Electrical Component Encapsulating Patents (Class 264/272.11)
  • Patent number: 8846183
    Abstract: A method of fabricating an elastomeric structure, comprising: forming a first elastomeric layer on top of a first micromachined mold, the first micromachined mold having a first raised protrusion which forms a first recess extending along a bottom surface of the first elastomeric layer; forming a second elastomeric layer on top of a second micromachined mold, the second micromachined mold having a second raised protrusion which forms a second recess extending along a bottom surface of the second elastomeric layer; bonding the bottom surface of the second elastomeric layer onto a top surface of the first elastomeric layer such that a control channel forms in the second recess between the first and second elastomeric layers; and positioning the first elastomeric layer on top of a planar substrate such that a flow channel forms in the first recess between the first elastomeric layer and the planar substrate.
    Type: Grant
    Filed: October 20, 2011
    Date of Patent: September 30, 2014
    Assignee: California Institute of Technology
    Inventors: Marc A. Unger, Hou-Pu Chou, Todd A. Thorsen, Axel Scherer, Stephen R. Quake
  • Publication number: 20140259271
    Abstract: Methods for embedding an electronic device in a frame enclosure and wearable apparatuses using the same are disclosed. The method includes: providing a first substrate and a second substrate; shaping at least one of the first substrate or the second substrate according to a second predetermined pattern; disposing the electronic device between the first substrate and the second substrate; compressing the first substrate and the second substrate together, wherein the electronic device is sandwiched by the compression between the first substrate and the second substrate; and heating the assembly of the first substrate, the electronic device, and the second substrate.
    Type: Application
    Filed: March 17, 2014
    Publication date: September 18, 2014
    Applicant: CAPE EVOLUTION LIMITED
    Inventors: Christopher David Cox, Benoit Chirouter
  • Publication number: 20140255634
    Abstract: A housing includes a substrate and a protective layer. The protective layer is formed on the substrate. The substrate includes a first member and a second member, the first member is made of plastic and the second member is made of metal. The protective layer is made of silicone rubber and is formed on the second member of the substrate. The protective layer has a peripheral waterproof portion covering a peripheral edge of the substrate.
    Type: Application
    Filed: August 23, 2013
    Publication date: September 11, 2014
    Applicants: FIH (HONG KONG) LIMITED, SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD.
    Inventor: LI-HONG NA
  • Patent number: 8830665
    Abstract: Methods and apparatus for forming a housing, such as for an electronic device, from multi-layer materials are disclosed. The multi-layer materials include at least two layers. Typically, one or more of the layers are metal. However, different layers of the multi-layer materials can be different metals. In one embodiment, an inner layer of the multi-layer materials can be provided with or form internal features that can be for attaching parts or components to the multi-layer materials. In another embodiment, processing of an inner layer of the multi-layer materials can facilitate part formation with increased curvature and/or internal part clearance. In another embodiment, the multi-layer materials can include an intermediate layer that facilitates creation of internal features that can be for attaching parts or components to the multi-layer materials.
    Type: Grant
    Filed: October 18, 2012
    Date of Patent: September 9, 2014
    Assignee: Apple Inc.
    Inventors: Stephen B. Lynch, John B. Filson, Stephen P. Zadesky, Douglas J. Weber
  • Patent number: 8820359
    Abstract: A fluid storage and transport module includes complex plumbing features such as fluid reservoirs, filters, heat exchangers, three-dimensionally routed tubing, valves, mixing chambers, and exit apertures formed in and on a monolithic common bulk material using an additive rapid prototyping process of depositing multiple layers of rapid prototyping materials without welds, adhesives or compression fittings, being made by a method that minimizes leaks, maximizes packing density of the functional components, and increases the plumbing robustness to leaks.
    Type: Grant
    Filed: October 21, 2008
    Date of Patent: September 2, 2014
    Assignee: The Aerospace Corporation
    Inventor: David A. Hinkley
  • Patent number: 8776365
    Abstract: A method of manufacturing a terminal block for a telecommunication cable, which includes providing a housing having a front side and a back side and positioning multiple pairs of electrical connectors in the housing such that one end of each of the electrical connectors is exposed on the front side of the housing and one end of the connector is exposed on the back side of the housing. Each of electrical connectors having an insulation displacement contact terminal on the end exposed on the back side of the housing, and connecting multiple pairs of insulated electrical wires to the connectors on the back side of the housing. A dielectric material is pressure molded on the back side of the housing to encapsulate the connections of the wires and the connectors on the back side of the housing.
