Abstract: In order to provide a thin-film resistor and a manufacturing method thereof capable of restraining reduction of a Q-value of varactor by reducing a parasitic capacitance between the resistor and the substrate, the thin-film resistor includes a semiconductor substrate 10 including an integrated circuit 12 having a plurality of electrode pads 14 placed in a distance from each other in the most upper part of a plurality of stacked interconnections, and the integrated circuit 12 having a passivation film 16 formed between the plurality of electrode pads 14; a secondary interconnections 18 electrically connected to the electrode pads 14; an insulating film 20 formed in a place in between the secondary interconnections on the passivation film 16; and a resistor 26 formed 18 in a predetermined place in between the secondary interconnections 18 on the insulating film 20.

Abstract: An electronic component and a method for producing the electronic component achieve efficient production of resistive elements with various resistances. The electronic component includes a pair of terminals opposite each other and a resistive element disposed between the pair of terminals. The resistive element includes a plurality of dots arranged so as to overlap each other in a reference arrangement pattern excluding a portion of the arrangement pattern. To produce the electronic component, an electronic component is prototyped in advance and includes a resistive element in which the dots are arranged in the entire reference arrangement pattern between the pair of terminals. The prototyped resistive element is then partially removed so as to attain a desired resistance. An electronic component is then produced in which the dots are arranged in the reference arrangement pattern with a portion of the arrangement pattern excluded on the basis of the shape of the partially removed resistive element.

Abstract: A thin film resistor structure is disclosed. The resistor structure comprises a resistor film comprising a copper oxide layer and a plurality of metal islands thereon. The copper oxide layer has a top surface comprising a plurality of adjacent nodule-shaped recess regions, in which vacancies are formed between the nodule-shaped recess regions and are arranged in reticulate distribution. The plurality of metal islands is respectively distributed in the vacancies between the nodule-shaped recess regions. A method for fabricating the thin film resistor structure is also disclosed.

Abstract: A chip resistor (1) includes a chip substrate (2) a mutually separated terminal electrodes (3, 4) formed on the upper surface of the substrate (2), and a meandering resistor film (5) formed between the two terminal electrodes (3, 4). Each of the terminal electrodes (3, 4) includes an inner edge (3a, 4a) extending diagonally from one side surface (2a) toward the other side surface (2b) of the chip substrate (2). Each of the inner edges (3a, 4a) has a portion closer to the resistor film (5) that is electrically connected to a narrow portion (7, 8) formed integral with the resistor film (5). The narrow portion extends outward from an end (5a, 5b) of the resistor film (5).

Abstract: A method for making chip resistor components includes: (a) forming a plurality of first and second notches in a substrate so as to form resistor-forming strips; (b) forming pairs of upper and lower electrodes on each of the resistor-forming strips; (c) forming a resistor film on each of the resistor-forming strips; (d) forming an insulator layer on the resistor film; (e) forming a hole pattern in the insulator layer and the resistor film; (f) forming an insulating shield layer on the insulator layer; (g) cleaving the substrate along the first notches so as to form a plurality of strip-like semi-finished products; (h) forming a pair of side electrodes on two opposite sides of each of the semi-finished products; and (i) cleaving each of the semi-finished products.

Abstract: A method of making a circuitized substrate which involves forming a plurality of individual film resistors having approximate resistance values as part of at least one circuit of the substrate, measuring the resistance of a representative (sample) resistor to define its resistance, utilizing these measurements to determine the corresponding precise width of other, remaining film resistors located in a defined proximity relative to the representative resistor such that these remaining film resistors will include a defined resistance value, and then selectively isolating defined portions of the resistive material of these remaining film resistors while simultaneously defining the precise width of the resistive material in order that these film resistors will possess the defined resistance.

Abstract: Electro-thermal trimming of thermally-trimmable resistors is used to trim one or more of the plurality of resistors in or associated with an analog electric circuit. The TCR of each of a subset of a plurality of electro-thermally-trimmable resistors can be trimmed independently from the resistance in order to adjust the output parameter of an analog electric circuit without changing other parameters that would be affected by a change in resistance.

Abstract: An ablating device is used to form a pattern into a sensing element pad of a soot sensor, with the pattern establishing two finger paths without electrical connection between them. The pattern can be formed through a protective layer on the sensing element pad before the sensing element pad is fired.

