Abstract: In an electronic component mounting method in which electronic components are sucked/held by plural respective nozzles provided on a mounting head so as to be mounted on electronic component mounting portions of a board, such a mounting operation is sequentially carried out as to all of the electronic components, in which the electronic components are sucked/held by the plural nozzles; an electronic component sucked/held by one of the plural nozzles is provisionally positioned above one electronic component mounting portion; both this electronic component and the electronic component mounting portion are observed by an observation head which is located between the board and the mounting head; a relative position detecting operation for detecting a relative positional relationship between this electronic component and the electronic component mounting portion is carried out as to all of the electronic components held by the mounting head; and the electronic component is positioned with respect to the electroni

Abstract: A method of making a microelectronic assembly buying restraining a substrate in a fixture at room temperature, placing a flip chip on the substrate so that conductive bumps on the flip chip are aligned with contact pads on the substrate, heating the flip chip, the substrate and the fixture to reflow the conductive bumps on the flip chip, cooling the flip chip, substrate and fixture to solidify the conductive bumps and to mount the flip chip to the substrate, depositing an underfill between the flip chip and the substrate, curing the underfill by heating the flip chip, substrate, underfill and fixture to an elevated temperature, and removing the flip chip mounted substrate from the fixture.

Abstract: A mask (stencil) having cells (openings) is disposed on a surface of a heater stage, and is then filled (printed) with solder paste. Then a substrate is assembled to the opposite side of the mask. Then the solder paste is reflowed. This may be done partially inverted. Then the mask is separated from the substrate, either before or after cooling. Solder balls are thus formed on the substrate, which may be a semiconductor wafer. A biased chuck urges the substrate into intimate contact with the mask. A method for printing the mask with solder paste is described. Methods of forming high aspect ratio solder bumps (including balls and reflowable interconnect structures) are described.

Abstract: By photographing pad forming faces of CSPs 400 to recognize a pad arrangement through image processing so as to transfer and position the CSPs 400 in accordance with the recognition result of the pad arrangement, even if pads 401 are formed in any arrangement state in the CSPs 400 to be transferred, the positional relation between the pads 401 included in the CSPs 400 is made to always accurately coincide with the positional region between a plurality of solder ball attracting nozzles of a solder ball mounting apparatus.

Abstract: A tooling frame with an ability to adhere to tin is disclosed, which is a frame structure used to support a circuit board passing through a stannic furnace to be soldered. The tooling frame is characterized in that a tin adhesive apparatus having a tin adhesive material is mounted at an appropriate location of the tooling frame so as to suck surplus tin on said circuit board both after the circuit board is transported through the stannic furnace for tin filling and during tin shedding and to improve quality of soldering.

Abstract: A supporting tray for moving a PCB (10) in a wave solder machine includes a frame (30) and a circular plate (20). The frame includes a circular opening (33) defined thereof and a graduated scale (31) marked thereon around the circular opening. The circular plate includes a recessed portion (23). Two aligned pointers (21) are marked at two opposite outer sides of the recessed portion. In assembly, the PCB is fixedly received in the recessed portion of the circular plate. The combined PCB and circular plate is then rotatably received in the circular opening of the frame. Then the assembled PCB and the supporting tray are transported to a wave solder machine. The angle of the PCB with respect to a direction of flow of solder waves can be adjusted with an indication of the pointers and the scale. Consequently the optimal angle can be efficiently and accurately ascertained.

Abstract: A brazing fixture for fabricating a feed-through assembly during a brazing process and a method for forming a brazing fixture are provided. The brazing fixture includes a holding tray and a nesting plate removably mounted on the holding tray. The nesting plate has a surface with at least one nest disposed at the surface. The nest has a first well disposed at the surface of the nesting plate, the first well having first walls. A second well is disposed adjacent to and in concentric relationship with the first well, the second well having second walls. An orifice is disposed adjacent to the second well, the orifice having third walls. A release coating overlies the first walls of the first well and is absent from the third walls of the orifice.

Abstract: An apparatus for applying solder balls to a substrate and for remelting the solder balls on soldering points of the substrate has a capillary for supplying a solder ball to the soldering points and for placing the solder ball at the free end of the capillary opposite the soldering point, a means for supplying heat to the solder ball to remelt it, and a pressing apparatus for holding down the substrate to prevent the substrate from being resilient when placing and remelting the solder ball.

