Abstract: A compact resistor device comprises a body of ceramic material of positive temperature coefficient of resistivity having a large number of passages extending through the body between opposite ends of the body, thereby forming very thin webs of the resistor material between adjacent passages. Coatings are formed on the resistor material along the inner walls of the passages to serve as ohmic contacts. The coatings in alternate passages are connected together at one end of the resistor device and the coatings in the other passages are connected together at the opposite end of the device to serve as device terminals. When the device terminals are connected to a power source, current flows through very thin webs of resistor material between ohmic contacts in adjacent body passages. The resistor device is particularly useful in current limiting applications requiring low, room-temperature resistance and in heat-exchanger applications where a fluid to be heated is directed through the passages.

Abstract: A thin film foil resistor is disclosed wherein a thin metallic foil is bonded to an insulating substrate and a circuit path is formed on the foil by photographic artwork-etching techniques. After the circuit is formed, the structure is subjected to another etching process to reduce the thickness of the foil circuit thereby adjusting the value of the resistor. Terminal lands of the circuit are electroplated and the connecting leads are soldered to the lands. The value of the resistor is finally adjusted by use of a laser beam, and the resistor is encapsulated.

Abstract: A method of manufacturing a resistor element for fixed or variable resistors. The element comprises an insulating substrate injection molded from ceramic-glass frit material and organic binder and lubricating material and layers of resistive material and conducting termination material deposited on the unfired substrate. The organic materials in the substrate and its termination and resistive layers are substantially "burned out" prior to simultaneously co-firing the substrate and the deposited resistive and termination layers.The fixed resistor element may be molded as a half-shell arranged to receive leads extending from opposite ends thereof and attached by soldering to the termination areas. A substantially identical cover member molded and fired from the same material as the substrate is adhesively attached to the substrate to complete the resistor.

Abstract: An electric resistance furnace adapted for operation at about 1,800.degree. C. or higher temperatures even in an oxidizing or neutral atmosphere is disclosed. The furnace has a cylindrical heating chamber defined by a generally cylindrical heating element made of ceramic material, such as zirconium oxide and lanthanum chromide. The heating element has a wall thickness which is very small at its middle section and gradually increases toward each end. The middle section of the heating element defines the useful part of the heating chamber into which the heat generated by the heating element is effectively concentrated. An electrode comprising an annular foil of platinum is provided at each end of the heating element to pass electric current therethrough.

Abstract: Metal oxide varistors having a uniform wattage gradient across the varistor surfaces are provided by removing a thin layer of metal oxide surface material from the periphery of the varistors prior to applying an insulating collar and a silicone rubber encapsulation for the purpose of heat dissipation.

Abstract: An electrical device has a casing, a solid state component, and a pair of means in the casing for electrical contacting and positioning engagement with the solid state component. A pair of terminal means are disposed in the casing for connection in circuit with the engagement means, respectively, and at least one of the terminal means is adapted for limited displacement movement in the casing upon the mounting association of the terminal means with a pair of mating terminals. The at least one terminal means includes means associated both mechanically and electrically with one of the engagement means and adapted for isolating the one engagement means from the limited displacement movement of the at least one terminal means upon the mounting association of the terminal means with the mating terminals.A method of making an electrical device is also disclosed.

Abstract: An electrical circuit device having a substrate including circuit components on at least one side thereof and a plurality of through openings in the substrate. Terminal leads are positioned in the openings each with a deformation intermediate the ends of the leads and spaced internally of the opening from a soldered area at the juncture of the exposed portion of the leads and the termination edge of the substrate. Two methods of assembly of leads to the substrate are also disclosed.

Abstract: An electrically conductive paper comprising glass fibers is made by dispersing electrically conductive materials i.e. electrically conductive fibers or particles, with the glass fibers of a paper-making slurry. Paper having an electrically conductive layer and a nonconducting layer can be made. Heating panels are made by adhering the electrically conductive paper to a wall in much the same manner as is wallpaper. A positive electrical terminal is applied to one end of the paper and a ground terminal is applied to the other end of the paper. A flow of electricity through the paper causes the paper to heat and to in turn supply heat to the room which the wall faces.

Abstract: An improved laminated beam lead for microelectronic devices, e.g., thin film resistors, integrated circuits or the like includes a first metal adhesion layer, e.g. tantalum nitride having disposed thereover a barrier metal such as palladium or platinum, and a bulk beam material, e.g., gold.In accordance with one aspect of the present invention, a transverse discontinuity is formed in the barrier metalization layer such that normal forces applied to the end portion of the composite beam lead remote from the device chip will merely cause the beam lead to deform at the discontinuity rather than delaminating from the chip.

