With Housing Or Contact Structure Patents (Class 257/99)
  • Patent number: 10816852
    Abstract: A backlight unit includes: a plurality of light emitting diode (LED) packages on a top surface of a circuit board; an encapsulation layer located on the circuit board and covering the plurality of LED packages; and an integrated pattern sheet on the encapsulation layer, the integrated pattern sheet including: a base layer; a plurality of lens patterns at a top surface of the base layer and respectively corresponding to the plurality of LED packages; and hollow cavity particles at a bottom surface of the base layer and at a region between the plurality of LED packages.
    Type: Grant
    Filed: October 25, 2018
    Date of Patent: October 27, 2020
    Assignee: LG Display Co., Ltd.
    Inventors: Il-Soo Kim, Dong-Hwi Kim, Ki-Seong Kim
  • Patent number: 10818705
    Abstract: A method for manufacturing a field effect transistor including a gate-insulating layer, an active layer, and a passivation layer. The method includes a first process of forming the gate-insulating layer; and a second process of forming the passivation layer. At least one of the first process and the second process includes: forming a first oxide containing an alkaline earth metal and at least one of gallium, scandium, yttrium, and a lanthanoid; and etching the first oxide by use of a first solution containing at least one of hydrochloric, acid, oxalic acid, nitric acid, phosphoric acid, acetic acid, sulfuric acid, and hydrogen peroxide water.
    Type: Grant
    Filed: March 13, 2017
    Date of Patent: October 27, 2020
    Assignee: RICOH COMPANY, LTD.
    Inventors: Yuji Sone, Naoyuki Ueda, Yuki Nakamura, Yukiko Abe, Shinji Matsumoto, Ryoichi Saotome, Sadanori Arae, Minehide Kusayanagi
  • Patent number: 10804424
    Abstract: A method for manufacturing a light emitting element includes: forming a semiconductor structure on a first substrate; providing a second substrate configured to be bonded above a side of the semiconductor structure opposite the first substrate; forming a metal layer above at least one of (i) a side of the semiconductor structure opposite the first substrate, and/or (ii) a side of the second substrate that is to be located closer to the semiconductor structure; bonding the second substrate above the semiconductor structure via a bonding member; removing the first substrate from the semiconductor structure to obtain a bonded body in which the second substrate is bonded above the semiconductor structure; and singulating the bonded body.
    Type: Grant
    Filed: August 30, 2017
    Date of Patent: October 13, 2020
    Assignee: NICHIA CORPORATION
    Inventor: Eiji Muramoto
  • Patent number: 10800651
    Abstract: An integrated device package is disclosed. The integrated device package can include a packaging structure defining a cavity. An integrated device die can be disposed at least partially within the cavity. A gel can be disposed within the cavity surrounding the integrated device. A portion of the gel can be disposed between a lower surface of the integrated device die and an upper surface of the packaging structure within the cavity.
    Type: Grant
    Filed: April 25, 2017
    Date of Patent: October 13, 2020
    Assignee: Analog Devices, Inc.
    Inventor: Thomas M. Goida
  • Patent number: 10790425
    Abstract: A package includes a first lead electrode, a second lead electrode, and a resin molded body. The first lead electrode has a first upper surface and a first lower surface defining a depression and opposite to the first upper surface. The second lead electrode has a second upper surface and a second lower surface opposite to the second upper surface. The resin molded body defining a recess with a bottom surface including the first upper surface and the second upper surface, the resin molded body also covering the first lower surface and the second lower surface. The first electrode having a first region closer to the second lead electrode and a second region farther to the second lead electrode than the first region, and having a thickness smaller than a thickness of the first region due to the depression defined in the first lower surface.
    Type: Grant
    Filed: April 28, 2016
    Date of Patent: September 29, 2020
    Assignee: NICHIA CORPORATION
    Inventor: Tomohide Miki
  • Patent number: 10784426
    Abstract: A device substrate includes a receiving substrate, a micro light emitting element, a first wire, and a second wire is provided. The micro light emitting element is disposed on the receiving substrate. The micro light emitting element includes a first type semiconductor layer and a second type semiconductor layer. The first type semiconductor layer is disposed on the receiving substrate and has a first wire connecting surface away from the receiving substrate. The second type semiconductor layer is disposed on a part of the first type semiconductor layer and has a second wire connection surface away from the receiving substrate. The first wire is disposed on the first wire connection surface. The second wire is disposed on the second wire connection surface. A projection range of the first wire perpendicularly projected on the micro light emitting element and a projection range of the second wire perpendicularly projected on the micro light emitting element are at least partially overlap.
    Type: Grant
    Filed: May 27, 2019
    Date of Patent: September 22, 2020
    Assignee: Au Optronics Corporation
    Inventors: Wen-Wei Yang, Cheng-Chieh Chang, Cheng-Yeh Tsai
  • Patent number: 10782493
    Abstract: An optical connector includes a lens body having a lens portion, a fiber optic transceiver having an optical element, a housing, an biasing portion configured to bias the fiber optic transceiver toward the lens portion, and a plurality of abutment convex portions provided on at least one of the lens body and the fiber optic transceiver such that the fiber optic transceiver biased toward the lens body by the biasing portion is arranged in parallel to the lens body with a uniform gap between the fiber optic transceiver and the lens body in a direction along an optical axis of the optical element.
