Comprising Luminescent Material (e.g., Fluorescent) (epo) Patents (Class 257/E33.061)
  • Patent number: 8890196
    Abstract: A solid-state light source has light emitting diodes embedded in a thermally conductive translucent luminescent element. The thermally conductive translucent luminescent element has optically translucent thermal filler and at least one luminescent element in a matrix material. A leadframe is electrically connected to the light emitting diodes. The leadframe distributes heat from the light emitting diodes to the thermally conductive translucent luminescent element. The thermally conductive translucent luminescent element distributes heat from light emitting diodes and the thermally conductive translucent luminescent element.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: November 18, 2014
    Assignee: Goldeneye, Inc.
    Inventors: Scott M. Zimmerman, William R. Livesay, Richard L. Ross, Eduardo DeAnda
  • Patent number: 8890187
    Abstract: A low-power light-emitting device which can be manufactured in simple steps and is suitable for increasing definition and the size of a substrate is provided. The light-emitting device includes a layer for blocking visible light; a conductive layer that partly overlaps with the layer for blocking visible light; a color filter layer that includes an opening over the layer for blocking visible light; a first electrode layer for transmitting visible light that is connected to the conductive layer through the opening, over the color filter layer; an insulating partition over the first electrode layer overlapping with the opening; a layer containing an organic compound over the first electrode layer and the partition; and a second electrode layer over the layer containing an organic compound. The layer containing an organic compound includes a layer containing a donor substance and an acceptor substance and a layer containing a light-emitting organic compound.
    Type: Grant
    Filed: April 13, 2011
    Date of Patent: November 18, 2014
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventor: Ryo Arasawa
  • Patent number: 8884327
    Abstract: According to one embodiment, a semiconductor light emitting device includes a light emitting chip and a fluorescent material layer. The light emitting chip includes a semiconductor layer, a first electrode, a second electrode, an insulating layer, a first interconnect layer, a second interconnect layer, a first metal pillar, a second metal pillar, and a resin layer. The semiconductor layer includes a light emitting layer, a first major surface, and a second major surface formed on a side opposite to the first major surface. The fluorescent material layer is provided on the first major surface and has a larger planer size than the light emitting chip.
    Type: Grant
    Filed: September 21, 2010
    Date of Patent: November 11, 2014
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Yoshiaki Sugizaki, Hideki Shibata, Akihiro Kojima, Masayuki Ishikawa, Hideo Tamura, Tetsuro Komatsu
  • Patent number: 8883530
    Abstract: A device manufacturing method including substrate preparation, pixel electrode formation, photosensitive film formation, first part exposure, second part exposure, and development. In first part exposure, after execution of photosensitive film formation, first photomask is arranged to face substrate and exposure is performed to cause first part of photosensitive film to be exposed to light via first photomask. In second part exposure, after or together with execution of first part exposure, second photomask is arranged to face substrate and exposure is performed to cause second part of photosensitive film, which is different from first part at least partially, to be exposed to light via second photomask. In second part exposure, second photomask is arranged such that end thereof overlaps with end of first photomask, and overlap between first and second photomasks positionally corresponds to electrical wire.
    Type: Grant
    Filed: June 7, 2012
    Date of Patent: November 11, 2014
    Assignee: Panasonic Corporation
    Inventor: Seiji Nishiyama
  • Patent number: 8877528
    Abstract: A method for producing a light emitting transfer sheet includes the steps of preparing a light emitting element sheet including a light semiconductor layer connected to an electrode portion on one side surface and a phosphor layer laminated on the other side surface; dividing the light emitting element sheet into plural pieces to form a plurality of light emitting elements; disposing a plurality of the light emitting elements on a substrate to be spaced apart from each other; forming a reflecting resin layer containing a light reflecting component on the substrate so as to cover the light emitting elements; and removing the reflecting resin layer partially so that one side surface of the electrode portion is exposed from the reflecting resin layer.
    Type: Grant
    Filed: April 13, 2012
    Date of Patent: November 4, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Yasunari Ooyabu, Toshiki Naito, Satoshi Sato
  • Patent number: 8872208
    Abstract: A light source can include: a light source that emits light of a predetermined wavelength within a wavelength region covering the wavelength of ultraviolet light and that of visible light; and a wavelength conversion layer containing a fluorescent material of at least one type that is excited by excitation light from the fixed light source to emit fluorescent light of a wavelength longer than that of light emitted from the fixed light source. The fixed light source and the wavelength conversion layer can be spaced from each other. The light source device can employ a reflection system of extracting at least fluorescent light from an incident surface of the wavelength conversion layer through which excitation light from the fixed light source enters the wavelength conversion layer. The wavelength conversion layer can have a surface structure with depressions or projections.
    Type: Grant
    Filed: May 21, 2012
    Date of Patent: October 28, 2014
    Assignee: Stanley Electric Co., Ltd.
