorporated in the stage and is movable in parallel with a lower surface of the placed and fixed substrate so as to cause a magnetic force to act in an upward direction of the stage; and a mask frame capable of being positioned above the stage. An arranging method using this arranging apparatus is also provided. An apparatus for arranging magnetic solder balls includes: a stage for placing and fixing the substrate thereon; a mask frame capable of being positioned above the stage; and a magnetic generator which is movable above the mask frame and causes a magnetic force to act on the stage. An arranging method using this arranging apparatus is also provided.
    Type: Grant
    Filed: July 9, 2010
    Date of Patent: December 21, 2010
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Hideaki Sakaguchi, Kiyoaki Iida
  • Patent number: 7845549
    Abstract: A method of making a braze preform includes: providing a mixture of a brazing alloy in metallic powder form and a binder; melting the binder and forming the mixture into a preform having a preselected shape; removing a majority of the binder from the preform; and heating the preform to remove the remainder of the binder and to sinter the metallic powder together. The preform may include a wear-resistant material therein. Such preforms may be used to form a braze joint between two metallic components, or to produce a metallic component with a wearcoated surface.
    Type: Grant
    Filed: May 31, 2006
    Date of Patent: December 7, 2010
    Assignee: General Electric Company
    Inventor: David Edwin Budinger
  • Patent number: 7845546
    Abstract: Method for producing a vacuum measuring cell having a pressure transducer diaphragm with housing plates sealed on opposite sides to form reference and measuring vacuum chambers. An opening in one plate communicates with the measuring vacuum chamber and has a sealed connection for joining to medium to be measured. The diaphragm and plates are aluminum oxide ceramic and at least one of the seals is aluminum with a thickness of 0.5 ?m to 30 ?m. The ceramic parts are pressed together at increased temperature of 600° C. to 680° C. in a process gas atmosphere including a reducing gas, during a time of 30 to 90 minutes, and subsequently a tempering step is carried out in a second process gas atmosphere including oxygen, tempering taking place at a temperature of 450° C. to 575° C. such that the metallic aluminum is oxidized into aluminum oxide.
    Type: Grant
    Filed: March 25, 2008
    Date of Patent: December 7, 2010
    Assignee: Inficon GmbH
    Inventors: Dietmar Bertsch, Klaus Dietrich, Nico Onda, Martin Wüest
  • Patent number: 7841871
    Abstract: In accordance with a disclosed example method, a first coaxial port is connected to a connector casing. The first coaxial port is connectable to a first section of coaxial cable and the first port to receive digital packet-based data from a first device. A second coaxial port is connected to the connector casing. The second coaxial port is connectable to a second section of coaxial cable. A first impedance is electrically connected to the first coaxial port. The first impedance located in the connector casing. A second impedance is electrically connected to the second coaxial port. The second impedance is located in the connector casing and is different from the first impedance to create an impedance imbalance between the second port and the second section of the coaxial cable.
    Type: Grant
    Filed: October 29, 2009
    Date of Patent: November 30, 2010
    Assignee: AT&T Intellectual Property I, L.P.
    Inventors: Edward Walter, Steven M. Wollmershauser, Vernon Reed, Donald True
  • Patent number: 7837087
    Abstract: A method of forming a brazed joint between an armature bar and a hydraulic header clip including the steps of: locating ends of a plurality of hollow strands and a plurality of solid strands within a cavity in an end fitting such that free ends of said hollow strands extend axially beyond free ends of said solid strands; and pre-placing an essentially phosphorous-free silver braze alloy around and between said ends of said hollow strands and said solid strands such that said braze alloy extends axially beyond the free ends of said solid strands.
    Type: Grant
    Filed: March 19, 2007
    Date of Patent: November 23, 2010
    Assignee: General Electric Company
    Inventors: Jeffrey Michael Breznak, James Fredrick Hopeck, Alan Michael Iversen, Lawrence Lee Sowers
  • Patent number: 7832620
    Abstract: In soldering processes according to prior art, there is often an insufficient tie-up to a substrate of a component. A method in which no voids occur during the soldering processes is provided. A temperature pattern is proposed according to the method in which the temperature is lowered successively during the soldering operation.
