With Means To Handle Work Or Product Patents (Class 228/47.1)
  • Publication number: 20110265330
    Abstract: A datum is created in an axle housing. A finished brake flange is welded to the axle housing with reference to the datum to make an axle sub-assembly. The axle sub-assembly is fixed to a first part of a machine. A finished spindle is supplied to a second part of the machine. The spindle is welded to the axle sub-assembly with reference to the datum. A dial indexing table is rotated to a first position. An axle is placed on the dial indexing table with its longitudinal axis oriented vertically. The dial indexing table is rotated to a second position, wherein the axle aligned with a CNC machine. A machining operation is performed on the axle with the CNC machine. The dial indexing table is rotated to a third position. The axle is removed from the dial indexing table. An axle and an apparatus for manufacturing an axle are described.
    Type: Application
    Filed: April 30, 2010
    Publication date: November 3, 2011
    Inventors: Chris JOHNSTON, Robert TAVES
  • Patent number: 8047418
    Abstract: A soldering apparatus including a vessel containing a molten solder, a casing defining therewithin a soldering chamber in which a flat overflowing wave of the molten solder is formed, a conveyor physically integrated with the casing for movement therewith and operable for transferring a printed circuit board through the soldering chamber, actuators and for vertically moving the casing, inert gas feeders for feeding an inert gas to the soldering chamber, and a controller for controlling the operation of the actuators and, so that the printed circuit board is contacted with the surface of the flat overflowing wave in an atmosphere of the inert gas during its passage through the soldering chamber.
    Type: Grant
    Filed: December 8, 2006
    Date of Patent: November 1, 2011
    Assignees: Fujitsu Ten Limited, Sensbey Co., Ltd.
    Inventors: Nobuyuki Aoyama, Kenshi Ikedo, Akira Okuno, Masato Arita
  • Patent number: 8047419
    Abstract: A welding facility includes a main welding line for manufacturing an assembly of frame members, and a sub-welding line for manufacturing an assembly of panel members, the sub-welding line merging with the main welding line. The main welding line is comprised of a plurality of welding stages provided with a welding robot, the sub-welding line is provided at the end with a transfer mechanism for transferring the panel member assembly to the desired welding stage, and the merging parts are changeable according to the type of product to be welded. The facility permits a plurality of vehicle bodies having different vehicle types to be manufactured using the same manufacturing line.
    Type: Grant
    Filed: August 10, 2010
    Date of Patent: November 1, 2011
    Assignee: Honda Motor Co., Ltd.
    Inventors: Noritaka Sata, Masami Okada, Toshio Sugahara, Takeshi Arikawa, Hiroshi Nagano
  • Publication number: 20110215134
    Abstract: The present invention relates generally to a rotary die bonding apparatus (102) comprising a vertical motion linear actuator and a rotary motion actuator with a plurality of pick up heads (116) for transferring semiconductor die (122) from diced wafer to the lead frame for die bonding process, wherein said plurality of pick up heads (116) performs its assigned task such as pick (126), die bonding (132), inspection (128) and others simultaneously upon reaching its specific location and rotates to another location upon completion of each task to perform the next assigned task.
    Type: Application
    Filed: November 17, 2010
    Publication date: September 8, 2011
    Inventor: Ah Yoong SIM
  • Publication number: 20110210158
    Abstract: A method for brazing a metallic honeycomb body (1) for exhaust gas treatment, includes at least: a) pretreatment of a honeycomb body (1) at a temperature above 400° C.; b) cooling the honeycomb body (1); c) brazing the honeycomb body (1) at a temperature in a range of from 1050° C. to 1100° C. under atmospheric pressure; and d) cooling the honeycomb body (1). A suitable apparatus for carrying out the method is also provided.
    Type: Application
    Filed: March 17, 2011
    Publication date: September 1, 2011
    Applicant: EMITEC GESELLSCHAFT FUR EMISSIONSTECHNOLOGIE MGH
    Inventors: HANS-PETER CASPER, HUBERTUS KOTTHOFF, JÖRG GUTOWSKI, DIETMAR CHAUCHET, LUDWIG WIERES
  • Patent number: 8006891
    Abstract: A robotic welding cell includes a frame, a robot arm connected to the frame, a welding gun affixed to the robot arm, a welding table connected to the welding frame, and means to move the welding table in or about at least two mutually perpendicular axes. A welding table assembly for use in a robot welding cell is also disclosed.
    Type: Grant
    Filed: April 10, 2006
    Date of Patent: August 30, 2011
    Assignee: Lincoln Global, Inc.