    Inventor: Yasuyuki Kawakami
  • Patent number: 8872210
    Abstract: According to one embodiment, a semiconductor light emitting device includes a light emitting element, a phosphor layer, and a fluorescent reflection film. The phosphor layer has a transparent medium, a phosphor dispersed in the transparent medium, and a particle dispersed in the transparent medium. The phosphor is excited by the excitation light so as to emit a fluorescence. The particle is a magnitude of not more than 1/10 a wavelength of the excitation light. The particle has a different refractive index from a refractive index of the transparent medium. The fluorescent reflection film is provided between the light emitting element and the phosphor layer. The fluorescent reflection film has a higher reflectance with respect to a fluorescent wavelength of the phosphor, than a reflectance with respect to the wavelength of the excitation light.
    Type: Grant
    Filed: August 29, 2012
    Date of Patent: October 28, 2014
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Hideto Furuyama, Yosuke Akimoto, Miyoko Shimada, Akihiro Kojima, Yoshiaki Sugizaki
  • Patent number: 8866134
    Abstract: Provided are a light-emitting device and a photovoltaic cell having excellent characteristics. A light-emitting device (10) includes a cathode (34), an anode (32), a light-emitting layer (50) interposed between the cathode (34) and the anode (32), and an electron injection layer (44) provided between the cathode (34) and the light-emitting layer (50) and connected to the cathode (34), in which at least one of the anode (32) and the cathode (34) contains a conductive material having an aspect ratio of 1.5 or more, and the electron injection layer (44) contains an organic compound having at least one of an ionic group and a polar group.
    Type: Grant
    Filed: June 24, 2011
    Date of Patent: October 21, 2014
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Takayuki Iljima, Kenta Tanaka, Masanobu Tanaka, Hideyuki Higashimura
  • Patent number: 8860061
    Abstract: A semiconductor light-emitting device, a method for manufacturing the same and a vehicle headlight can include the light-emitting device, which is composed of a light-emitting structure including a transparent plate, at least one semiconductor light-emitting chip and a wavelength converting layer between the transparent plate and the light-emitting chip to emit various colored lights including white light. The light-emitting device can also include a mounting board mounting the light-emitting structure and a frame thereon, a reflective material disposed between the frame and the light-emitting structure and the transparent material located on the reflective material to prevent an occurrence of oil-bleeding phenomenon. Thus, the disclosed subject matter can provide the light-emitting device having a high reliability for the vehicle headlight and the like, which can be maintained at a high quality even when they have been used for a long time under harsh conditions, and methods of manufacturing such devices.
    Type: Grant
    Filed: January 22, 2013
    Date of Patent: October 14, 2014
    Assignee: Stanley Electric Co., Ltd.
    Inventor: Hiroshi Kotani
  • Patent number: 8860058
    Abstract: A light emitting assembly comprising a solid state device coupleable with a power supply constructed and arranged to power the solid state device to emit from the solid state device a first, relatively shorter wavelength radiation, and a down-converting luminophoric medium arranged in receiving relationship to said first, relatively shorter wavelength radiation, and which in exposure to said first, relatively shorter wavelength radiation, is excited to responsively emit second, relatively longer wavelength radiation. In a specific embodiment, monochromatic blue or UV light output from a light-emitting diode is down-converted to white light by packaging the diode with fluorescent organic and/or inorganic fluorescers and phosphors in a polymeric matrix.
    Type: Grant
    Filed: August 23, 2012
    Date of Patent: October 14, 2014
    Assignee: Cree, Inc.
    Inventors: Bruce Baretz, Michael A. Tischler
  • Patent number: 8860072
    Abstract: A light emitting device includes a body having a first recess; a barrier section having a second recess and a third recess, protruding upward over a bottom surface of the first recess, and dividing the bottom surface of the first recess into a first region and a second region; a first light emitting diode disposed in the first region; a second light emitting diode disposed in the second region; a first lead electrode disposed in the first region; a second lead electrode disposed in the second region; a first wire electrically connecting the first lead electrode to the second light emitting diode through the second recess; and a second wire electrically connecting the second lead electrode to the first light emitting diode through the third recess.
    Type: Grant
    Filed: November 30, 2012
    Date of Patent: October 14, 2014
    Assignee: LG Innotek Co., Ltd.
    Inventors: Joong In An, Sung Min Kong
  • Patent number: 8853726
    Abstract: Disclosed are a light emitting device package and a lighting system including the same. The light emitting device package includes a first lead frame and a second lead frame disposed on an insulating layer and electrically separated from each other by a separation part, and a light emitting device disposed on the second lead frame and electrically connected to the first lead frame, and the second lead frame includes a through part disposed opposite to the separation part such that the light emitting device is located therebetween.
    Type: Grant
    Filed: March 6, 2012
    Date of Patent: October 7, 2014
    Assignee: LG Innotek Co., Ltd.
