Abstract: A chuck for holding an object, including one or more linear motors which include one or more linear stators, two or more moving members which are movable along the linear stator or stators, independent of each other, and one or more guide members which guide each of the two or more moving members along the linear stator or stators, and two or more holding members which are supported by the two or more moving members, respectively, and which cooperate with each other to hold the object.

Abstract: A method of electrically connecting an electronic component to the flexible printed wiring board may comprise the steps of: Providing an air permeable platen having a substantially flat front surface and a back surface; placing the flexible printed wiring board on the front surface of the platen; lowering the pressure at the back surface of the platen; and electrically connecting the electronic component to the flexible printed wiring board.

Abstract: A pin stop and method of implementation suitable for use lift pin assemblies used in semiconductor process environments is provided. The pin stop includes a pin shaft and a circular pin head with soft stop and hard stop features defined thereon. The soft stop feature is defined in a grove in the pin head surface and is configured to impact a stopping surface slowing movement of a lift pin assembly. The hard stop then impacts the stopping surface providing a constant, reliable and repeatable position of a wafer positioned on the lift pin assembly.

Abstract: There is provided an apparatus for bundling a plurality of wires placed on a receiving plate. The apparatus is provided with a bundling pawl mechanism that includes a plate and a pair of pawl members. The pawl members are respectively supported at pivot points provided on the plate in spaced-apart relation and interconnected with driving units for opening and closing movement. The pawl members also respectively extend beyond an edge portion of the plate. A wire bundling region is formed between inner surfaces of the pawl members and the edge portion of the plate when at least one of the pawl members rotates toward the other of the pawl members in a closing direction. The bundling pawl mechanism further includes a wire catch prevention member that projects into the wire bundling region from an angled inner corner formed between the inner surface of the at least one pawl member and the edge portion of the plate when the at least one pawl member rotates in the closing position.

Abstract: An apparatus and method for positioning packaged semiconductor devices having different rectangular shapes and sizes. A positioning apparatus includes an adjustable alignment guide releasably coupled to a base. The adjustable alignment guide may be positioned along a first axis to partially define a recess into which the packaged semiconductor devices are placed during positioning. The positioning apparatus may also include additional adjustable alignment guides that may be positioned along the first or a second axis to further define the recess into which the packaged semiconductor device is to placed during positioning. The adjustable alignment guides may have alignment surfaces against which the integrated circuit rests when placed into the recess that is partially defined by the alignment surfaces.

Abstract: A method to precisely position an electronic component within a cutout on a printed circuit board before attachment to said board. A nest precisely positions and firmly holds the component in place. Inner walls of the nest match the component's dimensions while the outer walls are stepped and match the cutout dimensions. In the preferred embodiment, the nest is mounted on a top plate above the circuit board. The operator places and centers the component in the nest, by means of the nest's shape or leaf springs which hold the component centered. Components are positioned by wiggling the nest until the stepped sides engage the PCB. In an alternative embodiment, the operator turns an eccentric cam applying force to a spring, pushing the component towards one edge of the nest for alignment. Both embodiments, hold the component so the operator can fasten the component to the board with both hands.

Abstract: A device for holding a semiconductor wafer for unilateral etching has a base plate with a central hole around which a first seal bears against the side of the wafer to be etched along its perimeter. The back is closed by a lid extending beyond the wafer and bearing with a second annular seal against the plate.

Abstract: A fixture and process for assembly of semiconductor modules. Each module comprises a substrate and a cover attached to the substrate. The fixture comprises a baseplate adapted to accept the substrate and a spring-loading device containing a shape memory alloy spring engaging the cover. The shape memory alloy spring exerts a lesser force at room temperature and an elevated force at the bonding temperature of the bonding agent used to attach the cover to the substrate.

Abstract: When a movable member (14) is moved from a gripping position in which a circuit board (2) was gripped by the movable member (14) and a stationary member (13), a separation mechanism (7, 12) forcibly separates the circuit board from the stationary member (13), to thereby prevent the occurrence of a state in which the circuit board (2) is stuck to the stationary member.

Abstract: A method for reliable, safe removal of an electrical or electronic component or device mounted on a fragile or brittle circuit board substrate having opposed planar upper and lower surfaces, e.g., for performing testing such as failure analysis, comprises sequential steps of cutting the substrate transversely through its thickness to separate therefrom a segment comprising a first portion including the component or device and a second, adjoining portion; cutting the separated segment longitudinally along a plane parallel to the upper surface, the cutting extending beneath the entirety of the first portion; and cutting the substrate of the separated segment transversely through its thickness to separate the first portion including the component or device from the second portion.

