Abstract: A light-emitting semiconductor chip, a light-emitting component and a method for producing a light-emitting component are disclosed. In an embodiment a light-emitting semiconductor chip includes a substrate having a top surface, a bottom surface opposite the top surface and a first side surface extending transversely or perpendicularly to the bottom surface, a semiconductor body arranged on the top surface of the substrate, the semiconductor body comprising an active region configured to generate light and a contacting comprising a first current distribution structure and a second current distribution structure, which is formed to supply current to the active region, wherein the semiconductor chip is free of any connection point on a side of the semiconductor body facing away from the substrate and on the bottom surface of the substrate, and wherein the connection point is a connection point for electrically contacting the first and second current distribution structures.

Abstract: In various embodiments, methods for forming a chip package are provided. The chip package may include a chip comprising a chip metal surface, a metal contact structure electrically contacting the chip metal surface, a packaging material at least partially encapsulating the chip and the metal contact structure, and a chemical compound physically contacting the packaging material and at least one of the chip metal surface and the metal contact structure, wherein the chemical compound may be configured to improve an adhesion between the metal contact structure and the packaging material and/or between the chip metal surface and the packaging material, as compared with an adhesion in an arrangement without the chemical compound, wherein the chemical compound is essentially free from functional groups comprising sulfur, selenium or tellurium.

Abstract: An encapsulation structure, a display panel, an electronic device and an encapsulation method are provided. The encapsulation structure includes: a first substrate and a second substrate, and a first sealant and a second sealant bonding the first substrate and the second substrate to each other. The first sealant includes a first inclined surface; the second sealant includes a second inclined surface which is attached to and in direct contact with the first inclined surface. In a direction parallel to the first substrate, each of the first inclined surface and the second inclined surface extends from a first position to a second position. Along a direction from the first position to the second position, a distance from the first inclined surface to the first substrate and a distance from the second inclined surface to the second substrate gradually change; and sums of the two distances are substantially equal.

Abstract: Disclosed is a method for manufacturing a chip scale package (CSP) for a light-emitting diode (LED). The method may include a light-emitting device mounting step for mounting a plurality of light-emitting devices on a substrate strip, a phosphor forming step for forming a phosphor on the plurality of light-emitting devices, a reflective member forming step for forming a reflective member on the substrate strip to surround the phosphor, and a package singulation step for singulating unit packages by cutting the substrate strip and the reflective member.

Abstract: Disclosed is a unit substrate for an optical device, the unit substrate including: an optical device-mounting region provided on an upper surface of the unit substrate; and first and second metal substrates bonded to each other with a vertical insulating layer interposed therebetween. A lower surface of the unit substrate is electrically connected to the mounting region, and side and upper surfaces of the unit substrate are electrically isolated from the mounting region such that an optical device is capable of operating in an environment with low electrical resistance.

Abstract: A stack of strata containing LEDs is fabricated by repeatedly bonding unpatterned epitaxial structures. Because the epitaxial structures are unpatterned (e.g., not patterned into individual micro LEDs), requirements on alignment are significantly relaxed. One example is an integrated multi-color LED display panel, in which arrays of micro LEDs are integrated with corresponding driver circuitry. Multiple strata of micro LEDs are stacked on top of a base substrate that includes the driver circuitry. In this process, each stratum is fabricated as follows. An unpatterned epitaxial structure is bonded on top of the existing device. The epitaxial structure is then patterned to form micro LEDs. The stratum is filled and planarized to allow the unpatterned epitaxial structure of the next stratum to be bonded. This is repeated to build up the stack of strata.

Abstract: In a thin flash module for a camera, a rectangular array of LEDs is mounted on a single lead frame. The lead frame connects the LEDs in series. The LEDs are much smaller than conventional LEDs in a flash module. The LEDs may be in 5×3 array or a 4×3 array, for example. An array of reflective cups is molded over the lead frame or attached to the lead frame, where each of the cups has a substantially square aperture to produce a square sub-beam. A layer of phosphor is located within each cup overlying its associated LED to produce white light. The aspect ratio of the array is selected to generally match the aspect ratio of the camera's field of view (e.g., 16:9). Since the LEDs are very small, the height of the cups may be small to form an ultra-thin flash module. Thin lenses may instead be used.