Abstract: An electrical circuit component includes an apertured, relatively flat substrate having a circuit deposited on a surface and with a terminal lead member lying along one of the opposed surfaces of the substrate with the inboard end of the lead having a supporting body portion and an integral portion offset with respect to the body portion. The lead includes a plurality of integral laterally extending projections, at least one of which projects from the body portion and the other of which projects from the offset portion of the lead member. The lead projections are inserted in respective apertures and are upset at their distal end portions to provide clamping retention and electrical continuity between the lead body portion and the substrate with its deposited circuitry.

Abstract: A first thin-film resistor member, preferably TaN, is disposed over a sec thin film member, such as NiCr, to completely cover the second member and act as a passivating layer preventing anodization of the second. The thin-film materials used for the first and second members have substantially an equal thin-film, sheet-resistance, resistance value per square (.OMEGA..quadrature.), with the first material being trimmable for this purpose. Also, the TCR (temperature coefficient of expansion) of the first material is negative while that of the second is positive. These members are coupled in parallel with substantially equal lengths but with differing widths which permit the first to completely cover the second. The arrangement permits the TCR of the parallel circuit to be brought substantially to a zero value and, in any event, a value no greater than .+-. 50 ppm/.degree. C.

Abstract: Reconstituted metal oxide varistors are formed by hot pressing powdered metal oxide varistor ceramic with plastic resin. Metal electrodes may be pressed directly into the ceramic-plastic composite to provide improved contact characteristics.

Abstract: A plurality of separate metallized regions on a substrate form a bondsite for a single lead to be bonded to the substrate. The metallized regions are electrically interconnected at a point removed from the bondsite. Such multiple metallized regions offer redundant bonds for each such lead to improve the mechanical strength and to improve the reliability of the bond between the lead and the substrate.

Abstract: An electronic printed circuit is produced by firstly forming an electric resistance layer on an insulating substrate at positions where resistors and conductive portions of the printed circuit are expected to be provided, and then applying a layer of electrically conductive substance over the electric resistance layer thus formed, at positions where the terminals and the conductive portions of the printed circuit are to be provided.

Abstract: A termination material for a vitreous enamel electrical resistor includes a mixture of a glass frit and particles of either molybdenum, tungsten, tantalum or titanium. The termination material is applied to a substrate and fired to melt the glass frit, and then cooled to form a layer of the glass with the metal particles embedded therein. The termination material may be applied to the substrate either before or after the resistance material is applied to the substrate and is particularly useful with vitreous enamel resistance materials which include either a mixture of tantalum nitride and tantalum, a mixture of tungsten carbide and tungsten, or an alloy of copper and nickel.

Abstract: An anisotropic resistor for electrical feed throughs embodies a body of semiconductor material having at least one channel region of recrystallized material of the body formed therein. The channel region extends entirely through, and terminates in two major opposed surfaces of, the body. The at least one region is formed by a temperature gradient zone melting process, has a substantially uniform level of resistivity throughout the region and is electrically conductive.

Abstract: A process for making thin film resistor terminals is described. Terminal fabrication is accomplished by the steps of chemical plating onto the terminal forming surfaces of the resistor and thereafter heat treating between 300.degree. and 800.degree. C in the vacuum, non-oxidation gas or non-oxidation atmosphere or in the air, oxidation gas or oxidation atmosphere. The chemical plating is of nickel, cobalt or nickel-cobalt alloy.

Abstract: A varistor has a cylindrical core made of a sintered varistor material which includes a longitudinal opening between the core ends. A pair of terminating layers are applied to the core, each adhering to one of the ends of the core and being in electrical contact with a lead wire inserted into the longitudinal opening. An electrode film is applied to the outer longitudinal surface of the core with each end in communication with one of the terminating layers. The electrode film is divided between the terminating layers into a pair of electrode portions by a gap which is dimensioned to predetermine the electrical properties of the varistor.

Abstract: A thick film varistor comprises a varistor film sandwiched between a pair of electrodes, one of which is in contact with a cylindrical substrate. Alternatively, the electrodes may be positioned on the same surface of the film--either in contact with the substrate or the surface of the film opposite the substrate. The preferred method of manufacture involves applying a terminating layer to each end of the substrate, forming the varistor film and the electrodes on the substrate in the desired configuration, attaching a lead wire to each end of the substrate in electrical contact with an adjacent terminating layer, and enclosing the varistor film within a conformal coating.

Abstract: A termination material for a vitreous enamel electrical resistor which includes a mixture of a glass frit and particles of nickel and iron. The termination material is applied to a substrate and fired to melt the glass frit, and then cooled to form a layer of the glass with particles of an alloy of nickel and iron embedded therein. The termination material may be applied to the substrate either before or after the resistance material is applied to the substrate.

