Abstract: Short fibers in a solder or a welding material often do not have the desired strength. Fiber mats that are introduced onto a surface or into a recess of a metallic component are provided. In addition a process for applying material to a metallic component is provided. In the process, a first fiber mat and a second fiber mat are used.

Abstract: A method of welding a gas turbine engine substrate composed of a gamma prime precipitation strengthened nickel based superalloy, including the steps of: applying weld beads on the substrate to form a continuous layer the thickness of the weld beads; using a filler material made of a first material exhibiting comparable strength and ductility as the substrate, and a second material exhibiting greater ductility than the substrate; and creating crack propagation mitigating regions within the continuous layer by increasing the percentage of the second material in the crack propagation mitigating regions over the percentage of the second material in the remainder of the continuous layer.

Abstract: A mold fill head includes a solder delivery head and an interface portion having a compliant portion secured to the solder delivery head and a dispensing region associated with the compliant portion. The dispensing region is formed with at least one aperture configured to interface with cavities in a mold plate, the at least one aperture being in fluid communication with the solder delivery head. The compliant portion is configured and dimensioned to urge the dispensing region against the mold plate when held a predetermined distance therefrom and to substantially tolerate variations in flatness of the mold plate, variations in the predetermined distance, and/or variations in an angular orientation of the interface portion and the mold plate.

Abstract: A tin or solder alloy film is formed by ejecting molten tin liquid or molten solder alloy liquid in a jet state onto a copper surface of an electronic component. The overflowing molten tin or molten solder alloy liquid is transported to a stirrer. Then, cuprate and the like mixed in the overflowing molten tin or molten solder alloy liquid are taken in to the organic fatty acid solution by fiercely stirring and mixing the molten tin or molten solder alloy liquid in contact with a solution at a temperature of 180 to 350° C. containing 1 to 80 weight % of organic fatty acid having 12 to 20 carbon number that circulates in the stirrer to purify the overflowing molten tin or molten solder alloy liquid.

Abstract: A mold plate to parking location interface includes: a mold plate for holding solder; a fill head with an o-ring for dispensing solder bumps on the mold plate; a parking location for locating the fill head; and a platform between the mold plate and the parking location for relatively moving the fill head from the first location to the second location such that the o-ring decompresses as it passes over the platform.

Abstract: A portion of compliant material includes four walls defining a slot. The slot has a relatively large cross-section end in fluid communication with a solder reservoir, and also has a relatively small cross-section end opposed to the relatively large cross-section end. The slot has a generally elongate rectangular shape when viewed in plan, with a length perpendicular to a scan direction, a width, parallel to the scan direction, associated with the relatively large cross section end, and a width, parallel to the scan direction, associated with the relatively small cross section end. The slot is configured in the portion of compliant material such that the relatively small cross-section end of the slot normally remains substantially closed, but locally opens sufficiently to dispense solder from the reservoir when under fluid pressure and locally unsupported by a workpiece. Methods of operation and fabrication are also disclosed.

Abstract: A composition for welding or brazing aluminum comprises silicon (Si) and magnesium (Mg) along with aluminum in an alloy suitable for use in welding and brazing. The Si content may vary between approximately 4.7 and 10.9 wt %, and the Mg content may vary between approximately 0.15 wt % and 0.50 wt %. The alloy is well suited for operations in which little or no dilution from the base metal affects the Si and/or Mg content of the filler metal. The Si content promotes fluidity and avoids stress concentrations and cracking. The Mg content provides enhanced strength. Resulting joints may have a strength at least equal to that of the base metal with little or no dilution (e.g., draw of Mg). The joints may be both heat treated and artificially aged or naturally aged.

Abstract: A reflow furnace using a conventional heater for blowing hot air has difficulty in reducing ?t and in stabilizing the oxygen concentration at a low level. In addition, it is difficult to uniformly discharge hot air from the discharge holes in a perforated plate of a conventional heater for blowing hot air. In a reflow furnace according to the present invention, the total area per unit area of discharge holes formed in a perforated plate in a heater for blowing hot air installed in a main heating zone is 1.5-5 times the total area per unit area of the discharge holes formed in a perforated plate of a heater for blowing hot air installed in a preheating zone. A heater for blowing hot air has a body divided into three chambers by partitions.

