Abstract: A coupler is disclosed that employs hall-effect sensing technology. Specifically, the coupler is configured to produce an output voltage by converting the magnetic field generated by a current conductor at an input side. The output and input sides may be electrically isolated from one another but may be coupled via the hall-effect sensing technology, such as a hall-effect sensor. The output and input sides may be provided in an overlapping configuration.

Abstract: A proximity sensor is provided according to the embodiments of the present disclosure, comprising: a sensor chip; a light-emitting device; a substrate, the sensor chip and the light-emitting device being located on the substrate; a transparent molding material covering a light-emitting surface of the light-emitting device; and a non-transparent molding material separating the transparent molding material from the sensor chip.

Abstract: A temperature change detection apparatus for monitoring temperature change in various portions of a large space includes a trip logic unit configured to execute a trip operation based on receipt of a trip signal at the trip logic unit; a plurality of temperature sensors each including a sensing portion composed of optical fiber cable and each being configured to generate light information indicating an amount of Brillouin scattering that occurs within the sensing portion; a plurality of monitoring units configured such that each monitoring unit determines a temperature value corresponding to each temperature sensor connected to the monitoring unit based on an amount of Brillouin scattering indicated by the light information generated by each of the connected temperature sensors, an each monitoring unit generates a trip signal when a determined temperature value exceeds a running average by more than a threshold amount.

Abstract: An optoelectronic safety device for monitoring a machine movement includes an emitter/receiver device, control electronics, an electric line which includes at least two wires to transmit a supply voltage and a control signal, and a device provided so that the supply voltage and the control signal can be transmitted where the at least two wires is a two-wire electric line or, alternatively, a three-wire electric line.

Abstract: A modular optical device having a set of optoelectronic modules that enables the device to operate, e.g., as a WDM or multichannel transceiver. In an example embodiment, the set of optoelectronic modules includes a laser module, a modulator module, and an optical-to-electrical converter module, all mounted on the same circuit board and optically and electrically connected for the intended application. Each of the optoelectronic modules comprises a respective stack of integrated circuits, at least one of which is a photonic integrated circuit (PIC). Some of the PICs may be configurable for different applications, with the configuration setup being carried out using electrical control signals and/or optical connections of the PICs.

Abstract: An optical device includes a substrate, a light emitter, a light detector, a conductive structure, and an opaque material. The light emitter, the light detector and the conductive structure are disposed on a surface of the substrate and are electrically connected to traces on the surface of the substrate. The light emitter includes an emitting area facing the substrate. The light detector includes a receiving area facing the substrate. The light emitter emits light within a range of wavelengths, and the substrate passes the light emitted by the light emitter. The opaque material is disposed on the substrate, and absorbs or attenuates the light within the range of wavelengths.

Abstract: According to one embodiment, a semiconductor device includes a first semiconductor element having a first surface, a second semiconductor element having a lower surface bonded to the first surface of the first semiconductor element, a gel-like silicone that covers an upper surface of the second semiconductor element, and a resin portion that covers the gel-like silicone and the first surface of the first semiconductor element.

Abstract: Disclosed examples include integrated circuits with a leadframe structure, a first circuit structure including a light source configured to generate a light signal along an optical path, a second circuit structure including a light sensor facing the optical path to receive the light signal, and a molded package structure enclosing portions of the leadframe structure, the molded package structure having a cavity defined by an interior surface of the molded package structure, the optical path extending in the cavity between the first and second circuit structures.

Abstract: An optical isolator is provided. The optical isolator includes a printed circuit board having a first surface and a second surface opposite the first surface. The printed circuit board has a recess extending only partially through the board. The first photoelement has an active surface and is mounted relative to the first surface of the printed circuit board. A second photoelement has an active surface and is mounted relative to the second surface. The second photoelement is configured to interact with the first photoelement. At least one of the first and second photoelements has its active surface disposed at least partially in the recess. A portion of the printed circuit board is interposed between the first and second photoelements.

Abstract: A photoelectric conversion assembly is proposed. The photoelectric conversion module comprises three parts, photoelectric conversion module, a printed circuit board (PCB) and a hybrid cable. The photoelectric conversion module comprises an interposer, at least one optical element configured on the interposer, and an optical bench for the printed circuit board and the interposer configured thereon. Electrical wires are used for coupling to the printed circuit board. An optical ferrule is used for engaging with the photoelectric conversion module and an optical fiber component. A plug is used for electrically connecting the printed circuit board. A first lens array is configured under the interposer. A mirror is configured under the first lens array. A second lens array is configured left side of the mirror.

