Abstract: A semiconductor encapsulation apparatus for encapsulating a semiconductor device on a substrate, the apparatus comprising a mold comprising a cavity pressure zone that is configured to be at a molding process pressure during molding, a base vacuum pump conduit connecting a base vacuum pump to the cavity pressure zone, a base vacuum valve located along the base vacuum pump conduit such that the base vacuum pump is in fluid communication with the cavity pressure zone when the base vacuum valve is open, a reservoir vacuum pump conduit connecting a reservoir vacuum pump to the base vacuum pump conduit, and a reservoir vacuum valve located along the reservoir vacuum pump conduit such that the reservoir vacuum pump is in fluid communication with the base vacuum pump conduit when the reservoir vacuum valve is open.

Abstract: In an embodiment, a multilayer ceramic capacitor 10 has the first external electrode 12 and second external electrode 13 provided with a space between them on the other height-direction surface f6 of the capacitor body 11 in the length direction, where the width Wa of the other height-direction surface f6 of the capacitor body 11 is smaller than the width W of the one height-direction surface f5. The multilayer ceramic capacitor can improve yield and help reduce cost by allowing several of the conditions to be found non-defective in the appearance inspection.

Abstract: A container for a refrigerated fluid having an external container and an internal container between which an evacuated intermediate space is situated, which contains a superinsulator formed by several, separated layers of foil provided with a metal layer, is used as a storing device for electric energy. The foils act as foil capacitors and are electrically contacted so that an electric voltage can be applied to corresponding electric terminals on the exterior side of the container. In the container, a metal layer can be provided on both surfaces of the foil(s), and the foil(s) may consist of a material with a semiconductor characteristic. The foil capacitors are electrically connectable in series or parallel, and the electrical contacting of the foil metal surfaces can take place via a suspension structure of the internal container in the external container.

Abstract: LTCC devices are produced from dielectric compositions comprising a mixture of precursor materials that, upon firing, forms a dielectric material comprising a matrix of titanates of alkaline earth metals, the matrix doped with at least one selected from rare-earth element, aluminum oxide, silicon oxide and bismuth oxide.

Abstract: A multilayer electronic component includes a first capacitor including a first capacitor body and first and second external electrodes disposed on outer surfaces of the first capacitor body; and a second capacitor including a second capacitor body and third and fourth external electrodes disposed on outer surfaces of the second capacitor body and electrically connected to the first capacitor. The first and third external electrodes are connected to each other by a first metal terminal enclosing portions of a lower surface of the first external electrode to an upper surface of the third external electrode, and the second and fourth external electrodes are connected to each other by a second metal terminal enclosing portions of a lower surface of the second external electrode and an upper surface of the fourth external electrode.

Abstract: In one embodiment, a capacitor structure includes a substrate, a dielectric stack, a first conductor segment, a second conductor segment and a shielding conductor segment. The dielectric stack is formed on the substrate. A first layer of the dielectric stack includes a plurality of conductor segments routed only in a first direction. A first conductor segment among the multiple conductor segments may be biased to a first voltage. The second conductor segment among the multiple conductor segments may be biased to a second voltage. The shielding conductor segment may be biased to the second voltage and is formed at an end of the first conductor segment. In addition to that, the capacitances for the capacitor structure may be adjusted while the footprint of the capacitor structure is fixed.

Abstract: An improved method for forming a capacitor is provided as is a capacitor, or electrical component, formed by the method. The method includes providing an aluminum containing anode with an aluminum oxide dielectric thereon; forming a cathode on a first portion of the aluminum oxide dielectric; bonding an anode lead to the aluminum anode on a second portion of the aluminum oxide by a transient liquid phase sintered conductive material thereby metallurgical bonding the aluminum anode to the anode lead; and bonding a cathode lead to said cathode.

Abstract: An embedded device includes a multilayer body including dielectric layers and internal electrode layers interposed between adjacent dielectric layers; external electrodes disposed on external surfaces of the multilayer body to apply electric charges having different polarities to adjacent internal electrode layers, the external electrodes containing a conductive material; first copper layers disposed on external surfaces of the external electrodes to cover the external electrodes; and second copper layers disposed on the first copper layers to cover the first copper layers. An average particle diameter of powder particles of the first copper layers is greater than an average particle diameter of powder particles of the second copper layers.

