Means To Assemble Electrical Device Patents (Class 29/729)
  • Patent number: 8561288
    Abstract: Some embodiments include a connection device for electrically coupling an electrical device to a test system. The connection device can include at least one suction cup configured to be coupled to the electrical device, spring loaded connector pins configured to electrically couple the electrical device to the test system, and a support frame coupled to the at least one suction cup and the spring loaded connector pins. The at least one suction cup can include three suction cups including a first suction cup, a second suction cup, and a third suction cup, and the support frame can include a first end coupled to the first suction cup, a second end opposite the first end and coupled to the second suction cup, and a third end between the first and second ends and coupled to the third suction cup. Other embodiments of related devices and methods are also described herein.
    Type: Grant
    Filed: March 1, 2012
    Date of Patent: October 22, 2013
    Assignee: Arizona Board of Regents, a body corporate of the State of Arizona, Acting for and on behalf of Arizona State University
    Inventor: Edward J. Bawolek
  • Patent number: 8561287
    Abstract: A tool for use in servicing an LPRM assembly of a nuclear reactor vessel includes a structural member having a first bore that is structured to receive an LPRM device associated with the LPRM assembly, a headpiece provided at a first end of the structural member, and a nut engaging assembly slideably mounted on the structural member. The headpiece has a plurality of projections structured to mate with a plurality of bores provided in a seal of the LPRM assembly to enable the seal to be removed, and the nut engaging assembly has a housing that defines a second bore and that has first and second nut engaging portions. The nut engaging assembly is free to slide along the structural member and over the headpiece to a position wherein the engaging portions extend beyond the headpiece so that they may be used to remove the assembly nut.
    Type: Grant
    Filed: May 6, 2010
    Date of Patent: October 22, 2013
    Assignee: Westinghouse Electric Company LLC
    Inventors: David P. Ketcham, Stafford L. Turner, Brian C. Campbell
  • Publication number: 20130269173
    Abstract: An apparatus comprising a robot; an end effector coupled to the robot and configured to grasp or transfer a probe of a size for use in a probe card; and instructions stored on a machine readable medium coupled to the robot, the instructions comprising to configure the robot to transfer a probe to a probe card substrate or, where the probe is attached to a probe card substrate, to move the probe. A method comprising automatically transferring a probe to a probe card substrate in an assembly process or, where the probe is attached to a probe card substrate, moving the probe in a repair process; and after transferring or moving the probe, heating the probe with a heat source.
    Type: Application
    Filed: December 30, 2011
    Publication date: October 17, 2013
    Inventors: Todd P. Albertson, David M. Craig, Anil Kaza, David Shia
  • Patent number: 8555487
    Abstract: Provided are an imaging device production system, an imaging device inspection system, and an imaging device inspection method. The imaging device production system includes a assembling process for assembling each components constituting an imaging device, an inspection process in which the imaging device assembled in he assembling process is continuously transferred without being stopped except for emergency when two inspection tasks adjacent to and different from each other are performed, and a packaging for packaging the imaging device which passes through the inspection tasks to confirm quality of the imaging device.
    Type: Grant
    Filed: June 12, 2009
    Date of Patent: October 15, 2013
    Assignee: LG Electronics Inc.
    Inventors: Myeong-Woo Kim, Jin-Sang Ah, Jae-Hyun Kim
  • Patent number: 8549736
    Abstract: A component fixing device includes a holding portion for holding a component with a hollow portion while restricting a movement of the component; and a fixed portion elastically connected to the holding portion and to be fixed to an object. The holding portion is inserted into the hollow portion of the component for holding the component. The holding portion may have a center holding portion abutting against an outer surface of the component and a pair of arm portions disposed at both sides of the center holding portion and capable of bending relative to the center holding portion, so that the center holding portion and the arm portions sandwich the component.
    Type: Grant
    Filed: September 15, 2010
    Date of Patent: October 8, 2013
    Assignee: Oki Data Corporation
    Inventors: Hidenori Ueda, Masato Yamazaki, Emiko Baba
  • Patent number: 8539668
    Abstract: An apparatus for manufacturing a temporary substrate includes a jig having a table, a holding guide for positioning constituent members of the temporary substrate, a holding unit for holding the laminated constituent members, and a heater unit for performing a temporary bonding on the laminated constituent members, and further includes a drive mechanism for moving each member constituting the jig between a standby position and an in-use position. The holding guide has a plurality of step portions formed in such a manner that peripheries of the step portions define areas corresponding to outer sizes of the respective constituent members when the holding guide is moved to the in-use position. The temporary substrate has as the constituent members, a prepreg, inner metal foils respectively stacked on both surfaces of the prepreg and each having a smaller outer size than the prepreg, and outer metal foils respectively stacked on the inner metal foils and each having a larger outer size than the prepreg.
