Consisting Of Soldered Or Bonded Constructions (epo) Patents (Class 257/E23.023)
- Additional leads (EPO) (Class 257/E23.032)
- Characterized by die pad (EPO) (Class 257/E23.037)
- Multilayer (EPO) (Class 257/E23.041)
- Plurality of lead frames mounted in one device (EPO) (Class 257/E23.042)
- Geometry of lead frame (EPO) (Class 257/E23.043)
- For devices adapted for rectifying, amplifying, oscillating, or switching, capacitors, or resistors with at least one potential-jump barrier or surface barrier (EPO) (Class 257/E23.044)
- Deformation absorbing parts in lead frame plane, e.g., meanderline shape (EPO) (Class 257/E23.045)
- Cross-section geometry (EPO) (Class 257/E23.046)
- Insulating layers on lead frame, e.g., bridging members (EPO) (Class 257/E23.049)
- Specifically adapted to facilitate heat dissipation (EPO) (Class 257/E23.051)
- Assembly of semiconductor devices on lead frame (EPO) (Class 257/E23.052)
- Characterized by materials of lead frames or layers thereon (EPO) (Class 257/E23.053)
- Consisting of thin flexible metallic tape with or without film carrier (EPO) (Class 257/E23.055)
- Insulating layers on lead frames (EPO) (Class 257/E23.056)
- Capacitor integral with or on lead frame (EPO) (Class 257/E23.057)
- Battery in combination with lead frame (EPO) (Class 257/E23.058)
- Oscillators in combination with lead frame (EPO) (Class 257/E23.059)
- Leads being also applied on sidewalls or bottom of substrate, e.g., leadless packages for surface mounting (EPO) (Class 257/E23.061)
- Multilayer substrates (EPO) (Class 257/E23.062)
- Chip support structure consisting of plurality of insulating substrates (EPO) (Class 257/E23.063)
- For flat cards, e.g., credit cards (EPO) (Class 257/E23.064)
- Flexible insulating substrates (EPO) (Class 257/E23.065)
- Lead frames fixed on or encapsulated in insulating substrates (EPO) (Class 257/E23.066)
- Via connections through substrates, e.g., pins going through substrate, coaxial cables (EPO) (Class 257/E23.067)
- Additional leads joined to metallizations on insulating substrate, e.g., pins, bumps, wires, flat leads (EPO) (Class 257/E23.068)
- Geometry or layout (EPO) (Class 257/E23.07)
- Characterized by materials (EPO) (Class 257/E23.072)
- Conductive materials containing semiconductor material (EPO) (Class 257/E23.073)
- Carbon, e.g., fullerenes (EPO) (Class 257/E23.074)
- Conductive materials containing organic materials or pastes, e.g., for thick films (EPO) (Class 257/E23.075)
- Conductive materials containing superconducting material (EPO) (Class 257/E23.076)
- Materials of insulating layers or coatings (EPO) (Class 257/E23.077)