Abstract: A composite sheet includes a ceramic green sheet having a lengthwise direction and a conductor film printed on the ceramic green sheet. The conductor film has a shape that has a longitudinal dimension extending in the lengthwise direction and a lateral dimension perpendicular or substantially perpendicular to the longitudinal direction. The conductor film includes a plurality of thickness-varied regions arranged in a row or a plurality of rows extending in the lengthwise direction while being dispersed in the lengthwise direction. The thickness-varied regions have a thickness that is different from a thickness of a portion of the conductor film excluding the thickness-varied regions.

Abstract: A multilayer ceramic capacitor includes an element body, a first terminal electrode, a second terminal electrode, and a plurality of internal electrodes. The plurality of internal electrodes include a plurality of first internal electrodes, a plurality of second internal electrodes, a plurality of third internal electrodes, and a plurality of fourth internal electrodes. The element body includes a plurality of first and second regions. The first regions are located between the first internal electrodes opposed with each other. The second regions are located between the first internal electrodes opposed to each other through the third internal electrodes, and between the second internal electrodes opposed to each other through the fourth internal electrodes. The first regions and the second regions are alternately located in the first direction.

Abstract: To perform poling treatment in a simple procedure by dry process. A magnetic field poling device includes a first holding part configured to hold a film-to-be-poled (2); a second holding part configured to hold a magnet generating a magnetic field B to the film-to-be-poled (2); and a moving mechanism configured to move the first holding part or the second holding part in a direction perpendicular to the direction of the magnetic field B.

Abstract: A micromechanical moisture sensor device includes: a substrate having a front side and a rear side; an interdigital printed conductor track arrangement provided above and/or below the front side of the substrate; and a moisture-sensitive polymer layer situated above and in the gaps of the interdigital printed conductor track arrangement. The moisture-sensitive polymer layer extends below the front side into the substrate.

Abstract: A thin film capacitor includes a lower electrode layer, an upper electrode layer, and a dielectric substance layer provided between the lower electrode layer and the upper electrode layer. A dielectric patch member formed of a dielectric material is formed on a surface of the dielectric substance layer on an upper electrode layer side, a cross-sectional structure of the dielectric patch member has a taper angle of 1 to 25 degrees in a cross section perpendicular to the dielectric substance layer, the taper angle being an angle formed by (1) a tangential line tangent to an end portion of the dielectric patch member at a position that is 50% of a maximum height of the dielectric patch member and (2) a line being an interface between the dielectric substance layer and the upper electrode layer, and an area of the dielectric patch member is 100 to 900000 ?m2.

Abstract: An electrical component includes a main body, a metallic contact structure, which is in direct contact with the main body, and an electrically insulating passivation layer provided with an opening. The metallic contact structure is connected to an external contact-making element through the opening. Furthermore, the external contact-making element is covered and enclosed by a flexible metal composite layer. A method for producing an electrical component is also specified.

Abstract: A resistance assembly for a mobile device and a manufacturing method thereof are disclosed. The resistance assembly for a mobile device in accordance with an aspect of the present invention includes: a substrate having a circuit formed thereon; first to fourth pads laminated and separated from one another on the substrate; first to fourth terminals connected to the first to fourth pads, respectively, by being formed in a longitudinal direction along edges of lateral surfaces of a resistance body that are opposite to each other; and first and second resistors formed in between the first to fourth terminals along the opposite lateral and connected in parallel to each other on the resistance body and configured to adjust electric current flowed into the circuit.

Abstract: A multilayer ceramic capacitor includes a body including an active region including first and second internal electrodes, and an upper cover region disposed on the active region, and a lower cover region disposed below the active region. First and second external electrodes are disposed on first and second surfaces of the body in the length direction and connected to the first and second internal electrodes, respectively. At least one stress dispersion pattern occupying an area equal to 30% to 95% of an area of the first or second internal electrode is disposed in the cover region.

Abstract: A film capacitor includes a pair of mutually opposed dielectric films; and evaporated electrodes respectively provided on the pair of dielectric films. The evaporated electrode provided on one of the pair of dielectric films includes slits that are regions in which the evaporated electrode is not provided, a plurality of electrode regions defined by the slits, and at least one fuse portion that connects the electrode regions adjacent to each other. The one dielectric film, on which the evaporated electrode including the slits and the at least one fuse portion is provided, includes at least one through portion that extends through the one dielectric film, the at least one through portion being provided in at least one area corresponding to at least one of the slits adjacent to the at least one fuse portion.