    Type: Grant
    Filed: June 17, 2009
    Date of Patent: November 16, 2010
    Assignee: Siemens Aktiengesellschaft
    Inventors: Ingo Berger, Jan Münzer, Ingo Reinkensmeier, Silke Settegast
  • Patent number: 7823764
    Abstract: A device and a method for applying brazing material to an at least partially structured metal foil include a) providing at least one flat metal foil, b) shaping the at least one metal foil to produce a structure, and c) applying brazing material to the at least one metal foil. Steps b) and c) are carried out discontinuously and at least partially together. The device and method are preferably used in the production of metallic honeycomb bodies for the treatment of exhaust gases in vehicles.
    Type: Grant
    Filed: March 17, 2008
    Date of Patent: November 2, 2010
    Assignee: Emitec Gesellschaft Für Emissionstechnologie mbH
    Inventor: Ludwig Wieres
  • Patent number: 7819304
    Abstract: An example method of manufacturing a solid brazed laminate structure includes stacking a first lamina on a second lamina with an interfacial spacing between them, aligning mating portions of the first lamina and the second lamina, and introducing a braze material at least partially into the interfacial spacing to join the first lamina and the second lamina together. One example solid brazed laminate structure includes a lock assembly. Another example solid brazed structure includes a gear assembly.
    Type: Grant
    Filed: March 23, 2007
    Date of Patent: October 26, 2010
    Assignee: Commando Lock LLC
    Inventor: Patrick Smith
  • Patent number: 7810702
    Abstract: A method of producing standoffs in an injection molded solder (IMS) mold, which possesses cavities, each of which is filled with a solder paste using standard techniques, such as screening or IMS. This solder paste is heated to a reflow temperature at which the solder melts and forms a ball or sphere. Since solder pastes are known to reduce in volume due to the therein contained organic material burning off, the remaining solder ball will be significantly lower in volume than that of the cavity. A solder material having a lower melting point is then filled into the cavities about the solder balls. The mold and solder metal are then allowed to cool, resulting in the formation of a solid sphere of metal in the cavity surrounded by solder material of a lower melting point, which, upon transfer to a wafer, form the standoffs.
    Type: Grant
    Filed: July 2, 2008
    Date of Patent: October 12, 2010
    Assignee: International Business Machines Corporation
    Inventors: Steven A. Cordes, Peter A. Gruber
  • Patent number: 7784668
    Abstract: A repair method of propagating epitaxial crystalline structures is provided. The repair method broadly comprises the steps of providing a substrate to be repaired, placing an additive material as a preformed shape onto an area of the substrate to be repaired, utilizing a heat source to heat an entire volume of the additive material and an area adjacent to the additive material to within 0-100° F. of their solidus temperatures, holding at the fusion temperature for a time sufficient to allow grain growth and orientation to occur, and ramping down the heat source at a predetermined controlled rate until solidification is complete.
    Type: Grant
    Filed: December 16, 2005
    Date of Patent: August 31, 2010
    Assignee: United Technologies Corporation
    Inventor: Gary Charles Shubert
  • Patent number: 7784671
    Abstract: An apparatus for arranging magnetic solder balls includes: a stage for placing and fixing the substrate thereon; a magnet which is incorporated in the stage and is movable in parallel with a lower surface of the placed and fixed substrate so as to cause a magnetic force to act in an upward direction of the stage; and a mask frame capable of being positioned above the stage. An arranging method using this arranging apparatus is also provided. An apparatus for arranging magnetic solder balls includes: a stage for placing and fixing the substrate thereon; a mask frame capable of being positioned above the stage; and a magnetic generator which is movable above the mask frame and causes a magnetic force to act on the stage. An arranging method using this arranging apparatus is also provided.
    Type: Grant
    Filed: July 23, 2008
    Date of Patent: August 31, 2010
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Hideaki Sakaguchi, Kiyoaki Iida
  • Patent number: 7780058
    Abstract: Improved solder and soldering methods are disclosed. In accordance with one technique, a solder having a plurality of individual wire strands braided together is used. In accordance with another technique, the braided solder comprises both the same solder composition and wire gauge in the individual solder wire strands. In accordance with another technique, the braided solder comprises at least two different solder compositions used in the individual solder wire strands. In accordance with another technique, the braided solder comprises at least two different wire gauges used in the individual solder wire strands. In accordance with another technique, the braided solder comprises at least one wire strand where the primary surface is coated with a thin layer of a noble metal. In accordance with another technique, the braided solder comprises at least one wire strand where flux material is present.
