Abstract: A component placement machine for assembling at least one component on to at least one printed circuit board (PCB) is provided. The component placement machine comprises at least one head configured for picking a component from at least one feeder and placing the picked component on to a PCB of a first PCB product. The component placement machine also includes at least one feeder/nozzle bank system, wherein the feeder/bank system is configured to enable a setup of a second PCB product on the component placement machine while the component placement machine assembles the PCB of the first PCB product. The component placement machine facilitates methodology for product changeover on a production line.

Abstract: The invention refers to a process for loading a socket and/or adapter device with a corresponding semi-conductor component, a socket and/or adapter device, a precision alignment device, as well as a mechanism for loading a socket and/or adapter device with a corresponding semi-conductor component, whereby the mechanism comprises a device, especially a mechanical device for aligning the mechanism in relation to the socket and/or adapter device.

Abstract: A multiple insertion head for mounting components onto substrates includes a carrier configured to rotate about a rotational axis, a plurality of active drives, and a plurality of receiving tools configured to move in a mounting direction at an angle to the rotational axis. The receiving tools are arranged on the carrier so as to receive the components. Each receiving tool is permanently coupled to one of the active drives.

Abstract: Provided are an apparatus for transferring a semiconductor chip and a method of transferring a semiconductor chip using the same, which can inhibit the occurrence of a void to enhance the reliability of a semiconductor package. The apparatus for transferring the semiconductor chip includes: a holder member including a first vacuum hole connected to a vacuum line; a plate member including at least one second vacuum hole corresponding to the first vacuum hole and redistributed to edges of the plate member, the plate member combined with the holder member; and an absorption member including at least one third vacuum hole corresponding to the second vacuum hole and a groove connected to the third vacuum hole, the absorption member combined with the plate member and the holder member.

Abstract: In component feeding head apparatus, a head unit having a holding unit for releasably holding a component and a rotating unit for rotating the holding unit around its center of axis is set as an object of an up-and-down operation and an inverting operation, and a head lifting device for moving the head unit up and down and a head inverting device for inverting the head unit are provided as constructions independent from the head unit that is the object.

Abstract: A test device for a heat dissipating fan, which is suitable for testing if the fan wheel is secured to the housing firmly, includes a support post, a transverse slide unit, which is disposed at the top of the support post and provides a transverse slide seat, a vertical slide unit, which is disposed at the transverse slide seat and provides a vertical slide seat. Further, the test device provides a clamping unit, a suction unit and a sensing element, which are moved with the vertical slide seat. The clamping unit clamps the housing and the suction unit absorbs the fan wheel. The heat dissipating fan is admitted in case of the sensing unit sensing the fan wheel being incapable of moving upward under the suction force and is carried away by the transverse slide unit in case of the sensing unit sensing the fan wheel being capable of moving upward under the suction force.

Abstract: The present invention provides a substrate carrying apparatus capable of surely carrying a substrate with electronic parts mounted thereon, at low costs without causing the electronic parts to fall off the substrate, and without damaging the substrate. A substrate carrying apparatus has an arm body capable of vertical and horizontal movement. The arm body is provided with a plurality of substrate suction pads capable of sticking to the upper surface of the glass substrate by suction to hold the glass substrate, and a plurality of electronic part suction pads disposed above the electronic parts so as to correspond to the electronic parts, respectively. The electronic part suction pads are capable of sticking to the upper surfaces of the electronic parts by suction to hold the electronic parts. The suction pads are connected to a suction device by suction lines.

Abstract: A component mounting apparatus having a work conveyor-positioner unit is arranged on a supporting base to convey and position a substrate in an X direction. Supporting frames extend vertically from ends of the supporting base and face each other in a Y direction. The component mounting apparatus further includes a plurality of Y-axis tables extending between upper ends of the supporting frames, X-axis tables attached to movable portions of the Y-axis tables, and operating heads attached to movable portions of the X-axis tables to perform operations with respect to the substrate on the work conveyor-positioner unit. Each of the plurality of the Y-axis tables includes a movable portion at a lower part. Each of the X-axis tables includes a movable portion at a lower part and the operating heads are attached to a lower part of the movable portion of the X-axis tables.

