Static Random Access Memory Structures (sram) (epo) Patents (Class 257/E21.661)
  • Patent number: 10396075
    Abstract: After forming a plurality of semiconductor fins that are separated from one another by trenches on a substrate, the semiconductor fins are fully or partially oxidized to provide semiconductor oxide portions. The volume expansion caused by the oxidation of the semiconductor fins reduces widths of the trenches, thereby providing narrowed trenches for formation of epitaxial semiconductor fins using aspect ratio trapping techniques.
    Type: Grant
    Filed: May 1, 2017
    Date of Patent: August 27, 2019
    Assignee: International Business Machines Corporation
    Inventors: Karthik Balakrishnan, Kangguo Cheng, Pouya Hashemi, Alexander Reznicek
  • Patent number: 10396157
    Abstract: A semiconductor device includes semiconductor layer having first device region and second device region. A shallow trench isolation (STI) structure is in the semiconductor layer and located at periphery of the first and second device regions. A first and second insulating layers are on the semiconductor layer and respectively located in the first and second device regions. A first gate structure is located on the first insulating layer. A source region and a drain region are in the semiconductor layer and are located at two sides of the first gate structure. A gate doped region is in a surface region of the semiconductor layer in the second device region to serve as a second gate structure. A channel layer is located on the second insulating layer. A source layer and a drain layer are on the STI structure and are located at two sides of the channel layer.
    Type: Grant
    Filed: March 6, 2018
    Date of Patent: August 27, 2019
    Assignee: United Microelectronics Corp.
    Inventors: Shin-Hung Li, Kuan-Chuan Chen, Nien-Chung Li, Wen-Fang Lee, Chih-Chung Wang
  • Patent number: 10283495
    Abstract: A semiconductor device includes two elongated active regions that include source/drain regions for multiple transistor devices, a first contact layer that includes an electrical connection between the two active regions, a second contact layer that includes a connection between two gate lines, and a gate contact layer that provides connections to the gate lines.
    Type: Grant
    Filed: April 1, 2016
    Date of Patent: May 7, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Ru-Gun Liu, Chun-Yi Lee, Jyh-Kang Ting, Juing-Yi Wu, Liang-Yao Lee, Tung-Heng Hsieh, Tsung-Chieh Tsai
  • Patent number: 10217751
    Abstract: In a region just below an access gate electrode in an SRAM memory cell, a second halo region is formed adjacent to a source-drain region and a first halo region is formed adjacent to a first source-drain region. In a region just below a drive gate electrode, a third halo region is formed adjacent to the third source-drain region and a fourth halo region is formed adjacent to a fourth source-drain region. The second halo region is set to have an impurity concentration higher than the impurity concentration of the first halo region. The third halo region is set to have an impurity concentration higher than the impurity concentration of the fourth halo region. The impurity concentration of the first halo region and the impurity concentration of the fourth halo region are different from each other.
    Type: Grant
    Filed: June 21, 2018
    Date of Patent: February 26, 2019
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventors: Koji Nii, Makoto Yabuuchi, Yasumasa Tsukamoto, Kengo Masuda
  • Patent number: 10211206
    Abstract: Methods of connecting a read driver transistor to a PD and PU inverter of a two-port vertical SRAM via a shared GAA or a vertical cross-couple contact between a GAA of the read driver transistor and the bottom source/drain region of the PD and PU inverter and the resulting devices are provided. Embodiments include forming a first PD transistor, a first PU transistor, a second PU transistor, and a second PD transistor over a substrate; forming a first PG transistor and a second PG transistor over the substrate; forming a read transistor and a read driver transistor laterally separated in the first direction over the substrate, the read transistor and the read driver transistor adjacent to the second PG transistor and the first PD transistor, respectively; and connecting the read driver transistor, the first PD transistor, and the first PU transistor.
    Type: Grant
    Filed: November 1, 2017
    Date of Patent: February 19, 2019
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Hui Zang, Jerome Ciavatti
  • Patent number: 10211156
    Abstract: A semiconductor device includes a substrate including PMOSFET and NMOSFET regions, a first gate structure extending in a first direction and crossing the PMOSFET and NMOSFET regions, and a gate contact on and connected to the first gate structure, the gate contact being between the PMOSFET and NMOSFET regions, the gate contact including a first sub contact in contact with a top surface of the first gate structure, the first sub contact including a vertical extending portion extending vertically toward the substrate along one sidewall of the first gate structure, and a second sub contact spaced apart from the first gate structure, a top surface of the second sub contact being positioned at a same level as a top surface of the first sub contact.
    Type: Grant
    Filed: August 31, 2018
    Date of Patent: February 19, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Changseop Yoon, Kwangsub Yoon, Jongmil Youn, Hyung Jong Lee
  • Patent number: 10181496
    Abstract: A memory device can include at least one plate structure formed over a semiconductor substrate; an active region formed within the semiconductor substrate without lateral isolation structures; a plurality of bit line contact groups, each including bit line contacts to the active region disposed in a first direction; a plurality of storage contact groups, each including storage contacts to the active region disposed in the first direction; a plurality of gate structures, each including a main section extending in the first direction, and disposed between one bit line contact group and an adjacent storage contact group; and a two-terminal storage element disposed between each bit line contact and the at least one plate structure.
