Abstract: Microelectronic packages with leadframes, including leadframes configured for stacked die packages, and associated systems and methods are disclosed. A system in accordance with one embodiment includes a support member having first package bond sites electrically coupled to leadframe bond sites. A microelectronic die can be carried by the support member and electrically coupled to the first packaged bond sites. A leadframe can be attached to the leadframe bond sites so as to extend adjacent to the microelectronic die, with the die positioned between the leadframe and the support member. The leadframe can include second package bond sites facing away from the first package bond sites. An encapsulant can at least partially surround the leadframe and the microelectronic die, with the first and second package bond sites accessible from outside the encapsulant.

Abstract: The printed wiring board 1 includes the metallic substrate 2, the insulating layer 3 provided on the surface of the metallic substrate 2, and the conductive layer 4 formed on the surface of the insulating layer 3. The conductive layer 4 is electrically connected to the metallic substrate 2. A bottomed via hole or a through hole 6 is formed in the insulating layer 3 and the conducive layer 4. The via hole has a bottom in the metallic substrate 2, and has a wall surface in the insulating layer 3 and in the conductive layer 4. The through hole 6 extends through the insulating layer 3, the conductive layer 4, and the metallic substrate 2. Conductive paste 7 fills the bottomed via hole or the through hole 6 to electrically connect the metallic substrate 2 and the conductive layer 4 with each other. The printed wiring board 1 is subjected to a process in which current is applied to the interface between the metallic substrate 2 and the conductive paste 7.

Abstract: An optical interface module includes a single flexible Printed Circuit Board (PCB) including conductive traces. An electrical connector, one or more opto-electronic transducers and ancillary circuitry are disposed on the flexible PCB. The electrical connector is configured to mate with a corresponding connector on a substrate. The opto-electronic transducers are configured to be coupled to optical fibers carrying optical signals. The ancillary circuitry is coupled by the traces to the opto-electronic transducers and the electrical connector so as to convey electrical signals corresponding to the optical signals between the opto-electronic transducers and the electrical connector.

Abstract: A multi-layer printed-wiring-board is used in densely packaging electronic components such as semiconductors having improved function, and a production method therefor, and more specifically it achieves a multi-layer printed-wiring-board having excellent copper-foil-peel-strength and high connection-reliability in which occurrence of structural defects such as delamination (interlayer peeling) is prevented, and a production method therefor. Because of thinning of the printed-wiring-board or diversification of insulating layers constituting the printed-wiring-board, peeling such as delamination may occur between the insulating layers or in an interface between the insulating layer and the plated conductor.

Abstract: This relates to systems and methods for providing one or more vias through a module of an electrical system. For example, in some embodiments, the module can include one or more passive elements and/or active of the electrical system around which a packaging has been plastic molded. The module can be stacked under another component of the electrical system. Vias can then be provided that extend through the module. The vias can include, for example, electrically conductive pathways. In this manner, the vias can provide electrical pathways for coupling the component stacked on top of the module to other entities of an electronic device including the electrical system. For example, the component can be coupled to other entities such as other components, other modules, printed circuit boards, other electrical systems, or to any other suitable entity.

Abstract: An ink jet print head can be formed using a laser to melt a plating layer interposed between a piezoelectric actuator and a circuit layer bump. The plating layer can be formed on the circuit layer bump, the piezoelectric actuator, or both, and a laser beam output by the laser is used to melt the plating layer to provide a laser weld. In another embodiment, the circuit layer bump or the trace itself functions as the plating layer, which is melted using a laser to provide the laser weld.

Abstract: A wiring board includes a substrate having an adhesive surface, a first wiring, and a second wiring. The adhesive surface is in contact with the first wiring and the second wiring. The first wiring has a penetrating hole extending in a direction perpendicular to the adhesive surface. The second wiring has a first region, a second region, and a third region, which are adjacent regions arranged in that order. The first region is inside the penetrating hole in the first wiring and in contact with a first portion of the adhesive surface that forms part of the penetrating hole. The second region is in contact with the first wiring and faces the first wiring and the substrate. The third region is in contact with a second portion of the adhesive surface outside the first portion.