    Type: Grant
    Filed: May 25, 2011
    Date of Patent: September 24, 2013
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Takeshi Okada, Kazuhiro Kobayashi
  • Publication number: 20130232771
    Abstract: The present invention relates to a method and system for repairing and refurbishing a microplate reader of the Flipr type which has a water cooled argon laser light source. The old laser is removed and replaced with a high power (300 to 500 mW) air cooled solid state laser as a replacement place on its own support and focused and wired to replace the old laser. The new product operates at lower power consumption yet provides accurate measurements.
    Type: Application
    Filed: April 26, 2013
    Publication date: September 12, 2013
    Inventor: Thomas Leen
  • Publication number: 20130219707
    Abstract: An insert apparatus for installing a transducer assembly in a sensor port of a flow cell is disclosed. The transducer assembly is installed in the cavity of the insert body without the use of glues or adhesives to bond the transducer assembly to the cavity.
    Type: Application
    Filed: February 29, 2012
    Publication date: August 29, 2013
    Applicant: General Electric Company
    Inventors: Lei Sui, Nicholas Joseph Mollo, Benjamin Edward McDonald, Toan Huu Nguyen, Solomon Feldman, Nicholas Anderson Hobbs, Ganesh Devkar, John Austin True, Mykhaylo Barsukov
  • Patent number: 8516681
    Abstract: In a loud speaker, the diaphragm has a protruded part protruding on a yoke side on the inside and in the vicinity of an inner coupling part as a coupled portion to a voice coil. The loud speaker can be manufactured with the voice coil accurately positioned with respect to a diaphragm, and the voice coil is accurately vibrated vertically inside a magnetic gap. The possibility of the voice coil coming into contact with a plate and a yoke as a magnetic circuit body of the loud speaker can be reduced, thereby to improve production efficiency and a yield at the time of manufacturing the loud speaker.
    Type: Grant
    Filed: October 20, 2009
    Date of Patent: August 27, 2013
    Assignee: Panasonic Corporation
    Inventors: Mitsukazu Kuze, Takehiko Tanabu, Satoshi Itoh, Masashi Kawabe, Mamiko Tsutsumi
  • Patent number: 8516687
    Abstract: A battery replacing apparatus includes a battery mount portion, vehicle hoist members, and a lifting-lowering means for lifting and lowering the battery mount portion. When attaching a battery unit to or detaching a battery unit from the battery support portion of an electric vehicle, the vehicle hoist members are moved together with the battery mount portion to be brought into contact with the vehicle body. The vehicle hoist members are formed like rods extending in the front-rear direction of the vehicle. The vehicle hoist members are arranged on the left and right sides of the battery unit placed on the battery mount portion. The battery unit is attached to the battery support portion of the vehicle or detached from the battery support portion from below.
    Type: Grant
    Filed: March 12, 2012
    Date of Patent: August 27, 2013
    Assignee: Kabushiki Kaisha Toyota Jidoshokki
    Inventors: Mamoru Hozumi, Yoshio Ojima, Takahiro Fukagawa, Takashi Murase
  • Patent number: 8516688
    Abstract: An assembly includes a cylindrical magnet assembly, which includes comprises at least one coil mounted on a former. The assembly also includes a bore tube with a number of radially-directed retaining protrusions formed in a material of the bore tube, each of the number of radially-directed retaining protrusions configured to bear against a periphery of a corresponding cavity in the former.
    Type: Grant
    Filed: September 14, 2012
    Date of Patent: August 27, 2013
    Assignee: Siemens Plc.
    Inventor: Russell Peter Gore
  • Patent number: 8505192
    Abstract: A manufacturing method of common mode filters and a structure of the same are revealed. A common mode choke layer is disposed over a composite substrate and a second magnetic material layer is coated on an upper surface of the common mode choke layer. The common mode choke layer is produced by a wafer-level electrode leading out method and having leading-out terminals on sides thereof. External electrodes are formed on sides of the common mode choke layer by partial cutting, sputtering, lithography and electroplating at wafer level and corresponding to the leading-out terminals. Thereby common mode filters produced are supported more stably. Moreover, the volume is minimized due to inductive coils and external electrodes connected by wafer level packaging. Thus the common mode filters are mass-produced, the cost is down and the defect rate is reduced.
    Type: Grant
    Filed: September 29, 2011
    Date of Patent: August 13, 2013
    Assignee: Advance Furnace Systems Corp.
    Inventor: Chung-Ming Chu
  • Patent number: 8505189
    Abstract: A manufacturing apparatus for a backlight unit includes a feed mechanism, a testing mechanism, and an attachment mechanism. The feed mechanism arranges a plurality of light-emitting diodes in a row. The testing mechanism tests the light-emitting diodes. The attachment mechanism positions the light-emitting diodes to a circuit board. The attachment mechanism comprises a support assembly and a laminating device, in which the support assembly receives the light-emitting diodes tested by the at least one testing unit, the support assembly is opposite to the circuit board, and the laminating device laminates the light-emitting diodes to the circuit board. A method for manufacturing the backlight unit is also provided.