    Inventors: Gun Kyo Lee, Nak-Hun Kim, Sun Mi Moon
  • Patent number: 8853722
    Abstract: A semiconductor light-emitting device includes a light-impervious substrate, a bonding structure, a semiconductor light-emitting stack, and a fluorescent material structure overlaying the semiconductor light-emitting stack. The semiconductor light-emitting stack is separated from a growth substrate and bonded to the light-impervious substrate via the bonding structure. A method for producing the semiconductor light-emitting device includes separating a semiconductor light-emitting stack from a growth substrate, bonding the semiconductor light-emitting stack to a light-impervious substrate, and forming a fluorescent material structure over the semiconductor light-emitting stack.
    Type: Grant
    Filed: March 10, 2011
    Date of Patent: October 7, 2014
    Assignee: Epistar Corporation
    Inventors: Min-Hsun Hsieh, Chia-Fen Tsai
  • Patent number: 8853730
    Abstract: A light emitting device comprises a substrate including a top surface that is flat, a light emitting diode on the substrate, a lead frame formed on the flat top surface of the substrate. The lead frame includes a circuit with a predetermined pattern to electrically connect to the light emitting diode. A dam part is formed on the substrate and is adjacent to the light emitting diode. A first member is formed on the light emitting diode, the first member including a fluorescent substance to convert a light emission spectrum of light from the light emitting diode. A second member is surrounded by the dam part and is formed on the substrate adjacent to the first member, and a lens covers the first member, the second member and the light emitting diode.
    Type: Grant
    Filed: August 31, 2007
    Date of Patent: October 7, 2014
    Assignee: LG Innotek Co., Ltd.
    Inventor: Bo Geun Park
  • Patent number: 8841684
    Abstract: A light-emitting device includes a circuit substrate including at least a pair of electrodes, an LED element electrically mounted on the circuit substrate, a phosphor plate disposed on an upper surface of the LED element, a diffuser plate disposed on an upper surface of the phosphor plate, and a white resin disposed on an upper surface of the circuit substrate and covering a peripheral side surface of the LED element, a peripheral side surface of the phosphor plate, and a peripheral side surface of the diffuser plate. The present invention makes it possible to obtain a planar light-emitting surface even with a plurality of LEDs, and also, a problem of color-ring occurrence caused by a phosphor may be less represented.
    Type: Grant
    Filed: July 2, 2012
    Date of Patent: September 23, 2014
    Assignees: Citizen Electronics Co., Ltd., Citizen Holdings Co., Ltd.
    Inventors: Kazuya Ishihara, Jo Kinoshita
  • Patent number: 8841146
    Abstract: A method for fabricating light emitting diode (LED) dice includes the steps of coating a transparent substrate with a wavelength conversion material, continuously evaluating a correlated color temperature (CCT) of the output electromagnetic radiation produced by the wavelength conversion material and comparing the correlated color temperature (CCT) to a target correlated color temperature (CCT), and controlling the coating step responsive to feedback from the evaluating and comparing step to adjust the correlated color temperature (CCT) to achieve the target correlated color temperature (CCT). A system for fabricating light emitting diode (LED) dice includes a coating system, a monitoring system, and a control system configured to control the coating system to adjust the correlated color temperature (CCT) of the wavelength conversion material on the transparent substrate to achieve the target correlated color temperature (CCT).
    Type: Grant
    Filed: July 31, 2012
    Date of Patent: September 23, 2014
    Assignee: SemiLEDS Optoelectronics Co., Ltd.
    Inventors: Jui-Kang Yen, Georg Soerensen, Mark Ewing Tuttle
  • Patent number: 8835957
    Abstract: A light emitting device includes a substrate having a conductive portion; a light emitting element having one or more electrodes on a lower surface side thereof, the electrodes being positioned on the conductive portion of the substrate; a phosphor layer disposed on a surface of the light emitting element and on a peripheral surface area of the conductive portion next to the light emitting element; and a reflection layer covering a part of the phosphor layer disposed on the peripheral surface area of the conductive portion.
    Type: Grant
    Filed: March 23, 2012
    Date of Patent: September 16, 2014
    Assignee: Nichia Corporation
    Inventors: Suguru Beppu, Takuya Noichi
  • Patent number: 8835970
    Abstract: A light-emitting apparatus of the present invention has (i) a semiconductor device which emits light toward a higher position than a substrate and (ii) a plurality of external connection terminals, and includes: a light-reflecting layer, provided on the substrate, which reflects the light emitted by the semiconductor device; and a covering layer which covers at least the light-reflecting layer and which transmits the light reflected by the light-reflecting layer. Further, the semiconductor device is provided on the covering layer, and is electrically connected to the external connection terminals via connecting portions, and the semiconductor device and the connecting portions are sealed with a sealing resin so as to be covered. Therefore, the light-emitting apparatus has increased efficiency with which light is taken out, and can prevent a reflecting layer from being altered, deteriorating, and decreasing in reflectance.