    Type: Grant
    Filed: April 29, 2016
    Date of Patent: January 15, 2019
    Assignee: Adesto Technologies Corporation
    Inventors: Ming Sang Kwan, Venkatesh P. Gopinath
  • Patent number: 10103153
    Abstract: An integrated circuit with a SAR SRAM cell with power routed in metal-1. An integrated circuit with a SAR SRAM cell that has power routed in Metal-1 and has metal-1 and metal-2 integrated circuit and SAR SRAM cell patterns which are DPT compatible. A process of forming an integrated circuit with a SAR SRAM cell with DPT compatible integrated circuit and SAR SRAM cell metal-1 and metal-2 patterns.
    Type: Grant
    Filed: September 28, 2015
    Date of Patent: October 16, 2018
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventor: James Walter Blatchford
  • Patent number: 10096546
    Abstract: A semiconductor device includes a substrate including PMOSFET and NMOSFET regions, a first gate structure extending in a first direction and crossing the PMOSFET and NMOSFET regions, and a gate contact on and connected to the first gate structure, the gate contact being between the PMOSFET and NMOSFET regions, the gate contact including a first sub contact in contact with a top surface of the first gate structure, the first sub contact including a vertical extending portion extending vertically toward the substrate along one sidewall of the first gate structure, and a second sub contact spaced apart from the first gate structure, a top surface of the second sub contact being positioned at a same level as a top surface of the first sub contact.
    Type: Grant
    Filed: September 14, 2017
    Date of Patent: October 9, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Changseop Yoon, Kwangsub Yoon, Jongmil Youn, Hyung Jong Lee
  • Patent number: 9881810
    Abstract: Structures and methods are provided for nanosecond electrical pulse anneal processes. The method of forming an electrostatic discharge (ESD) N+/P+ structure includes forming an N+ diffusion on a substrate and a P+ diffusion on the substrate. The P+ diffusion is in electrical contact with the N+ diffusion. The method further includes forming a device between the N+ diffusion and the P+ diffusion. A method of annealing a structure or material includes applying an electrical pulse across an electrostatic discharge (ESD) N+/P+ structure for a plurality of nanoseconds.
    Type: Grant
    Filed: January 14, 2014
    Date of Patent: January 30, 2018
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Michel J. Abou-Khalil, Robert J. Gauthier, Jr., Tom C. Lee, Junjun Li, Souvick Mitra, Christopher S. Putnam, Robert R. Robison
  • Patent number: 9881926
    Abstract: A method is presented for forming a semiconductor structure. The method includes forming gate contacts on a semiconductor substrate, forming trench silicide (TS) contacts on the semiconductor substrate, recessing the TS contacts to form a gap region, filling the gap region of the recessed TS contacts with a dielectric, selectively etching the gate contacts to form a first conducting layer, and selectively etching the TS contacts to form a second conducting layer.
    Type: Grant
    Filed: October 24, 2016
    Date of Patent: January 30, 2018
    Assignee: International Business Machines Corporation
    Inventors: Veeraraghavan S. Basker, Kangguo Cheng, Sivananda K. Kanakasabapathy, Theodorus E. Standaert, Junli Wang
  • Patent number: 9871047
    Abstract: A semiconductor structure includes a SRAM cell having transistors defined by fins and metal gate stack structures. A transistor and a corresponding pick up cell are disposed in an extension direction of the fins. The transistor and the corresponding pick up cell have metal gate stack structures of the same type.
    Type: Grant
    Filed: January 20, 2017
    Date of Patent: January 16, 2018
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Yu-Lin Wang, Wei-Chi Lee
  • Patent number: 9824748
    Abstract: Static random access memory (SRAM) bitcell structures with improved minimum operation voltage (Vmin) and yield are provided. The structures may include a silicon substrate, a deep n-well (DNW) layer, p-well (PW) regions, doped back-plate (BP) regions, a buried oxide (BOX) layer, and/or active regions formed on the BOX layer and over portions of the BP regions. At least one BP region may extend below at least one shallow trench isolation (STI) region, at least one contact to back plate (CBP), at least one active region and at least one PC construct overlapping the at least one active region forming a channel of at least one of a first pull-up (PU1) transistor and a second pull-up (PU2) transistor. The at least one CBP facilitates biasing of at least one the PU1 and PU2 transistors during at least one of a read, write or standby operation of the structures.
    Type: Grant
    Filed: December 30, 2016
    Date of Patent: November 21, 2017
    Assignee: GLOBALFOUNDRIES Inc.