Abstract: A method of manufacturing a space transformer for a probe card includes the steps of mounting and electrically connecting second substrates on a first substrate, forming an insulated layer with through holes on each of the second substrates, and forming electrically conductive blocks in the through holes, respectively. Because the electrically conductive blocks are formed after the second substrates are mounted to the first substrate, any unexpected relative displacement of the first and second substrates during mounting is uninfluential to positions of the electrically conductive blocks. Besides, a step of planarizing the electrically conductive blocks can be further carried out. Therefore, the positions and flatness of probe needles may not need to be adjusted after the probe needles are connected with the electrically conductive blocks of the space transformer thus obtained.

Abstract: A method of manufacturing a hollow surface mount type electronic component has a preparing step, a gluing step and a cutting step. The preparing step includes preparing a baseboard, a clapboard and a cover board, mounting multiple circuit segments and conducting points on two opposite faces of the baseboard at intervals and boring multiple through holes on the clapboard corresponding to the circuit segments. The gluing step includes mounting multiple electronic elements on the baseboard to connected with the circuit segments, gelatinizing glue on the boards to mount the clapboard between the baseboard and the cover board and pressing the boards by a pressing machine. The cutting step includes cutting the boards by a cutting machine to produce multiple single SDM electronic components.

Abstract: Multiple high-voltage side and low-voltage side electric conductors are formed from one sheet of a conductive plate in such a way that the multiple electric conductors are arranged in parallel to one another across an initial gap between the high-voltage side and the low-voltage side electric conductors. The multiple electric conductors are connected to one another via connecting portions. An intermediate portion of the connecting portion is deformed so as to reduce the initial gap to a smaller adjusted gap. Portions of the electric conductors as well as switching devices mounted to the electric conductors are sealed by sealing material. The connecting portions are cut away so that the electric conductors are finally separated from one another.

Abstract: A flexible display device includes a flexible display panel, a flexible printed circuit board extending from the display panel, an integrated circuit chip that is mounted on at least one surface of the flexible printed circuit board and is configured to drive the display panel, and a protection member attached to a rear surface of the display panel. When the flexible printed circuit board is flexed to be partially positioned on the rear surface of the display panel, the protection member is positioned between the display panel and the integrated circuit chip. The flexible display device prevents the integrated circuit chip stacked with the display panel from making direct contact with the display panel using the protection member. Thus, even if the display device is deformed into, for example, a flexed or rolled state, it is possible to prevent the display panel from being damaged.

Abstract: A two-stage power delivery network includes a voltage regulator and an interposer. The interposer includes a packaging substrate having an embedded inductor. The embedded inductor includes a set of traces and a set of through substrate vias at opposing ends of the traces. The interposer is coupled to the voltage regulator. The two-stage power delivery network also includes a semiconductor die supported by the packaging substrate. The two-stage power delivery network also includes a capacitor that is supported by the packaging substrate. The capacitor is operable to provide a decoupling capacitance associated with the semiconductor die and a capacitance to reduce a switching noise of the voltage regulator.

Abstract: In one embodiment, a printed circuit board (PCB) assembly includes a PCB, the PCB being arranged to define a through-hole therein, the through-hole having a surface, wherein the PCB includes a top surface and a bottom surface. The PCB assembly also includes a slug arrangement and a surface mount component. The slug arrangement is formed from an electrically and thermally conductive material and includes at least a first portion and a second portion. At least a part of the first portion is positioned in the through-hole, and the second portion is coupled to the bottom surface. The surface mount component is positioned over the through-hole and the top surface, and has a first surface configured to contact the first portion.

Abstract: This disclosure provides systems, methods, and apparatuses for low-profile lighting systems. In one aspect, a lighting apparatus can include a lighting apparatus having a light emitter and an electronics substrate including an electrical circuit. An unrolled capacitive film can be attached to the lighting apparatus and electrically coupled to the electrical circuit.

Abstract: Apparatuses and methods related to the field of microchip assembly and handling, in particular to devices and methods for assembling and handling microchips manufactured with solid edge-to-edge interconnects, such as Quilt Packaging® interconnect technology. Specialized assembly tools are configured to pick up one or more microchips, place the microchips in a specified location aligned to a substrate, package, or another microchip, and facilitate electrical contact through one of a variety of approaches, including solder reflow. This specialized assembly tooling performs heating functions to reflow solder to establish electrical and mechanical interconnections between multiple microchips. Additionally, the interconnected microchips may be arranged in an arbitrarily large array.

