Abstract: The invention relates to an electric rotating machine (10) comprising a rotor (7), a stator (1) surrounding the rotor (7), and an air gap (6) between the rotor (7) and the stator (1). In order to obtain high efficiency and a compact design, the stator (1) has stator windings (13) that are encased, and the stator (1) immediately adjoins the air gap (6).

Abstract: An apparatus for fabricating a semiconductor package may include a mold and a molding plate. The mold may define a mold cavity with the mold being configured to receive a circuit board in the mold cavity, and the circuit board may include a semiconductor chip mounted thereon. A molding plate may be moveable in the mold cavity with the molding plate being configured to adjust a volume of the mold cavity. Related methods are also discussed.

Abstract: A method of manufacturing a resin molded electronic component using a first mold having a cavity with an open top surface and a second mold combined with the first mold on top includes the following steps: (A) inserting a element of the electronic component and a liquid resin precursor into the cavity of the first mold, the liquid resin precursor having viscosity of 10 Pa·s or lower at 40° C.; (B) arranging the second mold such that the element and the resin precursor are sandwiched after the step (A); and (C) pressing the element and the resin precursor between the first mold and the second mold, and curing the resin precursor by heat from the second mold after the step (B). A temperature of the second mold is set to be higher than that of the first mold.

Abstract: The present invention relates to the fabrication of multichannel nerve conduits for use in the repair of nerve injury. In particular, the invention relates to collagen multichannel nerve conduits which are suitable for use in repair of peripheral nerves.

Abstract: The present disclosure relates generally to microfluidic devices and methods for fabricating the devices. More particularly, the present disclosure relates to microfluidic devices having encapsulated fluidic tubing and encapsulated electrodes, microfluidic devices having encapsulated fluidic tubing, encapsulated capillary loops and encapsulated electrodes, and methods of fabricating devices having encapsulated fluidic tubing, encapsulated capillary loops and encapsulated electrodes resulting in reduced dead volume interconnects between the fluidic tubing and capillary loops and associated microchannels and aligned fluidic tubing openings, capillary loop openings, electrodes and other device features.

Abstract: Mold pieces (105 and 110) for molding a layer of mold compound on the interconnect side of a bumped semiconductor wafer (118) include a primary cavity (117) and secondary cavities (120) into which excess mold compound from the primary cavity (117) flows. The secondary cavities (120) include a plunger (130) that asserts a predetermined backpressure that is equal to a desired mold compound pressure on the mold compound during molding. As most of the excess mold compound in the primary cavity (117) is forced to flow into the secondary cavities (120), this advantageously leaves a relatively thin layer of mold compound on the semiconductor wafer (118), which can then be removed, for example by grinding, in a relatively short time. Mold piece (105) further comprises a movable cavity bar (115) that can be moved away from mold piece (105) after molding and be cooled to detach the molded substrate that adheres to the cavity bar.

Abstract: A semiconductor chip which is mounted on a wiring substrate and which is electrically connected to the wiring substrate is disposed in a sealing apparatus. A sealing resin material made of a thermosetting resin composition is supplied into the sealing apparatus. The sealing resin material contains a solid foreign matter having a cured product of a thermosetting resin, and includes particulates of the thermosetting resin composition pulverized with the solid foreign matter, a granulation powder of the particulates, or a preform of the particulates. The semiconductor chip is resin sealed by using the sealing resin material.

Abstract: The invention relates to a method for encapsulating electrical and/or electronic components in a housing, the components being arranged on a printed circuit or a strip conductor in an assembly. Said assembly is positioned in the housing and is encapsulated with a curing, electrically insulating molding compound. The method according to the invention is characterized by encapsulating preferably in a molding chamber at a pressure below atmospheric pressure and by removing the negative pressure after encapsulation and before curing.

Abstract: Disclosed herein, among other things, are methods and apparatus for providing an environmentally sealed hearing assistance device that is easy to manufacture. One aspect of the present subject matter includes a method of manufacturing a hearing assistance device. A hearing assistance device electrical component is placed into a mold and a liquid polymer resin is inserted into the mold. The polymer resin is cured into a solid state to encase the electrical component. In various embodiments, the hearing assistance device is assembled using the encased electrical component. The polymer resin is adapted to resist moisture ingress and to protect the electrical component from corrosion, shock and vibration, in various embodiments.