Abstract: To provide a glazed metal film resistor device excellent in TCR characteristics with using an economical base body containing glass by reducing affection to TCR characteristics caused by glass contained in the base body. The resistor device comprises base body 11 containing glass, first protective film 12, which does not contain glass, formed on a surface of base body 11, and thick film resistor 13 formed on first protective film 12. By forming first protective film 12 on a surface of base body 11 containing glass and insulating base body 11 containing glass against thick film resistor 13 of ruthenium oxide as primary component, affection of glass contained in base body 11 to thick film resistor 13 of ruthenium oxide can be suppressed, and change of TCR value from original value of thick film resistor itself can be suppressed.

Abstract: The chip resistor (1) of the present invention includes an insulating substrate (2) in the form of a chip, a pair of terminal electrodes (3, 4) formed on both ends of the insulating substrate (2), a plurality of resistor films (5) formed on an obverse surface of the insulating substrate (2) in parallel with each other between the paired terminal electrodes (3, 4), and a cover coat formed on the obverse surface of the insulating substrate (2) to cover the resistor films (5). In the chip resistor (1), one of the terminal electrodes (3) includes individual upper electrodes (8) each formed on the obverse surface of the insulating substrate (3, 4) to be independently connected to a respective one of the resistor films (5) and a side electrode (9) formed on a side surface of the insulating substrate (2) to be connected to all the individual upper electrodes (8).

Abstract: A humidity sensing structure having a cantilever resistor and a method for fabricating the same are disclosed. The method includes providing a substrate having a first surface and a second surface; performing an oxidation process on the first surface and the second surface to form a first oxide layer and a second oxide layer respectively; forming a resistance sensing layer on the first oxide layer; forming a humidity sensing layer on the resistance sensing layer; forming in the substrate a through-hole penetrating the first oxide layer and the second oxide layer; and forming a cantilever in the through-hole such that both the humidity sensing layer and the resistance sensing layer are secured in position on the cantilever. In response to humidity changes, the humidity sensing layer varies in volume and in consequence the resistance sensing layer varies in length, allowing ambient humidity to be measured.

Abstract: Precursor compositions for the deposition of electronic features such as resistors and dielectric components and methods for the deposition of the precursor compositions. The precursor compositions have a low viscosity, such as not greater than about 1000 centipoise and can be deposited using a direct-write tool. The precursors also have a low conversion temperature, enabling the formation of electronic features on a wide variety of substrates, including low temperature substrates.

Abstract: Disclosed herein is a manufacturing method of a planar resistance heating element and a planar resistance heating element made using the method. In the manufacturing method of a planar resistance heating element by etching an aluminum foil deposited on an insulating substrate in a desired pattern, printing carbon paste and connecting current input terminals in parallel, the aluminum foil is adapted to undergo a multiple step tempering process to thereby prevent heat deformation. The carbon paste acting as a resistor element is made of electrically conductive carbon, graphite, a resin, a solvent and a hardener which are mixed so as to optimize physical properties of the carbon paste. As a result, prevention of heat deformation of the insulating substrate, uniform heat conductivity, excellent heat-generation effect and easy manufacture may be achieved.

Abstract: A process for making a fluid ejector head for a micro-fluid ejection device. In one embodiment, the process comprises depositing a thin film resistive layer on a substrate to provide a plurality of thin film heaters. The thin film resistive layer comprises a tantalum-aluminum-nitride material consisting essentially of AlN, TaN, and TaAl alloys, and containing from about 30 to about 70 atomic % tantalum, from about 10 to about 40 atomic % aluminum and from about 5 to about 30 atomic % nitrogen.

Abstract: A flow sensor may be formed by bonding a sensor chip formed with a flow rate detecting part and a flow path-forming member that is provided on the sensor chip and is formed with a flow path for a fluid flowing in the flow rate detecting part to each other on the upper surface of a substrate. The flow path-forming member may be formed by bonding a transparent first flow path forming member and a second flow path-forming member to each other. The first flow path forming member has a plate shape, and is provided with an inflow port and a outflow port for the fluid to be measured, and the second flow path forming member has a plate shape, and is provided with a through hole that forms the flow path along the flow of the fluid flowing along the flow rate detecting part.

