With Work-holder For Assembly Patents (Class 29/760)
  • Patent number: 11652392
    Abstract: A pre-fitting nest and a method serve for forming a crown from a plurality of U-shaped electrically conductive hairpins to then be able to install the crown in a machine element of an electric machine, e.g., a stator. Here, an accommodating member has a plurality of grooves in which the legs of the hairpins are accommodated. The grooves are annularly disposed about a center and extend perpendicularly to the plane of the accommodating member. With respect to their size and geometry, they are configured such that in each case a first leg of a hairpin rotates within the groove thus to enable an unconstrained positioning of the second leg of the hairpin in another groove. One or several crowns formed from hairpins are provided for introduction into a machine element and inserted into the machine element.
    Type: Grant
    Filed: November 10, 2021
    Date of Patent: May 16, 2023
    Assignee: GROB-WERKE GmbH & Co. KG
    Inventors: Manfred Metzger, Markus Schmölz
  • Patent number: 11616426
    Abstract: A method and an apparatus are provided for manufacturing a stator with a plurality of hairpin conductors. For inserting the hairpin conductors (15, 15) into the slots (11) of a stator core (12) a stator core template (22) is provided. Hairpin conductors (15) are axially inserted into slots (21) of the stator core template (22) such that the hairpin conductor (15) is arranged at a first position (P1) within said slot (21). The hairpin conductor (15) is then moved within said slot (21) to a different position (P2). A complete nest (20) of hairpin conductors (15) formed within the stator core template (22) is then transferred to the stator core (12).
    Type: Grant
    Filed: October 9, 2019
    Date of Patent: March 28, 2023
    Assignee: ATOP S.p.A.
    Inventors: Massimo Ponzio, Rubino Corbinelli, Daniele Nocciolini
  • Patent number: 11410918
    Abstract: An integrated circuit package and a method of forming the same are provided. A method includes forming a first redistribution layer over a carrier, the first redistribution layer including a contact pad and a bond pad. A conductive pillar is formed over the contact pad. A backside surface of an integrated circuit die is attached to the bond pad using a solder joint. An encapsulant is formed along a sidewall of the conductive pillar and a sidewall of the integrated circuit die, a front-side surface of the integrated circuit die being substantially level with a topmost surface of the encapsulant and a topmost surface of the conductive pillar. A second redistribution layer is formed over the front-side surface of the integrated circuit die, the topmost surface of the encapsulant and the topmost surface of the conductive pillar.
    Type: Grant
    Filed: February 28, 2018
    Date of Patent: August 9, 2022
    Inventors: Chen-Hua Yu, Hung-Jui Kuo, Ming-Che Ho, Tzung-Hui Lee
  • Patent number: 11381040
    Abstract: An external conductor terminal (22) comprises: a terminal body (45) that can surround the outer periphery of an internal conductor terminal (21); a back plate part (43) that is displaced from an open state to a closed state in relation to the terminal body (45), and seals a back-surface opening of the terminal body (45) in the closed state; and a side plate part (44) that connects to the back plate part (43), and constitutes a part of a side-surface portion of the terminal body (45) in the closed state. The back plate part (43) has a base plate connection piece (49) that projects out toward a circuit board (90). The side plate part (44) has: a linear-shaped slit (53) that extends toward the circuit board (90); and a locking part (54) that is bent and raised through the slit (53), is locked to the terminal body (45), and holds the back plate part (43) in the closed state.
    Type: Grant
    Filed: March 28, 2019
    Date of Patent: July 5, 2022
    Inventor: Takuma Hibino
  • Patent number: 11381061
    Abstract: A system for servicing cable includes a field-end assembly and a live-end assembly, each mounted on a support structure having at least one drive mechanism operable to cause relative linear movement between the field-end assembly and the live-end assembly. A drilling-and-shorting assembly can create a short circuit in a field-end of the cable, and a continuity tester can test the integrity of the short-circuit. The field end of the cable can then be ejected from the system, and an end-cap-cradle assembly can position an end cap on a live end of an electrical cable and test its installation.
    Type: Grant
    Filed: December 16, 2019
    Date of Patent: July 5, 2022
    Assignees: ULC Technologies, LLC, Consolidated Edison Company of New York, Inc.
    Inventors: Alex Symington, Dennis John Semet, Caner Oktayer, Aalap Rajendra Shah, Than Lin Htaik, Patrick McHugh, Maggie Chow, George Murray, Luis Jerez, Thomas Campbell, Michael Baratta
  • Patent number: 11328842
    Abstract: Systems and methods for designing and assembling form boards with attached wire routing devices for use in wire bundle assembly. The assembly method comprises: (a) establishing a coordinate system of a form board having a multiplicity of holes; (b) using a computer system to determine locations of form board devices of different types with reference to the coordinate system of the form board based on engineering data specifying a wire bundle configuration; and (c) fastening the form board devices of different types to respective holes of the form board having centers closest to respective locations determined in step (b). The form board devices may be inserted robotically or manually.