Abstract: An electrical multilayer component includes a stack composed of functional layers and also a first and a second external contact. The external contacts are arranged on side surfaces of the stack. Internal electrodes of a first type are directly electrically conductively connected to the first external contact and internal electrodes of a second type directly electrically conductively connected to the second external contact. An internal electrode of the first type and an internal electrode of the second type partly overlap. An internal electrode of the first type and an internal electrode of the second type are arranged in a manner spaced apart from one another in an identical plane.

Abstract: An AIMD includes a conductive housing, an electrically conductive ferrule with an insulator hermetically sealing the ferrule opening. A conductive pathway is hermetically sealed and disposed through the insulator. A filter capacitor is disposed on a circuit board within the housing and has a dielectric body supporting at least two active and two ground electrode plates interleaved, wherein the at least two active electrode plates are electrically connected to the conductive pathway on the device side, and the at least two ground electrode plates are electrically coupled to either the ferrule and/or the conductive housing. The dielectric body has a dielectric constant less than 1000 and a capacitance of between 10 and 20,000 picofarads. The filter capacitor is configured for EMI filtering of MRI high RF pulsed power by a low ESR, wherein the ESR of the filter capacitor at an MRI RF pulsed frequency or range of frequencies is less than 2.0 ohms.

Abstract: A multilayer electronic component includes a ceramic body including a plurality of dielectric layers, a plurality of capacitor parts disposed in the ceramic body, including a plurality of internal electrodes alternately exposed to both end surfaces of the ceramic body in a length direction of the ceramic body, and having different capacitances, and first and second external electrodes formed on both end surfaces of the ceramic body in the length direction of the ceramic body and connected to the plurality of internal electrodes, wherein the plurality of capacitor parts include three or more capacitor parts and connected in parallel with each other.

Abstract: An AIMD includes a conductive housing, an electrically conductive ferrule with an insulator hermetically sealing the ferrule opening. A conductive pathway is hermetically sealed and disposed through the insulator. A filter capacitor is disposed within the housing and has a dielectric body supporting at least two active and two ground electrode plates interleaved, wherein the at least two active electrode plates are electrically connected to the conductive pathway on the device side, and the at least two ground electrode plates are electrically coupled to either the ferrule and/or the conductive housing. The dielectric body has a dielectric constant less than 1000 and a capacitance of between 10 and 20,000 picofarads. The filter capacitor is configured for EMI filtering of MRI high RF pulsed power by a low ESR, wherein the ESR of the filter capacitor at an MRI RF pulsed frequency or range of frequencies is less than 2.0 ohms.

Abstract: An electronic component has a main body. The main body includes a porous material having surface pores at a surface of the main body. A passivation liquid is arranged in the surface pores. A method of forming an electronic component is also disclosed as is a method of passivating a body.

Abstract: A laminated ceramic capacitor that includes a ceramic laminated body having a stacked plurality of ceramic dielectric layers and a plurality of internal electrodes opposed to each other with the ceramic dielectric layers interposed therebetween, and external electrodes on the outer surface of the ceramic laminated body and electrically connected to the internal electrodes. The internal electrodes contain Ni and Sn, a proportion of the Sn/(Ni+Sn) ratio is 0.001 or more in molar ratio is 75% or more in a region of the internal electrode at a depth of 20 nm from a surface opposed to the ceramic dielectric layer, and the proportion of the Sn/(Ni+Sn) ratio is 0.001 or more in molar ratio is less than 40% in a central region in a thickness direction of the internal electrode.

Abstract: A three terminal capacitor includes a capacitor element including first through sixth surfaces, first-side and second-side outer electrodes, a center outer electrode between the first-side and second-side outer electrodes, and conductor layers. The conductor layers include a pair of outermost conductor layers that are respectively nearest to the fifth and sixth surfaces, and thicknesses of the pair of outermost conductor layers are greater than a thickness of a center conductor layer nearest to a center of the capacitor element in a width direction.