Abstract: A planting device for planting solder balls onto a chip includes a main board with a plurality of apertures for accommodating solder balls, and a fixture for fixing the chip under the main board. The chip is coated with a layer of adhesive for adhering the solder balls accommodated inside the apertures onto the chip.

Abstract: A wire bonder (900) with a rigid pedestal (902) having resilient inserts (920). A package (904) placed on the pedestal (902) contains an electrical device (906). The bond pads on the electrical device (906) are electrically connected to bond pads on the package (904) by a series of bond wires (908) through use of a well know bonding process. A vacuum source holds the package (904) against the pedestal (902) deforming the resilient strips (920) located in the rigid member (902) of the pedestal and ensuring good contact between the ground pads of the package (904) and conductive resilient members (920). The resilient members (920) are conductive and electrically connect the package grounds to a system ground (922).

Abstract: A low shock work transport system for moving workpieces into a pressure vessel without significant vibrations or mechanical shocks. The pressure vessel has two opposing ends with a sealable port in each of the opposing ends. A vessel rail is contained entirely within the pressure vessel with the two ends of the rail adjacent the ends of the pressure vessel. A movable rail is adjacent each end of the pressure vessel. Each movable rail is movable between a first position in which one end of the movable rail is within the pressure vessel and contiguous with the adjacent end of the vessel rail, and a second position in which the one end of the movable rail is outside the pressure vessel such that the sealable ports can be sealed. The workpieces are moved by sliding them over the upper surfaces of the rails.

Abstract: A method for making a bonding tool is provided. The bonding tool includes a three dimensional surface configuration which is a mirror image of a three dimensional surface configuration of a circuit card assembly (CCA). The method includes creating a mirror image of the three dimensional surface configuration of the CCA. After producing the three dimensional surface configuration of the CCA, the method then produces a bonding tool surface with the mirror image of the three dimensional surface configuration. The mirror image of the three dimensional surface configuration isolates delicate components of the CCA during bonding and re-bonding operations of the CCA using the bonding tool.

Abstract: A method and apparatus for soldering terminal ends of an antenna embedded in a plastic smart card to contact terminals of an IC module disposed on the card are shown. The enamel coated antenna terminal ends are pre-coated with solder with a heater having horizontal opening with melted solder retained therein. The solder pre-coated terminal ends are maintained in a secured contact with the terminal contacts of the IC module by heating coils mounted at a free front end of two pivotal elongated cantilever arms. A piece of predetermined amount of solder is dropped into the cavity of each heating coil, and the heating coils are actuated with a low electrical current to generate a concentrated intense heat to melt the piece of solder to form secure permanent solder joints between the terminal ends of the antenna to the contact terminals of the IC module.

Abstract: In a substrate holder for holding a circuit board onto which a viscous material for bonding electronic components is printed by means of a squeegee through a screen mask, a first holding area for holding the screen mask and a second holding area for holding the circuit board are provided on a base surface. The squeegee is supported by at least one of the first holding area and the second holding area. The squeegee is abutted against the circuit board being held to the second holding area, via the screen mask placed on the circuit board.

Abstract: An apparatus for the transport and equipping of substrates with semiconductor chips comprises a channel with two side walls in which the substrates are transported in a transport direction. The apparatus has at least one comb which can be raised and lowered in order to move the substrates in transport direction as well as resiliently mounted elements which press against the substrates.

Abstract: Die bonding equipment for fine pitch ball grid array package includes: a semiconductor chip pickup stage for inspecting a status of a loaded semiconductor chip and a corresponding position thereof; an alignment stage on which the semiconductor chip fixed on a mount head is aligned; a chip transfer unit for transferring the semiconductor chip from the semiconductor chip pickup stage to the alignment stage; a guide rail for guiding a mount tape frame; a status inspecting unit disposed at a selected position over the guide rail, for inspecting a status and a position of the land pattern on the mount tape frame; and a bonding unit for bonding the land pattern to the semiconductor chip which is mounted on the mount head. The equipment only bonds semiconductor chips (good or defective) to lands patterns having the same status (good or defective).

