Acoustic Wave Patents (Class 257/416)
  • Publication number: 20140299948
    Abstract: The present invention relates to a silicon based MEMS microphone, comprising a silicon substrate and an acoustic sensing part supported on the silicon substrate, wherein a mesh-structured back hole is formed in the substrate and aligned with the acoustic sensing part, the mesh-structured back hole includes a plurality of mesh beams which are interconnected with each other and supported on the side wall of the mesh-structure back hole, the plurality of mesh beams and the side wall define a plurality of mesh holes which all have a tapered profile and merge into one hole in the vicinity of the acoustic sensing part at the top side of the silicon substrate. The mesh-structured back hole can help to streamline the air pressure pulse caused, for example, in a drop test and thus reduce the impact on the acoustic sensing part of the microphone, and also serve as a protection filter to prevent alien substances such as particles entering the microphone.
    Type: Application
    Filed: December 29, 2011
    Publication date: October 9, 2014
    Applicant: Goertek Inc.
    Inventors: Zhe Wang, Mengjin Cai
  • Patent number: 8852985
    Abstract: Semiconductor nano pressure sensor devices having graphene membrane suspended over open cavities formed in a semiconductor substrate. A suspended graphene membrane serves as an active electro-mechanical membrane for sensing pressure, which can be made very thin, from about one atomic layer to about 10 atomic layers in thickness, to improve the sensitivity and reliability of a semiconductor pressure sensor device.
    Type: Grant
    Filed: August 31, 2012
    Date of Patent: October 7, 2014
    Assignee: International Business Machines Corporation
    Inventors: Jin Cai, Yanqing Wu, Wenjuan Zhu
  • Patent number: 8855337
    Abstract: The invention relates to a method for manufacturing a micromachined microphone and an accelerometer from a wafer 1 having a first layer 2, the method comprising the steps of dividing the first layer 2 into a microphone layer 5 and into an accelerometer layer 6, covering a front side of the microphone layer 5 and a front side of the accelerometer layer 6 with a continuous second layer 7, covering the second layer 7 with a third layer 8, forming a plurality of trenches 9 in the third layer 8, removing a part 10 of the wafer 1 below a back side of the microphone layer 5, forming at least two wafer trenches 11 in the wafer 1 below a back side of the accelerometer layer 6, and removing a part 12, 13 of the second layer 7 through the plurality of trenches 9 formed in the third layer 8. The micromachined microphone and the accelerometer according to the invention is advantageous over prior art as it allows for body noise cancellation in order to minimize structure borne sound.
    Type: Grant
    Filed: February 3, 2010
    Date of Patent: October 7, 2014
    Assignee: NXP, B.V.
    Inventors: Twan van Lippen, Geert Langereis, Martijn Goossens
  • Patent number: 8853800
    Abstract: An embodiment relates to a device integrated on a semiconductor substrate of a type comprising at least one first portion for the integration of at least one microfluidic system, and a second portion for the integration of an additional circuitry. The microfluidic system comprises at least one cavity realized in a containment layer of the integrated device closed on top by at least one portion of a polysilicon layer, this polysilicon layer being a thin layer shared by the additional circuitry and the closing portion of the cavity realizing a piezoresistive membrane for the microfluidic system.
    Type: Grant
    Filed: July 7, 2011
    Date of Patent: October 7, 2014
    Assignee: STMicroelectronics S.r.l.
    Inventors: Claudia Caligiore, Salvatore Leonardi, Salvatore Baglio, Bruno Ando′
  • Publication number: 20140291784
    Abstract: A microelectromechanical system (MEMS) microphone assembly includes a base and a cover. The cover is coupled to the base and together with the base defines a cavity. The base forms a recess and the recess has dimensions and a shape so as to hold a MEMS die. The MEMS die includes a diaphragm and back plate.
    Type: Application
    Filed: March 20, 2014
    Publication date: October 2, 2014
    Applicant: Knowles Electronics, LLC
    Inventor: Wade Conklin
  • Publication number: 20140291785
    Abstract: A microphone has a base substrate having a main surface, an acoustic sensor mounted on the main surface, and a circuit element that processes a signal output from the acoustic sensor. The acoustic sensor has a sensor substrate having a first surface opposed to the base substrate, a second surface on a side opposite to the first surface, and a cavity formed while piercing the sensor substrate from the first surface to the second surface, and a movable electrode that covers the cavity from the second surface side. A through-hole is formed in the base substrate while piercing the base substrate in a thickness direction to communicate with the cavity. The through-hole overlaps the sensor substrate when viewed in the thickness direction of the base substrate.