Abstract: A working system for a circuit substrate enabling a control of stopping the substrate without inconvenience. A PWB detector 308 held by a Y-axis slide 252 of an XY robot 266 moving a component mounting head, has reflection type photoelectric sensors 310, 312 spaced from each other in a direction of conveyance of a PWB 12 by a conveyor 14. When the PWB 12 carried in the system, the sensors 310, 312 are moved to a position corresponding to a downstream-side edge of the PWB 12 stopped at a predetermined stop position. The PWB 12 is decelerated when detected by one of the sensors on the upstream side, and stopped at a desired position regardless of its shape, dimensions and conveying direction, when detected by the other or downstream sensor. Electronic circuit components 16 can be supplied to plural kinds of PWBs 12 with one component supply device.

Abstract: An apparatus and method are provided for detaching a die from an adhesive film, the apparatus comprising a vacuum platform having a surface configured to support a part of the adhesive film on which the die is attached. A plurality of pre-peeling columns having substantially flat contact surfaces are projectable relative to the surface of the vacuum platform to push against the adhesive film at the position of the die to generate initial peeling between the die and the adhesive film. Thereafter, a plurality of ejector pins that are positionable relative to the pre-peeling columns are operative to push against the adhesive film at the position of the die to generate further peeling between the die and the adhesive film. The die is then removed from the adhesive film.

Abstract: A suction nozzle (21) has an outer nozzle member (30), a nozzle body (40), and an urging member (50) for urging the nozzle body (40) in a direction away from the outer nozzle member (30). The suction nozzle (21) also has a spring accommodation chamber (60) defined by at least a wall surface of a nozzle body accommodation bore (32) and a proximal end face (40c) of the nozzle body (40). The spring accommodation chamber (60) is shut off from first and second suction passages (31, 32) and communicates with atmosphere. The urging member (50) is housed in the spring accommodation chamber (60).

Abstract: A component mounting apparatus includes one head unit which has a component holding member capable of holding a component and which is selected from among a plurality of types of head units according to a type of the fed component, a head moving unit which has a head fitting portion onto which the selected one head unit is removably loaded and which moves the head unit loaded on the head fitting portion in a direction extending generally along a surface of the board, and a head control unit which is provided for each of the head units and which performs control for component mounting operation by a head unit corresponding to the loaded head unit.

Abstract: In component feeding head apparatus, a head unit having a holding unit for releasably holding a component and a rotating unit for rotating the holding unit around its center of axis is set as an object of an up-and-down operation and an inverting operation, and a head lifting device for moving the head unit up and down and a head inverting device for inverting the head unit are provided as constructions independent from the head unit that is the object.

Abstract: A component mounting apparatus is proposed, which has a plurality of vacuum pick-up nozzles attached to a mount head so as to revolve about a main shaft, causing one of the vacuum pick-up nozzles to move to a location to be driven by an actuator that is provided at a designated location in the direction of revolution, and causing the vacuum pick-up nozzle to make a forward movement by the actuator for vacuum pick-up and/or mounting of a component, wherein each of the vacuum pick-up nozzles is provided with a pushed plate of a designated size in the moving direction of the vacuum pick-up nozzle at a driven portion thereof.

Abstract: A workpiece chuck includes an upper assembly on which can be mounted a flat workpiece such as a semiconductor wafer. A lower assembly is mountable to a base that supports the chuck. A non-constraining attachment means such as vacuum, springs or resilient washers applied to the chuck holds the upper assembly to the lower assembly, the lower assembly to the base and can hold the wafer to the top surface of the upper assembly. By holding the chuck together by non-constraining means, the chuck layers can move continuously relative to each other under expansion forces caused by temperature effects, such that mechanical stresses on the chuck and resulting deformation of the chuck and workpiece over temperature are substantially eliminated. A plurality of support members including inclined surfaces provided between an upper and lower portion of the chuck maintain the top surface of the chuck and any workpiece mounted thereon at a constant height over temperature.

Abstract: A contact member is supported on the support shaft. A force sensor is coupled to the support shaft. A movable member is coupled to the force sensor. The pressure apparatus allows the movable member to cause the axial movement of the support shaft. A first guide serves to guide the axial movement of the support shaft. The first guide is supported on the support member. The support member stands still during the movement of the movable member. Accordingly, the movement of the movable member is restrained in the axial direction. The contact member is thus prevented from suffering from a swinging movement around the force sensor. Servo control of a higher frequency bandwidth can be applied to the movement of the contact member. The contact member moves at a higher velocity. Occurrence of resonance is still avoided in the contact member. The tact time can be shortened.

