Abstract: A vacuum pipette has a filter grid that is shifted into its extended interior and whose cross section is considerably greater than the cross section of an end-side suction opening. The gaps formed in the filter grid can be so narrow that even very small components are reliably retained. Nevertheless, the entire passage cross section available is considerably greater than in the case of a filter grid arranged at the end side. As a result, favorable suction forces are generated under constant suction conditions.

Abstract: An in-line programming (ILP) system and method for programming and testing programmable integrated circuit devices (PICs) and performing the assembly of printed circuit board assemblies (PCBAs). Printed circuit boards enter and leave the ILP system on a conveyor system. PICs are loaded into the ILP system, and the ILP system automatically programs and tests the PICs and places them onto the PCBs as the PCBs arrive on the conveyor. The programming and testing operations are performed by the same piece of equipment that performs the PCBA assembly operation.

Abstract: A substantial apparatus width along a board carrying direction of an electronic component placing apparatus for placing electronic components on a board having a length L along the board carrying direction is a total dimension 4L+SL. Specifically, 4L denotes a length of the sum of the lengths of a first board retreat position, a first component placement position, a second board retreat position and a second component placement position. Further, SL denotes a length of the sum of the lengths of the spaces for positioning a board stop mechanism provided at each of the first board retreat position, the first component placement position, the second board retreat position and the second component placement position. Finally, the substantial apparatus width is between 450 mm and 1000 mm inclusively.

Abstract: An electronics packaging system (1) including a printer (3), a placing unit (4) and a reflow unit (5), wherein a printed wiring board (2) is carried while being kept in an upright position. The printed wiring board (2) has solder printed on all the lands thereof at the same time, the electronic parts (10) are all placed on the lands at the same time, and the electronic parts (10) are all soldered to the lands at the same time. Thus, the system (1) can be designed more compact, and the electronic parts packaged in a shorter time.

Abstract: A device for fitting substrates with electric components includes a stationary carrier supporting a positioning device. The carrier is arranged above at least two fitting stations that are located one after the other in a conveying direction. A chassis of the device includes end supports and central supports that are connected to the carrier.

Abstract: There is provided a plurality of component mounting apparatuses for sucking a plurality of components by a mounting head section and successively mounting the components onto a board located at a board positioning section. The component mounting apparatuses are arranged in parallel to one another, and a board transfer path is provided so that it penetrates the component mounting apparatuses. Even when the number of components to be mounted onto the board increases, the components are mounted on the component supply tables of the component mounting apparatuses as distributed thereto, and therefore, the whole apparatus is not dimensionally increased. The component supply tables are fixedly installed so as to become free of vibration, and the mounting head section executes the suction and the mounting of the plurality of components. Therefore, the component mounting operation speed can be remarkably increased.

Abstract: The wiring harness has a plurality of first sub-harnesses and a plurality of second sub-harnesses. The first sub-harness has a first press-fit terminal joined to each end of a first electrical cable, and the first sub-harness has a first isolator holding the first press-fit terminal. The second sub-harness has a second press-fit terminal, a crimp terminal, a connector housing for accommodating the crimp terminal, and a second isolator supporting the second press-fit terminal. The second press-fit terminal is connected to one end of a second electrical cable, and the crimp terminal is connected to the other end of the second electrical cable. The press-fit terminals held by different ones of the isolators can be connected to one another when any of the first and second isolators are layered.

Abstract: An apparatus for performing treatments to the surface of disk-shaped workpieces/substrates, as in the manufacture of multi-layer, thin-film recording media. The apparatus includes treatment stations for performing treatments to a surface of each of the disk-shaped workpieces/substrates; a pallet adapted for mounting the disk-shaped workpieces/substrates, a plurality of bias potential sources; and a transporting source to transport the pallet past the treatment stations. The pallet includes electrically conductive segments and each segment is electrically insulated from other segments; is adapted to mount and expose at lest one surface of a disk-shaped workpiece; and includes an electrical contact for providing electrical contact with the bias potential source of the apparatus.

Abstract: An occurrence component lack at a component arrangement position, designated by a mounting program, of a component feed part, which feeds components to be mounted, is determined. Whether a spare component for the lacking component to be mounted is present in a spare component feed area of the component feed part is determined, and supply of the component to be mounted from a designated component arrangement position of the component feed part is switched to supply of the spare component from the spare component feed area.