Abstract: A printed circuit board is aligned to its mounting plate by using cutouts already cut for electronic components. A top plate with a notched location block and two edge locators is placed on top of both the printed circuit board and the mounting plate so that the notched block straddles two cutouts on the board and the mounting plate. At the same time, the two edge locators are placed inside the two matching cutouts. An eccentric cam is used to move a pressure plate that slides on top of the top plate and pushes both the circuit board and the mounting plate with spring action. The cam is turned until the edge locators hit the edges of the cutouts, aligning the printed circuit board to the mounting plate.

Abstract: For the removal of a connector from a printed circuit board (12, 28) wherein the connector consist of a connector housing (14) including contact pins (16) being of the right angle type (bent at an angle of about 90°), whereby a portion of the contact pins include a compliant attachment (press-fit) area by means of which the connector is attached to the board, and wherein use is generally made of a press with a push ram (10) and a table (11) provided with an anvil, whereby the anvil (20) comprises a base portion (22) and an upper hook-shaped portion which is formed as a comb (24) wherein the openings or slots (26) are in register with the position of the contact pins (16) along the longitudinal direction of the connector (14) and which is introduced into an open side of the connector housing up to the level of the contact pins in order to provide appropriate support to the printed circuit board while the compliant attachment area's of the contact pins are being pushed out of the holes of the board.

Abstract: A circuit board carrier and method of using the same. The carrier allows circuit boards to be processed on lead frame-based semiconductor processing equipment. The circuit board carrier contains a structure to secure a circuit board thereto and the carrier is sized and shaped, and provided with standardized indexing holes, to allow processing of circuit boards on processing equipment configured for lead frame-based processing.

Abstract: The present invention relates to a transport carrier and a heating system for use therewith. The present invention makes the workability of a transport carrier compatible with the maintenance of positioning accuracy and imparts a general-purpose property. An electric wire-hanging member is provided on which a plurality of bundles of electric wires are hung in a parallel. A holder is provided for retaining the electric wire-connecting parts which are formed in bundles of electric wires on the electric wire-hanging member. Further, an electric wire sandwiching system for regulating the retention of at least the electric wire-connecting parts side of the bundles of electric wires which are hung on the electric wire-hanging member and for releasably retaining the connected bundles of electric wires.

Abstract: A mechanical interface between a manipulation system and an optical component in which manipulation system jaws are adapted to engage an optical component at a handle and then deform the component. In some applications, an optical component is translationally or rotationally deformed. In one example, the jaws are moved towards each other in an opposed fashion such that teeth engage the optical component at the handle. Then, the jaws are collectively actuated so that they are moved in substantially the same direction. This results, typically, in the deformation of the optical component so that the optical element held by the optical mounting structure is moved into an improved alignment position. In another example, a V-shaped slot in one of the jaws is used to grasp the optical element, e.g., fiber, to move the element.

Abstract: A fixture supports and secures a printed circuit board (“PCB”) during processing thereof. The fixture includes a frame for supporting the PCB and an attachable and entirely detachable bar or plate for securing the PCB in the fixture. A first opening is defined by the frame and is of sufficient dimensions to expose a first surface of the PCB. The plate defines a second opening, the second opening being of sufficient dimensions to expose a second surface of the PCB for processing. Spring-loaded latch assemblies connect the bar or plate to the frame at its ends or corners, respectively. The latch assemblies are simultaneously actuated by application of a slight pressure on the plate or bar. Simultaneous actuation of the latch assemblies ensures uniform application of pressure on the PCB, to avoid creation of a moment in the board. The latch assemblies do not require an operator's individual, repeated manipulation, but are actuated with a single application of slight pressure to the plate or bar.

Abstract: A method and arrangement for lifting lowering and centering a substrate on a surface employs lift pins have conical tips. A capture range is provided by the conical tips to capture and center misaligned wafers. One or more of the pins are inclined in certain embodiments to enhance the alignment capability of the lift pins. The inclined lift pins, when retracting into a support member at an angle, move a supported substrate horizontally into proper alignment.