Abstract: A method of providing electrically conductive bumps on electrode pads of a microelectronic substrate, and bumped substrate formed according to the method. The method includes: providing a substrate including first electrode pads and second electrode pads thereon, the first electrode pads exhibiting a first pattern, and the second electrode pads exhibiting a second pattern different from the first pattern; attaching first solder portions to a solder delivery head according to the first pattern, and second solder portions to a solder delivery head according to the second pattern, the second solder portions being larger than the first solder portions; after attaching, releasing the first solder portions onto the first electrode pads, and the second solder portions onto the second electrode pads; after releasing, reflowing the first solder portions and second solder portions to form, respectively, first solder bumps and second solder bumps on the electrode pads.

Abstract: A mounting apparatus includes an X-Y table for holding a board onto which components are to be mounted, and drive units for moving a mounting section by which the components are to be mounted, and also moving individual sections. When an effective torque calculated by an effective torque detecting section is decided by an effective torque deciding section as having exceeded a specified upper-limit value, rotational speed of a corresponding one of the drive units is decreased.

Abstract: Provided is a component mounter having a plurality of revolving nozzle spindles, which can simultaneously pick up and mount two or more electronic components. A head assembly for the component mounter includes: a base frame; a rotary housing rotatably mounted on the base frame and having spindle receiving holes vertically formed at regular intervals at the same radius from a center thereof; a plurality of nozzle spindles having lower ends to which nozzles for picking up electronic components are coupled, and received in the spindle receiving holes such that the plurality of nozzle spindles rotate on the same axis when the rotary housing rotates; a housing rotating mechanism rotating the rotary housing; and a nozzle lifting mechanism including a nozzle lift driving unit, and a clutch part that moves according to the operation of the nozzle lift driving unit and can simultaneously press down and lower the plurality of nozzle spindles.

Abstract: Disclosed is an electronic-component mounting apparatus 1 for mounting a plurality of electronic components onto a printed-wiring board 10, which comprises a component mounting head 4 adapted to suck up the electronic component and mount the sucked up electronic component on the printed-wiring board 10 while moving along an X-axis direction, a table 8 adapted to move the printed-wiring board 10 along a Y-axis direction, an electronic-component feeding device 12, 14 attached to the table 8 and adapted to move in sync with the movement of the printed-wiring board 10, and component image-recognition/correction means 16 for correcting a posture of the electronic component in accordance with image recognition of the posture, during the time between the sucking up and mounting of the electronic component by the component mounting head, wherein respective positions of the sucking of the electronic component, the mounting of the electronic component and the image recognition are located on the X-axis.

Abstract: An origin detection method for a component placement head includes setting an axial origin for each elevation nut section, of the component placement head, by detecting a rotational angle of a drive section corresponding to the elevation nut section. The elevation nut sections are then individually moved down from the axial origin so that light emitted from a light-projecting section is received by a light-receiving section without being interrupted. Then, it is confirmed that the axial origin of each elevation nut section is an origin of elevation by detecting interruption of light, emitted from the light-projecting section, by the elevation nut section at a position corresponding to the elevation nut section having been lowered from the axial origin by a prescribed light interruption dimension.

Abstract: A component mounting method and a component mounting apparatus for picking up an electronic component, positioning the electronic component on a circuit substrate and mounting the electronic component to the circuit substrate are adapted to perform an idling operation during a pause of component mounting operation, thereby eliminating any degradation of the component mounting accuracy due to temperature changes.

Abstract: A seal-feeding station includes a seal receiver (21) for receiving a waterproof seal (20) fed through a seal feeding tube (16) and a seal keeper (23) for keeping the waterproof seal (20) transferred from the seal receiver (21) in an electric-wire insertion position. The seal receiver (21) includes a slider board (27) which is supported slidably between a standby position and a transfer position and includes an acceptance hole (27b) in which the waterproof seal (20) is fit in when the slider board (27) is in the standby position, and a push pin (38) which is movable forward and backward, is located so as to face the acceptance hole (27b) of the slider board (27) when the slider board (27) is in the transfer position, and moves forward to push the waterproof seal (20) fit in the acceptance hole (27b) and transfer the waterproof seal (20) to the seal keeper (23).