Abstract: A supporting tray for moving a PCB (10) in a wave solder machine includes a frame (30) and a circular plate (20). The frame includes a circular opening (33) defined thereof and a graduated scale (31) marked thereon around the circular opening. The circular plate includes a recessed portion (23). Two aligned pointers (21) are marked at two opposite outer sides of the recessed portion. In assembly, the PCB is fixedly received in the recessed portion of the circular plate. The combined PCB and circular plate is then rotatably received in the circular opening of the frame. Then the assembled PCB and the supporting tray are transported to a wave solder machine. The angle of the PCB with respect to a direction of flow of solder waves can be adjusted with an indication of the pointers and the scale. Consequently the optimal angle can be efficiently and accurately ascertained.

Abstract: A method and associated pallet assembly for reflow soldering electrical interconnections between a pair of printed circuits, at least one of which features a relatively-low-softening-temperature substrate, includes fixturing the printed circuits between the mating surfaces of a pallet and a cover, wherein the cover includes a first aperture adapted to expose an area on the back face of the first printed circuit. When the palletized printed circuits are advanced through a reflow oven, a nozzle directs hot gases through the first aperture to impinge directly upon the back face of the substrate to thereby reflow a solder layer sandwiched between the respective substrates of the printed circuits. Additional components on the second printed circuit are advantageously soldered in the same pass as hot gases from the nozzle flow through a second aperture defined in the pallet assembly's cover to impinge upon an additional solder layer on the second printed circuit.

Abstract: A system and method for reworking, repairing and upgrading flatwire is disclosed. A repair tool for reworking and/or repairing the flatwire is disclosed for creating subsequent electrical and mechanical joints of equal or greater quality as compared to the original system. The repair tool includes a heating blade, a power controller, a tool assembly, an inerting system, a cooling system, a flatwire cassette, a tool material, a flatwire material, an upgrade/repair procedure and various other aspects for rapidly heating flatwire two join two separate portions of the flatwire. The system and method of the present invention addresses the challenges of working with substrate materials which typically degrade at temperatures commonly used to form solder joints. Further, the soldering tool of the present invention may be a portable, lightweight unit that can be used in the field, for automotive and aerospace applications.

Abstract: A method of securing articles to each other and an alignment and holding apparatus comprising a platform having an alignment member for positioning and holding a first article, such as a substrate, in a first position and a further alignment member for aligning extensions of a second article, such as a lead frame, in an assembleable position with respect to the first article while a spacer maintains the extensions in proper lateral position and a clamp that secures the extensions proximate the first article while an electrical connection is formed between the first article and the extensions of the second article.

Abstract: A solder ball attracting mask which is mounted on a suction apparatus for sucking a plurality of solder balls under vacuum so as to place the solder balls on electrodes of an electronic component and formed with a plurality of through-holes for attracting the solder balls thereto, with the solder ball attracting mask having a principal face engageable with the solder balls and a rear face engageable with the suction apparatus such that the through-holes extend through the solder ball attracting mask from the principal face to the rear face, the through-holes each including a funnellike attraction area for attracting the solder ball thereto, which reduces its diameter gradually from the principal face towards the rear face up to a suction port and a suction hole which has a diameter larger than that of the suction port and extends from the suction port to the rear face to define a suction space.

Abstract: A circuit board pallet with an improved securement pin and component positioning arms is disclosed. The improved pin of the present invention is cylindrical pin with an enlarged head. A countersunk hole is drilled in the bottom of the pallet to accommodate the pin. The pin is inserted into the countersunk hole and secured with a high-temperature epoxy resin. The epoxy holds the pin securely in place and keeps the pin from moving up or down. The present invention also comprises at least one arm affixed at one end to a swivel joint. The swivel joint allows the arm to rotate about a vertical axis. The upper portion of the swivel joint is hinged such that the arm can rotate about a horizontal axis. The combination of movement about the horizontal and vertical axis allows the arm to be positioned at any point over the pallet.

Abstract: An apparatus for locally applying solder to a plurality of sets of preselected conductive areas on each printed circuit board to which component leads are joined. The apparatus includes a flux station with flux nozzles, a preheater station, and a wave solder station with solder nozzles, arranged in line to receive and process printed circuit boards. The flux nozzles and the solder nozzles are arranged in a pattern identical to that of the preselected conductive areas on each of the board. A conveyor system is arranged to simultaneously transporting the boards from one station to another.