Abstract: A workpiece chuck includes an upper assembly on which can be mounted a flat workpiece such as a semiconductor wafer. A lower assembly is mountable to a base that supports the chuck. A non-constraining attachment means such as vacuum, springs or resilient washers applied to the chuck holds the upper assembly to the lower assembly, the lower assembly to the base and can hold the wafer to the top surface of the upper assembly. By holding the chuck together by non-constraining means, the chuck layers can move continuously relative to each other under expansion forces caused by temperature effects, such that mechanical stresses on the chuck and resulting deformation of the chuck and workpiece over temperature are substantially eliminated. A plurality of support members including inclined surfaces provided between an upper and lower portion of the chuck maintain the top surface of the chuck and any workpiece mounted thereon at a constant height over temperature.

Abstract: A semiconductor wafer transfer machine for transferring first wafers having a first diameter from a first transferor carrier to a first receiver carrier and second wafers having a second diameter different from the first diameter from a second transferor carrier to a second receiver carrier. The wafer transfer machine includes a base plate with a longitudinal axis for placement on the base plate of the transferor carriers and the receiver carriers and a mechanism for transferring wafers contained in the first and second transferor carriers to the first and second receiver carriers, respectively.

Abstract: A carriage for a printed circuit board in a soldering apparatus has clamps which clamp opposite edges of the board to hold it during transport. As the carriage is lowered to a board delivery station, the clamp members are opened automatically. The board is slid between the clamp members and the carriage then raised, allowing the clamp members to close on the board.

Abstract: A rework nozzle includes a gripping device that is used to remove a soldered device from a circuit board. The rework nozzle attaches to a module that generates hot gas. The device that is to be removed from the circuit board is placed within the nozzle. The module generates hot gas, and the hot gas is directed by the nozzle to soldered connections that couple the device to the circuit board. The hot gas melts the solder and the gripping mechanism is used to grasp the device. The device may be removed from the circuit board by separating the circuit board from the nozzle after the hot gas melts the solder. The nozzle will release the device if the force needed to remove the device is greater than the force applied to the device by the gripping mechanism. The release of the device will prevent damage to the device or to the circuit board.

Abstract: A tool which accurately controls the thickness of a thermal grease applied to an integrated circuit that is mounted to a printed circuit board. The tool includes a bracket that supports the printed circuit board and the integrated circuit. A thermal grease is applied to the top surface of the integrated circuit. A lid is attached to the bracket to capture the printed circuit board. The lid has a platen that is separated from the integrated circuit by a space which has a predetermined thickness. The space defines the thickness of the thermal grease. Any excess thermal grease is pushed out of the space by the lid so that a consistent thickness of thermal grease is applied for each integrated circuit assembly. The bracket, lid, integrated circuit and printed circuit board can be mounted to a motherboard as a single integrated circuit module. Alternatively, the lid can be detached from the base so that the grease covered integrated circuit can be removed from the tool for subsequently assembly.

Abstract: The present invention relates to a printed circuit board(PCB) flat level compensating unit of a surface mounting apparatus in which when a PCB is stopped at its working position and is firstly pushed up from the lower portion thereof, the PCB is secondly pushed to be raised thereby to be compensated its flat level and the mounting height for the PCB according the thickness is adjusted thereby to be increased a mounting efficient and a precision.

Abstract: A clamp for holding laser components during a facet coating process. The clamp includes a first elongate member for contacting a first side of the laser components and a second elongate member for contacting a second opposing side of the laser components. The first and second elongate members include first and second lands, respectively, for contacting and holding the laser components.

Abstract: A gripping device for positioning a component (47) on a substrate, comprising three fingers (1, 2, 3) arranged in a triangle (7), and means for moving the fingers along parallel paths (4, 5, 6) relatively to each other to grip or release a component, a middle finger (2) being movable in opposite directions with respect to the outer fingers (1, 3).

Abstract: A workpiece chuck includes an upper assembly on which can be mounted a flat workpiece such as a semiconductor wafer. A lower assembly is mountable to a base that supports the chuck. A non-constraining attachment means such as vacuum, springs or resilient washers applied to the chuck holds the upper assembly to the lower assembly, the lower assembly to the base and can hold the wafer to the top surface of the upper assembly. By holding the chuck together by non-constraining means, the chuck layers can move continuously relative to each other under expansion forces caused by temperature effects, such that mechanical stresses on the chuck and resulting deformation of the chuck and workpiece over temperature are substantially eliminated. A plurality of support members including inclined surfaces provided between an upper and lower portion of the chuck maintain the top surface of the chuck and any workpiece mounted thereon at a constant height over temperature.