Abstract: An apparatus for fabricating a semiconductor package may include a mold and a molding plate. The mold may define a mold cavity with the mold being configured to receive a circuit board in the mold cavity, and the circuit board may include a semiconductor chip mounted thereon. A molding plate may be moveable in the mold cavity with the molding plate being configured to adjust a volume of the mold cavity. Related methods are also discussed.

Abstract: A process for curing a porous muffler preform defined by a plurality of glass fibers and a heat-curing thermoset or thermoplastic materials applied to the plurality of glass fibers is disclosed herein. The process includes the step of enclosing the muffler preform in a chamber. The process also includes the step of surrounding the muffler preform with steam. The process also includes the step of causing steam to enter the muffler preform from multiple directions.

Abstract: A method for producing a magnetic field sensor for use in drive train of a motor vehicle includes encapsulating an electrical assembly and an end of a connecting cable via injection molding and integrally extruding a fastening tab. After a first injection step in which the electrical assembly and the connecting cable are encapsulated in a core-type first molded part, a second injection molding step in implemented in which a fastening tab is integrally formed via injection molding on the core-type insertion part in a specifiable longitudinal and/or angular position. The core-like insertion part is held in the injection mold in a longitudinally displaceable and/or rotatable manner.

Abstract: A permanent-magnet rotor for external-rotor electric motor (1) particularly for washing machines of unusual silence comprising a cup-shaped support structure (6) having a bottom (7) and a side wall (10) and a plurality of magnetic poles (12) arranged in the support structure (6) and arranged along said side wall (10), with elastomeric material interposed between said magnetic poles (12) which forms with them a massive structure (14) of uniform thickness.

Abstract: A family of functionalized polymers is provided capable of forming membranes having exceptional OH? ionic conductivity as well as advantageous mechanical properties, which may be applied to membranes including such polymers for use in, e.g., AEMFC/HEMFC fuel cells. Preferred functional groups include a quaternary phosphonium, and the polymer may specifically be (tris(2,4,6-trimethoxyphenyl) phosphine)3 functionalized phosphonium polysulfone hydroxide, ECL-PVBC-QPOH, or QPOH based on any of the commercial polumers including polycarbonate (PC), poly(2,6-dimethyl-1,4-phenylene oxide) (PPO), polyetherimine (PEI), poly(ether sulfone) (PES), poly(phenylene sulfoxide) PPS, poly(ether ether ketone) (PEEK), or polybenzimidazole (PBI), polyvinyl chloride (PVC). An ionomer membrane may include polysulfone based TPQPOH, ECL-PVBC-QPOH, and/or PPO.

Abstract: The present invention provides flexible devices, such as integrated circuits, having a multilevel electronic device structure including two or more electronic components. The electronic components within the structure are electrically connected by an interconnect structure having multiple interconnect levels. In addition to the multilevel electronic device structure, the flexible devices include an elastomeric material disposed around the interconnect levels, including within the spaces between the interconnect levels.

Abstract: The present disclosure is directed to a method for potting an electrical module. In one embodiment, the method includes placing the electrical component in a potting mold, wherein the potting mold comprises an interior topology that matches a topology of one or more components of the electrical module, filling the potting mold with a potting compound and curing the potting compound over the electrical module.

Abstract: A method includes molding a polymer onto a package component. The step of molding includes a first molding stage performed at a first temperature, and a second molding stage performed at a second temperature different from the first temperature.

Abstract: A preventative maintenance method of strengthening the connection between high pressure, in situ piping. An encapsulation mold is installed over a properly functioning, non-leaking coupling or joint interconnecting pipe sections carrying gas in excess of 60 psi. A resin sealant having tensile strength in excess of 3000 psi fills the mold, so that it circumscribes the coupling and adjacent portions of the pipe sections extending from the coupling, forming a permanent bond to the coupling and pipe sections. The method prevents high pressure pipe connection pullout, which otherwise could lead to catastrophic failure.

Abstract: Processes for manufacturing hollow structures such as spars for helicopter rotor blades, fixed wings for aircraft, and other aerostructures can include the provision of a path for gases to exit the material from which the spar is formed as the material is heated and cured, to help eliminate voids within the material caused by the presence of such gases.

Abstract: A method for manufacturing an optical waveguide includes: step A of forming a first resin layer 23 by allowing a first liquid-state resin to flow to be extended in a manner so as to bury and enclose cores 22; step B of forming a second resin layer 25 by allowing a second liquid-state resin having a viscosity higher than that of the first liquid-state resin to flow to be extended on the first resin layer 23, after or while the first resin layer 23 is heated; and step C of forming an over-cladding layer 26 by curing the first resin layer 23 and the second resin layer 25.