    Type: Grant
    Filed: February 23, 2011
    Date of Patent: August 13, 2013
    Assignees: Innocom Technology (Shenzhen) Co., Ltd., Chimei InnoLux Corporation
    Inventors: Gang-Tao Gu, Zhong-Hai Xiao, Min-Cheng Wang
  • Publication number: 20130199031
    Abstract: An improved field emission system and method is provided that involves field emission structures having electric or magnetic field sources. The magnitudes, polarities, and positions of the magnetic or electric field sources are configured to have desirable correlation properties, which may be in accordance with a code. The correlation properties correspond to a desired spatial force function where spatial forces between field emission structures correspond to relative alignment, separation distance, and the spatial force function.
    Type: Application
    Filed: December 18, 2012
    Publication date: August 8, 2013
    Applicant: Correlated Magnetics Research, LLC
    Inventor: Correlated Magnetics Research, LLC
  • Publication number: 20130199019
    Abstract: A catheter is provided for medical ultrasound imaging that can be effectively used in combination with other imaging modalities to detect medical structures of interest as well as the catheter. Markers are added to the catheter with precision, which provides a means to merge the images from different modalities. Using a template, apertures for marker placement are formed in the catheter after creating the catheter housing. The ultrasound array may be used for accurate positioning of the template. Alternatively or additionally, a rigid insert with markers connects with the array. The insert holds the markers in place and may reduce artifacts in ultrasound scanning due to flexing of the array.
    Type: Application
    Filed: February 8, 2012
    Publication date: August 8, 2013
    Applicant: Siemens Medical Solutions USA, Inc.
    Inventors: Lex J. Garbini, Wilko Gerwin Wilkening, Ricardo Espinosa
  • Patent number: 8499438
    Abstract: An apparatus for joining a wire pair of a stator coil. The apparatus includes a tool having a pair of electrodes and control equipment. The control equipment is configured to control the electrodes to apply force to the wire pair to push adjacent wires of the wire pair toward each other and cause current to pass between the pair of electrodes, and so through the wire pair pushed together, at a time at which the force is being applied to the wire pair.
    Type: Grant
    Filed: February 28, 2011
    Date of Patent: August 6, 2013
    Assignee: GM Global Technology Operations LLC
    Inventors: John S. Agapiou, John Patrick Spicer, Stephen R Smith, Jeffrey A Abell
  • Patent number: 8499437
    Abstract: A device for aligning a LCD panel having circuit elements with driver circuit card assemblies, consisting of retractable pins located around a central platform. The retractable pins extend in order to receive the LCD panel and circuit element assembly and hold it in place as the circuit elements are aligned with driver circuit card assemblies. Once aligned, the drivers and LCD panel can be bonded together. Once bonded, the pins are retracted and the LCD panel and driver assembly is released. The present invention also relates to a method of aligning LCD panels and drivers using retractable pin tools.
    Type: Grant
    Filed: March 27, 2008
    Date of Patent: August 6, 2013
    Assignee: American Panel Corporation
    Inventor: Ware Bedell
  • Publication number: 20130192060
    Abstract: Provided is an electric bus battery exchange station. The electric bus battery exchange station according to the present invention includes: an exchange station body having a battery exchange, wherein said battery exchange unit is projected out to be connected with a hole of; an imaging unit taking images of the electric bus moving toward said exchange station body; an entry process storing unit storing entry process information needed in order that the electric bus is positioned exactly below the battery exchange unit; an entry information output unit comparing an entry state of the electric bus obtained from images taken by said imaging unit with the entry information stored, and outputting entry information for modifying the entry state of the electric bus to make equal to said entry process information; and an entry information providing unit providing information outputted by said entry information output unit to the electric bus.
    Type: Application
    Filed: July 1, 2012
    Publication date: August 1, 2013
    Applicants: Industry-University Cooperation Foundation of Korea Aerospace University, Kookmin University Industry Academy Cooperation Foundation
    Inventors: Jun Seok Park, Won-Kyu Kim, Won-Jae Jung
  • Publication number: 20130178081
    Abstract: A signal connector anti-theft device set includes a cap, a rotating member defining multiple through holes and rotatably set in the cap, a locking member abutted against the rotating member in the cap and having a driven structure facing toward the through holes of the rotating member, and a hand tool having a working tip for rotating the rotating member into accurate alignment with the driven structure of the rotating member and then inserting through the through holes of the rotating member into the driven structure to rotate the locking member between a locking position and an unlocking position.