Abstract: A chip transfer apparatus includes a first carrier for feeding chips and a second carrier for carrying works on it. The transfer apparatus also includes a transfer engine including two or more coaxial revolvers, which can revolve coaxially with each other. Each of the coaxial revolvers includes an end-effector for receiving a chip from the first carrier and transferring the received chip onto a work on the second carrier. The end-effectors of the coaxial revolvers are arranged in a circle coaxial with the revolvers. The end-effectors sequentially receive chips from the first carrier at substantially zero speed relative to the first carrier and transfer the received chips onto works on the second carrier at substantially zero speed relative to the second carrier. While the end-effectors are revolving, they undergo periodic speed change control for timing adjustment and speed adjustment for the chip reception and transfer.

Abstract: An electric-component holding apparatus including a component holder which holds an electric component and includes an engaging portion, a holder-holding member to which the component holder is detachably attached, a lock member which consists of a substantially rigid body, and which is supported by the holder-holding member such that the lock member is movable relative to the holder-holding member, and is engaged with the engaging portion of the component holder to lock the component holder to the holder-holding member, and a locked-state maintaining device which includes an operable member and an elastic member and which maintains, owing to an elastic force of the elastic member, a locked state in which the lock member is engaged with the engaging portion of the component holder.

Abstract: The present invention features a system to generate vacuum for picking up and holding a component in a component placement machine wherein the arrangement of the elements comprising the system prevents the flow of foreign matter back through the system. One arrangement locates a venturi between a valve and nozzle, thereby minimizing where vacuum exists within the system.

Abstract: A method for registering a plurality of substrates that are retained on a workpiece carrier onto an exposure mask for carrying out a photolithography process has the steps of registering and immobilizing the exposure mask onto an alignment panel having precisely fitting passthrough orifices for reception of one substrate for each passthrough orifice and inserting into the passthrough orifices of the alignment panel the substrates that are retained on the workpiece carrier.

Abstract: A die holding apparatus to form electrical contacts on individual dies is described. In one embodiment, a semiconductor device holder is used to hold individual dies for processing and reprocessing. The semiconductor device holder holds each individual die in a separate processing cavity configured to hold each individual die in a predetermined processing position. In one embodiment, a vacuum force is used to hold one or more dies in respective processing cavities with a predetermined level of force even if other adjacent die processing cavities are unoccupied by other individual dies.

Abstract: A vacuum fixture (100) for holding workpieces includes a case (10) formed with a hollow chamber (15), a plurality of suction cups (30) disposed on the case and a control valve (20). Each of the suction cups has an air aperture (33) in communication with the hollow chamber, and each of the suction cups serves to absorb a workpiece. The control valve serves to maintain and/or re-pressurize a vacuum in the hollow chamber.

Abstract: An apparatus and method is provided for detaching a semiconductor chip from an adhesive tape on which it is mounted. The apparatus comprises a platform adapted to contact the adhesive tape at a position of the chip and a retaining force generator coupled to the platform for drawing the adhesive tape in a direction away from the chip. An elevation device is projectable from the platform that is movable both laterally across a surface of the platform and vertically with respect to the platform for elevating the chip. By moving the elevation device across a width of the chip while lifting the chip, controlled lifting of the chip and propagation of delamination between the chip and the adhesive tape may be achieved.

Abstract: A depaneling system is disclosed for cutting a panel. The depaneling system comprises a tooling apparatus and a cutting apparatus. The tooling apparatus helps hold the panel in place with suction during cutting of said panel and collects dust particles generated by the cutting of the panel. The cutting apparatus is comprised of a housing, a drive motor, a cutting unit, and a drive connector. The housing separates the drive motor from the cutting unit. The housing comprises a first section and a second section separated by a dividing member. The drive connector, such as a belt, passes through the first section of the housing. The second section of the housing forms a path for the dust particles.

Abstract: In accordance with a component mounting apparatus, a component stored in a component feeder is held by a component holding member and is then mounted in a mounting position on an object. The apparatus functions to, when a mounting posture of the component in which the component is mounted onto the object is inclined with respect to a basic posture of the component by a mounting angle, hold the component from the component feeder by the component holding member that has preliminarily been rotated to the mounting angle in such a direction as to depart from a reference posture of the component holding member prior to the mounting of the component on the object. And afterwards, the component holding member is rotated in a specified direction to finally return the component holding member to the reference posture, and then the component is mounted on the object.

