Abstract: A flexible resilient member at least partially overlying an electrical switch, and attached to an external surface of the switch, comprises at least one signalling component operable on operation of the underlying switch. The member may be in the form of a membrane, for example, formed of an elastomeric material. The signalling component may emit wireless signals which may be received by a monitoring component.

Abstract: Disclosed herein is a method of making a light emitting device having an LED die and a molded encapsulant made by polymerizing at least two polymerizable compositions. The method includes: (a) providing an LED package having an LED die disposed in a reflecting cup, the reflecting cup filled with a first polymerizable composition such that the LED die is encapsulated; (b) providing a mold having a cavity filled with a second polymerizable composition; (c) contacting the first and second polymerizable compositions; (d) polymerizing the first and second polymerizable compositions to form first and second polymerized compositions, respectively, wherein the first and second polymerized compositions are bonded together; and (e) optionally separating the mold from the second polymerized composition. Light emitting devices prepared according to the method are also described.

Abstract: An electrochemical sensor with a capillary channel is formed by placing a sacrificial insert and electrodes on a sensor base and applying plastic material. After the plastic material is cured, the sacrificial is removed leaving a capillary channel in the sensor. The inserts may be removed by a tool including a clamp for clamping and holding each insert stationary and a sliding block to which the sensor is secured.

Abstract: An assembly including an electrical wire and a plug housing forming an electrical connector. The electrical wire includes an electrical conductor and electrical insulation surrounding the electrical conductor. An end of the electrical conductor is not surrounded by the electrical insulation. The plug housing is on the end of the electrical wire. The plug housing covers a bottom of the end of the electrical conductor and covers a first portion of a front side of the end of the electrical conductor. The plug housing does not cover a top of the end and does not cover a second portion of the front side such that the top of the end and the second portion are exposed to be able to electrically contact an electrical contact of a mating electrical connector.

Abstract: An FPC connector is manufactured by pouring a resin material into a cavity defined by a mold through a gate formed to the mold so as to fill the cavity to thereby perform an injection molding of the FPC connector. In the manufacture, a mold to which a single gate is formed is used, and the gate is formed at a position between one end portion of the cavity and a portion apart inside by 15/100 of a full length of the cavity from one end in a longitudinal direction thereof. A liquid crystalline polyester may be preferable used as the resin material.

Abstract: A film member and a film molded product are disclosed that include a film layer, a decorative layer having a predetermined image, a metal wiring layer having a metal wiring, and a shape retaining layer.

Abstract: The invention relates to a method for encapsulating electronic components in a mold by the processing steps of: A) placing the electronic component for encapsulating in a mold cavity, and B) feeding an encapsulating material to the mold cavity, wherein at least a part of the mold surface defining the mold cavity is brought into contact with a conditioning gas containing a decreased oxygen concentration relative to the atmosphere. The invention also relates to a device for encapsulating an electronic component, in particular a semiconductor, with encapsulating material.

Abstract: A method of manufacturing a semiconductor device sealed in a cured silicone body by placing an unsealed semiconductor device into a mold and subjecting a curable liquid silicone composition that fills the spaces between the mold and the unsealed semiconductor device to compression molding under a predetermined molding temperature, wherein said curable liquid silicone composition has viscosity of 90 Pa·s or less at room temperature, a time interval from the moment directly after measurement of a torque with a curometer at the molding temperature to the moment when the torque reached 1 kgf·cm is not less than 1 min., while the time interval during which the torque grows from 1 kgf·cm to 5 kgf·cm is not more than 1 min.

Abstract: A method to manufacture a sensor is provided and includes forming a foamed core of a first material with a hole defined therein, inserting a rod into the hole, filling the core with a slurry of a second material and curing the second material.

Abstract: A front cover for a vehicle lighting fixture is attached to the front opening part of the vehicle lighting fixture having a lamp body and a light source installed in the lamp body. A part of the surface of the front cover opposed to the light source includes a heating element having a three-dimensional curved surface. The heating element includes a mesh pattern having intersections of a large number of grids formed of conductive metallic filaments and a first electrode and a second electrode formed at both opposed ends of the mesh pattern. The projection shape of the outline of the entire mesh pattern is formed in a rectangular shape having the longitudinal direction, for example, between the first electrode and the second electrode.