Abstract: In a solder reflow type building of modular electrical apparatus involving integrated circuit and discrete components, fabrication operations are arranged to include the providing of a general type series of steps for each component element involving a reflow or joining step at the highest joining temperature, immediately followed by a solder flux cleaning step and immediately followed by a testing of the entire module constructed thus far. There is provided a further specific type operation for each different type of component element that includes the providing of a loop for the introduction of a replacement for any broken discrete component with joining being achieved with use of a lower fusion temperature solder, flux cleaning and testing at each joining followed by reinsertion into the module. There is further provided an operation at the encapsulation stage of the module building for introducing underfill between the component and supporting carrier.

Abstract: A circuit board pallet with an improved securement pin and component positioning arms is disclosed. The improved pin of the present invention is cylindrical pin with an enlarged head. A countersunk hole is drilled in the bottom of the pallet to accommodate the pin. The pin is inserted into the countersunk hole and secured with a high-temperature epoxy resin. The epoxy holds the pin securely in place and keeps the pin from moving up or down.

Abstract: A method is provided for placement of a first workpiece onto a second workpiece. The first workpiece is initially positioned at an origination location and the second workpiece has an attach location different from the origination location. A first place step is performed to displace the first workpiece from the origination location to an intermediate location different from the origination and attach locations. A second place step is performed to displace the first workpiece from the intermediate location to the attach location and the first workpiece is attached to the second workpiece at the attach location.

Abstract: An electronic component carrier includes a frame, a circuit board clamp fixed to the frame for clamping a circuit board, a vibrating device for vibrating the circuit board while the circuit board is carried through a reflow oven and the temperature inside the reflow oven is a predetermined temperature, and a collector installed on the frame for collecting electronic components dropping from the circuit board.

Abstract: A bump forming apparatus which carries out a temperature control of a type different from the conventional art in forming bumps to a semiconductor wafer, and a bump formation method executed by the bump forming apparatus are provided. A bonding stage, a load and transfer device and a control device are provided. A wafer, after having bumps formed thereon, is held by the load and transfer device and arranged above the bonding stage through control by the control device, so that a temperature drop of the wafer is controlled. Accordingly, generation of troubles such as a crack because of thermal stress and the like can be prevented to even compound semiconductor wafers sensitive to a temperature change.

Abstract: A die bonding apparatus for die bonding at least two members, which are heated in a heat treatment furnace, comprising a first member having a surface to be die bonded on which solder is disposed and a second member disposed to face the first member in a state in which the solder disposed on the surface of the first member to be die bonded is interposed therebetween, and a base portion for mounting the first member thereon in a predetermined position, wherein the base portion has a temperature distribution so that a temperature of a vicinity of a central portion in a predetermined direction of the base portion is higher than that of a vicinity of an end portion of the base portion in a state in which heating is effected in the heat treatment furnace to, so that it is possible to suppress the occurrence of bubbles in the solder.

Abstract: A titanium alloy strip which has a reduced cross section in the central region of the strip. By concentrating heat in this central region the process of bonding laser devices to a substrate is greatly improved. Furthermore, the titanium alloy strip allows for the possibility of removing the laser device from the substrate without destroying the laser device.

Abstract: A soldering machine for tape carrier package. The soldering machine includes a cylinder, a linking rod, a cushioning pad, a floating connector and a press head assembly. The cylinder has a first end and a second end. The linking rod passes through the interior of the cylinder. The linking rod also has a first end and a second end. The first end of the linking rod protrudes from the first end of the cylinder while the second end of the first linking rod protrudes from the second end of the cylinder. The first end of the linking rod has a threaded section with an adjusting nut screw onto the threaded section. There is a cushioning pad between the adjusting nut and the cylinder. The second end of the linking rod has a floating connector. The press head assembly and the linking rod is connected together via the floating connector.

Abstract: A die bonding apparatus includes a first member having a surface to be die bonded on which solder is disposed, a base portion for mounting the first member thereon in a predetermined position, a second member disposed in an inclined manner with respect to the first member and faces the solder, and an inclination attenuating member for inclining and holding the second member with respect to the first member to attenuate an angle of inclination &thgr;1 of the second member with respect to the first member in a state where the solder is melted. In a state where the first, second members, and the solder are heated and the solder is melted, die bonding is effected while the inclination attenuating member gradually attenuates the angle of inclination &thgr;1, so that it is possible to suppress the occurrence of bubbles in the solder.