    Type: Application
    Filed: March 25, 2014
    Publication date: October 2, 2014
    Applicant: OMRON CORPORATION
    Inventors: Masaaki Kasai, Hidetoshi Nishio
  • Publication number: 20140291783
    Abstract: A microphone assembly includes a base, a cover, and a microelectromechanical system (MEMS) die. The cover extends at least partially over and is coupled to the base. The cover and the base form a cavity. The MEMS die is coupled to the base and disposed within the cavity. At least a portion of the cover is constructed of a copper-nickel-zinc alloy that is effective in preventing solder from moving from a first portion of the cover to a second portion of the cover.
    Type: Application
    Filed: March 20, 2014
    Publication date: October 2, 2014
    Applicant: Knowles Electronics, LLC
    Inventors: Dennis Talag, Kurt Friel, Tony Lim
  • Publication number: 20140291786
    Abstract: Substrate-side overload protection for the diaphragm structure of a microphone component having a micromechanical microphone structure which impairs the damping properties of the microphone structure as little as possible, in which the microphone structure includes a diaphragm structure having at least one acoustically active diaphragm which is formed in a diaphragm layer above a semiconductor substrate. The diaphragm structure spans at least one sound opening in the rear side of the substrate. A stationary, acoustically permeable counter element is formed in the layer structure of the component above the diaphragm layer. According to the invention, at least projections are formed at the outer edge area of the diaphragm structure which protrude beyond the edge area of the sound opening, so that the edge area of the sound opening acts as a substrate-side stop for the diaphragm structure.
    Type: Application
    Filed: July 20, 2012
    Publication date: October 2, 2014
    Inventors: Jochen Zoellin, Franz Laermer, Christoph Schelling, Mike Daley
  • Publication number: 20140291782
    Abstract: Methods and devices for packaging integrated circuits. A packaged device may include an integrated circuit, a first packaging component including a patterned surface, and a second packaging component. The patterned surface of the first packaging component may be adhesively coupled to a surface of the second packaging component or a surface of the integrated circuit. The integrated circuit may be at least partially enclosed between the first and second packaging components. A packaging method may include patterning a surface of a packaging component of an integrated circuit package. The surface of the packaging component may be for adhesively coupling to a second component to at least partially enclose an integrated circuit in the integrated circuit package.
    Type: Application
    Filed: March 29, 2013
    Publication date: October 2, 2014
    Applicant: STMicroelectronics Pte Ltd.
    Inventors: Kim-Yong Goh, Yiyi Ma, Wei Zhen Goh
  • Publication number: 20140291787
    Abstract: A structure of micro-electro-mechanical systems (MEMS) electroacoustic transducer is disclosed. The MEMS electroacoustic transducer includes a substrate having a MEMS device region, a diaphragm having openings and disposed in the MEMS device region, a silicon material layer disposed on the diaphragm and sealing the diaphragm, and a conductive pattern disposed beneath the diaphragm in the MEMS device region. Preferably, a first cavity is also formed between the diaphragm and the substrate.
    Type: Application
    Filed: June 18, 2014
    Publication date: October 2, 2014
    Inventors: Bang-Chiang Lan, Ming-I Wang, Li-Hsun Ho, Hui-Min Wu, Min Chen, Chien-Hsin Huang
  • Patent number: 8841737
    Abstract: A MEMS comprises a back-plate (7) having an inner portion (7a) and an outer portion (7b), the inner portion (7a) connected to the outer portion (7b) by a sidewall (7c). A raised section or anchor ring (60) is formed in the outer portion (7b) of the back-plate, in a region of the back-plate near the inner perimeter of the outer portion. The anchor ring may comprise angled sidewalls. The thickness of the back-plate may be greater than the thickness of the material supporting the anchor ring. Embodiments are also disclosed in which a membrane comprises a raised portion and an outer portion connected by an angled sidewall.
    Type: Grant
    Filed: September 18, 2008
    Date of Patent: September 23, 2014
    Assignee: Wolfson Microelectronics plc
    Inventors: Richard Ian Laming, Colin Robert Jenkins
  • Patent number: 8841734
    Abstract: A sensor element includes: a first substrate in which a diaphragm is configured on a main surface; a second substrate which is provided on the side opposite to the diaphragm of the first substrate; a cavity which is provided just below the diaphragm of the first substrate; a bonding position which is provided at a bonding position between the first substrate and the second substrate for airtight sealing of the cavity; and a bump portion which is provided at the fitting portion, and protects a fitted state between the first substrate and the second substrate.