Abstract: The invention relates to a holder for a semiconductor substrate including a main body which is provided with three or more projections by means of which the substrate can be held fixed in the holder. Two projections are fixedly connected, and a third projection present opposite the other two is movably connected to the main body. The third projection can be moved away from the other two and is urged towards the latter two by means. According to the invention, a lateral side of each projection facing towards the substrate to be inserted is provided with a convex recess whose geometry is such that exclusively the outermost edges of both the upper surface and the lower surface of the substrate to be inserted come into contact with the convex recess. A substrate, for example a round substrate, can be satisfactorily fastened in such a holder while still its entire surface area can be processed.

Abstract: The invention provides an improved support structure for the components of a removable hard disk drive system, particularly for use in recording and archiving of digital video and other data. The invention generally makes use of a base formed by stamping sheet metal. This stamping process can be used to define cartridge engaging surfaces within the base, as well as mounting pads for the data transfer head support structure, spindle drive structure, a head load ramp, and the like.

Abstract: A wiring jig is provided with a cable receiving area which receives cables. A crank-shaped supporting member supports a pillar which supports the cable receiving area. A pressing member having a pair of locating feet is provided with a pressing screw. Tightening the pressing screw of the pressing member fastens the supporting member to a perforated panel. Loosening the pressing screw allows the supporting member to rotate and/or slide so that the pillar can be installed at any desired position without being limited by the position of mounting holes pre-formed with a predetermined spacing in a perforated panel which receive the pair of locating feet of the pressing member.

Abstract: A latch for securing a wafer to a clamp plate. The latch may include a bearing that couples a wheel to a horizontal shaft. The horizontal shaft is adapted to rotate relative to the clamp ring so that the wheel secures the wafer. The bearing minimizes the amount of particles generated by the moving components of the latch that may contaminant the wafer.

Abstract: The present invention is directed to a connector holder for holding a connector during wiring of the connector which facilitates accurate positioning of protection material about wires of a cable. The connector holder includes a support member such as a pillar for mounting the invention to the wiring board. The connector holder includes a holder portion which houses a connector in an insertable and removable manner in such a condition that the wires can be connected thereto, and a positioning member is integrally provided with the holder portion and assists in the positioning of protection material about cable wires connected to the connector. The positioning member may also include an adjustable pin capable of positioning protection material arranged around the periphery of a cable in such a condition that the plurality of wires of the cable connected with a connector is arranged on both sides of the positioning member.

Abstract: A device particularly adapted to engage an irregular bottom surface of an object and then carry that object includes a support block. In the support block is a set of longitudinally spaced apart upright bores. On each side of the bores in a top wall of the block is a guide channel for a slide bar. Ends of these bars operatively connect with a reciprocating mechanism attached to one end of the block. In each bore is a sleeve having an inner opening formed with an upper section for a spring. An upper and lower end coil of a coil portion of each spring connects with an arm that projects outwardly. The upper arms fit respectively in upward facing slots in one slide bar while the lower arms fit respectively in downward facing slots in the other slide bar. In the sleeve inner openings and extending respectively through the coil portion of each springs is a support pin. Top ends of these pins fit in openings in a top cover plate fastened to the support block top wall.

Abstract: A wafer holder is provided which properly protect backside of a wafer, especially when frontside of the wafer is processed, from pollution and mechanical injury. The wafer holder includes a wafer support section having a hole for locating a wafer, a cover covering the wafer but any chip on the wafer is not touched with the cover; one or more fastening devices for fastening the cover on the wafer support section, each the fastening device having a fixed terminal and a movable terminal where the fixed terminal locates on the wafer support section and the movable terminal presses the cover on the wafer support section. Addition, the wafer support section can be part of chamber wall and then it is an optional part of the present wafer holder.

Abstract: An adjustable tooling pin for a bed-of-nails test fixture used for testing circuit boards (cards) is provided which allows the tooling pin, and thus the card, to be precisely realigned while the card is still mounted in the test fixture. The adjustable tooling pin mechanism comprises a pivot bushing having a channel running from end-to-end into which a slide bar fits. The tooling pin projects from the end of the sliding bar in the z-direction such that a card may be located over the tooling pin. A locking screw fits through an aperture in the sliding bar and the pivot bushing and is threadably engaged into a threaded insert in the test fixture top plate. Hence, the tooling pin, and thus the card, are radially adjustable in the x-y plane by turning the pivot bushing and by sliding the sliding bar along the pivot bushing channel.