Abstract: Cast material rotor (200,300,500,800) with profiled helical outer surface (208,308,508,808). Cast material layer (502,802) can be disposed between core (504,804) and tube (506,806). Profiled helical outer surface (208,308) can be in tube 206 or cast material layer 302, respectively. Method of forming rotor 200 can include filling void between outer surface 212 of core 204 and longitudinal bore 210 of tube 206 having profiled helical outer surface 208 with cast material 202 in fluid state, and solidifying cast material 202. Tube 206 can be disposed within profiled helical bore 714 of mold 700, e.g., before solidifying cast material 202. Method of forming rotor 300 can include filling void between outer surface 312 of core 304 and profiled helical bore 714 in mold 700 with cast material 302 in fluid state, solidifying cast material 302 to impart profiled helical outer surface 308 thereto, and removing mold 700 from cast material 302.

Abstract: A high-voltage connector component for a high-voltage cable comprises an insulator made of a polymer material which surrounds a cable end portion of the high-voltage cable, wherein the insulator is received in a housing and is made of an elastomer material, wherein the elastomer material is filled, cast or injected into the housing in order to form the insulator. The connector component is designed such that upon connection to a corresponding connector component a basically closed pressure chamber is formed between the housing, the corresponding connector component and the cable end portion, wherein the pressure chamber is basically provided for being completely occupied by the insulator.

Abstract: An encapsulation method of an environmentally sensitive electronic element is provided. A first substrate is provided, wherein at least one first alignment mark and a plurality of environmentally sensitive electronic elements are formed on the first substrate. A second substrate is provided, wherein at least one second alignment mark and a plurality of limiting cavities are formed on the second substrate. A plurality of cover lids is respectively disposed in the limiting cavities. An adhesive is formed on the cover lids. The first substrate and the second substrate are laminated together with the first alignment mark and the second alignment mark as reference, so that the environmentally sensitive electronic elements are sealed in the adhesive and located between the first substrate and the second substrate. The second substrate and the cover lids are separated from each other.

Abstract: A process for making a protective assembly for an article, such as a circuit, includes forming a flexible layer of the protective assembly over the circuit to be protected during circuit operation, wherein said protective assembly is non-adhesive to the circuit and wherein the flexible layer is conformed to the topography of the circuit and non-adhesive to the circuit.

Abstract: The torque sensor includes a plurality of coil units having a substantially cylindrical shape, the coil units including a plurality of detection coils arranged to face a magnetic characteristic change portion formed on a rotary shaft. The coil units include a first coil unit and a second coil unit, and the first coil unit and the second coil unit are disposed in the axial direction of the shaft. The first coil unit and the second coil unit are fixed in an integrally molded resin. Thereby, there is provided a torque sensor having a high productivity and an easy configuration and a method of manufacturing the torque sensor.

Abstract: A method and apparatus for simplifying battery pack encapsulation is provided. The battery pack includes a pair of complementary housing members with each housing member including a plurality of cell constraints into which the ends of corresponding battery cells are inserted during assembly. One or both housing members also include at least one, and preferably a plurality, of raised encapsulant injection ports. The raised encapsulant injection ports are designed to extend above the surface of the respective housing members and beyond the injected encapsulation material, thus ensuring that the ports remain open after encapsulation material injection.

Abstract: The present invention relates to a process for manufacturing composite structures formed by two subcomponents of the same material, characterized in that it comprises the following steps: providing a first subcomponent (13), particularly a skin; providing a tool (15) made of a composite and precured for the manufacture of the second subcomponent (17), particularly a stiffener; positioning said tool (15) on said first subcomponent (13); applying preimpregnated composite (21) on said tool (15) so as to form the second subcomponent (17); consolidating the composite structure by means of a process of curing the assembly resulting from the previous steps under suitable pressure and/or temperature conditions.

Abstract: A fuel cell, having improved sealing against leakage, includes a fuel cell component having a cured sealant, wherein the cured sealant includes a telechelic-functional polyisobutylene, an organhydrogenosilane crosslinker, a platinum catalyst and a photoinitiator. The fuel cell component may be a cathode flow field plate, an anode flow field plate, a resin frame, a gas diffusion layer, an anode catalyst layer, a cathode catalyst layer, a membrane electrolyte, a membrane-electrode-assembly frame, and combinations thereof.

