Abstract: Discussed is a white organic light emitting device for enhancing emission efficiency and panel efficiency. The white organic light emitting device can include a first emission part between a first electrode and a second electrode and configured to include a first emission layer (EML), a second emission part on the first emission part and configured to include a second EML, and a third emission part on the second emission part and configured to include a third EML. The first to third emission parts have an emission position of emitting layers (EPEL) structure in which the first to third emission parts have a maximum emission range in respective emission areas of the first to third EMLs.

Abstract: Example embodiments relate to an organic photoelectronic device that includes a first electrode, a light-absorption layer on the first electrode and including a first p-type light-absorption material and a first n-type light-absorption material, a light-absorption auxiliary layer on the light-absorption layer and including a second p-type light-absorption material or a second n-type light-absorption material that have a smaller full width at half maximum (FWHM) than the FWHM of the light absorption layer, a charge auxiliary layer on the light-absorption auxiliary layer, and a second electrode on the charge auxiliary layer, and an image sensor including the same.

Abstract: An image pickup apparatus includes photoelectric conversion units each including a first semiconductor region of a first conductivity type and a semiconductor region of a second conductivity type disposed in contact with the first semiconductor region, a potential barrier formed between photoelectric conversion units, and a contact plug disposed in an image sensing area. The number of contact plugs is smaller than the number of photoelectric conversion units. The photoelectric conversion units include first and second photoelectric conversion units and are arranged such that at least two first photoelectric conversion units are adjacent in a first direction. The potential barrier includes a first part formed between the two first photoelectric conversion units disposed adjacently and a second part formed between first and second photoelectric conversion units adjacent to each other. The contact plug is located closer to the first part than to the second part.

Abstract: The performance of lead sulfide quantum dot (QD) photovoltaic cells is improved by exposing a QD layer to a solution containing metal salts after the synthesis of the QDs is completed. The halide ions from the salt solution passivate surface lead (Pb) sites and alkali metal ions mend Pb vacancies. Metal cations and halide anions with small ionic radius have high probability of reaching QD surfaces to eliminate surface recombination sites. Compared to control devices fabricated using only a ligand exchange procedure without salt exposure, devices with metal salt treatment show increases in both the form factor and short circuit current of the PV cell. Some embodiments comprise a method for treatment of QDs with a salt solution and ligand exchange. Other embodiments comprise a photovoltaic cell having a QD layer treated with a salt solution and ligand exchange.

Abstract: An organic electroluminescence device includes a pair of electrodes and an organic compound layer interposed therebetween. The organic compound layer includes a plurality of emitting layers at least including a first emitting layer and a second emitting layer. The first emitting layer contains a first host material and a fluorescent first luminescent material. The second emitting layer contains a second luminescent material that is different from the first luminescent material. A difference ?ST(H1) between singlet energy EgS(H1) of the first host material and an energy gap Eg77K(H1) at 77[K] of the first host material satisfies a specific relationship. One of the first luminescent material and the second luminescent material has a main peak wavelength from 400 nm to less than 500 nm and the other of the first luminescent material and the second luminescent material has a main peak wavelength from 500 nm to 700 nm.

Abstract: An optical component is disclosed that comprises a first substrate, an optical material comprising quantum confined semiconductor nanoparticles disposed over a predetermined region of a first surface of the first substrate, a layer comprising an adhesive material disposed over the optical material and any portion of the first surface of the first substrate not covered by the optical material, and a second substrate disposed over the layer comprising an adhesive material, wherein the first and second substrates are sealed together. In certain embodiments, the optical component further includes a second optical material comprising quantum confined semiconductor nanoparticles disposed between the layer comprising the adhesive material and the second substrate. Method are also disclosed. Also disclosed are products including the optical component.

Abstract: An electricity storing solar power generation device 10 includes: solar cells including at least two kinds of solar cells 11, 12 and 13 having mutually different spectral absorption sensitivities; and electricity storing devices 21, 22 and 23 electrically connected to the solar cells. The solar cells are configured such that an nth (n being an integer of 1 or greater) solar cell spontaneously disperses light by itself by transmitting or reflecting light so as to allow a portion of light incident on the nth solar cell other than a portion of light absorbed by the nth solar cell to fall on an n+1th solar cell having a smaller band gap. Each of the solar cells is electrically connected to one of the electricity storing devices, and electric power generated by the solar cells is stored in the electricity storing devices electrically connected to the two or more solar cells.