    Type: Grant
    Filed: October 28, 2019
    Date of Patent: May 10, 2022
    Assignee: The Boeing Company
    Inventors: Lars E. Blacken, Damien O. Martin, Eerik J. Helmick, Keith M. Cutler, John R. Porter
  • Patent number: 11024864
    Abstract: An assembly device may be employed to vertically stack a fuel cell stack having alternating membrane-electrode units and bipolar plates. The assembly device may include a base plate, a cover plate, and connecting pieces positioned at each of two end faces of the base plate and cover plate. A substantially cuboidal assembly chamber may be defined inside the assembly device by a plurality of vertically oriented locating strips, in order, via the locating strips, to position the membrane-electrode units and bipolar plates relative to one another during stacking. The assembly device may further include a drive for synchronous displacement of the locating strips.
    Type: Grant
    Filed: October 12, 2017
    Date of Patent: June 1, 2021
    Inventor: Andreas Walter
  • Patent number: 10893612
    Abstract: The disclosure relates to methods and compositions for direct printing of rigid flexible electronic objects. Specifically, the disclosure relates to methods, systems and compositions for the direct, optionally simultaneous inkjet printing of rigid-flexible electronics, for example, rigid-flexible PCBs, FPCs, TFTs, antennae solar cells, RFIDs and the like, using a combination of print heads with flexible and rigid conductive and dielectric ink compositions.
    Type: Grant
    Filed: January 11, 2018
    Date of Patent: January 12, 2021
    Assignee: Nano Dimension Technologies Ltd.
    Inventors: Hila Elimelech, Einav Amit
  • Patent number: 10751845
    Abstract: The invention relates to a supporting device for a plurality of components (100, 200, 100*) with different geometries, in particular for a plurality of geometrically different motor-vehicle external attachments made of polymer material, having a support frame (30), a drive (40) arranged on the support frame (30) and at least two supporting groups (1, 2, 3, 4, 5) arranged on the support frame (30), wherein each supporting group (1, 2, 3, 4, 5) serves as a supporting surface for a particular component geometry, wherein each supporting group (1, 2, 3, 4, 5) has at least two spaced-apart, disc-shaped supporting elements (1?, 1?, 1??; 2?, 2?, 2??, etc.), the upwardly facing rim (10?, 10?, 10??; 20?, 20?, 20??, etc.) of each of which already has, in the unloaded state, a contour adapted to the geometry of the associated component (100, 200, 100*). By means of the drive (40), the supporting elements (1?, 1?, 1??; 2?, 2?, 2??, etc.) are movable such that only the supporting elements (1?, 1?, 1??; 2?, 2?, 2??, etc.
    Type: Grant
    Filed: October 24, 2016
    Date of Patent: August 25, 2020
    Assignee: Rehau AG + Co.
    Inventor: Bernd Grund
  • Patent number: 10554110
    Abstract: Displacement devices comprise a stator and a moveable stage. The stator comprises a plurality of coils shaped to provide pluralities of generally linearly elongated coil traces in one or more layers. Layers of coils may overlap in the Z-direction. The moveable stage comprises a plurality of magnet arrays. Each magnet array may comprise a plurality of magnetization segments generally linearly elongated in a corresponding direction. Each magnetization segment has a magnetization direction generally orthogonal to the direction in which it is elongated and at least two of the magnetization directions are different from one another. One or more amplifiers may be connected to selectively drive current in the coil traces and to thereby effect relative movement between the stator and the moveable stage.
    Type: Grant
    Filed: March 13, 2018
    Date of Patent: February 4, 2020
    Assignee: The University of British Columbia
    Inventors: Xiaodong Lu, Irfan-Ur-Rab Usman
  • Patent number: 10238020
    Abstract: A positive pressure command value which is appropriate for releasing a component is registered in component data, and a control device of a component mounting machine obtains the positive pressure command value to be used in releasing the component suctioned to the suction nozzle, and adjusts output positive pressure of the electropneumatic proportional valve by outputting the positive pressure command value to the electropneumatic proportional valve, with reference to the component data of the component suctioned to the suction nozzle.
    Type: Grant
    Filed: July 12, 2013
    Date of Patent: March 19, 2019
    Inventor: Jinya Imura
  • Patent number: 10104820
    Abstract: A mounting machine acquires identification information arranged in a back-up plate, from the back-up plate. The mounting machine controls a conveyance unit so as to change a conveyance lane based on mounting conditions when the acquired identification information is identification information which is included in the mounting conditions of a printed circuit board. Meanwhile, in the mounting machine, when the acquired identification information is not the identification information which is included in the mounting conditions of the printed circuit board, the conveyance lane is stopped from being changed. In this manner, a conveyance width of the conveyance lane is not changed when the back-up plate which is ready to be subjected to mounting processing and matches the mounting conditions is not mounted.