    Type: Grant
    Filed: February 27, 2008
    Date of Patent: August 24, 2010
    Inventors: Siuyoung Yao, Brian Taggart
  • Patent number: 7775414
    Abstract: A consumable insert (10) formed of material particles (14) contained within a sheath (12). The particles may be a melting point depressant that has a concentration that is greater in a center region (16) of the insert than in the surface region (18) of the insert, thereby facilitating complete melting of the insert during a transient liquid phase bonding process. Alternatively, the particles may be a low-ductility material, such as a superalloy or an MCrAlY alloy, contained within a high ductility sheath material formed into a ribbon shape, thereby allowing the low-ductility material to be delivered in ribbon form during a coating process.
    Type: Grant
    Filed: October 4, 2003
    Date of Patent: August 17, 2010
    Assignee: Siemens Energy, Inc.
    Inventors: Peter J. Ditzel, Srikanth Kottilingam
  • Patent number: 7762447
    Abstract: Processes for friction stir welding, typically for comparatively thick plate materials using multiple passes and multiple layers of a friction stir welding tool. In some embodiments a first portion of a fabrication preform and a second portion of the fabrication preform are placed adjacent to each other to form a joint, and there may be a groove adjacent the joint. The joint is welded and then, where a groove exists, a filler may be disposed in the groove, and the seams between the filler and the first and second portions of the fabrication preform may be friction stir welded. In some embodiments two portions of a fabrication preform are abutted to form a joint, where the joint may, for example, be a lap joint, a bevel joint or a butt joint. In some embodiments a plurality of passes of a friction stir welding tool may be used, with some passes welding from one side of a fabrication preform and other passes welding from the other side of the fabrication preform.
    Type: Grant
    Filed: March 20, 2008
    Date of Patent: July 27, 2010
    Assignee: UT-Battelle, LLC
    Inventors: Zhili Feng, Stan A. David, David Alan Frederick
  • Patent number: 7748601
    Abstract: A brazing assembly includes a tungsten/carbide/cobalt substrate (e.g., wear pad), a second substrate including titanium or titanium alloy (e.g., a midspan shroud of a fan or compressor blade) and a brazing material including gold, nickel, and copper present in respective amounts to improve the ductility of the braze joint. A brazed article includes a first substrate, a second substrate, and a braze joint having a post-braze hardness of between 450 and 600 KHN. A method to improve the impact resistance of a braze joint between a tungsten/carbide/cobalt substrate and a substrate including titanium or alloy thereof includes utilizing a brazing material including gold, nickel, and copper and brazing at temperatures less than about 1900° F. (1038° C.).
    Type: Grant
    Filed: October 31, 2007
    Date of Patent: July 6, 2010
    Assignee: General Electric Company
    Inventors: Kazim Ozbaysal, David Edwin Budinger
  • Publication number: 20100163098
    Abstract: The present subject matter relates to receivers for concentrating photovoltaic systems and methods for fabricating such receivers. A receiver for a concentrating photovoltaic system can comprise a substrate, a plurality of electrical contact pads located on a first surface of the substrate, and a plurality of photovoltaic cells each having plurality of electrically conductive traces that are each electrically coupled to one of the electrical contact pads. In some embodiments, all of the conductive traces can be located on the back surface of the photovoltaic cells for conduction of electric current generated by the photovoltaic cells when illuminated. Alternatively, conductive traces can further be located on a front surface of the photovoltaic cells and can be electrically coupled to corresponding contact pads by electrical connectors. Regardless of the specific arrangement, the receivers can be fabricated using industry standard soldering techniques often used in the electronics industry.
    Type: Application
    Filed: December 3, 2009
    Publication date: July 1, 2010
    Inventors: James Christopher Clemens, Charles Ross Evans, II, Daniel Jones, Eric Vendura, Philip J. DeSena, Ryan Kelly, Michael Poncheri
  • Patent number: 7731079
    Abstract: A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat-generating electronic device. The method of fabrication includes: obtaining a solder material; disposing the solder material on a surface to be cooled; and reflowing and shaping the solder material disposed on the surface to be cooled to configure the solder material as a base with a plurality of fins extending therefrom. In addition to being in situ-configured on the surface to be cooled, the base is simultaneously metallurgically bonded to the surface to be cooled. The solder material, configured as the base with a plurality of fins extending therefrom, is a single, monolithic structure thermally attached to the surface to be cooled via the metallurgical bonding thereof to the surface to be cooled.