Abstract: An automated soldering system includes a robotic soldering machine and a plurality of feed lines for delivering workpieces to be soldered by the soldering machine. Each of the feed lines transports workpieces such as LCD modules from an input end to a soldering area, and from the soldering area to an outlet end. The soldering areas are arranged within the range of motion of a soldering arm of the soldering machine are preferably arranged in a bilateral triangle having the pivot axis of the soldering are at its apex. The soldering arm is programmed to work reciprocally among the soldering areas, thus increasing the yield of the robotic soldering machine so that the soldering machine is more cost effective. The soldering machine may be programmed to perform different soldering operations at different soldering areas.

Abstract: A retaining device for holding at a place a workpiece such as a lead frame including a pair of first slits formed so as to surround the bonding window opened in the retainer. Furthermore, second slits are formed so as to extend to the outside from the end portions of the first slits, thus forming first connecting areas; and third slits are formed on the outside of the second slits so as to be perpendicular to the first connecting areas, thus forming second connecting areas.

Abstract: A position-, speed- and force-controllable chip accessing apparatus comprises a fixing seat, a rotational direction moving device, a linear direction moving device, and a position sensing device, characterized in that a flexible positioning means is provided at a proper central site of said fixing seat and is screw fixed with said rotational direction moving device; one side of said rotational direction moving device is coupled with said linear direction moving device, while the other side of said rotational direction moving device is coupled with said position sensing device screw; and that by measuring with a speed sensor and a position sensing device on said linear direction moving device, the control of the force, speed and moving distance can be achieved.

Abstract: In a battery post burning apparatus, the majority of the heat is supplied to the lead via the mold in which the finished post is being formed. The mold material in contact with the lead has a low thermal mass and high electrical and thermal resistance.

Abstract: A transport apparatus comprises a gripper for the transport of substrates. The gripper has a plate on the underside of which the vacuum grippers can be attached magnetically. The plate preferably consists of steel and each vacuum gripper has a permanent magnet. The transport apparatus is suitable for use on a Die Bonder.

Abstract: Stage structure in a bonding machine including a plate movably fitted in a bonding chamber, a plurality of blocks of electro-static chucks fitted to the plate for providing an electro-static force to hold a substrate, a plurality of vacuum holes in the plate around the electro-static chucks for receiving a vacuum force, and adsorbing and holding the substrate, and a plurality of alignment mark confirming holes in a periphery of the plate for confirming the marks for aligning the adsorbed substrate, thereby separating substrate from the stage more easily by applying a DC power with polarities opposite to a regular DC power.

Abstract: A nozzle device of a surface mounting device including a holder mounted and adhered closely to socket shafts by an elastic force of elastic members connected to both ends of the socket shafts, and a holder shaft formed on the bottom surface of the holder is disclosed. The nozzle device further includes a nozzle having a moving member assembled to the inside of the holder shaft, and moved in an upward or downward direction due to a pressure of air flown through the holder shaft, for picking up or placing a parts.

Abstract: Provided is a construction including a stage having a suction hole for sucking an electronic component and fixing the same in position and position regulating suction hole for sucking an electronic component when the electronic component is regulated in position, a position regulating pawl for positioning the electronic component on the stage and a position regulating suction force control section capable of controlling a position regulating suction force when the electronic component is regulated in position on the stage.

Abstract: An improved die placement and bonding apparatus with bleed out control for attachment of a die onto the prescribed surface of a leadframe. The apparatus contains a bond frame provided with an alignment mechanism, and a die placement mechanism. The frame has a perimeter side wall with a base defining a predetermined area therein, with dimensions larger than the dimensions of the die. The side wall is used to provide a solder liquid tight seal when it is placed on a prescribed surface of the leadframe. The alignment mechanism is coupled to the frame and allows the frame to be properly aligned with the leadframe before it is lowered onto the prescribed surface. The die placement mechanism is used for delivering and placing the die onto the liquid solder on the leadframe within the side wall.