    Type: Grant
    Filed: December 13, 2013
    Date of Patent: September 16, 2014
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Masahiro Konishi, Masaki Kondo, Takaaki Horio, Takanobu Matsuo, Toshio Hata, Kiyohisa Ohta
  • Patent number: 8828756
    Abstract: A wafer level light-emitting device package may include a polymer layer that bonds a light-emitting structure to a package substrate, and the polymer layer and the package substrate may include a plurality of via holes. Also, a method of manufacturing the wafer level light-emitting device package may include forming the polymer layer on the light-emitting structure, bonding the package substrate onto the polymer layer by applying heat and pressure, and forming a plurality of via holes in the polymer layer and the package substrate.
    Type: Grant
    Filed: September 22, 2011
    Date of Patent: September 9, 2014
    Assignee: Samsung Electronics Co., Ltd
    Inventor: Seong-deok Hwang
  • Patent number: 8816371
    Abstract: Coated color-converting particles and associated devices, systems, and methods are disclosed herein. A coating of the coated color-converting particles can include, for example, a parylene, such as a fluorinated parylene. In particular embodiments, the coating can be configured to protect a color-converting material of a particle core of the coated color-converting particles from detrimental reactions. For example, the coating can prevent, slow, or otherwise inhibit detrimental reactions between the color-converting material and a matrix material or between the color-converting material and an environmental constituent that can diffuse through a matrix. In particular embodiments, the coated color-converting particles can be incorporated into a matrix to form a composite. The composite can be used, for example, with a radiation transducer.
    Type: Grant
    Filed: November 30, 2011
    Date of Patent: August 26, 2014
    Assignee: Micron Technology, Inc.
    Inventor: Charles M. Watkins
  • Patent number: 8809889
    Abstract: A light emitting diode package includes a light emitting diode, an insulating layer, a plurality of light emitting particles, and a plurality of metal particles. The light emitting diode is configured to emit first light of a first wavelength in a visible light range. The insulating layer is disposed on the light emitting diode. The plurality of light emitting particles is dispersed in the insulating layer and is configured to receive the first light to generate a second light of a second wavelength different from the first wavelength. The plurality of metal particles is dispersed in the insulating layer, and is configured to receive at least one light component of the first light and the second light to cause, at least in part, surface plasmon resonance, the surface plasmon resonance being configured to yield a resonance wave comprising a peak wavelength in the range of the second wavelength.
    Type: Grant
    Filed: April 26, 2013
    Date of Patent: August 19, 2014
    Assignee: Samsung Display Co., Ltd.
    Inventors: Baek Hee Lee, Jong Hyuk Kang, Junghyun Kwon, Minki Nam, Jae Byung Park, Seon-Tae Yoon, Dong-Hoon Lee
  • Patent number: 8802467
    Abstract: A method of manufacturing an encapsulation structure for encapsulating an LED chip includes the following steps: providing a first encapsulation defining a receiving room for receiving the LED chip therein and a second encapsulation defining a receiving space for receiving the first encapsulation therein; providing a mounting tablet defining an entrance therein, mounting the first encapsulation and the second encapsulation on the mounting tablet with a clearance defined therebetween communicating with the entrance; injecting a liquid transparent resin with phosphorous compounds disturbed therein into the clearance via the entrance; and solidifying the liquid transparent resin to form a transparent resin layer interconnecting the first encapsulation and the second encapsulation.
    Type: Grant
    Filed: October 23, 2013
    Date of Patent: August 12, 2014
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Shiun-Wei Chan, Chih-Hsun Ke
  • Patent number: 8803170
    Abstract: A light source module includes a substrate, a first LED package and a second LED package. The first and second LED packages are disposed on the substrate. The first LED package includes a first blue LED chip and a first phosphor. The first blue LED chip emits light in the range of the wavelength for blue light. The first phosphor is used to convert the wavelength of a portion of the light emitted from the first blue LED chip. The second LED package includes a second blue LED chip and a second phosphor. The second blue LED chip emits light in the range of the wavelength for blue light. The second phosphor is used to convert the wavelength of a portion of the light emitted from the second blue LED chip. The wavelength associated with the second phosphor is greater than that associated with the first phosphor.
    Type: Grant
    Filed: August 9, 2012
    Date of Patent: August 12, 2014
    Assignee: Lextar Electronics Corporation
    Inventors: Pei-Song Cai, Yong-Hong Liao, Tzu-Pu Lin, Yun-Yi Tien, Jian-Chin Liang
  • Patent number: 8803175
    Abstract: Disclosed herein is a light emitting device including: a substrate; a light emitting diode (LED) chip disposed on the substrate; and a phosphor sheet disposed on an upper portion of the LED chip and including alignment members formed on a lower surface thereof. The alignment members contact the LED chip, such that the phosphor sheet is aligned with the LED chip.
    Type: Grant
    Filed: September 28, 2011
    Date of Patent: August 12, 2014
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventor: Hyuck Jung Choi
  • Patent number: 8795817
    Abstract: There are provided a phosphor film, a method of manufacturing the same, and a method of coating an LED chip with a phosphor layer. The phosphor film includes: a base film; a phosphor layer formed on the base film and obtained by mixing phosphor particles in a partially cured resin material; and a cover film formed on the phosphor layer to protect the phosphor layer.