    Type: Application
    Filed: January 10, 2012
    Publication date: July 11, 2013
    Applicant: EZCONN CORPORATION
    Inventor: Cheng-Hui WANG
  • Publication number: 20130176696
    Abstract: An attachment mechanism for an electronic component includes a circuit board and a fastener. A first connector is fastened to the circuit board to be connected to a second connector of the electronic component. The first connector includes a mounting portion fastened to the circuit board and a main body on a top of the mounting portion. The fastener includes an engaging portion and a rotating portion rotatably connected to a first end of the engaging portion. The engaging portion sandwiches the main body. The rotating portion includes a top wall and two abutting walls extending from opposite ends of the top wall to abut a top of the main body. One of the abutting walls is rotatably connected to the first end of the engaging portion. A stop wall extends from the other abutting wall to be detachably connected a second end of the engaging portion.
    Type: Application
    Filed: May 4, 2012
    Publication date: July 11, 2013
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: ZHENG-HENG SUN
  • Publication number: 20130167361
    Abstract: When a connected position detecting unit detects that a connected position of a tape reaches a predetermined position in the tape passage, head-feeding of an electronic component provided in a head of the connected new tape is provided. In the head-feeding, a tape feeder feeds the tape such that the electronic component in the head of the new tape is located in a component pickup port. When the connected position detecting unit detects that the connected position of the tape reaches the predetermined position in the tape passage, a mounting head picks up the electronic component from the new tape fed by the head feeding control unit and is mounted on a new board positioned by a board conveying path.
    Type: Application
    Filed: August 23, 2011
    Publication date: July 4, 2013
    Applicant: PANASONIC CORPORATION
    Inventors: Teppei Kawaguchi, Michiaki Mawatari
  • Publication number: 20130167368
    Abstract: An assembly structure for carrying an electronic element and assisting in assembling or detaching the electronic element to or from a connector of an electronic device includes a base, a support and a hand-held element. The base disposed on the electronic device has a limiting part and an auxiliary part. The support used to carry the electronic element has an alignment part. When the support is mounted on the base, the alignment part is opposite to the limiting part, so that the alignment part is able to move within the limiting part. The hand-held element pivotally connected to the support has a hand-held part and a recess part. When the support is mounted on the base, the recess part is disposed across the auxiliary part. The support is moved with respect to the base, and two ends of the recess part contact against the auxiliary part.
    Type: Application
    Filed: December 27, 2012
    Publication date: July 4, 2013
    Applicant: PEGATRON CORPORATION
    Inventor: PEGATRON CORPORATION
  • Publication number: 20130170242
    Abstract: The present disclosure provides an apparatus, a system and a method for a rear windshield for a vehicle, comprising an integral backlight having a combined surface, wherein the combined surface has an internal surface and an external surface, a plurality of illumination source disposed in a predefined pattern over the combined surface, a conductive grid disposed uniformly on the combined surface, and an apparatus capable of receiving signals disposed on the combined surface.
    Type: Application
    Filed: January 2, 2013
    Publication date: July 4, 2013
    Applicant: TATA TECHNOLOGIES PTE LTD
    Inventor: TATA TECHNOLOGIES PTE LTD
  • Patent number: 8468672
    Abstract: A method for orienting a surface sensing device (SSD) uses an apparatus having a support attachable to a moveable arm of a machine, such as a coordinate measuring apparatus. The support includes a first member rotatable about a first axis of rotation and a SSD for sensing the surface of a workpiece; the SSD is releasably connectable to the first member for rotation therewith. The method includes the steps of disconnecting a SSD from a support, the SSD being connected to the support in a first orientation; rotating one of the SSD and the support relative to the other of the SSD and the support and reconnecting the SSD and the support into a second orientation. An apparatus for orienting a surface sensing device is further described.
    Type: Grant
    Filed: March 5, 2009
    Date of Patent: June 25, 2013
    Assignee: Renishaw PLC
    Inventor: David Sven Wallace
  • Patent number: 8468685
    Abstract: A wire forming device for applying a paste material on an insulating substrate to form a wiring pattern. The wire forming device includes a paste material application unit which includes an atomizing unit atomizing the paste material and a nozzle spraying the atomized paste material onto the insulating substrate. The atomizing unit includes: a medium supplying portion which mixes a medium with a carrier gas to form a mixed gas and an atomizing portion. The atomizing portion holds the paste material and brings the mixed gas into contact with the paste material to atomize the paste material, thereby making a mist stream of the mixed gas and the paste material as the atomized paste material fed to the nozzle. The wire forming further includes a mixing ratio adjusting unit adjusting a mixing ratio of the paste material to the mixed gas in the mist stream.