Abstract: The apparatus and method of the present invention relates use a dry atmosphere in the component storage portion of the surface mount device placement machine. The dry atmosphere provides the benefit of eliminating the baking process and other moisture management issues. In accordance with one aspect of the present invention, a component placement machine for placing components on printed circuit boards includes a component storage area, a component placement system for taking components from the component storage area and placing the components on the printed circuit boards, an enclosure surrounding the component storage area, and a dry gas delivery system for delivery of a dry gas to the storage area to prevent moisture from being absorbed by the components.

Abstract: A method of manufacturing a stack of interlock laminations and thereby shaping the stack of laminations into a desired shape. Each of the individual laminations is formed by a series of punching operations from sheet stock material. The laminations are blanked from the stock material, are stacked atop one another, and are interlocked in a choke. The laminations are thereafter repositioned to form the stack into a second shape. The stacking axis and the core axis may be either parallel or perpendicular to one another. The second shape of the core may be variable in that the second shape may be changed from time to time or may be continuously changed.

Abstract: A compliance mechanism for manipulating a control object by an end effector supported by a robotic arm. The robotic arm is supported by a combination of linear slides for two-axis freedom of movement. A locking arm is attached to the robotic arm and the locking arm is moveable between a locked and an unlocked position. The locking arm is biased in the locked position to restrict movement of the robotic arm along the two axes. A plunger extends adjacent the end effector. Upon engagement with an alignment feature associated with the control object, the plunger moves the locking arm from the locked to the unlocked position, thereby introducing compliance along the two axes manipulation of the control object.

Abstract: A new fixture which is capable of holding an HSA throughout all processes is invented so that Quasi-Static Test can be done before swaging. Handling operations are reduced and rework is made much easier. The invention further provides a process for testing the HSA by means of the fixture.

Abstract: An apparatus of two stories for manufacturing a non-resonance knock sensor has an assembly body stage positioned at a first floor for forming an assembly body in which a lower insulator, a lower terminal plate, a piezoelectric element, an upper terminal plate and an upper insulator are mounted on a cylindrical base, and process stages positioned at a second floor for fastening the assembly body with a nut to form a sensor main body, bending partly the lower and upper terminal plates of the sensor main body and connecting by welding a resistor between the lower and upper terminal plates which are partly bent in the sensor main body. Accordingly, its manufacturing line is compact and can be installed in smaller horizontal ground area.

Abstract: Method for taking out electronic parts from a parts supply section by a transfer head and transporting and mounting the electronic parts to and on a board positioned on a transfer passage. In an image pickup step, a board recognition camera moves independently of the transfer head and advances to and retreats from the board for picking up an image of the board to detect the position thereof in a position detecting step. The image pickup step of the board by the board recognition camera and the parts taking out step in the parts supply section by the transfer head are performed concurrently. Thus, the tact time can be shortened and the electronic parts can be mounted on the board efficiently.

Abstract: The present invention has for its object to provide an apparatus and a method for transferring boards, and a component mounting apparatus whereby a production efficiency can be improved in accordance with types of boards to be produced. For accomplishing this object, there are arranged a shift device capable of moving a mounted board from a process-finished board transfer path to an unprocessed board transfer path, a controller for controlling this moving, and an identifying device. This arrangement enables switching of a method of transferring boards in accordance with types of boards to be produced, and controlling supply of boards to the component mounting apparatus, so that production efficiency is improved in accordance with types of boards.

Abstract: There is provided a plurality of component mounting apparatuses for sucking a plurality of components by a mounting head section and successively mounting the components onto a board located at a board positioning section. The component mounting apparatuses are arranged in parallel to one another, and a board transfer path is provided so that it penetrates the component mounting apparatuses. Even when the number of components to be mounted onto the board increases, the components are mounted on the component supply tables of the component mounting apparatuses as distributed thereto, and therefore, the whole apparatus is not dimensionally increased. The component supply tables are fixedly installed so as to become free of vibration, and the mounting head section executes the suction and the mounting of the plurality of components. Therefore, the component mounting operation speed can be remarkably increased.