    Type: Grant
    Filed: September 24, 2013
    Date of Patent: October 16, 2018
    Inventor: Hidetoshi Kawai
  • Patent number: 10010985
    Abstract: When plate-shaped components are inserted in the correct order and orientation into component insertion grooves of a component assembly jig, the component insertion grooves are blocked by the plate-shaped components, and the blowing of compressed air is stopped. When the blowing of compressed air from the component insertion grooves is stopped, the pressure in a compressed-air path increases, and an alignment-complete lamp is illuminated. Using the component assembly jig enables an assembly operation for overlapping the plurality of plate-shaped components in the correct order and orientation, without excess or deficiency, to be efficiently performed without error.
    Type: Grant
    Filed: February 25, 2015
    Date of Patent: July 3, 2018
    Assignee: TOPY FASTENERS, LTD.
    Inventors: Yuji Akahane, Makoto Aoyama
  • Patent number: 9919374
    Abstract: A gripper sensor device for aligning fine wires. The robotic gripper sensor device including a housing having a probe receiving cavity. A sensor probe is positioned in the probe receiving cavity. An arm of a positioning member includes a wire engagement section for engaging respective fine wires and a probe engagement section for engaging a portion of the sensor probe. As the wire engagement section is moved into cooperation with the wire, force is applied to the arm of the positioning member causing the probe engagement section to move relative to the portion of the probe, causing the probe to convert a stress change of the portion of the probe into a force reading.
    Type: Grant
    Filed: October 9, 2015
    Date of Patent: March 20, 2018
    Inventors: Huadong Wu, Yasser M. Eldeeb
  • Patent number: 9009952
    Abstract: An apparatus for assembling a lens module and an image sensor to form a camera module. The apparatus comprises i) a positioning system for adjusting a relative arrangement between the lens module and the image sensor; and ii) an inspection system operative to view fiducials of the lens modules and the image sensor. In particular, the positioning system is configured to align the lens module and the image sensor based on a relative alignment of the respective fiducials of the lens module and the image sensor as viewed by the inspection system. A method of assembling a lens module and an image sensor to form a camera module is also disclosed.
    Type: Grant
    Filed: August 29, 2011
    Date of Patent: April 21, 2015
    Assignee: ASM Technology Singapore Pte. Ltd.
    Inventors: Po Lam Au, Ming Lok Yeung, Tung Yeung Tsoi, Yu Luen Suen
  • Patent number: 8973256
    Abstract: An electrical terminal applicator system includes a die connected to a press. A one-piece member includes a stock guide portion homogeneously connected to a tool receiving portion. The one-piece member is releasably secured to the die using only a single fastener. A male member extends from either one of the one-piece member or the die, and a female slot is created in the other one of the one-piece member or the die slidably receiving the male member to permit the one-piece member to be horizontally positioned on the die prior to securing the one-piece member using the single fastener.
    Type: Grant
    Filed: September 26, 2013
    Date of Patent: March 10, 2015
    Assignee: Odyssey Tool, L.L.C.
    Inventors: Douglas A. Particka, George J. Tilli
  • Patent number: 8973235
    Abstract: A pulling head work station for attaching the lugs of pulling heads to cables, so that the cables may be pulled simultaneously through a conduit. The pulling head work station includes staggered cable receiving jigs, each jig having two clamps to hold a corresponding cable in place during attachment of a pulling lug. A chop saw to cut the cables and a crimper to secure a pulling lug to each stripped end portion of a cable may be slidably mounted to a work surface of the work station. A wire stripper may be removably attached to the work station.
    Type: Grant
    Filed: October 18, 2013
    Date of Patent: March 10, 2015
    Assignee: Cerro Wire LLC
    Inventors: Douglas P. Henderson, Joshua K. Young, Jeffery D. Kennedy
  • Patent number: 8966743
    Abstract: A device for changing the electrode of an electrode-holder tool of a welding device, with a first part configured to house an electrode-holder tool and including means to prevent the electrode-holder tool from moving, and a second part installed around the first part and covering the part of the electrode protruding outside the first part, where the second part can be separated from the first part by sliding along the electrode, and is able to rotate relative to the fixed part when it surrounds it, and where the second part is configured to tighten or untighten the mandrel and to attach the electrode and the second part, enabling it to be removed from the mandrel when the first part and the second part are separated.
    Type: Grant
    Filed: October 18, 2010
    Date of Patent: March 3, 2015
    Assignee: Areva NC
    Inventors: Jean-Luc Allard, Jean-Pierre Schwanck
  • Patent number: 8959754
    Abstract: An apparatus is provided comprising a base frame having a turntable, and a vertical section configured to be mounted on the turntable via a slidable mounting platform. The vertical section has a tapered wedge configured to move up and down the vertical section. The turntable is configured to rotate at least 360 degrees, and the vertical section is configured to move in a radial direction with respect to a center of rotation of the turntable.