    Type: Grant
    Filed: July 18, 2019
    Date of Patent: September 22, 2020
    Assignee: YAZAKI CORPORATION
    Inventor: Tomohiro Hikosaka
  • Patent number: 10784412
    Abstract: The present invention provides a package support structure and a light emitting device including same. The package support structure includes: a housing which comprises a light emitting surface, a backlight surface, a bottom surface and a groove; a conductive support which is partially covered by the housing and includes a first lead and a second lead that are separated from each other, where each of the first lead and the second lead includes an electrode portion and a bent portion, the electrode portion is exposed from the housing through the groove, and the bent portion extends outward from the electrode portion beyond the housing and bends toward the bottom surface of the housing; where one of the first lead and the second lead further includes a heat radiation portion, the heat radiation portion extend outward from the electrode portion and is exposed from the backlight surface of the housing.
    Type: Grant
    Filed: June 27, 2018
    Date of Patent: September 22, 2020
    Assignee: Everlight Electronics Co., Ltd.
    Inventors: Chien-Nan Liu, Teng-Wei Chen, Chieh-Yu Kang, Hao-Yu Yang, Yu-Da Lee
  • Patent number: 10777541
    Abstract: A micro-LED display panel including a substrate, an anisotropic conductive film, and a plurality of micro-LEDs is provided. The anisotropic conductive film is disposed on the substrate. The micro-LEDs and the anisotropic conductive film are disposed at the same side of the substrate, and the micro-LEDs are electrically connected to the substrate through the anisotropic conductive film. Each of the micro-LEDs includes an epitaxial layer and an electrode layer electrically connected to the epitaxial layer, and the electrode layers comprises a first electrode and a second electrode which are located between the substrate and the corresponding epitaxial layer. A ratio of a thickness of each of the electrode layers to a thickness of the corresponding epitaxial layer ranges from 0.1 to 0.5, and a gap between the first electrode and the second electrode of each of the micro-LEDs is in a range of 1 ?m to 30 ?m.
    Type: Grant
    Filed: October 19, 2018
    Date of Patent: September 15, 2020
    Assignee: PlayNitride Inc.
    Inventors: Ying-Tsang Liu, Yu-Chu Li, Pei-Hsin Chen, Yi-Ching Chen
  • Patent number: 10779376
    Abstract: The aim of the invention is to determine an operating point (220) of an AC/DC converter and optionally of a DC/DC converter, fed by the AC/DC converter, for feeding an operating DC voltage into a luminaire bus system in such a way that a power loss (202) of the luminaire bus system is reduced. This aim is achieved according to the invention in that a plurality of calibration DC voltages (282) are sequentially fed into the luminaire bus system, and a corresponding power consumption of the luminaire bus system is determined for each calibration DC voltage (282). The operating point can then be determined based on the power consumptions.
    Type: Grant
    Filed: December 18, 2017
    Date of Patent: September 15, 2020
    Assignee: TRIDONIC GMBH & CO KG
    Inventor: Günter Marent
  • Patent number: 10770636
    Abstract: The invention discloses a light-emitting device and a manufacturing method thereof. The light-emitting device comprising: a light-emitting unit, the light-emitting unit comprises a non-light-emitting element and a light-emitting diode; a reflective layer covering the non-light-emitting element; a light-transmitting layer covering the reflective layer and the light-emitting diode; a metal connection layer electrically connecting the non-light-emitting element and the light-emitting diode.
    Type: Grant
    Filed: February 13, 2019
    Date of Patent: September 8, 2020
    Assignee: EPISTAR CORPORATION
    Inventors: Shih-An Liao, Ming-Chi Hsu
  • Patent number: 10763397
    Abstract: A semiconductor light emitting device includes a light emitting structure having a first conductivity-type semiconductor layer, an active layer and a second conductivity-type semiconductor layer, a transparent electrode layer on the second conductivity-type semiconductor layer and spaced apart from an edge of the second conductivity-type semiconductor layer, a first insulating layer on the light emitting structure to cover the transparent electrode layer and including a plurality of holes connected to the transparent electrode layer, and a reflective electrode layer on the first insulating layer and connected to the transparent electrode layer through the plurality of holes.
    Type: Grant
    Filed: November 28, 2018
    Date of Patent: September 1, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: JuHeon Yoon, Jung Hwan Kil, Tae Hun Kim, Hwa Ryong Song, Jae In Sim
  • Patent number: 10756073
    Abstract: A micro-LED module is disclosed. The micro-LED module includes a flexible circuit board and a plurality of LED pixels mounted on the flexible circuit board. Each of the plurality of LED pixels includes a first micro-LED chip, a second micro-LED chip, and a third micro-LED chip. Each of the first micro-LED chip, the second micro-LED chip, and the third micro-LED chip has at least one side whose length is 100 ?m or less. Each of the first micro-LED chip, the second micro-LED chip, and the third micro-LED chip includes one or more electrode pads having a width of 80 ?m or less on the surface facing the flexible circuit board. The flexible circuit board includes a first flexible insulating film including electrode patterns formed on the upper surface thereof and connected to the electrode pads through solder bumps having a diameter of 80 ?m or less and a second flexible insulating film connected to the bottom of the first flexible insulating film through a first conductive pattern.
    Type: Grant
    Filed: June 18, 2018
    Date of Patent: August 25, 2020
    Assignee: LUMENS CO., LTD.
