Acoustic Wave Patents (Class 257/416)
  • Patent number: 9070879
    Abstract: In the method for monitoring flexural vibrations of a piezoactuator, a small-signal spectrum of a piezoactuator, which is provided and mounted for the purpose of exciting longitudinal vibrations, is measured and an excitation of a transverse vibration in the piezoactuator is detected from resonances occurring in the small-signal spectrum.
    Type: Grant
    Filed: September 2, 2011
    Date of Patent: June 30, 2015
    Assignee: EPCOS AG
    Inventor: Reinhard Gabl
  • Patent number: 9064901
    Abstract: Methods and structures for fabricating fins for multigate devices are disclosed. In accordance with one method, a plurality of sidewalls are formed in or on a plurality of mandrels over a semiconductor substrate such that each of the mandrels includes a first sidewall composed of a first material and a second sidewall composed of a second material that is different from the first material. The first sidewall of a first mandrel of the plurality of mandrels is selectively removed. In addition, a pattern composed of remaining sidewalls of the plurality of sidewalls is transferred onto an underlying layer to form a hard mask in the underlying layer. Further, the fins are formed by employing the hard mask and etching semiconducting material in the substrate.
    Type: Grant
    Filed: December 23, 2013
    Date of Patent: June 23, 2015
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Hong He, Chiahsun Tseng, Chun-Chen Yeh, Yunpeng Yin
  • Patent number: 9051174
    Abstract: Method for producing an MST device, and MST device A method for producing an electromechanical transducer is described, wherein an MST component is arranged in a container, and the container is closed with a cover layer, wherein the cover layer is provided with at least one cutout which divides the cover layer into an inner region and an outer region in such a way that both the inner region and the outer region are connected to the top side—facing the cover layer—of the MST component, and the inner region is lifted off while the outer region remains adhered.
    Type: Grant
    Filed: July 6, 2009
    Date of Patent: June 9, 2015
    Assignee: EPCOS AG
    Inventors: Wolfgang Pahl, Gregor Feiertag
  • Publication number: 20150145078
    Abstract: A semiconductor package includes a semiconductor die having a first main side and a second main side opposite the first main side, the first main side having an inner region surrounded by a periphery region. The semiconductor package further includes a film covering the semiconductor die and adhered to the periphery region of the first main side of the semiconductor die. The film has a curved surface so that the inner region of the first main side of the semiconductor die is spaced apart from the film by an air gap. Electrical conductors are attached at a first end to pads at the periphery region of the first main side of the semiconductor die. A corresponding method of manufacture is also provided.
    Type: Application
    Filed: November 26, 2013
    Publication date: May 28, 2015
    Inventor: Chee Yang Ng
  • Publication number: 20150145079
    Abstract: In one embodiment, a method of manufacturing a semiconductor device includes oxidizing a substrate to form local oxide regions that extend above a top surface of the substrate. A membrane layer is formed over the local oxide regions and the top surface of the substrate. A portion of the substrate under the membrane layer is removed. The local oxide regions under the membrane layer is removed.
    Type: Application
    Filed: February 2, 2015
    Publication date: May 28, 2015
    Inventors: Alfons Dehe, Stefan Barzen, Wolfgang Friza, Wolfgang Klein
  • Publication number: 20150137284
    Abstract: There are provided a microphone package and a mounting structure thereof, allowing for an increase in a back volume, the microphone package including: a package substrate; an acoustic element mounted on the package substrate and having a space formed in a lower portion thereof; and at least one electronic component mounted on the package substrate and having a space formed in a lower portion thereof, wherein the package substrate includes an acoustic volume connecting the space of the acoustic element and the space of the electronic component.
    Type: Application
    Filed: May 2, 2014
    Publication date: May 21, 2015
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Heung Woo PARK, Jong Woo HAN, Tae Hyun KIM
  • Publication number: 20150137285
    Abstract: A capacitive micromachined ultrasonic transducer and a method of fabricating the same are provided. The capacitive micromachined ultrasonic transducer includes a device substrate including a first trench defining a plurality of first portions corresponding to an element and a second trench spaced apart from the first trench; a supporting unit provided on the device substrate, the supporting unit defining a plurality of cavities; a membrane provided on the supporting unit to cover the plurality of cavities; a top electrode electrically connected to a second portion in the second trench through a via hole penetrating through the membrane and the supporting unit; and a through silicon via (TSV) substrate provided on a bottom surface of the device substrate, the TSV substrate including a first via metal connected to the plurality of first portions corresponding to the element and a second via metal connected to the second portion.