    Type: Grant
    Filed: August 5, 2011
    Date of Patent: September 23, 2014
    Assignee: Mitsubishi Electric Corporation
    Inventor: Hiromoto Inoue
  • Patent number: 8841738
    Abstract: A MEMS microphone system suited for harsh environments. The system uses an integrated circuit package. A first, solid metal lid covers one face of a ceramic package base that includes a cavity, forming an acoustic chamber. The base includes an aperture through the opposing face of the base for receiving audio signals into the chamber. A MEMS microphone is attached within the chamber about the aperture. A filter covers the aperture opening in the opposing face of the base to prevent contaminants from entering the acoustic chamber. A second metal lid encloses the opposing face of the base and may attach the filter to this face of the base. The lids are electrically connected with vias forming a radio frequency interference shield. The ceramic base material is thermally matched to the silicon microphone material to allow operation over an extended temperature range.
    Type: Grant
    Filed: October 1, 2012
    Date of Patent: September 23, 2014
    Assignee: Invensense, Inc.
    Inventors: Kieran P. Harney, Jia Gao, Aleksey S. Khenkin
  • Publication number: 20140264652
    Abstract: An integrated MEMS acoustic sensor has a MEMS transducer and a programmable electronic interface. The programmable electronic interface includes non-volatile memory and is coupled to the MEMS transducer. Using programmable electrical functions, the programmable electronic interface is operable to sense variations in the MEMS transducer caused by application of an acoustic pressure to the MEMS transducer.
    Type: Application
    Filed: July 24, 2013
    Publication date: September 18, 2014
    Applicant: Invensense, Inc.
    Inventors: Baris Cagdaser, Martin Lim, Fariborz Assaderaghi
  • Publication number: 20140264655
    Abstract: In an integrated MEMS device, moving silicon parts with smooth surfaces can stick together if they come into contact. By roughening at least one smooth surface, the effective area of contact, and therefore surface adhesion energy, is reduced and hence the sticking force is reduced. The roughening of a surface can be provided by etching the smooth surfaces in gas, plasma, or liquid with locally non-uniform etch rate. Various etch chemistries and conditions lead to various surface roughness.
    Type: Application
    Filed: October 23, 2013
    Publication date: September 18, 2014
    Applicant: InvenSense, Inc.
    Inventors: Kirt Reed WILLIAMS, Kegang HUANG, Wencheng XU, Jongwoo SHIN, Martin LIM
  • Publication number: 20140264651
    Abstract: In accordance with an embodiment of the present invention, a method of forming a semiconductor device includes forming a sacrificial layer over a first surface of a workpiece having the first surface and an opposite second surface. A membrane is formed over the sacrificial layer. A through hole is etched through the workpiece from the second surface to expose a surface of the sacrificial layer. At least a portion of the sacrificial layer is removed from the second surface to form a cavity under the membrane. The cavity is aligned with the membrane.
    Type: Application
    Filed: March 14, 2013
    Publication date: September 18, 2014
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Alfons Dehe, Carsten Ahrens, Stefan Barzen, Wolfgang Friza
  • Publication number: 20140264656
    Abstract: A MEMS device is disclosed. The MEMS device comprises a first plate with a first surface and a second surface; and an anchor attached to a first substrate. The MEMS device further includes a second plate with a third surface and a fourth surface attached to the first plate. A linkage connects the anchor to the first plate, wherein the first plate and second plate are displaced in the presence of an acoustic pressure differential between the first and second surfaces of the first plate. The first plate, second plate, linkage, and anchor are all contained in an enclosure formed by the first substrate and a second substrate, wherein one of the first and second substrates contains a through opening to expose the first surface of the first plate to the environment.
    Type: Application
    Filed: February 6, 2014
    Publication date: September 18, 2014
    Applicant: InvenSense, Inc.
    Inventors: Erhan Polatkan ATA, Martin LIM, Xiang LI, Stephen LLOYD, Michael Julian DANEMAN
  • Publication number: 20140264658
    Abstract: A cell phone is provided having multiple sensors configured to detect and measure different parameters of interest. The cell phone includes at least one monolithic integrated multi-sensor (MIMS) device. The MIMS device comprises at least two sensors of different types formed on a common semiconductor substrate. For example, the MIMS device can comprise an indirect sensor and a direct sensor. The cell phone couples a first parameter to be measured directly to the direct sensor. Conversely, the cell phone can couple a second parameter to be measured to the indirect sensor indirectly. Other sensors can be added to the cell phone by stacking a sensor to the MIMS device or to another substrate coupled to the MIMS device. This supports integrating multiple sensors such as a microphone, an accelerometer, and a temperature sensor to reduce cost, complexity, simplify assembly, while increasing performance.