Abstract: A resistance-type gas sensor includes a gas detection section including an oxide semiconductor layer. The oxide semiconductor layer includes cerium ions and zirconium ions. An amount of substance of zirconium ions relative to a sum of amounts of substance of cerium ions and zirconium ions contained in the oxide semiconductor layer is no less than about 45% and no more than about 60%, and the oxide semiconductor layer has a crystal phase containing about 80 vol % or more of cubic crystals.

Abstract: The disclosure relates to an overvoltage protection means containing ZnO microvaristor particles for protecting electrical elements and a method to produce the means. Single microvaristor particles are placed in an arrangement having a monolayer thickness and are electrically coupled to the electrical element to protect it against overvoltages. Embodiments, among other things, relate to: 1-dimensional or 2-dimensional arrangements of microvaristor particles; placement of single microvaristors on a carrier; the carrier being planar or string-like, being structured, being a sticky tape, having fixation means for fixing the microvaristors, or having electrical coupling means. The monolayered overvoltage protection means allows very tight integration and high flexibility in shaping and adapting it to the electric or electronic element. Furthermore, reduced capacitance and hence reaction times of overvoltage protection are achieved.

Abstract: A chip resistor (1) according to the present invention includes an insulating substrate (2) which is in the form of an elongated rectangle in plan view, a pair of upper electrodes (3, 4) in the form of a strip formed on the upper surface of the insulating substrate (2) at portions adjacent to the long side surfaces of the insulating substrate to extend along the side surfaces, a resistor film (5) formed on the upper surface of the insulating substrate (2) and electrically connected to the upper electrodes (3, 4), and a pair of terminal electrodes (6, 7) formed on the two long side surfaces of the insulating substrate and electrically connected to the upper electrodes (3, 4), respectively. One of two longitudinal ends of the resistor film (5) is connected to one of the upper electrodes (3), whereas the other one of the two longitudinal ends of the resistor film is connected to the other one of the upper electrodes (4).

Abstract: To provide an electronic component including a resistor element that can be efficiently produced with a range of resistances, and a method for manufacturing the electronic component, the electronic component includes a pair of terminals, and a resistor element disposed between the terminals. The resistor element includes at least two resistive portions (hereinafter referred to as a first resistive portion and a second resistive portion) that are continuously disposed. The first resistive portion includes a plurality of first dots overlapping one another. The second resistive portion includes a plurality of second dots having a different electric resistance from that of the first dots overlapping one another.

Abstract: A resistor R1 formed by forming a first resistor layer 5a of 20 nm thickness including a tantalum nitride film at a concentration of nitrogen of less than 30 at % and a second resistor layer of 5 nm thickness including a tantalum nitride film at a concentration of nitrogen of 30 at % or more successively by a reactive DC sputtering method using tantalum as a sputtering target material and using a gas mixture of argon and nitrogen as a sputtering gas, and then fabricating the first and the second resistor layers, in which the resistance change ratio of the resistor can be suppressed to less than 1% even when a thermal load is applied in the interconnection step, by the provision of the upper region at a concentration of nitrogen of 30 at % or more.

Abstract: An electrically adjustable resistor comprises a resistive polysilicon layer dielectrically isolated from one or more doped semiconducting layers. A tunable voltage is applied to the doped semiconducting layers, causing the resistance of the polysilicon layer to vary. Multiple matched electrically adjustable resistors may be fabricated on a single substrate, tuned by a single, shared doped semiconductor layer, creating matched, tunable resistor pairs that are particularly useful for differential amplifier applications. Multiple, independently adjustable resistors may also be fabricated on a common substrate.

Abstract: The present invention provides a method of producing a resistance element incorporated in a printed circuit board at an accuracy of resistance value of ±1% or less, at low cost and with a good yield while the resistance element formed by a resistor paste is incorporated.

Abstract: The present invention is directed to a thick film patterned resistor on a substrate and to a method of forming it. The method involves providing a substrate with opposed surfaces, where one surface is coated with a layer of a resistor composition. A photoresist is applied over the layer of the resistor composition, and a desired pattern in the photoresist is formed, where the pattern leaves certain regions of the resistor composition layer uncovered by the photoresist. The resistor composition layer which is uncovered by the photoresist is etched under conditions effective to leave a mass of loosely bound resistor particles at regions of the resistor composition which are not covered by photoresist. The mass of resistor particles is then removed from the substrate to produce a thick film patterned resistor on the substrate.