    Inventors: Daewon Kim, Taehong Jeong
  • Patent number: 10753575
    Abstract: Disclosed herein is a device which inactivates microorganisms. The device includes a light emitter and at least one light-converting material arranged to convert at least a portion of light from the light emitter. Any light emitted from the light emitter and converted light emitted from the at least one light-converting material mixes to form a combined light, the combined light having a proportion of spectral energy measured in an approximately 380 nm to approximately 420 nm range of greater than approximately 20 percent. In another embodiment, the device includes a light emitter configured to emit light with wavelengths in a range of 380 to 420 nm, and at least one light-converting material including at least one optical brightener and configured to emit a second light. The first light exiting the device and the second light exiting the device mix to form a combined light, the combined light being white.
    Type: Grant
    Filed: February 1, 2018
    Date of Patent: August 25, 2020
    Assignee: Vital Vio, Inc.
    Inventors: Jorel Lalicki, Robert Barron, James W Peterson
  • Patent number: 10755667
    Abstract: A novel human interface excellent in operability is provided. Furthermore, a novel data processor excellent in operability is provided. Furthermore, a novel data processor, a novel display device, or the like is provided. An input/output device that receives image data and supplies positional data, and an arithmetic device that supplies the image data and receives the positional data are included. The input/output device includes a first region, a second region, and a bend portion between the first region and the second region. Each of the first region and the second region includes a display portion and a positional data input portion that overlaps the display portion. The arithmetic device includes an arithmetic unit and a storage unit that stores a program to be executed by the arithmetic unit.
    Type: Grant
    Filed: February 8, 2018
    Date of Patent: August 25, 2020
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Shunpei Yamazaki, Yoshiharu Hirakata
  • Patent number: 10756119
    Abstract: A display device includes a display panel divided into a display region and a non-display region, the display panel including a panel pad part on the non-display region, a driving circuit substrate including a driving pad part, the driving circuit substrate to provide a driving signal to the display panel, a panel connecting substrate including a first connecting pad part and a second pad part, the panel connecting substrate to electrically connect the display panel and the driving circuit substrate, a first adhesive member between the driving pad part and the first connecting pad part, and a second adhesive member between the panel pad part and the second connecting pad part. At least one of the first and second adhesive members is a conductive adhesive member including a polymer resin and a plurality of conductive particles including at least one of tin or indium.
    Type: Grant
    Filed: February 22, 2017
    Date of Patent: August 25, 2020
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Euncheol Son, Jinsic Min, Jeongbong Lee, Yuji Kondo, Kyeongyeol Heo
  • Patent number: 10747078
    Abstract: The disclosed embodiments generally relate to a method, system and apparatus for forming a custom-sized display panel. An exemplary method to form a custom display from a large sheet of pixels includes: providing a sheet of pixels having a TFT substrate, a liquid crystal layer and a second substrate, the sheet of pixels having a first perimeter, the liquid crystal medium interposed between the TFT substrate and the second substrate; forming a display panel from the sheet of pixels, the display panel having a display panel perimeter, the second display having a first edge defined by the TFT substrate extending beyond the second substrate to thereby expose an electrical trace on the TFT substrate; sealing the liquid crystal layer on the first edge; conductively exposing the electrical trace on the TFT substrate; and forming a column driver line on the TFT substrate to communicate a driver signal to the second display.
    Type: Grant
    Filed: February 1, 2019
    Date of Patent: August 18, 2020
    Inventor: Richard McCartney
  • Patent number: 10749092
    Abstract: Disclosed is a light emitting device and a method of manufacturing the same. The light emitting device includes a body, a first electrode installed in the body and a second electrode separated from the first electrode, a light emitting chip formed on one of the first and second electrodes, and electrically connected to the first and second electrodes, and a protective cap projecting between the first and second electrodes.
    Type: Grant
    Filed: August 29, 2019
    Date of Patent: August 18, 2020
    Assignee: LG INNOTEK CO., LTD.
    Inventor: Jae Joon Yoon
  • Patent number: 10741993
    Abstract: A laser component including a molded body, and a laser chip embedded into the molded body and configured to emit a laser beam in an emission direction, wherein a surface of the molded body includes a deflection section arranged and inclined relative to the emission direction such that a laser beam emitted by the laser chip impinges on the deflection section and is subjected to total internal reflection at the deflection section.
    Type: Grant
    Filed: October 26, 2017
    Date of Patent: August 11, 2020
    Assignee: OSRAM OLED GmbH
    Inventors: Hubert Halbritter, Andreas Wojcik
  • Patent number: 10734369
    Abstract: A receiver optical module that receives an optical signal and generating an electrical signal corresponding to the optical signal is disclosed. The module includes a photodiode (PD), a sub-mount, a pre-amplifier, and a stem. The sub-mount, which is made of insulating material, mounts the PD thereon. The pre-amplifier, which receives the photocurrent generated by the PD, mounts the PD through the sub-mount with an adhesive. The pre-amplifier generates an electrical signal corresponding to the photocurrent and has signal pads and other pads. The stem, which mounts the pre-amplifier, provides lead terminals wire-bonded with the signal pads of the pre-amplifier. The signal pads make distances against the sub-mount that are greater than distances from the other pads to the sub-mount.