Abstract: The present disclosure provides a display panel and an encapsulation component. The display panel comprises a substrate component, a display assembly, and an encapsulation component. The encapsulation component comprises a first encapsulation layer, a second encapsulation layer, and a third encapsulation layer. The second encapsulation layer is sandwiched between the first encapsulation layer and the third encapsulation layer. The first encapsulation layer and the third encapsulation layer are made of an inorganic material. The second encapsulation layer is made of an organic material, and the second encapsulation layer comprises a plurality of organic nanoparticles in the second encapsulation layer. According to the present disclosure, water and oxygen outside of display panels are prevented from entering display panels.

Abstract: A lighting device comprises a solid state light emitter on a circuit board, and an optic held in place relative to the first circuit board, a voltage drop across the emitter at least 60 volts. A lighting device comprises a solid state light emitter on a first circuit board, an optic held in place relative to the first circuit board, and a non-isolated power supply. A lighting device comprises a solid state light emitter on a first circuit board, and a flame-rated optic held in place relative to the first circuit board. An optic, comprising a translucent region, a first dimension not larger than about 10 mm, a second dimension not larger than 15 mm. A flame-rated optic comprising a translucent region, structure configured to hold the optic in place relative to a circuit board. Methods of making lighting devices.

Abstract: A method of producing a component module includes providing a component holder having a curved upper side and a radiation-emitting bendable component, and bending and fastening the component to the upper side so that the component has a curved shape.

Abstract: The present application discloses a display apparatus. The display apparatus includes a display module including a first display substrate and a second display substrate facing the first display substrate; and a first substantially transparent magnetic layer and a second substantially transparent magnetic layer both of which on a side of the second display substrate distal to the first display substrate and spaced apart from each other. The first substantially transparent magnetic layer and the second substantially transparent magnetic layer are configured to face each other with their sides having a same magnetic polarity to generate a mutually repulsive force between each other.

Abstract: A light source module is provided that includes a primary wiring substrate and a light source array having a plurality of light sources mounted on a surface of the primary wiring substrate in a matrix. The light source module includes a heat radiation pad, provided at a peripheral region of the primary wiring substrate, and one or a plurality of heat transfer paths having a higher heat conductivity than a base substrate that is a parent material of the primary wiring substrate and connecting the plurality of light sources constituting the light source array and the heat radiation pad. At least one of the plurality of light sources, which are arranged at a row-directional central portion of the light source array, is connected with the heat radiation pad by the heat transfer path including a first linear portion.

Abstract: The invention relates to a method for laterally structuring a structured layer (2) with a plurality of three-dimensional structure elements (20), having the following steps: a) providing the structured layer with the three-dimensional structure elements; b) forming a laterally structured covering layer (3) on the structured layer in order to define at least one structured layer region (4) to be removed; and c) removing the structured layer region to be removed by means of a force acting on the structure elements in the region to be removed. The invention further relates to a semiconductor component (1).

Abstract: In an organic light-emitting display apparatus comprising a plurality of pixels, at least one of the plurality of pixels includes a first conductive layer over a substrate, a first organic insulating layer over the first conductive layer, the first organic insulating layer comprising a first opening exposing a part of the first conductive layer, a second conductive layer over the first organic insulating layer, the second conductive layer contacting the part of the first conductive layer exposed through the first opening, a first inorganic insulating layer over the first organic insulating layer to cover the second conductive layer, the first inorganic insulating layer comprising a second opening exposing at least a part of the first organic insulating layer, and a second organic insulating layer over the first inorganic insulating layer, the second organic insulating layer contacting the first organic insulating layer through the second opening.

Abstract: A micro LED display device includes a display panel. The display panel includes a plurality of pixel areas each having a thin film transistor. A first micro LED and a second micro LED are in each pixel area. The first micro LED is configured to emit light to display an image, and the second micro LED is configured to emit light to improve a displayed brightness for a specific area of the image.