    Type: Grant
    Filed: July 27, 2010
    Date of Patent: July 15, 2014
    Assignee: Channell Commercial Corporation
    Inventors: William H. Channell, Sr., Edward J. Burke
  • Publication number: 20140190742
    Abstract: An objective is to achieve a configuration for mounting a wire harness in a vehicle to protect the wire harness and regulate a path in a simpler manner with fewer components. A wire harness has a wire harness main body including at least one wire, and a protection member protecting the wire harness main body. The protection member includes an inner peripheral protection portion formed by hot-pressing a nonwoven member in a state of covering at least a portion of the wire harness main body and an outer peripheral protection portion formed by hot-pressing a nonwoven member in a state of covering at least a portion of the inner peripheral protection portion in an extending direction.
    Type: Application
    Filed: April 16, 2012
    Publication date: July 10, 2014
    Applicant: SUMITOMO WIRING SYSTEMS, LTD.
    Inventor: Yasuhiro Kajiwara
  • Patent number: 8771573
    Abstract: The invention relates to a method for producing a plastic housing, where at least one first plastic housing part with at least one guide or bearing for at least one mechanically movable component, in particular a sensor, is produced in a first molding step, the at least one first plastic housing part is overmolded in a second molding step while a second plastic housing part is being formed, in order to form an integral plastic housing. Moreover, the invention relates to a plastic housing with at least one first plastic housing part including at least one guide or bearing for at least one mechanically movable component, where the at least one plastic housing part is entirely or partially overmolded by a second plastic housing part so that the integral plastic housing is formed.
    Type: Grant
    Filed: April 18, 2008
    Date of Patent: July 8, 2014
    Assignee: Preh GmbH
    Inventors: Bernhard Knüttel, Annegret Suckfüll
  • Patent number: 8764240
    Abstract: An electrical device such as an LED light assembly includes a conductive circuit and one or more electrical components connected to the circuit. The electrical components and the circuit are at least partially overmolded with a thermoplastic polymer material to encapsulate the components. The material utilized to cover the circuit and/or electrical components may also be utilized to form a housing or other structure of a finished part.
    Type: Grant
    Filed: March 2, 2011
    Date of Patent: July 1, 2014
    Assignee: Innotec Corp.
    Inventors: Thomas J. Veenstra, Paul T. Vander Kuyl, Matthew S. Weeda, Michael L. Lanser, Kyle A. Israels, Jason R. Mulder, Mark W. Vander Pol
  • Publication number: 20140153211
    Abstract: An electronic device contains circuitry such as radio-frequency transceiver circuitry and antenna structures that are coupled using transmission line paths such as coaxial cable paths. A coaxial cable is mounted within an electronic device housing cable mounting structures. The coaxial cable has a meandering portion that forms a service loop. The cable mounting structures includes grooves that receive the meandering portion of the cable. The grooves may be formed within a molded plastic body. Patterned metal may be formed on the surface of the molded plastic body using laser-based processing techniques. The cable in the meandering portion may have a segment in which an outer cable conductor is exposed. The patterned metal on the molded plastic body may short the exposed outer conductor to the electronic device housing or other ground structure.
    Type: Application
    Filed: November 30, 2012
    Publication date: June 5, 2014
    Applicant: Apple Inc.
    Inventors: Shayan Malek, John B. Ardisana, II, Michael B. Wittenberg
  • Patent number: 8734956
    Abstract: The present invention provides a polybutylene terephthalate resin composition which satisfies performances such as high durability in an environment of heating and cooling cycles and adhesion properties to an addition-reaction type silicone rubber. Specifically, provided is the polybutylene terephthalate resin composition, exhibiting excellent adhesion properties to the addition-reaction type silicone rubber, including: (A) 100 parts by weight of polybutylene terephthalate resin; (B) 5 to 30 parts by weight of a styrene-based thermoplastic elastomer containing 40% by weight or less of styrene component; and (C) 20 to 100 parts by weight of glass fiber.
    Type: Grant
    Filed: December 24, 2008
    Date of Patent: May 27, 2014
    Assignee: Wintech Polymer Ltd.
    Inventors: Kouichi Sakata, Hiroyuki Amano
  • Publication number: 20140138122
    Abstract: A method for making an extruded insulator for a spark plug in a manner that minimizes pores, relics and/or other defects in the insulator microstructure so that the overall dielectric strength or performance of the insulator is improved. The method may be used to manufacture an extruded insulator that avoids many of the drawbacks associated with such defects, but also has a stepped internal bore for receiving a center electrode. In one embodiment, the method uses a multi-phase extrusion process to extrude a ceramic paste around an elongated arbor and form an extruded section, and then removes the arbor from the extruded section to reveal a stepped internal bore.