    Type: Application
    Filed: March 12, 2014
    Publication date: September 18, 2014
    Inventor: BISHNU PRASANNA GOGOI
  • Publication number: 20140270271
    Abstract: A MEMS acoustic transducer includes a substrate having a cavity therethrough, and a conductive back plate unit including a plurality of conductive perforated back plate portions which extend over the substrate cavity. A dielectric spacer arranged on the back plate unit between adjacent conductive perforated back plate portions, and one or more graphene membranes are supported by the dielectric spacer and extend over the conductive perforated back plate portions.
    Type: Application
    Filed: March 14, 2013
    Publication date: September 18, 2014
    Inventors: Alfons Dehe, Guenther Ruhl
  • Publication number: 20140264650
    Abstract: A microphone system includes a diaphragm suspended by springs and including a sealing layer that seals passageways which, if left open, would degrade the microphone's frequency response by allowing air to pass from one side of the diaphragm to the other when the diaphragm is responding to an incident acoustic signal. In some embodiments, the sealing layer may include an equalization aperture to allow pressure to equalize on both sides of the diaphragm.
    Type: Application
    Filed: March 12, 2013
    Publication date: September 18, 2014
    Applicant: Invensense, Inc.
    Inventors: Fang Liu, Kuang L. Yang
  • Publication number: 20140264654
    Abstract: MEMS microphone packages are described that include an ASIC integrated in the base substrate of the package housing. Methods of manufacturing the same and methods for separating individual microphone packages from wafer form assembly arrays are also described.
    Type: Application
    Filed: August 20, 2013
    Publication date: September 18, 2014
    Applicant: Robert Bosch GmbH
    Inventor: Jay Salmon
  • Publication number: 20140264657
    Abstract: An integrated circuit having an indirect sensor and a direct sensor formed on a common semiconductor substrate is disclosed. The direct sensor requires the parameter being measured to be directly applied to the direct sensor. Conversely, the indirect sensor can have the parameter being measured to be indirectly applied to the indirect sensor. The parameter being measured by the direct sensor is different than the parameter being measured by the indirect sensor. In other words, the direct sensor and indirect sensor are of different types. An example of a direct sensor is a pressure sensor. The pressure being measured by the pressure sensor must be applied to the pressure sensor. An example of an indirect sensor is an accelerometer. The rate of change of velocity does not have to be applied directly to the accelerometer. In one embodiment, the direct and indirect sensors are formed using photolithographic techniques.
    Type: Application
    Filed: March 12, 2014
    Publication date: September 18, 2014
    Inventor: BISHNU PRASANNA GOGOI
  • Publication number: 20140264653
    Abstract: A method embodiment includes providing a MEMS wafer. A portion of the MEMS wafer is patterned to provide a first membrane for a microphone device and a second membrane for a pressure sensor device. A carrier wafer is bonded to the MEMS wafer. The carrier wafer is etched to expose the first membrane and a first surface of the second membrane to an ambient environment. A MEMS structure is formed in the MEMS wafer. A cap wafer is bonded to a side of the MEMS wafer opposing the carrier wafer to form a first sealed cavity including the MEMS structure and a second sealed cavity including a second surface of the second membrane for the pressure sensor device. The cap wafer comprises an interconnect structure. A through-via electrically connected to the interconnect structure is formed in the cap wafer.
    Type: Application
    Filed: July 31, 2013
    Publication date: September 18, 2014
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Wen Cheng, Chia-Hua Chu
  • Publication number: 20140264659
    Abstract: A transportation device is provided having multiple sensors configured to detect and measure different parameters of interest. The transportation device includes at least one monolithic integrated multi-sensor (MIMS) device. The MIMS device comprises at least two sensors of different types formed on a common semiconductor substrate. For example, the MIMS device can comprise an indirect sensor and a direct sensor. The transportation device couples a first parameter to be measured directly to the direct sensor. Conversely, the transportation device can couple a second parameter to be measured to the indirect sensor indirectly. Other sensors can be added to the transportation device by stacking a sensor to the MIMS device or to another substrate coupled to the MIMS device. This supports integrating multiple sensors such as a microphone, an accelerometer, and a temperature sensor to reduce cost, complexity, simplify assembly, while increasing performance.
    Type: Application
    Filed: March 12, 2014
    Publication date: September 18, 2014
    Inventor: BISHNU PRASANNA GOGOI
  • Publication number: 20140264660
    Abstract: Complementary metal oxide semiconductor (CMOS) ultrasonic transducers (CUTs) and methods for forming CUTs are described. The CUTs may include monolithically integrated ultrasonic transducers and integrated circuits for operating in connection with the transducers. The CUTs may be used in ultrasound devices such as ultrasound imaging devices and/or high intensity focused ultrasound (HIFU) devices.
    Type: Application
    Filed: March 13, 2014
    Publication date: September 18, 2014
    Applicant: Butterfly Network, Inc.