Abstract: An optical system, an optocoupler, and an isolation device are provided. The disclosed optical system includes at least one photodetector that receives light energy and converts the light energy into one or more electrical signals. The disclosed optical system further includes a comparator module that receives the one or more electrical signals from the at least one photodetector and compares the one or more electrical signals against two different reference values to determine whether a power supply fault condition has occurred for a light source that emitted the light energy and to determine a logic signal conveyed to the at least one photodetector via the light energy emitted by the light source.

Abstract: A driving circuit including: a voltage detector that detects the sum voltage of a positive bias voltage and a negative bias voltage, the negative bias voltage or the positive bias voltage; and a switching element that is connected to the control terminal of a power element and the negative side of a negative-voltage power supply; wherein, when the value of the detection target voltage becomes lower than a voltage setting value or when a voltage between the control terminal and the reference terminal in the power element increases in a state where the value of the detection target voltage is lower than the voltage setting value, the voltage detector turns on the switching element to thereby supply, between the above terminals in the power element, a voltage of 0V or lower.

Abstract: An optical source is described. This optical source includes a set of semiconductor optical amplifiers, with a semiconductor other than silicon, which provides an optical gain medium. In addition, a photonic chip, optically coupled to the set of semiconductor optical amplifiers, includes optical paths. Each of the optical paths includes an optical waveguide and a distributed-Bragg-reflector (DBR) ring resonator. The DBR ring resonator at least partially reflects a given tunable wavelength in an optical signal provided by a given semiconductor optical amplifier. Moreover, the DBR ring resonator includes a different number of grating periods than DBR ring resonators in the remaining optical paths, and the DBR ring resonators in the optical paths have a common radius.

Abstract: In accordance with one or more embodiments, a transmission device includes a receiver configured to receive an interfering signal via an antenna. A transmitter is configured to generate first electromagnetic signals conveying first data. A coupler is configured to generate first guided electromagnetic waves in response to combined electromagnetic signals, wherein the first guided electromagnetic waves propagate, without requiring an electrical return path, along a surface of a transmission medium of a distributed antenna system. A cancellation circuit is configured to generate the combined electromagnetic signals, based on the interfering signal and the first electromagnetic signals, wherein the combined electromagnetic signals mitigate interference by the interfering signal with the first guided electromagnetic waves.

Abstract: The application provides methods of forming a fiber coupling device comprising a substrate, the substrate having a substrate surface and at least one optoelectronic and/or photonic element, and further comprising at least one fiber coupling alignment structure that is optically transmissive. The method comprises a) applying a polymerizable material to the substrate surface, b) selectively polymerizing, using a method of 3D lithography, a region of the polymerizable material so as to convert the region of the polymerizable material into a polymer material, thereby forming at least one fiber coupling alignment structure, and c) cleaning the substrate and the polymer material from remaining non-polymerized polymerizable material, thereby exposing the at least one fiber coupling alignment structure of the fiber coupling device.

Abstract: A digital signal input circuit including an isolating circuit and a voltage determining circuit is presented, where a first port of an input end of the isolating circuit receives a digital signal, an output end of the isolating circuit outputs the digital signal, and when the isolating circuit is open, the isolating circuit is configured to output a first level, or when the isolating circuit is closed, the isolating circuit is configured to output a second level; and the voltage determining circuit is configured to determine, according to a level of the digital signal, whether the isolating circuit is open or closed. According to the digital signal input circuit, the voltage determining circuit determines a level of a digital signal, thereby correctness of digital signal level conversion is increased.

Abstract: A temperature control apparatus is provided. The temperature control apparatus includes an analog to digital (AD) converter digital-converting a measurement value transmitted from a plurality of temperature sensors; a control means comparing the measurement value transmitted from the AD converter with a preset desired value to perform PID calculation; and an output unit transmitting, to outside, a pulse width modulation (PWM) control signal transmitted form the control means, wherein an input-side isolator for isolation for each temperature sensor is provided between the AD converter and the temperature sensor, the input-side isolator is connected to each of the temperature sensors, and the control means sequentially operates the input-side isolators.