    Type: Grant
    Filed: December 15, 2011
    Date of Patent: June 25, 2013
    Assignee: Kabushiki Kaisha Nihon Micronics
    Inventors: Katsumi Tanaka, Kenichi Shinozaki, Tetsuya Okumura, Makoto Kikuta, Masami Sano, Taro Mogi
  • Patent number: 8458896
    Abstract: A robotic end-effector for high-speed precision alignment and assembly of of a spacer ring onto a motor-hub assembly has a holding device operable for temporarily holding the spacer ring. The spacer ring is to be aligned and assembled to the motor-hub assembly. The robotic end-effector has a course alignment device operable for locating the holding device with respect to a locating feature that is coupled with the motor-hub assembly. The robotic end-effector has a retractor operable for disengaging the course alignment device from the locating feature. The robotic end-effector has a moveable base whereby lateral compliance is provided for the holding device, enabling motion of the spacer ring with respect to the motor-hub assembly, thereby enabling fine alignment of the spacer ring with the motor-hub assembly when the spacer ring touches the motor-hub assembly.
    Type: Grant
    Filed: November 25, 2008
    Date of Patent: June 11, 2013
    Assignee: HGST Netherlands B.V.
    Inventors: Nagappan Chandrasekaran, Ching Keat Tay, Qihong Wang
  • Publication number: 20130140099
    Abstract: A battery unit mounting apparatus for an electric vehicle includes four or more fixing portions configured to be provided at the bottom of an electric vehicle and four or more corresponding portions-to-be-fixed on a battery unit. When the battery unit is raised toward the vehicle, the battery unit mounting apparatus causes each fixing portion to be engaged with the corresponding one of the portions-to-be-fixed. There is a first group, formed by three of the fixing portions and corresponding three of the portions-to-be-fixed, and a second group, formed by the remaining one or more of the fixing portions and the remaining one or more of the portions-to-be-fixed. The fixing portion and the portion-to-be-fixed in the second group are configured to be engaged with each other after the fixing portions and the portions-to-be-fixed in the first group are engaged.
    Type: Application
    Filed: December 4, 2012
    Publication date: June 6, 2013
    Applicant: KABUSHIKI KAISHA TOYOTA JIDOSHOKKI
    Inventor: KABUSHIKI KAISHA TOYOTA JIDOSHOKKI
  • Publication number: 20130133189
    Abstract: A robot system according to an aspect of an embodiment includes a supply unit and a robot. The supply unit is fixedly provided at a predetermined position to supply a feed material that is used for processing a workpiece. The robot transfers the unprocessed workpiece handed from an operator at a predetermined transfer position to the vicinity of the supply unit to process the workpiece by using the feed material supplied from the supply unit and then transfers the processed workpiece to the transfer position.
    Type: Application
    Filed: April 17, 2012
    Publication date: May 30, 2013
    Applicant: KABUSHIKI KAISHA YASKAWA DENKI
    Inventors: Katsunori Urabe, Takashi Shiino, Keigo Ishibashi, Toshiyuki Harada
  • Publication number: 20130127879
    Abstract: This disclosure provides systems, methods and apparatus for glass-encapsulated pressure sensors. In one aspect, a glass-encapsulated pressure sensor may include a glass substrate, an electromechanical pressure sensor, an integrated circuit device, and a cover glass. The cover glass may be bonded to the glass substrate with an adhesive, such as epoxy, glass frit, or a metal bond ring. The cover glass may have any of a number of configurations. In some configurations, the cover glass may partially define a port for the electromechanical pressure sensor at an edge of the glass-encapsulated pressure sensor. In some configurations, the cover glass may form a cavity to accommodate the integrated circuit device that is separate from a cavity that accommodates the electromechanical pressure sensor.
    Type: Application
    Filed: November 18, 2011
    Publication date: May 23, 2013
    Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.
    Inventors: David William Burns, Philip Jason Stephanou, Ravindra V. Shenoy, Kurt Edward Petersen
  • Publication number: 20130126210
    Abstract: A method for forming a cover assembly on an electrical power transmission cable includes: mounting a tubular cover member around the cable such that a portion of the cover member defines a cavity surrounding the cable; providing a flowable electrical stress grading material in the cavity; and applying a vacuum to the cavity to evacuate air from the cavity and compact the electrical stress grading material in the cavity.
    Type: Application
    Filed: November 23, 2011
    Publication date: May 23, 2013
    Inventor: Ladislaus Kehl
  • Patent number: 8436779
    Abstract: The present invention is an apparatus operable to align an antenna and to retain the antenna in a reference position during alignment of the antenna. The apparatus may include a bracket having an arm attached thereto, and the arm conforms to the back wall of an antenna. An engagement means and/or securing means may be incorporated in the apparatus to retain the position of the antenna in a fixed or removeable connection with the apparatus. An alignment device being operable to align the antenna may be attached to the bracket. The apparatus of the present invention may be arranged or otherwise positioned in accordance with a reference position. Said reference position may be defined as a position that is selected in reference to a reference point, line, or plane of the antenna. The apparatus may retain the antenna in a reference position during alignment of the antenna.