Abstract: A multilayer ceramic capacitor may include: a ceramic body having first and second main surfaces opposing each other in a thickness direction and first and second end surfaces opposing each other in a length direction, a thickness of the ceramic body being greater than a width thereof; a first external electrode disposed on the first end surface and having a greater thickness in a region thereof adjacent to the second main surface than in a region thereof adjacent to the first main surface; a second external electrode disposed on the second end surface and having a greater thickness in a region thereof adjacent to the second main surface than in a region thereof adjacent to the first main surface; and first and second internal electrodes disposed in the ceramic body and connected to the first and second external electrodes, respectively.

Abstract: An inductor is provided on a substrate that includes a capacitor. The inductor comprises a series of wire loops. An end of the wire loop is wire bonded to the capacitor.

Abstract: Disclosed are a multilayer ceramic condenser and a method for manufacturing the same. There is provided a multilayer ceramic condenser including: a multilayer main body in which a plurality of dielectric layers including a first side, a second side, a third side, and a fourth side are stacked; a first cover layer and a second cover layer forming the plurality of dielectric layers; a first dielectric layer disposed between the first cover layer and the second cover layer and printed with a first inner electrode pattern drawn to the first side; a second dielectric layer alternately stacked with the first dielectric layer and printed with a second inner electrode pattern drawn to the third side; and a first side portion and a second side portion each formed on the second side and the fourth side opposite to each other.

Abstract: Provided is a capacitor module (10) for connection to a plurality of power conversion circuits, which includes: a dielectric part (11) that has a plurality of flat-film dielectric layers (18A, 18B) laminated; a capacitance formation part (12) that has conductors opposed to each other with the dielectric layers (18A, 18B) interposed therebetween within the dielectric part (11); and multiple pairs of output terminals (13A, 13B, 13C) that are connected respectively to the multiple power conversion circuits, where the multiple pairs of output terminals (13A, 13B, 13C) are connected to each other with the capacitance formation part (12) interposed therebetween.

Abstract: A method of manufacturing a stiffened panel having a skin and at least one substantially elongate stiffener having a longitudinal groove forming a cavity. At least one storage device for storing and releasing electrical energy. The longitudinal groove is filled with at least one storage device for storing and releasing electrical energy. The storage device is covered with a skin which forms the cavity together with the longitudinal groove of the stiffener. A stiffened ring can be derived from the method.

Abstract: A conductive paste for an external electrode, a multilayer ceramic electronic component using the same, and a manufacturing method of a multilayer ceramic electronic component are provided. The conductive paste for an external electrode includes first conductive particles containing a metal, second conductive particles formed of ceramic particles coated with silver (Ag), and a thermosetting resin.

Abstract: A monolithic ceramic electronic component having outer electrodes that include an inorganic substance containing at least Si, a crystal phase C containing at least Si, Ti, and Ba at the interfaces to a ceramic layer in peripheral end portions of the outer electrodes. A value of the crystal phase area ratio indicating the relationship between the area of the crystal phase C and the area of a glass phase G, which are formed at the interface to the ceramic layer, in a region within 5 ?m from the peripheral end portion of the outer electrode is within a range of 75% to 98%.

Abstract: A laminated film capacitor that includes a laminated body having alternately stacked first dielectric films with respective first internal electrodes and second dielectric films with respective second internal electrodes, a first metallikon part connected to the first internal electrodes, and a second metallikon part connected to the second internal electrodes, and the laminated body has principal surfaces in the shape of a trapezoid as viewed from the stacking direction of the first dielectric films and the second dielectric films.

Abstract: Implantable medical devices include connector enclosure assemblies that utilize conductors electrically coupled to feedthrough pins that extend into a can where electrical circuitry is housed. The conductors may be coupled to the feedthrough pins and to capacitor plates within a filter capacitor by an electrically conductive bonding material and as a single bonding event during manufacturing. The base plate of the connector enclosure assembly may also include a ground pin. Ground capacitor plates may be present at a ground aperture of the filter capacitor where the ground pin passes through so that the ground pin, a ground conductor, and the ground capacitor plate may be coupled. A protective cover may be provided for the connector enclosure assembly to enclose the conductors intended to extend into the can prior to the assembly being joined to the can. Conductors may be attached to a common tab that is subsequently removed.