    Type: Grant
    Filed: October 26, 2018
    Date of Patent: August 4, 2020
    Assignee: Sumitomo Electric Device Innovations, Inc.
    Inventor: Kyohei Maekawa
  • Patent number: 10734552
    Abstract: An embodiment provides a semiconductor device including a light emitting structure including a first conductive semiconductor layer, a second conductive semiconductor layer, an active layer disposed between the first conductive semiconductor layer and the second conductive semiconductor layer, and a plurality of recesses passing through the second conductive semiconductor layer and the active layer and extending to a portion of the first conductive semiconductor layer; a plurality of first electrodes disposed inside the plurality of recesses and electrically connected with the first conductive semiconductor layer; and a second electrode electrically connected with the second conductive semiconductor layer, wherein a ratio of a first area of where the plurality of first electrodes are in contact with the first conductive semiconductor layer and a second area of where the second electrode is in contact with the second conductive semiconductor layer (first area:second area) ranges from 1:3 to 1:10.
    Type: Grant
    Filed: June 20, 2017
    Date of Patent: August 4, 2020
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Su Ik Park, Youn Joon Sung, Min Sung Kim, Yong Gyeong Lee, Eun Dk Lee
  • Patent number: 10734557
    Abstract: A light-emitting device includes a package structure and a light-emitting chip. The package structure has a light exiting surface, a rear surface facing away from the light exiting surface, a groove inward recessed on the rear surface, and an outer surrounding side wall surrounding the groove. The light-emitting chip is disposed in the groove. The width of the package structure gradually decreases from the light exiting surface to the rear surface. The width of the groove gradually increases from inside to outside of the groove.
    Type: Grant
    Filed: December 26, 2018
    Date of Patent: August 4, 2020
    Assignees: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORPORATION
    Inventors: Liangliang Luo, Shu-yong Jia, Wen Lee, Ke-qin Guo
  • Patent number: 10734550
    Abstract: Disclosed herein is a semiconductor device including: a semiconductor structure including a first conductive semiconductor layer, a second conductive semiconductor layer, and an active layer interposed between the first conductive semiconductor layer and the second conductive semiconductor layer; a first insulating layer disposed on the semiconductor structure; a first electrode disposed on the first conductive semiconductor layer through a first hole of the first insulating layer; a second electrode disposed on the second conductive semiconductor layer through a second hole of the first insulating layer; a first cover electrode disposed on the first electrode; and a second cover electrode disposed on the second electrode, wherein the second cover electrode includes a plurality of pads, and a connecting portion configured to connect the plurality of pads, a width of the connecting portion is smallest at a central position between the adjacent pads, and an area ratio between the second cover electrode and the
    Type: Grant
    Filed: August 24, 2018
    Date of Patent: August 4, 2020
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Youn Joon Sung, Rak Jun Choi
  • Patent number: 10727381
    Abstract: A light emitting device according to one embodiment of the present disclosure includes a light emitting element, a fluorescent material layer, a reflective film, a light-transmissive member, and an absorbing layer. The light emitting element emits first light. The fluorescent material layer is disposed on the light emitting element. The fluorescent material layer is excited by the first light to emit second light being longer in wavelength than the first light. The reflective film is disposed on the fluorescent material layer to reflect part of the first light and transmit the second light. The light-transmissive member is disposed on the reflective film. The absorbing layer is disposed on the light-transmissive member to absorb part of the first light. The light emitting element is identical in area to or smaller in area than the fluorescent material layer in a plan view.
    Type: Grant
    Filed: December 12, 2019
    Date of Patent: July 28, 2020
    Assignee: NICHIA CORPORATION
    Inventor: Taiki Yuasa
  • Patent number: 10727383
    Abstract: An LED package structure includes a substrate, an electrode layer and an insulating layer in a coplanar arrangement and disposed on the substrate, an LED chip mounted on the electrode layer and the insulating layer, a phosphor sheet covering entirely a top surface of the LED chip, a first translucent layer disposed on a light emitting surface of the phosphor sheet, and a reflective housing covering the side surfaces of the LED chip and the side surfaces of the phosphor sheet. The light emitting surface has a central region and a ring-shaped region surrounding the central region. The first translucent layer covers at least 60% of an area of the ring-shaped region. A refractive index of the first translucent layer is larger than one and is smaller than that of the phosphor sheet. A top surface of the reflective housing is substantially flush with the light emitting surface.
    Type: Grant
    Filed: November 21, 2017
    Date of Patent: July 28, 2020
    Assignees: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORPORATION
    Inventors: Yu-Yu Chang, Shih-Chiang Yen, Yi-Hsuan Chen, Chen-Hsiu Lin
  • Patent number: 10727385
    Abstract: According to one embodiment, a light emitting device includes a first lead, a light emitting element, and a first bonding member. The light emitting element includes a semiconductor stacked body and a first electrode. The semiconductor stacked body includes a light emitting layer. The first electrode is below the semiconductor stacked body. The first bonding member electrically connects the first lead and the first electrode. A lower surface of the first electrode includes a first protrusion, a second protrusion, and a first depression. The first depression is located between the first and second protrusions. The first protrusion has a first side surface. The second protrusion has a second side surface facing the first side surface. The first bonding member contacts at least a part of the first side surface. At least a part of the second side surface is separated from the first bonding member.