    Type: Grant
    Filed: March 18, 2011
    Date of Patent: May 7, 2013
    Inventors: Bruce Kenneth Clifford, Mark Frischman
  • Publication number: 20130106553
    Abstract: An integrated circuit is disclosed. The integrated circuit includes a primary coil. The integrated circuit also includes a first secondary coil that acts as a first transformer with the primary coil. The integrated circuit further includes a second secondary coil that acts as a second transformer with the primary coil. The primary coil, the first secondary coil and the second secondary coil have a layout on the integrated circuit to minimize coupling between the first secondary coil and the second secondary coil.
    Type: Application
    Filed: January 23, 2012
    Publication date: May 2, 2013
    Applicant: QUALCOMM INCORPORATED
    Inventors: Young Gon Kim, Hong Sun Kim
  • Publication number: 20130091698
    Abstract: A transfer tool is disclosed for clamping a disk drive suspension to an actuator arm. The transfer tool comprises a first actuator operable to actuate at least one push pin to compress a spring of a suspension clamp, and a second actuator operable to actuate a driving pin, wherein the driving pin for rotating a latching member of the suspension clamp about a pivot.
    Type: Application
    Filed: October 14, 2011
    Publication date: April 18, 2013
    Applicant: WESTERN DIGITAL TECHNOLOGIES, INC.
    Inventors: WALTER G. BANSHAK, JR., MARK S. SEYMOUR, MITCHELL D. DOUGHERTY, GEOFFREY A. HALES
  • Patent number: 8421218
    Abstract: A structure for attaching a heat sink to an integrated circuit chip includes a servo control system and at least one voice coil motor for actuating the heat sink.
    Type: Grant
    Filed: January 3, 2011
    Date of Patent: April 16, 2013
    Assignee: International Business Machines Corporation
    Inventor: Timothy J Chainer
  • Publication number: 20130077814
    Abstract: Seamless headsets and related systems and methods of manufacture are provided. In this regard, a representative headset includes: an earpiece assembly having a ribbon cable portion and an earpiece portion; the ribbon cable portion having a body and multiple elongated conductors, the body being formed of electrically insulating material; the earpiece portion extending from a distal end of the body, the earpiece portion being configured as a contiguous extension of the insulating material of the body such that the earpiece assembly exhibits a seamless transition from the ribbon cable portion to the earpiece portion.
    Type: Application
    Filed: December 14, 2011
    Publication date: March 28, 2013
    Applicant: HTC CORPORATION
    Inventor: Shawn M. Stephenson
  • Publication number: 20130076612
    Abstract: A consumer electronic product includes at least a transparent housing and a flexible display assembly enclosed within the transparent housing. In the described embodiment, the flexible display assembly is configured to present visual content at any portion of the transparent housing.
    Type: Application
    Filed: September 26, 2011
    Publication date: March 28, 2013
    Applicant: Apple Inc.
    Inventor: Scott A. MYERS
  • Publication number: 20130077815
    Abstract: Headsets with multi-color ribbon cable and related systems and methods of manufacture are provided. A representative audio headset includes: a ribbon cable having a body and multiple elongated conductors, the body being formed of electrically insulating material and extending between a connector end an earpiece end, the body having a first side and an opposing second side, the insulating material exhibiting a first color, the multiple elongated conductors being embedded in the body; a connector attached to the connector end and electrically coupled to the conductors; an earpiece connected to the earpiece end and electrically coupled to the conductors; and dye bonded with the insulating material at the second side of the body such that the second side of the body exhibits a second color different from the first color.
    Type: Application
    Filed: March 21, 2012
    Publication date: March 28, 2013
    Applicant: HTC CORPORATION
    Inventor: Shawn M. Stephenson
  • Patent number: 8397376
    Abstract: A smart card processing system for processing a plurality of smart card portions on a smart card panel substantially simultaneously. The system may include a transfer member for moving card panels. Smart card panels may be loaded into an input magazine capable of elevating the panels with respect to a processing station. A transfer member may transport smart card panels from the input magazine to the processing station wherein one or more pre-personalization operations may be conducted. The transfer member may also be operative to move the smart card panels from the processing station to a marking station such that defective smart portions may be marked. The transfer may also move panels from the marking station to an output magazine. The output magazine may lower the smart card panels with respect to the marking station to accommodate more initiated smart card panels.
    Type: Grant
    Filed: August 26, 2010
    Date of Patent: March 19, 2013
    Assignee: CPI Card Group—Colorado, Inc.