Abstract: The present invention provides a power supply control method which is executed by the electronic component mounting apparatus. A drive power source and a control power source are separately connected and shut-off in accordance with a command from a control device to each of component feed drive parts for driving component feed devices, a component transfer drive device for driving a component transfer device, and a circuit board positioning drive device for driving a circuit board positioning device. The control device detects an individual occurrence of a halt condition of each of constituent parts of an electronic component mounting apparatus and shuts off a drive power source to the drive device in the halt condition. Thus, wasteful power consumption is eliminated and production is continued with a necessary minimum power.

Abstract: Disclosed is a component mounting method. Moved in first and second orthogonal directions is a first mounting head section having first nozzles. The first mounting head is rotated such that the first nozzles rotate and successively pickup components from a first component supply table arranged on one side of a board transfer path. These components are then successively mounted onto a board positioned in the board transfer path. Moved in third and fourth orthogonal directions is a second mounting head section having second nozzles. The second mounting head section is rotated such that the second nozzles rotate and successively pickup components from a second component supply table arranged on an opposite side of the board transfer path. These components are then successively mounted onto the board while positioned in the board transfer path.

Abstract: A suction head is inserted between first and second cameras relatively disposed facing one another with aligned optical axes, so that the first camera takes images of a head reference mark on the suction head, and the second camera of a first part suctioned to the suction head. Next, a stage is inserted between the first and second cameras so that the first camera takes images of a second part held on the stage, and the second camera of a stage reference mark thereupon. The relative positions between the first part and the suction head, and between the second part and the stage, are calculated based upon image information from the cameras, and the suction head and the stage are positioned, the first and second parts being relatively positioned based upon positional information and relative positional information from the first and second cameras, and mounting is performed.

Abstract: A first mounting unit and a second mounting unit capable of performing component holding, component recognition, and component placement for two boards independently of each other are provided. A first conveyance path for loading and unloading the first board, and a second conveyance path for loading and unloading the second board, are independently arranged.

Abstract: An apparatus is provided for thermally coupling a heat dissipation device to a microelectronic device. A thermal compression bonding apparatus is provided comprising a bonding head adapted to apply heat and pressure to the heat dissipation device to provide the desired thermal profile to effect solidification of the interface material from the center outward.

Abstract: A component mounting apparatus and a component mounting method which improve accuracy and a rate of placement of components onto a circuit-formed member. A component sucked by a suction nozzle is recognized at a component recognizing position, a deviation of the component from a normal suction status is determined on the basis of component recognition information obtained from this recognition of the component, and a velocity of conveyance of the component for a period of time following the recognition of the component and preceding placement of the component is controlled on basis of a magnitude of the deviation. By this control, the accuracy and rate of placement of components onto the circuit-formed member can be improved.

Abstract: The invention provides a mounting method capable of coping with high density mounting, narrower pitch mounting, cavity mounting and the like. In this method, displacement amounts of a chip that is picked up from a wafer by a pick-up nozzle to be held by the pick-up nozzle, with respect to a reference attitude, are obtained, and when the chip is delivered to a mounting nozzle for actually mounting the chip onto a substrate, the displacement amounts are corrected while taking the displacement amounts into consideration, so that the mounting nozzle always holds the chip in a fixed attitude.

Abstract: In a component pressing head which holds a component with a component holding tool provided at one end of a shaft member, rotates the component around an axis of the shaft member and presses the component in an axial direction of the axis, a first voice coil motor and a second voice coil motor are disposed between a upper plate and a lower plate so as to sandwich the shaft member from opposite sides thereof, so that a load is transmitted to the shaft member from the lower plate that is coupled to movable magnet holding portions of these two voice coil motors.

Abstract: An electronic component mounting apparatus is configured to adjust a positional relationship between two axes when an error occurs in the positional relationship between the axes when a beam is moved by two drive sources. According to movement of the beam for component picking and mounting operations, linear scale signals from linear scale reading heads are inputted to a Y2 driver and a Y1 driver, respectively. Each of the Y2 driver and the Y1 driver calculates a difference between positions of the drive axes of the beam and controls a moving member of a linear motor based on the difference so as to increase thrust of one drive axis when the one drive axis is in a more backward position than another drive axis and to reduce the thrust of one drive axis when the one drive axis in a more forward position than another drive axis.

Abstract: A method for applying pressure to circuit components during a manufacturing operation. The method utilizes a plurality of compressed air pressure cylinders which are supported on a plurality of horizontal arms along different axes over a circuit board. Compressed air is supplied simultaneously to each of the cylinders, and the cylinders force the component onto a bonding position on the circuit board. The method permits heat sinks to be pressed against components located on the circuit board to bond the heat sinks to the components.