Abstract: A base plate and load beam for an HG assembly are formed in series, stacked, and transferred by a transfer system in the form of the stacked-layer series to undergo the necessary assembly processes such as layer joining, slider attachment, and electrical connections between the terminals thereon. When uncompleted HG assemblies are transferred for each of the manufacturing processes, the uncompleted HG assembly is mounted on the assembly jig such as a tray or a block for transference. For this reason, assembling jigs, the number of which is at least equal to the number of the uncompleted HG assemblies remaining at the respective assembly processes would be needed. Accordingly, the efficiency of work space is reduced, and a rise in manufacturing cost is brought about by the need for the assembling jigs.

Abstract: An intermediate product manufacturing apparatus for carrying intermediate products and processing the intermediate products with a plurality of processing apparatuses is provided, the apparatus comprising: a plurality of carrying means for carrying the intermediate products to the processing apparatuses; a common processing apparatus provided between the plurality of carrying means, for carrying out a common process on the intermediate products carried by the carrying means; and intermediate product transfer sections provided between the plurality of carrying means, for transferring the intermediate products between the common processing apparatus and the carrying means.

Abstract: The present invention discloses a mounting method of electronic components in which the electronic components are mounted on plural printed circuit boards.

Abstract: In this electronic component mounting apparatus, a mounting head is movably arranged between the electronic component supplying unit and the board holding unit. A first camera for taking an image of the board in the board holding unit and detecting an electronic component mounting position, and a second camera for taking images of the chips of the electronic component supplying unit are arranged in such a manner that the first camera and the second camera can be entered/evacuated as against the electronic component supplying unit. Therefore, the electronic component supplying unit and the board holding unit are defined as a range to be transported, and the mounting head, the first camera, and the second camera are relatively traveled in conjunction to each other, a loss-time in both the electronic component supplying unit and the board holding unit can be avoided, and tact time can be shortened to improve a work-efficiency.

Abstract: In order to maximally reduce a space necessary for a terminal crimping apparatus to improve operability and maintenance readiness, terminal reels 422 and applicators 421 are arranged in such inclined states that terminals can be fed in a direction oblique to a wire conveyance path PH. A wire is fed to the applicators 421 by wire clamping units. Each wire clamping unit is so constructed as to switch the position thereof between a pressing position in which the end of the wire can be connected with a terminal and a normal position in which the end of the wire can be transferred to and from the remaining units.

Abstract: A method and apparatus for fabricating a three dimensional array of semiconductor chips is disclosed. The method uses a multiple step fabrication process that automates the surface mounting of semiconductor chips with unique chip carriers to achieve the three dimensional array of chips. The method includes a step of depositing solder on a multitude of chip carriers at one time, placing the chip carriers with chips on a printed circuit board and then running the board with chips and carriers arranged in a three dimensional array through a single reflow oven to complete a single reflow process to permanently connect all of the components. The apparatus includes a unique chip carrier pallet and print fixture pedestal that work in combination to position the chip carriers for the automatic deposition of solder on a multitude of carriers at once and then position them for addition to the circuit board.

Abstract: A cable-processing device includes a first drive for swiveling movement and a second drive for linear movement of a swivel-arm. The swivel-arm is held on a bracket for rotation about an axle with a spring force acting counterclockwise on the swivel-arm. A gripper on the end of the swivel-arm holds a cable-end between first and second gripper-jaws. The jaws are arranged rotatably on an axle and are opened and closed by means of gears. To reduce the swivel-arm mass to be moved, the actuator for the gears is arranged on the swivel-arm.

Abstract: An assembly system and a method are for assembling components on substrates. The system includes a transport track and several substrate carriers that can be displaced, for example, perpendicularly to the transport track. The substrate carriers can be loaded with substrates using loading that can be displaced in the direction of transport. Manipulation devices for removing components from feed devices and depositing the components on the substrates are arranged next to the transport track, so that they can be displaced laterally in the direction of transport. The feed devices can be displaced in a substantially perpendicular manner in relation to the direction of transport, in order to align the pick-up point for the respective components along a single pick-up track, parallel to the transport track.