    Type: Grant
    Filed: August 24, 2011
    Date of Patent: August 5, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Chang Hoon Kwak, II Woo Park, Kyu Jin Lee, Cheol Jun Yoo, Seong Jae Hong
  • Patent number: 8796712
    Abstract: A phosphor layer is composed of a resin in which phosphor particles and light scattering particles are dispersed.
    Type: Grant
    Filed: June 23, 2011
    Date of Patent: August 5, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Yasunari Ooyabu, Satoshi Sato, Yuki Shinbori, Shinya Ota, Hisataka Ito
  • Patent number: 8796715
    Abstract: There is provided a phosphor blend for an LED light source comprising from about 25 to about 35 weight percent of a cerium-activated yttrium aluminum garnet phosphor, from about 5 to about 10 weight percent of a europium-activated strontium calcium silicon nitride phosphor, and from about 50 to about 75 weight percent of a europium-activated calcium magnesium chlorosilicate phosphor. An LED light source in accordance with this invention has a B:G:R ratio for a 5500 K daylight balanced color film of X:Y:Z when directly exposed through a nominal photographic lens, wherein X, Y and Z each have a value from 0.90 to 1.10.
    Type: Grant
    Filed: August 17, 2010
    Date of Patent: August 5, 2014
    Assignee: Osram Sylvania Inc.
    Inventors: John Selverian, Robert E. Levin
  • Patent number: 8791495
    Abstract: Disclosed is a light emitting device package. The light emitting device package includes a body; first and second electrode layers on the body; a light emitting device electrically connected to the first and second electrode layers on the body; a luminescent layer on the light emitting device; and an encapsulant layer including particles on the luminescent layer, wherein an effective refractive index of the encapsulant layer has a deviation of 10% or less with respect to an effective refractive index of the luminescent layer.
    Type: Grant
    Filed: January 4, 2011
    Date of Patent: July 29, 2014
    Assignee: LG Innotek Co., Ltd.
    Inventor: Geun Ho Kim
  • Patent number: 8791488
    Abstract: Provided are a surface treated phosphor having high dispersibility and remarkably improved moisture resistance without degradation in fluorescence properties, and a method of producing the surface treated phosphor.
    Type: Grant
    Filed: August 4, 2011
    Date of Patent: July 29, 2014
    Assignee: Sekisui Chemical Co., Ltd.
    Inventors: Ren-de Sun, Yasuhiro Nakatani, Takahiro Oomura
  • Patent number: 8785953
    Abstract: A manufacturing method of a light emitting diode (LED) and a manufacturing method of an LED module are provided. The manufacturing method of the LED may include manufacturing a plurality of LED chips, manufacturing a phosphor pre-form including a plurality of mounting areas for mounting the plurality of LED chips, applying an adhesive inside the phosphor pre-form, mounting each of the plurality of LED chips in each of the plurality of mounting areas, and cutting the phosphor pre-form to which the plurality of LED chips are mounted, into units including individual LED chips.
    Type: Grant
    Filed: March 23, 2012
    Date of Patent: July 22, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hak Hwan Kim, Min Jung Kim, Kyung Mi Moon, Jong Sup Song, Jae Sung You, Ill Heoung Choi, Cheol Jun Yoo
  • Patent number: 8785951
    Abstract: An optoelectronic component (1) is specified, comprising a connection carrier (2) on which a radiation-emitting semiconductor chip (3) is arranged, and a conversion element (4) fixed to the connection carrier (2). The conversion element (4) spans the semiconductor chip (3) in such a way that the semiconductor chip (3) is surrounded by the conversion element (4) and the connection carrier (2), and the conversion element (4) consists of one of the following materials: ceramic, glass ceramic.
    Type: Grant
    Filed: August 4, 2009
    Date of Patent: July 22, 2014
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventor: Ralph Wirth
  • Patent number: 8779455
    Abstract: The present invention provides a semiconductor light-emitting device that emits light with a specific low correlated color temperature and with a high Ra, and a semiconductor light-emitting system provided with the semiconductor light-emitting device. This object is attained by the semiconductor light-emitting device having the below-described configuration. A semiconductor light-emitting device includes a LED chip as a semiconductor light-emitting element, and a phosphor emitting light using the LED chip as an excitation source, and emits light with a correlated color temperature equal to or higher than 1600 K and lower than 2400 K. The phosphor includes at least a green phosphor and a red phosphor. In the spectrum of light emitted from the semiconductor light-emitting device, the value of the peak intensity of the light emitted by the LED chip is less than 60% of the maximum peak intensity of the light emitted by the phosphor.