Abstract: A method for winding a lead wire on a multi-winding electronic component is provided. The method can prevent winding slack of the lead wire, a break of the lead wire, and/or a terminal disconnection failure. A lead wire is wound around a winding core by a certain number of turns to form at least one first layer. Next, the lead wire is folded back toward an electrode, is pulled toward the electrode at an end-of-winding side so as to be across the second layer. Then, the lead wire is caught at a bottom part of the collar to form a final terminal part for boding to the electrode.

Abstract: A method of manufacturing a portion of a portable electronic device includes forming a fibrous laminate sheet to provide a laminate body, and connecting a rim with the body. The rim includes a connector for coupling with a complementary part.

Abstract: A pneumatic tire includes a tire body having a crown portion and a pair of sidewalls. At least one reinforcing belt is disposed in the crown portion of the tire. A tag is carried by the reinforcing belt. In one embodiment, the tag is disposed in the location of one of the reinforcing cords that is disposed in the reinforcing belt. In another embodiment, the tag is disposed at the splice of the reinforcing belt. An alternative version of the tire has the tag carried in a depression formed in the outer surface of the tire sidewall. The tag may be encapsulated with an encapsulation material that is also disposed in the depression.

Abstract: A circuit carrier is disclosed that includes a base body having two flat sides and a plurality of narrow sides, a first conductor track applied to a first flat side of the base body, and a leadframe arranged in the interior of the base body. A method for producing the circuit carrier is also disclosed.

Abstract: A method comprising: a first process of placing a laminated rotor core in a preheating device to preheat the laminated core; a second process of removing the preheated laminated core from the preheating device and disposing the laminated core between upper and lower dies of a resin sealing apparatus; a third process of pressing the laminated core by the upper and lower dies and liquefying resin material in resin reservoir pots by heating; and a fourth process of ejecting the liquefied resin material from the pots into the magnet insertion holes by plungers inserted and moving vertically in the pots and thermally curing the resin material. The method improves efficiency of resin sealing the permanent magnets in the laminated core.

Abstract: Improvement in the yield of a semiconductor device is aimed at. When extruding a molded body with the ejector pin which performs advance-or-retreat movement at the projecting portion which projects from this bottom face in the bottom face of a mold cavity corresponding to the surface and the mounting side of a molded body after forming a molded body, depressed portions being formed in the surface and the mounting side by projecting portions, they can extrude. When accumulating molded bodies themselves in the baking step after a resin molding step and performing bake, by arranging the resin burr which furthermore withdrew from the surface and the mounting side in the depressed portion, bake can be performed in the condition that the accumulated molded bodies are stuck. Therefore, the form of deformation of a warp etc. of each molded body or a lead frame, can be made uniform, and, as a result, improvement in the yield of QFP (semiconductor device) is aimed at.

Abstract: A connector (20) is placed in a first die (50) so that an end of a wall (41) of the connector (20) closely contacts a recess (55) of the first die (50) to define a cutoff (58). The dies then are closed to define a filling space (60C) between a surface (62) of a second die (51) and an outer surface (46) of the wall (41). The outer surface (46) of the wall (41) is inclined moderately upward. Molten resin is directed into the filling space (60C) and presses the inclined outer surface (46) of the wall (41) so that an inner surface (47) of the bottom wall (41) is pressed against the recess (55) of the first die (50) and strongly held in close contact by a component of this pressing force. Thus, molten resin cannot intrude through the cutoff (58).

Abstract: A housing includes a base and an antenna radiator. The base includes a first injection layer and a second injection layer. The first and second injection layers are formed by injecting of moldable plastic and combining to each other. The antenna radiator is sandwiched between the first and second injection layers by insert molding. The antenna radiator is at least partly covered by the first and second injection layer. The antenna radiator includes a plurality of hills and a plurality of valleys defined between adjacent hills. The antenna radiator includes at least two conducting layers and at least one dielectric layer, and adjacent conducting layers electrically are connected to each other and are separated by the dielectric layer.