Abstract: A chip resistor includes a resistive element (1), an insulation layer (4) formed in a back surface of the flat surface, and two electrodes (3) spaced from each other via the insulation layer. Each electrode (3) makes contact with the insulation layer (4). Each electrode (3) has a lower surface formed with a solder layer (39).

Abstract: Embodiments of a resistor are disclosed.

Abstract: A chip resistor (A1) includes a chip-like resistor element (1), two electrodes (31) spaced from each other on the bottom surface (1a) of the resistor element, and an insulation film (21) between the two electrodes. Each electrode (31) has an overlapping portion (31c) which overlaps the insulation film (21) as viewed in the vertical direction.

Abstract: A chip resistor includes an insulating substrate, a pair of electrodes formed on a main surface of the substrate and a resistor element electrically connected to the electrodes. The paired electrodes are spaced from each other in a first direction. The main surface of the substrate is formed with a raised portion in the form of a plateau which is smaller in size than the substrate in a second direction perpendicular to the first direction. The paired electrodes are formed on the raised portion. The resistor element is equal in size to the raised portion in the second direction.

Abstract: A thermally sprayed gas heater comprises a gas flow apparatus that propels a gas through a housing; and a thermally sprayed heater bonded to a surface of the apparatus, the heater positioned to heat the gas flow in the housing. In other aspects, a heater system for a turbulent flow gas duct comprises a duct having a gas flow channel, the channel having a shaped surface providing turbulent gas flow in the channel, and a thermally sprayed heater positioned to heat the gas flow in the channel.

Abstract: The chip resistor (1) includes an insulating substrate (2) and a main upper electrode (4) formed on a main surface of the insulating substrate (2). On the main surface of the insulating substrate (2) , a resistor film (5) including an end (5a) overlapping the upper surface of main upper electrode (4) is formed. The resistor film (5) is covered by a protective coat (7, 8). An auxiliary upper electrode (6) is formed on the upper surface of the main upper electrode (4). The auxiliary upper electrode (6) includes an inner end (6a) overlapping the upper surface of the end (5a) of the resistor film (5). The protective coat (7, 8) overlaps the inner end (6a) of the auxiliary upper electrode (6).

Abstract: An electrically conductive resistive layer (26) is produced by thermally spraying an electrically conductive material (18) onto the surface of a non-conductive substrate (12). Initially, the material layer (14) arising therefrom has no desired shape. The material layer (14) is then removed (24) in certain areas so that an electrically conductive resistive layer (26) having said desired shape is produced.

Abstract: A ceramic heater for heating a semiconductor wafer under processing and has a layered structure wherein on one surface of a supporting substrate made of carbon or a carbon-based composite material, successively formed layers including an insulating layer, and electroconductive layer as an electric heating element and a dielectric layer. A first step for partly or completely removing the layer or layers having degraded properties by means of a suitable method such as sandblasting and a second step of re-forming the layer or layers having been removed in the first step. The invention allows for a substantial cost decrease as compared with the conventional way by replacing the worn-out ceramic heater with a newly manufactured one.

Abstract: A method of manufacturing an inexpensive fine resistor which do not require dimensional classifications of discrete substrates is disclosed. The method eliminates a process of replacing a mask according to a dimensional ranking of each discrete substrate. The method includes: dividing an insulated substrate sheet along a first slit dividing portion and a second dividing portion perpendicular to the first dividing portion; forming a top electrode layer on a top face of the discrete substrate; forming a resistor layer such that a part of the resistor layer overlaps the top electrode layer; forming protective layers so as to cover the resistor layer; and forming side electrode layer on a side face of the discrete substrate such that the side electrode layer is electrically coupled to the top electrode layer.

Abstract: An apparatus for detecting an amount of strain comprises a strain generating part, an electrical insulating layer and sensing elements. The strain generating part is a member to which strain is to be applied. The electrical insulating layer is formed on the strain generating part. The sensing elements are formed on the electrical insulating layer. Each of the sensing elements is made of a silicon film. The silicon film comprises a poly-crystalline main layer and a poly-crystalline interface-layer, which comes into contact with the electrical insulating layer.