    Inventors: Jonathan M. Rothberg, Keith G. Fife, Tyler S. Ralston, Gregory L. Charvat, Nevada J. Sanchez
  • Patent number: 8836052
    Abstract: An electromechanical transducer includes multiple elements each having multiple cells, with each cell including a first electrode formed from a conductive substrate, and a second electrode opposed to a first face of the conductive substrate and across a gap. The multiple cells of each of the elements are electrically connected, and the conductive substrate is divided for each of the elements by grooves extending from the first face to a second face which is opposite from the first face. In addition, insulating films are formed on opposing side walls of the conductive substrate and define each of the grooves, wherein a gap width of each of the grooves is narrower on the second face side of the conductive substrate than on the first face side of the conductive substrate.
    Type: Grant
    Filed: November 30, 2010
    Date of Patent: September 16, 2014
    Assignee: Canon Kabushiki Kaisha
    Inventors: Hideyuki Itoh, Takahiro Ezaki
  • Patent number: 8836043
    Abstract: A lateral bipolar junction transistor includes an emitter region; a base region surrounding the emitter region; a gate disposed at least over a portion of the base region; and a collector region surrounding the base region; wherein the portion of the base region under the gate does not under go a threshold voltage implant process.
    Type: Grant
    Filed: January 22, 2014
    Date of Patent: September 16, 2014
    Assignee: Mediatek Inc.
    Inventors: Ching-Chung Ko, Tung-Hsing Lee
  • Publication number: 20140252512
    Abstract: Methods and apparatus for MEMS release are disclosed. A method is described including providing a substrate including at least one MEMS device supported by a sacrificial layer; performing an etch in solution to remove the sacrificial layer from at least one MEMS device; immersing the substrate including the at least one MEMS device in an organic solvent; and while the substrate is immersed in the organic solvent, removing water from the organic solvent until the water remaining in the organic solvent is less than a predetermined threshold. An apparatus is disclosed for performing the methods. Additional alternative methods are disclosed.
    Type: Application
    Filed: March 8, 2013
    Publication date: September 11, 2014
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventor: Taiwan Semiconductor Manufacturing Company, Ltd.
  • Publication number: 20140246738
    Abstract: A method for the manufacture of a package encasing a Micro-Electro-Mechanical Systems (MEMS) device provides a cover having a lid and sidewalls with a port extending through the lid. A first base component is bonded to the sidewalls defining an internal cavity. This first base component further includes an aperture extending therethrough. The MEMS device is inserted through the aperture and bonded said to the lid with the MEMS device at least partially overlapping the port. Assembly is completed by bonding a second base component to the first base component to seal the aperture. The package so formed has a cover with a lid, sidewalls and a port extending through the lid. A MEMS device is bonded to the lid and electrically interconnected to electrically conductive features disposed on the first base component. A second base component is bonded to the first base component spanning the aperture.
    Type: Application
    Filed: March 4, 2013
    Publication date: September 4, 2014
    Applicant: UNISEM (M) BERHAD
    Inventors: Rob Protheroe, Alan Evans, Timothy Leung, Ming Xiang Tang, JunHua Guan
  • Publication number: 20140246739
    Abstract: A method for the manufacture of a package encasing a Micro-Electro-Mechanical Systems (MEMS) device provides a cover having a lid and sidewalls with a port extending through the lid. A first base component is bonded to the sidewalls defining an internal cavity. This first base component further includes an aperture extending therethrough. The MEMS device is inserted through the aperture and bonded to the lid with the MEMS device at least partially overlapping the port. Assembly is completed by bonding a second base component to the first base component to seal the aperture. The package so formed has a cover with a lid, sidewalls and a port extending through the lid. A MEMS device is bonded to the lid and electrically interconnected to electrically conductive features disposed on the first base component. A second base component is bonded to the first base component spanning the aperture.
    Type: Application
    Filed: December 27, 2013
    Publication date: September 4, 2014
    Applicant: Unisem (M) Berhad
    Inventors: Rob Protheroe, Alan Evans, Timothy Leung, Tang Ming Xiang, Guan JunHua
  • Patent number: 8823116
    Abstract: A hybrid integrated component includes: at least one ASIC element having integrated circuit elements and a back-end stack; an MEMS element having a micromechanical structure, which extends over the entire thickness of the MEMS substrate; and a cap wafer. The hybrid integrated component is provided with an additional micromechanical function. The MEMS element is mounted on the ASIC element, so that a gap exists between the micromechanical structure and the back-end stack of the ASIC element. The cap wafer is mounted above the micromechanical structure of the MEMS element. A pressure-sensitive diaphragm structure having at least one deflectable electrode of a capacitor system is implemented in the back-end stack of the ASIC element, which diaphragm structure spans a pressure connection in the rear side of the ASIC element.