    Type: Grant
    Filed: June 20, 2008
    Date of Patent: June 8, 2010
    Assignee: International Business Machines Corporation
    Inventors: Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Bruce K. Furman, Madhusudan K. Iyengar, Paul A. Lauro, Roger R. Schmidt, Da-Yuan Shih, Robert E. Simons
  • Patent number: 7721939
    Abstract: A method for aligning the sputter target onto a backing plate having a peripheral arcuate-shaped flange on its bonding surface to provide an aligned and uniform solder bonded interface; and the sputter target/backing plate assembly so produced.
    Type: Grant
    Filed: July 16, 2008
    Date of Patent: May 25, 2010
    Assignee: Praxair S. T. Technology, Inc.
    Inventors: Joseph C. Facey, Ivan Ward
  • Patent number: 7708184
    Abstract: A gas turbine engine includes alternating rows of rotary airfoils or blades and static airfoils or vanes. The vanes are made of a base metal, such as cobalt or nickel superalloy. If a crack forms in one of the vanes, a braze alloy is applied to the crack. The braze alloy is a powdered slurry. The braze alloy includes approximately 50 to 100% of a base material and approximately 0 to 50% of a braze material. The base material of the braze alloy has the same composition as the composition of the base metal of the vane. The airfoil is then exposed to microwaves which melt the braze alloy in preference to the base metal to repair the crack in the vane.
    Type: Grant
    Filed: October 1, 2004
    Date of Patent: May 4, 2010
    Assignee: United Technologies Corporation
    Inventor: Balaji Rao Garimella
  • Patent number: 7703663
    Abstract: The present invention relates to a device and method for brazing a heat pipe assembly with copper-silver alloy filler rings to improve heat dissipation efficiency of a heat pipe. The device comprises a brazing furnace and a conveyor. The brazing furnace comprises an open ended passage with a multi-stage brazing heater and cooler. The conveyor comprises an input bracket assembly, an output bracket assembly and a steel mesh belt. The method comprises steps of (A) providing multiple heat pipe components, (B) assembling the heat pipe components to form heat pipe assemblies, (C) injecting mixed gas, (D) turning on the multi-stage brazing heater and cooler, (E) placing the heat pipe assemblies on the conveyor, (F) brazing the heat pipe assemblies to form heat pipes, (G) cooling the heat pipes and (H) removing the heat pipes from the conveyor.
    Type: Grant
    Filed: September 16, 2009
    Date of Patent: April 27, 2010
    Inventor: Wen-Chih Liao
  • Publication number: 20100089981
    Abstract: An apparatus for interconnecting two connection pads in a head-gimbal assembly. The apparatus includes a conveyer for conveying a metallic slug, and a nozzle for ejecting the metallic slug toward the two connection pads. The nozzle includes a receiving portion for receiving the metallic slug from the conveyer, and a straight guide disposed downstream of the receiving portion. The straight guide has a maximum inner diameter that is smaller than a minimum inner diameter of the receiving portion. The apparatus also includes a laser for applying a laser beam from an inlet side of the nozzle to the metallic slug as the metallic slug passes along a path that includes a first portion through said straight guide and a second portion between the straight guide and the two connection pads. The laser is configured to melt the metallic slug for attaching the metallic slug to the two connection pads.
    Type: Application
    Filed: October 9, 2009
    Publication date: April 15, 2010
    Inventors: Yohsuke Matsumoto, Tatsumi Tsuchiya, Eiki Oosawa, Tatsushi Yoshida
  • Patent number: 7694868
    Abstract: Provided is a method and apparatus for mounting a plurality of electronic components. The method comprises mounting a first electronic component on a substrate; forming a mask on the substrate to expose the first electronic component and a region of the substrate on which a solder paste is to be applied; forming a guide on a portion of the mask disposed around the first electronic component; applying the solder paste onto the substrate by using a squeezer contacting a portion of the mask disposed around the region of the substrate on which the solder paste is to be applied; removing the guide and the mask; and mounting a second electronic component on the solder paste.
    Type: Grant
    Filed: December 2, 2008
    Date of Patent: April 13, 2010
    Assignee: Samsung Digital Imaging Co., Ltd.