Abstract: There is provided a pupil tracking device including an active light source, an image sensor and a processing unit. The active light source emits light toward an eyeball alternatively in a first brightness value and a second brightness value. The image sensor captures a first brightness image corresponding to the first brightness value and a second brightness image corresponding to the second brightness value. The processing unit identifies a brightest region at corresponding positions of the first brightness image and the second brightness image as an active light image.

Abstract: An apparatus is described that includes a first semiconductor chip having a first pixel array. The first pixel array has visible light sensitive pixels. The apparatus includes a second semiconductor chip having a second pixel array. The first semiconductor chip is stacked on the second semiconductor chip such that the second pixel array resides beneath the first pixel array. The second pixel array has IR light sensitive pixels for time-of-flight based depth detection.

Abstract: A transistor substrate may include a transistor. The transistor substrate may further include a set of color filters that has at least two different colors, overlaps the transistor, and defines a hole. The hole exposes a portion of the transistor.

Abstract: Disclosed are a color converting element and a method for manufacturing the color converting element. The disclosed color converting element includes: first wavelength conversion cells spaced apart from one another; and second wavelength conversion cells arranged among the first wavelength conversion cells. The first and second wavelength conversion cells are made of a material containing glass. The color converting element of the disclosed technology is configured in that color converting cells having different color converting characteristics are periodically arranged, when the color converting element is applied to a color converting glass material which may improve thermal and chemical durability of white LEDs, thus minimizing the degradation of efficiency or luminance caused by an interaction between color converting phosphors or active ions and allowing for ease of adjustment of color rendering index.

Abstract: The amount of power and processing needed to process gesture input for a computing device can be reduced by utilizing a separate gesture sensor. The gesture sensor can have a form factor similar to that of conventional cameras to reduce costs by being able to utilize readily available low cost parts, but can have a lower resolution and adjustable virtual shutter such that fast motions can be captured and/or recognized by the device. In some devices, a subset of the pixels of the gesture sensor can be used as a motion detector, enabling the gesture sensor to run in a low power state unless there is likely gesture input to process. Further, at least some of the processing and circuitry can be included with the gesture sensor such that various functionality can be performed without accessing a central processor or system bus, thus further reducing power consumption.

Abstract: A structure includes a silicon substrate; silicon readout circuitry disposed on a first portion of a top surface of the substrate and a radiation detecting pixel disposed on a second portion of the top surface of the substrate. The pixel has a plurality of radiation detectors connected with the readout circuitry. The plurality of radiation detectors are composed of at least one visible wavelength radiation detector containing germanium and at least one infrared wavelength radiation detector containing a Group III-V semiconductor material. A method includes providing a silicon substrate; forming silicon readout circuitry on a first portion of a top surface of the substrate and forming a radiation detecting pixel, on a second portion of the top surface of the substrate, that has a plurality of radiation detectors formed to contain a visible wavelength detector composed of germanium and an infrared wavelength detector composed of a Group III-V semiconductor material.

Abstract: A ranging pixel located in a peripheral region of a solid-state image sensor includes a microlens having a center axis that is shifted relative to a center axis of the ranging pixel, a first photoelectric conversion unit, and a second photoelectric conversion unit. The first photoelectric conversion unit is disposed on a side of the center axis of the ranging pixel that is in a direction opposite to a direction (projection shift direction) obtained by projecting a shift direction of the microlens onto a straight line connecting a center of the first photoelectric conversion unit and a center of the second photoelectric conversion unit, and the second photoelectric conversion unit is disposed on another side of the center axis of the ranging pixel that is in a direction identical to the projection shift direction of the microlens. In addition, the area of the first photoelectric conversion unit is greater than the area of the second photoelectric conversion unit.

Abstract: An optical sensor arrangement includes two sensors arranged one behind the other. The operational spectral ranges of the sensors match, and the first sensor forms an attenuation filter for the second sensor, which is arranged behind the first sensor.