    Type: Application
    Filed: November 11, 2013
    Publication date: May 22, 2014
    Inventor: William J. Walker, JR.
  • Publication number: 20140133171
    Abstract: The present inventive compact generator, light emitting wheel hub has an improved light and armature assembly that simplifies manufacturing, improves function and durability of the light emitting wheel hub. The inventive wheel hub is useful for such wheels used in skate board, roller skate, in-line roller skate, wheel chair, and like apparatus.
    Type: Application
    Filed: April 21, 2011
    Publication date: May 15, 2014
    Inventor: Soon Chang Kwon
  • Patent number: 8709187
    Abstract: A method of continuously forming heated conduit includes performing a tape for winding onto a spiral pipeline former. At least one conductor is positioned adjacent to the centerline of and parallel with a thin polymer ribbon. The ribbon is folded in half to encapsulate the conductors. The folded ribbon is thermally welded to itself. The folded, welded, ribbon is passed through a creaser, which forms a crease midway across the folded ribbon. The creased pre-formed ribbon is formed into a conduit in a continuous process on a spiral pipeline former.
    Type: Grant
    Filed: November 13, 2008
    Date of Patent: April 29, 2014
    Assignee: Fisher & Paykel Healthcare Limited
    Inventors: Daniel John Smith, Nathan Lee Gray, Luke Jeremy Gallagher, Kieran James Hatcher, Kristopher Poh Ming Laurent
  • Publication number: 20140097022
    Abstract: A seal for a cable and connector interconnection includes a unitary elastic primary body with a primary bore therethrough. The primary bore is provided with a primary cable outer diameter seal portion at a cable end, the cable outer diameter seal portion adjacent a primary connector cavity portion, the primary connector cavity portion adjacent a coupling nut cavity portion, and the coupling nut cavity portion adjacent a connector neck seal portion at a connector end. The coupling nut cavity portion is longitudinally aligned with a coupling nut of the connector and is provided with a greater inner diameter than the cable outer diameter seal portion and the connector neck seal portion.
    Type: Application
    Filed: October 8, 2012
    Publication date: April 10, 2014
    Applicant: Andrew LLC
    Inventor: Ronald Alan Vaccaro
  • Publication number: 20140090463
    Abstract: A tire pressure monitoring unit includes a measurement and transmission electronics unit for measuring and wirelessly transmitting pressure information. A power source supplies power to the measurement and transmission electronics unit. A plastic body embeds the measurement and transmission electronics unit and also the power source. A metal carrier sheet, which carries the measurement and transmission electronics unit and also the power source, protrudes out from the plastic body with a fastening portion, which has a fastening hole. A method for producing a tire pressure monitoring unit is also disclosed.
    Type: Application
    Filed: December 8, 2013
    Publication date: April 3, 2014
    Applicant: Huf Hulsbeck & Furst GmbH & Co. KG
    Inventors: Andreas Nagora, Sisay Tadele
  • Patent number: 8647110
    Abstract: An apparatus for fabricating a semiconductor package may include a mold and a molding plate. The mold may define a mold cavity with the mold being configured to receive a circuit board in the mold cavity, and the circuit board may include a semiconductor chip mounted thereon. A molding plate may be moveable in the mold cavity with the molding plate being configured to adjust a volume of the mold cavity. Related methods are also discussed.
    Type: Grant
    Filed: August 10, 2010
    Date of Patent: February 11, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Youngshin Choi, Kikwon Jeong
  • Publication number: 20140036198
    Abstract: A substrate module includes: a substrate on which an electronic component is mounted; and a sealing resin that seals the electronic component, and has an opening, the opening being open along an extending direction of the substrate.
    Type: Application
    Filed: June 28, 2013
    Publication date: February 6, 2014
    Inventor: Masayuki KITAJIMA
  • Publication number: 20140022720
    Abstract: Systems and methods provide for a device including a film having a shape that defines an interior region. The device may also include one or more electronic components disposed within the interior region of the film, and a hardened thermo-set resin within the interior region, wherein the thermo-set resin encompasses the electronic components and substantially fills the interior region of the film. In one example, printed content is coupled to a surface of the film. In addition, the thermo-set resin may include an additive that is configured to absorb and distribute heat generated by the electronic components.