    Type: Grant
    Filed: June 11, 2013
    Date of Patent: September 2, 2014
    Assignee: Robert Bosch GmbH
    Inventor: Heribert Weber
  • Patent number: 8823115
    Abstract: A microphone unit converts voice into an electric signal based on the vibration of a diaphragm contained in an MEMS chip. The microphone unit includes a substrate on which the diaphragm is mounted (the MEMS chip is mounted); a cover member, having sound holes, that is disposed above the substrate so that the diaphragm is contained within the inner space formed between the cover member and the substrate; and a holding member that holds only the substrate or both of the substrate and the cover member.
    Type: Grant
    Filed: December 10, 2009
    Date of Patent: September 2, 2014
    Assignee: Funai Electric Co., Ltd.
    Inventors: Takeshi Inoda, Ryusuke Horibe, Fuminori Tanaka, Akira Funatsu, Michitomo Shibutani
  • Patent number: 8816451
    Abstract: In a MEMS structure, a first trench which penetrates the first layer, the second layer and the third layer is formed, and a second trench which penetrates the fifth layer, the forth layer and the third layer is formed. The first trench forms a first part of an outline of the movable portion in a view along the stacked direction. The second trench forms a second part of the outline of the movable portion in the view along the stacked direction. At least a part of the first trench overlaps with the first extending portion in the view along the stacked direction.
    Type: Grant
    Filed: February 25, 2011
    Date of Patent: August 26, 2014
    Assignee: Kabushiki Kaisha Toyota Chuo Kenkyusho
    Inventors: Hirofumi Funabashi, Yutaka Nonomura, Yoshiyuki Hata, Motohiro Fujiyoshi, Teruhisa Akashi, Yoshiteru Omura
  • Patent number: 8816453
    Abstract: A component includes at least one MEMS component and at least one additional semiconductor component in a common housing having at least one access opening. On the front side of the MEMS component, at least one diaphragm structure is provided, which spans a cavity on the backside of the MEMS component. The housing includes a carrier, on which the MEMS component is mounted. The MEMS component is mounted, using its front side, on the carrier, so that there is a standoff between the diaphragm structure and the carrier surface. The at least one additional semiconductor component is connected to the backside of the MEMS component, so that the MEMS component and the semiconductor component form a chip stack.
    Type: Grant
    Filed: April 24, 2012
    Date of Patent: August 26, 2014
    Assignee: Robert Bosch GmbH
    Inventors: Jochen Zoellin, Ricardo Ehrenpfordt, Ulrike Scholz
  • Patent number: 8816454
    Abstract: A microphone component has a micromechanical microphone pattern which is implemented in a layer construction on a semiconductor substrate and includes (i) an acoustically active diaphragm which at least partially spans a sound opening on the backside of the substrate, (ii) at least one movable electrode of a microphone capacitor system, and (iii) a stationary acoustically penetrable counterelement having through holes, which counterelement is situated in the layer construction over the diaphragm and functions as the carrier for at least one immovable electrode of the microphone capacitor system. The diaphragm is tied in to the semiconductor substrate in a middle area, and the diaphragm has a corrugated sheet metal type of corrugation, at least in regions.
    Type: Grant
    Filed: July 10, 2013
    Date of Patent: August 26, 2014
    Assignee: Robert Bosch GmbH
    Inventors: Jochen Zoellin, Ricardo Ehrenpfordt, Juergen Graf, Christoph Schelling, Frederik Ante, Michael Curcic
  • Publication number: 20140230557
    Abstract: A method and apparatus for detecting underwater sounds is disclosed. An embodiment of the apparatus includes a substrate with a vacuum-sealed cavity. A support structure and an acoustic pressure sensor are situated on the substrate. The support structure of the apparatus may include a first oxide layer situated on the substrate, a silicon layer situated on the first oxide layer, and a second oxide layer situated on the silicon layer. The acoustic pressure sensor of the apparatus includes a first electrode layer situated on the substrate, a piezoelectric layer situated on the first electrode layer, and a second electrode layer situated on the piezoelectric layer. In one embodiment, the surface area of the second electrode layer is between about 70 to 90 percent of the surface area of the piezoelectric layer. In various embodiments, the support structure is thicker than the piezoelectric layer.