    Type: Grant
    Filed: June 27, 2012
    Date of Patent: February 24, 2015
    Assignee: General Electric Company
    Inventors: Syed Wajahat Ali, Gregory Eugene Dobbert, John Matthew Sassatelli, Andrew John Tomko
  • Patent number: 8938875
    Abstract: A component aligning apparatus includes a component aligning jig, in which electronic components to be aligned have a rectangular parallelepiped shape whose length dimension is L, width dimension is W, and thickness dimension is T, the component aligning jig includes electronic component accommodating recesses opening on a surface, the depth Z of the accommodating recesses is shorter than the length L of the electronic components so that a single electronic component is held in each of the electronic component accommodating recesses while partially projecting upwards from each of the recesses with the WT surface on one side facing up, and letting s be the shortest separation that is larger than the thickness T and is the narrowest distance between opposing inside surfaces of each of the accommodating recesses when each of the accommodating recesses is seen in plan view, W>S>T.
    Type: Grant
    Filed: November 23, 2011
    Date of Patent: January 27, 2015
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Toshiki Miyazaki
  • Publication number: 20150013890
    Abstract: A system, topology, and methods placing a protection module on one or more surfaces of a device, in particular on an electronic device. Architecture including multiple layer protection module and alignment tool. Other embodiments may be described and claimed.
    Type: Application
    Filed: March 6, 2014
    Publication date: January 15, 2015
    Inventor: Ramin Rostami
  • Patent number: 8910375
    Abstract: The purpose of the invention is to provide a mounting apparatus that can mount a part such as a chip, etc. on a substrate effectively and precisely. A wafer is placed on the upper surface of turntable, which has opening section, and a backup section and a head section that hold a chip are lifted up and lowered respectively, at opening section. The wafer and the chip are contacted, pinched and held locally, and then they are heat-bonded. After that, the backup section and the head section are removed. Lift arms equipped on a holding table are inserted between the wafer and turntable, the wafer is lifted up, and opening section is moved relative to the wafer when turntable is rotated. The wafer is placed on turntable again and the bonding process is performed.
    Type: Grant
    Filed: June 2, 2009
    Date of Patent: December 16, 2014
    Assignees: Adwelds Corporation, Elpida Memory, Inc.
    Inventors: Seiya Nakai, Shinichi Sakurada
  • Patent number: 8898890
    Abstract: According to the present invention, an apparatus for manufacturing a multichannel electrode array for cranial nerve stimulation comprises: an electrode support supporting a plurality of electric wires, and having a plurality of platinum rings inserted therein; a frame member including a base, a pair of vertical frames, and a horizontal frame to fix the electrode support; a rotating member into the center of which the electrode support is inserted, and which rotates such that electric wires are twisted, pair by pair, at the electrode support so as to form a grid, when bobbins that are wound with the electric wires slide; an elevating plate rotatably and slidably supporting the rotating member; and a pair of left-side and right-side control units and which rotate the rotating member such that the rotating member slides along a length equal to that the grid.
    Type: Grant
    Filed: April 28, 2010
    Date of Patent: December 2, 2014
    Assignee: M.I.Tech Co., Ltd.
    Inventors: Se-Ik Park, Hoseung Lee, Jung Min Lee, Ho Yun
  • Patent number: 8893374
    Abstract: Method and Apparatus are provided for automatically disposing plural wires along predetermined trajectories, wherein the plural wires extend from coils wound in slots of dynamoelectric machine cores. Plural wires forming leads are located in predetermined positions and caused to extend along predetermined directions by means of manipulating equipment and tooling which operates automatically. In addition, the equipment and tooling cause the plural wires to become twisted and cut to form portions for connection to terminals. The tooling is provided with reference surfaces and seats which are used to bend the plural wires along the predetermined trajectories and to provide a position constraint for the portions becoming twisted. Apparatus can be provided for positioning portions of a plurality of restraining members in the spacing existing between the bridges of the coils and the end faces of a dynamo electric machine core.
    Type: Grant
    Filed: May 22, 2013
    Date of Patent: November 25, 2014
    Assignee: ATOP S.p.A.
    Inventors: Massimo Ponzio, Gianfranco Stratico, Rubino Corbinelli, Paolo Nesti
  • Publication number: 20140317917
    Abstract: Systems, methods and apparatuses for attaching devices to ends of a circuit board. An exemplary method includes removing or creating at least a portion of a sacrificial part of a circuit board based on a predefined pattern, inserting a holder device into a remaining portion of the sacrificial part of the circuit board, placing a device at a predefined location on the circuit board, wherein the device is at least partially supported by a portion of the holder device, attaching the device to the circuit board and removing the holder device and the sacrificial part of the circuit board.