    Inventor: David E. Osicki
  • Publication number: 20110168331
    Abstract: A weld stack includes a horn having a weld end, a polar mount adapted to receive a portion of the horn therein, a first adjustment ring coupled to the polar mount at a pre-determined distance from the weld end of the horn, and a second adjustment ring coupled to the polar mount adjacent the first adjustment ring, wherein the second adjustment ring includes a fine adjustment device for adjusting a relative position of the first adjustment ring and the second adjustment ring.
    Type: Application
    Filed: March 25, 2011
    Publication date: July 14, 2011
    Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC
    Inventors: Edgar M. Storm, Paul F. Spacher
  • Publication number: 20110127311
    Abstract: A system and method for friction stir welding of small diameter tubing, wherein the small diameter tubing is held in a correct position with a grasp sufficient to perform FSW when the tubing is comprised of high melting temperature materials, wherein the small diameter tubing can be rotated by the positioning and holding system while a FSW tool is held stationary, or vice versa, wherein internal mandrels are also described which can fit inside the smaller dimensions of the small diameter tubing and expand to provide a counter force to prevent deformation of the tubing when forces are applied by the FSW tool, wherein new FSW tool geometries are also described which enable the FSW tool to direct more heat on a tool/workpiece interface to counteract a lack of contact between the FSW shoulder and the workpiece because of tube curvature, and wherein the FSW tool is positioned on a small diameter tube by trailing the joint to provide desirable heating at the joint/workpiece interface and surface finishing.
    Type: Application
    Filed: November 2, 2010
    Publication date: June 2, 2011
    Inventors: Jeremy Peterson, John Hall, Russell J. Steel, Jonathan Babb, Matt Collier, Scott M. Packer
  • Patent number: 7952052
    Abstract: A welding torch maintenance center that uses a microcontroller to control the operation, to configure the maintenance center, to repeat the reaming process for excessive spatter deposit inside the nozzle, to spray the nozzle with anti-spatter fluid, to cut the welding wire, to provide a tool center point check signal, and to provide diagnostic information.
    Type: Grant
    Filed: May 26, 2004
    Date of Patent: May 31, 2011
    Assignee: Nasarc Technologies Inc.
    Inventors: Jody Rice, Naseem Kteily
  • Patent number: 7926694
    Abstract: The present invention refers to an apparatus and method that allows manufacturing of steel poles and honeycomb columns. It consists of placing previously cut strips of steel in vertical position with a set of top and bottom clamping devices to form a steel tapered pole. The strips of steel are welded together, to form a steel pole or honeycomb column, with a slideable welding device mounted on a ascending and descending moving welding platform. The moving welding platform moves to the top position, the top clamping device is liberated and the finished pole or honeycomb column is tilted 90 degrees to the front of the machine by a hydraulic cylinder that tilts the extraction platform. The finished pole or honeycomb column is positioned in the extraction bed and the bottom clamps release the pole.
    Type: Grant
    Filed: October 11, 2006
    Date of Patent: April 19, 2011
    Inventor: Enrique Franco
  • Patent number: 7926693
    Abstract: A receiving element which can be introduced into a borehole of at least one component includes a bolt presenting an outer surface that is approximately parallel and advantageously coaxial to a longitudinal axis of the bolt. The receiving element requires few materials and can therefore be produced at a low constructional cost while being provided with high dimensional stability and positioning accuracy. The bold includes an abrasion-resistant sintered material, and a metal tip provided on the front end of the shaft. The end part of the tip is engageable in a recess of the bolt, and there is a direct connection between the end part and the recess in the connection region on the front end of the bolt.
    Type: Grant
    Filed: July 20, 2010
    Date of Patent: April 19, 2011
    Assignee: Friatec Aktiengesellschaft
    Inventor: Peter Schramm
  • Publication number: 20110079629
    Abstract: A method of manufacturing a stacked-type semiconductor device, comprises: arranging a plurality of stacked chips obtained by stacking semiconductor chips on a plurality of stages on a support substrate; connecting a semiconductor chip of each stage in each stacked chip and the support substrate by wire while performing heating in units of stacked chips; performing plastic molding of each stacked chip; and separating the stacked chips from each other. An apparatus for manufacturing a stacked-type semiconductor device, comprising divided heater blocks formed under a support substrate on which a plurality of stacked chips obtained by stacking a plurality of semiconductor chips are arranged, the divided heater blocks being formed with respect to the stacked chips, and a heating device to selectively transmit heat to a stacked chip subjected to a wire bonding.
    Type: Application
    Filed: December 8, 2010
    Publication date: April 7, 2011
    Applicant: Kabushiki Kaisha Toshiba
    Inventor: Atsushi Yoshimura
  • Patent number: 7913894
    Abstract: A solder machine includes a top flat carrier that holds PWBs just above a solder bath. Opposed edges of the carrier are coupled to a frame and each edge can be independently raised or lowered by a respective piston. Also, the base of the frame can pivot along one of its edges to provide a second degree of freedom of motion to the top flat carrier in dipping the PWBs relative to the solder bath, thereby providing a solder machine with a relatively small footprint that nonetheless can achieve precise soldering of PWBs.