    Type: Application
    Filed: February 20, 2013
    Publication date: August 21, 2014
    Applicants: Agency for Science Technology and Research (A"STAR), PGS Geophysical AS
    Inventors: Jinghui Xu, Julius Ming-Lin Ming-Lin Tsai, Winston Sun, Chengliang Sun
  • Patent number: 8809095
    Abstract: A micromechanical component having a substrate, a micromechanical functional layer situated above the substrate, and an encapsulation layer situated above the functional layer, and a method for producing the micromechanical component are provided, the encapsulation layer having at least one trench, and a bridging of the trench by at least one electrically insulating connection link is provided.
    Type: Grant
    Filed: May 19, 2008
    Date of Patent: August 19, 2014
    Assignee: Robert Bosch GmbH
    Inventors: Volker Schmitz, Axel Grosse
  • Patent number: 8809974
    Abstract: In some embodiments, a semiconductor package can include: (a) a base having a cavity; (b) an interposer coupled to the base and at least partially over the cavity such that the interposer and the base form a back chamber, the interposer has a first opening into the back chamber; (c) a micro-electro-mechanical system device located over the interposer at the first opening; and (d) a lid coupled to the base. Other embodiments also are disclosed.
    Type: Grant
    Filed: February 26, 2010
    Date of Patent: August 19, 2014
    Assignee: Ubotic Intellectual Property Company Limited
    Inventors: Chi Kwong Lo, Lik Hang Wan, Ming Wa Tam
  • Patent number: 8809973
    Abstract: In various embodiments, a method for manufacturing a chip package is provided. The method includes arranging a chip over a substrate, the chip including a microphone structure and an opening to the microphone structure; and encapsulating the chip with encapsulation material such that the opening is kept at least partially free from the encapsulation material.
    Type: Grant
    Filed: January 23, 2013
    Date of Patent: August 19, 2014
    Assignee: Infineon Technologies AG
    Inventor: Horst Theuss
  • Publication number: 20140225203
    Abstract: Microelectromechanical systems (MEMS) microphone devices and methods for packaging the same include a package housing, an interior lid, and an integrated MEMS microphone die. The package housing includes a sound port therethrough for communicating sound from outside the package housing to an interior of the package housing. The interior lid is mounted to an interior surface of the package housing to define an interior lid cavity, and includes a back volume port therethrough. The MEMS microphone die is mounted on the interior lid over the back volume port, and includes a movable membrane. The back volume port is configured to allow the interior lid cavity and the MEMS movable membrane to communicate, thereby increasing the back volume of the MEMS microphone die and enhancing the sound performance of the packaged MEMS microphone device.
    Type: Application
    Filed: October 1, 2013
    Publication date: August 14, 2014
    Applicant: ANALOG DEVICES, INC.
    Inventor: Jicheng Yang
  • Publication number: 20140225205
    Abstract: An MEMS component includes at least one metal-ceramic multilayer stack as a mechanical functional layer in the layered structure of the MEMS component. The metal-ceramic multilayer stack functions as a mechanical functional layer in which at least one component of the micromechanical structure of the MEMS component is configured.
    Type: Application
    Filed: January 16, 2014
    Publication date: August 14, 2014
    Applicant: ROBERT BOSCH GMBH
    Inventors: Jochen ZOELLIN, Christoph SCHELLING
  • Publication number: 20140225204
    Abstract: A cavity is provided in a substrate so as to penetrate from a front surface to a back surface of the substrate. A thin-film diaphragm for sensing acoustic vibrations above the substrate is provided over the cavity. At least one wall surface of the cavity is configured of a first inclined surface between the front surface of the substrate and a middle portion in the thickness direction, the first inclined surface gradually widening toward the outside of the substrate as the first inclined surface goes from the front surface of the substrate toward the middle portion, and a second inclined surface between the middle portion and the back surface of the substrate, the second inclined surface gradually narrowing toward the inside of the substrate as the second inclined surface goes from the middle portion toward the back surface of the substrate.
    Type: Application
    Filed: August 29, 2012
    Publication date: August 14, 2014
    Applicant: OMRON CORPORATION
    Inventors: Yusuke Nakagawa, Yoshitaka Tatara, Nobuyuki Iida, Koichi Ishimoto, Tsuyoshi Hamaguchi, Hajime Kano
  • Patent number: 8803260
    Abstract: A capacitive micromachined ultrasonic transducer (CMUT), which has a conductive structure that can vibrate over a cavity, has a number of vent holes that are formed in the bottom surface of the cavity. The vent holes eliminate the deflection of the CMUT membrane due to atmospheric pressure which, in turn, allows the CMUT to receive and transmit low frequency ultrasonic waves.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: August 12, 2014
    Assignee: Texas Instruments Incorporated
    Inventors: Steven Adler, Peter Johnson, Ira Oaktree Wygant
  • Patent number: 8803261
    Abstract: A method of fabricating a micro-electrical-mechanical system (MEMS) transducer comprises the steps of forming a membrane on a substrate, and forming a back-volume in the substrate. The step of forming a back-volume in the substrate comprises the steps of forming a first back-volume portion and a second back-volume portion, the first back-volume portion being separated from the second back-volume portion by a step in a sidewall of the back-volume. The cross-sectional area of the second back-volume portion can be made greater than the cross-sectional area of the membrane, thereby enabling the back-volume to be increased without being constrained by the cross-sectional area of the membrane. The back-volume may comprise a third back-volume portion. The third back-volume portion enables the effective diameter of the membrane to be formed more accurately.