    Inventors: Hui Zang, Manfred Eller, Min-hwa Chi
  • Patent number: 9697874
    Abstract: Providing for a monolithic memory device comprising a combination of a one-transistor, one-resistor (1T1R) memory array, and a one-transistor, multiple-resistor (1TnR, where n is a suitable integer greater than 1) memory array is described herein. By way of example, the monolithic memory device can be a stand-alone device, configured to perform functions in response to predetermined conditions and generate an output(s), or can be a removable device that can be connected to and operable with another device. In various embodiments, the 1TnR array having high memory density can serve as storage class memory (SCM) for the monolithic memory device, and the 1T1R array having high performance and efficacy can serve as code memory. In addition to the foregoing, the 1T1R array and the 1TnR array can be fabricated from at least one common layer or a common processing step, to simplify and lower cost of fabricating disclosed memory devices.
    Type: Grant
    Filed: June 9, 2016
    Date of Patent: July 4, 2017
    Assignee: CROSSBAR, INC.
    Inventors: Mehdi Asnaashari, Sundar Narayanan
  • Patent number: 9601495
    Abstract: A three-dimensional semiconductor device includes a semiconductor substrate, fin(s) coupled to the substrate and surrounded at a bottom portion thereof by isolation material, each fin including a source region, a drain region and a channel region therebetween, a first gate and spacers over a portion of each fin, and a second gate and spacers, the second gate encompassing a common end portion of each fin. The first gate and corresponding source and drain regions act as an access transistor, and the second gate and common end portion(s) of the fin(s) act as a storage capacitor, and a top surface of the second gate acts as a plate for the storage capacitor, when multiple cells are arranged in an array.
    Type: Grant
    Filed: July 30, 2015
    Date of Patent: March 21, 2017
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Hui Zang, Min-hwa Chi
  • Patent number: 9590074
    Abstract: The method for preventing epitaxial growth in a semiconductor device begins with patterning a photoresist layer over a semiconductor structure having a set of fin ends on a set of fins of a FinFET structure. The set of fins are isolated from one another by a first dielectric material. The photoresist is patterned over the set of fin ends so that it differs from the photoresist pattern over other areas of the FinFET structure. A set of dielectric blocks is formed on the set of fin ends using the photoresist pattern. The set of dielectric blocks prevents epitaxial growth at the set of fin ends in a subsequent epitaxial growth step. In another aspect of the invention, a semiconductor device includes a set of fin structures having a set of fin ends at a respective vertical surface of a fin structure and is separated by a set of trenches from other fin structures. Each of the fin structures has a top surface which is higher than a top surface of a dielectric material in the set of trenches.
    Type: Grant
    Filed: December 5, 2015
    Date of Patent: March 7, 2017
    Assignees: International Business Machines Corporation, GlobalFoundries Inc.
    Inventors: Balasubramanian Pranatharthiharan, Hui Zang
  • Patent number: 9484068
    Abstract: An MTP (Many Times Programmable) memory cell for integrated circuit memory arrays is described. The cell includes an MTP device and a thyristor interconnected so that the MTP device triggers the thyristor to turn on during a Read or Verify operation. The difference in threshold voltages between a data memory cell and a reference memory cell is used to determine the information in the data memory cell. Different memory cell structures may be constructed for different memory array requirements.
    Type: Grant
    Filed: February 16, 2016
    Date of Patent: November 1, 2016
    Assignee: Kilopass Technology, Inc.
    Inventors: Colin Stewart Bill, Harry Luan
  • Patent number: 9406607
    Abstract: A method includes forming a transistor at a surface of a semiconductor substrate, wherein the step of forming the transistor comprises forming a gate electrode, and forming a source/drain region adjacent the gate electrode. First metal features are formed to include at least portions at a same level as the gate electrode. Second metal features are formed simultaneously, and are over and contacting the first metal features. A first one of the second metal features is removed and replaced with a third metal feature, wherein a second one of the second metal features is not removed. A fourth metal feature is formed directly over and contacting the gate electrode, wherein the third and the fourth metal features are formed using a same metal-filling process.
    Type: Grant
    Filed: October 21, 2013
    Date of Patent: August 2, 2016
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei Yu Ma, Fang-Tsun Chu, Kvei-Feng Yen, Yao-Bin Wang
  • Patent number: 9391080
    Abstract: An approach for providing SRAM bit cells with miniaturized bit cells, without local interconnection layers, with improved lithographic printability, and enabling methodology are disclosed. Embodiments include providing first color structures, in a M1 layer, including a first word line, a first bit line, a second bit line, a first ground line, a second ground line, a second latch line or a combination thereof, wherein the first color structures include side edges longer than tip edges; providing second color structures, in the M1 layer, including a second word line, a first power line, a second power line, a first latch line or a combination thereof, wherein the second color structures include side edges longer than tip edges; and forming a bit cell including the first color structures and the second color structures, wherein adjacent tip edges include a first color structure tip edge and a second color structure tip edge.