Abstract: An electric-component mounting system including: nozzle holders each carrying suction nozzles and rotatable to bring selected one of the suction nozzles; a turning device to turn the nozzle holders about a common axis of turning, for stopping each nozzle holder at predetermined working positions including nozzle-selecting, component-receiving and component-mounting positions; a holder rotating device which includes an engaging member engageable with and disengageable from an engaging portion of each nozzle holder, and which is disposed at the nozzle-selecting position, to rotate the nozzle holder, with the engaging member engaging the engaging portion; and an engaging-and-disengaging device to move the engaging member for engagement and disengagement with and from the engaging portion, and wherein each nozzle holder receives an electric component at the selected suction nozzle when each nozzle holder is located at the component-receiving position, and mounts the electric-component onto a circuit substrate whi

Abstract: The invention relates to an assembly system and method for assembling components on substrates, with, for example, two substrate support pairs arranged perpendicular to a conveyor run, comprising substrate supports (110, 130, 120, 140) which may be displaced perpendicular to the conveyor run. Assembly fields (500, 550) are arranged to the side of the conveyor run, which can be supplied with circuit boards (L) by means of the substrate supports (110, 130, 120, 140). A loading device (210) and an unloading device (220) are arranged along the conveyor run (T), by means of which the circuit boards (L) can be placed on the substrate supports (110, 130, 120, 140). The loading device (210) and the unloading device (22) may be displaced along the conveyor run in a loading direction and an unloading direction. A flexible execution of assembly processes is possible with the above arrangement.

Abstract: A surface mounting device of the present invention has a printed circuit board carrier including a plurality of transfers installed at a predetermined portion of a base frame; and a plurality of conveyers movable in a predetermined direction. A surface mounting method of the present invention comprises the steps of: transferring a printed circuit board from a first transfer to one of a plurality of conveyers movable in a predetermined direction; perform the mounting of parts from a feeder on the printed circuit board; transferring the printed circuit board onto which parts have been mounted to the other one of the plurality of conveyers; and transferring the printed circuit board to a second transfer.

Abstract: The object of the present invention is to form individual packaged ICs by using a single apparatus to cut wiring boards on which a plurality of IC chips are mounted. The first cutting device 23 cuts the wiring boards 3 into separate parts along one direction, so that the cut wiring boards 3 constitute strip-form cut wiring boards 3a. The cut wiring boards 3a are conveyed to the second cutting device 33, and are fed by the second conveying device 43 along the direction of length and are then cut by the second cutting device 33 with the orientation altered by 90 degrees relative to the first cutting direction. The wiring boards 3b resulting from the cutting performed by the second cutting device 33 constitute the original forms of the IC packages. The wiring boards 3b that have been cut and conveyed from the second cutting device 33 enter a cleaning step.

Abstract: The invention relates to a method for the operation of a component placement unit, a component placement unit for carrying out said method and a feed device for said component placement unit, permitting an optimised flexible operation of component placement units, whereby the main transport direction (HT) of the transport runs (130, 140) is reversed and component supports (110, 120, 120-R) are transported in the opposite direction (GT).

Abstract: A novel method and placement system are configured for populating a substrate with an electronic component. The placement system has a substrate holding device for receiving the substrate, a wafer holding device above the substrate holding device serving for receiving a wafer holding frame, and a vacuum forceps holding device arranged above the wafer holding device. The wafer holding frame can receive a complete semiconductor wafer divided into electronic components.

Abstract: A mounting system for an electric component operates by transferring the electric component from a component supply device to a suction nozzle of a component-holding head on a circuit substrate. A relative position between a sucking surface of the suction nozzle and an axis of rotation of the component-holding head is obtained. A component-holding head and the component supply device are moved relative to each other on the basis of the obtained relative position, so as to minimize an error of relative positioning between the sucking surface and a predetermined sucking position of the electric component positioned at the component-supply portion. The head and the component supply device are then moved toward each other, for transferring the electronic components from the component supply device to the suction nozzle.

Abstract: A method and apparatus are described for a flexible tape constructed of a material suitable to convey electronic devices through an entire manufacturing process without removing the electronic packages from the tape. According to one embodiment, part receiving areas are located within the tape. Each part receiving area is suitable to hold an electronic device. A retention channel encompasses each part receiving area. The retention channel extends substantially an entire length along each edge of each part receiving area. The retention channel comprises an upper tab and a lower tab wherein the upper tab is flush with an upper surface of the flexible tape and extends into the part receiving area and the lower tab extends below a lower surface of the flexible tape and into the part receiving area.

Abstract: A plurality of self-propelled system heads (5) are made to independently travel along a closed-loop travel track (6) in a manner that the heads do not interfere with each other by controlling respective drive devices (4). Components (2) from a component supply device (8) are held by component holding members (3) of the heads, and thereafter, the components held by the component holding members are mounted on boards (1) positioned by board positioning devices (7).