    Inventors: Guy S. Meeker, Francisco Pezzuti, Bryan Kingston
  • Patent number: 8393074
    Abstract: A method of manufacturing a thermally-assisted magnetic recording head includes: providing a light source unit including a laser diode; providing a slider having a thermally-assisted magnetic recording head section thereon, the thermally-assisted magnetic recording head section including a magnetic pole, an optical waveguide, and a plasmon generator, the magnetic pole and the optical waveguide both extending toward an air bearing surface, the plasmon generator being located between the magnetic pole and the optical waveguide; driving the laser diode to allow a light beam to be emitted therefrom, the light beam including both a TE polarization component and a TM polarization component; performing an alignment between the light source unit and the thermally-assisted magnetic recording head section, based on a light intensity distribution of the TE polarization component in the light beam which has been emitted from the laser diode and then passed through the optical waveguide; and bonding the light source unit
    Type: Grant
    Filed: October 6, 2011
    Date of Patent: March 12, 2013
    Assignees: TDK Corporation, Sae Magnetics (H.K) Ltd.
    Inventors: Seiichi Takayama, Koji Shimazawa, Shinji Hara, Yasuhiro Ito, Nobuyuki Mori, Ryo Hosoi, Kazuaki Takanuki, Youichi Ando, Chimoto Sugiyama
  • Publication number: 20130055561
    Abstract: A method for manufacturing a head suspension is capable of suppressing the dispersion in the vibration control effect of a head suspension and improve productivity, the manufacturing method includes a step of punching, by use of a hollow punch having a tooth portion at a distal end thereof, a vibration damper piece out from a base material having a vibration damper provided detachably on a liner through an attaching surface, to hold the vibration damper piece on a hollow internal surface of the punch, a step of positioning the punch holding the vibration damper piece on an objective portion of a semi-finished head suspension, and a step of attaching, by use of an extruding implement, the vibration damper piece on the objective portion with the attaching surface through extruding the vibration damper piece from the punch.
    Type: Application
    Filed: March 1, 2012
    Publication date: March 7, 2013
    Applicant: NHK SPRING CO., LTD.
    Inventors: Kunihiro TSUTSUMI, Tsuyoshi Amemiya
  • Patent number: 8387234
    Abstract: A multi-turn coil device comprising a flexible circuit board and a plurality of serially electrically coupled coils coupled to both sides of the flexible circuit board. The coils are formed such that when the circuit board is folded in an accordion manner, the coils are substantially aligned and have the same direction of current flow. The coils are serially coupled sequentially from front to back and back to front wherein the coupling of the coils is through a plated through hole in the flexible circuit board.
    Type: Grant
    Filed: November 5, 2010
    Date of Patent: March 5, 2013
    Assignee: Flextronics AP, LLC
    Inventor: Bruce D. Olson
  • Patent number: 8387233
    Abstract: A circuit board assembling system includes a circuit board whereon a slot is formed. The circuit board includes a first region and a second region. The circuit board assembling system further includes a component placement machine, a positioning rod, wherein a first width of the unadjusted positioning rod is larger than a width of the slot so that the unadjusted positioning rod can not pass through the slot, a conveying device for driving the circuit board to a positioning point in a first direction and driving the circuit board to an assembling position in a second direction, and a control unit for controlling the conveying device to drive the circuit board to the assembling position in the second direction and controlling the component placement machine to assemble a first component set and a second component set on the first region and the second region respectively.
    Type: Grant
    Filed: January 27, 2010
    Date of Patent: March 5, 2013
    Assignee: Wistron Corporation
    Inventors: Jun-Min Yang, Hao-Chun Hsieh, Hsin-Lun Tsai, Chia-Hsien Lee
  • Patent number: 8389057
    Abstract: The present invention discloses systems and methods for printing functional blocks from a plurality of printheads to a target substrate. In exemplary embodiments, the printing system comprises a main printhead for the majority of printing process, and a secondary printhead for supplemental printing. The system further comprises a controller, utilizing a positioning intelligence system to distribute the printing of the functional blocks between the main printhead and the secondary printhead, to minimize the motions of the printheads while maximize the printing speed.
    Type: Grant
    Filed: April 6, 2009
    Date of Patent: March 5, 2013
    Inventors: Douglas Knox, Jayna Sheats, Ric Asselstine
  • Publication number: 20130050155
    Abstract: This disclosure provides systems, methods and apparatus for glass packaging of integrated circuit (IC) and electromechanical systems (EMS) devices. In one aspect, a glass package may include a glass substrate, a cover glass, one or more devices encapsulated between the glass substrate and the cover glass, and bond pads configured to attach to a flexible connector and in electrical communication with an encapsulated device. In some implementations, a flexible connector may be used to electrically connect a device within the glass package to an electrical component, such as an integrated circuit (IC) device or PCB, outside the glass package.