Abstract: A rework nozzle includes a gripping device that is used to remove a soldered device from a circuit board. The rework nozzle attaches to a module that generates hot gas. The device that is to be removed from the circuit board is placed within the nozzle. The module generates hot gas, and the hot gas is directed by the nozzle to soldered connections that couple the device to the circuit board. The hot gas melts the solder and the gripping mechanism is used to grasp the device. The device may be removed from the circuit board by separating the circuit board from the nozzle after the hot gas melts the solder. The nozzle will release the device if the force needed to remove the device is greater than the force applied to the device by the gripping mechanism. The release of the device will prevent damage to the device or to the circuit board.

Abstract: The disclosure is a plural process to perform a solder ball attaching process that corresponds to the final of a ball grid array package manufacturing process. For example, flux and solder balls are exactly attached on solder ball pads of base frames on which base tapes having a number of land pattern groups are adhered. In the above state, the base frames are inserted into an adjacent reflow device to make the solder balls be attached on the solder ball pads. After the flux of the solder ball pad, on which the solder ball is attached, is removed, the base frames are stored in containers. To perform the base frame storing process in a very small space, the transfer course of the base frames is in the form of loop.

Abstract: A precisor plate for an automatic wire bonder having a heat block attachment portion thereon to precisely attach a heat block thereto provides a simple and quickly adjustable precisor plate and method of alignment. The precisor plate includes fixed alignment pins to align the precisor plate relative to a lead frame in an automatic wire bonding machine. In a preferred embodiment, the heat block is integral with the precisor plate and includes internal bores and or passageways for receiving a heating element, a thermocouple, and/or a vacuum source.

Abstract: The present invention relates to a workpiece implementation device that fabricates individual workpieces, positions them at their point of use on a component, and connects the workpieces to the components. The device further comprises an accessory assembly capable of shaping the workpieces, coating the workpieces with a solderable material, burnishing the point of use on the component, and testing the connection between the workpieces and the component. The positioning, attaching, and accessory assemblies of the workpiece implementation device are adapted to selectively perform their individual functions without the necessity of first repositioning the component or the implementation device. Accordingly, the present invention increases overall production efficiency by integrating several separate implementation tools and workstations into a single, adaptable device.

Abstract: A die bonding device for installing electronic components S on a metal stem, comprising a bonding nozzle for suctioning an electronic component S and positioning the electronic component S on a component mounting face of the stem, a stem carrying head for carrying the stem, a heater section for heating the electronic component S while it is positioned on the component mounting face of the stem, and an imaging camera having a light axis L extending through the component mounting face of the stem when positioned inside the heater section, which performs reciprocating motion in the direction of the light axis L.

Abstract: An integrated solder bump deposition method and apparatus that enables solder bumps to be lithographically formed on a substrate. The apparatus comprises a plurality of electrolyte cells, and etch/clean/passthrough station and a reflow chamber.

Abstract: Wafers are previously positioned so that the wafer orientation flat is oriented in a particular direction. A transporting means then moves and places the previously positioned wafer on a bonding stage where bumps are formed on the wafer by means of a bonding head. The transporting means has a sensor for detecting the position of the orientation flat of a wafer on the bonding stage from a position above the bonding stage, thereby avoiding the adverse effects of heat from the bonding stage during orientation flat detection.

Abstract: An Integrated Electronics Workstation is disclosed. Also disclosed is a workstation that includes a housing with an integrated exhaust fan. The workstation further includes a plurality of other features, including a pair of adjustable arms and board grips mounted thereto for holding boards and/or wire while the board is being worked on. Still further, the workstation includes a soldering tool station, one or more wire spools, a light housing for illuminating the work area, a voltage measuring device, a power supply device, and a microscope and/or loupe.

Abstract: The present invention relates to a new and improved device adapted for mounting semiconductor components to substrates. More particularly, the device includes a housing and a first member rotatably mounted to the housing. A first interface is formed between the first member and the housing. The device also has a second member mounted in the first member. The second member is movable in an axial direction relative to the first member between a first position, in which the second member extends from the first member, and a second position, in which the second member is retracted from the first position. The second member has an engaging mechanism at an end thereof for engaging a semiconductor component when the second member is in its first position. A second interface is formed between the first and second members.