Abstract: A workpiece table assembly is configured to hold a plurality of workpieces (e.g. conductive strands) so that the workpieces can be modified (e.g. bent). In one embodiment, the workpiece table assembly advantageously comprises a table, a saddle, a lift mechanism, and a die. The saddle is advantageously recessed below the table and raised or lowered by the lift mechanism. The table advantageously has a top surface with holes adapted to accept quick-release pins from a step-off board. The step-off board also has notches to accept and position the strands for die pressing. In one exemplary operation, the step-off board is used to stagger the strands over the down-positioned saddle. The saddle is then raised by the lift mechanism and the die placed within the saddle on top of the strands. A force is applied to the die to bend the strands.

Abstract: A die bonder includes a conveyor, a pre-heater, at least one carrier, a paste-dispensing mechanism, a die taking/placing mechanism, and a heater. The conveyor continuously operates in a ring-shaped manner. The carrier is carried on the conveyor to position the substrate. The pre-heater heats the substrate to eliminate the moisture in the substrate. The paste-dispensing mechanism dispenses an adhesive agent onto the substrate. Then, the die taking/placing mechanism places a die onto the substrate at a position where the adhesive agent is dispensed. Finally, the heater is used to cure the adhesive agent so as to bond the die to the substrate.

Abstract: Apparatus for the manufacture of a component such as an integrated circuit chip, including: a plurality of processing stations forming a production line for the manufacture of the component, a conveyor adapted to transport component forming materials from one processing station to another in the production line, and a storage on the production line for storing the materials during transport along the production line. The storage acts as buffers effectively to collect materials and store them for efficient transport along the production line.

Abstract: The object of the present invention is to form individual packaged ICs by using a single apparatus to cut wiring boards on which a plurality of IC chips are mounted.

Abstract: A compact and high-speed automatic electronic parts mounting apparatus is provided which includes first and second parts feeders, first and second mounting heads, a printed board-holding table, and a controller. Each of the first and second parts feeders includes a plurality of cassettes storing therein electronic parts and having pick-up stations. The second parts feeder is arranged at a preselected interval away from the first parts feeder in a first direction. Each of the first and second mounting heads is movable in the first direction and includes a plurality of pick-up nozzles movable in a vertical direction for picking up the electronic parts from the pick-up stations of the cassettes. The printed board-holding table is disposed within the preselected interval between the first and second parts feeders so as to move in a second direction perpendicular to the first direction.

Abstract: An apparatus is provided to simplify the construction of an assembling apparatus and shorten a tact time thereof for inserting a plurality of fuse into a box. In a fuse box assembling apparatus 1, fuses are fed one by one through outlets 2a of parts feeding units 2 provided for the respective kinds of fuses, and are inserted into a movable magazine 30. The movable magazine 30 is displaced to the respective outlets 2a by a displacing unit 5, thereby collecting necessary fuses in a specified order. The fuses are transferred from the movable magazine 30 to a fixed magazine 40 at once by a transferring mechanism 6 of the mounting unit 4, and are inserted one by one into a box by an inserting mechanism 7. Simultaneously with a fuse inserting operation, fuses to be inserted next are collected in the movable magazine 30.

Abstract: The object of the present invention is to form individual packaged ICs by using a single apparatus to cut wiring boards on which a plurality of IC chips are mounted. The first cutting device 23 cuts the wiring boards 3 into separate parts along one direction, so that the cut wiring boards 3 constitute strip-form cut wiring boards 3a. The cut wiring boards 3a are conveyed to the second cutting device 33, and are fed [into the second cutting device 33] by the second conveying device 43 along the direction of length. [The cut wiring boards 3a] are then cut by the second cutting device 33 with the orientation altered by 90 degrees relative to the first cutting direction. The wiring boards 3b resulting from the cutting performed by the second cutting device 33 constitute the original forms of the IC packages. The wiring boards 3b that have been cut and conveyed from the second cutting device 33 enter a cleaning step.