    Type: Application
    Filed: May 23, 2014
    Publication date: May 21, 2015
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong-sik SHIM, Seog-woo HONG, Seok-whan CHUNG, Chang-jung KIM
  • Publication number: 20150135841
    Abstract: Provided are a capacitive transducer that can make a sealing film thickness necessary to seal a gap smaller and can enhance performance such as a wider bandwidth, and a method of manufacturing the capacitive transducer. The capacitive transducer including cells each including a vibration film including a second electrode that is provided with a gap from a first electrode can be manufactured in the following manufacturing method. A convex part is formed on the first electrode, a sacrifice layer having a thickness larger than the thickness of the convex part is formed on the first electrode and the convex part, and a membrane is formed on the sacrifice layer. Further, an etching hole is formed in the membrane at a position above the convex part, the sacrifice layer is etched through the etching hole, and the etching hole is sealed by a sealing layer.
    Type: Application
    Filed: October 27, 2014
    Publication date: May 21, 2015
    Inventor: Kazuhiko Kato
  • Patent number: 9035451
    Abstract: The present disclosure relates to a method of forming a plurality of MEMs device having a plurality of cavities with different pressures on a wafer package system, and an associated apparatus. In some embodiments, the method is performed by providing a work-piece having a plurality of microelectromechanical system (MEMs) devices. A cap wafer is bonded onto the work-piece in a first ambient environment having a first pressure. The bonding forms a plurality of cavities abutting the plurality of MEMs devices, which are held at the first pressure. One or more openings are formed in one or more of the plurality of cavities leading to a gas flow path that could be held at a pressure level different from the first pressure. The one or more openings in the one or more of the plurality of cavities are then sealed in a different ambient environment having a different pressure, thereby causing the one or more of the plurality of cavities to be held at the different pressure.
    Type: Grant
    Filed: September 30, 2013
    Date of Patent: May 19, 2015
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yu-Chia Liu, Chia-Hua Chu, Kuei-Sung Chang, Chun-Wen Cheng
  • Publication number: 20150129992
    Abstract: Disclosed herein are a microelectromechanical systems (MEMS) microphone with a dual-back plate, and a method of manufacturing the same. The MEMS microphone according to an exemplary embodiment of the present invention includes: a substrate having a first back plate formed at a central portion thereof; a membrane plate disposed on first support parts formed at both sides on the substrate and vibrated depending on external sound pressure; and a second back plate disposed on second support parts formed at both sides of the membrane plate.
    Type: Application
    Filed: November 29, 2012
    Publication date: May 14, 2015
    Applicant: KOREA INSTITUTE OF MACHINERY MATERIALS
    Inventors: Shin Hur, Young Do Jung, Young Hwa Lee, Jun Hyuk Kwak, Chang-Hyeon JI
  • Patent number: 9029962
    Abstract: A molded ring includes a molded cavity of a molded cavity substrate MEMS package. The molded ring is formed by molding a dielectric material directly upon a substrate. As molding is a relatively simple and low cost process, the molded ring and thus molded cavity are formed at a minimal cost. This, in turn, minimizes the cost of the molded cavity substrate MEMS package.
    Type: Grant
    Filed: October 12, 2011
    Date of Patent: May 12, 2015
    Assignee: Amkor Technology, Inc.
    Inventors: Mahmoud Dreiza, Andrew Ballantine, Russell Scott Shumway
  • Patent number: 9029179
    Abstract: A method for producing a MEMS device having improved charge elimination characteristics includes providing a substrate having one or more layers, and applying a first charge elimination layer onto at least one portion of one given layer of the substrate. The method may then (1) apply a sacrificial layer onto the first charge elimination layer, (2) apply a second charge elimination layer onto at least a portion of the sacrificial layer, and (3) deposit a movable layer onto at least a portion of the second charge elimination layer. To form a structure within the movable layer the method may etch the movable layer. The method may then etch the sacrificial layer to release the structure.
    Type: Grant
    Filed: June 28, 2012
    Date of Patent: May 12, 2015
    Assignee: Analog Devices, Inc.