    Type: Grant
    Filed: September 10, 2009
    Date of Patent: March 29, 2011
    Assignees: Sony Corporation, Sony Electronics Inc.
    Inventors: Esteban Arturo Alvarez Serrano, Julián Martinez Fonseca, Horman Armando Millán Sánchez
  • Publication number: 20110031298
    Abstract: Adjustable, elongate, beam-offset jig structure for assisting, under manual, or appropriate computer, control, in welding a pair of beam-end, column-interface components to the opposite ends of an elongate beam. The jig structure includes spaced, adjustable head-stock and tail-stock structures, each capable of holding such a component adjacent a beam end for adjustment to an infinite number of different, pre-weld angular-offset dispositions relative to such a beam end in order to accommodate planned horizontal and vertical beam offsets which will be encountered when such beams are installed in a building frame. A computer-controlled, robotic welder may be provided adjacent each end of the jig structure to implement appropriate welding when any and all offset angles have been jig-established.
    Type: Application
    Filed: October 15, 2010
    Publication date: February 10, 2011
    Applicant: ConXtech, Inc.
    Inventor: Robert J. Simmons
  • Publication number: 20100219568
    Abstract: The invention relates to an installation for soldering or for heat-treating workpieces (1) under a protective gas atmosphere, comprising a workpiece transportation apparatus (2), comprising an entrance (3) into the installation and an exit (4) out of the installation, comprising a combustion-gas or heating-gas stream (B) which is conducted separately from the protective-gas stream (S) and brings the protective-gas stream (S) to operating temperature, and comprising an insulating means (5) which surrounds the installation. A considerable amount of energy is saved in that, according to the invention, the combustion-gas or heating-gas stream (B) and the protective-gas stream (S) have approximately corresponding heat capacities and can be conducted through the installation in counterflow. The invention also proposes a process which is favourable in terms of energy.
    Type: Application
    Filed: July 9, 2008
    Publication date: September 2, 2010
    Inventor: Frank Opferkuch
  • Publication number: 20100176183
    Abstract: The present invention relates to a guiding device (40) configured to guide equipment units for joining pipe sections which are arranged in a substantially upright position. The guiding device comprises a stationary body (41), one or more movable carriers being movably supported on said stationary body and configured to revolve one or more equipment units about a pipe section, a pipeline engagement device (63) configured to engage said guiding device with said pipe section and to support said stationary body, and one or more adjustable supports (44), said one or more adjustable supports being configured to make adjustment possible of a working plane of one or more equipment units (47, 48, 49) mounted on or to be mounted on said one or more carriers with respect to a pipe section on which the guiding device is mounted.
    Type: Application
    Filed: September 4, 2006
    Publication date: July 15, 2010
    Applicant: HEEREMA MARINE CONTRACTORS NEDERLAND B.V.
    Inventor: Stefan Willem Hees
  • Publication number: 20100170939
    Abstract: A joining method includes melting a hot melt joining material provided between a board and a component to be joined to the board; and reducing the pressure of the ambient atmosphere of the hot melt joining material and tilting the board while the hot melt joining material is in a molten state.
    Type: Application
    Filed: December 21, 2009
    Publication date: July 8, 2010
    Applicant: FUJITSU LIMITED
    Inventor: Tetsuji ISHIKAWA
  • Patent number: 7735709
    Abstract: A method and apparatus for joining pipe sections (102, 104) together to form an underwater pipeline. The pipe sections (102, 104) are in an abutting position and have a generally vertical orientation. The apparatus comprises at least two welding equipment carriers (148, 152) and at least two welding heads (110, 112). Each welding head is connected to an equipment carrier (148, 152) by means of at least one umbilical (130, 132). The apparatus further comprises a welding head guide assembly (113) which is adapted to be fixed to one of said upper of lower pipe sections. The welding head guide assembly (113) guides the welding heads about the pipe sections (102, 104). The apparatus further comprises a guiding device (133) which guides the welding equipment carriers (148, 152) around said welding area (115). The welding equipment carriers (148, 152) are movable independently from one another.
    Type: Grant
    Filed: March 28, 2003
    Date of Patent: June 15, 2010
    Assignee: Heerema Marine Contractors Nederland B.V.