Abstract: A solid-state imaging device includes an Si substrate in which a photoelectric conversion unit that photoelectrically converts visible light incident from a back surface side is formed, and a lower substrate provided under the Si substrate and configured to photoelectrically convert infrared light incident from the back surface side.

Abstract: Spectral filtering device including a dielectric substrate, a first filter capable of acting as a passband filter in the visible range and having a plurality of first nanostructures with a uniform spacing between each other. Each nanostructure has a portion of dielectric material arranged between two portions of metallic material such that one of the two portions of metallic material is arranged between the substrate and the portion of dielectric material. A second filter capable of acting as a passband filter in the infrared range is also included having a plurality of second nanostructures with a uniform spacing between each other and each comprising a portion of dielectric material of which only one face is in contact with a portion of metallic material.

Abstract: A solid-state image sensing device has a plurality of detection units periodically arranged as a two-dimensional array on a substrate. Each of the detection units includes a visible light detector and an infrared light detector arranged on the same optical axis in a vertical direction so that the visible light detector and the infrared light detector overlap with each other. Each of the detection units also includes a signal readout circuit provided in the substrate so as to output signals of the visible light detector and the infrared light detector as time-series signals.

Abstract: Provided is a pixel of a multi-stacked complementary metal-oxide semiconductor (CMOS) image sensor and a method of manufacturing the image sensor including a light-receiving unit that may include first through third photodiode layers that are sequentially stacked, an integrated circuit (IC) that is formed below the light-receiving unit, electrode layers that are formed on and below each of the first through third photodiode layers, and a contact plug that connects the electrode layer formed below each of the first through third photodiode layers with a transistor of the IC.

Abstract: A radiation detector is provided that includes a photodiode having a radiation absorber with a graded multilayer structure. Each layer of the absorber is formed from a semiconductor material, such as HgCdTe. A first of the layers is formed to have a first predetermined wavelength cutoff. A second of the layers is disposed over the first layer and beneath the first surface of the absorber through which radiation is received. The second layer has a graded composition structure of the semiconductor material such that the wavelength cutoff of the second layer varies from a second predetermined wavelength cutoff to the first predetermined wavelength cutoff such that the second layer has a progressively smaller bandgap than the first bandgap of the first layer. The graded multilayer radiation absorber structure enables carriers to flow toward a conductor that is used for measuring the radiation being sensed by the radiation absorber.

Abstract: The amount of power and processing needed to process gesture input for a computing device can be reduced by utilizing a separate gesture sensor. The gesture sensor can have a form factor similar to that of conventional camera elements, in order to reduce costs by being able to utilize readily available low cost parts, but can have a lower resolution and adjustable virtual shutter such that fast motions can be captured and/or recognized by the device. In some devices, a subset of the pixels of the gesture sensor can be used as a motion detector, enabling the gesture sensor to run in a low power state unless there is likely gesture input to process. Further, at least some of the processing and circuitry can be included with the gesture sensor such that various functionality can be performed without accessing a central processor or system bus, thus further reducing power consumption.

Abstract: A semiconducting structure configured to receive electromagnetic radiation and transform the received electromagnetic radiation into an electric signal, the semiconductor structure including a semiconducting support within a first surface defining a longitudinal plane, a first zone with a first type of conductivity formed in the support with a second zone with a second type of conductivity that is opposite of the first type of conductivity to form a semiconducting junction. A mechanism limiting lateral current includes a third zone formed in the support in lateral contact with the second zone, the third zone having the second type of conductivity for which majority carriers are electrons. The third zone has a sufficient concentration of majority carriers to have an increase in an apparent gap due to a Moss-Burstein effect.

Abstract: An imaging device includes: a plurality of first absorption layers that absorb an infrared ray with a given wavelength range, and generate pixel signals of a plurality of pixels, respectively; at least one second absorption layer that absorbs an infrared ray with a wavelength range which is different from the given wavelength range of the first absorption layers, and generates a pixel signal common to the pixels; a plurality of first electrodes that take out the pixel signals from the first absorption layers, respectively; and a second electrode that takes out the pixel signal from the at least one second absorption layer.