    Inventors: Fang Liu, Kuang L. Yang
  • Patent number: 9029963
    Abstract: Mechanical resonating structures, as well as related devices and methods of manufacture. The mechanical resonating structures can be microphones, each including a diaphragm and a piezoelectric stack. The diaphragm can have one or more openings formed therethrough to enable the determination of an acoustic pressure being applied to the diaphragm through signals emitted by the piezoelectric stack.
    Type: Grant
    Filed: September 24, 2013
    Date of Patent: May 12, 2015
    Assignee: Sand 9, Inc.
    Inventors: Andrew Sparks, Todd M. Borkowski
  • Patent number: 9024396
    Abstract: A device includes a support structure, a sound port disposed in the support structure, and a MEMS structure including a membrane acoustically coupled to the sound port. The membrane separates a first space contacting a first side of the membrane from a second space contacting an opposite second side of the membrane. The device further includes an adjustable ventilation path disposed in the support structure and extending from the sound port to the second space.
    Type: Grant
    Filed: July 12, 2013
    Date of Patent: May 5, 2015
    Assignee: Infineon Technologies AG
    Inventor: Alfons Dehe
  • Patent number: 9013013
    Abstract: A pressure sensor package includes a pressure sensor having a first side with a pressure sensor port, a second side opposite the first side, and electrical contacts. A logic die stacked on the pressure sensor has a first side attached to the second side of the pressure sensor and a second side opposite the first side with electrical contacts. The logic die is laterally offset from the electrical contacts of the pressure sensor and operable to process signals from the pressure sensor. Electrical conductors connect the electrical contacts of the pressure sensor to the electrical contacts of the logic die. Molding compound encapsulates the pressure sensor, the logic die and the electrical conductors, and has an opening defining an open passage to the pressure sensor port. External electrical contacts are provided at a side of the pressure sensor package.
    Type: Grant
    Filed: December 6, 2013
    Date of Patent: April 21, 2015
    Assignee: Infineon Technologies AG
    Inventors: Sebastian Beer, Helmut Wietschorke, Jochen Dangelmaier, Horst Theuss
  • Publication number: 20150102436
    Abstract: A MEMS lead frame package body encloses a MEMS device enclosed in an internal cavity formed by the mold body and cover. A conductive internal shell with a connection window sits in the cavity. The MEMS device is mounted in the shell and electrically coupled to the lead frame through wire bonds directed through the connection window. To accommodate a MEMS microphone, an acoustic aperture extends through the mold body aligned with a hole in the internal shell.
    Type: Application
    Filed: December 19, 2014
    Publication date: April 16, 2015
    Inventor: Thomas Goida
  • Publication number: 20150102435
    Abstract: A MEMS microphone. The microphone includes a backplate, a membrane, and a plurality of antennas. The backplate has a plurality of acoustic apertures. The membrane is parallel to the backplate and is positioned a distance from the backplate. The plurality of antennas are connected to the membrane and extend toward the backplate. In addition, the plurality of antennas are positioned entirely within spaces defined by the plurality of acoustic apertures.
    Type: Application
    Filed: October 14, 2014
    Publication date: April 16, 2015
    Inventor: John W. Zinn
  • Patent number: 9006845
    Abstract: A MEMS device, a method of making a MEMS device and a system of a MEMS device are shown. In one embodiment, a MEMS device includes a first polymer layer, a MEMS substrate disposed on the first polymer layer and a MEMS structure supported by the MEMS substrate. The MEMS device further includes a first opening disposed in the MEMS substrate and a second opening disposed in the first polymer layer.
    Type: Grant
    Filed: January 16, 2013
    Date of Patent: April 14, 2015
    Assignee: Infineon Technologies, A.G.
    Inventor: Alfons Dehe
  • Publication number: 20150091108
    Abstract: The present disclosure provides a package structure and a manufacturing method. The package structure includes a substrate, a cover, a conductive pattern, and a sensing component. The cover is disposed on the substrate. The cover and the substrate define an accommodation space. The conductive pattern includes a conductive line. The conductive line is disposed on an internal surface of the cover exposed by the accommodation space, and is electrically connected to the substrate. The sensing component is disposed on the internal surface of the cover, and is electrically connected to the conductive line.