    Type: Grant
    Filed: April 28, 2015
    Date of Patent: July 12, 2016
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Juhan Kim, Mahbub Rashed
  • Patent number: 9385716
    Abstract: A semiconductor device includes a first block coupled between a first latch node and a second latch node, a second block suitable for generating common-mode noise between the first latch node and the second latch node, wherein the second block includes a first MOS transistor having a gate coupled with the first latch node, and one between a source and a drain of the first MOS transistor is coupled with the second latch node while the other between the source and the drain is floating.
    Type: Grant
    Filed: December 12, 2014
    Date of Patent: July 5, 2016
    Assignee: SK Hynix Inc.
    Inventors: Seong-Jin Kim, Sung-Soo Chi
  • Patent number: 9379014
    Abstract: A static random-access memory (SRAM) array includes a first metal layer and a second metal layer. The metal layer includes multiple first source lines spanning multiple columns of cells. The multiple first source lines include a first source line and a second source line. The second metal layer includes multiple second source lines spanning multiple rows of cells. The SRAM array further includes a set of vias coupled to the multiple first source lines and to the multiple second source lines. A first via of the set of vias is coupled to the first source line and multiple vias of the set of vias are coupled to the second source line. Two vias of the multiple vias that are closest to the first via are each substantially the same distance from the first via.
    Type: Grant
    Filed: July 18, 2015
    Date of Patent: June 28, 2016
    Assignee: QUALCOMM Incorporated
    Inventors: Niladri Narayan Mojumder, Stanley Seungchul Song, Choh Fei Yeap, Mosaddiq Saifuddin
  • Patent number: 9041117
    Abstract: A Static Random Access Memory (SRAM) cell includes a first pull-up transistor and a second pull-up transistor, and a first pull-down transistor and a second pull-down transistor forming cross-latched inverters with the first pull-up transistor and the second pull-up transistor. A conductive feature includes a first leg having a first longitudinal direction, wherein the first leg interconnects a drain of the first pull-up transistor and a drain of the first pull-down transistor. The conductive feature further includes a second leg having a second extending direction. The first longitudinal direction and the second extending direction are un-perpendicular and un-parallel to each other. The second leg interconnects the drain of the first pull-up transistor and a gate of the second pull-up transistor.
    Type: Grant
    Filed: November 13, 2012
    Date of Patent: May 26, 2015
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventor: Jhon-Jhy Liaw
  • Patent number: 9029951
    Abstract: A semiconductor device with an SRAM memory cell having improved characteristics. Below an active region in which a driver transistor including a SRAM is placed, an n type back gate region surrounded by an element isolation region is provided via an insulating layer. It is coupled to the gate electrode of the driver transistor. A p well region is provided below the n type back gate region and at least partially extends to a position deeper than the element isolation region. It is fixed at a grounding potential. Such a configuration makes it possible to control the threshold potential of the transistor to be high when the transistor is ON and to be low when the transistor is OFF; and control so as not to apply a forward bias to the PN junction between the p well region and the n type back gate region.
    Type: Grant
    Filed: July 22, 2012
    Date of Patent: May 12, 2015
    Assignee: Renesas Electronics Corporation
    Inventors: Katsuyuki Horita, Toshiaki Iwamatsu, Hideki Makiyama
  • Patent number: 9029956
    Abstract: A static random access memory cell is provided that includes first and second inverters formed on a substrate each having a pull-up and pull-down transistor configured to form a cell node. Each of the pull-down transistors of the first and second inverters resides over first regions below the buried oxide layer and having a first doping level and applied bias providing a first voltage threshold for the pull-down transistors. A pair of passgate transistors is coupled the cell nodes of the first and second inverters, and each is formed over second regions below the buried oxide layer and having a second doping level and applied bias providing a second voltage threshold for the passgate transistors. The first voltage threshold differs from the second voltage threshold providing electrical voltage threshold control between the pull-down transistors and the passgate transistors.
    Type: Grant
    Filed: October 26, 2011
    Date of Patent: May 12, 2015
    Assignee: Global Foundries, Inc.
    Inventors: Randy W. Mann, Scott D. Luning
  • Patent number: 9006826
    Abstract: The present disclosure relates to an SRAM memory cell. The SRAM memory cell has a semiconductor substrate with an active area and a gate region positioned above the active area. A butted contact extends along a length (i.e., the larger dimension of the butted contact) from a position above the active area to a position above the gate region. The butted contact contains a plurality of distinct regions having different widths (i.e., the smaller dimensions of the butted contact), such that a region spanning the active area and gate region has width less than the regions in contact with the active area or gate region. By making the width of the region spanning the active area and gate region smaller than the regions in contact with the active area or gate, the etch rate is reduced at a junction of the gate region with the active area, thereby preventing etch back of the gate material and leakage current.
    Type: Grant
    Filed: May 14, 2012
    Date of Patent: April 14, 2015
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventor: Tzyh-Cheang Lee
  • Patent number: 9006841
    Abstract: A dual port SRAM has two data storage nodes, a true data and complementary data. A first pull down transistor has an active area that forms the drain region of the first transistor and the true data storage node that is physically isolated from all other transistor active areas of the memory cell. A second pull down transistor has an active area that forms the drain region of a second transistor that is the complementary data node that is physically isolated from all other transistor active areas of the memory cell.