Abstract: First, a horizontal nozzle is inserted between an upper mold section and a lower mold section in a horizontally extending state. Then, liquid resin is horizontally discharged from a discharge port of the horizontal nozzle. Thus, the liquid resin is supplied into a cavity. Thereafter the upper mold section and the lower mold section are closed. Consequently, an electronic component mounted on a substrate is dipped in the liquid resin stored in the cavity. Therefore, the electronic component is resin-sealed on the substrate by compression molding.

Abstract: A light emitting device includes a base body forming a recess defined by a bottom surface and a side wall thereof, a conductive member whose upper surface being exposed in the recess and whose lower surface forming an outer surface, a protruding portion disposed in the recess, a light emitting element mounted in the recess and electrically connected to the conductive member, and a sealing member disposed in the recess to cover the light emitting element. The base body has a bottom portion and a side wall portion integrally formed of a resin, an inner surface of the side wall portion is the side wall defining the recess and has a curved portion, and the protruding portion is disposed in close vicinity to the curved surface. With this arrangement, a thin and small-sized light emitting device excellent in light extraction efficiency and reliability can be obtained.

Abstract: A new cross linked polyolefin material combination that is designed to replace current high-density polyethylene (“HDPE”) materials for use with molded or over-molded electrical transmission products. Such molded or over-molded electrical transmission products include, for example, vise-top pin insulators, line post insulators, F-neck, C-neck, and J-neck pin insulators of classes ANSI 55-3, 55-4, and 55-5, Spacer cable spacers, Brackets, hangers, Line post sensors, cable restraint insulators, and transmission style insulators.

Abstract: A molding process is performed by molds such that a primarily molded body 12 mounted with a detecting element 11 for detecting a vehicle condition is subjected to a secondary molding process, and that a hollow portion 19 within a connector housing portion 15 to be formed by the secondary molding process is penetrated to the face area of the primarily molded body 12 corresponding to the position of the detecting element 11.

Abstract: Disclosed herein is a method of making a light emitting device having an LED die and a molded encapsulant made by polymerizing at least two polymerizable compositions. The method includes: (a) providing an LED package having an LED die disposed in a reflecting cup, the reflecting cup filled with a first polymerizable composition such that the LED die is encapsulated; (b) providing a mold having a cavity filled with a second polymerizable composition; (c) contacting the first and second polymerizable compositions; (d) polymerizing the first and second polymerizable compositions to form first and second polymerized compositions, respectively, wherein the first and second polymerized compositions are bonded together; and (e) optionally separating the mold from the second polymerized composition. Light emitting devices prepared according to the method are also described.

Abstract: Provided is a small resin-sealed electronic control device with a reduced plane area and volume, which can provide an enlarged area on which circuit components are mounted without increasing a plane area of electronic boards. In the resin-sealed electronic control device, a support member (20A) includes a first support plate (21a), a second support plate (22a), and a pair of rising portions (23a) which form a space portion with a first electronic board (30A) and a second electronic board (40A). An exterior covering material (11) is formed by injecting a melted synthetic resin into the space portion and spaces outside the space portion along the pair of rising portions (23a). Inner circuit components (33) are situated inside window holes formed through the support plate (20A) and face one of the first electronic board (30A) and the second electronic board (40A) opposed to each other with a gap interposed therebetween.

Abstract: A forming method of a toilet seat which is integrally formed with an embedded heating wire uses primarily a plastic material or glass fiber reinforced plastic to embed a heating wire in a toilet seat, forming the toilet seat which is integrally formed with the embedded heating wire. The toilet seat which is integrally formed with the embedded heating wire is characterized in that the said toilet seat is embedded with the heating wire which contacts with the toilet seat without leaving a gap, thereby forming the integrally formed toilet seat.

Abstract: Gelatinous materials combined with the Colloidal Silver additive to formulate an antimicrobial product having cushioning properties. Embodiments of the present invention can include gelatinous materials selected from a group consisting of thermosetting polymer, Styrene-Ethylene-Butadiene-Styrene polymer (SEBS), Thermoplastic Elastomer (TPE), and Polyurethane (PU) gelatin with and without a raised geometry on an outer surface.