    Type: Grant
    Filed: February 26, 2019
    Date of Patent: July 28, 2020
    Assignee: NICHIA CORPORATION
    Inventor: Ryosuke Wakaki
  • Patent number: 10720556
    Abstract: A method for manufacturing a light emitting device includes the steps of: disposing a light emitting element on a base; disposing a single or plurality of light-transmissive members on the base so that the light emitting element is interposed between and spaced apart from at least one pair of opposing portions of the single or plurality of light-transmissive members; covering the base, the at least one pair of opposing portions of the single or plurality of light-transmissive members, and the light emitting element with a sealing member containing a phosphor; and cutting the base, the at least one pair of opposing portions of the single or plurality of light-transmissive members, and the sealing member, along paths on which the at least one pair of opposing portions are disposed.
    Type: Grant
    Filed: December 31, 2018
    Date of Patent: July 21, 2020
    Assignee: NICHIA CORPORATION
    Inventor: Yuki Shiota
  • Patent number: 10720476
    Abstract: A method of manufacturing a flexible display device includes forming a base substrate on a first sacrificial layer formed on a first supporting substrate, forming a display device array on the base substrate, forming a second sacrificial layer on a second supporting substrate, forming a touch array on the second sacrificial layer, adhering the first supporting substrate onto the second supporting substrate using an adhesive, irradiating laser energy onto the first sacrificial layer to remove the first sacrificial layer and separate the first supporting substrate from the base substrate, and irradiating laser energy onto the second sacrificial layer to separate interfaces of the second supporting substrate and the second sacrificial layer from each other, such that the second sacrificial layer is fixed on the touch array. The second sacrificial layer includes at least one of oxidized molybdenum, lead zirconate titanate, gallium nitride, and an amorphous silicon based inorganic material.
    Type: Grant
    Filed: May 22, 2019
    Date of Patent: July 21, 2020
    Assignee: Samsung Display Co., Ltd.
    Inventors: In Jun Bae, Ji Hye Park, Jae Hwan Oh
  • Patent number: 10720550
    Abstract: A method of fabricating an LED includes: providing an epitaxial structure having a growth substrate, a first-type semiconductor layer, an active layer and a second-type semiconductor layer; forming an extended electrode and performing thermal treatment to form ohmic contact with the second-type semiconductor layer; providing a temporary substrate bonded with the epitaxial structure, and removing the growth substrate to expose the surface of the first-type semiconductor layer; forming an ohmic contact layer, a mirror layer and a bonding layer over the exposed surface of the first-type semiconductor layer; providing a conductive substrate bonded with the bonding layer, and removing the temporary substrate to expose part of the surface of the second-type semiconductor layer and the extended electrode; forming a roughening surface via etching of the exposed second-type semiconductor layer; and providing a bonding wire electrode forming a closed loop with the extended electrode.
    Type: Grant
    Filed: September 22, 2018
    Date of Patent: July 21, 2020
    Assignee: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Cheng Meng, Chun-Yi Wu, Shufan Yang, Duxiang Wang
  • Patent number: 10692545
    Abstract: Systems, apparatuses, and methods for performing efficient data transfer in a computing system are disclosed. A termination voltage generator includes an inverter-based chopper circuit, which uses a first group of an even number of serially connected inverters coupled between the output node of the chopper circuit and the gate terminal of an output pmos transistor. Additionally, a second group of an even number of serially connected inverters is coupled between the output node and the gate terminal of an output nmos transistor. A replica inverter includes two serially connected pmos transistors and two serially connected nmos transistors. Each of one pmos transistor and one nmos transistor receives a generated voltage set as the expected value of the termination voltage. Each of the other pmos transistor and nmos transistor receives an output based on a comparison between the expected value to the output of the replica inverter.
    Type: Grant
    Filed: September 24, 2018
    Date of Patent: June 23, 2020
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Milam Paraschou, Balwinder Singh, Gerald R. Talbot, Alushulla Jack Ambundo, Edoardo Prete, Thomas H. Likens, III, Michael A. Margules
  • Patent number: 10693041
    Abstract: High-performance light-emitting diode together with apparatus and method embodiments thereto are disclosed. The light emitting diode devices emit at a wavelength of 390 nm to 470 nm or at a wavelength of 405 nm to 430 nm. Light emitting diode devices are characterized by having a geometric relationship (e.g., aspect ratio) between a lateral dimension of the device and a vertical dimension of the device such that the geometric aspect ratio forms a volumetric light emitting diode that delivers a substantially flat current density across the device (e.g., as measured across a lateral dimension of the active region). The light emitting diode devices are characterized by having a current density in the active region of greater than about 175 Amps/cm2.
    Type: Grant
    Filed: October 23, 2018
    Date of Patent: June 23, 2020
    Assignee: SORAA, INC.
    Inventors: Michael J. Cich, Aurelien J. F. David, Christophe Hurni, Rafael Aldaz, Michael Ragan Krames
  • Patent number: 10692843
    Abstract: A flexible polymeric dielectric layer (12) having first and second major surfaces, the first major surface having a conductive layer (20) thereon, the dielectric layer having at least one conduit (10) extending from the second major surface to the first major surface, the conduit having at least one lateral dimension of at least about one centimeter and being at least partially filled with conductive material (18), the conductive layer including at least one conductive feature (21) substantially aligned with the conduit (10), the conductive feature (21) supporting a plurality of light emitting semiconductor devices (22).