    Type: Application
    Filed: April 17, 2014
    Publication date: October 30, 2014
    Applicant: Signalcraft Technologies
    Inventors: Bernard Gobeil, Todd Smiley, Jason McKay
  • Publication number: 20140310948
    Abstract: A system for assembling a luminaire comprising a housing, a computer-controlled manipulation device, and a parts repository defined within the housing and configured to carry a plurality of light modules, a plurality of luminaire housings of various luminaire housing types, and a plurality of optics of various optic types. The system further comprises a programming device configured to program a light module of the plurality of light modules to emit light having lighting characteristics. Each of the light modules are configured to be removably couplable to the computer-controlled manipulation device. The luminaire housings each comprise a locking tab configured to permit the respective light modules to engage therewith, thereby enabling attachment of the respective light modules to the respective luminaire housings. Each of the optics comprise a locking tab configured to permit a respective luminaire housing to engage therewith, enabling attachment of the respective luminaire housing to the respective optic.
    Type: Application
    Filed: April 21, 2014
    Publication date: October 23, 2014
    Inventors: Fredric S. Maxik, Robert R. Soler, David E. Bartine, Valerie A. Bastien, Matthew Regan, James Lynn Schellack
  • Patent number: 8857045
    Abstract: A method of assembling a circuit board assembly is provided. The circuit board assembly includes a circuit board assembly fixture and a plurality of fixed circuits. The method includes coupling the plurality of fixed circuits to the circuit board assembly fixture. The plurality of fixed circuits includes at least one of a fully flexible circuit, a flexible circuit having stiffeners, and a rigid circuit. The fixture includes a plurality of supporting surfaces each including a first side, configured to receive at least one of the fixed circuits, and an opposite second side. The fixture includes at least one hinge, at least one fastening mechanism extending from the first side, and at least one retainer coupled to at least one of the plurality of supporting surfaces. The method includes folding the circuit board assembly fixture into a desired alignment.
    Type: Grant
    Filed: June 2, 2011
    Date of Patent: October 14, 2014
    Assignee: General Electric Company
    Inventors: Ryan Adam Conger, Robert Ivan Rose, Dale Stewart Apgar, Robert Paul Stachow, Jr.
  • Patent number: 8857044
    Abstract: An system for manufacturing a field emission structure is provided that involves a magnet supplying device and a magnet placement device for placing each of a plurality of magnets at a corresponding location of a plurality of locations of the field emission structure. The corresponding location and a corresponding orientation of each of the magnets relative to each other are defined in accordance with a code that specifies at least one magnet of the plurality of magnets having a first polarity orientation and at least one other magnet of the plurality of magnets having a second polarity orientation that is opposite from the first polarity orientation.
    Type: Grant
    Filed: December 18, 2012
    Date of Patent: October 14, 2014
    Assignee: Correlated Magnetics Research LLC
    Inventors: Larry W. Fullerton, Mark D. Roberts
  • Patent number: 8850695
    Abstract: Printed circuit board (PCB) assembly tooling and methods are provided. Particular tooling includes a first tooling fixture having a first core component receiver to receive a first portion of a magnetic core to be coupled to a first side of a PCB. The tooling also has a second tooling fixture including a second core component receiver to receive a second portion of the magnetic core to be coupled on a second side of the PCB to the first portion of the magnetic core. The tooling also has an alignment component disposed on at least one of the first tooling fixture and the second tooling fixture. The alignment component enables alignment of the first tooling fixture and the second tooling fixture. When the first tooling fixture and the second tooling fixture are aligned, the first portion of the magnetic core and the second portion of the magnetic core are aligned.
    Type: Grant
    Filed: January 5, 2010
    Date of Patent: October 7, 2014
    Assignee: The Boeing Company
    Inventors: Norman L. Call, Jose M. Chavez, Rodolfo Chavez
  • Publication number: 20140272521
    Abstract: New electrochemical battery recharging, refurbishment and replacement techniques are provided. In some aspects of the invention, small, fungible battery elements may be immersed in a fluid and delivered via a bifurcated pump interface that simultaneously unloads discharged cells and loads new, charged cells, to accomplish rapid cell replacement and recharging. The cells may be magnetically aligned to bring cathode and anode elements together, in series, and bridge contacts within a container (powering an appliance). Density differentials between charged and discharged elements may aid in placing them in series (with similar charge states and capacities) and in removing them during replacement. In other aspects, electrode elements may be rapidly flushed to accomplish rapid recharging, in a staged process.
    Type: Application
    Filed: March 15, 2013
    Publication date: September 18, 2014
    Inventor: Christopher V. Beckman
  • Patent number: 8826524
    Abstract: Provided is a fitting tool for a liquid absorber which is included in a liquid ejecting apparatus having a liquid ejecting head for ejecting liquid from nozzle openings formed in a nozzle forming surface and fits the liquid absorber for absorbing the liquid in a cap which is capable of being abutted to the liquid ejecting head so as to cover the nozzle openings, the fitting tool including: a holding portion which holds the liquid absorber; and a locking portion which has elasticity and is locked to a portion of the cap when the holding portion is inserted into the cap.
