Abstract: A plurality of indicated back-up pin devices are detachably placed on a back-up plate provided on a component mounting apparatus, to a plurality of indicated positions of the back-up plate to support a board from an under surface thereof, to which already mounted components have been mounted, when another components are to be mounted on an upper surface of the board. The back-up pin device comprises a base portion detachably placed on the back-up plate, at least one support pin erected upright on the base portion to support the board by contacting an upper end thereof with an under surface of the board and at least one of an identification mark for identifying the type of the back-up pin device and a position mark as a reference to determine a position of the base portion on the back-up plate, which is provided on the base portion.

Abstract: Disclosed is an electronic component mounting line on which a substrate undergoes solder paste printing, electronic component placements, and then reflow, while being moved from upstream to downstream.

Abstract: A method for controlling a board stopping position includes a calculation step for calculating an extended length of the electronic component mounted on the board and extended from the board end portion in the transfer direction by one of the electronic component mounting machines; and a correcting and stopping step for correcting a stopping timing of the conveyer belt to be stopped in response to the detection signal which is outputted from the board sensor and stopping the board at the mounting position, based on the calculated extended length of the electronic component in a subsequent stage electronic component mounting machine arranged subsequent to the one of the electronic component mounting machines.

Abstract: An object of the invention is to provide an electronic component mounting system and an electronic component mounting method which can execute component mounting work on a plurality of boards simultaneously, concurrently and efficiently so that high productivity and responsiveness to production of many items can be achieved consistently.

Abstract: A display device includes an upper substrate on a lower substrate, a driver integrated chip (IC) on the lower substrate, the driver IC and upper substrate contacting different parts of the lower substrate, a plurality of bumper units along edges of the driver IC, and a deformation preventing bumper unit between the bumper units, the deformation preventing bumper unit being configured to prevent the driver IC from being deformed.

Abstract: Electronic components each having a chip module with module contacts and an antenna having antenna contacts is made by securing a plurality of the chip modules the inner face of a module film strip having an outer periphery projecting past the chip module with the chip modules spaced from one another at a uniform predetermined module spacing. A plurality of the antennas are secured to an inner face of an elongated antenna strip with the antennas spaced from one another by a predetermined antenna spacing. The module strip is longitudinally subdivided into sections each of which is of a length equal to the predetermined module spacing and each of which carries a respective chip module. The module-strip sections are pressed against the antenna strip such that the module contacts of each of the chip modules engage and bear on the antenna contacts of a respective antenna.

Abstract: A component supplying apparatus which is appended to the electronic component working apparatus, for supplying electronic components to the electronic component working apparatus is provided. The component supplying apparatus includes a component storing section which stores the electronic components, and movement range regulator. The movement range regulator allows the component storing section to move between a supply position P1 which is set for supplying the electronic components and a retracted position P2 to which the component storing section is retracted for the purpose of maintenance of the electronic component working apparatus. In addition, the movement range regulator regulates the range of relative movement of the component storing section with respect to the electronic component working apparatus to a movement amount L4 that is previously established.

Abstract: A method is provided for determining a sequence of mounting a plurality of components on a board by using variable pitch heads having a plurality of pitches. The method includes: partitioning the board into a plurality of sectors, each of the sectors including a plurality of mounting points arranged in parallel with a direction in which the heads are arranged; dividing the board into a plurality of sub-boards including first sub-boards based on the sectors, each of the first sub-boards including as many mounting points as the heads; and determining a combination of a sequence of mounting the components on the board and at least one pitch among the pitches required to mount the components on the board in a shortest time, compared to another sequence or other sequences of mounting the components on the board and another pitch or other pitches among the pitches, based on the first sub-boards.

Abstract: An apparatus and method for aligning one or more components while attaching the component to a substrate. The component is positioned over the substrate. An alignment tool is attachable to the component. The alignment tool includes a tool alignment element, an optical tool, and a substrate alignment element attached to the substrate. The tool alignment element aligns with the substrate alignment element such that the components are positioned at specified locations on the substrate for attachment to the substrate. Further, in the method according to the disclosure, the tool alignment element aligns with the substrate alignment element to position one or more components at a specified location on the substrate.

Abstract: In an operation performing step which performs operations associated with the device type changing by operating operation switches such as a “file operation” (35e) which are displayed by selecting a “device type changing” (33c) which is displayed in an operation screen (30) on an operation panel, when a non-object mounting lane except an operation object performs operation actions, the inputting of the operations with the operation switches is permitted and the inputting of the operations with a lane specifying switch (36) is prohibited so that a second mounting lane (L2) which is producing will not become an object of the inputting of operations.