Abstract: The present invention features a method and apparatus wherein a component in a component placement machine is rejected during the placement cycle and subsequently retained in a component rejection station. A component is imaged and the image processed using an automated vision system. The image processing determines whether the component is placeable based upon a comparison of the component image to preprogrammed mechanical parameters for the component. A non-placeable component is rejected into a reject station with means to retain the component. Because a component can not escape the reject station, there is no degradation of the placement machine performance.

Abstract: Provided is an electronic parts mount apparatus for taking out semiconductor chips from a semiconductor wafer held on a wafer hold section by a transfer head comprising a plurality of suction nozzles and transporting and mounting the semiconductor chips to and on a board has a parts recognition camera disposed in a manner that it can advance to and retreat from the wafer hold section for picking up an image of the semiconductor wafer. Also provided is a method including a parts mounting step for mounting a plurality of semiconductor chips on the board by the transfer head and an image picking up step for picking up a plurality of semiconductor chips to be next taken out by the parts recognition camera which are performed concurrently.

Abstract: A suction head is inserted between first and second cameras relatively disposed facing one another with aligned optical axes, so that the first camera takes images of a head reference mark on the suction head, and the second camera of a first part suctioned to the suction head. Next, a stage is inserted between the first and second cameras so that the first camera takes images of a second part held on the stage, and the second camera of a stage reference mark thereupon. The relative positions between the first part and the suction head, and between the second part and the stage, are calculated based upon image information from the cameras, and the suction head and the stage are positioned, the first and second parts being relatively positioned based upon positional information and relative positional information from the first and second cameras, and mounting is performed.

Abstract: A method of utilizing a removable protective tape to protect the active surfaces of semiconductor wafer and the individual semiconductor chips during semiconductor packaging processes is provided along with several configurations of apparatuses that may be used in such a method for removing protective tape portions from individual semiconductor chips during the assembly process.

Abstract: An apparatus for mounting semiconductors contains a bonding station, whereby the bonding station comprises a wafer table for presenting the semiconductor chips, a substrate table and a pick and place system with a bondhead with a chip gripper. Part of the wafer table is located underneath the substrate table. The pick and place system has a first linear motor that comprises a rigidly arranged stator and a shuttle that can be moved in a first direction guided by first guide elements, and a second linear motor that comprises a rigidly arranged stator and a shuttle that can be moved in a second direction. The shuttle of the first linear motor has second guide elements that guide the shuttle of the second linear motor. The bondhead with the chip gripper is arranged on the shuttle of the second linear motor.

Abstract: There is provided a plurality of component mounting apparatuses for sucking a plurality of components by a mounting head section and successively mounting the components onto a board located at a board positioning section. The component mounting apparatuses are arranged in parallel to one another, and a board transfer path is provided so that it penetrates the component mounting apparatuses. Even when the number of components to be mounted onto the board increases, the components are mounted on the component supply tables of the component mounting apparatuses as distributed thereto, and therefore, the whole apparatus is not dimensionally increased. The component supply tables are fixedly installed so as to become free of vibration, and the mounting head section executes the suction and the mounting of the plurality of components. Therefore, the component mounting operation speed can be remarkably increased.

Abstract: A disc centering device includes a base plate, a chuck which is installed on the base plate, a hub unit which is detachably engaged to the chuck and receives discs and spacers to be stacked, disc pushers which are slidably provided outside the hub unit and include corresponding pressure members which center the discs by pushing circumferences of the discs, a driving unit which slides the disc pushers, and biasing units which are slidably provided outside the hub unit and push circumferences of the spacers. Accordingly, by performing a spacer biasing along with a disc centering, the accuracy of a centering is increased, thereby providing the discs having data recorded thereon with a uniform quality. Additionally, vibration of a rotation body can be minimized due to the simple configuration of the disc centering device. Furthermore, the productivity and manufacturability of HDDs are improved in view of the simplified maintenance and repair of the same.

Abstract: A component mounting apparatus have a pair of component supply sections, and first and second mounting head sections. Each of the first and second head sections has a rotary member driven about a horizontal axis, component suction nozzles attached to the rotary member, driving mechanisms for rotating corresponding component suction nozzle, and a recognition section for recognizing components sucked by the component suction nozzle. Each of the first and second mounting head section performs successive suction, recognition, posture adjustment, and mounting of the components.