Abstract: A member having a coating film capable of suppressing whisker generation is provided. The coating film (3) including a plurality of crystalline grains (3a) made of tin or tin alloy is formed above the surface of the base member (1). An intermetallic compound (3b) of tin and the first metal is being formed along the crystalline grain boundaries of the coating film.

Abstract: A method and an electronic assembly for attaching a component to a substrate, or printed circuit board, is recited. The printed circuit board comprises a solder-nonwettable surface and a bond pad being formed of a solder-wettable surface. The printed circuit board defines a through hole extending through the printed circuit board and the bond pad. A plate lining a first portion of the through hole in the printed circuit board is formed of a solder-wettable material. Solder paste is applied to the bond pad and into the through hole. A component including a terminal overlies the bond pad in an arrangement. Reflowing the solder paste forms a solder fillet that bonds the terminal to the bond pad. The solder fillet extends within the through hole attaching the component to the printed circuit board.

Abstract: An apparatus and a process for the manufacture of a solder-bump adhered wafer substrate for use in the semiconductor industry, comprising one or more of the following steps including: arranging a first compressive member and a second compressive member in an opposed, compressibly displaceable, spaced-apart relationship, with a pattern plate disposed therebetween with the pattern plate having a plurality of aligned through-holes arranged thereon; filling the through-holes with a molten solder; compressing the solder and the pattern plate between the first and second opposed compressive members to compact the solder therein and cleans the pattern plate of excess solder; chilling the pattern plate to solidify the molten solder in the through-holes; and removing the pattern plate from the spaced-apart compressive members to produce a wafer with solder bumps thereon.

Abstract: A portion of compliant material includes four walls defining a slot. The slot has a relatively large cross-section end in fluid communication with a solder reservoir, and also has a relatively small cross-section end opposed to the relatively large cross-section end. The slot has a generally elongate rectangular shape when viewed in plan, with a length perpendicular to a scan direction, a width, parallel to the scan direction, associated with the relatively large cross section end, and a width, parallel to the scan direction, associated with the relatively small cross section end. The slot is configured in the portion of compliant material such that the relatively small cross-section end of the slot normally remains substantially closed, but locally opens sufficiently to dispense solder from the reservoir when under fluid pressure and locally unsupported by a workpiece. Methods of operation and fabrication are also disclosed.

Abstract: An interconnection technology may use molded solder to define solder balls. A mask layer may be patterned to form cavities and solder paste deposited in the cavities. Upon heating, solder balls are formed. The cavity is defined by spaced walls to keep the solder ball from bridging during a bonding process. In some embodiments, the solder bumps connected to the solder balls may have facing surfaces which are larger than the facing surfaces of the solder ball.

Abstract: The invention provides a solder structure which is least likely to develop Sn whiskers and a method for forming such a solder structure. The solder structure includes an Sn alloy capable of a solid-liquid coexistent state and an Au (or Au alloy) coating covering at least part of the surface of the Sn alloy. The Au covering is a film that covers and coats at least part of the surface of the Sn alloy. As a preferable mode, the Au coating forms a netlike structure on the surface of the Sn alloy. The thickness of the Au coating is, for instance, 1 to 5 ?m.

Abstract: A braze material and processes for making and using the material, such as for use in the manufacturing, coating, repair, and build-up of superalloy components. The braze material is composed of particles with melt-modifying constituents that are limited to the surfaces of the particles, yet are capable of sufficiently promoting the heating of the particles by conventional means and microwave radiation to achieve at least partial melting of the particles. The melt-modifying constituents are in the form of particulates embedded in the outer surface region of each particle. The particulates are formed of melting point depressant(s) and/or microwave coupling enhancer(s), are much smaller than the particle in which they are embedded.