Abstract: A photosite is formed in a semiconductor substrate and includes a photodiode confined in a direction orthogonal to the surface of the substrate. The photodiode includes a semiconductor zone for storing charge that is formed in an upper semiconductor region having a first conductivity type and includes a main well of a second conductivity type opposite the first conductivity type and laterally pinned in a first direction parallel to the surface of the substrate. The photodiode further includes an additional semiconductor zone including an additional well having the second conductivity type that is buried under and makes contact with the main well.

Abstract: Bias-switchable dual-band infrared detectors and methods of manufacturing such detectors are provided. The infrared detectors are based on a back-to-back heterojunction diode design, where the detector structure consists of, sequentially, a top contact layer, a unipolar hole barrier layer, an absorber layer, a unipolar electron barrier, a second absorber, a second unipolar hole barrier, and a bottom contact layer. In addition, by substantially reducing the width of one of the absorber layers, a single-band infrared detector can also be formed.

Abstract: To provide a semiconductor device having a photoelectric conversion element having a high sensitivity, causing less blooming, and capable of providing a highly reliable image. The semiconductor device has a semiconductor substrate, a first p type epitaxial layer, a second p type epitaxial layer, and a first photoelectric conversion element. The first p type epitaxial layer is formed over the main surface of the semiconductor substrate. The second p type epitaxial layer is formed so as to cover the upper surface of the first p type epitaxial layer. The first photoelectric conversion element is formed in the second p type epitaxial layer. The first and second p type epitaxial layers are each made of silicon and the first p type epitaxial layer has a p type impurity concentration higher than that of the second p type epitaxial layer.

Abstract: Photo-field-effect transistor devices and associated methods are disclosed in which a photogate, consisting of a quantum dot sensitizing layer, transfers photoelectrons to a semiconductor channel across a charge-separating (type-II) heterointerface, producing a sustained primary and secondary flow of carriers between source and drain electrodes. The light-absorbing photogate thus modulates the flow of current along the channel, forming a photo-field effect transistor.

Abstract: A display apparatus includes a first substrate including a plurality of pixels, and a second substrate facing the first substrate, the second substrate comprising a sensor area and a peripheral area, the sensor area comprising a plurality of sensors. The second substrate includes an insulating layer, and a plurality of lines disposed on the insulating layer corresponding to the peripheral area and connected to the sensors. A void is formed in the insulating layer between two adjacent lines of the plurality of lines at a boundary of the sensor area and the peripheral area.

Abstract: A solid-state imaging device includes an Si substrate in which a photoelectric conversion unit that photoelectrically converts visible light incident from a back surface side is formed, and a lower substrate provided under the Si substrate and configured to photoelectrically convert infrared light incident from the back surface side.

Abstract: Method for manufacturing a microelectronic device from a first substrate (10), including the production of at least one electronic component in the semi-conductor substrate after transferring the first substrate (10) onto a second substrate (20), characterized in that it comprises: a first phase carried out prior to the transfer, and including forming at least one pattern made of a sacrificial material in a layer of the first substrate (10), a second phase carried out after the transfer and including the substitution of the electronic component for the pattern.

Abstract: An electrical circuit includes a solar cell that has a photovoltaically active front side and a back side. An electronic or micromechanical component is arranged on the back side of the solar cell and is electrically connected to the photovoltaically active front side of the solar cell by a contact-making structure. The electrical circuit also includes a transparent first protective layer that is arranged on the photovoltaically active front side of the solar cell. The contact-making structure has a first contact-making section that is arranged on a front side of the first protective layer facing away from the solar cell.

Abstract: A solid-state image pickup element 1 is structured so as to include: a semiconductor layer 2 having a photodiode formed therein, photoelectric conversion being carried out in the photodiode; a first film 21 having negative fixed charges and formed on the semiconductor layer 2 in a region in which at least the photodiode is formed; and a second film 22 having the negative fixed charges, made of a material different from that of the first film 21 having the negative fixed charges, and formed on the first film 21 having the negative fixed charges.

Abstract: A solid-state imaging device includes a plurality of photoelectric conversion regions stacked at different depths within a semiconductor substrate of each pixel to photoelectrically convert light of different wavelength bands, and a discharge region formed between the photoelectric conversion regions adjacent to each other in a depth direction of the semiconductor substrate to discharge charges generated by photoelectric conversion in regions between the photoelectric conversion regions.