    Type: Grant
    Filed: November 9, 2012
    Date of Patent: July 15, 2014
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Hiroaki Sakuta, Yuki Kohara, Yoshihito Satou
  • Patent number: 8779453
    Abstract: A light-emitting element that has an improved light-extraction efficiency and an improved color purity of an emitted light. A light-emitting element includes a reflective electrode, a transparent electrode, a light-emitting layer, a functional layer, and a color filter. An optical film thickness of the functional layer is from approximately 218 nm to approximately 238 nm for a light emitting element that emits a blue light. An optical film thickness of the functional layer is from approximately 384 nm to approximately 400 nm for a light emitting element that emits a red light.
    Type: Grant
    Filed: January 30, 2012
    Date of Patent: July 15, 2014
    Assignee: Panasonic Corporation
    Inventors: Keiko Kurata, Seiji Nishiyama, Takashi Isobe
  • Patent number: 8779450
    Abstract: Disclosed is a light-emitting device including a support member, a reflective layer on the support member, a light-transmitting electrode layer on the reflective layer, a light-emitting structure on the light-transmitting electrode layer, the light-emitting structure being provided with a first conductive semiconductor layer, an active layer and a second conductive semiconductor layer, and a luminescence layer interposed between the reflective layer and the light-transmitting electrode layer. Accordingly, the luminescence layer is formed in the chip formation process to minimize non-uniform application of a phosphor composed of an epoxy resin and simplify fabrication of the light-emitting device.
    Type: Grant
    Filed: May 5, 2011
    Date of Patent: July 15, 2014
    Assignee: LG Innotek Co., Ltd.
    Inventor: Kyungwook Park
  • Patent number: 8772807
    Abstract: In one aspect, an LED package structure comprises a fluorescent substrate, a first electrically conductive pattern, a second electrically conductive pattern, at least one electrically conductive element, and an LED chip. The fluorescent substrate has a first surface and a second surface opposite the first surface. The fluorescent substrate comprises a mixture of a fluorescent material and a glass material. The first electrically conductive pattern is disposed on the first surface. The second electrically conductive pattern is disposed on the second surface. The electrically conductive element passes through the fluorescent substrate and connects the first and second electrically conductive patterns. The LED chip is disposed on the second surface and has a light extraction surface that connects the second electrically conductive pattern. The LED chip is electrically coupled to the first electrically conductive pattern via the electrically conductive element.
    Type: Grant
    Filed: May 27, 2011
    Date of Patent: July 8, 2014
    Assignee: Everlight Electronics Co., Ltd.
    Inventor: Hsien Chia Lin
  • Patent number: 8772814
    Abstract: LED dies are suspended in an ink and printed on a first support substrate to form a light emitting layer having a light emitting surface emitting primary light, such as blue light. A mixture of a transparent binder, phosphor powder, and transparent glass beads is formed as an ink and printed over the light emitting surface. The mixture forms a wavelength conversion layer when cured. The beads are preferably sized so that the tops of the beads protrude completely through the conversion layer. Some of the primary light passes through the beads with virtually no attenuation or backscattering, and some of the primary light is converted by the phosphor to secondary light. The combination of the secondary light and the primary light passing though the beads may form white light. The overall color is highly controllable by controlling the percentage weight of the beads.
    Type: Grant
    Filed: May 31, 2013
    Date of Patent: July 8, 2014
    Assignee: Nthdegree Technologies Worldwide Inc.
    Inventors: William J. Ray, Reuben Rettke, Mark D. Lowenthal, Alexander Ray
  • Patent number: 8772810
    Abstract: According to one embodiment, a semiconductor light emitting device includes: a semiconductor layer including a first face, a second face, a side face, and a light emitting layer; a p-side electrode provided on the second face; an n-side electrode provided on the side face; a first p-side metal layer provided on the p-side electrode; a first n-side metal layer provided on the periphery of the n-side electrode; a first insulating layer provided on a face on the second face side in the first n-side metal layer; a second p-side metal layer connected with the first p-side metal layer on the first p-side metal layer, and provided, extending from on the first p-side metal layer to on the first insulating layer; and a second n-side metal layer provided on a face on the second face side in the first n-side metal layer in a peripheral region of the semiconductor layer.
    Type: Grant
    Filed: August 31, 2012
    Date of Patent: July 8, 2014
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Yoshiaki Sugizaki, Akihiro Kojima, Hideto Furuyama, Yosuke Akimoto
  • Patent number: 8759863
    Abstract: A semiconductor light-emitting device of the invention includes: a semiconductor layer including a light-emitting layer and having a first major surface and a second major surface opposite to the first major surface; a phosphor layer facing to the first major surface; an interconnect layer provided on the second major surface side and including a conductor and an insulator; and a light-blocking member provided on a side surface of the semiconductor layer and being opaque to light emitted from the light-emitting layer.