Abstract: A semiconductor device is provided in which a semiconductor chip is bonded to a substrate with a sufficiently increased bonding strength and cracking is assuredly prevented which may otherwise occur due to heat shock, heat cycle and the like. The semiconductor device includes a semiconductor chip and a substrate having a bonding area to which the semiconductor chip is bonded via a metal layer. The metal layer includes an Au—Sn—Ni alloy layer and a solder layer provided on the Au—Sn—Ni alloy layer. Undulations are formed in an interface between the Au—Sn—Ni alloy layer and the solder layer.

Abstract: A brazed part, and methods of forming a brazed joint therein, are disclosed. The brazed part includes two or more components that are brazed together. Using the method of locating the parts herein disclosed, an inter-component gap between the components may be formed. Flow control features formed along the inter-component gap may then be used to assist in the retention of the braze material between the components during brazing.

Abstract: A method for making a feedthrough assembly for an implantable electronic medical device comprises providing a metallic ferrule having an outer surface and an aperture defined by an inner lumen surface; providing an insulator, the insulator having a first surface and a second surface. At least one of the first surface and the second surface of the insulator includes a brazing region disposed thereon. The braze material is applied to the brazing region and the insulator is positioned within or around the metallic ferrule such that the positioned insulator brazing region and the metallic ferrule outer surface or inner lumen surface defines a braze gap. The braze gap has a width ranging between 10 ?m to 50 ?m. The feedthrough assembly is then heated at a temperature conducive to melt the braze material in the braze gap thereby forming a hermetic seal between the ferrule and said insulator.

Abstract: A flexible unitary mask has a plurality of through holes. A substrate has a plurality of wettable pads in recessed regions defining volumes. The through holes are aligned with the wettable pads. Molten solder is directly injected through the through holes of the flexible unitary mask into the volumes with the wettable pads, such that the through holes and the volumes with the wettable pads are filled with solder. The solder is allowed to solidify, forming a plurality of solder structures adhered to the wettable pads. The flexible unitary mask is peeled from the substrate after the solder has solidified.

Abstract: The process that is the subject of this invention is a method of making a rotary sputtering target having the steps of providing a cylinder of sputtering target material having an adhesion-wetting layer on its inside surface; providing a stainless steel sputtering target backing tube having an outside diameter smaller than the sputtering target material inside diameter, the backing tube having an adhesion-wetting layer on its outside surface; welding an upper and lower stainless steel retaining ring to the backing tube adjacent to the sputtering target material so that the target material is in compression and the backing tube in tension; and introducing molten bonding material into the annulus between the backing tube and the sputtering target material.

Abstract: A reflow module of a reflow oven including a reflow fixture housed within a compartment of the reflow oven, removable side ports attached to the reflow fixture for controlling air flow through the reflow module and a chamber housing encasing the reflow fixture within the compartment of the reflow oven. A reflow oven incorporating the reflow module may include a reflow fixture having a plurality of air tubes and at least one orifice fixture plate removably attached to the reflow fixture, wherein the at least one orifice fixture plate includes a plurality of orifices for directing airflow into the plurality of air tubes.

Abstract: The present invention relates to a high energy density beam welding system using molten metal droplet jetting. The present invention includes a beam emitting unit for emitting a high energy density beam onto a welded portion on a target object; and a molten metal droplet jetting unit for generating molten metal droplets to transfer or spray the molten metal droplets onto the welded portion on the target object, which follows a path of the beam emitting unit. Thus, it has advantages of widening a range of applications and enhancing the productivity and the quality in that a welding can be performed at a high junction efficiency even where a gap is wide, a loss in the high density energy beam is small, and heat distortions of the welded portion can be minimized.

Abstract: According to a metal joining method of the present invention, first and second dissimilar metals are joined together by interposing between the first and second metal materials a third metal material dissimilar to the first and second metal materials and causing eutectic melting at least either at an interface between the first and third metal materials or at an interface between the second and third metal materials.