Abstract: A circuit board carrier and method of using the same. The carrier allows circuit boards to be processed on lead frame-based semiconductor processing equipment. The circuit board carrier contains a structure to secure a circuit board thereto and the carrier is sized and shaped and provided with standardized indexing holes to allow processing of circuit boards on processing equipment configured for lead frame-based processing.

Abstract: A registration alignment system to be used with a printed circuit board drilling machine for registration of PCBs on the tooling plate for drilling and other operations. The registration alignment system includes a registration bar and a registration block that move independently of each other. The movement of the registration bar is constrained to one dimension (i.e., X-axis), and the movement of the registration block is constrained to one dimension (i.e., Y-axis) that is perpendicular to the axis of movement of the registration bar. The registration bar and block contact adjusting screws which are used to control precise movement of the registration bar and block. When the registration pins of the PCB are in position against the registration bar and block, the pins are held in place by clamping bars. When the size of the registration pins change, the registration of the new PCB is still correct and does not have to be adjusted.

Abstract: In a wire harness, 20, an arrange shape of a plurality of electric wires 15 is held by bonding upper and lower films 19 and 16 to each other. A connector 18 is connected to a terminal portion of the electric wires 15. A connector fixing portion 21 is provided to both the upper and lower films 19 and 16 to be bonded to an outer peripheral portion of the connector 18 except for an end portion 18a thereof to fix the connector 18.

Abstract: A locking screw mechanism includes an improved screw nut for minimizing the force required for loosening the locking screw mechanism when an object is clamped therein. A locking screw mechanism includes a screw head disposed on a screw shaft and a screw nut threaded about the screw shaft. The screw nut includes a back screw nut threaded about the screw shaft. The back screw nut has a nut holding portion and a contact ring surface. The screw nut also includes a front screw nut disposed around the nut holding portion of the back screw nut. The front screw nut is disposed toward the object that is being clamped. The screw nut further includes a holding ring disposed around the nut holding portion of the back screw nut for holding the front screw nut to the back screw nut. The contact ring surface of the back screw nut turns against the front screw nut to press the front screw nut against the object when the back screw nut is threaded toward the object.

Abstract: A fixture to hold an electronic substrate having probe areas on a top surface. The top surface of the electronic substrate is left open to provide a maximum area to couple interconnect wires for a device under test. In addition, a bottom surface of the substrate is left open to provide a maximum area to couple with a probe card in one embodiment, or a test head in another embodiment. This open bottom and open top minimize the mechanical interference with electrical connections. The substrate is planarized to a frame by one or more clamps that are attached to the frame. The clamps provide adjustment of the pressure down on the substrate in a Z-axis direction which is normal to the top surface of the substrate for providing a good connection with a planar card. In addition, the clamps provide adjustment in the an X-Y plane parallel to the frame and rotational correction about the Z-axis.

Abstract: The present invention provides a fixture for mounting a substrate to mounting tape on a film frame so as to retain the substrate to the film frame for dicing. A plurality of grooves for receiving a cutting saw extend longitudinally and transversely across the fixture to define die regions. The fixture also includes a plurality of apertures that align with the substrate and with dies to be cut from the substrate. The aligned apertures supply vacuum to the substrate to retain the substrate and cut dies in the fixture. When the dicing is completed, the vacuum is turned off and the individual dies can be readily removed from the fixture.

Abstract: An improvement in a reflow soldering apparatus for bonding a connector element such as flexible circuitry or a pin type input/output (I/O) connector to a printed circuit board (PCB) is disclosed wherein a fixture tray included in the apparatus automatically aligns or self levels itself with the heating bars, or thermodes, of the apparatus. The fixture tray includes a body for supporting the connector/PCB assembly and cylindrical rods extending from the body. The rods are rotatably supported in corresponding grooves on the surface of the fixture tray table. As a thermode is pressed onto the connector/PCB assembly, the fixture tray rotates about its axis of rotation until the work area is aligned with the thermode. In a sandwich type soldering application including a pair of thermodes for simultaneously soldering opposite sides of a connector/PCB assembly, the fixture tray rests on an upper plate of a tray table supported by resilient means such as springs.

Abstract: A battery jig for facilitating the soldering of battery bars between adjacent pairs of batteries held in a line. The group of batteries is used to power small electrical devices, such as racing cars. The frame has a front and a back and sides which secure the batteries in a side by side relationship. A spring loaded arm may be positioned between the batteries to hold down a battery bar so that it may be soldered to adjacent terminals.