Abstract: An image taking system including: (a) a CMOS or CCD image sensor; (b) an interest-region setter configured to set regions of interest within an image taking area of the image sensor; (c) an acquiring-condition determiner configured to determine an image-data acquiring condition required for acquiring at least two image data generated in at least two of the regions of interest; and (d) an image-data acquirer configured to acquire the at least two image data. The acquiring-condition determiner includes an exposure-time determining portion configured to determine, as the image-data acquiring conditions, at least two different exposure times required for acquiring the at least two image data generated in the at least two regions of interest. The image-data acquirer includes an exposure-time-based-image-data acquiring portion configured to acquire the at least two image data, such that the acquired at least two image data are based on the at least two different exposure times.

Abstract: An apparatus 200 for delivering semiconductor components 212 to a substrate 206a; 206b; 500a; 500b; 500c during semiconductor package manufacturing. The apparatus 200 comprises a platform 216 and a plurality of delivery modules 202a, 202b affixed to the platform 216. Each of the plurality of delivery modules 202a, 202b has a support device 204a; 204b for supporting the substrate 206a; 206b; 500a; 500b; 500c, as well as a delivery device 208a; 208b for delivering the semiconductor components 212 to the substrate 206a; 206b; 500a; 500b; 500c. In particular, heights of the support devices 204a, 204 are mutually leveled for conveying the substrate 206a; 206b; 500a; 500b; 500c between the plurality of delivery modules 202a, 202b.

Abstract: In a component mounting apparatus, when one of first and second board transfer devices is performing the unloading and loading of boards, a controller operates a component placing device to mount components on a first or second board loaded by the other board transfer device. Thus, it is possible to effectively utilize the time which is taken for the unloading and the loading of either boards, for component mountings on the other board, so that the efficiency in producing boards can be enhanced. Further, since the controller executes a control so that while component mountings are performed on the first boards of M-sheets on the first board transfer device, component mountings are performed on the second boards of N-sheets on the second board transfer device, it is realized to suppress the occurrence of an intermediate stock of either boards where the first boards of the M-sheets and the second boards of the N-sheets are required.

Abstract: A component mounting system and apparatus are provided that include a component mounting apparatus with a substrate holding device, a component supplying device, a head support portion, a mounting head and a forcing means. The mounting head is detachably attached to the head support portion. The mounting head of the system has a recording medium in which information relating to the mounting head is recorded. The system has an external storage portion that stores a plurality of batches of information relating to a plurality of mounting heads. The system further includes a recognizing portion that obtains and recognizes information from the external storage corresponding to the mounting head that is attached to the support portion.

Abstract: Bi-directional camera modules and flip chip bonders including the same are provided. The module includes a circuit board on which an upper sensor and a lower sensor are mounted, an upper lens and a lower lens disposed on the upper sensor and under the lower sensor, respectively, and a housing fixing the upper lens and the lower lens spaced apart from the upper sensor and the lower sensor, respectively. The housing surrounds the circuit board. The housing has a plurality of inlets and an outlet through which air flows, and the housing has an air passage connected from the inlets to the outlet via a space between lower lens and the lower sensor.

Abstract: A chip is attached to a printed conductive surface. The chip is first heated to a first temperature, which is lower than what the chip can stand without being damaged by the heat. The heated chip is pressed against the printed conductive surface with a first pressing force. A combination of said first temperature and said first pressing force is sufficient to at least partly melt the material of at least one of: the printed conductive surface, contact point on the chip.

Abstract: A method of aligning electronic components comprising providing a positioning member 110 having at least one formation 120 for receiving an electronic component; said at least one formation having lateral boundaries 35, 36 for constraining movement of an electronic component; placing a first electronic component 10a in said at least one formation; and providing a force for actively aligning said first electronic component with a lateral boundary of said at least one formation. The force may, for example, be provided by tilting the positioning member, by providing suction or by using an actuator. An apparatus for aligning electronic components and a 3D system of stacked electronic components is also disclosed.