Abstract: The present invention relates to a kit for an electric motor having a rotary encoder for determining the position of the motor shaft of the electric motor. A kit is proposed by which simple and precise positioning of a sensor of the rotary encoder on the electric motor, good protection of the sensor, and simple assembly are possible. To this end, the invention proposes that the kit includes an electric motor and a rotary encoder having a solid measure and having a sensor having sensor electronics, wherein the solid measure of the rotary encoder can be applied to a motor shaft at a reverse end face of the electric motor and protruding therefrom, the sensor of the rotary encoder is embedded with the sensor electronics in a plastic disc, a motor-side mounting element is disposed at the reverse end face of the electric motor, and the plastic disc comprises a sensor-side mounting element designed to be complementary to the motor-side mounting element.

Abstract: An electrochemical sensor is described, containing a sensor substrate and at least one set of electrodes comprising a working electrode, a reference electrode and optionally an auxiliary electrode, further containing at least one reaction vessel, which is tightly connected to the sensor substrate and inside which is located at least one working electrode, whereas at least a part of the sensor substrate forms a vessel bottom. The vessel can contain a lid and also other preferred embodiments are described. The invention further describes a method of manufacture of the electrochemical sensor with the integrated reaction vessel, particularly by injection moulding.

Abstract: There is provided a case of an electronic device having an antenna pattern embedded therein, the case including: a radiator frame injection molded so that a radiator including an antenna pattern part and formed on a film is formed on one surface thereof; a case frame injection molded upwardly of the radiator frame and provided with the radiator embedded between the radiator frame and the case frame; and a boundary part forming a boundary between the radiator frame and the case frame and having a groove formed inwardly of the case frame.

Abstract: Provides is a method of manufacturing an insert-molded article enabling to perform resin molding and tie bar cutting in one step and so as not to expose the cut planes of the tie bars to the external surface of the resin. A lead frame 1 provided with easily breakable notches 3a at positions closer to the metal component than the interfaces of tie bars 3 to be resin molded is prepared and positioned by means of pilot pins 11 provided to a lower mold 10. A metal component 4 is sandwiched between support protrusions 13 and component fixing pins 24 by lowering an upper mold 20 with the lead frame being positioned. Tie bar cutting punches 23 provided to the upper mold 20 are pressed against the tie bars, the tie bars 3 are separated from the metal component 4 by breaking the notches 3a, and the surroundings of the metal component 4 are filled with resin while the molds are closed. By this, the cut surfaces between the metal component 4 and the tie bars 3 are buried in the molded resin 7.

Abstract: Described herein is a molded printed circuit board. The printed circuit board may be placed inside of a mold and a material is injected therein. The material hardens in the mold around the printed circuit board thereby forming an overmolded printed circuit board. The overmolded material may have apertures in it to allow access to the leads on the printed circuit board so that components to be connected to it. The overmolded printed circuit boards may allow a plurality of electrical components to selectively and removably attach to it. Further, the printed circuit board may be attached in a housing which may itself removably and selectively connect to components.

Abstract: A method of manufacturing an encapsulated package for a magnetic device on a substrate. In one embodiment, the method includes providing a magnetic core on the substrate and placing a shielding structure over the magnetic core to create a chamber thereabout. The method also includes depositing an encapsulant about a portion of the magnetic core within the chamber. The shielding structure limits the encapsulant entering the chamber.

Abstract: A method of manufacturing a film antenna includes: preparing a carrier film formed of an insulation polymer material; forming an antenna radiator on at least one side of the carrier film by one of sputtering and deposition; inserting the carrier film with the antenna radiator formed thereon into a mold having a shape of a mobile communication terminal case; and forming a mobile communication terminal case integrally formed with the carrier film by injecting a molding material into the mold.

Abstract: To provide an assembly which is as small as possible which contains a well-protected component and effectively dissipates heat, and to provide a device and a method for use in the rapid manufacture of such an assembly, an assembly includes a component and a housing from which the component is partially separated by narrow casting gaps filled with a casting compound containing a relatively large amount of filler. For the manufacture of such an assembly, a device is used for filling with casting compound and which includes a mounting for securing the assembly in a position which permits air to escape from the casting gaps, which have an external connection during filling. Also there are supply containers and supply lines for the casting compound which open into the casting gaps, and an apparatus for generating pressure. A method which is used to fill narrow casting gaps with casting compound by using such a device.