Abstract: The component mounting apparatus includes a component delivery unit, a chuck (13) provided on the component delivery unit, a component transfer unit (19) for receiving a component held by the chuck (13), and a head (20) for receiving the component held by the component transfer unit (19). The head (20) includes a main head body (80), a vertically moving mechanism (81) for the main head body (80), insertion nails (68) provided at a bottom portion of the main head body (80), an opening/closing mechanism (82) for the insertion nails (68), and a turning mechanism (83) for moving the insertion nails (68) in forward and backward directions. A cam plate (84) constituting the turning mechanism (83) is mounted detachably on the main head body (80).

Abstract: A circuit board manufacturing system is provided which includes a production assembly line with a carrier handling system for a plurality of feeder/programming/buffer systems. The feeder/programming/buffer system has a flexible feeder mechanism for receiving unprogrammed device in a number of different manners, a programming mechanism for performing a programming operation on the unprogrammed devices at a high rate of speed, and a buffer mechanism for providing the programmed micro devices to the carrier handling system. The carrier handling system has its own buffer section and is integrated with an assembly handling system of the production assembly line to populate the programmed devices on to the circuit boards.

Abstract: A fitting system and a method of fitting substrates with components includes, along a conveyor line, loading apparatuses provided in a conveying direction. Each of the loading apparatuses include at least two holding regions arranged one above another, so that substrates delivered along the conveyor line can be transferred to the upper holding region or the lower holding region. In this case, it is possible to feed substrates to fitting areas and at the same time to move substrates past the fitting areas. This achieves a very high performance per unit area of the fitting system. Furthermore, great flexibility is possible in the selected processing of the substrates.

Abstract: There is disclosed an apparatus for adjusting the origins of module heads of a surface mounting apparatus for a dual gantry, the adjusting apparatus, and method therefor.

Abstract: An apparatus for moving an operative suction nozzle which holds an electric component. The apparatus mounts the electric component held by the operative suction nozzle on a circuit board. The apparatus includes a device which supplies the electric component to the operative suction nozzle; a device which supports the circuit substrate; a nozzle storing device which stores normal suction nozzles; and a nozzle moving device. A nozzle-defect detecting device which detects a defeat of the operative suction nozzle is provided. Also provided is a nozzle exchanging device which automatically operates the nozzle moving device to move the defective suction nozzle having the detected defect, to the nozzle storing device so that the defective suction nozzle is exchanged with the normal suction nozzle stored by the nozzle storing device.

Abstract: A method for mounting an external heat dissipater to a light emitting diode is disclosed. The heat dissipater is comprised of at least one heat dissipation board. A long metal strip is conveyed through a working platform and is punched to form a number of heat dissipation boards connected thereto by connection sections. Light emitting diodes are positioned on the heat dissipation boards and the heat dissipation boards are cut and separated from the metal strip to form finished products of light emitting diodes to which a heat dissipater comprised of the heat dissipation board is mounted.

Abstract: The present invention relates to systems, apparatuses, and methods for the automated manufacture of optical fiber devices including a fiber magazine and a plurality of fiber cassettes within the magazine. The cassettes include alignment members and optical fiber in which the devices are to be formed. A plurality of work stations include assemblies for processing the fiber in the cassettes and reciprocal alignment structures corresponding to the alignment members of the cassettes.

Abstract: A process for picking up and moving a microelectronic package during card assembly operations. A clipping lid having a top surface and at least two sides attaches to a substrate via friction where the sides act as leaf springs gripping the substrate. The top surface of the lid provides a clean, smooth, flat surface to which a vacuum probe may be attached. In the preferred embodiment, the lid and sides are formed from an integral piece of stainless steel. Also provided are flares at the bottom of each side to aid in guiding the lid onto the substrate. Protrusions are provided in the sides to prevent the lid from slipping too far onto the substrate and contacting the components mounted to the substrate. Also provided is at least one hole in the top surface to allow the lid to be pried free from the substrate after completion of the steps where vacuum probe movement is required.

Abstract: A production line (13) for the one-sided and two-sided assembly of printed circuit boards with components consists of two successive sections (13a, 13b), each comprising a printer (4), at least one printed circuit board assembly machine (6, 7, 8) and a vertical reflow soldering furnace (14), in the direction in which the printed circuit boards pass through. One of each of the assembly modules (6, 7, 8) that are necessary for the desired product flexibility and which are allocated to the processing of different components is provided in the production line (13), said modules being distributed between the two sections (13a, 13b), between which a reversing station (11) is located. The soldering furnace (14) of the second section (13b) is preferably followed by another reversing station (11) which can be switched on and off.