    Type: Grant
    Filed: December 2, 2014
    Date of Patent: June 23, 2020
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Ravi Palaniswamy, Jian Xia Gao, Alejandro Aldrin A. Narag, II, Nathan P. Kreutter, Andrew J. Ouderkirk
  • Patent number: 10683454
    Abstract: The present invention relates to a phosphor, a method for preparing the phosphor, an optoelectronic component, and a method for producing the optoelectronic component. The phosphor has the following general formula: La3(1?x)Ga1?yGe5(1?z)O16: 3xA3+, yCr3+, 5zB4+, where x, y, and z do not equal to 0 simultaneously; A represents at least one of Gd and Yb; B represents at least one of Sn, Nb, and Ta. For the phosphor, its emission spectrum is within a red visible light region and a near-infrared region when excited by blue visible light, purple visible light or ultraviolet light; and it has a wide reflection spectrum and a high radiant flux. Therefore, it can be used in optoelectronic components such as LEDs to meet requirements of current medical testing, food composition analysis, security cameras, iris/facial recognition, virtual reality, gaming notebook and light detection and ranging applications.
    Type: Grant
    Filed: October 19, 2018
    Date of Patent: June 16, 2020
    Assignee: Everlight Electronics Co., Ltd.
    Inventors: Veeramani Rajendran, Mu-Huai Fang, Ru-Shi Liu, Ho Chang, Kuang-Mao Lu, Yan-Shen Lin, Chieh-Yu Kang, Gabriel Nicolo A. De Guzman, Shu-Fen Hu
  • Patent number: 10686106
    Abstract: The disclosure discloses an optoelectronic element comprising: an optoelectronic unit comprising a first metal layer, a second metal layer, and an outermost lateral surface; an insulating layer having a first portion overlapping the optoelectronic unit and extending beyond the lateral surface, and a second portion separated from the first portion in a cross-sectional view; and a first conductive layer formed on the insulating layer.
    Type: Grant
    Filed: May 7, 2018
    Date of Patent: June 16, 2020
    Assignee: EPISTAR CORPORATION
    Inventors: Cheng-Nan Han, Tsung-Xian Lee, Min-Hsun Hsieh, Hung-Hsuan Chen, Hsin-Mao Liu, Hsing-Chao Chen, Ching-San Tao, Chih-Peng Ni, Tzer-Perng Chen, Jen-Chau Wu
  • Patent number: 10672961
    Abstract: A light-emitting element package includes a package body having a cavity; a first lead frame and a second lead frame disposed on the package body; a light-emitting element disposed on the bottom surface of the cavity and electrically connected to the first lead frame and the second lead frame; and a molding part surrounding the light-emitting element and disposed in at least a portion of the cavity. Each of the lead frames includes a first part corresponding to a portion of the bottom surface and side walls of the cavity; a second part corresponding to a portion of an upper surface and outer side surfaces of the package body; and a connection part disposed between the first part and the second part width of the connection part is narrower than the width of the first part and the second part in a region adjacent to the connection part.
    Type: Grant
    Filed: February 3, 2017
    Date of Patent: June 2, 2020
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Byeong Hwang Min, Gam Gon Kim, Bong Kul Min, Byeong Duck Lee
  • Patent number: 10673016
    Abstract: A display device includes: a substrate; a plurality of pixels on the substrate; an organic encapsulation layer covering a pixel area including at least one pixel; a first inorganic encapsulation layer on the organic encapsulation layer and having a first crack at a pixel area gap; and a second inorganic encapsulation layer on the first inorganic encapsulation layer and filling the first crack.
    Type: Grant
    Filed: March 20, 2018
    Date of Patent: June 2, 2020
    Assignee: Samsung Display Co., Ltd.
    Inventors: Oh June Kwon, Jin Koo Kang, Chung Sock Choi
  • Patent number: 10672951
    Abstract: The light emitting element is provided to comprise: a first conductive type semiconductor layer; a mesa; a current blocking layer; a transparent electrode; a first electrode pad and a first electrode extension; a second electrode pad and a second electrode extension; and an insulation layer partially located on the lower portion of the first electrode, wherein the mesa includes at least one groove formed on a side thereof, the first conductive type semiconductor layer is partially exposed through the groove, the insulation layer includes an opening through which the exposed first conductive type semiconductor layer is at least partially exposed, the first electrode extension includes extension contact portions in contact with the first conductive type semiconductor layer through an opening, and the second electrode extension includes an end with a width different from the average width of the second electrode extension.
    Type: Grant
    Filed: December 15, 2017
    Date of Patent: June 2, 2020
    Assignee: SEOUL VIOSYS CO., LTD.
    Inventors: Duk Il Suh, Ye Seul Kim, Kyoung Wan Kim, Sang Won Woo, Ji Hye Kim
  • Patent number: 10665573
    Abstract: The invention provides a manufacturing method of micro LED display panel and micro LED display panel. In the manufacturing method, an elastic conductive layer is formed on the upper pixel electrode on the package substrate. When the package substrate and the driving substrate are assembled, the upper pixel electrode and the upper electrode of the micro LED are electrically connected through the elastic conductive layer, and the elasticity of the elastic conductive layer is utilized to fill the height difference between the individual micro LEDs, avoid poor connection between the upper pixel electrode and the upper electrode of the micro LED, and improve the assembling effect of the micro LED display panel and the process yield of the micro LED display panel.