    Type: Grant
    Filed: December 6, 2012
    Date of Patent: June 24, 2014
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Yoshiaki Sugizaki, Akihiro Kojima, Susumu Obata
  • Patent number: 8759860
    Abstract: An LED package includes an LED die and a lens module. The lens module covers the LED die. Light emitted from the LED die travels through the lens module. The lens module includes a concave lens and a convex lens with a smaller radial dimension than that of the concave lens. The concave lens covers the LED die. The convex lens is attached on a center of a surface of the concave lens away from the LED die. Optical axes of the concave lens and the convex lens are both collinear with a central axis of the LED die. Light from the LED die is diverged by the lens module to a peripheral side of the LED package.
    Type: Grant
    Filed: August 27, 2012
    Date of Patent: June 24, 2014
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Ming-Yi Lin, Wen-Chen Hung
  • Patent number: 8759847
    Abstract: A white LED assembly includes a string of series-connected blue LED dice mounted on a substrate. The substrate has a plurality of substrate terminals. A first of the substrate terminals is coupled to be a part of first end node of the string. A second of the substrate terminals is coupled to be a part of an intermediate node of the string. A third of the substrate terminals is coupled to be a part of a second end node of the string. Other substrate terminals may be provided and coupled to be parts of corresponding other intermediate nodes of the string. A single contiguous amount of phosphor covers all the LED dice, but does not cover any of the substrate terminals. In one example, the amount of phosphor contacts the substrate and has a circular periphery. All the LEDs are mounted to the substrate within the circular periphery.
    Type: Grant
    Filed: December 22, 2011
    Date of Patent: June 24, 2014
    Assignee: Bridgelux, Inc.
    Inventors: Tao Xu, Michael Solomensky
  • Patent number: 8754428
    Abstract: A light emitting diode having a mount lead having a cup and a lead, an LED chip mounted in the cup of said mount lead with one of electrodes being electrically connected to said mount lead, a coating material filling the cup of said mount lead to cover said LED chip; a molding material covering said LED chip, said coating material and the cup of said mount lead, and a phosphor absorbing a part of light emitted by said LED chip and emitting light of wavelength different from that of the absorbed light, wherein said phosphor is located in said coating material, and wherein said molding material is shaped to form a concave lens.
    Type: Grant
    Filed: October 7, 2009
    Date of Patent: June 17, 2014
    Assignee: Nichia Corporation
    Inventors: Yoshinori Shimizu, Kensho Sakano, Yasunobu Noguchi, Toshio Moriguchi
  • Patent number: 8754432
    Abstract: A light emitting device is configured to achieve a white color by mixing light from respective phosphors. The light emitting device includes: a light emitting element for emitting ultraviolet or short-wavelength visible light having a peak wavelength in a wavelength range of 380 to 420 nm; a first phosphor excited by the ultraviolet or short-wavelength visible light to emit visible light having a peak wavelength in a wavelength range of 560 nm to 600 nm; a second phosphor excited by the ultraviolet or short-wavelength visible light to emit visible light having a complementary relationship with visible light emitted by the first phosphor; and a light transmitting member which is a light transmitting layer for covering the light emitting element, and has the first phosphor and the second phosphor dispersed therein.
    Type: Grant
    Filed: February 8, 2011
    Date of Patent: June 17, 2014
    Assignee: Koito Manufacturing Co., Ltd.
    Inventors: Hisayoshi Daicho, Tatsuya Matsuura, Ken Kato, Kiminori Enomoto
  • Patent number: 8754429
    Abstract: According to one embodiment, an optical semiconductor device includes a light emitting layer, a transparent layer, a first metal post, a second metal post and a sealing layer. The light emitting layer includes a first and a second major surface, a first and a second electrode. The second major surface is a surface opposite to the first major surface, and the first electrode and second electrodes are formed on the second major surface. The transparent layer is provided on the first major surface. The first metal post is provided on the first electrode. The second metal post is provided on the second electrode. The sealing layer is provided on the second major surface. The sealing layer covers a side surface of the light emitting layer and seals the first and second metal posts while leaving end portions of the first and second metal posts exposed.
    Type: Grant
    Filed: June 7, 2011
    Date of Patent: June 17, 2014
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Hiroshi Koizumi, Yasuhide Okada, Susumu Obata, Tomomichi Naka, Kazuhito Higuchi, Kazuo Shimokawa, Yoshiaki Sugizaki, Akihiro Kojima
  • Patent number: 8754399
    Abstract: The present invention relates to an organic electroluminescence element which comprises an anode, a luminescent layer, two or more electron transport layers and a cathode, in this order, wherein at least one of the two or more electron transport layers adjoins the luminescent layer, the luminescent layer contains a luminescent material and a charge transport material, the electron transport layer which adjoins the luminescent layer contains a charge transport material, the charge transport material contained in the luminescent layer and the charge transport material contained in the electron transport layer which adjoins the luminescent layer may be the same material or may be different material, and the specific electron affinities EA1, EA2 and EA3, and the specific work function WF satisfy the specific relationship.