    Inventors: Frits-Jan Koppert, Cornelis van Zandwijk
  • Publication number: 20100102106
    Abstract: A weld enclosure (15) and welding apparatus (10) including a weld enclosure (15). Also a method of welding. The apparatus (10) has first (12) and second (14) opposed tooling faces adapted to receive and hold respective first (16) and second (18) weld elements. The weld enclosure (15) comprises a housing (22, 24a, 24b) that allows relative movement between the weld elements (16, 18) and a change in a physical dimension of at least one of the weld elements (16, 18). The weld enclosure (15) also comprises locating means for locating the housing (22, 24a, 24b) relative to the welding apparatus and includes heating means (20).
    Type: Application
    Filed: May 23, 2008
    Publication date: April 29, 2010
    Applicant: ROLLS-ROYCE PLC
    Inventors: Simon E. Bray, Tony J. Sweeting
  • Publication number: 20100051671
    Abstract: A device for mounting an array of solder balls to a plurality of substrates of integrated circuits, comprising: a first plate for receiving a first substrate in a loading position; said first plate adapted to translate laterally from a substrate loading position to a flux receiving position; said first plate further adapted to rotate 180° from the substrate loading position to a such that the first plate is in a solder ball receiving position, and; mounting solder balls to the first plate.
    Type: Application
    Filed: November 22, 2007
    Publication date: March 4, 2010
    Inventors: Nee Seng Ling, Soo Loo Ang, Ter Siang Pai
  • Patent number: 7648056
    Abstract: A solder machine uses various linear actuators to move a PWB carrier in three degrees of freedom relative to a solder bath, to facilitate safe loading and unloading of PWBs onto the carrier while the carrier is distanced from the bath, and then to move the carrier over the bath, lower it, and tilt it as necessary to effect soldering.
    Type: Grant
    Filed: July 3, 2008
    Date of Patent: January 19, 2010
    Assignees: Sony Corporation, Sony Electronics Inc.
    Inventors: Esteban Arturo Alvarez Serrano, Horman Armando Millán Sánchez
  • Publication number: 20100001046
    Abstract: A solder machine uses various linear actuators to move a PWB carrier in three degrees of freedom relative to a solder bath, to facilitate safe loading and unloading of PWBs onto the carrier while the carrier is distanced from the bath, and then to move the carrier over the bath, lower it, and tilt it as necessary to effect soldering.
    Type: Application
    Filed: July 3, 2008
    Publication date: January 7, 2010
    Inventors: Esteban Arturo Alvarez Serrano, Horman Armando Millan Sanchez
  • Publication number: 20090308911
    Abstract: A bonding tool for bonding a fine wire to a substrate, said bonding tool comprising an at least substantially cylindrical portion having a concentric capillary therein through which the fine wire runs; a working tip portion formed at an end of the cylindrical portion being tapered towards the tip thereof, said working tip portion having an annular chamfer at the tip thereof; wherein the concentric capillary opens into the annular chamfer of the working tip, and wherein the diameter of the cylindrical portion decreases consecutively at a plurality of discrete intervals along the length of the cylindrical portion towards the working tip portion.
    Type: Application
    Filed: August 25, 2009
    Publication date: December 17, 2009
    Applicant: SMALL PRECISION TOOLS INC.
    Inventors: Jaime Castaneda, Kay Soon Goh
  • Patent number: 7631796
    Abstract: A solder machine includes a top flat carrier that holds PWBs just above a solder bath. Opposed edges of the carrier are coupled to a frame and each edge can be independently raised or lowered by a respective piston. Also, the base of the frame can pivot along one of its edges to provide a second degree of freedom of motion to the top flat carrier in dipping the PWBs relative to the solder bath, thereby providing a solder machine with a relatively small footprint that nonetheless can achieve precise soldering of PWBs.
    Type: Grant
    Filed: December 4, 2007
    Date of Patent: December 15, 2009
    Assignees: Sony Corporation, Sony Electronics Inc.
    Inventors: Esteban Arturo Alvarez Serrano, Julian Martinez Fonseca, Hozman Armando Millán Sánchez
  • Publication number: 20090275174
    Abstract: A soldering container configured to be conveyed by a conveyance mechanism during soldering in a state accommodating a soldering subject. The container includes a sealable container body for accommodating the soldering subject. The container body includes at least one communication passage enabling communication between the inside and outside of the container body. The container body is configured to be connectable to an atmospheric adjustment device for adjusting an internal atmosphere of the container body through the communication passage.
    Type: Application
    Filed: December 22, 2006
    Publication date: November 5, 2009
    Inventor: Masahiko Kimbara
  • Publication number: 20090269889
    Abstract: An apparatus for manufacturing a semiconductor package includes an index rail transferring a lead frame in forward and backward directions, the lead frame having a first surface and a second surface that is opposite to the first surface, a loader portion connected to an end portion of the index rail and supplying the lead frame to the index rail, a frame driving portion connected to the opposite end portion of the end portion of the index rail and rotating the lead frame around a normal to the first surface, and a wire bonding portion electrically connecting the lead frame and a semiconductor chip attached to the lead frame supplied to the index rail using a wire bond.