Abstract: A method for producing components for injection moulding comprising a body made of thermally conducting material with expansion coefficient matching that of the insulating layers and provided with a passage for the material to be injected. At least one strip of electrically conducting material with high change of resistance with temperature, forming a heating resistor or inductor is applied on a electrically insulating base layer previously directly applied on the body. At least one final insulating layer with low thermal emissivity is then applied to optimise electrical efficiency. The method utilises thermal spray techniques and can be applied also for production of other heating equipment.

Abstract: In manufacturing a chip resistor by dividing a chip resistance substrate which includes an insulator, resistance film formed on a surface of the insulator, and a plurality of conductive strips disposed on the resistance film at fixed intervals, grooves are formed by removing a predetermined width of the resistance film including at least second prescribed severing lines. After forming the grooves, the chip resistance substrate is severed in longitudinal and lateral directions along first prescribed severing lines for dividing the conductive strips into two parts and the second prescribed severing lines perpendicular to the first prescribed severing lines so as to produce discrete chip resistors.

Abstract: A thick film heater is shown wherein the thick film resistive circuit, as the heating element, is applied directly to a target object to be heated for very low temperature applications. The thick film used is polymer-based (preferably epoxy). The thick film resistive circuit is applied using conventional means. However, it is cured at higher temperatures and longer cycles than conventional thick film circuits, and preferably in multiple stages.

Abstract: Methods of creating an internal channel of a fluid-ejection device are provided. One method includes encapsulating a channel core in an element of the fluid-ejection device that corresponds to the internal channel and dissolving at least a portion of the channel core.

Abstract: A resistive element in the form of a bent metal plate is placed in a box-shaped case and has electrodes exposed out of the box-shaped case. A heat radiator in the form of a bent metal plate is also placed in the box-shaped case and has heat radiating electrodes exposed out of the box-shaped case. The resistive element and the heat radiator are held out of contact with each other and disposed in criss-cross relation to each other. The box-shaped case is filled with a cement material in surrounding relation to the resistive element and the heat radiator.

Abstract: According to one aspect of the invention, a structure and method for providing improved thermal conductivity of a thermal interface material (TIM) made of phase changed polymer matrix and a fusible filler material is disclosed. The TIM may also have a non-fusible filler material and a percentage of a non-phase change polymer added to the phase change polymer matrix. The TIM, used to mate and conduct heat between two or more components, can be highly filled systems in a polymeric matrix where the fillers are thermally more conductive than the polymer matrix.

Abstract: A method of manufacturing a composite structural member with an integrated electrical circuit is provided. The structural member includes a plurality of layers of structural reinforcement material, and two or more electrical devices are disposed at least partially between the layers with an intermediate layer of the structural reinforcement material disposed between the electrical devices. At least one electrical bus is disposed in the structural member, and each electrical device is connected to the bus by a conductive electrode. Thus, the electrodes can extend through the intermediate layer of the structural reinforcement material to connect each of the electrical devices to one or more of the buses.

Abstract: A high precision power resistor having the improved property of reduced resistance change due to power is disclosed. The resistor includes a substrate having first and second flat surfaces and having a shape and a composition; a resistive foil having a low TCR of about 0.1 to about 1 ppm/° C. and a thickness of about 0.03 mils to about 0.7 mils cemented to one of the flat surfaces with a cement, the resistive foil having a pattern to produce a desired resistance value, the substrate having a modulus of elasticity of about 10×106 psi to about 100×106 psi and a thickness of about 0.5 mils to about 200 mils, the resistive foil, pattern, type and thickness of cement, and substrate being selected to provide a cumulative effect of reduction of resistance change due to power. The present invention also provides for a method of producing a high precision power resistor.

Abstract: A surface mount resistor includes an elongated piece of resistive material having strips of conductive material attached to its opposite ends. The strips of conductive material are separated to create an exposed central portion of the resistive material therebetween. According to the method the resistive strip is attached to a single co extensive strip of conductive material and a central portion of the conductive material is removed to create the exposed central portion of the resistive strip.

Abstract: The present invention relates to a method of manufacturing surge arrestors, the method including stacking varistors; and forming a coating of composite material on the stack. Between these steps, also included is placing a bead of flexible, adhesive, and dielectric material on the previously formed stack in register with the various interfaces between each pair of adjacent varistors.