Abstract: A solid-state imaging apparatus comprising a substrate having a first face and a second face opposing each other, and in which photoelectric conversion portions are formed, an optical system including microlenses provided on a side of the first face, and light absorbing portions provided on a side of the second face, wherein the apparatus has pixels of first type for detecting light of a first wavelength and second type for detecting light of a second wavelength shorter than the first wavelength, and the apparatus further comprises a first portion between the substrate and the light absorbing portion for each first type pixel, and a second portion between the substrate and the light absorbing portion for each second type pixel, and the first portion has a reflectance higher than that of the second portion for the light of the first wavelength.

Abstract: A pixel and pixel array for use in an image sensor are provided. The image sensor includes floating sensing nodes symmetrically arranged with respect to a photodiode in each pixel.

Abstract: Provided is a method of fabricating a backside illuminated image sensor that includes providing a device substrate having a frontside and a backside, where pixels are formed at the frontside and an interconnect structure is formed over pixels, forming a re-distribution layer (RDL) over the interconnect structure, bonding a first glass substrate to the RDL, thinning and processing the device substrate from the backside, bonding a second glass substrate to the backside, removing the first glass substrate, and reusing the first glass substrate for fabricating another backside-illuminated image sensor.

Abstract: A device for medium wavelength infrared emission and a method for the manufacture thereof is provided. The device has a semiconductor substrate; a passive hermetic barrier disposed upon the substrate, and an emitter element disposed within said hermetic barrier; and a mirror.

Abstract: Room temperature IR and UV photodetectors are provided by electrochemical self-assembly of nanowires. The detectivity of such IR detectors is up to ten times better than the state of the art. Broad peaks are observed in the room temperature absorption spectra of 10-nm diameter nanowires of CdSe and ZnS at photon energies close to the bandgap energy, indicating that the detectors are frequency selective and preferably detect light of specific frequencies. Provided is a photodetector comprising: an aluminum substrate; a layer of insulator disposed on the aluminum substrate and comprising an array of columnar pores; a plurality of semiconductor nanowires disposed within the pores and standing vertically relative to the aluminum substrate; a layer of nickel disposed in operable communication with one or more of the semiconductor nanowires; and wire leads in operable communication with the aluminum substrate and the layer of nickel for connection with an electrical circuit.

Abstract: The invention describes in detail a solid-state CMOS image sensor, specifically a CMOS image sensor pixel that has stacked photo-sites, high sensitivity, and low dark current. The pixels have incorporated therein special potential barriers under the standard pinned photodiode region that diverts the photo-generated electrons from a deep region within the silicon bulk to separate storage structures located at the surface of the silicon substrate next to the pinned photodiode. The storage structures are p channel BCMD transistors that are biased to a low dark current generation mode during a charge integration period. The signal readout from the BCMD is nondestructive, therefore, without kTC noise generation. Thus a single pixel is capable of detecting several color-coded signals while using fewer or without using any light absorbing color filters on top of the pixel.

Abstract: Methods and structures for providing single-color or multi-color photo-detectors leveraging plasmon resonance for performance benefits. In one example, a radiation detector includes a semiconductor absorber layer having a first electrical conductivity type and an energy bandgap responsive to radiation in a first spectral region, a semiconductor collector layer coupled to the absorber layer and having a second electrical conductivity type, and a plasmonic resonator coupled to the collector layer and having a periodic structure including a plurality of features arranged in a regularly repeating pattern.

Abstract: A solid-state imaging device includes a photoelectric conversion film which is interposed between two transparent electrodes outside a semiconductor substrate, wherein a film surface of the photoelectric conversion film is provided so as to incline with respect to a front surface of the semiconductor substrate.

Abstract: A device includes a plurality of isolation spacers, and a plurality of bottom electrodes, wherein adjacent ones of the plurality of bottom electrodes are insulated from each other by respective ones of the plurality of isolation spacers. A plurality of photoelectrical conversion regions overlaps the plurality of bottom electrodes, wherein adjacent ones of the plurality of photoelectrical conversion regions are insulated from each other by respective ones of the plurality of isolation spacers. A top electrode overlies the plurality of photoelectrical conversion regions and the plurality of isolation spacers.