Abstract: A flip-chip block structure with block bumps comprises a die, a substrate, a first block bump, and a second block bump. The die comprises an active side and a backside, a first die pad and a second die pad are disposed on the active surface, and an electrode layer is disposed on the backside. The first die pad and the second die pad are connected to the pattern side of the substrate via the first block bump and the second block bump respectively. Besides, the first block bump and the second block bump are formed by a wedge bonding method, therefore, the block bumps are more easily formed into larger sizes, which enhance electrical performance and thermal dissipation performance of the flip-chip structure due to a lower contact resistance and a larger contact area between the die and the substrate.

Abstract: In one exemplary embodiment, a high melting temperature fastening material may be prepared containing magnetic particles that is used to fasten two or more parts substrates together to form an integrated part.

Abstract: A wire is electrically connected to an electrical bonding pad of an integrated circuit chip and electronic device through an intermediate electrical interconnect block that is interposed between the electrical bonding pad and one end of the electrical lead wire.

Abstract: A package structure for an electronic device having an electronic device mounted on a substrate; the electronic device including an external electrode; the substrate including an interconnection and an electrode pad for mounting the electronic device thereon. Part or entire of the interconnection and part or entire of the electrode pad of the substrate are formed of the same material; and the external electrode of the electronic device is joined to the electrode pad of the substrate with a joining part which is the same material as the interconnection and the electrode pad.

Abstract: Lead-free solder is replenished to a solder bath to receive a work having copper, the work to be processed subsequent to a soldering process using an air knife or a die. The replenished lead-free solder includes Sn as a major composition and at least 0.01 to 0.5 mass percent Ni. By replenishing the lead-free solder having the above composition, the density of the solder bath, being sharply changed for using one of a HASL device and a die, is quickly restored back to within an appropriate range.

Abstract: A process by which molten solder is purified in-situ, making the soldering process more efficient and yielding better results, particularly for lead-free soldering. Lead-free solder becomes practical for use since the temperature for reliable soldering is reduced. A layer of active additive is maintained on the surface of molten solder for scavenging metal oxide from the solder and assimilating metal oxide into a liquid layer. The active additive is an organic liquid having nucleophilic and/or electrophilic groups. As an example, a layer of dimer acid maintained on a wave soldering apparatus scavenges metal oxide from the bath, and assimilates dross that may form on the surface. Scavenging metal oxide cleanses the bath and lowers viscosity of the solder, and PC boards or the like soldered on the wave have reliable solder joints.

Abstract: A composite includes a thermally conductive metal matrix and silicone particles dispersed therein. The composite can be used to form a thermal interface material in an electronic device. The composite can be used for both TIM1 and TIM2 applications.

Abstract: A device fabrication method, according to which a tin-copper-alloy layer is formed adjacent to a copper-plated pad or pin that is used to electrically connect the device to external wiring. Advantageously, the tin-copper-alloy layer inhibits copper dissolution during a solder reflow process because that layer is substantially insoluble in liquid Sn—Ag—Cu (tin-silver-copper) solder alloys under typical solder reflow conditions and therefore shields the copper plating from direct physical contact with the liquefied solder.

Abstract: Provided are a pasty composition for aluminum brazing which has excellent coating properties, is capable of attaining favorable dimensional accuracy of products obtained after brazing, causes less erosion, and allows favorable external appearances of brazed portions (fillets); an aluminum-containing member coated with the pasty composition for aluminum brazing; and a method, using the pasty composition for aluminum brazing, for brazing the aluminum-containing members. The pasty composition for aluminum brazing contains an aluminum-containing powder. In a case where on a cumulative grading curve of the aluminum-containing powder, a particle diameter D ?m which corresponds to a Q volume % is indicated as D(Q) ?m, D(50) ?m is greater than or equal to 20 ?m and less than or equal to 150 ?m; and D(90) ?m/D(10) ?m is less than or equal to 5. A mass percentage of particles, in the aluminum-containing powder, which pass through a screen mesh having an opening of 45 ?m is less than or equal to 50%.