Abstract: A multiple chip resistor is manufactured in the following method. First electrode layers are formed on a first surface of a substrate. Resistor elements electrically connected to the first electrode layers, respectively, are formed on the first surface of the substrate. Slits are formed in the substrate for separating the first electrode layers. Edge electrodes connected to the first electrode layers at the edges of the slits, respectively, are formed on respective edges at the slits of the substrate. The substrate is divided at the slits into strip substrates. Portions of the edge electrodes are removed for electrically isolating the resistor elements from each other. The method provides the edge electrodes on each strip substrate with an improved dimensional accuracy, hence allowing the edge electrodes to be isolated electrically from each other. Consequently, the multiple chip resistor is prevented from being mounted defectively when the resistor is surface-mounted.

Abstract: A method for fabricating the embedded thin film resistors of a printed circuit board is provided. The embedded thin film resistors are formed using a resistor layer built in the printed circuit board. Compared with conventional discrete resistors, embedded thin film resistors contribute to a smaller printed circuit board as the space for installing conventional resistors is saved, and better signal transmission speed and quality as the capacitive reactance effect caused by two connectors of the conventional resistors is avoided. The method for fabricating the embedded thin film resistors provided by the invention can be conducted using the process and equipment for conventional printed circuit boards and thereby saving the investment on new types of equipment. The method can be applied in the mass production of printed circuit boards and thereby reduce the manufacturing cost significantly.

Abstract: A method for producing a uniformly heated electric heating cloth comprising the steps of forming heating threads by dissolving a thermoplastic polymer in an organic solvent, adding an industrial carbon which is produced from acetylene to form a first mixture, grinding the mixture of industrial carbon and thermoplastic polymer, adding a colloidal graphite to form a second mixture, grinding the second mixture, coating threads with the second mixture in a spinneret, heating the coated threads to remove the organic solvent; and interweaving the coated heating threads with non-conducting threads in a perpendicular direction.

Abstract: The substrate (2) containing the via-hole (3) is inserted into an electrophoretic cell (1) and an electrode (6) (the “first electrode”) is placed on top of a first orifice of the via-hole(s) (3), to be implemented with electrical component(s), so that the electrode (6) totally covers the first orifice. Electrically charged either conductive and/or non-conductive particles are provided by immersing the volume of the via-hole(s) (3) in a conductive medium (17) consisting of the electrically charged particles. An electric field is created between the first electrode (6) and a second electrode (4) through the via-hole(s) (3) and the conductive medium (17) and the electrically charged particles are precipitated on the inner surface of the first electrode (6) that is directed to the second orifice of the via-hole(s) (3), until a desired portion of the volume of the via-hole(s) (3) is filled with a first layer of the charged particles having a desired thickness.

Abstract: A method of making a windshield having first and second outer layers and a conductive bar, an electrical connector, and an intermediate layer positioned between the outer layers. The method includes the step of sinking the conductive bar and the electrical connector into a surface of the intermediate layer so as to be at least substantially flush with the surface. After sinking the conductive bar and the electrical connector into the surface, the first outer layer is engaged with the surface of the intermediate layer. Additionally, the second outer layer is engaged with a second surface of the intermediate layer.

Abstract: An inexpensive fine resistor which do not require dimensional classifications of discrete substrates, eliminating a process of replacing a mask according to a dimensional ranking of each discrete substrate as in the prior art. The resistor includes discrete substrate made into pieces by dividing an insulated substrate sheet along a first slit dividing portion and a second dividing portion perpendicular to the first dividing portion; top electrode layer formed on a top face of discrete substrate; resistor layer formed such that a part of resistor layer overlaps top electrode layer; protective layers formed so as to cover resistor layer; side electrode layer formed on a side face of discrete substrate such that side electrode layer is electrically coupled to top electrode layer.

Abstract: A strain sensor comprising a metal substrate, a first electrode provided on the metal substrate, a glass layer formed on the first electrode, and a second electrode and a strain detecting resistor provided on the glass layer. In the strain sensor, the insulation resistance between the metal substrate and the second electrode has been raised, and the reliability is high. It can be implemented at low cost.