    Type: Application
    Filed: August 30, 2011
    Publication date: February 28, 2013
    Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.
    Inventors: Kurt Edward Petersen, Ravindra V. Shenoy, Justin Phelps Black, David William Burns, Srinivasan Kodaganallur Ganapathi, Philip Jason Stephanou, Nicholas Ian Buchan
  • Publication number: 20130042469
    Abstract: Certain embodiments described herein are directed to inserts and ion sources. In some examples, an insert can comprise a positioning guide configured to provide for visual positioning of a chromatography column under the positioning guide. In other examples, an ion source configured with an aperture to couple to a carrier tube to render the ion source non-removable from an instrument housing when the carrier tube is coupled to the ion source is described.
    Type: Application
    Filed: July 17, 2012
    Publication date: February 21, 2013
    Inventors: Keith Ferrara, Rosario Mannino, Timothy Neal, Gregory Hanlon
  • Patent number: 8376064
    Abstract: An apparatus and method for quick release of a spinner head assembly of a cotton candy machine. The spinner head is snap-fit to the rotational output shaft of the motor of the cotton candy machine to prevent longitudinal separation between the two during operation. Intermeshing portions between the spinner head and the output shaft are configured to translate rotational torque between the two and thus translate rotational torque of the output shaft of the motor to the spinner head. Quick release of the head is possible by pulling on the head along the rotational axis of the output shaft to overcome the snap-fit. This allows longitudinal separation of the spinner head and disengages the intermeshing portions for complete removal of the head. Reattachment is possible by snap-fitting connection between head and output shaft.
    Type: Grant
    Filed: January 21, 2010
    Date of Patent: February 19, 2013
    Inventors: David Swegle, Liansuo Xie
  • Publication number: 20130038783
    Abstract: A camera module includes an imaging sensor, a conductive member, a plate-like member, and a sealing member. The imaging sensor includes a light-receiving surface configured to receive light gathered by a lens unit, the lens unit including a lens and a drive section driving the lens. The conductive member is connected to the drive section for supply of power to the drive section. The plate-like member is provided with the imaging sensor and the conductive member. The sealing member is formed by sealing the imaging sensor and the conductive member, the conductive member being exposed at a connection part for connection to the drive section, the imaging sensor being exposed at the light-receiving surface.
    Type: Application
    Filed: August 2, 2012
    Publication date: February 14, 2013
    Applicant: Sony Corporation
    Inventors: Masahiko Shimizu, Toshiaki Iwafuchi
  • Publication number: 20130031776
    Abstract: A toolbox device for actuating locking and/or unlocking of a power battery of a drive motor of a motor vehicle, the device including a supporting structure supporting a plurality of separate modules, each including at least one system for gripping a mechanism for locking/unlocking the battery and at least one actuator, a number of actuators being relative to a number of movements to be performed to implement the locking/unlocking the battery.
    Type: Application
    Filed: February 9, 2011
    Publication date: February 7, 2013
    Applicant: RENAULT s.a.s.
    Inventors: Bruno Escande, Charles Lombarte
  • Publication number: 20130026896
    Abstract: An assembly structure includes a panel installing member, a back cover, a first frame component and a second frame component. The panel installing member is used for holding a first panel module, and a plurality of assembly holes is formed on the panel installing member. The back cover includes a plurality of posts, and each of the posts is disposed through the corresponding assembly hole. The first frame component is installed on the back cover for being selectively fixed on a side of the panel installing member or on a side of a second panel module. The second frame component is installed on the back cover for being selectively fixed on another side of the panel installing member or on another side of the second panel module, so as to fix the first panel module or the second panel module on the back cover cooperatively with the first frame component.
    Type: Application
    Filed: March 7, 2012
    Publication date: January 31, 2013
    Inventors: Shou-Lun Chang, Feng-Yun Wu
  • Publication number: 20130016024
    Abstract: A wideband antenna system with multiple antennas and at least one parasitic element is disclosed. In an exemplary design, an apparatus includes a first antenna, a second antenna, and a parasitic element. The first antenna has a shape of an open-ended loop with two ends that overlap and are separated by a gap. The second antenna may also have a shape of an open-ended loop with two ends that overlap and are separated by a gap. The parasitic element is located between the first and second antennas. The first and second antennas may be placed side by side on a board, located at either the top end or the bottom end of a wireless device, and/or formed on opposite sides (e.g., the front and back sides) of the board. The parasitic element may be formed on a plane that is perpendicular to the plane on which the first and second antennas are formed.
    Type: Application
    Filed: July 13, 2011
    Publication date: January 17, 2013
    Applicant: QUALCOMM INCORPORATED
    Inventors: Guining Shi, Allen Minh-Triet Tran, Elizabeth M. Wyrwich