Abstract: An electrical resistor and method of making same including a substrate of an electrical insulating material having on a surface thereof a film of a resistance material and a termination film of a conductive material at each end of the resistance film. The resistance film is preferably a layer of a glass having embedded therein conductive particles such as tantalum nitride and tantalum or tungsten carbide and tungsten. The termination film contains either molybdenum, tungsten or a mixture thereof.

Abstract: A PTCR thermistor has a doped barium titanate body, and two base metal lead wires being bonded to and ohmically connected to two separate surface regions of the body by means of two conductive electrodes, respectively. The electrodes are comprised of aluminum particles being bound within a matrix of a lead borate glass. The glass amounts to from 20 to 60% by weight. The simple method of making the thermistor may include the selective application of heat to the electrode regions to avoid oxidizing the base metal leads. These thermistors are capable of undergoing many self-heating switching operations in service without deterioration of the lead to body connections.

Abstract: A novel humidity sensor printed and fired on a dielectric substrate comprising an interdigitated pattern of a conductive precious metal with cobalt oxide as the only binder. Sensors according to the invention may be employed as hermeticity detectors in semiconductor packages.

Abstract: A potentiometer including a resistance track and a wiper element adapted for relative movement with respect thereto includes first, second and third terminals connected respectively to each end of the resistance track and to the wiper element. The potentiometer further includes conductive means to effectively reverse the electrical positions of the terminals connected to either end of the resistance track.

Abstract: An electric resistance heating element, comprising at least two elongated dielectric bodies, each having a plurality of openings extending longitudinally thereon in radially displaced, parallel relation. Three metal pins fit into openings in the dielectric bodies and at least certain maintain the latter in longitudinally aligned relation. A resistance wire is wound on each of the bodies, each wire having longitudinally spaced terminals. One of the terminals of each resistance wire is electrically connected to one pin; the opposite terminal of one resistance wire is electrically connected to a second pin; and the opposite terminal of the other resistance wire is electrically connected to the third pin, whereby the one pin serves as a common electrical connection for both resistance wires, and the second and third pins serve as separate electrical connections to the respective resistance wires, whereby separate electrical circuits may be established within the heating element.

Abstract: A method of assembling a temperature responsive resistance member within a pair of separable housings. This method includes the steps of: mounting the temperature responsive resistance member in both supporting engagement and electrical contacting engagement between a pair of electrical terminals; and joining the separable housings against displacement so that the temperature responsive resistance member in both the supporting engagement and the electrical contacting engagement with the terminals is disposed within the housings in predetermined spaced relation therewith with portions of the terminals extending exteriorly of the housings.

Abstract: A row of thick-film resistors connected by thick-film conductors on a ceramic substrate are suitably powered to form a thermal printing head. Thermally-sensitive paper is placed in intimate contact with the resistors, some of which are heated to a temperature sufficient to cause a color change in the paper to thereby produce a corresponding array of dots. The paper is moved across the printing head in incremental steps, forming other arrays of dots. The dots combine to form alphanumeric characters.

Abstract: A process for establishing gold contact studs on thin film circuits consists in localized sublayer deposition of a platinum-gold alloy followed by subsequent electrolytic gold thickening of the studs. The studs so produced are particularly fit for thermocompression interconnection.

Abstract: The specification discloses a continuous composite web from which electrical low temperature heating mats can be produced by transverse cutting at certain positions and possibly by effecting an edge insulation and attaching electrical connections. A method for the production of such webs is also disclosed. The web consists of resistance foil material between two insulating foil layers which are joined in the areas of direct contact to secure the resistance foil. The resistance foil material is in the form of parallel, continuous, longitudinal strips and transverse strips extending transversely to said longitudinal strips at desired intervals and connected thereto to form electrical connections between two and two adjacent foil strips.

Abstract: An electric heater plate is disclosed comprising a sheet of tempered glass with a metallized aluminum circuit extending over the face thereof for carrying an electrical heating current. At the terminals of the metallized aluminum circuit there is provided a terminal area of silver between the glass and the metallized aluminum coating, which silver terminals are each exposed through a small opening in the metallized aluminum coating such that lead wires may be soldered to the silver through said openings.

Abstract: A method for making a heavy duty PTC resistor with a pressed and sintered hollow cylindrical body of a ceramic composition which has two end faces in a radial plane with a connection contact on each end face.

Abstract: The hot resistance of ceramic positive temperature coefficient resistors is stabilized by subjecting such resistors to a heat treatment over a period of time ranging from 1 to 40 hours at a temperature in the range of 400.degree. to 500.degree. C., either during or after the application of contact coatings on the resistor.