Abstract: It is an objective to provide a part-mounting method that, even when parts are extremely small, makes it possible to mount the parts at a repair-requiring location without fail, to thus enhance a percentage of a non-defective substrate. In a part-mounting method, inspection is made as to whether or not a parts-missing location exists on a substrate Pb reloaded between a solder printer 2 and a first part-mounting machine 4A after having undergone manual repair by an operator OP, or the like, in connection with a repair-requiring location found through inspection performed after mounting of parts Pt, by use of an inspection camera 15A of a first part-mounting machine 4A. When a parts-missing location on the substrate Pb is found, the parts-missing location is identified. Subsequently, a mounting head 14A of the first part-mounting machine 4A and a mounting head 14B of a second part-mounting machine 4B mount a part Pt at the parts-missing location on the thus-identified substrate Pb.

Abstract: A component mounting apparatus for mounting components on a plurality of mounting regions placed on an edge part of a substrate along a first direction that is a direction along the edge part of the substrate, comprises component placing units for holding components placed in component delivery positions that are spaced from the edge part of the substrate in a second direction orthogonal to the first direction, moving the held components in the second direction, and placing the components onto the mounting regions, component feeding units for sequentially feeding the components to component feeding positions spaced from the component delivery positions, and component carrying units for holding the components fed to the component feeding positions, moving the held components, and placing the components in the component delivery positions. Therefore, the components can be placed even onto a large substrate with satisfactory working efficiency.

Abstract: A device suitable for producing an image of an object disposed in an object space by means of a sensor comprises at least the sensor, a first lens assembly disposed in front of the sensor, a stop plate comprising a light passage disposed in front of the first lens assembly, a second lens assembly disposed in front of the stop plate and the object space disposed in front of the second lens assembly. The device further comprises a light source, as well as a diffuser which is disposed on a side of the object space that is averted from the light source.

Abstract: A surface mount process, a surface mount system, and a feeding apparatus thereof are provided. The surface mount system includes a feeding apparatus and a surface mount apparatus. The feeding apparatus includes a vibrating tray feeder module, a vibrating linear feeder module, and a component recycling module. The vibrating tray feeder module has a circular vibrating conveyer belt with a vibrating tray output end. The vibrating linear feeder module has a linear vibrating conveyer belt connected to the vibrating tray output end and has a linear vibrating output end opposite the vibrating tray feeder module. The component recycling module is disposed under the vibrating tray feeder module to recycle the rejected components. The surface mount apparatus has a component receiving unit corresponding to the linear vibrating output end of the vibrating linear feeder module.

Abstract: When a component mounting process by mounting heads is executed on substrates which are positioned alternately by two substrate carrying lines, a determination is made on whether or not a mounting turn can be completed every time the mounting heads perform the mounting turn, and when it is determined that one of the mounting turns performed by the mounting head cannot be completed, a component mounting process is executed on the substrate which is positioned by the substrate carrying line which is opposite to the substrate carrying line.

Abstract: An inspection device includes a base to receive an electronic device, a supporting member, a first adjustment member, a second adjustment member, and an inspecting member installed on the second adjustment member. The supporting member includes a horizontal plate movable relative to the base, a guideway fixed on the horizontal plate, and a guiding block movably mounted on the guideway. The first adjustment member includes a fixing plate fixed on the guiding block, and an adjusting plate rotatably attached to the fixing plate, and movable and rotatable relative to the base. The second adjustment member is fixed on the adjusting plate. Movement and rotation of the adjusting plate relative to the base allow movement and rotation of the second adjustment member relative to the base to allow movement and rotation of the inspecting member relative to the electronic device.

Abstract: An apparatus and method of mounting components are provided. The apparatus for mounting components includes: a component supplying unit which supplies the components so that the components move in at least one line; and a plurality of suction nozzles disposed to approach to or retreat from the components, wherein intervals between the plurality of suction nozzles are changeable so that the suction nozzles correspond to positions of the components. The method of mounting components includes: disposing a plurality of suction nozzles corresponding to the positions of the components; picking up the components by using the suction nozzles adjusting intervals between the suction nozzles; moving the suction nozzles to an upper side of a substrate, on which the components are to be mounted; and putting the components down on the substrate.

Abstract: A positioning apparatus has a pilot holder having a hold face, a positioning pin having a tapered tip and supported by the pilot holder so that the tapered tip protrudes from the hold face of the pilot holder, a pad having a pad face that opposes the hold face of the pilot holder, and a movable member having a stop face that opposes the positioning pin and a relief hole for avoiding the tapered tip of the positioning pin from hitting the stop face, the movable member resiliently supported on the pad. The pilot holder and the pad in which the thin plate material is set between the hold face and the pad face relatively move to insert the tapered tip of the positioning pin into the positioning hole of the thin plate material. The stop face is flush with or protruding from the pad face of the pad.