    Type: Application
    Filed: February 26, 2009
    Publication date: October 29, 2009
    Applicant: STS SEMICONDUCTOR & TELECOMMUNICATIONS CO., LTD.
    Inventor: Sun Ha HWANG
  • Publication number: 20090212090
    Abstract: The invention relates to an industrial welding system with a tool table, which has at least one tool holder for fixing workpieces that are to be welded. According to the invention, the tool holder is placed on a rotating frame that is mounted in a manner that enables it to rotate about a rotation axis that is parallel to a table base area of the tool table. The invention serves to weld plastic parts for the automotive industry.
    Type: Application
    Filed: March 25, 2006
    Publication date: August 27, 2009
    Inventors: Franz Hepp, Tobias Schuler, Thomas Schedding
  • Patent number: 7544912
    Abstract: A plurality of attachments having springs hold the outer plate of a fuel tank, and an inner jig positions the inner plate. The attachments are attached to clamp arms which are opened/closed by cylinders. When the overlap portion between the outer and inner plates is welded, the thermal deformation caused by welding is accommodated by the springs. The attachments are spaced from the fuel tank in the order in which the welding point is approached.
    Type: Grant
    Filed: August 13, 2003
    Date of Patent: June 9, 2009
    Assignee: Honda Giken Kogyo Kabushiki Kaisha
    Inventors: Naoji Yamaoka, Yoshimasa Iwaguchi, Takashi Shimada, Setsuo Arai, Toshio Ishii
  • Publication number: 20090134202
    Abstract: Provided are a reflow apparatus and method. The reflow apparatus includes a loader unit, a heating unit, an unloader unit, and a moving unit. The loader unit has an input module and an input stacker. Processing objects are stored in vertical stacks in magazines, and a plurality of magazines is stored in the input stacker. The magazines stored in the input stacker are moved to the input module and are introduced into the heating unit by the moving unit. Solder balls provided on the processing objects within the heating unit are quickly processed using an induction heating method. The processing objects that have undergone a reflow process are loaded in a magazine on an output module of the unloader unit and are then stored in an output stacker.
    Type: Application
    Filed: November 26, 2008
    Publication date: May 28, 2009
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Min-Ill KIM, Il-Young HAN, Ki-Kwon JEONG
  • Publication number: 20090095794
    Abstract: The present invention relates to a welding system. The welding system comprises: a fixing jig for securely fixing any one of a plurality of to-be-welded objects; a movable jig for moving another of the plurality of to-be-welded objects a movable block for horizontally moving the movable jig; a block driving mechanism for driving the movable block; a position sensor for detecting the position of the movable jig; and a control device for receiving position data from the position sensor to control the block driving mechanism. According to a welding system of the present invention, it is possible sequentially identify the positions of the to-be-welded objects after the melting and shrinkage thereof using a position sensor and determine an optimal welding position of the to-be-welded objects during the welding to thereby realize an optimal finished product.
    Type: Application
    Filed: December 31, 2007
    Publication date: April 16, 2009
    Applicant: Hyundai Motor Company
    Inventor: Jong Cheol Kim
  • Publication number: 20080302857
    Abstract: A wire clamp for a wire bonder comprises a first arm and a second arm, which is mounted on the first arm so that it is rotatable around a predetermined axis. The first arm and the second arm each have a clamping jaw on an end distal from the axis. The wire clamp also comprises a piezo bending element for opening and closing the wire clamp. One end of the piezo bending element is fastened to the second arm and an opposite end of the piezo bending element bears in a retainer fastened to the first arm.
    Type: Application
    Filed: June 5, 2008
    Publication date: December 11, 2008
    Applicant: OERLIKON ASSEMBLY EQUIPMENT AG, STEINHAUSEN
    Inventor: Armin Felber
  • Publication number: 20080289503
    Abstract: A method and a device produce a fleece of metallic fibers in a layer in which the metallic fibers are welded to one another to form the fleece. A welding process is repeatedly carried out with regard to a portion or section of the fleece. Such metallic fiber fleeces are used, in particular, for exhaust gas treatment units in the automobile industry.