    Type: Grant
    Filed: January 8, 2013
    Date of Patent: June 17, 2014
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Futoshi Tanaka, Kazuki Okabe, Atsushi Takahashi
  • Patent number: 8753908
    Abstract: There are disclosed a method of manufacturing a semiconductor light emitting device and a paste application apparatus. The method includes preparing a light emitting structure including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer; disposing a mask including an opening exposing a part of the light emitting structure on the light emitting structure; applying a paste including a wavelength conversion material to the light emitting structure through the opening of the mask, by using a pressure means; and planarizing the applied paste by using a roller.
    Type: Grant
    Filed: July 3, 2012
    Date of Patent: June 17, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Tsuyoshi Tsutsui, Shin Kun Kim, Seong Jae Hong, Il Woo Park
  • Patent number: 8754427
    Abstract: A lens arrangement for an LED display device includes a lens. The lens has a first lens surface and an optical axis. The optical axis penetrates the first lens surface of the lens. Furthermore, the lens arrangement includes a transparent transition body, which is firmly coupled with the lens on the first lens surface, which is more temperature-resistant than the lens and which has an optical axis that is parallel to the optical axis of the lens.
    Type: Grant
    Filed: December 21, 2007
    Date of Patent: June 17, 2014
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Stefan Groetsch, Moritz Engl, Steffen Koehler, Simon Bluemel, Michael Hiegler, Thomas Zeiler
  • Patent number: 8748921
    Abstract: A semiconductor light emitting device is provided with a separately fabricated wavelength converting element. The wavelength converting element, of e.g., phosphor and glass, is produced in a sheet that is separated into individual wavelength converting elements, which are bonded to light emitting devices. The wavelength converting elements may be grouped and stored according to their wavelength converting properties. The wavelength converting elements may be selectively matched with a semiconductor light emitting device, to produce a desired mixture of primary and secondary light.
    Type: Grant
    Filed: March 13, 2009
    Date of Patent: June 10, 2014
    Assignee: Philips Lumileds Lighting Company LLC
    Inventors: Paul S. Martin, Gerd O. Mueller, Regina B. Mueller-Mach, Helena Ticha, Ladislav Tichy
  • Patent number: 8742433
    Abstract: A light emitting apparatus with a combination of a plurality of LED chips and a phosphor layer is provided and can be configured to significantly reduce variations in chromaticity and luminance. The plurality of semiconductor light emitting devices (LED chips) are disposed with a gap therebetween, and the phosphor layer is formed on the upper surface thereof to bridge over the gaps between the LED chips. The phosphor layer may be uniform in thickness, but can be less in thickness over the gaps between the LED chips than on the upper surface of the LED chips. The phosphor layer can be continuously formed on the upper surface of the array of the chips with no phosphor layer present in between the chips. This configuration allows for reducing variations in luminance and chromaticity which may result from the gaps or the phosphor layer present in between the gaps.
    Type: Grant
    Filed: May 27, 2008
    Date of Patent: June 3, 2014
    Assignee: Stanley Electric Co., Ltd.
    Inventors: Shuichi Ajiki, Yasuyuki Kawakami, Tsutomu Akagi, Mitsunori Harada
  • Patent number: 8736036
    Abstract: A process is described for wavelength conversion of LED light using phosphors. LED dies are tested for correlated color temperature (CCT), and binned according to their color emission. The LEDs in a single bin are mounted on a single submount to form an array of LEDs. Various thin sheets of a flexible encapsulant (e.g., silicone) infused with one or more phosphors are preformed, where each sheet has different color conversion properties. An appropriate sheet is placed over an array of LED mounted on a submount, and the LEDs are energized. The resulting light is measured for CCT. If the CCT is acceptable, the phosphor sheet is permanently laminated onto the LEDs and submount. The lamination encapsulates each LED to protect the LEDs from contaminants and damage. The LEDs in the array of LEDs on the submount are separated. By selecting a different phosphor sheet for each bin of LEDs, the resulting CCT is very uniform across all bins.
    Type: Grant
    Filed: March 17, 2008
    Date of Patent: May 27, 2014
    Assignee: Philips Lumileds Lighting Company LLC
    Inventor: Haryanto Chandra
  • Patent number: 8735914
    Abstract: A light emitting device is a light emitting device using light emitting elements and includes: a substrate; a resin frame provided circularly on the substrate; a resin wall provided on the substrate so as to partition an area surrounded by the resin frame into 2 zones; light-emitting sections (a first light-emitting section: blue LEDs+red fluorescent material, a second light-emitting section: blue LEDs+yellow fluorescent material) provided in the respective zones, each of which light-emitting sections includes at least one light emitting element; and first and second anode electrodes and a cathode electrode provided so that each of the light-emitting sections receives current via a corresponding anode electrode and the cathode electrode, the light-emitting sections emitting respective pieces of light each having at least one color, which respective pieces of light have different colors from each other, the first and second anode electrodes being electrically connected to the first and second light-emitting se
    Type: Grant
    Filed: May 16, 2011
    Date of Patent: May 27, 2014
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Makoto Agatani, Toshio Hata, Tomokazu Nada, Toyonori Uemura, Shinya Ishizaki