Abstract: A delivering unit for a semiconductor chip provided with a solder bump may include a shuttle configured to move translationally along a direction; at least one chip supporting plate provided on the shuttle to support the semiconductor chip; a pick-up head configured to pick up the semiconductor chip from the at least one chip supporting plate; and at least one buffering member supporting the at least one chip supporting plate and relieving an impact between the pick-up head and the semiconductor chip. A semiconductor chip mounting apparatus may include a chip providing unit configured to provide semiconductor chips having one or more solder bumps; a mounting unit configured to mount the semiconductor chips on printed circuit boards in a surface mounting manner; and a chip delivering unit configured to deliver the semiconductor chips from the chip providing unit to the mounting unit.

Abstract: The invention relates to a plunger that is used to feed and withdraw an electronic component, in particular integrated circuits, to and/or from a contact device that is connected to a test device. The plunger head can be secured to a base body by a quick locking system. The quick locking system can be placed in a rear-engagement position when the plunger head is rotated in relation to the base body, a position in which the plunger head is axially coupled to the base body.

Abstract: In a component mounting apparatus, a picking member picks components and mounts them on a board through movements of a plurality of moving members driven by motors. The apparatus is provided with a regenerative electric power control section for controlling regenerative electric power produced by regenerating a motion energy when each of the motors is decelerated; power supply sections for the motors each for exchanging electric power with the regenerative electric power control section; and a control section. When two moving members are moved, the control section begins to start and accelerate one of the two moving members in synchronized relation with a timing of beginning to decelerate and stop the other moving member and controls the regenerative electric power control section to utilize a regenerative electric power which is obtained from the motor driving the other moving member, in starting the motor which drives the one moving member.

Abstract: A substrate conveyor track is provided with first to fourth conveyors. Two conveyors situated on both sides of the substrate conveyor track, and the other two conveyors situated at the center of the same. There is enabled selection of any one from a small substrate mounting mode for giving a single substrate conveyance width to the four conveyors and mounting electronic components on four small substrates having the single width; a large substrate mounting mode for actuating all movable conveyors to the center of the substrate conveyor track and mounting electronic components on two large substrates by the two conveyors; and a large-small-substrates mounting mode for bringing the two conveyors on one side of the substrate conveyor track, among the four conveyors, into the small substrate mounting mode and bringing one of the conveyors on the other side of the track into the large substrate mounting mode.

Abstract: An apparatus includes a pick and place system with a bonding head, picking head and support table. The picking head and support table are mounted on a carriage. The apparatus can be operated in a direct mode and a parallel mode. In the direct mode the carriage is in a first position (parked). A control unit operates the pick and place system to cause the bonding head to move a series of semiconductor chips from the wafer table to the substrate. In the parallel mode, the carriage is in a second position. The control unit operates the picking head, support table and pick and place system to repeatedly cause the picking head to move a semiconductor chip from the wafer table to the support table and the bonding head to move said semiconductor chip from the support table to the substrate.

Abstract: A component mounting apparatus includes: two heads equipped with plural nozzles for suctioning and mounting a component; a memory holding at least one of information on maximum speed and maximum acceleration; an operation determining unit determining whether an operation after a suctioning operation of any one of heads is a suctioning operation or not; a speed/acceleration calculating unit calculating at least one of speed and acceleration at the time of axial movement by using at least one of the maximum speed and the maximum acceleration for the suction, if it is determined that the operation after the suctioning operation is the suctioning operation; a control signal generating unit generating a control signal; and a driving unit performing movement from the suction operation to a component suction position of the subsequent nozzle in accordance with the control signal when the suctioning operation by the subsequent nozzle is performed.

Abstract: A mounting apparatus mounts a component (A) on a board (W). The mounting apparatus is provided with a head unit (40) wherein a plurality of heads (41) for picking up components (A) are arranged in a prescribed direction, a head unit transfer device (4) for moving the head unit (40), a board imaging camera (21) (board imaging device) disposed on the head unit (40) for capturing an image of the board (W), and a camera moving device (25) (imaging device moving device) which moves the board imaging camera (21) relative to the head unit (40) in the arrangement direction of the heads (41).

Abstract: An apparatus for manufacturing a semiconductor package includes an index rail transferring a lead frame in forward and backward directions, the lead frame having a first surface and a second surface that is opposite to the first surface, a loader portion connected to an end portion of the index rail and supplying the lead frame to the index rail, a frame driving portion connected to the opposite end portion of the end portion of the index rail and rotating the lead frame around a normal to the first surface, and a die attach portion attaching a semiconductor chip on the lead frame supplied to the index rail.