    Type: Application
    Filed: November 19, 2007
    Publication date: November 27, 2008
    Applicant: EMITEC GESELLSCHAFT FUR EMISSIONSTECHNOLOGIE MBH
    Inventors: Rolf Bruck, Gottfried Wilhelm Haesemann
  • Patent number: 7398910
    Abstract: A mechanical weldable fitting for use in tapping a pipe includes a first and second metal collar, each formed of attachable upper and lower semi-toroidal portions that when assembled on the pipe providing spaced-apart external cylindrical surfaces. Each collar having at least one internal circumferential sealing groove therein that receives a gasket formed about the pipe. A lower semi-tubular metal containment member is positioned on the external cylindrical surfaces of the collars. An upper semi-tubular metal containment member is positioned on the external cylindrical surfaces of the collars. The upper containment member having an integral upwardly extending tubular access portion affording passage for tapping the pipe. The upper and lower containment members are welded to each other and to the collars to fully encompass a portion of the pipe.
    Type: Grant
    Filed: March 14, 2007
    Date of Patent: July 15, 2008
    Assignee: TDW Delaware, Inc.
    Inventors: Tony R. Garrison, Larry J. Oden, James E. Terry, Dixit B. Kadakia
  • Publication number: 20080156850
    Abstract: A tooling fixture is adapted to preserve the dimensional accuracy of critical dimension locating components associated with the fixture. The tooling fixture has a plurality of component locators having a body with at least one surface for accurately constraining at least one component part within the tooling fixture. The surfaces of the component locators are exposed to weld spatter. A spatter resistant coating is applied to the surfaces of the component locators to protect their surfaces from accumulating weld spatter thereby preserving the dimensional repeatability of the tooling fixture and decreasing rework or scrap quantities resulting from the component parts being out of specification.
    Type: Application
    Filed: January 2, 2007
    Publication date: July 3, 2008
    Applicant: GENESIS SYSTEMS GROUP, L.L.C.
    Inventors: GARY ALDEN, PATRICK W. POLLOCK, Don STABENOW
  • Publication number: 20080142568
    Abstract: Provided is a plaque and its method of manufacture, the plaque including a binding material and a reinforcing material that is molded into a controlled thickness. Also provided is a solder pallet utilizing the plaque in its manufacture. The plaque can be manufactured by forming a preform of the raw materials, optionally preheating the preform, molding the preform into a plaque of the desired thickness, and then cooling the plaque at an elevated temperature to maintain the flatness of the plaque without the need for sanding or otherwise machining the plaque to the desired size. The plaque can then be formed into the desired solder pallet by cutting the plaque to appropriate dimensions, if necessary, and adding holes and/or clips for use in a soldering process for soldering circuit boards, for example.
    Type: Application
    Filed: November 30, 2007
    Publication date: June 19, 2008
    Applicant: Electrolock, Inc.
    Inventor: Richard A. Reed
  • Publication number: 20080041919
    Abstract: A welding system includes a resistance type or other type welder with a support member and a tool for holding a work piece supported on the supported member. The support member and tool are configured to provide a substantially gaseous fluid bearing between the support member and the tooling to allow the tooling to be moved relative to the support member. When the bearing is not provided, the tooling is supported on the support member so that an electrical current pathway is provided between the tooling and the support member.
    Type: Application
    Filed: August 15, 2006
    Publication date: February 21, 2008
    Inventor: George J. Daumeyer
  • Patent number: 7331439
    Abstract: A manufacturing plant (1) is provided for vehicle body parts (2, 3). The manufacturing plant includes a number of processing stations (4, 5, 6, 7, 8, 9, 10), which are situated one behind the other along a transfer line (22), and of a number of multiaxial robots (18, 19). In at least one processing station (4, 5, 6, 7, 8, 9, 10), one or more handling robots (18) for transporting parts is/are arranged on at least one axis of travel (20, 21). Next to the handling robot (18), one or more processing robots (19) is/are displaceably arranged on the same axis of travel (20). Working locations (11, 12) are arranged on both sides of a common axis of travel (20), whereby another common axis of travel can be provided on the rear side of the working locations.
    Type: Grant
    Filed: December 23, 2003
    Date of Patent: February 19, 2008
    Assignee: KUKA Schweissanlagen GmbH
    Inventors: Michael Degain, Robert Long, Hans Moser
  • Patent number: 7322510
    Abstract: A machining system and unit, especially a welding cell, is provided for use for the machining of workpieces (2), especially body parts of vehicles. The machining system has one or more machining stations (15, 16) with robots (18, 19, 20) and at least one rotation or turning station (5), which has at least two work stations (6, 7) for carrying out different operations simultaneously. The turning station (5) has at least two said multiaxially movable turning units (8, 9) arranged next to one another with said gripping tools (11, 12, 13). The working areas (10) intersect each other at the work stations (6, 7).