    Type: Application
    Filed: May 17, 2012
    Publication date: January 23, 2014
    Inventors: Peter Davison, David Pidwerbecki
  • Patent number: 8623254
    Abstract: A method for producing a magnetic field sensor for use in drive train of a motor vehicle includes encapsulating an electrical assembly and an end of a connecting cable via injection molding and integrally extruding a fastening tab. After a first injection step in which the electrical assembly and the connecting cable are encapsulated in a core-type first molded part, a second injection molding step in implemented in which a fastening tab is integrally formed via injection molding on the core-type insertion part in a specifiable longitudinal and/or angular position. The core-like insertion part is held in the injection mold in a longitudinally displaceable and/or rotatable manner.
    Type: Grant
    Filed: November 26, 2008
    Date of Patent: January 7, 2014
    Assignee: Robert Bosch GmbH
    Inventors: Rolf Goetz, Steffen Schulze, Daniel Matthie, Markus Kny, Frank Weishaeutel
  • Publication number: 20140002998
    Abstract: An apparatus may include an electrical component body, where the electrical component body is operative to vary power during operation. The apparatus may also include a thermal component in contact with at least a portion of the electrical component body, in which the thermal component comprises a matrix material, and a thermal energy storage material embedded in the matrix material to absorb heat generated by the electrical component body. Other embodiments are disclosed and claimed.
    Type: Application
    Filed: June 28, 2012
    Publication date: January 2, 2014
    Applicant: Intel Corporation
    Inventors: David Pidwerbecki, Alexander B. Uan-Zo-li
  • Publication number: 20130338746
    Abstract: A 3D microelectrode device includes a flexible substrate containing poly-dimethyl siloxane (PDMS). The device may be fabricated in a miniature form factor suitable for attachment to a small organ such as a lateral gastrocnemius muscle of a live rat. In addition to providing a miniaturized, conformable attachment, the device provides an anchoring action via one or more microelectrodes, each having an insertable tip particularly shaped to provide the anchoring action. Furthermore, a base portion of each of the microelectrodes is embedded inside conductive poly-dimethyl siloxane (cPDMS). The cPDMS is contained in a pad that is coupled to a conductive track embedded in the flexible substrate. Embedding of the base portion inside the cPDMS material not only allows the microelectrode to bend in various directions, but also provides good electrical conductivity while eliminating the need for attachment processes using solder or epoxy adhesives.
    Type: Application
    Filed: June 17, 2013
    Publication date: December 19, 2013
    Inventors: GARETH S. GUVANASEN, SWAMINATHAN RAJARAMAN, RICARDO AGUILAR, JR., LIANG GUO, T. RICHARD NICHOLS, STEPHEN P. DEWEERTH
  • Publication number: 20130330465
    Abstract: A bi-stable sensor is provided that includes a frame upon which electrical and optical components may be disposed and a coating, such as an overmold coating, provided about the frame. A resistance-providing component is provided integral with or external to the coated bi-stable sensor such that the bi-stable sensor has two mechanically stable configurations that may be transitioned between by overcoming the resistance provided by the resistance-providing component and/or the by the coating. In one embodiment, the resistance-providing component comprises an elastic band provided about a hinge of the frame, either within or external to the coating. In one embodiment, the sensor may be placed on a patient's finger, toe, ear, and so forth to obtain pulse oximetry or other physiological measurements.
    Type: Application
    Filed: August 15, 2013
    Publication date: December 12, 2013
    Applicant: Covidien LP
    Inventors: William Raridan, George L. Matlock, Joseph Coakley, Darius Eghbal
  • Publication number: 20130331521
    Abstract: It is provided that a resin composition for sealing electrical electronic components which is not susceptible to gelation even when stagnant under high temperature conditions, and which are excellent in initial bond strength to an aluminum material, and which exhibits superior durability under a cooling and heating cycle load and the like. It is also provided that a sealed electrical electronic component with the resin composition for sealing electrical electronic components. A resin composition for sealing electrical electronic components, containing a crystalline polyester-based elastomer (A), a phenol-modified xylene resin (B1) and/or a phenol resin (B2), and a polyolefin resin (C), and having a melt viscosity of 5 dPa·s or more and 3000 dPa·s or less when dried to a water content of 0.1% or less, heated to 220° C., subjected to a pressure of 1 MPa, and extruded through a die with a hole diameter of 1.0 mm and a thickness of 10 mm.
    Type: Application
    Filed: February 21, 2012
    Publication date: December 12, 2013
    Inventors: Daiki Funaoka, Kenji Shiga
  • Publication number: 20130303010
    Abstract: A sealed connector assembly connects a first cable to a second cable and includes female and male terminal assembly components each having molded in place a weather resistant sleeve that both covers the respective terminal assembly components, and defines openings or gaps which enable female and male contacts to be electrically connected and the sleeves to mechanically contact, thereby providing weather and element resistance. In a method for insulating the respective female and male terminals in a mold assembly, an O-ring applied to the terminal components to prevent liquid mold material from flowing over the electrical contacts.