Abstract: A mounting system for applying an RFID chip module having at least one electrical connection to a substrate having at least one conductor, in particular a label, has the following features: a) a stamping device for stamping out the RFID chip module from a carrier strip having a plurality of chip modules, wherein the stamping device comprises a stamping die having a stamping opening, by which an RFID chip module to be stamped out is received with accurate positioning, and a stamping punch disposed above the stamping opening, and wherein a support for receiving a substrate with accurate positioning is disposed below the stamping opening and the stamping punch can be moved up against the substrate; b) a suction device for holding the RFID chip module on the stamping punch; and c) a heating device for melting solder present on the RFID chip module in order to establish a conductive connection between an electrical connection of the RFID chip module and a conductor of the substrate.

Abstract: It is an object to provide an electronic component mounting system capable of concurrently, efficiently subjecting a plurality of substrates to component mounting operation and accomplishing both high productivity and a capability of addressing production of multiple products. An electronic component mounting system is configured by arranging, on an upstream side of a component loading unit having a plurality of substrate conveyance mechanisms, a screen printer M2 having a plurality of individual printing mechanisms and a coating and inspection machine M4 that applies a coat of a resin for use in boding an electronic component and that inspects a coated state. The coating and inspection machine M4 is equipped with a coating head 15 that performs operation for coating substrates conveyed by substrate conveyance mechanisms 12A and 12B from the screen printer M2 with the resin and an inspection head 16 that performs pre-coating inspection and post-coating inspection.

Abstract: A head that moves across a surface of a mask, which includes a plurality of apertures for disposing conductive balls on a substrate, whereby, while the head is rotating about an axis that is perpendicular to the mask, the axis moves across the surface of the mask. The head includes a gatherer that gathers the conductive balls into a circular area that is smaller than the surface of the mask and disposed around a center of rotation of the head, the conductive balls being gathered from an area around the circular area when the head rotates.

Abstract: An object of the invention is to provide an electronic component mounting system and an electronic component mounting method which can execute component mounting work on a plurality of boards simultaneously, concurrently and efficiently so that high productivity and responsiveness to production of many items can be achieved consistently.

Abstract: Link mechanisms provided corresponding to press bonding heads each include a first link member having one end pivotably connected to an upper end of the press bonding head, a second link member having one end pivotably connected to the other end of the first link member and having the other end pivotably connected to a link bracket above the press bonding head, and a connection slide part connected to a connection part between the first and second link members, collectively drive the connection slide parts of the link mechanisms by a press bonding head driving unit in horizontal directions (Y axis directions) orthogonal to a direction (X axis direction) of side-by-side arrangement of the plurality of press bonding heads, open and close the first and second link members of the link mechanisms in the vertical directions thereby collectively moving the plurality of press bonding heads downward and upward.

Abstract: There is provided a work processing apparatus including a plurality of work conveyance lines on which works are to be moved, a stopping unit to stop a work in a predetermined processing position on each of the work conveyance lines, a processing unit to make a desired process on the work stopped by the stopping unit, and a moving unit to move the processing unit between the work conveyance lines. Works are sequentially processed on the plurality of work conveyance lines. While a work is being processed in the processing position on one of the work conveyance lines, another work can be carried in to the other work conveyance line. Therefore, immediately after a work is completely processed on the one work conveyance line, processing of another work can be started. As a result, the production rate is higher and the apparatus can be designed smaller in size.

Abstract: A jig securing alignment and positional accuracy in all directions (x, y, z) for an electrical component to be soldered to a PCB is provided. The jig positions the IC in the x and y directions, and keeps the IC from rotating. The jig also holds the IC down during the soldering process to make sure that the IC remains parallel to the PCB before, during and after soldering. The jig attaches to mounting holes on the PCB and its placement can be automated or performed manually.

Abstract: A head assembly for a chip mounter is provided. The head assembly includes a nozzle module disposed above a printed circuit board (PCB) and configured to pick up and move an electronic component to mount the electronic component on the PCB, and a component recognition module electrically connected to the nozzle module and configured to recognize presence of the electronic component, a distance between the PCB and the nozzle module, and alignment of the electronic component at least one given moving position of the electronic component.