Abstract: A process for encapsulating an apparatus to restrict environmental element permeation between the apparatus and an external environment includes applying multiple barrier layers to the apparatus and preceding each layer application with a separate cleaning of the presently-exposed apparatus surface, resulting in an apparatus which includes an encapsulation stack, where the encapsulation stack includes a multi-layer stack of barrier layers. Each separate cleaning removes particles from the presently-exposed apparatus surface, exposing gaps in the barrier layer formed by the particles, and the subsequently-applied barrier layer at least partially fills the gaps, so that a permeation pathway through the encapsulation stack via gap spaces is restricted. The quantity of barrier layers applied to form the stack can be based on a determined probability that a stack of the particular quantity of barrier layers is independent of at least a certain quantity of continuous permeation pathways through the stack.

Abstract: Disclosed is a light emitting diode package that includes: a frame having a light emitting diode (LED) thereon; and a glass cell over the LED, the glass cell including a quantum dot dispersed in one of a resin and an organic solvent.

Abstract: A light-emitting device includes a circuit board including a wiring on a surface of a substrate, the wiring including a raised portion, and a light-emitting element mounted on the raised portion. When the light-emitting element is of a flip-chip type, an element electrode thereof is connected to the raised portion such that an edge of the element electrode on an outer periphery side of the light-emitting element is located outside of the raised portion in a top view and an exposed portion of the element electrode is covered with a white or transparent resin. When the light-emitting element is of a face-up type, an element substrate thereof is bonded to the raised portion such that the raised portion is located inside the element substrate in the top view and an exposed portion of a bottom surface of the element substrate is covered with a white resin.

Abstract: A display apparatus includes a substrate, a circuit, and a pixel electrode. The substrate includes a display area and a peripheral area outside the display area. The circuit is disposed in the display area. The circuit includes a plurality of conductive layers, and each conductive layer contacts a corresponding inorganic layer arranged directly below the each conductive layer. The pixel electrode is arranged over the circuit and is electrically connected to at least one of the conductive layers.

Abstract: Integrated multilayer structure (100, 400) for hosting electronics, comprising a first substrate (102) comprising organic, electrically substantially insulating natural material including and exhibiting a related naturally grown or natural textile based surface texture, said first substrate having a first side (102A) facing a predefined front side of the structure, said first side of the first substrate being optionally configured to face a user and/or use environment of the structure or of its host device, and an opposite second side (102B), a plastic layer (112), optionally comprising thermoplastic or thermoset plastics, molded onto said second side of the first substrate so as to at least partially cover it, and circuitry (104, 104B) provided on the second side of the first substrate, said circuitry being at least partially embedded in the molded material of the plastic layer. Related method of manufacture is presented.

Abstract: The present disclosure relates to a display device and a method of producing the same. In an embodiment, the display device includes: a base substrate; a cover plate opposite to the base substrate; and a first frame sealant, the cover plate is bonded to the base substrate at least by the first frame sealant, at least one groove is provided in a bonding region of at least one of the base substrate and the cover plate, and at least a part of the first frame sealant is disposed in the groove.

Abstract: Provided is a light-emitting device of which a resin frame serving as a dam of a sealing resin is not readily deformed. The light-emitting device includes: a planar lead frame configured from first and second metal portions which are spaced apart from each other with an insulating resin interposed therebetween; light-emitting elements mounted on the first metal portion and electrically connected by wires to the first and second metal portions; a first resin frame disposed on the lead frame so as to enclose the light-emitting elements; a sealing resin containing a phosphor for converting the wavelength of light emitted from the light-emitting elements, the sealing resin being filled into a region on the lead frame enclosed by the first resin frame to seal the light-emitting elements; and a second resin frame being harder than the first resin frame and covering an outer surface of the first resin frame at an outer edge of the lead frame.

Abstract: A manufacturing method of a liquid crystal display device including a first substrate and a second substrate each including a flexible board, the manufacturing method includes a first step of forming the flexible board by forming, in a first region on a glass substrate, a first resin unit made of a first resin having a property of absorbing infrared light and forming, in a second region on the glass substrate, a second resin unit made of a second resin smaller in infrared absorptivity than the first resin; and a second step of, subsequent to the first step, irradiating the first resin unit with infrared light to cut a portion corresponding to the first region in the flexible board.