Abstract: A wind turbine component having a laminate of fibrous material and plastic and an electrical line embedded in the laminate, wherein a profile is arranged on a lateral surface of the electrical line, said profile counteracting the formation of a hollow space or plastic nest between the lateral surface and a fibrous material layer which covers an upper side of the electrical line during the manufacture of the laminate.

Abstract: Disclosed herein is a method of making a light emitting device having an LED die and a molded encapsulant made by polymerizing at least two polymerizable compositions. The method includes: (a) providing an LED package having an LED die disposed in a reflecting cup, the reflecting cup filled with a first polymerizable composition such that the LED die is encapsulated; (b) providing a mold having a cavity filled with a second polymerizable composition; (c) contacting the first and second polymerizable compositions; (d) polymerizing the first and second polymerizable compositions to form first and second polymerized compositions, respectively, wherein the first and second polymerized compositions are bonded together; and (e) optionally separating the mold from the second polymerized composition. Light emitting devices prepared according to the method are also described.

Abstract: The resin molding method comprises the steps of: feeding a first resin to a cavity concave portion of a molding die set, which is opened, and a second resin to a pot thereof; feeding a work to a prescribed position of the molding die set, which corresponds to the cavity concave portion; closing the molding die set so as to clamp the work; and pressurizing and sending the molten second resin, which has been molten in the pot, to the cavity concave portion, by a manner of transfer-molding, so as to mix the molten first resin, which has been molten in the cavity concave portion, and the molten second resin and cure the mixed resin with maintaining a prescribed resin pressure.

Abstract: A method for pouring resin in a stator (2) of an electric machine, in particular an axial flux machine, in which a plurality of coils (5) is supported by a magnetic core (4) contained in a container (12), in which resin is poured in order to fill the spaces existing between the various components contained in the container (12). The method comprises the steps of heating a resin (20) until it reaches a pre-set temperature T1, corresponding to which is a target value of fluidity; supplying in a controlled way an electric current Istat to the coils (5) so that the current will flow in the coils (5), which behave as resistors, thus obtaining a heating by the Joule effect of the coils (5) which reach a temperature T2 that is higher than the temperature T1 of the resin; mixing the resin with a catalyst and pouring the mixture of resin and catalyst into the container (12) so that the resin fills said spaces; and obtaining complete hardening of the poured resin.

Abstract: The present invention relates to a process for manufacturing composite structures formed by two subcomponents of the same material, characterized in that it comprises the following steps: providing a first subcomponent (13), particularly a skin; providing a tool (15) made of a composite and precured for the manufacture of the second subcomponent (17), particularly a stiffener; positioning said tool (15) on said first subcomponent (13); applying preimpregnated composite (21) on said tool (15) so as to form the second subcomponent (17); consolidating the composite structure by means of a process of curing the assembly resulting from the previous steps under suitable pressure and/or temperature conditions.

Abstract: Improvement in the yield of a semiconductor device is aimed at. When extruding a molded body with the ejector pin which performs advance-or-retreat movement at the projecting portion which projects from this bottom face in the bottom face of a mold cavity corresponding to the surface and the mounting side of a molded body after forming a molded body, depressed portions being formed in the surface and the mounting side by projecting portions, they can extrude. When accumulating molded bodies themselves in the baking step after a resin molding step and performing bake, by arranging the resin burr which furthermore withdrew from the surface and the mounting side in the depressed portion, bake can be performed in the condition that the accumulated molded bodies are stuck. Therefore, the form of deformation of a warp etc. of each molded body or a lead frame, can be made uniform, and, as a result, improvement in the yield of QFP (semiconductor device) is aimed at.

Abstract: First, a horizontal nozzle is inserted between an upper mold section and a lower mold section in a horizontally extending state. Then, liquid resin is horizontally discharged from a discharge port of the horizontal nozzle. Thus, the liquid resin is supplied into a cavity. Thereafter the upper mold section and the lower mold section are closed. Consequently, an electronic component mounted on a substrate is dipped in the liquid resin stored in the cavity. Therefore, the electronic component is resin-sealed on the substrate by compression molding.