    Type: Grant
    Filed: September 13, 2018
    Date of Patent: May 26, 2020
    Assignee: SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventor: Lixuan Chen
  • Patent number: 10665753
    Abstract: A vertical ultraviolet light-emitting diode has, on an aluminum polar plane of an n-type AlN single crystal substrate, a layer represented by n-type AlXGa1-XN (wherein X is a rational number satisfying 0.5?X?1.0), an active layer, a layer represented by p-type AlYGa1-YN (wherein Y is a rational number satisfying 0.5?Y?1.0) and a p-type GaN layer in this order and which is equipped with a p-electrode formed on the p-type GaN layer and an n-electrode partially provided on a plane on the opposite side to the aluminum polar plane of the n-type AlN single crystal substrate, preferably an n-electrode formed by providing at least one opening functioning as a light extraction window, wherein the shortest distance between the n-electrode and an arbitrary point in a portion where the n-electrode is not provided, is not more than 400 ?m.
    Type: Grant
    Filed: February 21, 2017
    Date of Patent: May 26, 2020
    Assignee: Stanley Electric Co., Ltd.
    Inventor: Toru Kinoshita
  • Patent number: 10665758
    Abstract: A component having a metal carrier and a method for producing a component are disclosed. In an embodiment the component includes a carrier having a metallic carrier layer, an insulating layer and a first through-contact extending in a vertical direction throughout the carrier layer, wherein the through-contact is electrically isolated from the carrier layer via the insulating layer. The component further includes a semiconductor body and a wiring structure arranged in the vertical direction between the carrier and the semiconductor body at least places and electrically contacting the semiconductor body, wherein the wiring structure has a first connection area and a second connection area, wherein the connection areas adjoin the carrier and are assigned to different electrical polarities of the component, wherein the first through-contact is in electrical contact with one of the connection areas, and wherein the component is configured to be externally electrically connectable via the carrier.
    Type: Grant
    Filed: July 14, 2016
    Date of Patent: May 26, 2020
    Assignee: OSRAM OLED GmbH
    Inventors: Christian Leirer, Thomas Schwarz, Lutz Höppel
  • Patent number: 10660325
    Abstract: The invention concerns an apparatus and a method for deterring birds, comprising a frame fixedly disposed on a structure; a laser light generator connected with the frame, including a laser light source for generating a laser light beam; a supply circuit for supplying the laser light source; driving means connected with the laser light generator, for having at least a part of the laser light generator move; and a control element for controlling the laser light source and the drivable part of the laser light generator, wherein the driving means are arranged for causing a movement to be executed of at least a drivable part of the laser light generator. Thus, an apparatus and a method are obtained having a greater effect in deterring birds.
    Type: Grant
    Filed: February 15, 2019
    Date of Patent: May 26, 2020
    Assignee: Steinar Holding B.V.
    Inventors: Steinar Finn Boye Henskes, Pim Roelof Clement Tammes, Tim Sprang
  • Patent number: 10655828
    Abstract: An LED package structure includes an LED frame, a driver frame unit, a housing, LED chips, a driver chip, and a light-permeable package body. The LED frame includes a carrying segment and two bent leads connected to the carrying segment. The driver frame unit includes two side frames each having a functional segment and a bent lead. The housing has a cavity exposing the carrying segment and the two functional segments. The bent leads protrude from a lateral surface of the housing, and curvedly extend to a bottom surface of the housing. The LED chips are mounted on the carrying segment. The driver chip is fixed to one of the two functional segments, and is electrically connected to the other functional segment and the LED chips. The light-permeable package body is filled in the cavity so as to embed the LED chips and the driver chip.
    Type: Grant
    Filed: February 12, 2019
    Date of Patent: May 19, 2020
    Assignees: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORPORATION
    Inventors: Chen-Hsiu Lin, Ming-Kun Weng
  • Patent number: 10658545
    Abstract: Provided is a light emitting device capable of reducing light attenuation within the element and having high light extraction efficiency, and a method of manufacturing the light emitting device. The light emitting device has a light emitting element having a light transmissive member and semiconductor stacked layer portion, electrodes disposed on the semiconductor stacked layer portion in this order. The light emitting element has a first region and a second region from the light transmissive member side. The light transmissive member has a third region and a fourth region from the light emitting element side. The first region has an irregular atomic arrangement compared with the second region. The third region has an irregular atomic arrangement compared with the fourth region. The first region and the third region are directly bonded.
    Type: Grant
    Filed: July 5, 2018
    Date of Patent: May 19, 2020
    Assignee: NICHIA CORPORATION
    Inventor: Masatsugu Ichikawa
  • Patent number: 10658550
    Abstract: A light-emitting diode (LED) package structure includes: a support; an LED chip; and a package cover, wherein: a support circuit is formed over the support; the LED chip is arranged over the support and electrically coupled to the support circuit; a lower surface periphery of the package cover is provided with a groove structure filled with organic binder; and the package cover is arranged over the LED chip and connected to the support via the organic binder.
    Type: Grant
    Filed: November 10, 2018
    Date of Patent: May 19, 2020
    Assignee: XIAMEN SAN'AN OPTOELECTRONICS CO., LTD.