Abstract: Methods for manufacturing a display device are provided. A representative method includes: providing a substrate having a plurality of sub-pixel locations; providing a carrier substrate supporting a plurality of light emitting diodes (LEDs); transferring the plurality of LEDs from the carrier substrate to the substrate; and fixing the plurality of LEDs with respect to the substrate. The method also may include: positioning the substrate within a chamber; and providing an insulator over the substrate.

Abstract: A display (100) comprising a plurality of LED chips (604), each LED chip (604) comprising a plurality of light emitting elements (606a-c). Each LED chip (604) is arranged such that a first light emitting element (606a) is configured to illuminate a sub-pixel, and a second light emitting element (606b) is configured to illuminate a sub-pixel using substantially the same wavelength of light as the first light emitting element. There is also described an LED chip, a display pixel, a controlling method, a computer device and a computer program for a display.

Abstract: An LED package allows a fluorescent material to be uniformly distributed around an LED chip on a base when a filling space inside a transparent wall surrounding the LED chip is filled with the fluorescent material. The LED package includes a base, at least one LED chip mounted on the base, a transparent wall formed on the base and having a filling space around the LED chip, and a fluorescent material, with which the filling space is filled to cover the LED chip.

Abstract: The light-emitting device includes a first light-emitting element having an emission peak wavelength of 430 nm or more and less than 490 nm, a second light-emitting element having an emission peak wavelength of 490 nm or more and 570 nm or less, a support body at which the first light-emitting element and the second light-emitting element are disposed, and a light-transmissive member containing a red phosphor and covering the first light-emitting element and the second light-emitting element. A content density of the red phosphor in the light-transmissive member in a space between the first and second light-emitting elements is higher in a part below an upper surface of the second light-emitting element than in a part above the upper surface thereof.

Abstract: An organic light-emitting display apparatus, including a substrate; a first electrode on the substrate; a second electrode on the first electrode; a first organic emissive layer between the first electrode and the second electrode, the first organic emissive layer to emit a first light; a second organic emissive layer between the first electrode and the second electrode, the second organic emissive layer to emit a second light having a different color from the first light; an auxiliary layer on the second electrode, the auxiliary layer having a refractive index equal to or higher than about 2.2; and a charging layer on the auxiliary layer.

Abstract: Provided is an encapsulation structure for a transparent flexible organic electronic device, the encapsulation structure including a flexible substrate, and at least one hybrid unit structure provided on at least one surface of the flexible substrate and including a zinc oxide thin film, an aluminum oxide thin film, and a magnesium oxide thin film stacked on one another.

Abstract: An exposure head according to one or more embodiments may include: a light emitting element board on which light emitting elements are arranged; a holder that holds the light emitting element board and is provided with an opening; a transparent cover arranged at a position to shield the opening, such that a first attachment surface of the holder is attached to a second attachment surface of the transparent cover by using an adhesive; and an optical system arranged between the light emitting element board and the transparent cover. The exposure head satisfies an expression defined as ?1<?2, where ?1 is a contact angle on the first attachment surface representing wettability of the first attachment surface, and ?2 is a contact angle on the second attachment surface representing wettability of the second attachment surface.

Abstract: A foldable display device comprises a display panel; and a backplate attached to a side of the display panel and including a hard layer and first and second soft layer attached on lower and upper surfaces of the hard layer, respectively, wherein the hard layer has a difference in a distance from a reference line in a center portion and a first edge portion.

Abstract: Provided is a light-emitting device in which a light-emitting region is increased in size without decreasing the yield. This light-emitting device includes a central light-emitting unit, and a plurality of peripheral light-emitting units arranged to fill a periphery of the central light-emitting unit, wherein each of the central light-emitting unit and the peripheral light-emitting units includes a substrate and light-emitting elements mounted on the substrate, and an area of the light-emitting region of each of the peripheral light-emitting units is equal to or smaller than an area of the light-emitting region of the central light-emitting unit.

Abstract: An apparatus comprises a device substrate having an upper surface. An anchor opening exists in the device substrate. The apparatus also comprises a lid layer disposed over the upper surface of a frame layer. The lid layer and the frame layer each comprise a photodefinable polymer material. The apparatus also comprises a compartment in the frame layer. The lid layer provides a cover for the compartment, and a portion of the frame layer is disposed in the anchor opening.