    Type: Grant
    Filed: March 10, 2014
    Date of Patent: August 12, 2014
    Assignee: Wolfson Microelectronics plc
    Inventors: Anthony Bernard Traynor, Richard Ian Laming, Tsjerk H. Hoekstra
  • Patent number: 8803259
    Abstract: Systems, apparatus, and associated methods of forming the systems and/or apparatus may include imaging devices that may comprise multiple arrays of ultrasonic transducer elements for use in a variety of applications. These multiple arrays of ultrasonic transducer elements can be arranged to form a three-dimensional imaging device. Non-coplanar arrays of ultrasonic transducer elements can be coupled together. These imaging devices may be used as medical imaging devices. Additional apparatus, systems, and methods are disclosed.
    Type: Grant
    Filed: February 11, 2013
    Date of Patent: August 12, 2014
    Assignee: STC.UNM & University of New Mexico
    Inventor: Jingkuang Chen
  • Publication number: 20140217522
    Abstract: A microphone structure is disclosed. The microphone structure comprises a substrate penetrated with at least one opening chamber and having an insulation surface. A conduction layer is arranged on the insulation surface and arranged over the opening chamber. An insulation layer is arranged on the conduction layer and having a opening to expose a part of the conduction layer as a vibration block arranged over the opening chamber. At least two first patterned electrodes are arranged on the insulation layer and arranged over the vibration block. At least two second patterned electrodes are arranged over the opening chamber, arranged on the vibration block and separated from the first patterned electrodes by at least two first gaps. When the vibration block vibrates, the vibration block moves the second patterned electrodes whereby the second patterned electrodes and the first patterned electrodes perform differential sensing.
    Type: Application
    Filed: April 4, 2014
    Publication date: August 7, 2014
    Inventor: Chuan-Wei Wang
  • Patent number: 8796790
    Abstract: A monolithically integrated MEMS and CMOS substrates provided by an IC-foundry compatible process. The CMOS substrate is completed first using standard IC processes. A diaphragm with stress relief corrugated structure is then fabricated on top of the CMOS. Air vent holes are then etched in the CMOS substrate. Finally, the microphone device is encapsulated by a thick insulating layer at the wafer level. The monolithically integrated microphone that adopts IC foundry-compatible processes yields the highest performance, smallest form factor, and lowest cost. Using this architecture and fabrication flow, it is feasible and cost-effective to make an array of Silicon microphones for noise cancellation, beam forming, better directionality and fidelity.
    Type: Grant
    Filed: June 23, 2009
    Date of Patent: August 5, 2014
    Assignee: mCube Inc.
    Inventor: Xiao (Charles) Yang
  • Publication number: 20140210020
    Abstract: MEMS devices with a rigid backplate and a method of making a MEMS device with a rigid backplate are disclosed. In one embodiment, a device includes a substrate and a backplate supported by the substrate. The backplate includes elongated protrusions.
    Type: Application
    Filed: January 25, 2013
    Publication date: July 31, 2014
    Applicant: INFINEON TECHNOLOGIES AG
    Inventor: Alfons Dehe
  • Patent number: 8791531
    Abstract: A package is provided. The package has a substrate and a cover. A MEMS die is provided having a diaphragm. A CMOS die is provided wherein at least a portion of the CMOS die is positioned between the diaphragm and the substrate.
    Type: Grant
    Filed: October 21, 2011
    Date of Patent: July 29, 2014
    Assignee: Knowles Electronics, LLC
    Inventors: Peter V. Loeppert, David Giesecke, Anthony Minervini, Jeffrey Niew, Lawrence Grunert
  • Publication number: 20140203380
    Abstract: In various embodiments, a method for manufacturing a chip package is provided. The method includes arranging a chip over a substrate, the chip including a microphone structure and an opening to the microphone structure; and encapsulating the chip with encapsulation material such that the opening is kept at least partially free from the encapsulation material.
    Type: Application
    Filed: January 23, 2013
    Publication date: July 24, 2014
    Applicant: INFINEON TECHNOLOGIES AG
    Inventor: Horst Theuss