    Type: Application
    Filed: March 15, 2013
    Publication date: November 14, 2013
    Inventors: Jeffrey John KRAMER, Robert Salvatore TERRACINA
  • Patent number: 8561306
    Abstract: The present invention relates to a kit for an electric motor having a rotary encoder for determining the position of the motor shaft of the electric motor. A kit is proposed by which simple and precise positioning of a sensor of the rotary encoder on the electric motor, good protection of the sensor, and simple assembly are possible. To this end, the invention proposes that the kit includes an electric motor and a rotary encoder having a solid measure and having a sensor having sensor electronics, wherein the solid measure of the rotary encoder can be applied to a motor shaft at a reverse end face of the electric motor and protruding therefrom, the sensor of the rotary encoder is embedded with the sensor electronics in a plastic disc, a motor-side mounting element is disposed at the reverse end face of the electric motor, and the plastic disc comprises a sensor-side mounting element designed to be complementary to the motor-side mounting element.
    Type: Grant
    Filed: December 15, 2009
    Date of Patent: October 22, 2013
    Assignee: Maxon Motor AG
    Inventors: Max Erick Busse-Grawitz, Florian Schmidt, Berthold Puszta, Reto Korner, Mario Lussmann, Bruno Unternährer
  • Publication number: 20130271349
    Abstract: A dielectric cone radiator sub-reflector assembly for a reflector antenna with a waveguide supported sub-reflector is provided as a unitary dielectric block with a sub-reflector at a distal end. A waveguide transition portion of the dielectric block is dimensioned for insertion coupling into an end of the waveguide. A sub-reflector support portion of the dielectric block and the waveguide transition portion provided with a plurality of longitudinal ribs and grooves coaxial with a longitudinal axis of the assembly; the longitudinal grooves open to a proximal end of the dielectric block. The unitary dielectric block may be manufactured as a single contiguous monolithic portion of dielectric material via injection molding.
    Type: Application
    Filed: March 12, 2013
    Publication date: October 17, 2013
    Applicant: ANDREW LLC
    Inventors: Alastair Wright, John Curran
  • Publication number: 20130255848
    Abstract: The disclosure provides a core layer for an information carrying card, resulting information carrying card, and methods of making the same. A core layer for an information carrying card comprises at least one thermoplastic layer having at least one cavity, an inlay layer, and, and a crosslinked polymer composition. At least one portion of the inlayer layer is disposed inside the at least one cavity of the at least one thermoplastic layer. The crosslinked polymer composition is disposed over the at least one thermoplastic layer and contacting the inlayer layer.
    Type: Application
    Filed: March 13, 2013
    Publication date: October 3, 2013
    Applicant: X-Card Holdings, LLC
    Inventor: Mark A. Cox
  • Publication number: 20130249664
    Abstract: In a planar coil element and a method for producing the same, a metal magnetic powder-containing resin containing an oblate or needle-like first metal magnetic powder contains a second metal magnetic powder having an average particle size (1 ?m) smaller than that (32 ?m) of the first metal magnetic powder, which significantly reduces the viscosity of the metal magnetic powder-containing resin. Therefore, the metal magnetic powder-containing resin is easy to handle when applied to enclose a coil unit, which makes it easy to produce the planar coil element.
    Type: Application
    Filed: March 21, 2013
    Publication date: September 26, 2013
    Inventors: Kyohei TONOYAMA, Makoto MORITA, Tomokazu ITO, Hitoshi OHKUBO, Manabu OHTA, Yoshihiro MAEDA, Yuuya KANAME, Hideharu MORO
  • Patent number: 8528190
    Abstract: A method of manufacturing a power module on a substrate. In one embodiment, the method includes providing power conversion circuitry including providing a magnetic device having a magnetic core and at least one switch on the substrate. The method also includes placing a shielding structure with a baffle over the magnetic core to create a chamber thereabout. The method also includes depositing an encapsulant about the power conversion circuitry. The shielding structure limits the encapsulant entering the chamber and the baffle directs the encapsulant away from the magnetic core thereby limiting an amount of the encapsulant that contacts the magnetic core within the chamber.
    Type: Grant
    Filed: August 21, 2008
    Date of Patent: September 10, 2013
    Assignee: Enpirion, Inc.