    Inventors: Kyeong-heon Kim, Tae-hun Kim, Dong-hee Kim
  • Patent number: 7690550
    Abstract: In a reflow soldering apparatus comprising a conveyor 4 to transport circuit boards 5 mounted with electronic components into multiple chambers 1, 2 and 3, and fans 6 installed in the chambers 1, 2 and 3, the centers of the impellers in the adjacent fans 6 are not on a single perpendicular plane along the transport line of the conveyor and arrayed offset to the left and right. This apparatus may also employ a structure wherein the centers of the impellers in the adjacent fans are not on a single horizontal plane and arrayed offset up and down. Further, it may also employ a structure wherein the fans are arranged with their rotation shafts inclined.
    Type: Grant
    Filed: May 1, 2003
    Date of Patent: April 6, 2010
    Assignee: Yokota Technica Limited Company
    Inventor: Yatsuharu Yokota
  • Publication number: 20100059576
    Abstract: A lead-free and solder alloy composition for electronic assembly applications having reduced toxicity. The alloy composition comprises, by weight, about 0.2% to about 1% copper; about 0.001% to about 0.039% nickel; about 0.001% to about 0.039% cobalt; and the balance of tin. The alloy composition has a melting temperature of about 227° C., with superior wetting and mechanical strength making the alloy composition wells suited for electronic circuit board manufacture and lead less component bumping or column arrays, and replacement of conventional tin-lead solders.
    Type: Application
    Filed: September 5, 2008
    Publication date: March 11, 2010
    Applicant: American Iron & Metal Company, Inc.
    Inventor: Karl F. Seelig
  • Publication number: 20100051673
    Abstract: Method and device for transferring a solder deposit configuration having multiple solder deposits onto a terminal surface configuration of a contact surface of a substrate (36) using a removal of multiple solder deposits from a solder deposit reservoir (25) accommodated in a solder deposit receptacle unit (11) via an isolation unit (12), which is implemented like a template and is situated above the solder deposit reservoir, to implement the solder deposit configuration implemented corresponding to the terminal surface configuration, and using a subsequent transfer of the solder deposit configuration onto the terminal surface configuration of the substrate, the solder deposit reservoir being impinged by partial vacuum through template openings (15) of the isolation unit to transfer the solder deposits from the solder deposit reservoir into the isolation unit, the solder deposit reservoir (25) being ventilated via a floor wall (20) situated diametrically opposite the isolation unit during the partial vacuum im
    Type: Application
    Filed: September 24, 2009
    Publication date: March 4, 2010
    Inventors: Elke Zakel, Ghassem Azdasht
  • Patent number: 7666520
    Abstract: A honeycomb body includes two opposite end sides, at least one housing and at least one metallic layer forming channels. At least one of the end sides has at least one brazed zone forming a belt-shaped, brazing material-free zone adjacent the housing. A method for producing the honeycomb body, an exhaust-gas treatment component for an internal combustion engine and a motor vehicle having the honeycomb body, are also provided.
    Type: Grant
    Filed: March 24, 2008
    Date of Patent: February 23, 2010
    Assignee: EMITEC Gesellschaft fuer Emissionstegchnologie mbH
    Inventors: Ludwig Wieres, Jörg Gutowski, Michael Voit, Ferdi Kurth
  • Patent number: 7651023
    Abstract: A nickel-based braze composition is described, containing nickel, palladium, and restricted amounts of boron and silicon. The composition can also contain tantalum, titanium, and zirconium, as well as aluminum, chromium, and cobalt. A method for joining two metal components, using the braze composition, is also described. The braze composition can also be used to fill cracks or other cavities in a component, e.g., a gas turbine part formed from a nickel-based superalloy. Articles of manufacture which contain the braze composition are also described.
    Type: Grant
    Filed: May 22, 2007
    Date of Patent: January 26, 2010
    Assignee: General Electric Company
    Inventors: Shyh-Chin Huang, Liang Jiang, Melvin Robert Jackson, Laurent Cretegny, Charles Gitahi Mukira
  • Patent number: 7635270
    Abstract: An impedance imbalance connector is provided. The connector comprises a first port connectable to a first section of coaxial cable, the first port having a first impedance and the first port further to receive digital packet-based data from a first device. The connector further comprises a second port connectable to a second section of coaxial cable, the second port having a second impedance which differs from the first impedance so as operationally to create an impedance imbalance between the second port and the second section of the coaxial cable.
    Type: Grant
    Filed: August 15, 2006
    Date of Patent: December 22, 2009
    Assignee: AT&T Intellectual Property I, L.P.