    Type: Grant
    Filed: August 22, 2012
    Date of Patent: April 14, 2015
    Assignee: STMicroelectronics International N.V.
    Inventors: Shishir Kumar, Dibya Dipti, Pierre Malinge
  • Patent number: 8975699
    Abstract: Improvements are achieved in the characteristics of a semiconductor device including SRAM memory cells. Under an active region in which an access transistor forming an SRAM is disposed, a p-type semiconductor region is disposed via an insulating layer such that the bottom portion and side portions thereof come in contact with an n-type semiconductor region. Thus, the p-type semiconductor region is pn-isolated from the n-type semiconductor region, and the gate electrode of the access transistor is coupled to the p-type semiconductor region. The coupling is achieved by a shared plug which is an indiscrete conductive film extending from over the gate electrode of the access transistor to over the p-type semiconductor region. As a result, when the access transistor is in an ON state, a potential in the p-type semiconductor region serving as a back gate simultaneously increases to allow an increase in an ON current for the transistor.
    Type: Grant
    Filed: September 24, 2014
    Date of Patent: March 10, 2015
    Assignee: Renesas Electronics Corporation
    Inventors: Toshiaki Iwamatsu, Katsuyuki Horita, Hideki Makiyama
  • Patent number: 8952418
    Abstract: Some embodiments include gated bipolar junction transistors. The transistors may include a base region between a collector region and an emitter region; with a B-C junction being at an interface of the base region and the collector region, and with a B-E junction being at an interface of the base region and the emitter region. The transistors may include material having a bandgap of at least 1.2 eV within one or more of the base, emitter and collector regions. The gated transistors may include a gate along the base region and spaced from the base region by dielectric material, with the gate not overlapping either the B-C junction or the B-E junction. Some embodiments include memory arrays containing gated bipolar junction transistors. Some embodiments include methods of forming gated bipolar junction transistors.
    Type: Grant
    Filed: March 1, 2011
    Date of Patent: February 10, 2015
    Assignee: Micron Technology, Inc.
    Inventors: Rajesh N. Gupta, Farid Nemati, Scott T. Robins
  • Patent number: 8947912
    Abstract: Memory cells are described with cross-coupled inverters including unidirectional gate conductors. Gate conductors for access transistors may also be aligned with a long axis of the inverter gate conductor. Contacts of one inverter in a cross-coupled pair may be aligned with a long axis of the other inverter's gate conductor. Separately formed rectangular active regions may be orthogonal to the gate conductors across pull up, pull down and access transistors. Separate active regions may be formed such that active regions associated with an access transistor and/or a pull up transistor are noncontiguous with, and narrower than, an active region associated with a pull down transistor of the inverter. The major components of 6T SRAM, and similar, memory cell topologies may be formed essentially from an array of rectangular lines, including unidirectional gate conductors and contacts, and unidirectional rectangular active regions crossing gate conductors of the inverters and access transistors.
    Type: Grant
    Filed: July 20, 2011
    Date of Patent: February 3, 2015
    Assignee: University of Virginia Licensing & Ventures Group
    Inventors: Benton H. Calhoun, Randy W. Mann
  • Patent number: 8934287
    Abstract: A method for providing a SRAM cell having a dedicated read port separated from a write port includes providing a first and a second bit-line placed in parallel forming a complementary bit-line pair for the dedicated read port, and providing a third and a fourth bit-line placed in parallel forming a complementary bit-line pair for the write port. The method further includes providing a positive voltage supply line disposed between a first and a second ground line placed in parallel, providing a first and a second metal line adjacently flanking and in parallel to the first bit-line, and providing a third and a fourth metal line adjacently flanking and in parallel to the second bit-line to provide a new SRAM cell structure having a balanced read and write operation speed and an improved noise margin.
    Type: Grant
    Filed: November 7, 2013
    Date of Patent: January 13, 2015
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventor: Jhon Jhy Liaw
  • Patent number: 8929115
    Abstract: A ternary content addressable memory (TCAM) is formed by TCAM cells that are arranged in an array. Each TCAM cell includes a first and second SRAM cells and a comparator. The SRAM cells predominantly in use have a horizontal topology with a rectangular perimeter defined by longer and shorter side edges. The match lines for the TCAM extend across the array, and are coupled to TCAM cells along an array column. The bit lines extend across the array, and coupled to TCAM cells along an array row. Each match line is oriented in a first direction (the column direction) that is parallel to the shorter side edge of the horizontal topology layout for the SRAM cells in each CAM cell. Each bit line is oriented in a second direction (the row direction) that is parallel to the longer side edge of the horizontal topology layout for the SRAM cells in each CAM cell.
    Type: Grant
    Filed: November 30, 2011
    Date of Patent: January 6, 2015
    Assignee: STMicroelectronics International N.V.