Abstract: Disclosed herein is a method of making a light emitting device having an LED die and a molded encapsulant made by polymerizing at least two polymerizable compositions. The method includes: (a) providing an LED package having an LED die disposed in a reflecting cup, the reflecting cup filled with a first polymerizable composition such that the LED die is encapsulated; (b) providing a mold having a cavity filled with a second polymerizable composition; (c) contacting the first and second polymerizable compositions; (d) polymerizing the first and second polymerizable compositions to form first and second polymerized compositions, respectively, wherein the first and second polymerized compositions are bonded together; and (e) optionally separating the mold from the second polymerized composition. Light emitting devices prepared according to the method are also described.

Abstract: A method for manufacturing an elongate stiffening element and a rigid shell structure integrated with at least one elongate stiffening element. The method includes providing a preformed, form-stable reinforcement member, which has a hat profile with two inwardly directed, opposing flange portions, covering the reinforcement member with a curable composite material to form an external hat profile having outwardly directed flanges, and integrating this assembly with either a curable or preformed shell structure of composite material.

Abstract: A method for filling multi-layer chip-stacked gaps is revealed, primarily comprising the steps as below. Firstly, a chip-stacked assembly is provided, comprising a substrate and a plurality of chips vertically stacked on the substrate where at least a first underfilling gap is formed between each two adjacent ones of the stacked chips with a height difference from the substrate. Then, the chip-stacked assembly is flipped and dipped into an underfilling material where the underfilling material is disposed in a storage tank in a flowing state to completely fill the first underfilling gap. Then, the chip-stacked assembly is taken out. Finally, the chip-stacked assembly is heated to cure the underfilling material filled in the first underfilling gap. Accordingly, multi-layer chip-stacked gaps with different heights can be simultaneously filled at one single step. The conventional underfilling difficulty of multi-layer chip-stacked gaps can be solved leading to higher productivity.

Abstract: A method of manufacturing a resin molded electronic component using a first mold having a cavity with an open top surface and a second mold combined with the first mold on top includes the following steps: (A) inserting a element of the electronic component and a liquid resin precursor into the cavity of the first mold, the liquid resin precursor having viscosity of 10 Pa·s or lower at 40° C.; (B) arranging the second mold such that the element and the resin precursor are sandwiched after the step (A); and (C) pressing the element and the resin precursor between the first mold and the second mold, and curing the resin precursor by heat from the second mold after the step (B). A temperature of the second mold is set to be higher than that of the first mold.

Abstract: A high quality finished prototype fuselage structure of an aircraft is manufactured using a cured female tool and an automated composite layup machine, and then touched up by hand to meet a tolerance or other specification. The female tool is preferably made from a male mold, by depositing layers of composite material over the mold, curing the tool together at a first cure temperature, separating the tool from the mold, and then curing the tool at a second, higher temperature. The first cure temperature should be at or below an upper limit temperature no greater than 180° F. The second cure temperature is preferably in the range of 250° F. to 350° F. The step of hand touching up can comprise one or more of mechanically abrading and deforming a first portion of the fuselage structure to mate with a second portion of the fuselage structure.

Abstract: A manufacturing method of a semiconductor device includes arranging a melted resin on a substrate, arranging a semiconductor chip on the melted resin, pressing the semiconductor chip and flip-chip mounting the semiconductor chip on the substrate, and hardening the melted resin with the melted resin being subjected to a fluid pressure and forming a resin portion.

Abstract: [Problems] To provide a process for producing a conductor built-in ceramic which can eliminate the need to conduct metallic lead wire processing, can suppress the entry of a foreign matter, dust and the like from gaps between bases formed in dewaxing and firing and can reduce a dielectric breakdown failure, and a conductor built-in ceramic produced by the production process. [Means for Solving Problems] A process for producing a conductor built-in ceramic, comprising the step of producing a molded product (11) for an energization part using a conduction mixture, containing an electroconductive ceramic powder and a binder, the step of holding the molded product (11) for an energization part within a mold (13) and filling a mixture (15), for a base, containing an insulating ceramic powder and a binder into the mold (13) to produce an element compact (17) comprising a molded product (11), for an energization part, covered with the mixture (15) for a base, and the step of firing the element compact (17).