    Type: Application
    Filed: September 29, 2014
    Publication date: April 2, 2015
    Inventors: Ching-Han HUANG, Lu-Ming LAI
  • Patent number: 8995694
    Abstract: A Microelectromechanical System (MEMS) microphone includes a printed circuit board, a MEMS die, and an integrated circuit. The MEMS die is disposed on a top surface of the printed circuit board. The integrated circuit is disposed at least partially within the printed circuit board and produces at least one output signal. The output signals of the integrated circuit are routed directly into at least one conductor to access pads at the printed circuit board and the access pads are disposed on a bottom surface of the printed circuit board that is opposite the top surface.
    Type: Grant
    Filed: January 31, 2013
    Date of Patent: March 31, 2015
    Assignee: Knowles Electronics, LLC
    Inventors: Sandra F. Vos, Daniel Giesecke
  • Publication number: 20150086050
    Abstract: A micro-electromechanical chip includes a substrate, a micro-electromechanical structure formed in the substrate, and a covering element that is positioned on a surface of the substrate and that is configured to protect the micro-electromechanical structure from at least one of outside contaminants and mechanical influences.
    Type: Application
    Filed: September 27, 2012
    Publication date: March 26, 2015
    Inventor: Ando Feyh
  • Publication number: 20150084053
    Abstract: Complementary metal oxide semiconductor (CMOS) ultrasonic transducers (CUTs) and methods for forming CUTs are described. The CUTs may include monolithically integrated ultrasonic transducers and integrated circuits for operating in connection with the transducers. The CUTs may be used in ultrasound devices such as ultrasound imaging devices and/or high intensity focused ultrasound (HIFU) devices.
    Type: Application
    Filed: December 5, 2014
    Publication date: March 26, 2015
    Applicant: Butterfly Network, Inc.
    Inventors: Jonathan M. Rothberg, Keith G. Fife, Tyler S. Ralston, Gregory L. Charvat, Nevada J. Sanchez
  • Patent number: 8987844
    Abstract: A MEMS capacitive transducer with increased robustness and resilience to acoustic shock. The transducer structure includes a flexible membrane supported between a first volume and a second volume, and at least one variable vent structure in communication with at least one of the first and second volumes. The variable vent structure includes at least one moveable portion which is moveable in response to a pressure differential across the moveable portion so as to vary the size of a flow path through the vent structure. The variable vent may be formed through the membrane and the moveable portion may be a part of the membrane, defined by one or more channels, that is deflectable away from the surface of the membrane. The variable vent is preferably closed in the normal range of pressure differentials but opens at high pressure differentials to provide more rapid equalization of the air volumes above and below the membrane.
    Type: Grant
    Filed: February 10, 2014
    Date of Patent: March 24, 2015
    Assignee: Cirrus Logic International (UK) Limited
    Inventors: Colin Robert Jenkins, Tsjerk Hans Hoekstra, Euan James Boyd
  • Patent number: 8987843
    Abstract: A method and system to map density and temperature of a chip, in situ, is disclosed. The method includes measuring a propagation time that a mechanical propagation wave travels along at least one predefined path in a substrate. The method further includes calculating an average substrate density and temperature along the at least one predefined path as a function of the propagation time and distance. The method further includes determining a defect or unauthorized modification in the substrate based on the average substrate density being different than a baseline substrate density.
    Type: Grant
    Filed: November 6, 2012
    Date of Patent: March 24, 2015
    Assignee: International Business Machines Corporation
    Inventors: Jerome L. Cann, David P. Vallett
  • Patent number: 8987842
    Abstract: A MEMS device includes a silicon substrate and a structural dielectric layer. The silicon substrate has a cavity. The structural dielectric layer is disposed on the silicon substrate. The structural dielectric layer has a space above the cavity of the silicon substrate and holds a plurality of structure elements within the space, including: a conductive backplate, over the silicon substrate, having a plurality of venting holes and a plurality of protrusion structures on top of the conductive backplate; and a diaphragm, located above the conductive backplate by a distance, wherein a chamber is formed between the diaphragm and the conductive backplate, and is connected to the cavity of the silicon substrate through the venting holes. A first side of the diaphragm is exposed by the chamber and faces to the protrusion structures of the conductive backplate and a second side of the diaphragm is exposed to an environment space.
    Type: Grant
    Filed: September 14, 2012
    Date of Patent: March 24, 2015
    Assignee: Solid State System Co., Ltd.