    Inventors: Edward Walter, Steven M. Wollmershauser, Vernon Reed, Donald True
  • Patent number: 7635079
    Abstract: System for placing conductive spheres on prefluxed bond pads of a substrate using a stencil plate with a pattern of through-holes positioned over the bond pads. Conductive spheres are placed in the through-holes by a moving feed mechanism and the spheres drop through the through-holes onto the bond pads. In one embodiment, the feed mechanism is a sphere hopper which crosses the entire through-hole pattern. In another embodiment, a shuttle plate fed spheres from a reservoir and reversibly moves about one-half of the pitch, moving from a non-discharge position to a discharge position.
    Type: Grant
    Filed: May 23, 2000
    Date of Patent: December 22, 2009
    Assignee: Micron Technology, Inc.
    Inventors: Chad A. Cobbley, Michael B. Ball, Marjorie L. Waddel
  • Patent number: 7635078
    Abstract: This invention relates to a method of brazing while the thickness of the opening between materials being brazed can not be maintained constant or can not be adjusted in the appropriate range. In order to solve this issue the porous material of metals or metal alloys consisting of Ni, Cu, Ti, Al, Ag or W should be utilized. The metallic porous material is inserted into the brazing opening mentioned above by using the softness of it, and is made to hold the brazing solder and to reinforce the bonding part after brazing.
    Type: Grant
    Filed: February 6, 2006
    Date of Patent: December 22, 2009
    Assignee: Kanto Yakin Kogyo Kabushiki Kaisha
    Inventors: Tadashi Ariga, Kiichi Kanda
  • Patent number: 7624906
    Abstract: A method of ultrasonic brazing metal matrix composite, which forms a reinforced composite bond without filling welding wire with reinforcement or adding alloy element to generate ceramic phase, includes the steps of setting a filler metal; introducing ultrasonic vibration to braze in air; dissolving the base materials, and introducing ultrasonic wave again. The method performs the aluminum brazing at low temperature. The periodic time of brazing is shorter and the cost is lower than the conventional brazing methods. The strength, service temperature and dimensional stability of the joint are close to the base article.
    Type: Grant
    Filed: November 21, 2007
    Date of Patent: December 1, 2009
    Assignee: Harbin Institute of Technology
    Inventors: Jiuchun Yan, Weiwei Zhao, Huibin Xu, Dacheng Li, Zhiwu Xu, Shiqin Yang, Yang Zhang, Zhipeng Ma
  • Publication number: 20090285715
    Abstract: The invention relates to a welding additive material, a use of a welding additive material, welding methods and a component which significantly improves the weldability of some nickel-based superalloys by means of a welding additive material and comprises the following constituents (in wt %): 18.0%-20.0% of chromium, 9.0%-11.0% of cobalt, 7.0%-10.0% of molybdenum, 2.0%-2.5% of titanium, 1.0%-1.7% of aluminum, 0.04%-0.08% of carbon, balance nickel.
    Type: Application
    Filed: February 16, 2007
    Publication date: November 19, 2009
    Inventors: Nikolai Arjakine, Uwe Paul, Rolf Wilkenhöner
  • Patent number: 7614541
    Abstract: An improved placing method and placing apparatus are provided for placing conductive balls in a predetermined pattern onto a base unit. In the placing method for placing balls having conductivity in a predetermined pattern onto one surface of the base unit, an arrangement member has one surface, another surface opposite to the one surface of the arrangement member and positioning openings, wherein the positioning openings are arranged corresponding to the pattern such that the openings are through from the one surface to the another surfaces of the arrangement member so that the balls are inserted therein. The another surface of the arrangement member is positioned opposite to the one surface of the base unit. The arrangement member has two or more line members of which the core axes are substantially aligned.
    Type: Grant
    Filed: August 25, 2008
    Date of Patent: November 10, 2009
    Assignee: Hitachi Metals, Ltd.
    Inventors: Motoyuki Itoh, Masanori Ochiai, Shinichi Kazui
  • Patent number: 7607559
    Abstract: A conductive ball arraying apparatus includes an arraying jig including conductive ball insertion parts in a predetermined array pattern, a ball cup that has an opening formed in a bottom surface thereof and is capable of housing a plurality of conductive balls along with the arraying jig, moving means that moves the arraying jig and the ball cup relatively, the moving means moving the ball cup relatively along a top surface of the arraying jig and dropping off the conductive balls into the ball insertion parts of the arraying jig, floating means that floats the ball cup from the arraying jig, and vibrating means that vibrates the ball cup. The moving means moves the ball cup relatively along the top surface of the arraying jig while floating the ball cup from the arraying jig and vibrating the ball cup.