Abstract: A clamp ring assembly for securing a generally circular workpiece to a supporting surface comprises an annular base ring having a radial inner surface of a predetermined diameter and at least one locking member. The base ring further includes at least one opening extending axially therethrough for securing the base ring to the supporting surface. An annular securing ring having a radial outer surface and a radial inner surface is provided. The diameter of the outer surface of the securing ring is the same as or slightly smaller than the diameter of the inner surface of the base ring and the securing ring includes at least one locking member for engaging the locking member of the base ring when the securing ring is assembled with the base ring. The securing ring also includes at least one workpiece engaging member for engaging and holding the workpiece against the supporting surface.

Abstract: An electronic component mounting apparatus is provided with a plurality of support blocks for supporting boards. A support block is automatically selected from among the plurality of support blocks and exchanged in accordance with the switching of the kind of boards to be supported by the support block, so that the time required for switching the kind of boards is reduced, thereby improving the productivity.

Abstract: A frame comprising four angles each angle having two legs, each leg connected to a a leg of a neighboring angle wherein locations of attachment of the legs are adjustable so as to accommodate a range of sizes of boards for a surface mount manufacturing process. One leg of each angle has a tongue and the other leg has a groove so that tongue of one leg slideably engages the groove of the leg of a neighboring angle to enable adjustment in size of the frame opening. The board is supported on a shoulder around the frame opening with the surface of the board opposite the supporting shoulder surface coplanar with the plane surface of the frame. A flat spring loaded rotatable finger on the plan surface in one corner of the board urges the board toward the opposite corner of the frame.

Abstract: To avoid damage to carrier substrates in a device for mechanically aligning carrier substrates for electronic circuits, the carrier substrates having two main surfaces and a peripheral surface and being supplied to a horizontal fixture of the device, centering elements being forced to engage on the peripheral surface of the carrier substrates to align the carrier substrates in the horizontal fixture, it is proposed that at least two centering elements be mounted rotationally and displaceably in the axial direction on at least two first shafts that are oriented in parallel with one another and in parallel with the horizontal fixture. The centering elements engage on sections of the peripheral surface of the carrier substrate disposed opposite one another in a first direction, and at least two further centering elements engage with stop faces at sections of the peripheral surface of the carrier substrate disposed opposite one another in a second direction running perpendicularly to the first direction.

Abstract: A fixture assembly for securing a component to a heat sink includes a frame having two parallel longitudinal members connected by first and second transverse crossbeams, which together define a receptacle into which a component is received. A spring clip is rotatably attached to the frame and has a position in which the spring clip presses the component against a heat sink. The frame includes at least two depending legs for supporting the frame above the surface of a heat sink, and at least one opening for receiving a fastener that secures the frame to the heat sink. A guide peg or similar positioning structure may also be provided for positioning the frame on the heat sink. The spring clip includes a proximal end having a non-round cross section which is rotatably attached to the first transverse crossbeam of the frame, and a distal end which includes a resilient lip which is detachably engage able with the second transverse crossbeam.

Abstract: Each pack has a pair of opposite edges and a pair of locating pins, and is also provided with pairs of holes separated by a distance equal to that between the pins to enable the packs to be stacked in offset manner, with the pins inserted inside the holes of the underlying pack. The loading and unloading device has a loading station and an unloading station located on either side of the worktable; and a transfer device movable between the stations and a fixture on the worktable for clamping the pack for machining. An unpinning mechanism for unpinning the pack has punches which are activated to remove the pins from the pack before the pack is deposited at the unloading station.

Abstract: Spoke shaped (petal shaped) through holes or cavities are provided at the center or a substrate holder which attaches and holds a substrate over substantially the entire surface, to allow vertical movement of a center-up member having a plurality of radially extended spoke shaped mounting portions. As a result, degradation in the flatness of a substrate at the time of attaching the substrate to the mounting surface of the substrate holder is minimized.

Abstract: A work station for splicing together a pair of fiber optic cables includes a portable splicing table including a recessed portion for supporting a splice enclosure. The recessed portion extends across the width of the splicing table and allows for a pair of fiber optic cables to enter the table in the recessed portion. A pair of cable grips are included in the recessed area for holding the cables in place during the splicing operation. A plurality of fiber clips may be disposed on the table surface and used to match up the pairs of fibers to be spliced together from the cables.