    Type: Grant
    Filed: July 23, 2008
    Date of Patent: September 9, 2014
    Assignee: Seiko Epson Corporation
    Inventors: Hiroki Matsuoka, Atsushi Yoshida
  • Patent number: 8813333
    Abstract: A method for servicing a stator frame of a power generator includes removing a first stator core from a main housing of the frame. A support assembly including a plurality of rails and a trolley is used to insert second laminations of a second stator core into the main housing. The rails extend axially within a bottom portion of the main housing and provide support for the trolley and for the second laminations as they are being inserted into the main housing. The trolley is provided for axial movement on the rails for inserting the second laminations into the main housing.
    Type: Grant
    Filed: May 11, 2012
    Date of Patent: August 26, 2014
    Assignee: Siemens Energy, Inc.
    Inventors: Travis J. Vitello, David T. Allen
  • Patent number: 8813350
    Abstract: A ball grid array presentment apparatus and associated method are provided. The apparatus has a stationary guard defining a first passage. A core is mounted adjacent to the stationary guard, the core being operably moveable between an unload position and a second position. The core defines a second passage and supports a workpiece fixture operably retaining the ball grid array. The unload position of the core operably aligns the second passage to the first passage, the aligned passages being sized to permit access to unload the ball grid array from the workpiece fixture. The second position of the core operably misaligns the second passage from the first passage whereat the core and the stationary guard cooperatively form an enclosure around the workpiece fixture containing a supply of balls that are not retained in the ball grid array.
    Type: Grant
    Filed: June 3, 2011
    Date of Patent: August 26, 2014
    Assignee: Seagate Technology LLC
    Inventors: Niandong Liu, William A. Nelson, James O. Anderson
  • Patent number: 8763239
    Abstract: A system for transferring a nanostructure from a die to a flat side of a large-area substrate. The system has a substrate holder that receives the substrate on a substrate receiving surface. A structural surface of the die is oriented parallel to and opposite the substrate receiving surface. An adjusting means receives the substrate holder and adjusts the position of the substrate relative to the die in an x-direction, y-direction and a rotational direction. An actuator device includes at least two separately controllable actuators that each independently imposes a force in a direction orthogonal to the substrate receiving surface. A force measuring cell is in each actuator for measuring the force applied on the die or substrate. The forces, in combination, produce a single, controllable resultant force at a predetermined location. The single, resultant force is orientated in a direction orthogonal to the substrate receiving surface of the substrate holder.
    Type: Grant
    Filed: November 7, 2008
    Date of Patent: July 1, 2014
    Assignee: EV Group E. Thallner GmbH
    Inventors: Friedrich Paul Lindner, Thomas Glinsner, Markus Wimplinger
  • Patent number: 8735218
    Abstract: A method of producing an electronic module with at least one electronic component and one carrier. A structure is provided on the carrier so that the electronic component can take a desired target position relative to the structure. The structure is coated with a liquid meniscus suitable for receiving the electronic component. Multiple electronic components are provided at a delivery point for the electronic components. The carrier, with the structure, is moved nearby and opposite to the delivery point, where the delivery point delivers one of the electronic components without contact, while the structure on the carrier is moving near the delivery point, so that after a phase of free movement the electronic component at least partly touches the material, and the carrier, with the structure, is moved to a downstream processing point, while the electronic component aligns itself to the structure on the liquid meniscus.
    Type: Grant
    Filed: December 1, 2009
    Date of Patent: May 27, 2014
    Assignee: Muehlbauer AG
    Inventors: Michael Max Mueller, Helfried Zabel, Hans-Peter Monser
  • Patent number: 8726494
    Abstract: An elastic material, in which at least the surface thereof is adhesive and conductive, is provided on a plate, and while a substrate constituting a component of an electronic part is held on the surface of the elastic material by the adhesiveness of the elastic material, an element such as a semiconductor chip is mounted at a fixed location on the substrate.
    Type: Grant
    Filed: October 6, 2009
    Date of Patent: May 20, 2014
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Akio Katsube, Hideo Nakagoshi, Hidemasa Kawai
  • Patent number: 8722275
    Abstract: An apparatus for fuel cell stacking includes an assembly jig having a base; an alignment assembly configured to be engaged with the base; and a compression assembly configured to be engaged with the alignment assembly.
    Type: Grant
    Filed: July 8, 2011
    Date of Patent: May 13, 2014
    Assignee: Oorja Protonics Inc.
    Inventors: Derek Kwok, Paul Knauer, Sergio Sanchez-Chopit
  • Patent number: 8707550
    Abstract: A bonding apparatus for bonding electronic devices including substrates comprises first and second rails arranged adjacent to each other which are configured to align the substrates in vertical orientations during transportation along the rails. A bonding system is locatable over a first bonding site which is located along the first rail and a second bonding site which is located along the second rail. A first indexer is located adjacent to the first rail and a second indexer is located adjacent to the second rail wherein each indexer is independently operative to transport a substrate along one rail while a substrate held on the other rail is being bonded. A container located at one end of the rails for holding multiple unbonded substrates is operative to feed unbonded substrates directly to the rails.