Abstract: A compression resin sealing apparatus includes cooling means (64, 104) for each of an upper die (6) and a lower die (10). A gate nozzle (15) including cooling means (154a) is provided in the upper die (6). A cavity (106) for mounting a single substrate is provided in the lower die (10). In this apparatus, a liquid thermosetting resin material (R) in a required amount is supplied into the cavity (106) through the gate nozzle (15). Then, a substrate is supplied between the upper die (6) and the lower die (10), and the upper die (6) and the lower die (10) are clamped to each other. As a result, an electronic component on the substrate is immersed in the liquid thermosetting resin material (R) in the cavity (106). That is, compression resin molding is performed. Here, a temperature of the liquid thermosetting resin material (R) is controlled by the gate nozzle (15) and the cooling means (154a, 64, 104).

Abstract: A method for forming an enclosure for enclosing internal electronic components of an electronic device is provided, which comprises: performing a first injection molding process, the first injection molding process forming at least a first wall of the enclosure; allowing the at least a first wall of the enclosure to solidify; thereafter performing a second injection molding process, the second injection molding process forming at least a second wall of the enclosure, the at least a second wall of the enclosure fusing with the at least a first wall of the enclosure during the second injection molding process, the at least second wall of the enclosure forming at least one different side of the enclosure than the at least first wall of the enclosure; and allowing the at least a second wall of the enclosure to solidify, the at least a second wall of the enclosure being integrally formed with the at least a first wall of the enclosure to thereby form a single-piece multi-walled enclosure.

Abstract: The present invention relates to electrostatically actuated device components and methods of making the same. In an embodiment, the invention includes a method of making an electrostatically actuated device component including providing a multilayered structure comprising a first layer comprising a first polymer, a second layer comprising a conductive material, the second layer disposed over the first layer, a third layer comprising a dielectric material, the third layer disposed over the second layer, positioning the multilayered structure within an injection mold, and injecting a second polymer into the mold and bonding the first layer to the second polymer to produce an electrostatically actuated device component. In an embodiment, the invention includes a method of injection molding a stator component for an electrostatically actuated valve.

Abstract: There is provided a method of sealing and molding an optical device with resin by employing a die including a top piece, a bottom piece, an intermediate piece, and a mold release film pinched between the bottom and intermediate pieces and thus tensioned as prescribed to cover the bottom piece's cavity, when the bottom piece is heated, and the mold release film expands and thus closely contacts the cavity's entire surface along the cavity's geometry so that the optical device can be sealed in transparent set resin shaped as desired.

Abstract: A device and method for the molding of plugs as part of a pipe connection wherein the pipe connection is constructed as a sealing plug-in connection with a connecting piece and a plug that can be locked with the connecting piece. A molding slot is placed in the material of the plug with an expanding tool acting in a radial direction and a sensor subject to the radial deformation is arranged in the expanding jaw. The sensor records the radial deformation work of the expanding jaw and regulates the expanding drive.

Abstract: Cable organization assemblies and methods of making said assemblies are provided herein. Preferred assemblies are directed to releasably coupling two or more audio wires to prevent entanglement. Headphones having two audio cables configured to zip together to prevent entanglement and subsequently zip apart are provided herein.

Abstract: A housing assembly (100), used, e.g., in a mobile electronic device (300), includes a housing body (10) and a display unit (20). The housing body defines a display opening (110). The display unit contains electronic ink. The display unit is received in the display opening and is configured for providing information and/or graphics. The housing body moldingly receives the display lens therein, via an injection molding process.

Abstract: A device configured to maintain an electric circuit in a fixed position during an overmolding process comprises a wire retainer configured to hold the electric circuit taut and in a fixed position while being molded within a molded item. The retainer has a first end and an opposite second end, and includes a first bushing defining a mounting hole for the molded item extending along a width axis. The built-in bushing includes front and back surfaces configured to be aligned and substantially co-planar with the front and back surfaces of the molded item. The device also includes a first securing member configured to secure a portion of the electric circuit to the retainer within the molded item, to hold the electric circuit in a fixed position within the molded item during the overmolding process.