    Inventors: Tsung-Min Hsieh, Chien-Hsing Lee, Jhyy-Cheng Liou
  • Publication number: 20150076629
    Abstract: There is provided a microphone including: a thin film member including leg members extended in a direction not in parallel with a vibration direction; first supports supporting first points of the leg members, respectively; and a piezoelectric member connected to second points of the leg members and converting vibrations of the thin film member into electrical signals.
    Type: Application
    Filed: November 15, 2013
    Publication date: March 19, 2015
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hwa Sun LEE, Byung Hun Kim, Yoon Sok Park
  • Publication number: 20150076627
    Abstract: A MEMS microphone with reduced parasitic capacitance is provided. A microphone includes a protection film covering a rim-sided area of the backplate.
    Type: Application
    Filed: November 14, 2011
    Publication date: March 19, 2015
    Inventors: Leif Steen Johansen, Jan Tue Ravnkilde, Pirmin Hermann Otto Rombach, Kurt Rasmussen
  • Publication number: 20150076628
    Abstract: An integrated device package includes a housing having a first opening and a second opening in fluid communication with an interior volume of the housing. A package substrate(s) has a first port and a second port. A first device die is mounted to the substrate(s) over the first port. A second device die is mounted to the substrate(s) over the second port. The substrate(s) is coupled to the housing to cover the first and second openings such that the first device die is disposed within the interior volume through the first opening and the second device die is disposed within the interior volume through the second opening.
    Type: Application
    Filed: September 17, 2013
    Publication date: March 19, 2015
    Applicant: Analog Devices, Inc.
    Inventors: David Bolognia, Vikram Venkatadri
  • Patent number: 8981501
    Abstract: A method of forming a semiconductor device is disclosed. Provided is a substrate having at least one MOS device, at least one metal interconnection and at least one MOS device formed on a first surface thereof. A first anisotropic etching process is performed to remove a portion of the substrate from a second surface of the substrate and thereby form a plurality of vias in the substrate, wherein the second surface is opposite to the first surface. A second anisotropic etching process is performed to remove another portion of the substrate from the second surface of the substrate and thereby form a cavity in the substrate, wherein the remaining vias are located below the cavity. An isotropic etching process is performed to the cavity and the remaining vias.
    Type: Grant
    Filed: April 25, 2013
    Date of Patent: March 17, 2015
    Assignee: United Microelectronics Corp.
    Inventors: Meng-Jia Lin, Chang-Sheng Hsu, Kuo-Hsiung Huang, Wei-Hua Fang, Shou-Wei Hsieh, Te-Yuan Wu, Chia-Huei Lin
  • Patent number: 8981535
    Abstract: Charge pump capacitor assemblies and methods of manufacturing the same. One charge pump capacitor assembly includes a charge pump capacitor and a silicon substrate. The charge pump capacitor includes: a silicon-based charge pump capacitor oxide layer, a first terminal on a first side of the silicon-based charge pump layer, a second terminal on a second side of the silicon-based charge pump capacitor oxide layer opposite the first side, and a field oxide layer mounted adjacent the second terminal. The charge pump capacitor is coupled to the silicon substrate. The silicon substrate is etched to reduce contact between the silicon substrate and the field oxide layer.
    Type: Grant
    Filed: September 27, 2013
    Date of Patent: March 17, 2015
    Assignee: Robert Bosch GmbH
    Inventor: John M. Muza
  • Patent number: 8981499
    Abstract: A MEMS chip package includes a first chip, a second chip, a first coupling element, and a first redistribution layer. The first chip has a first chip surface and a second chip surface, which is opposite the first chip surface. The second chip has a first chip surface and a second chip surface, which is opposite the first chip surface. The first coupling element couples the first chip surface of the second chip to the first chip surface of the first chip, so that a first cavity is defined between the first chip and the second chip. The first redistribution layer is mounted on the second chip surface of the second chip and is configured to provide contact with a substrate.