Abstract: A method of making a braze preform includes: providing a mixture of a brazing alloy in metallic powder form and a binder; melting the binder and forming the mixture into a preform having a preselected shape; removing a majority of the binder from the preform; and heating the preform to remove the remainder of the binder and to sinter the metallic powder together. The preform may include a wear-resistant material therein. Such preforms may be used to form a braze joint between two metallic components, or to produce a metallic component with a wearcoated surface.

Abstract: A lead-free solder alloy suitable for use in flow soldering of electronic components to printed wiring boards comprises 0.1-3 wt % of Cu, 0.001-0.1 wt % of P, optionally 0.001-0.1 wt % of Ge, and a balance of Sn. The solder alloy may further contain at least one of Ag and Sb in a total amount of at most 4 wt %, and/or at least one of Ni, Co, Fe, Mn, Cr, and Mo in a total amount of at most 0.5 wt % in order to strengthen the alloy, and/or at least one of Bi, In, and Zn in a total amount of at most 5 wt % in order to lower the melting point of the alloy.

Abstract: The invention concerns a method to create fusion-integrated joints of workpieces, in which a workpiece area formed on a workpiece made from a TiAl alloy and a workpiece area formed on another workpiece made from a TiAl alloy or a different high temperature material are joined in a joint area using a joining additive, where the joining additive contains at least one of the elements gallium and indium. The invention also concerns a method to create a material deposit on a workpiece, in which a deposit material is applied to a workpiece area made from a TiAl alloy, where a fusion-integrated joint is produced between the deposit material and the workpiece area, where the deposit material contains at least one of the elements gallium and indium and a filler material.

Abstract: A small solder rod with a stop-off at the end in order to prevent the solder from dripping from an opening is provided. A process for applying solder to a hole in a substrate, wherein the solder is used in the form of a wire or a small rod is also provided.

Abstract: In one exemplary embodiment, a high melting temperature fastening material may be prepared containing magnetic particles that is used to fasten two or more parts substrates together to form an integrated part.

Abstract: A method of implementing an injection molded soldering process for three-dimensional structures, particularly, such as directed to three-dimensional semiconductor chip stacking. Also provide is an arrangement for implementing the injection molded soldering (IMS) process. Pursuant to an embodiment of the invention, the joining of the semiconductor chip layers with a substrate is implemented, rather than by means of currently known wire bond stacking, through the intermediary of columns of solder material formed by the IMS process, thereby providing electrical advantages imparted by the flip chip interconnect structures. In this connection, various diversely dimensioned solder column interconnects allow for simple and dependable connections to a substrate by a plurality of superimposed layers or stacked arrays of semiconductor components, such as semiconductor chips.

Abstract: The present invention provides a joining method for metal members, including: preparing an Fe-based metal member of Fe-based material, and an Al-based metal member of Al-based material; providing a Zn-based brazing filler metal between the Fe-based metal member and the Al-based metal member; and joining the Fe-based metal member and the Al-based metal member, wherein the Zn-based brazing filler metal includes: 2.0 mass % or less of Al; and the balance of Zn and inevitable impurities, and in the joining, the Zn-based brazing filler metal is heated such that a liquid phase of the Zn-based brazing filler metal is generated, and in solidification of the Zn-based brazing filler metal in a condition of the liquid phase, Zn primary crystal or eutectic of Zn and Al is crystallized.

Abstract: An assembly having a substrate and at least one component fastened thereon by sintering using a sintering agent, in particular sintering paste. The sintering agent is situated in a recess of the substrate that accommodates at least some areas of the component. A method for producing an assembly having a substrate and at least one component fastened thereon by sintering using a sintering agent, in particular sintering paste. The sintering agent is brought into a recess of the substrate that accommodates at least some areas of the component.

Abstract: A radiation-sensitive detector includes a first substrate 202 with first and second opposing sides. The first side detects incident radiation, and the first substrate 202 produces a signal indicative of the detected radiation. At least one electrical contact 204 is located on the first substrate 202. An electrically conductive material 214 is coupled to the at least one electrical contact 204. The electrically conductive material 214 has a melting point in a range of about seventy-two (72) degrees Celsius to about ninety-five (95) degrees Celsius.