Abstract: An electrode forming film includes: a dielectric film; an electrode head part; a first common electrode connected with the electrode head part; a plurality of first split electrodes spaced apart from the first common electrode in the first direction; a second common electrode spaced apart from the first split electrodes in the first direction; a plurality of second split electrodes spaced apart from the second common electrode in the first direction; a plurality of first fuse parts formed between the first common electrode and the first split electrodes; a plurality of second fuse parts formed between the first split electrodes and the second common electrode; and a plurality of third fuse parts formed between the second common electrode and the second split electrodes.

Abstract: Disclosed herein are an electronic component and a method of manufacturing the same. In an electronic component having a conductor formed in an insulator and providing an external electrode electrically connected to the conductor on an outer surface of the insulator, a curvature of the external electrode in a via machining region is decreased at a predetermined level or less, thereby making it possible to decrease defect generation due to a glare-reflection of a laser.

Abstract: In a method of forming a plating layer for an external terminal electrode by applying, for example, copper plating to an end surface of a component main body with respective ends of internal electrodes exposed, and then applying a heat treatment at a temperature of about 1000° C. or more in order to improve the adhesion strength and moisture resistance of the external terminal electrode, the plating layer may be partially melted to decrease the bonding strength of the plating layer. In the step of applying a heat treatment at a temperature of about 1000° C. or more to a component main body with plating layers formed thereon, the average rate of temperature increase from room temperature to the temperature of about 1000° C. or more is set to about 100° C./minute or more. This average rate of temperature increase maintains a moderate eutectic state in the plating layer and ensures a sufficient bonding strength of the plating layer.

Abstract: A monolithic capacitor includes a laminated body including stacked dielectric layers and substantially in the shape of a rectangular parallelepiped, and including a first surface being a mounting surface, a second surface opposite to the first surface, opposing third and fourth surfaces orthogonal to the first and second surfaces, and opposing fifth and sixth surfaces orthogonal to the first to fourth surfaces; capacitor electrodes disposed in the laminated body and each including a capacitive portion and a lead portion extending therefrom to at least one surface of the laminated body, the capacitive portions facing each other with dielectric layers interposed therebetween; and first and second outer electrodes disposed on at least one surface of the laminated body and connected to the lead portions. A gap between the first surface and the capacitive portions is greater than a gap between the second surface and the capacitive portions.

Abstract: A multilayer ceramic capacitor may include: a ceramic body; first and second external electrodes; first and second internal electrodes connected to the first and second external electrodes, respectively; first floating electrodes having both end portions overlapped with portions of the first and second internal electrodes, respectively; and at least one second floating electrode shifted with respect to the first floating electrodes in a length direction of the ceramic body. The lengths of portions of the first and second floating electrodes overlapped with the portions of the first internal electrodes may be different from those of portions of the first and second floating electrodes overlapped with the portions of the second internal electrodes.

Abstract: A multilayer capacitor that achieves reduced acoustic noise includes a capacitor body including a capacitance generating portion, a first outer layer portion, and a second outer layer portion. First and second internal electrodes are provided in the capacitance generating portion. The first outer layer portion is located between the capacitance generating portion and a first principle surface. The second outer layer portion is located between the capacitance generating portion and a second principle surface. The second outer layer portion is thicker than the first outer layer portion. At least one of a concave portion and a convex portion is provided on the second principle surface.

Abstract: A method for making multilayer ceramic capacitors is described with high voltage capability without the need of coating the part to resist surface arc-over. One design combines a high overlap area for higher capacitance whilst retaining a high voltage capability. A variation of this design has increased voltage capability over this design as well as another described in the prior art although overlap area and subsequently capacitance is lowered in this case.

Abstract: There is provided a multilayer ceramic electronic component including: a ceramic body including a plurality of dielectric layers; and a plurality of first and second internal electrodes disposed to face each other with the dielectric layer interposed therebetween within the ceramic body and having different widths, wherein three or more of the plurality of first and second internal electrodes form a single block, the blocks are iteratively laminated, and when the longest distance between the uppermost internal electrode and the lowermost internal electrode, among the plurality of first and second internal electrodes 121 and 122, is T1 and the shortest distance therebetween is T2, 0.76?T2/T1?0.97 is satisfied.