    Type: Grant
    Filed: November 21, 2012
    Date of Patent: March 17, 2015
    Assignee: Robert Bosch GmbH
    Inventors: Ricardo Ehrenpfordt, Mathias Bruendel, Andre Gerlach, Christina Leinenbach, Sonja Knies, Ando Feyh, Ulrike Scholz
  • Patent number: 8975713
    Abstract: Disclosed is an ultrasonic probe comprising: CMUT cells (13) that mutually convert ultrasonic waves and electrical signals; a semiconductor substrate (15) that has a plurality of the CMUT cells (13) formed on the surface thereof; an acoustic lens (3) that is provided on the front face side of the CMUT cells (13); and a backing layer (5) that is provided on the rear face side of the semiconductor substrate (15). The backing layer (5) is formed by a first backing layer (27) that makes contact with the semiconductor substrate, and a second backing layer (29) that is provided on the rear face side of the backing layer (27). The acoustic impedance of the backing layer (27) is set based on the sheet thickness of the semiconductor substrate (15). The backing layer (29) is formed by attenuating material capable of attenuating ultrasonic waves transmitted through the backing layer (27).
    Type: Grant
    Filed: January 5, 2012
    Date of Patent: March 10, 2015
    Assignee: Hitachi Medical Corporation
    Inventors: Akifumi Sako, Tomoko Takenaka, Kazunari Ishida
  • Patent number: 8975107
    Abstract: In one embodiment, a method of manufacturing a semiconductor device includes oxidizing a substrate to form local oxide regions that extend above a top surface of the substrate. A membrane layer is formed over the local oxide regions and the top surface of the substrate. A portion of the substrate under the membrane layer is removed. The local oxide regions under the membrane layer is removed.
    Type: Grant
    Filed: June 16, 2011
    Date of Patent: March 10, 2015
    Assignee: Infineon Techologies AG
    Inventors: Alfons Dehe, Stefan Barzen, Wolfgang Friza, Wolfgang Klein
  • Publication number: 20150061048
    Abstract: A packaged MEMS device may include an embedding arrangement, a MEMS device disposed in the embedding arrangement, a sound port disposed in the embedding arrangement and acoustically coupled to the MEMS device, and a grille within the sound port. Some embodiments relate to a sound transducer component including an embedding material and a substrate-stripped MEMS die embedded into the embedding material. The MEMS die may comprise a diaphragm for sound transduction. The sound transducer component may further comprise a sound port within the embedding material in fluidic or acoustic contact with the diaphragm. Further embodiments relate to a method for packaging a MEMS device or to a method for manufacturing a sound transducer component.
    Type: Application
    Filed: August 27, 2013
    Publication date: March 5, 2015
    Inventors: Irmgard Escher-Poeppel, Edward Fuergut, Alfons Dehe
  • Patent number: 8969980
    Abstract: A micro-electromechanical system (MEMS) device includes a housing and a base. The base includes a port opening extending therethrough and the port opening communicates with the external environment. The MEMS die is disposed on the base and over the opening. The MEMS die includes a diaphragm and a back plate and the MEMS die, the base, and the housing form a back volume. At least one vent extends through the MEMS die and not through the diaphragm. The at least one vent communicates with the back volume and the port opening and is configured to allow venting between the back volume and the external environment.
    Type: Grant
    Filed: September 20, 2012
    Date of Patent: March 3, 2015
    Assignee: Knowles Electronics, LLC
    Inventor: Sung Bok Lee
  • Patent number: 8969978
    Abstract: A pressure sensor system comprising a pressure sensor chip is disclosed. The pressure sensor chip comprises a sensing side where pressure sensing is performed and one or more interconnections where electrical connections are made at the other side of the chip. The pressure sensor comprising an integrated circuit (1) forming a substrate, the substrate comprising a membrane shaped portion adapted for being exposed to the pressure, the integrated circuit (1) comprising both pressure signal sensing components and pressure signal processing components.
    Type: Grant
    Filed: April 25, 2013
    Date of Patent: March 3, 2015
    Assignee: Melexis Technologies NV
    Inventors: Laurent Otte, Appolonius Jacobus Van Der Wiel
  • Publication number: 20150054098
    Abstract: The present invention concerns a MEMS microphone assembly (1) comprising a MEMS transducer element (2) comprising a MEMS die (3), a back plate (4) and a diaphragm (5) displaceable in relation to the back plate (4), and a sound inlet (16) for acoustically coupling the MEMS transducer element (2) to the exterior of the MEMS microphone assembly (1), wherein the MEMS die (3) comprises an indentation (17) that forms at least a part of the sound inlet (16). Further, the present invention concerns a method of manufacturing said MEMS microphone assembly (1).