Abstract: The present invention relates to a joint (10) that includes a first member (11) to be jointed, a second member (12) to be jointed and a jointing layer (13) located between the first member (11) and the second member (12). The jointing layer (13) is made of Sn metal and a metallic material with a melting point higher than the melting point of the Sn metal. The present invention relates also to a method of joining this first member (11) to the second member (12).

Abstract: A lead-free solder joint is formed between a tin-silver-copper solder alloy (SAC), SACX, or other commonly used Pb-free solder alloys, and a metallization layer of a substrate. Interaction of the SAC with the metallization layer forms an intermetallic compound (IMC) that binds the solder mass to the metallization layer. The IMC region is substantially free of any phosphorous-containing layers or regions.

Abstract: A method of soldering an electronic component includes; providing solder onto a printed circuit board electrode of a printed circuit board; placing the electronic component over the printed circuit board, the electronic component having a component electrode to be mounted on the printed circuit board electrode with a component-supporting member that melts with heat interposed therebetween; and heating the solder and the component-supporting member. The electronic component is supported on one side thereof by the component-supporting member and on the opposite side thereof directly by the printed circuit board.

Abstract: A welding process is provided. The welding process includes two steps. First, the welding material is applied over a large area of the substrate in the region without melting or partially melting the welding material. Then, a welding device is used to melt the applied welding material. In addition the welding material may be applied in two applications where the second application of the welding material is applied over a large area of the first application of molten and solidified welding material. Then, the second application of the welding material is melted.

Abstract: A system, method, and apparatus for injection molding conductive bonding material into a plurality of cavities in a surface are disclosed. The method comprises aligning a fill head with a surface. The mold includes a plurality of cavities. The method further includes placing the fill head in substantial contact with the surface. At least a first gas is channeled about a first region of the fill head. The at least first gas has a temperature above a melting point of conductive bonding material residing in a reservoir thereby maintaining the conductive bonding material in a molten state. The conductive bonding material is forced out of the fill head toward the surface. The conductive bonding material is provided into at least one cavity of the plurality of cavities contemporaneous with the at least one cavity being in proximity to the fill head.

Abstract: A system and method for injection molding conductive bonding material into a plurality of cavities in a non-rectangular mold is disclosed. The method comprises aligning a fill head with a non-rectangular mold. The non-rectangular mold includes a plurality of cavities. The fill head is placed in substantial contact with the non-rectangular mold. Rotational motion is provided to at least one of the non-rectangular mold and the fill head while the fill head is in substantial contact with the non-rectangular mold. Conductive bonding material is forced out of the fill head toward the non-rectangular mold. The conductive bonding material is provided into at least one cavity of the plurality of cavities contemporaneous with the at least one cavity being in proximity to the fill head.

Abstract: A method for producing a composite from at least two metal components that have perforations or openings, especially for producing a cooler or cooling elements or heat sinks that have at least one composite. The components are joined to each other to yield the composite by heating them to a process temperature while using a joining agent or joining surfaces defined by surface faces of the components. To produce components having complicated geometric shapes, thereby increasing their cooling capacity, at least a first component is not flat, and is joined to at least one flat or non-flat component to yield the composite.

Abstract: This method for producing a seal barrier for a micro component comprising a stack of two thin sealing layers involves forming a fusible interlayer between two sealing layers, said fusible interlayer having a melting temperature which is lower than that of the two sealing layers and melting said interlayer.

Abstract: A method for manufacturing a down hole cutting tool, wherein the cutting tool includes a cutting element support structure having at least one cutter pocket formed therein to support a cutting element comprising a substrate and an ultrahard layer, wherein the method includes inserting a base portion of the cutting element into the cutter pocket; locating a first braze alloy such that when heated the first braze alloy melts and fills a space in the cutter pocket between the cutting element and the cutting element support structure adjacent the ultrahard layer; locating a second braze alloy such that when heated the second braze alloy melts and fills a space in the cutter pocket between the cutting element and the cutting element support structure non-adjacent the ultrahard layer; and heating the first and second braze alloy such that they melt.