    Type: Grant
    Filed: July 23, 2003
    Date of Patent: January 29, 2008
    Assignee: KUKA Systems GmbH
    Inventor: Gerhard Kraus
  • Patent number: 7312541
    Abstract: In an actuator of a bonding apparatus, a rotating body 16 that has a bonding head is rotatably supported on a supporting carrier having the same shape as magnetic path members 32L and 32R, and coil portions 40 and 42 are disposed on both outer sides of this supporting carrier. Rectilinear magnetic fields created by the coil portions 40 and 42 and a circumferential magnetic field created by permanent magnets of the rotating body 16 act cooperatively via magnetic path members 32L and 32R in which a plurality of magnetic paths are formed, so that the rotating body 16 makes a movement combining rotation and a linear movement along the Y axis in accordance with the respective driving of the coil portions 40 and 42. The rotating body 16 is movable along the X and Y axes by the shape of the magnetic paths of the magnetic path members.
    Type: Grant
    Filed: January 27, 2005
    Date of Patent: December 25, 2007
    Assignee: Kabushiki Kaisha Shinkawa
    Inventor: Manabu Haraguchi
  • Patent number: 7303111
    Abstract: A bondhead assembly having a bond body for mounting a bonding tool, a support structure that is configured to be drivable for moving the bondhead assembly to different locations and flexural elements arranged substantially along at least one plane which couple the bond body to the support structure for flexibly supporting the bond body during movement with respect to the support structure. A motor is coupled to the support structure and it is operative to drive the bond body to move relative to the support structure along an axis extending substantially perpendicular to the at least one plane.
    Type: Grant
    Filed: October 14, 2005
    Date of Patent: December 4, 2007
    Assignee: ASM Technology Singapore Pte. Ltd.
    Inventors: Ajit Gaunekar, Gary Peter Widdowson
  • Patent number: 7303109
    Abstract: The invention provides an apparatus and a method for forming conductive bumps on a plurality of semiconductor devices with an oxidizable material. The apparatus comprises a bump forming device, a chamber system adapted to house the semiconductor devices and a gas supply for supplying an inert gas into the chamber system. A support table is provided for supporting the semiconductor devices during bumping, and the said support table is operative to move the semiconductor devices from a bumping site into the chamber system after bumping.
    Type: Grant
    Filed: July 1, 2003
    Date of Patent: December 4, 2007
    Assignee: ASM Technology Singapore Pte Ltd.
    Inventors: Ka Shing Kwan, Guoshen Hu, Tingyu He, Yie Mi, Yam Mo Wong
  • Publication number: 20070272723
    Abstract: A vibration welding apparatus and a method for executing vibration welding of three or more work pieces made of a thermoplastic material to make them integral in a sandwich shape, comprises an upper tool means supporting a first work piece so as to apply a lateral motion to it by a vibration means, a lower tool means capable of supporting a plurality of second work pieces to be welded to at least both surfaces of the first work piece, and a means capable of actuating the lower tool means in such a manner as to move the second work pieces vertically by an elevating means so as to align with the first work piece, and move the second work pieces toward the first work piece laterally by a slide actuating means so as to bring them into contact with the first work piece.
    Type: Application
    Filed: May 25, 2006
    Publication date: November 29, 2007
    Applicant: BRANSON ULTRASONICS CORP.
    Inventors: Masataka Kimura, Daisuke Sengoku
  • Patent number: 7293687
    Abstract: An apparatus (1) for manufacturing tubes made from thin-walled material, especially made from sheet metal, with a welding machine for longitudinal-seam welding, as well as with a clamping device (2), which has clamping jaws, which are arranged on opposite sides of the tube blank (3) and which can be pressed against the tube blank (3) for holding a tubular, preformed blank in the welding position. The clamping jaws (4) each have a stack of pressure plates (5), which contact each other on the flat sides thereof, and which contact the tube blank (3) on the narrow sides thereof in a contact region (6), and which can be pressed against the tube blank (3). The plate stacks are adapted to the outer contours of the tube blank (3) in the contact region (6). Through the use of the apparatus according to the invention, a uniform and uniformly load-bearing weld seam can be achieved, even for contoured tubes, which have outer diameters that vary along the course of their longitudinal extent.
    Type: Grant
    Filed: August 10, 2005
    Date of Patent: November 13, 2007
    Assignee: Weil Engineering GmbH
    Inventors: Wolfgang Weil, Walther Lacher
  • Patent number: 7255259
    Abstract: A wire feed sensor guide, used in fabrication of semiconductor packages, guides a wire W from a wire source to a wire bonding location. The wire feed sensor guide has a unitary slider 1 that can be manually slid into and out of a fixed portion (2 or 2/3). Slider 1 has a slot SL that guides wire W, and includes a hole S for a sensor wire SW (such as optical fiber) that senses the position of wire W within the slot. Slider 1 also includes an air tube hole A that transmits air to urge wire W from a first position W1 toward a second position W2 during a wire bonding cycle. Advantageously, the unitary nature of the slider (including its air tube hole A and sensor wire hole S) ensure that the air blowing and wire position sensing processes do not require manual adjustment. Moreover, the end of the sensor wire is substantially protected from contamination by being substantially enclosed in the slider 1 and exposed only inside slot SL, thus increasing reliability.