    Inventor: Nishu Kohli
  • Patent number: 8928062
    Abstract: A nonvolatile semiconductor memory device includes a plurality of nonvolatile memory cells formed on a semiconductor substrate, each memory cell including source and drain regions separately formed on a surface portion of the substrate, buried insulating films formed in portions of the substrate that lie under the source and drain regions and each having a dielectric constant smaller than that of the substrate, a tunnel insulating film formed on a channel region formed between the source and drain regions, a charge storage layer formed of a dielectric body on the tunnel insulating film, a block insulating film formed on the charge storage layer, and a control gate electrode formed on the block insulating film.
    Type: Grant
    Filed: March 23, 2009
    Date of Patent: January 6, 2015
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Naoki Yasuda
  • Patent number: 8921179
    Abstract: Methodology enabling a reduction of edge and strap cell size, and the resulting device are disclosed. Embodiments include: providing first and second NW regions on a substrate; providing first and second RX regions on the first and second NW regions, respectively; providing a contact on the substrate connecting the first and second RX regions; and providing a dummy PC on the substrate connecting the first and second RX regions. Other embodiments include: determining an RX region of an IC design; determining a PPLUS mask region extending along a horizontal direction and being on an entire upper surface of the RX region; determining a NW region extending along a vertical direction and separated from the RX region; and comparing an area of an overlap of the NW region and PPLUS mask region to a threshold value.
    Type: Grant
    Filed: February 13, 2013
    Date of Patent: December 30, 2014
    Assignee: GlobalFoundries Inc.
    Inventors: Bipul C. Paul, Anurag Mittal, Pierre Malinge
  • Patent number: 8908419
    Abstract: A semiconductor storage device includes a memory cell array, a plurality of word lines, a plurality of bit lines, a first gate wiring element 3a, 3b, a second gate wiring element 3c, 3d, a first connector 5a, 5b, and a second connector 5c, 5d. Each memory cell 10 has first and second sets having a driver transistor 11, a load transistor 12, and an access transistor 13. The word lines are arranged in parallel to each other along a first direction. The bit lines are arranged in parallel to each other along a second direction perpendicular to the first direction. The first gate wiring element comprises a gate electrode of the first driver transistor and the first load transistor, and has a rectangular shape having straight line on opposite sides. The second gate wiring element comprises a gate electrode of the access transistor and has a rectangular shape having straight line on opposite sides.
    Type: Grant
    Filed: March 18, 2013
    Date of Patent: December 9, 2014
    Assignee: Renesas Electronics Corporation
    Inventors: Hidemoto Tomita, Shigeki Ohbayashi, Yoshiyuki Ishigaki
  • Patent number: 8860096
    Abstract: An SRAM cell of a semiconductor device includes a load transistor, a driver transistor and an access transistor. First source/drains of the load, driver and access transistors are connected to a node. A power line, a ground line and a bit line are electrically connected to second source/drains of the load transistor, the driver transistor and the access transistor. The power line, the ground line and the bit line are disposed at substantially the same level to extend in a first direction. A word line is electrically connected to a gate of the access transistor to extend in a second direction perpendicular to the first direction. The word line is disposed at a different level from the level of the power line, the ground line and the bit line.
    Type: Grant
    Filed: January 19, 2011
    Date of Patent: October 14, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: OhKyum Kwon, Byungsun Kim, Taejung Lee
  • Patent number: 8853700
    Abstract: Cross-coupling between a gate conductor and an active region of a semiconductor substrate is provided by forming a gate dielectric layer on the semiconductor substrate and lithographically patterning the gate dielectric layer to form opening therein over a portion of the active region at which electrical contact with the gate conductor is desired. After implanting electrical dopants, a gate conductor layer is deposited and patterned. A remaining portion of the gate conductor layer includes an integral conductor structure, which includes a first portion overlying a gate dielectric over an active region and a second portion contacting the semiconductor material of the same active region or a different active region. The gate dielectric layer can be deposited within gate cavities in planarization dielectric material layer in a replacement gate scheme, or can be deposited on planar surfaces of active regions and/or shallow trench isolation structures in a gate first processing scheme.
    Type: Grant
    Filed: August 10, 2011
    Date of Patent: October 7, 2014
    Assignee: International Business Machines Corporation
    Inventors: Viraj Y. Sardesai, Robert C. Wong
  • Patent number: 8772841
    Abstract: Methods, devices, and systems associated with oxide based memory can include a method of forming an oxide based memory cell. Forming an oxide based memory cell can include forming a first conductive element, forming an oxide over the first conductive element, implanting a reactive metal into the oxide, and forming a second conductive element over the oxide.
    Type: Grant
    Filed: September 14, 2012
    Date of Patent: July 8, 2014
    Assignee: Micron Technology, Inc.