Abstract: This invention teaches methods of making a hermetic terminal assembly comprising the steps of: inserting temporary stops, shims and jigs on the bottom face of a terminal assembly thereby blocking assembly core open passageways; mounting the terminal assembly inside a vacuum chamber using a temporary assembly perimeter seal and flange or threaded assembly interfaces; mixing a seal admixture and hardener in a mixer conveyor to form a polymer seal material; conveying the polymer seal material into a polymer reservoir; feeding the polymer seal material from the reservoir through a polymer outlet valve and at least one polymer outlet tube into the terminal assembly core thereby filling interstitial spaces in the core adjacent to service conduits, temporary stop, and the terminal assembly casing; drying the polymer seal material at room temperature thereby hermetically sealing the core of the terminal assembly; removing the terminal assembly from the vacuum chamber, and; removing the temporary stops, shims.

Abstract: This invention relates to compositions, and the use of such compositions for protective coatings, particularly of electronic devices. The invention concerns fired-on-foil ceramic capacitors coated with a composite encapsulant and embedded in a printed wiring board.

Abstract: A pre-mold part is formed by pre-molding the insert with the pre-molded part, and then the pre-molded part is inserted into the over-molded part composed of thermo plastic resin. After applying a heat treatment with the temperature lower than a crystalline melting point of the pre-molded part to the pre-molded part surrounding the insert formed as the composite mold part surrounding the pre-mold part, a firm contact between the insert and the resin surrounding the insert part without no gap at the interface between those parts is obtained.

Abstract: A process for manufacturing an elastomeric sleeve of a joint for electrical cables. The sleeve has an electric field-control element, an electrical insulating element surrounding the electric field-control element, and at least a semiconductive element having two stress control screens. The process includes providing the electric field-control element and the two stress control screens on a supporting element; introducing the supporting element into a mold provided for molding the electrical insulating element; filling with the electrical insulating material the space radially external to the electric field-control element and the stress control screens, the step of filling being carried out during the step of introducing; curing the electrical insulating material to obtain the electrical insulating element of the elastomeric sleeve. An apparatus for carrying out the process for manufacturing is also disclosed.

Abstract: A multilayer film formed by a solution process. The multilayer film includes a plurality of basic film structures positioned in contiguous overlying relationship to form a common multilayer film. Each of the plurality of basic film structures includes one of: a first two-layer structure with a first layer including either a polymer material or an organic material and a second layer including a functionalized inorganic material; a second two-layer structure with a first layer including either a polymer material or an organic material and a second layer including either a polymer binder and/or an organic binder; and a three layer structure with a first layer including either a polymer material or an organic material, a second layer including a functionalized inorganic material, and a third layer including one of a polymer binder and/or an organic binder.

Abstract: An electrosurgical electrode shroud including a hollow substantially cylindrical member having a first end portion and a second end portion; the first end portion defining an opening which is configured and dimensioned to receive an electrosurgical electrode assembly therein; the second end portion defining an opening which is configured and dimensioned to receive an electrode mounting portion of an electrosurgical instrument, wherein at least the second end portion is formed of a substantially translucent material. The electrosurgical electrode shroud may further include visual or tactile indicator on the second end portion for indicating a depth of penetration of the electrosurgical instrument within the second end portion when viewed by the surgeon through the translucent material.

Abstract: A non-aqueous electrolyte battery includes a battery element, a film-form casing member, and a resin protective layer. The battery element includes a positive electrode, a negative electrode, and a separator disposed between the positive electrode and the negative electrode. The film-form casing member contains the battery element and an electrolyte in an enclosed space thereof. The resin protective layer is formed along the surface of the film-form casing member and has a substantially uniform thickness.

Abstract: A method for manufacturing an integrated solar cell and concentrator. The method includes providing a first photovoltaic region and a second photovoltaic region disposed within a first mold member. A second mold member is coupled to the first mold member to form a cavity region. The cavity region forms a first concentrator region overlying a vicinity of the first photovoltaic region and a second concentrator region overlying a vicinity of the second photovoltaic region. The method includes transferring a molding compound in a fluidic state into the cavity region to fill the cavity region with the molding compound and initiating a curing process of the molding compound to form a first concentrator element and a second concentrator element overlying the respective photovoltaic regions.

Abstract: An electrically conductive composite material includes metallic nanostrands distributed throughout a matrix constructed of a polymer, ceramic, or elastomer. The nanostrands may have an average diameter under four microns and an average aspect ratio over ten-to-one. Larger fibers may also be included to enhance electrical conductivity or other properties. The nanostrands and/or fibers may be magnetically oriented to enhance electrical conductivity along one direction. A pressure sensor may be formed by utilizing an elastomer for the matrix. Electrical conductivity through the composite material varies in proportion to deflection of the elastomer. A composite material may be applied to a surface as an electrically conductive paint. Composite materials may be made by cutting a blank of the nanostrands to the desired shape, inserting the matrix, and curing the matrix. Alternatively, a suspension agent may first be used to dispose powdered nanostrands in the desired shape.