Abstract: An image sensor including a pixel unit, the pixel unit including a photodiode, a first color filter and a second color filter each disposed in a different position on a plane above the photodiode, and a first on-chip lens disposed over the first color filter and a second on-chip lens disposed over the second color filter.

Abstract: In various embodiments, a photodetector includes a semiconductor substrate and a plurality of pixel regions. Each of the plurality of pixel regions comprises an optically sensitive layer over the semiconductor substrate. A pixel circuit is formed for each of the plurality of pixel regions. Each pixel circuit includes a pinned photodiode, a charge store, and a read out circuit for each of the plurality pixel regions. The optically sensitive layer is in electrical communication with a portion of a silicon diode to form the pinned photodiode. A potential difference between two electrodes in communication with the optically sensitive layer associated with a pixel region exhibits a time-dependent bias; a biasing during a first film reset period being different from a biasing during a second integration period.

Abstract: A method of producing a solid-state imaging device includes the steps of forming on a substrate a photoelectric conversion portion that receives light on a light-receiving surface and that photoelectrically converts the received light to generate a signal charge, forming above the light-receiving surface an optical waveguide that guides light to the light-receiving surface, and forming above the optical waveguide a color filter which colors light and from which colored light is emitted to the optical waveguide, wherein, in forming the color filter, the color filter is formed from a photosensitive resin film containing a dye by performing an exposure process and then performing a development process on the film, and in forming the optical waveguide, a core portion of the optical waveguide is formed so that the core portion absorbs exposure light radiated onto the photosensitive resin film when the exposure process is performed.

Abstract: The present invention relates to a photodetector for detecting an infrared-light emission having a given wavelength (?) comprising a multilayer with: a layer (11) of a partially absorbent semiconductor; a spacer layer (12) made of a material that is transparent to said wavelength; and a structured metallic mirror (13), the distance (g) between the top of said mirror and said spacer layer being smaller than ? and said mirror comprising a network of holes defining an array of metallic reliefs with a pitch P of between 0.5 ?/nSC and 1.5 ?/nSC, where nSC is the real part of the refractive index of the semiconductor, a relief width L of between 9P/10 and P/2 and a hole depth h of between ?/100 and ?/15.

Abstract: Methods and apparatus for a sensor are disclosed. An oxide layer is formed on a substrate, followed by a spacer layer and a buffer layer. A photoresist layer is formed on the buffer layer over a pixel region, with an opening exposing a first part of the buffer layer. A first etching is performed to remove the first part of the buffer layer to expose a first part of the spacer layer. A second etching is performed to remove the first part of the spacer layer, the remaining buffer layer, and partially remove a second part of the spacer layer so that the result spacer layer will have an end with a shape substantially similar to a triangle, a height of the end is in a substantially same range as a length of the end.

Abstract: A unit pixel array of an image sensor includes a semiconductor substrate having a plurality of photodiodes, an interlayer insulation layer on a front-side of the semiconductor substrate, and a plurality of micro lenses on a back-side of the semiconductor substrate. The unit pixel array of the image sensor further includes a wavelength adjustment film portion between each of the micro lenses and the back-side of the semiconductor substrate such that a plurality of wavelength adjustment film portions correspond with the plurality of micro lenses.

Abstract: An optoelectronic device includes: a substrate made of a first material; a region in the substrate, the region being made of a second material different from the first material; an N-well in the region made of the second material; and a photo diode formed in the region by ion implantation. The second material for example is silicon germanium (Si1-xGex) or silicon carbide (Si1-yCy) wherein 0<x,y<1.

Abstract: A solid-state imaging device includes: a first photodiode receiving light of a first color; a second photodiode that is arranged next to the first photodiode in a first direction and receives light of a second color; a third photodiode that is arranged next to the second photodiode in a second direction and receives light of the first color; a fourth photodiode that is arranged next to the third photodiode in the first direction and receives light of a third color; a first reset transistor for discharging a charge generated in the first photodiode and the second photodiode; and a second reset transistor for discharging a charge generated in the third photodiode and the fourth photodiode. The first photodiode and the third photodiode have a small difference in area.