Abstract: A method of fabricating a semiconductor device is provided. A hybrid bonded structure is provided. A cover lid comprising a base portion and at least one dummy portion protruding from the base portion is provided. The at least one dummy portion of the cover lid is bonded to the hybrid bonding structure. The base portion is removed. A redistribution structure over the hybrid bonding structure and the at least one dummy portion is formed.

Abstract: An embodiment relates to an ultraviolet light-emitting device, a method for manufacturing an ultraviolet light-emitting device, a light-emitting device package and an illumination apparatus. The ultraviolet light-emitting device includes a first conductive-type semiconductor layer; an active layer comprising a plurality of quantum walls and a plurality of quantum wells and disposed on the first conductive-type semiconductor layer; a second conductive-type first semiconductor layer disposed on the active layer; an electron blocking layer disposed between the active layer and the second conductive-type first semiconductor layer; and a second conductive-type second semiconductor layer disposed between the last quantum wall of the active layer and the electron blocking layer, wherein the second conductive-type second semiconductor layer includes a p-type Alx1Ga1-x1N layer (0?x1?1) and a p-type InyAlx2Ga1-y-x2N layer (0?x2?1, 0?y?1, 0?x2+y?1).

Abstract: A light-emitting device including a lamp cover, a transparent front cover, a light-emitting element, a radiation layer and a reflective layer is provided. The transparent front cover and the lamp cover are combined together and form a cavity therein. The light-emitting element is disposed on the lamp cover and located within the cavity. The light-emitting element is used for emitting a light towards the transparent front cover. The radiation layer is formed on the lamp cover and the reflective layer is formed on the radiation layer.

Abstract: Disclosed is an organic light-emitting diode structure which includes a substrate, an optically-modified layer, a planarization layer, a pixel definition layer, and an organic light-emitting layer. The optically-modified layer can improve non-uniform luminance of OLEDs manufactured based on the ink-jet printing technology.

Abstract: An optoelectronic semiconductor device, a method for manufacturing an optoelectronic semiconductor device and light source having an optoelectronic semiconductor device are disclosed.

Abstract: Disclosed is a PCB used in multifunctional LED applications, having an electronic side with circuit components and a LED side with lighting components; which has at least one metal surface coated on the ground of the mentioned electronic side, at least one metal surface coated on the ground of the mentioned LED surface, or at least one pipe located in the inner cross-section of the mentioned PCB in order to reduce the heating generated on the mentioned PCB by dissipating it over the surface of board.

Abstract: A display device includes a display panel and a backlight assembly. A light source unit of the backlight assembly includes a light source board including a conductive pattern, a light emitting chip on the light source board and electrically connected to the conductive pattern, a wavelength conversion member covering the light emitting chip and converting a wavelength of light emitted from the light emitting chip; and diffusion particles in the wavelength conversion member. The light emitting chip includes a rear surface facing the light source board, a top surface opposite to the rear surface and a side surface connecting the rear surface to the top surface. A density of the diffusion particles in the wavelength conversion member at the top surface of the light emitting chip is greater than a density of the diffusion particles in the wavelength conversion member at the side surface of the light emitting chip.

Abstract: An LED filament, including: a strip substrate having two ends, a plurality of LED chips, metal strip electrodes, and a plurality of electronic devices. The plurality of LED chips is disposed on the strip substrate and connected in series to form an LED light source. The metal strip electrodes are disposed on the two ends of the strip substrate. The plurality of electronic devices is disposed on the strip substrate in the vicinity of one end of the strip substrate or in the vicinity of two ends of the strip substrate. The metal strip electrodes are connected to the electronic devices and the LED light source via leads. The strip substrate, the LED light source, the electronic devices, and joints between the strip substrate and the metal strip electrodes are coated with fluorescent glue.