    Type: Grant
    Filed: July 24, 2009
    Date of Patent: April 29, 2014
    Assignee: ASM Technology Singapore Pte Ltd
    Inventors: Keng Yew James Song, Ka Shing Kenny Kwan, Choong Kead Leslie Lum, Ting Yu He
  • Patent number: 8708321
    Abstract: A secondary battery, a jig suitable for fabrication of the secondary battery, and a method for producing a secondary battery constructed with a case accommodating the electrode assembly. The case includes a front portion terminated along opposite edges by a first wing portion and a second wing portion, and a back portion positioned opposite to the front portion, with insulating film bent along a length of a junction between the front portion and each of the first wing portion and the second wing portion, a pair of holes in the insulating film are held in parallel alignment with respect to the length of the junction, with the insulating film adhering to and covering the front portion and a corresponding one of the first wing portion and the second wing portion, in order to prevent leakage of electrolyte, and resulting corrosion of the electrically conducting metal components of the secondary battery.
    Type: Grant
    Filed: February 9, 2012
    Date of Patent: April 29, 2014
    Assignee: Samsung SDI Co., Ltd.
    Inventor: Sung-Ho Hong
  • Patent number: 8707549
    Abstract: The present invention relates to ultrasound transducers for ultrasonic imaging systems and, in particular, to improved grip assemblies for ultrasound transducers. One grip assembly includes a locking plate defining first and second apertures and a coupling post extending from the locking plate. An interface plate has a first elongate extension being extendable at least partially through the first aperture and a second elongate extension being extendable at least partially through the second aperture. A handle is coupled to the locking plate and includes a grip, a coupling interface, and a neck extending between the grip and the coupling interface. The coupling interface defines a coupling aperture for receiving the coupling post.
    Type: Grant
    Filed: April 9, 2012
    Date of Patent: April 29, 2014
    Assignee: Boise State University
    Inventors: Joie Burns, Michelle Sabick, Seth Kuhlman, Carly Lockard, Brittany Siewert
  • Patent number: 8689436
    Abstract: An align fixture for aligning an electronic component having a receptacle adapted to receive the electronic component and having a first abutting section and a second abutting section, the align fixture further having a first elastic unit and a second elastic unit, the first abutting section is flexibly mounted via the first elastic unit, and the second abutting section is flexibly mounted via the second elastic unit, and the first abutting section and the second abutting section are together adapted to floatingly engage the electronic component.
    Type: Grant
    Filed: August 17, 2010
    Date of Patent: April 8, 2014
    Assignee: Multitest Elektronische Systeme GmbH
    Inventors: Thomas Hofmann, Helmut Scheibenzuber
  • Patent number: 8683676
    Abstract: Disclosed is a gripper for use with a disk clamp end effecter in a disk drive manufacturing process used for mounting a disk clamp to a disk in the manufacturing of a disk drive. The gripper comprises: a disk gripper housing, a lip seal gripper mounted to the disk gripper housing, and a vacuum channel. The lip seal gripper includes an upper portion that fits into the disk gripper housing and a lower portion that has a surface. The surface is configured to extend around the disk clamp to press against the disk clamp. The vacuum channel extends from the upper portion of the lip seal gripper to the lower portion of the lip seal gripper to provide a vacuum to the lip seal gripper such that the surface of the lip seal gripper is gripped by the vacuum to the surface of the disk clamp around the disk clamp.
    Type: Grant
    Filed: April 29, 2011
    Date of Patent: April 1, 2014
    Assignee: Western Digital Technologies, Inc.
    Inventors: David Wuester, Sr., Dean Albert Tarrant
  • Patent number: 8683680
    Abstract: An align fixture for aligning an electronic component having an elastic unit plate having an elastic unit receiving section, a receptacle adapted to receive the electronic component and having a first abutting section and a second abutting section, and an elastic unit, the first abutting section being flexibly mounted via the elastic unit, the elastic unit is adapted to exert a force to align the electronic component to the second abutting section, and the elastic unit is a separate elastic member adapted to be mounted at the elastic unit receiving section.
    Type: Grant
    Filed: August 17, 2010
    Date of Patent: April 1, 2014
    Assignee: Multitest Elektronische Systeme GmbH
    Inventor: Thomas Hofmann
  • Publication number: 20140082926
    Abstract: Embodiments described herein take the form of fixtures to be used in a manufacturing process. In particular, a manufacturing fixture may be sized to accept one or more electronic components, such as a printed circuit board (PCB) having various electrical elements. The PCB may be placed on the fixture in a predetermined area. The PCB may be placed in a depression or aperture sized to accept the PCB. When the PCB is placed within the fixture, a cover may be lowered or otherwise placed across the PCB in order to hold the PCB in place. The cover contacts the PCB and is pliable or malleable to conform to those portions of the PCB it contacts. When the cover is closed, a negative pressure may be induced in the fixture beneath the cover. When the PCB is held in position, the manufacturing fixture may operate on the PCB.