    Inventors: Ashraf W. Lotfi, Mathew Wilkowski, John D. Weld
  • Patent number: 8506327
    Abstract: Portable electronic devices may have sealed connectors. A sealed connector may be formed using a multi-shot insert molding process. The sealed connector may include contacts. A first shot of thermoplastic may be injected to form a contact housing that is molded around the contacts. The contact housing may be encased in a metal shell. A second shot of thermoplastic material may be inserted to form a connector housing that is molded around the contact housing. An elastomeric sealing member may be integrated into the connector housing. A sealed connector formed in this way may be fitted into a device housing of an electronic device. The sealed connector may prevent ingress of liquid, dirt, or other undesirable debris that may enter into the device through the connector port. A flex circuit within the device may have solder pads that may be soldered to corresponding contacts in the connector.
    Type: Grant
    Filed: September 30, 2009
    Date of Patent: August 13, 2013
    Inventor: Eric Jol
  • Publication number: 20130200545
    Abstract: In order to produce ceramic green sheets with embedded structures of a functional material, structures of a functional material are first created on a carrier. The same structures are then embedded in a slip layer of a ceramic base material. Nearly plane-parallel green sheets obtained in this manner can easily be further processed to produce ceramic multilayer components.
    Type: Application
    Filed: July 28, 2011
    Publication date: August 8, 2013
    Applicant: EPCOS AG
    Inventor: Aloys Josef Foecker
  • Publication number: 20130142986
    Abstract: A method of forming a conductive adhesive includes condensation-polymerizing a carrier onto a plurality of carbon nanotubes each disposed on a substrate and having a first end and a second end spaced opposite the first end. The carrier is spaced apart from the substrate so that each of the plurality of carbon nanotubes extends continuously through the carrier such that the first end and the second end are spaced apart from the carrier. After condensation-polymerizing, the method includes removing the substrate from the plurality of carbon nanotubes without removing the carrier from the plurality of carbon nanotubes to thereby form the conductive adhesive. A conductive adhesive for removably joining a first surface and a second surface is also disclosed.
    Type: Application
    Filed: December 2, 2011
    Publication date: June 6, 2013
    Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC
    Inventors: Benjamin R. Christian, Jeffrey A. Abell, Jessica E. Weber
  • Publication number: 20130135802
    Abstract: Method and apparatus for potting an electronic device. In one embodiment, the method comprises providing an enclosure having a first inner volume with the electronic device disposed therein; placing a fill control element within the enclosure such that a second inner volume of the fill control element is fluidly coupled to the first inner volume; and filling a remaining portion of the first inner volume, the remaining portion not occupied by the electronic device or the fill control element, with a sealant such that air is trapped within at least a first portion of the second inner volume.
    Type: Application
    Filed: January 28, 2013
    Publication date: May 30, 2013
    Applicant: ENPHASE ENERGY, INC.
    Inventor: ENPHASE ENERGY, INC.
  • Patent number: 8444405
    Abstract: A fluid device includes a housing and a rotor assembly disposed in the housing. The rotor assembly includes a core and a coating. The core has a first surface, an oppositely disposed second surface and an outer peripheral surface that extends between the first and second surfaces. The core defines a bore that extends through the first and second surfaces. The coating coats at least a portion of the core. The coating is a water-swellable plastic material.
    Type: Grant
    Filed: September 29, 2009
    Date of Patent: May 21, 2013
    Inventors: Matthew Hollister, Doug Purdy, Dustin Featherstone
  • Publication number: 20130115427
    Abstract: A method and apparatus for molding a plastic element having a body with a surface from which at least one rib extends and an insert at least partially arranged against the surface and under the rib. The method carried out by the apparatus includes the steps of: (a) installing the insert against a wall of an injection cavity, the wall having at least one slit extending at least partially opposite at least one part of the insert, the slit being adapted to form the rib of the plastic element; and (b) injecting molding material into the injection cavity to create the body and the rib of the plastic element. A support element is positioned in the slit, against the insert, to support said insert during the injection.
    Type: Application
    Filed: April 27, 2012
    Publication date: May 9, 2013
    Applicant: Faurecia Interieur Industrie
    Inventors: Jean Oeuvrard, Gérald Marchetto
  • Patent number: 8429807
    Abstract: An aluminum-plastic composite structure includes an aluminum portion and a plastic portion. The aluminum portion defines a plurality of micro grooves by ultraviolet lithography. The plastic portion is integrally formed on the aluminum portion and substantially filling in the micro grooves. A width of each micro groove is in a range from 0.02 millimeters to 0.05 millimeters. A depth of each micro groove is in a range from 0.2 millimeters to 0.25 millimeters.