Abstract: An optical integrated circuit (IC) package includes an optical IC including an optical IC substrate, an optical IC including an optical IC substrate, an electrical integrated circuit device (EICD) on the optical IC substrate, at least one optical device spaced apart from the EICD on the optical IC substrate, an optical interface on a first side of the optical IC substrate, an electrical interface located on a second side of the optical IC substrate, and an encapsulation member configured to encapsulate the optical IC, the EICD, the at least one optical device, the optical interface, and the electrical interface.

Abstract: Techniques are described for providing, in a gate driver circuit, a compensation current to compensate for parasitic displacement current induced during the rising edge of an output voltage at an output gate of the gate driver circuit. In one example, the techniques of the disclosure include activating, by a bridge driver circuit for a direct-current (DC) motor, a driver of the bridge driver circuit and measuring, by the bridge driver circuit, a parasitic current of the driver during a rise time of an output gate voltage of the driver. In response to the measured parasitic current, generating, by the bridge driver circuit, a compensation current; and outputting, by the bridge driver circuit and to the output gate of the of the driver, the compensation current.

Abstract: Methods, systems, and devices for high voltage and/or high frequency modulation. In one aspect, an optoelectronic modulation system includes an array of two or more photoconductive switch units each including a wide bandgap photoconductive material coupled between a first electrode and a second electrode, a light source optically coupled to the WBGP material of each photoconductive switch unit via a light path, in which the light path splits into multiple light paths to optically interface with each WBGP material, such that a time delay of emitted light exists along each subsequent split light path, and in which the WBGP material conducts an electrical signal when a light signal is transmitted to the WBGP material, and an output to transmit the electrical signal conducted by each photoconductive switch unit. The time delay of the photons emitted through the light path is substantially equivalent to the time delay of the electrical signal.

Abstract: A display panel and method of manufacture are described. In an embodiment, a display substrate includes a pixel area and a non-pixel area. An array of subpixels and corresponding array of bottom electrodes are in the pixel area. An array of micro LED devices are bonded to the array of bottom electrodes. One or more top electrode layers are formed in electrical contact with the array of micro LED devices. In one embodiment a redundant pair of micro LED devices are bonded to the array of bottom electrodes. In one embodiment, the array of micro LED devices are imaged to detect irregularities.

Abstract: A package structure with an optical barrier is provided. An emitter for emitting an optical signal and a detector for receiving the optical signal are disposed on a substrate. The optical barrier is disposed between the emitter and the detector for shielding the excess optical signal. A package material is used to completely cover the optical barrier, the emitter and the detector so that the optical barrier is completely disposed within the package material.

Abstract: According to one embodiment, a transimpedance circuit includes: a transimpedance amplifier that converts a current signal into a voltage signal, a reference voltage generating circuit that generates a reference voltage signal, and a comparator that generates a pulse signal corresponding to the current signal in accordance with a voltage level of the voltage signal and a voltage level of the reference voltage signal. The transimpedance amplifier includes a first transistor that amplifies the current signal, a voltage converter that converts the current signal into a voltage signal, and a bypass circuit that allows the current signal to be bypassed when the current signal which flows through a control terminal of the first transistor exceeds a predetermined value.

Abstract: There is provided a power supply receiver-transmitter device, a wireless power supply receiver, and a wireless power supply transmitter which allow wireless power supply transmission and wireless data transmission and reception, and improve the usability thereof. The wireless power supply receiver-transmitter device includes: a wireless power supply receiver (PR) including a power receiver unit (RU) and a first data transmitter/receiver unit (DRU); a wireless power supply transmitter (PT) including a power transmitter unit (TU); and a second data transmitter/receiver unit (DTU). The wireless power supply receiver (PR) wirelessly receives electric power transmitted from the wireless power supply transmitter (PT), and the first data transmitter/receiver unit (DRU) bidirectionally transmits and receives data to/from the second data transmitter/receiver units (DTU) through optical communications.

Abstract: In at least one embodiment of the method, the method is used to produce optoelectronic semiconductor components. A lead frame assemblage includes a plurality of lead frames. The lead frames each includes at least two lead frame parts and the lead frames in the lead frame assemblage are electrically connected to one another by connecting webs. The lead frame assemblage is fitted on an intermediate carrier. At least a portion of the connecting webs is removed and/or interrupted. Additional electrical connecting elements are fitted between adjacent lead frames and/or lead frame parts. A potting body mechanically connects the lead frame parts of the individual lead frames to one another. The resulting structure is singulated to form the semiconductor components.