    Type: Application
    Filed: May 2, 2012
    Publication date: February 26, 2015
    Applicant: Epcos AG
    Inventor: Jan Tue Ravnkilde
  • Publication number: 20150054097
    Abstract: A method for manufacturing a MEMS device includes providing a cavity within a layer adjacent to a sacrificial layer. The cavity extends to the sacrificial layer and includes a capillary slot protruding into the layer. The sacrificial layer is removed by exposing the sacrificial layer to an etching agent that is introduced through the cavity.
    Type: Application
    Filed: August 26, 2013
    Publication date: February 26, 2015
    Inventors: Alfons Dehe, Christoph Glacer, Soenke Pirk
  • Publication number: 20150041931
    Abstract: A microelectromechanical system (MEMS) apparatus includes a base. A MEMS device is disposed on the base. A cover encloses the MEMS device on the base. A port extends through the base, and the MEMS device is disposed over the port. A diaphragm is embedded within the base and has at least some portions that extend across the port. In an open position, the diaphragm allows the passage of sound energy from the exterior of the apparatus to the interior of the apparatus. In a closed position, the diaphragm makes contact with an outer surface of the port to at least partially block the passage of sound energy from the exterior of the apparatus to the interior of the apparatus.
    Type: Application
    Filed: August 7, 2014
    Publication date: February 12, 2015
    Inventors: John Szczech, Sung Bok Lee, John J. Albers, Vivian Gill, Brandon Harrington, Kurt Friel
  • Publication number: 20150041929
    Abstract: A packaged microphone has a base and a lid that at least in part form a package having a plurality of exterior sides and an interior chamber. The packaged microphone also has a flexible substrate having a first portion within the interior chamber, and a second portion, extending from the interior chamber, having at least two sets of pads. A MEMS microphone die is mounted to the first portion of the flexible substrate, and each set of pads is in electrical communication with the microphone die. One set of pads is on a first exterior side of the package, and a second set of pads is on a second exterior side of the package.
    Type: Application
    Filed: August 7, 2013
    Publication date: February 12, 2015
    Applicant: Invensense, Inc.
    Inventor: David Bolognia
  • Publication number: 20150041930
    Abstract: There is provided an acoustic transducer including: a substrate formed to have a hollow part through which acoustic waves are input; a diaphragm formed on the substrate and covering the hollow part; and a back plate disposed so as to cover at least a portion of the diaphragm, wherein a ring-shaped groove extended along an edge of the diaphragm is formed in the substrate.
    Type: Application
    Filed: November 14, 2013
    Publication date: February 12, 2015
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jong Beom Kim, Yoon Sok Park, Jung Won Lee, Hyun Ho Lim, Byeong Sung Min
  • Patent number: 8952468
    Abstract: In an acoustic sensor, a conductive vibrating membrane and a fixed electrode plate are disposed above a silicon substrate with an air gap provided therebetween, and the substrate has an impurity added to a surface thereof. A microphone includes an acoustic transducer; and an acquiring section that acquires a change in pressure as detected by the acoustic transducer. A method for manufacturing an acoustic transducer including a semiconductor substrate, a vibrating membrane, which is conductive, and a fixed electrode plate and detecting a pressure according to a change in capacitance between the vibrating membrane and the fixed electrode plate, the method includes an impurity adding step of adding an impurity to a surface of the semiconductor substrate; and a forming step of forming the vibrating membrane and the fixed electrode plate above the semiconductor substrate to which the impurity has been added.
    Type: Grant
    Filed: April 20, 2011
    Date of Patent: February 10, 2015
    Assignees: OMRON Corporation, STMicroelectronics Srl
    Inventors: Koichi Ishimoto, Yoshitaka Tatara, Shin Inuzuka, Sebastiano Conti
  • Publication number: 20150035094
    Abstract: A microphone assembly includes two MEMS components each having a micromechanical microphone structure, each microphone structure having: a diaphragm configured to be deflected by sound pressure and provided with at least one diaphragm electrode of a capacitor system; and a stationary acoustically permeable counter-element that acts as bearer for at least one counter-electrode of the capacitor system. The microphone assembly is configured such that under the action of sound the spacing between the diaphragm and the counter-element of the two microphone structures changes in opposite directions.