    Type: Application
    Filed: September 27, 2012
    Publication date: March 27, 2014
    Applicant: Apple Inc.
    Inventors: Ching Yu John Tam, Ching-Cheng Huang, Xingqun Li
  • Patent number: 8671558
    Abstract: A terminal crimping device where an electric wire is moved from a wire stripping section to a terminal crimping section, with both ends of the wire held by two wire holding hands of a wire conveying hand, and is subjected to terminal crimping processing by terminal crimping pressing devices. The terminal crimping device has the second wire conveying hand for conveying the wire at the terminal crimping section. The wire conveying hand conveys the wire without passing it from one side of the wire crimping pressing devices to the other side, so that an occurrence of a holding failure of the wire is suppressed even if the number of the terminal crimping pressing devices is increased or the conveyance speed of the wire is increased.
    Type: Grant
    Filed: August 16, 2012
    Date of Patent: March 18, 2014
    Assignees: The Furukawa Electric Co., Ltd., Furukawa Automotive Systems Inc.
    Inventor: Etsuro Kihara
  • Patent number: 8661657
    Abstract: A plurality of indicated back-up pin devices are detachably placed on a back-up plate provided on a component mounting apparatus, to a plurality of indicated positions of the back-up plate to support a board from an under surface thereof, to which already mounted components have been mounted, when another components are to be mounted on an upper surface of the board. The back-up pin device comprises a base portion detachably placed on the back-up plate, at least one support pin erected upright on the base portion to support the board by contacting an upper end thereof with an under surface of the board and at least one of an identification mark for identifying the type of the back-up pin device and a position mark as a reference to determine a position of the base portion on the back-up plate, which is provided on the base portion.
    Type: Grant
    Filed: April 19, 2011
    Date of Patent: March 4, 2014
    Assignee: Fuji Machine Mfg. Co., Ltd.
    Inventors: Hidetoshi Ito, Fumitaka Maeda
  • Publication number: 20140053396
    Abstract: An screw assembling device includes a supplying mechanism, a securing mechanism, a driving mechanism, and an assembling mechanism. The supplying mechanism supplies a number of screws sequentially. The securing mechanism holds a housing of an electronic device. The assembling mechanism is connected to the supplying mechanism and the driving mechanism. The assembling mechanism is driven by the driving mechanism to predetermined positions of the housing of electronic device and is configured for assembling the plurality of screws transmitted from the supplying mechanism to the predetermined positions of the housing of electronic device.
    Type: Application
    Filed: August 14, 2013
    Publication date: February 27, 2014
  • Patent number: 8650744
    Abstract: A process for assembling a rigid-flex printed circuit board (PCB) is presented. During operation, the process receives rigid-flex PCBs that are to be coupled together, wherein a rigid-flex PCB includes flexible PCBs coupled to rigid PCBs. The process then places the PCBs onto a carrier which is configured to: align the PCBs so that bond regions located on the flexible PCBs overlap with bond regions located on corresponding flexible PCBs, and apply pressure to the overlapped bond regions. The process then sends the carrier through a reflow oven which reflows solder on the PCBs so that the components become mechanically and electrically coupled to the PCBs. The temperature profile generated by the reflow oven and the pressure applied by the carrier cures and sets an anisotropic conductive film located in the bond regions so that the overlapped flexible PCBs become mechanically and electrically coupled together.
    Type: Grant
    Filed: February 17, 2010
    Date of Patent: February 18, 2014
    Assignee: Apple Inc.
    Inventors: Michael N. Rosenblatt, Amir Salehi
  • Patent number: 8650746
    Abstract: A lens assembly tool includes a lens receiving frame having a first surface, a positioning plate positioned on the lens receiving frame, and a pressing plate positioned on the positioning plate and having a second surface. The first surface defines a plurality of receiving holes. The positioning plate defines a plurality of through holes aligned with the plurality of receiving holes. The second surface forms a plurality of pressing punches aligned with the plurality of receiving holes.
    Type: Grant
    Filed: June 28, 2012
    Date of Patent: February 18, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Chien-Chun Wang
  • Patent number: 8627562
    Abstract: A tool for installing compression connectors of various sizes and types on the end of a coaxial cable has a base mounting a pair of movable anvils for engaging two different lengths of connectors. The base further incorporates a fixed anvil for engaging a third length of connector. The movable anvils define an aperture which is shaped to permit easy entry and exit of a cable while still applying a suitable retention force to an inserted cable. A connector seating holder is formed in the front of the tool. A slidably mounted plunger cooperates with the anvils to compress a connector. The plunger has a push head and a slide rod. A lock nut is threaded on the push head and is engageable with the slide rod to prevent rotation of the push head.
    Type: Grant
    Filed: July 29, 2011
    Date of Patent: January 14, 2014
    Assignee: IDEAL Industries, Inc.
    Inventors: Robert W. Sutter, Stephen J. Skeels