Abstract: A method of manufacturing a ceramic capacitor component that includes preparing a laminate body including first to third green sheets by stacking the first green sheets before applying conductive paste, stacking the second green sheets with conductive paste applied thereon on the first green sheets, and stacking the third green sheets before applying conductive paste on the second green sheets; preparing fourth green sheets from a raw material that does not contain V2O5; providing the fourth green sheets onto four surfaces of the laminate body other than end surfaces of the laminate body to form a main body; firing the main body; and applying and baking a Cu paste onto the four surfaces of the main body and the end surfaces of the main body.

Abstract: A multilayer ceramic electronic component achieves a high electrostatic capacitance and includes an Al inner electrode superior in smoothness and conductivity. The multilayer ceramic electronic component includes a multilayer body including a plurality of stacked ceramic layers and a plurality of inner electrodes arranged along certain interfaces between the ceramic layers and containing Al as a main component, and an outer electrode located on an outer surface of the multilayer body. A surface of the inner electrode is covered with a layer including a noble metal or Ti as a main component.

Abstract: An apparatus and associated method for an energy-storage device (e.g., a capacitor) having a plurality of electrically conducting electrodes including a first electrode and a second electrode separated by a non-electrically conducting region, and wherein the non-electrically conducting region further includes a non-uniform permittivity (K) value. In some embodiments, the method includes providing a substrate; fabricating a first electrode on the substrate; and fabricating a second electrode such that the second electrode is separated from the first electrode by a non-electrically conducting region, wherein the non-electrically conducting region has a non-uniform permittivity (K) value. The capacitor devices will find benefit for use in electric vehicles, of all kinds, uninterruptible power supplies, wind turbines, mobile phones, and the like requiring wide temperature ranges from several hundreds of degrees C. down to absolute zero, consumer electronics operating in a temperature range of ?55 degrees C.

Abstract: A resin is provided so as to cover four side faces of a piezoelectric multilayer body integrally and thus is effectively prevented from peeling from the piezoelectric multilayer body, whereby high adhesion is attained between the piezoelectric multilayer body and the resin. At the same time, the resin covers dicing surfaces in the side faces of the piezoelectric multilayer body, thereby effectively restraining the piezoelectric body and the electrodes from producing particles.

Abstract: Disclosed herein is a multilayer ceramic device including a device body having lateral surfaces and circumferential surfaces connecting the lateral surfaces, an internal electrode disposed in a length direction of the device body within the device body, an external electrode having a front portion covering the lateral surface and a band portion extending from the front portion to cover a portion of the circumferential surface, and a reinforcement pattern extending from the lateral surface toward the interior of the device body and having a length longer than a width of the band portion.

Abstract: A micro electrical mechanical system (MEMS) device in one embodiment includes a substrate defining a back cavity, a membrane above the back cavity, a back plate above the membrane, and a first overtravel stop (OTS) positioned at least partially directly beneath the membrane and supported by the back plate.

Abstract: A multilayer ceramic electronic component includes: a ceramic body including dielectric layers; an oxide film formed on one surface of the ceramic body; first and second external electrodes formed on both sides of the oxide film on one surface of the ceramic body; a first internal electrode formed on the dielectric layer and including a first electrode lead-out portion exposed to the first external electrode and a first insulating lead-out portion exposed to the oxide film and having a composite-metal-oxide region formed in an exposed edge portion thereof; a second internal electrode facing the first internal electrode, having the dielectric layer interposed therebetween, and including a second electrode lead-out portion exposed to the second external electrode and a second insulating lead-out portion exposed to the oxide film, having a composite-metal-oxide region formed in an exposed edge portion thereof, and overlapped with the first insulating lead-out portion to form additional capacitance.

Abstract: A method for producing a piezoelectric multilayer component is disclosed. Piezoelectric green films and electrode material are provided, arranged alternately on top of one another and sintered. The electrode material is provided with a PbO-containing coating and/or PbO is mixed into the electrode material.

Abstract: A capacitor, and methods of its manufacture, having improved capacitance efficiency which results from increasing the effective area of an electrode surface are disclosed. An improved “three-dimensional” capacitor may be constructed with electrode layers having three-dimensional aspects at the point of interface with a dielectric such that portions of the electrode extend into the dielectric layer.