    Type: Application
    Filed: July 29, 2014
    Publication date: February 5, 2015
    Applicant: ROBERT BOSCH GMBH
    Inventors: Franz LAERMER, Ricardo EHRENPFORDT, Jochen ZOELLIN, Bill SCOTT, Jeff BERRYMAN
  • Patent number: 8946832
    Abstract: A representative filter comprises a silicon-on-insulator substrate having a top surface, a metal shielding positioned above the top surface of the silicon-on-insulator substrate, and a band-pass filter device positioned above the metal shielding. The band-pass filter device includes a first port, a second port, and a coupling metal positioned between the first and second ports.
    Type: Grant
    Filed: February 5, 2010
    Date of Patent: February 3, 2015
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chia-Chung Chen, Chewn-Pu Jou, Chin-Wei Kuo
  • Publication number: 20150028435
    Abstract: A method of packaging integrated circuits includes providing a molded substrate that has a plurality of first semiconductor dies and a plurality of second semiconductor dies laterally spaced apart from one another and covered by a molding compound. The molding compound is thinned to expose at least some of the second semiconductor dies. The exposed second semiconductor dies are removed to form cavities in the molded substrate. A plurality of third semiconductor dies are inserted in the cavities formed in the molded substrate, and electrical connections are formed to the first semiconductor dies and to the third semiconductor dies.
    Type: Application
    Filed: August 7, 2014
    Publication date: January 29, 2015
    Inventors: Ulrich Wachter, Dominic Maier, Thomas Kilger
  • Publication number: 20150028436
    Abstract: A system and a method for forming a packaged MEMS device are disclosed. In one embodiment a packaged MEMS device includes a MEMS device having a first main surface with a first area along a first direction and a second direction, a membrane disposed on the first main surface of the MEMS device and a backplate adjacent to the membrane. The packaged MEMS device further includes an encapsulation material that encapsulates the MEMS device and that defines a back volume, the back volume having a second area along the first direction and the second direction, wherein the first area is smaller than the second area.
    Type: Application
    Filed: October 15, 2014
    Publication date: January 29, 2015
    Inventors: Edward Fuergut, Horst Theuss, Rainer Leuschner
  • Patent number: 8941193
    Abstract: A simple and cost-effective manufacturing method for hybrid integrated components including at least one MEMS element, a cap for the micromechanical structure of the MEMS element, and at least one ASIC substrate, using which a high degree of miniaturization may be achieved. The micromechanical structure of the MEMS element and the cap are manufactured in a layered structure, proceeding from a shared semiconductor substrate, by applying at least one cap layer to a first surface of the semiconductor substrate, and by processing and structuring the semiconductor substrate proceeding from its other second surface, to produce and expose the micromechanical MEMS structure. The semiconductor substrate is then mounted with the MEMS-structured second surface on the ASIC substrate.
    Type: Grant
    Filed: April 24, 2013
    Date of Patent: January 27, 2015
    Assignee: Robert Bosch GmbH
    Inventors: Jens Frey, Frank Fischer
  • Publication number: 20150023523
    Abstract: A surface mountable microphone package comprises a first microphone and a second microphone. Furthermore, the surface mountable microphone package comprises a first opening for the first microphone and a second opening for the second microphone. The first opening and the second opening are arranged on opposite sides of the surface mountable microphone package.
    Type: Application
    Filed: October 28, 2013
    Publication date: January 22, 2015
    Inventors: Klaus Elian, Horst Theuss, Thomas Mueller
  • Publication number: 20150021721
    Abstract: A method of forming a packaged electronic device includes fabricating a MEMS structure, such as a BAW structure, on a first semiconductor wafer substrate; forming a cavity in a second semiconductor wafer substrate; and mounting the second substrate on the first substrate such that the MEMS structure is positioned inside the cavity in the second substrate. A wafer level assembly and an integrated circuit package are also described.
    Type: Application
    Filed: July 22, 2013
    Publication date: January 22, 2015
    Applicant: Texas Instruments Incorporated
    Inventors: Matthew David Romig, Marie-Solange Anne Milleron, Benjamin Michael Sutton
  • Publication number: 20150021722
    Abstract: A MEMS device includes a membrane comprising a first plurality of fingers. A counter electrode arrangement includes a second plurality of fingers disposed in a interdigitated relationship with the first plurality of fingers of the membrane. A deflector is configured to deflect the membrane such that the first and second plurality of fingers are displaced in a position excluding maximum overlapping of surfaces of the fingers.
    Type: Application
    Filed: July 22, 2013
    Publication date: January 22, 2015
    Inventors: Alfons Dehe, Mohsin Nawaz