    Inventors: D.V. Nirmal Ramaswamy, Gurtej S. Sandhu
  • Patent number: 8723181
    Abstract: Stacked transistors and electronic devices including the stacked transistors. An electronic device includes a substrate, a first transistor on the substrate and including a first active layer, a first gate, and a first gate insulating layer between the first active layer and the first gate, a first metal line spaced apart from the first gate on the substrate, a first insulating layer covering the first transistor and the first metal line, and a second transistor on the first insulating layer between the first transistor and the first metal line, and including a second active layer, a second gate, and a second gate insulating layer between the second active layer and the second gate.
    Type: Grant
    Filed: April 8, 2010
    Date of Patent: May 13, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Huaxiang Yin, Takashi Noguchi, Wenxu Xianyu, Kyung-bae Park
  • Patent number: 8710592
    Abstract: An SRAM cell includes a first PMOS pass transistor comprising a first gate electrode disposed on a first PMOS active region, a first NMOS pass transistor comprising a second gate electrode disposed on a first NMOS active region, a first PMOS pull-up transistor and a first NMOS pull-down transistor sharing a third gate electrode disposed on the first PMOS active region and the first NMOS active region and extending therebetween, a second PMOS pass transistor comprising a fourth gate electrode disposed on a second PMOS active region, a second NMOS pass transistor comprising a fifth gate electrode disposed on a second NMOS active region and a second pull-up transistor and a second pull-down transistor sharing a sixth gate electrode disposed on the second PMOS active region and the second NMOS active region and extending therebetween.
    Type: Grant
    Filed: March 5, 2012
    Date of Patent: April 29, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sunme Lim, Hanbyung Park, Ho-Kwon Cha
  • Patent number: 8703566
    Abstract: A memory device includes an array of memory cells and peripheral devices. At least some of the individual memory cells include carbonated portions that contain SiC. At least some of the peripheral devices do not include any carbonated portions. A transistor includes a first source/drain, a second source/drain, a channel including a carbonated portion of a semiconductive substrate that contains SiC between the first and second sources/drains and a gate operationally associated with opposing sides of the channel.
    Type: Grant
    Filed: May 24, 2013
    Date of Patent: April 22, 2014
    Assignee: Micron Technology, Inc.
    Inventor: Chandra Mouli
  • Patent number: 8691633
    Abstract: A semiconductor device is provided that includes a substrate, a static random access memory (SRAM) unit cell formed in the substrate, a first metal layer formed over the substrate the first metal layer providing local interconnection to the SRAM unit cell, a second metal layer formed over the first metal layer, the second metal layer including: a bit line and a complementary bit line each having a first thickness and a Vcc line disposed between the bit line and the complementary bit line, and a third metal layer formed over the second metal layer, the third metal layer including a word line having a second thickness greater than the first thickness.
    Type: Grant
    Filed: February 22, 2013
    Date of Patent: April 8, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventor: Jhon Jhy Liaw
  • Patent number: 8692317
    Abstract: An SRAM cell using a vertical MISFET is provided, wherein underside source/drain areas of a first access transistor, a first driving transistor and a first load transistor are connected together, and further connected to gates of a second driving transistor and a second load transistor. Underside source/drain areas of a second access transistor, the second driving transistor and the second load transistor are connected together, and further connected to gates of the first driving transistor and the first load transistor. A first arrangement of the first access transistor, the first driving transistor and the first load transistor, and a second arrangement of the second access transistor, the second driving transistor and the second load transistor are symmetric to each other.
    Type: Grant
    Filed: April 14, 2009
    Date of Patent: April 8, 2014
    Assignee: NEC Corporation
    Inventor: Kiyoshi Takeuchi
  • Patent number: 8614463
    Abstract: A layout configuration for a memory cell array includes at least a comb-like doped region having a first conductivity type and a fishbone-shaped doped region having a second conductivity type. The second conductivity type and the first conductivity type are complementary. Furthermore, the comb-like doped region and the fishbone-shaped doped region are interdigitated.
    Type: Grant
    Filed: November 2, 2011
    Date of Patent: December 24, 2013
    Assignee: United Microelectronics Corp.
    Inventors: Meng-Ping Chuang, Yu-Tse Kuo, Chia-Chun Sun, Yun-San Huang
  • Patent number: 8604522
    Abstract: In one embodiment, a semiconductor device includes a well region of a second conductivity type, a control electrode, a first main electrode and a second main electrode. The well region has a source region and a drain region of a first conductivity type selectively formed in a surface of the well region. The control electrode is configured to control a current path between the source region connected to the first main electrode and the drain region connected to the second main electrode. With respect to a reference defined as a position of the well region at an identical depth to a portion of the source region or the drain region with maximum curvature, a peak of impurity concentration distribution of the second conductivity type is in a range of 0.15 micrometers on a side of the surface of the well region and on a side opposite to the surface.
    Type: Grant
    Filed: January 17, 2011
    Date of Patent: December 10, 2013
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Masataka Takebuchi, Kazuhiro Utsunomiya, Noriyasu Ikeda
  • Patent number: 8604557
    Abstract: A semiconductor memory device includes: a first n-type transistor; a first p-type transistor; a first wiring layer having a first interconnecting portion for connecting a drain of the first n-type transistor and a drain of the first p-type transistor; and a second wiring layer having a first conductive portion electrically connected to the first interconnecting portion.