    Type: Grant
    Filed: September 4, 2004
    Date of Patent: August 14, 2007
    Assignee: Texas Instruments Incorporated
    Inventor: Radhakrishnan Menon
  • Patent number: 7229000
    Abstract: An adjustable frame fixture aims to hold a printed-circuit board (PCB) to pass over a tin oven to process wave soldering. The fixture includes at least two side frames and at least two fasteners. The two side frames are coupled to form a holding dock. The positions of the two neighboring side frames are adjustable to form an area of different sizes to hold the PCB of different sizes. After the positions of the side frames have been adjusted, the fasteners are used to anchor and couple the side frames.
    Type: Grant
    Filed: August 25, 2004
    Date of Patent: June 12, 2007
    Assignee: ASUSTeK Computer Inc.
    Inventors: Peng-Wei Wang, Chun-Hsiung Chiu
  • Patent number: 7172105
    Abstract: A counterweight assembly is especially adapted for mounting to a spinner tool allowing a workpiece to be balanced when rotated during welding or other operations. The counterweight assembly has an adjustable counterweight to provide a necessary amount of counterbalance force depending upon the particular size and configuration of the workpiece. The spinner tool is adapted to secure various diameters of pipe as well as pipe flanges. The spinner tool can be mounted within a portable vise that can be used directly at a work site.
    Type: Grant
    Filed: April 1, 2004
    Date of Patent: February 6, 2007
    Assignee: Amaesing Tools Mfg. Inc.
    Inventor: Roger V. Maes
  • Patent number: 7129446
    Abstract: A device is provided to heat the whole heated surface of a carried member carried intermittently with a temperature change over time maintained constant. The device controls the driving of a belt-conveyer so that a heater moves in a carrying direction at a carry time movement velocity that is slower than the carry velocity of a TAB tape if the TAB tape is in a carried state. On the other hand, the heater moves in an opposite carrying direction at a carry standby time movement velocity derived from the difference between the carry velocity and the carry time movement velocity if the TAB tape is in a carry standby state.
    Type: Grant
    Filed: April 21, 2004
    Date of Patent: October 31, 2006
    Assignee: Seiko Epson Corporation
    Inventor: Norio Imaoka
  • Patent number: 7051918
    Abstract: A method utilizing a stabilizing jig structure for positioning and supporting the assembly of an elongate structural beam and a beam-end mounting component during weld attachment of that mounting component to an end of the beam. This method includes the steps of (a) applying, through a positionally shiftable first biasing element, a first yieldable biasing force which urges the beam-end mounting component relatively toward the associated beam end, and (b) applying, through a positionally shiftable second biasing element, a second yieldable biasing force which urges the beam-end mounting component relatively toward the first biasing element.
    Type: Grant
    Filed: July 31, 2005
    Date of Patent: May 30, 2006
    Inventor: Robert J. Simmons
  • Patent number: 6976616
    Abstract: By photographing pad forming faces of CSPs 400 to recognize a pad arrangement through image processing so as to transfer and position the CSPs 400 in accordance with the recognition result of the pad arrangement, even if pads 401 are formed in any arrangement state in the CSPs 400 to be transferred, the positional relation between the pads 401 included in the CSPs 400 is made to always accurately coincide with the positional region between a plurality of solder ball attracting nozzles of a solder ball mounting apparatus.
    Type: Grant
    Filed: August 10, 2004
    Date of Patent: December 20, 2005
    Assignee: Niigata Seimitsu Co., Ltd.
    Inventors: Akihiro Mano, Yukihiro Ueno, Hironori Urasawa, Akihiro Tanaka
  • Patent number: 6921011
    Abstract: The invention relates to a work piece holder with top mounted robot which optimizes floor space for a work piece positioner and a robot. In general, the work piece positioner assembly and the top mounted robot is supported on a base frame. Attached to the base frame, is a first superstructure and a second superstructure which supports a work piece positioner and the top mounted robot. Above the first superstructure and second superstructure is a frame structure fixed in the unitary assembly to the first superstructure and the second superstructure. Attached to the frame structure is a robot stand and a robot. Due to the unique shape of the work piece holder with top mounted robot, the floor space of the combined robot and work piece positioner is significantly reduced, and the overall cost of the system is reduced.
    Type: Grant
    Filed: December 10, 2002
    Date of Patent: July 26, 2005
    Assignee: GSG, LLC
    Inventors: Jan C. Mangelsen, Jason J. Kelsick, John P. Christen