Abstract: An optical detecting module includes a housing, a light emitting component, an optical detecting component and an optical signal collecting component. The light emitting component is disposed inside the housing. The optical detecting component is disposed inside the housing to receive an optical detecting signal generated by the light emitting component. The optical signal collecting component is utilized to hold the light emitting component for signal collection. The optical signal collecting component includes an output portion, a bottom portion and at least one lateral portion. The light emitting component is disposed on the bottom portion, and an optical positive signal of the optical detecting signal is projected out of the housing through the output portion. The lateral portion is bent from the bottom portion to reflect an optical lateral signal of the optical detecting signal, and the optical lateral signal is projected out of the housing through the output portion.

Abstract: Plastic optical fiber data communication links. Particularly, plastic optical fiber data communication links for embedded applications. More particularly, unique packaging approaches to constructing a very small, low cost, but high performance optical link, which may operate at 1 gigabits per second (Gbps) or faster.

Abstract: An optical apparatus includes a substrate 1, a wiring pattern 8 formed on the substrate 1, a light-receiving element 3 and a light-emitting element 2 provided on the substrate 1 and spaced apart from each other in a direction x, a light-transmitting resin 4 covering the light-receiving element 3, a light-transmitting resin 5 covering the light-emitting element 2, and a light-shielding resin 6 covering the light-transmitting resin 4 and the light-transmitting resin 5. The wiring pattern 8 includes a first light-blocking portion 83 interposed between the light-shielding resin 6 and the substrate 1 and positioned between the light-receiving element 3 and the light-emitting element 2 as viewed in x-y plane. The first light-blocking portion 83 extends across the light-emitting element 2 as viewed in the direction x.

Abstract: An optical transconductance varistor system having a modulated radiation source configured to provide modulated stimulus, a wavelength converter operably connected to the modulated radiation source to produce a modulated stimulus having a predetermined wavelength, and a wide bandgap semiconductor photoconductive material in contact between two electrodes. The photoconductive material is operably coupled, such as by a beam transport module, to receive the modulated stimulus having the predetermined wavelength to control a current flowing through the photoconductive material when a voltage potential is present across the electrodes.

Abstract: A DP-QPSK optical transmitter includes an outer MZM comprising a first parent MZM comprising a first child MZM and a second child MZM that modulates a QPSK signal with a first polarization. A second parent MZM includes a first child MZM and a second child MZM that modulates a QPSK signal with a second polarization. The outer Mach-Zehnder modulator multiplexes the first and second polarization embedded into a dual-polarization QPSK signal generation. A first optical detector detects the QPSK signal generated by the first parent MZM with the first polarization. A second optical detector optical detects the QPSK signal generated by the second parent Mach-Zehnder modulator with the second polarization. A bias control circuit generates bias signals on at least one output that stabilize the DP-QPSK signal in response to signals generated by the first and second optical detector using electrical time division multiplexing.

Abstract: An optical sensor arrangement, in particular an optical proximity sensor arrangement comprises a three-dimensional integrated circuit further comprising a first layer comprising a light-emitting device, a second layer comprising a light-detector and a driver circuit. The driver circuit is electrically connected to the light-emitting device and to the light-detector to control the operation of the light-emitting device and the light-detector. A mold layer comprising a first light-barrier between the light-emitting device and the light-detector configured to block light from being transmitted directly from the light-emitting device to the light-detector.

Abstract: A photocoupler comprises a light emitting element, a light-sensing element, a transparent inner encapsulant body, an outer covering body, and two conductive frames. An optically reflective surface is formed on the outer covering body directly in contact with the dome encapsulant portion of the transparent inner encapsulant body. A portion of the light emitted by the light emitting element is reflected to the light-sensing element through the optically reflective surface, and the other portion of the light emitted from the light emitting element is directly emitting to the light-sensing element through the dome encapsulant portion. The present invention applies the optically reflective surface to minimize the overlapping area between the two conductive frames, and reduces the capacitance value, and increases the CMRR in a manner that the photocoupler of the present invention is able to meet the standard of electrical characteristics as required.

Abstract: An apparatus has a first ring of infrared emitters and a second ring of infrared detectors positioned adjacent to the first ring. A controller applies signals to the first ring and collects signals from the second ring.