Abstract: A light emitting device package can include a base including a flat top surface; first and second electrical circuit components disposed on the flat top surface of the base; a light emitting diode disposed on the flat top surface of the base, an optical member comprising a light transmissive material; and a guiding member disposed on the flat top surface of the base and having a closed loop shape for guiding the optical member, in which the first and second electrical circuit components respectively include first and second portions disposed between the flat top surface of the base and a bottom surface of the guiding member, the first electrical circuit component includes a first extension portion that extends from the first portion to a first location outside of an outer edge of the guiding member in a first direction, and a second extension portion that extends from the first extension portion to a second location outside of the outer edge of the guiding member in a second direction different than the first

Abstract: An optic configured to create an asymmetric pattern of illumination includes a cavity defined by a sidewall. The cavity is oriented to receive light emitted by a light source that is disposed adjacent a light source receiving end of the cavity. Further, the optic includes a totally internally reflective surface that extends circumferentially about the sidewall and is tapered, so as to reflect emitted light that passes through the sidewall of the cavity and into a body of the optic. The totally internally reflective surface can have a form that is different on opposing sides of the cavity. Furthermore, the optic includes a convex surface that is disposed at a light emitting end of the sidewall to condense, focus, or collimate emitted light from the light source.

Abstract: A cover for an electronic package is manufactured by placing an optical insert, having opposite faces and configured to allow light radiation to pass therethrough, between two opposite faces of a cavity of a mold in a position such that said optical faces of the optical insert make contact with said opposite faces of the cavity of the mold. A coating material is injected into the cavity and around the optical insert. The coating material is set to obtain a substrate that is overmolded around the optical insert so as to produce the cover. An electronic package includes an electronic chip mounted to a support substrate with the cover formed by the overmolded substrate mounted to the support substrate.

Abstract: A device with a light signaling function including a light-emitting diode designed to emit a first light signal in a first wavelength range in the blue or the ultraviolet, conversion device arranged for converting the first light signal emitted by the light-emitting diode in the first wavelength range into a second light signal in a second wavelength range, a cap arranged for filtering the second light signal with a view to obtaining a color included in a standard color space. The conversion device being chosen so the second wavelength range includes the normal color space.

Abstract: A semiconductor power module includes: an insulating substrate including a concave portion provided on a top surface of the insulating substrate; a substrate electrode embedded in the concave portion; a semiconductor device bonded onto the substrate electrode; and an insulating resin covering a top end part of the substrate electrode.

Abstract: This light flux control member has an incidence surface and an emission surface. The emission surface includes a first emission surface projecting toward the back side and disposed so as to cross the central axis, and a second emission surface projecting toward the front side and disposed so as to surround the first emission surface. When the light-emitting element is disposed so as to face the recessed part such that a light emission center thereof is located on the central axis, and a surface to be irradiated is disposed above the emission surface so as to lie at right angles to the central axis, a second maximum value calculated by a predetermined expression is larger than a first maximum value calculated by a predetermined expression.

Abstract: An LED module for increasing effective wavelengths output includes a light emission unit configured to be supplied with electric energy to generate light; and a frame unit where an installation space for installing the light emission unit is formed, and that absorbs electromagnetic waves being generated in the light emission unit. During operation, harmful electromagnetic waves other than the effective waves beneficial to human body may be absorbed. Accordingly, even when the human body is exposed to the LED module for a long period of time, the side effects caused by the electromagnetic waves can be minimized.

Abstract: A method of producing at least one connection carrier includes: A) providing a carrier plate with a planar top face; B) applying at least one electrically insulating insulation strip to the top face and cohesively connecting the carrier plate and the insulation strip; and C) applying at least one electrically conductive conductor strip to an adhesive surface of the insulation strip and cohesively connecting the insulation strip and the conductor strip, wherein the conductor strip and the carrier plate are electrically insulated from one another by the insulation strip.

Abstract: A method for manufacturing an organic electroluminescent display device is provided, which includes the steps of: providing a lower support substrate and an upper support substrate; making a lower flexible substrate and an organic electroluminescent device layer on the lower support substrate sequentially, making an upper flexible substrate and an adhesive layer on the upper support substrate sequentially; aligning the lower support substrate and the upper support substrate, to thereby attach the adhesive layer and the organic electroluminescent device layer; and peeling the lower support substrate and the upper support substrate. An organic electroluminescent display device made by the above manufacturing method is also provided.