    Type: Grant
    Filed: March 29, 2011
    Date of Patent: April 30, 2013
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Shien-Cheng Kuo
  • Publication number: 20130093539
    Abstract: The invention relates to a method for manufacturing an RF filter comprising several resonator cavities and an RF filter manufactured by the method. The resonator cavities are formed into shape from a copper plate in a first manufacturing phase. In a second manufacturing phase the formed resonator cavities are inserted or integrated into a chassis material of the RF filter.
    Type: Application
    Filed: November 11, 2011
    Publication date: April 18, 2013
    Applicant: Prism Microwave, Inc.
    Inventors: Mika Hedemaki, John Kevin Pryor, William Baldwin Johnson
  • Publication number: 20130084738
    Abstract: A strain relief for a coaxial cable and coaxial connector interconnection is provided as an injection moldable polymer material surrounding the interconnection. The injection moldable material fills a solder pre-form cavity between an outer conductor of the coaxial cable and an inner diameter of a bore of the connector body, strengthening and environmentally sealing the interconnection.
    Type: Application
    Filed: October 3, 2011
    Publication date: April 4, 2013
    Applicant: ANDREW LLC
    Inventors: Kendrick Van Swearingen, James J. Carlock, James P. Fleming
  • Publication number: 20130084740
    Abstract: A strain relief for a coaxial cable and coaxial connector interconnection is provided as an injection moldable polymer material surrounding the interconnection. The injection moldable material fills a solder pre-form cavity between an outer conductor of the coaxial cable and an inner diameter of a bore of the connector body, strengthening and environmentally sealing the interconnection. Where the outer conductor is corrugated, the polymer material may be provided covering an exposed portion of the corrugations and/or filling portions of a corrugation trough between an outer jacket and the outer diameter of the outer conductor.
    Type: Application
    Filed: October 2, 2012
    Publication date: April 4, 2013
    Applicant: ANDREW LLC
    Inventor: ANDREW LLC
  • Publication number: 20130082883
    Abstract: Embodiments are described herein in the context of housings for electronic devices. In one embodiment, a housing can make use of an outer member, which can be formed of glass. The outer member can be secured with respect to other portions of the housing for the electronic device. The output member can also be protected at its edges by a protective side member. Still further, one or more antenna can be provided at least partially internal to the protective side member. The electronic devices can be portable and in some cases handheld.
    Type: Application
    Filed: September 30, 2011
    Publication date: April 4, 2013
    Inventors: Anthony S. Montevirgen, Emery A. Stanford, Stephen B. Lynch
  • Patent number: 8398899
    Abstract: A method for manufacturing an optical waveguide includes: step A of forming a first resin layer 23 by allowing a first liquid-state resin to flow to be extended in a manner so as to bury and enclose cores 22; step B of forming a second resin layer 25 by allowing a second liquid-state resin having a viscosity higher than that of the first liquid-state resin to flow to be extended on the first resin layer 23, after or while the first resin layer 23 is heated; and step C of forming an over-cladding layer 26 by curing the first resin layer 23 and the second resin layer 25.
    Type: Grant
    Filed: June 12, 2009
    Date of Patent: March 19, 2013
    Assignee: Nitto Denko Corporation
    Inventor: Ryusuke Naitou
  • Publication number: 20130055828
    Abstract: An improved structure for a torque sensor assembly adapted for use in a vehicle steering system and method for producing the same. According to one embodiment, the torque sensor assembly includes a housing formed from a suitable material having a cavity; at least one flux concentrator and at least one hall effect IC disposed in the cavity of the housing; and a cover secured to the housing to close the cavity in the housing in a permanent and fluid-tight manner.
    Type: Application
    Filed: May 13, 2011
    Publication date: March 7, 2013
    Applicant: TRW AUTOMOTIVE U.S. LLC
    Inventors: Engelbert Lu, Jeremy Gonyou
  • Publication number: 20130048651
    Abstract: In order to produce a plastic container (1, 2) having a planar electronic element (15), a planar electronic element (15) is introduced into a recess (29) of an inner face of a mold. The mold comprises an outer mold part (10) and a mold core (11), which form a mold cavity (12). Molten plastic material is injected into the mold cavity (12). After the subsequent cooling of the plastic material, mold removal is carried out. The recess (29) is arranged on an inner face (26) of the outer mold part (10). The molten plastic material is injected into the mold cavity in such a way that the molten plastic material flows substantially parallel along a surface (25) of the planar electronic element (15) facing the mold cavity (12). The planar electronic element (15) is an RFID inlay, for example. The planar electronic element does not require a protective casing and can be sprayed directly.