Abstract: This disclosure provides example methods, devices, and systems for a three-lead electronic switch system adapted to replace a mechanical switch. A device is disclosed that includes a sensor, a current limiting circuit, an output switching circuit comprising a first switching device and a second switching device, and a three lead interface circuit in communication with the output switching circuit and the current limiting circuit. The device includes an electronic switching circuit in communication with the sensor, the current limiting circuit, and the output switching circuit. The electronic switching circuit is configured to drive the first and second switching devices in complementary conduction states responsive to determining the output of the sensor relative to a threshold voltage. The output switching circuit includes a first terminal, a second terminal, and a return terminal that are configured to provide power to the electronic switching circuit while providing an indication of the conduction states.

Abstract: A semiconductor system may include a first semiconductor device including a first pad group. The semiconductor system may include a second semiconductor device including a second pad group which is configured for input and output of signals from and to a third semiconductor device. The second semiconductor device may include a selective transfer unit configured to electrically couple the third pad group to the first pad group or to an interface unit electrically coupled to the first pad group, in response to a test mode enable signal.

Abstract: A semiconductor device includes a first chip coupled to an electrical insulator, and a sintered heat conducting layer disposed between the electrical insulator and the first chip.

Abstract: The invention relates to a digital bus interface for an operating device for a lighting means comprising: a transmitting branch and a receiving branch, wherein the receiving branch has a current source (Q90, Q95, R90, R91), which can be fed from a bus that carries voltage in the idle state, wherein the current source supplies at least the transmitting branch with energy and the transmitting branch has an optocoupler (U91), wherein an electrical energy store (C95) is provided in the receiving branch, which electrical energy store is charged by the current source and discharges via a resistor (100) in series with the secondary side of the optocoupler (U91) of the transmitting branch.

Abstract: The alignment accuracy between light emitting elements, light receiving elements, and an insulating film is improved. A photocoupling device manufacturing method includes preparing a first lead frame having a first frame part supporting light receiving elements and a second lead frame having a second frame part supporting light emitting elements. The method also includes superposing the first and the second lead frame such that the light receiving elements and the light emitting elements mutually oppose via a first light-transmissive resin covering the light receiving elements, a second light-transmissive resin covering the light emitting elements, and an insulating film sheet positioned between the first and the second light-transmissive resin. The insulating film sheet includes body parts positioned between the light receiving elements and the light emitting elements, joining parts joined to the body parts, and a third frame part fixed between the first and the second frame part.

Abstract: Methods and apparatus for sealed communication interfaces are disclosed. One example apparatus includes a translucent portion of a sealing gasket to allow signals to pass therethrough, a sealing wall of the gasket to define a substantially environmentally-isolated zone proximate the translucent portion, and a transmitter to transmit a signal across the translucent portion. The example apparatus also includes a receiver to detect a reflected signal corresponding to the transmitted signal, where the detection enables data communications across the translucent portion, and where the reflected signal is to be reflected from a surface on an opposite side of the translucent portion from the transmitter and receiver.

Abstract: A camera module and method of making same, includes a substrate of conductive silicon having top and bottom surfaces, a sensor device, and an LED device. The substrate includes a first cavity formed into the bottom surface of the substrate and has an upper surface, an aperture extending from the first cavity upper surface to the top surface of the substrate, and a second cavity formed into the top surface of the substrate and having a lower surface. The sensor device includes at least one photodetector, is disposed at least partially in the first cavity, and is mounted to the first cavity upper surface. The LED device includes at least one light emitting diode, is disposed at least partially in the second cavity, and is mounted to the second cavity lower surface.

Abstract: A semiconductor device and methods of manufacturing the same are disclosed. Specifically, methods and devices for manufacturing opto-couplers are disclosed. Even more specifically, the opto-coupler includes a lens assembly to enhance light coupling efficiency between an optical transmitter and an optical receiver. An encapsulant material may also be utilized.

Abstract: A semiconductor device includes first, second, and third molded bodies. The first molded body covers a first light emitting element, a part of a lead electrically connected to the first light emitting element, a first light receiving element configured to detect a light emitted from the first light emitting element, and a part of a lead electrically connected to the first light receiving element with a first resin. The second molded body covers a second light emitting element, a part of a lead electrically connected to the second light emitting element, a second light receiving element configured to detect a light emitted from the second light emitting element, and a part of a lead electrically connected to the second light receiving element with the first resin. The third molded body molds the first and the second molded bodies as one body using a second resin.