    Type: Grant
    Filed: December 10, 2008
    Date of Patent: December 10, 2013
    Assignee: Fujitsu Semiconductor Limited
    Inventor: Narumi Ohkawa
  • Patent number: 8587036
    Abstract: A non-volatile memory is formed on a substrate. The non-volatile memory includes an isolation structure, a floating gate, and a gate dielectric layer. The isolation structure is disposed in the substrate to define an active area. The floating gate is disposed on the substrate and crosses over the active area. The gate dielectric layer is disposed between the floating gate and the substrate. The floating gate includes a first region and a second region. An energy band of the second region is lower than an energy band of the first region, so that charges stored in the floating gate are away from an overlap region of the floating gate and the gate dielectric layer.
    Type: Grant
    Filed: December 12, 2008
    Date of Patent: November 19, 2013
    Assignee: eMemory Technology Inc.
    Inventors: Shih-Chen Wang, Wen-Hao Ching
  • Patent number: 8575697
    Abstract: An SRAM-type memory cell that includes a semiconductor on insulator substrate having a thin film of semiconductor material separated from a base substrate by an insulating layer; and six transistors such as two access transistors, two conduction transistors and two charge transistors arranged so as to form with the conduction transistors two back-coupled inverters. Each of the transistors has a back control gate formed in the base substrate below the channel and able to be biased in order to modulate the threshold voltage of the transistor, with a first back gate line connecting the back control gates of the access transistors to a first potential and a second back gate line connecting the back control gates of the conduction transistors and charge transistors to a second potential. The first and second potentials can be modulated according to the type of cell control operation.
    Type: Grant
    Filed: March 2, 2011
    Date of Patent: November 5, 2013
    Assignee: Soitec
    Inventors: Carlos Mazure, Richard Ferrant, Bich-Yen Nguyen
  • Patent number: 8525270
    Abstract: The methods and structures described are used to prevent protrusion of contact metal (such as W) horizontally into gate stacks of neighboring devices to affect the work functions of these neighboring devices. The metal gate under contact plugs that are adjacent to devices and share the (or are connected to) metal gate is defined and lined with a work function layer that has good step coverage to prevent contact metal from extruding into gate stacks of neighboring devices. Only modification to the mask layout for the photomask(s) used for removing dummy polysilicon is involved. No additional lithographical operation or mask is needed. Therefore, no modification to the manufacturing processes or additional substrate processing steps (or operations) is involved or required. The benefits of using the methods and structures described above may include increased device yield and performance.
    Type: Grant
    Filed: February 26, 2010
    Date of Patent: September 3, 2013
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Lee-Wee Teo, Ming Zhu, Chi-Ju Lee, Sheng-Chen Chung, Kai-Shyang You, Harry-Hak-Lay Chuang
  • Patent number: 8476717
    Abstract: A semiconductor structure. The semiconductor structure includes: a semiconductor substrate which includes a top substrate surface which defines a reference direction perpendicular to the top substrate surface and further includes a first semiconductor body region and a second semiconductor body region; a first gate dielectric region and a second gate dielectric region on top of the first and second semiconductor body regions, respectively; a first gate electrode region on top of the semiconductor substrate and the first gate dielectric region; a second gate electrode region on top of the semiconductor substrate and the second gate dielectric region; and a gate divider region in direct physical contact with the first and second gate electrode regions. The gate divider region does not overlap the first and second gate electrode regions in the reference direction.
    Type: Grant
    Filed: January 25, 2012
    Date of Patent: July 2, 2013
    Assignee: International Business Machines Corporation
    Inventors: Robert C. Wong, Haining S. Yang
  • Patent number: 8476138
    Abstract: Vertical MISFETs are formed over drive MISFETs and transfer MISFETs. The vertical MISFETs comprise rectangular pillar laminated bodies each formed by laminating a lower semiconductor layer (drain), an intermediate semiconductor layer, and an upper semiconductor layer (source), and gate electrodes formed on corresponding side walls of the laminated bodies with gate insulating films interposed therebetween. In each vertical MISFET, the lower semiconductor layer constitutes a drain, the intermediate semiconductor layer constitutes a substrate (channel region), and the upper semiconductor layer constitutes a source. The lower semiconductor layer, the intermediate semiconductor layer and the upper semiconductor layer are each comprised of a silicon film. The lower semiconductor layer and the upper semiconductor layer are doped with a p type and constituted of a p type silicon film.
    Type: Grant
    Filed: June 1, 2011
    Date of Patent: July 2, 2013
    Assignees: Hitachi ULSI Systems Co., Ltd., Renesas Electronics Corporation
    Inventors: Hiraku Chakihara, Kousuke Okuyama, Masahiro Moniwa, Makoto Mizuno, Keiji Okamoto, Mitsuhiro Noguchi, Tadanori Yoshida, Yasuhiko Takahshi, Akio Nishida