    Type: Application
    Filed: May 4, 2011
    Publication date: February 28, 2013
    Applicant: WEIDMANN PLASTICS TECHNOLOGY AG
    Inventors: Kurt Eggmann, Karl Mazenauer, Michael Akermann
  • Publication number: 20130043054
    Abstract: A housing includes a transparent panel and a housing body. The housing body includes a main body and a flange portion extending from the main body. The filler is formed between the transparent panel and the housing body. The filler includes a first connecting portion, a second connecting portion, and a support portion integrally formed together, the first connecting portion connecting the transparent panel to the flange portion, the support portion supporting the transparent panel, and the second connecting portion connected to the housing body.
    Type: Application
    Filed: December 23, 2011
    Publication date: February 21, 2013
    Applicant: FIH (Hong Kong) Limited
    Inventor: PO-FENG HO
  • Publication number: 20130010400
    Abstract: An method of forming a metal foil coated ceramic and a metal foil capacitor is provided in a method of making a metal foil coated ceramic comprising providing a metal foil; applying a ceramic precursor to the metal foil wherein the ceramic precursor comprises at least one susceptor and a high dielectric constant oxide and an organic binder, and sintering the ceramic precursor with a high intensity, high pulse frequency light energy to form the metal foil ceramic.
    Type: Application
    Filed: July 5, 2012
    Publication date: January 10, 2013
    Applicant: KEMET ELECTRONICS CORPORATION
    Inventors: John E. McConnell, John Bultitude, Abhijit Gurav
  • Patent number: 8347486
    Abstract: Various methods are disclosed herein for forming an apparatus, which is configured to reduce the electromagnetic interference between a pair of antennas coupled to a wireless communication device. In some embodiments, the method includes extracting a shape of the apparatus from a thin sheet of conductive material, and folding the shape into a plurality of resonant circuit elements. In other embodiments, the apparatus is formed within various cavities of a mold; a liquefied substance may be inserted into the mold for filling the various cavities and forming a plurality of resonant circuit elements. In all embodiments, the plurality of resonant circuit elements are each configured to resonate at (or near) a carrier frequency of a signal transmitted by one of the pair of antennas.
    Type: Grant
    Filed: December 22, 2011
    Date of Patent: January 8, 2013
    Assignee: Motion Computing, Inc.
    Inventors: Todd W. Steigerwald, Jerry Mayfield
  • Publication number: 20130000946
    Abstract: A cable which includes an injection molded coupling part which is manufactured from a polymer mixture with a thermoplastic material as polymer component, where the cable is distinguished by the fact that the casing contains thermoplastic polyurethane cross-linked by radiation. The cable has a water-tight and fixed connection between the casing of the cable and the section of the coupling part injection molded around the casing.
    Type: Application
    Filed: April 19, 2012
    Publication date: January 3, 2013
    Inventors: Otto Nachbauer, Dietmar Voelkl, Thomas Noetzel
  • Publication number: 20120318877
    Abstract: Encapsulated radio frequency identification (RFID) articles having enhanced break strength and/or temperature resistance and methods of making these articles. The RFID articles include an RFID tag embedded within a thermoplastic substrate to form the RFID article. In one embodiment, the RFID article includes an over-molded barrier material that enables the RFID article to have enhanced temperature resistance such that the articles are able top sustain repeated exposure to high temperatures and/or sterilization procedures, thereby enabling the RFID articles to be utilized in applications heretofore unavailable. In other embodiments, the RFID articles are made using an injection molding process that provides very thin encapsulated RFID tags that also exhibit an increased level of temperature resistance.
    Type: Application
    Filed: August 30, 2012
    Publication date: December 20, 2012
    Applicant: SABIC INNOVATIVE PLASTICS IP B.V.
    Inventors: Sudhakar R. Marur, Theethira Kushalappa Poovanna, Venkatesha Narayanaswamy
  • Publication number: 20120313826
    Abstract: A portable electronic device includes a base, an antenna radiator, an outer layer, and at least one conductive contact. The antenna radiator formed on the base, the antenna radiator is made by injection molding from a mixture of materials selected from a group consisting of thermoplastic, organic filling substances, and conductive small particle sized material. The antenna radiator is sandwiched between the base and the outer layer. One end of each conductive contact is electrically connected to the antenna radiator, and the other end of the each conductive contact is exposed.
    Type: Application
    Filed: August 17, 2011
    Publication date: December 13, 2012
    Applicants: FIH (HONG KONG) LIMITED, SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD.
    Inventors: ZHAO-YI WU, YONG YAN, YONG-FA FAN, XUE-LI ZHANG