Abstract: A power supply apparatus with input voltage detection includes a power input side and an input detection module. The power input side has a first input terminal and a second input terminal, and the first input terminal and the second input terminal are electrically connected to a live wire and a neutral wire of an AC power source, respectively. The input detection module has two input terminals, which are corresponding electrically connected to the first input terminal and the second input terminal. The input detection module generates a detection signal to shut down the power supply apparatus when the input detection module detects that the live wire or the neutral wire is abnormal, or the live wire and the neutral wire are both abnormal.

Abstract: A photosensor includes a sensor module in which emitter and receiver leads protrude from a circuit-encapsulating portion in a direction intersecting with a direction in which an external connecting terminal extends. The photosensor includes a light emitter, a light receiver, a circuit-encapsulating portion, a connecting terminal, first and second emitter leads, and first and second receiver leads. When the connecting terminal extends in a first direction, and a first plane is parallel to the first direction, the first and second emitter leads protrude from the circuit-encapsulating portion in a direction parallel to the first plane and intersecting with the first direction, and extend opposite to the first direction. The first and second receiver leads protrude from the circuit-encapsulating portion in the direction parallel to the first plane and intersecting with the first direction and opposite to a direction in which the first and second emitter leads protrude, and extend opposite to the first direction.

Abstract: There is provided a solid state imaging element including: an insulation film laminated on a semiconductor substrate; a lower transparent electrode film formed and separated by the insulation film per pixel; a hydrophobic treatment layer laminated on a flat surface of the insulation film and the lower transparent electrode film; an organic photoelectric conversion layer laminated on the hydrophobic treatment layer; and an upper transparent electrode film laminated on the organic photoelectric conversion layer. Also, there is provided a production method thereof and an electronic device.

Abstract: A terminal circuit in an inverter is disclosed, the terminal circuit including a photo-coupler configured to electrically insulate input/output signals, to receive, as input, an open collector output signal or a pulse output signal from a first port and to output the open collector output signal or the pulse output signal to a second port through a first output terminal, a transistor in which a base (B) terminal is connected to a second output terminal of the photo-coupler. And a bias resistor connected to a base (B) terminal of the transistor and to an emitter (E) terminal.

Abstract: A controller connected to a line voltage, includes an auto-transformer that provides a nominal line voltage at a first end terminal and a signaling voltage at a transformer tap. A first switch has a first switch terminal connected to the first end terminal of the auto-transformer, and a second switch terminal connected to an output node of the controller. A second switch has a first switch terminal connected to the transformer tap of the auto-transformer, and a second switch terminal connected to the output node. A switch controller is configured to output first and second switch signals responsive to a control signal, to control the first and second switches to insert signaling transitions onto the line voltage by selectively connecting the nominal line voltage at the first end terminal and the signaling voltage at the transformer tap to the output node.

Abstract: A power circuit for different types of fans includes first through sixth terminals, a control chip, first through third loads, and a connector. If a 3-pin fan is connected to the connector, only the first load connects the first and second terminals, and a control pin of the connector is idle. If a 4-pin fan is connected to the connector, the second load connects the third and fourth terminals, the third load connects the fifth and sixth terminals, and the first load does not connect the first and second terminals. The control pin receives a divided voltage to control fan speed.

Abstract: A semiconductor DC transformer is provided. The semiconductor DC transformer comprises: a plurality of semiconductor electricity-to-light conversion structures connected in series for converting input electric energy into optical energy; and a plurality of semiconductor light-to-electricity conversion structures connected in series for converting input optical energy into electric energy, in which a number of the semiconductor electricity-to-light conversion structures is different from that of the semiconductor light-to-electricity conversion structures so as to realize a DC transformation, and a working light spectrum of the semiconductor electricity-to-light conversion structures is matched with that of the semiconductor light-to-electricity conversion structures.

Abstract: A photocoupler includes: a support substrate; a MOSFET; a light receiving element; a light emitting element; and a bonding layer. The support substrate includes an insulating layer, input and output terminals. The MOSFET is bonded to the support substrate. The MOSFET has a first surface having an operation region. The light receiving element includes p-n junction and is bonded to the MOSFET. The light receiving element has first and second surfaces. The first surface includes a light reception region, a first electrode, and a second electrode. The light emitting element is connected to the input terminal. The light emitting element has first and second surfaces. The first surface includes first and second electrodes. The second surface has a light emitting region. The bonding layer is configured to bond the light emitting element to the light reception region.