    Type: Grant
    Filed: December 4, 2007
    Date of Patent: October 27, 2009
    Assignee: Shibuya Kogyo Co., Ltd.
    Inventor: Yoshihisa Kajii
  • Publication number: 20090260431
    Abstract: A thermal anemometer or mass flow meter typically having temperature and flow velocity sensor elements is provided in which a thin film temperature sensor is used in the heated sensor of the fluid velocity sensor element of the system. At least one thin-film RTD sensor is held within a spacer or interface member and the spacer, optionally, received within a housing. The thermal anemometer is preferably constructed to offer sufficient precision and accuracy in its design to be suitable for sensitive scientific and industrial applications. This goal is achieved while using cost effective parts by employing a construction approach in which the spacer and RTD sensor(s) is secured in place by solder, braze or another compound flowed into place while inserting the spacer and/or sensor(s).
    Type: Application
    Filed: April 21, 2008
    Publication date: October 22, 2009
    Inventors: John G. Olin, John P. Smitherman
  • Publication number: 20090261480
    Abstract: An article including a substrate having a blind hole formed therein, wherein the blind hole is defined by a floor and a sidewall and a solder connection is provided. The solder connection may couple a first contact pad to a second contact pad. The first contact pad may cover a first field of the floor of the blind hole, and may also promote wetting of a solder material of the solder connection. Wetting may be impeded on a second field of the floor of the blind hole. The second contact pad may be arranged above a surface of a further substrate, wherein the surface of the further substrate may be oriented perpendicularly to the floor of the blind hole in the substrate.
    Type: Application
    Filed: April 18, 2008
    Publication date: October 22, 2009
    Inventors: Alfred Martin, Barbara Hasler
  • Patent number: 7596864
    Abstract: A method for soldering a soft wire to a printed circuit board conveniently includes the following step: providing a bracket having a through hole and an enameled wire; fastening the enameled wire to the bracket with the conductive wire crossing over the through hole; providing a printed circuit board formed with conductive pads thereon and setting the printed circuit board onto the bracket with the pad aligned to the through hole so that a portion of the magnet wire crossing the through hole lies on the conductive pad; providing a soldering tool having a thermal contact portion and inserting the thermal contact portion into the through hole to solder the magnet wire to the conductive pad.
    Type: Grant
    Filed: March 15, 2007
    Date of Patent: October 6, 2009
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: John Chow, Huan Chen, Chih-Min Lin
  • Patent number: 7597233
    Abstract: There is provided a conductive ball mounting apparatus for mounting one conductive ball on each of a plurality of connection pads formed on a substrate. The conductive ball mounting apparatus includes: an outer frame; an inner cylinder provided in the outer frame, wherein an upper surface and a lower surface of the inner cylinder are opened; a sieve provided in the inner cylinder, wherein the inner cylinder is partitioned into an upper space and a lower space by the sieve; an inlet port for supplying an air from an outside to the lower space of the inner cylinder; a mask provided to a lower end of the outer frame and having openings, the openings being provided to correspond to conductive ball mounting positions; and an exhaust port for exhausting an air from an upper surface of the mask to the outside and being provided to the lower end of the outer frame, wherein the inner cylinder is adapted to vibrate without being restricted by the outer frame.
    Type: Grant
    Filed: July 23, 2008
    Date of Patent: October 6, 2009
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Hideaki Sakaguchi, Kiyoaki Iida
  • Publication number: 20090200362
    Abstract: In a lead-free solder, a semiconductor package and a method of manufacturing the semiconductor package, the lead-free solder includes about 3.5 percent by weight to about 6 percent by weight of silver, about 0.05 percent by weight to about 0.5 percent by weight of copper and a remainder of tin. The lead-free solder is employed in the semiconductor package. The lead-free solder has high impact resistance and high heat resistance to reduce failures of the semiconductor package.
    Type: Application
    Filed: February 11, 2009
    Publication date: August 13, 2009
    Inventors: Ky-Hyun JUNG, Jae-Yong Park, Heui-Seog Kim, Wha-Su Sin, Jung-Hyeon Kim