    Inventors: Junpeng Shi, Qiuxia Lin, Zhenduan Lin, Chen-Ke Hsu, Chih-Wei Chao
  • Patent number: 10658440
    Abstract: An organic light emitting diode display device includes a substrate including a display region, wherein a plurality of pixel regions are defined in the display region; a first electrode over the substrate and in each of the plurality of pixel regions; a bank including a lower layer and an upper layer on the first electrode, the lower layer disposed on edges of the first electrode and having a first width and a first thickness, the upper layer disposed on the lower layer and having a second width smaller than the first width; an organic emitting layer on the first electrode and a portion of the lower layer; and a second electrode on the organic emitting layer and covering an entire surface of the display region.
    Type: Grant
    Filed: June 26, 2018
    Date of Patent: May 19, 2020
    Assignee: LG Display Co., Ltd.
    Inventors: Dae-Jung Choi, Jae-Ki Lee, Ki-Soub Yang, Hwang-Un Seo, Hong-Myeong Jeon, Seung-Ryul Choi, A-Ryoung Lee, Han-Hee Kim, Geum-Young Lee, Kang-Hyun Kim
  • Patent number: 10658452
    Abstract: A display apparatus includes a substrate including a display area and a peripheral area disposed outside of the display area, a plurality of wiring lines disposed in the peripheral area, and an interlayer insulating layer covering the plurality of wiring lines. The interlayer insulating layer includes an upper surface having a first concave-convex surface corresponding to the plurality of wiring lines. The display apparatus further includes a first conductive layer disposed on the interlayer insulating layer and including a second upper surface having a second concave-convex surface corresponding to the first concave-convex surface, a planarization layer disposed on the first conductive layer and having a flat upper surface, a second conductive layer disposed on the planarization layer and having a flat upper surface, and a polarization plate disposed on the second conductive layer.
    Type: Grant
    Filed: March 25, 2019
    Date of Patent: May 19, 2020
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Chulhyun Choi, Zail Lhee, Keunsoo Lee, Kyungchan Chae, Kwangmin Kim, Wonkyu Kwak, Kiwook Kim, Yangwan Kim, Hyunjoon Kim, Jisu Na, Joongsoo Moon
  • Patent number: 10651128
    Abstract: In accordance with certain embodiments, a light-emitting element composed of one or more discrete units configured for light emission is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the light-emitting element or non-coplanarity of the semiconductor die contacts.
    Type: Grant
    Filed: June 28, 2018
    Date of Patent: May 12, 2020
    Assignee: COOLEDGE LIGHTING INC.
    Inventors: Michael A. Tischler, Philippe M. Schick, Ian Ashdown, Calvin Wade Sheen, Paul Jungwirth
  • Patent number: 10651119
    Abstract: The present disclosure includes: a flexible resin substrate made of a polyimide resin; an adhesion layer provided on the resin substrate; a semiconductor element mounted face down to the resin substrate and fixed to the resin substrate through the adhesion layer; a via hole provided in the resin substrate to correspond to an element electrode of the semiconductor element; a module electrode provided to the resin substrate to be in contact with the element electrode of the semiconductor element through the via hole; a protruding portion provided, around the element electrode or in a peripheral edge portion of the semiconductor element, on a surface of the semiconductor element; and an escape portion for the adhesion layer covering a head portion of the protruding portion to escape, the escape portion being provided in a region, of the resin substrate, corresponding to the protruding portion.
    Type: Grant
    Filed: December 20, 2018
    Date of Patent: May 12, 2020
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Takayuki Takano, Tasuku Kawashima
  • Patent number: 10643981
    Abstract: Planar surface mount (SM) micro light emitting diodes (?LEDs) are presented. The fabrication method provides a MOCVD LED structure with a stack including a first doped semiconductor in a first plane, a MQW layer overlying the first doped semiconductor in a second plane, and a second doped semiconductor overlying the MQW layer in a third plane. An electrical insulator is conformally deposited over the etched stack in a fourth plane, and etched to expose the second doped semiconductor, creating a first via. Etching exposes the first doped semiconductor, creating a second via. A first electrode is connected to the second doped semiconductor through the first via, and has a substrate interface surface in a fifth plane with an average planarity tolerance of less than 10 nanometers. A second electrode is connected to the first doped semiconductor through the second via, and has a substrate interface surface in the fifth plane.
    Type: Grant
    Filed: May 8, 2019
    Date of Patent: May 5, 2020
    Assignee: eLux, Inc.
    Inventors: Paul J. Schuele, Changqing Zhan, Kenji Sasaki, Kurt Ulmer, Jong-Jan Lee
  • Patent number: 10644205
    Abstract: A light-emitting diode (LED) package includes: an LED having a polygonal shape in a plan view; a light-transmissive layer directing light from the LED in an upward direction; a wavelength conversion layer changing a wavelength of the light emitted through the light-transmissive layer; and a coating layer covering the light-transmissive layer and reflecting the light emitted through the light-transmissive layer in the upward direction. In a plan view of the light-transmissive layer, a length from a first point corresponding to a vertex of the LED to a second point corresponding to an end of an extension of a diagonal of the LED is greater than or equal to a length from the first point to a third point corresponding to an end of an extension of a side of the LED.
    Type: Grant
    Filed: September 12, 2018
    Date of Patent: May 5, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong-kuk Lee, Moon-sub Kim, Sung-jin Ahn, Suk-ho Yoon, Seung-hwan Lee