Abstract: The invention relates to a mould part for applying in a device for encapsulating electronic components mounted on a carrier, comprising: at least one mould cavity recessed into a contact side, a contact surface at least partially enclosing the mould cavity for medium-tight connection to the carrier of the electronic component, a feed channel for encapsulating material recessed into the contact surface and connecting to the mould cavity, a first outlet channel for gas, and an extraction space recessed into the contact surface. The invention also relates to a device for encapsulating electronic components mounted on a carrier and to a method for encapsulating electronic components mounted on a carrier.

Abstract: Disclosed is a method for producing a synthetic resin mold package at high yield from which package a pair of the surface of an internal device is exposed. A to-be-exposed part of the surface of the internal device composed of an insulating substrate (2) and thin film electrodes (4, 5) and an insulating protective film (6) formed on the substrate is covered with a coating agent (42), and a die pad portion (8) is bonded to the back surface of the internal device. After placing the thus-obtained structure in a mold consisting of a lower mold (46) and an upper mold (48), a pin (50) is inserted into the mold so that the front end of the pin is pressed against the die pad portion (8), thereby keeping the surface of the coating agent (42) pressed against the inner surface of the upper mold (48). Then, a synthetic resin (52) is injected into the mold and cured therein. The thus-obtained resin sealed body is taken out from the mold, and the coating agent (42) is removed from the resin sealed body.

Abstract: A method of manufacturing an encapsulated package for a magnetic device on a substrate. In one embodiment, the method includes providing a magnetic core on the substrate and placing a shielding structure over the magnetic core to create a chamber thereabout. The method also includes depositing an encapsulant about a portion of the magnetic core within the chamber. The shielding structure limits the encapsulant entering the chamber.

Abstract: A method of manufacturing a power module on a substrate. In one embodiment, the method includes providing power conversion circuitry including providing a magnetic device having a magnetic core and at least one switch on the substrate. The method also includes placing a shielding structure over the magnetic core to create a chamber thereabout. The method also includes depositing an encapsulant about the power conversion circuitry. The shielding structure limits the encapsulant entering the chamber thereby allowing the encapsulant to surround a portion of the magnetic core within the chamber.

Abstract: There is disclosed a collective mounting method of electronic components in which a plurality of electronic components can uniformly be pressed to an insulating layer in a short time in a case where the electronic components and a resin layer are fixed. To manufacture a semiconductor-embedded substrate 200 in which a plurality of semiconductor devices 220 are embedded, after disposing the plurality of semiconductor devices 220 on an unhardened resin layer 212, this is stored in a container 31 of a pressurizing and heating unit 3, the plurality of semiconductor devices 220 are simultaneously, collectively and isotropically pressurized by use of an internal gas in the container 31 as a pressure medium to simultaneously press the plurality of semiconductor devices 220 to the unhardened resin layer 212, and the resin layer 212 is heated and hardened.

Abstract: This invention involves encapsulating an RFID device in an encapsulating material by known encapsulating processes to form a domed, encapsulated RFID tag. The encapsulating material may be translucent or opaque, flexible or hard, and has minimal effect on transmission or reception of radio frequency (RF) signals. The invention further involves a stand-off bracket, composed of one or more materials that have minimal effect on transmission or reception of RF signals, for mounting an RFID device on or near materials that impede RF transmission and reception. The encapsulated RFID tag and stand-off bracket, separately, may have an adhesive or other attachment means on one of their surfaces so that they may be adhered or otherwise attached to another surface. In one application, an encapsulated RFID tag in the 860-928 MHz range is mounted on a stand-off bracket and may be used for tracking items to which it is attached.

Abstract: An encapsulant is described for an optoelectronic device or optical component, which provides a coefficient of thermal expansion of less than 50 ppm/° C., with a variation of less than ±30%, and further provides an optical transmittance of at least 20% at a wavelength in the range of 400 to 900 nm, at an encapsulant thickness of about 1 mm. The encapsulant includes a filler consisting essentially of glass particles having diameters smaller than 500 ?m, being essentially free of titania and lead oxide, and having a refractive index in the range of 1.48 to 1.60, with a variance of less than about 0.001.