Abstract: A method for manufacture of an electronic interface card including defining a pair of apertures in a substrate layer, associating an antenna with the substrate layer such that opposite ends of the antenna terminate at the apertures, placing a conductor in each of the apertures, connecting the antenna to the conductor, forming a recess in the substrate layer, attaching continuous connection wires to a plurality of chip modules, attaching the continuous connection wires to a plurality of conductors on a corresponding plurality of the substrate layers, cutting the continuous connection wires so as to retain portions thereof which connect each chip module to a corresponding pair of conductors and sealing the chip module in the recess.

Abstract: A system for assembling electronic chips in a package, including a first lead frame defining chip reception areas; and a second lead frame defining chip coverage areas, the frames including, at least at their periphery, pairs of mutually-cooperating elements for maintaining the frames together.

Abstract: The present invention relates to methods and arrangements for using a thin foil to form electrical interconnects in an integrated circuit package. One such arrangement involves a foil carrier structure, which includes a foil adhered to a carrier having cavities. Some methods of the present invention involve attaching dice to the foil and encapsulating the foil carrier structure in a molding material. In one embodiment, the molding material presses against the foil, which causes portions of the foil to distend into the cavities of the carrier. As a result, recessed and raised areas are formed in the foil. Afterwards, the carrier is removed and portions of the raised areas in the foil are removed through one of a variety of techniques, such as grinding. This process helps define and electrical isolate contact pads in the foil. The resulting molded foil structure may then be singulated into multiple semiconductor packages.

Abstract: A device suitable for placing a component on a substrate is provided with a component feeding device, a component pick-and-place device comprising a nozzle, a substrate carrier, means for moving the component pick-and-place device from the component feeding device to the substrate carrier and vice versa. A global measuring system is provided for determining the position of the component pick-and-place device during movement of the component pick-and-place device from the component feeding device to the substrate carrier and vice versa. The device is further provided with a local measuring system, remote from the global measuring system, for almost continually determining, in the proximity of a desired position of the component on the substrate, the position of the component pick-and-place device with respect to the substrate. The local measuring system is located closer to the substrate carrier than the global measuring system.

Abstract: The invention is directed to an unfailing pickup operation of an electronic component from a component storage portion at a seam of storage tapes connected even using a connection tape and prevention of reduction in a pickup rate of an electronic component. A CPU sends a feeding command to a component feeding unit to perform a component feeding operation or the like. Then, when the CPU judges that a connection tape reaches a pickup position, the CPU drives an X axis drive motor and a Y axis drive motor to move a board recognition camera to the pickup position of the feeding unit, the camera takes an image of a storage portion of a storage tape, and a recognition processing device performs recognition processing. A correction value based on a result of this recognition processing is stored in a RAM, and a suction nozzle is moved taking this correction value into account and lowers to pick up an electronic component.

Abstract: A bonding apparatus for conducting bonding on substrates comprises a first substrate holding device for clamping a first substrate during bonding and a second substrate holding device for clamping a second substrate during bonding. Each substrate holding device is operative to move sequentially between its respective onloading position for receiving substrates, bonding position whereat substrates are bonded and offloading position whereat bonded substrates are removed from the substrate holding device. A first actuator is operative to drive the first substrate holding device along a first feeding path from its onloading position to its bonding position and from its offloading position to its onloading position along a first return path. A second actuator is operative to drive the second substrate holding device along a second feeding path from its onloading position to its bonding position and from its offloading position to its onloading position along a second return path.

Abstract: In an electronic component mounting apparatus that is used in an electronic component mounting line for producing a mounted substrate by mounting electronic components on a substrate and that subjects the substrate to predetermined operation, a working unit attachment section 30 is provided within a range of movement of a working head, such as a loading head and a paste coating head, wherein a nozzle stocker 9 and a paste trial coating unit 10 can be removably attached as a working unit for performing specific additional operation appropriate for working function of the working head. The nozzle stoker 9 and the paste trial coating unit 10 are attached to the working unit attachment section 30 according to the type of working head.

Abstract: An aligning device for electronic components and a bonding device using the aligning device. The aligning device includes a chamber, a flexible bellows within the chamber, two block used to hold an electronic component, a driving unit configured to move either of the two blocks relative to each other and located in an airtight chamber and an image port having a window through which one of the electronic components can be observed.

Abstract: In a component mounting device in which a component is picked up and mounted on a circuit board by a suction nozzle, an amount of displacement between a center position of the suction nozzle 11 and that of the picked-up component 12 is measured, and when it is larger than a preliminarily determined value, a warning is generated indicating that the parts cassette 3 from which the component 12 has been fed is in abnormal condition, as well as the mounting action of the component 12 is stopped.