Abstract: A touchscreen panel includes an upper substrate having a first transparent conductor layer provided on a first base layer, and a lower substrate having a second transparent conductor layer provided on a second base layer. The first and second transparent conductor layers oppose each other via a spacer and make contact when the first base layer is pressed. The first transparent conductor layer is segmented into a plurality of conductive regions that are electrically insulated from each other.

Abstract: A security device for protecting stored sensitive data includes a closed housing including an array of conductor paths and tamper detecting means adapted to detect a change in impedance of the array of conductor paths above a predetermined threshold value.

Abstract: A signal lighting beacon for a vehicle has a base and a plurality of LED arrays mounted on the base. the LED arrays are arranged to direct light signals outward in multiple different radial directions. Each LED array has an LED array circuit board having plurality of LEDs and an electrical connector mounted thereon. A common circuit board is connected to each of the plurality of LED arrays by electrical connectors on the common circuit board. The electrical connectors of single-sided LED circuit boards can be substantially identical to the electrical connectors on a single-sided common circuit board disposed at an angle relative to the LED circuit boards. The connectors can be connected to one another by inserting spade terminals into corresponding sockets from the sides of the sockets. The LED arrays can be pivoted relative to the common circuit board without withdrawing the spade terminals from the sockets.

Abstract: A method of manufacturing a multilayer wiring substrate is provided. A foil of a metal-foil-clad resin insulation material is brought into contact with a foil of a metal-foil-clad support substrate. A peripheral edge portion of the resin insulation material exposed as a result of removal of a peripheral edge portion of the foil is adhered to the foil of the support substrate. A plurality of conductor layers and a plurality of resin insulation layers are laminated so as to obtain a laminate structure having a wiring laminate portion, which is to become the multilayer wiring substrate. The laminate structure is cut along a boundary between the wiring laminate portion and a surrounding portion, and the surrounding portion is removed. The wiring laminate portion is separated from the support substrate along the boundary between the two foils.

Abstract: The present invention relates to a method of making a cavity substrate. In accordance with a preferred embodiment, the method includes: preparing a supporting board including a stiffener, a bump/flange sacrificial carrier and an adhesive, wherein the adhesive bonds the stiffener to the sacrificial carrier; then attaching an interconnect substrate to the supporting board using a dielectric layer; then removing the bump and a portion of the flange to form a cavity and expose the dielectric layer; and then forming a via opening in the dielectric layer to expose a selected portion of the interconnect substrate. A semiconductor device can be mounted on the cavity substrate and electrically connected to the exposed portion of the interconnect substrate. The interconnect substrate provides signal routing for the semiconductor device while the stiffener can provide adequate mechanical support for the interconnect substrate and the semiconductor device.

Abstract: A method of making a touch sensor assembly comprises: forming conductive trace elements on a transparent substrate; forming an insulator layer on the transparent substrate such that the insulator layer covers a portion of the conductive trace elements; and forming a plurality of conductive bridging lines such that each of the conductive bridging lines bridges two corresponding ones of the conductive trace elements. Each of the conductive bridging lines includes a plurality of conductor layers stacked one above the other and differing from one another in reflectivity. One of the conductor layers is formed by reacting a reactive gas with a metallic material, and has a reflectivity less than that of the metallic material.

Abstract: The electronic endoscope includes: an image pickup element that receives incident light; a circuit board on which the image pickup element and a drive circuit component for the image pickup element are mounted; a plurality of internal signal lines electrically connected to the circuit board; an airtight structure including an airtight container and an airtight terminal through which a plurality of terminal pins penetrate, the airtight structure airtightly sealing therein the image pickup element, the circuit board, and the plurality of internal signal lines; and a signal line cable including a plurality of signal lines, the signal line cable being placed outside of the airtight structure. The electronic endoscope further includes a pipe-shaped electrically conductive member that electrically connects each of the plurality of signal lines of the signal line cable and each of the plurality of terminal pins placed outside of the airtight structure.

Abstract: Disclosed is a flexible display device. The flexible display device includes a display panel configured to include a first substrate that includes a plurality of pixels and a second substrate that is facing-coupled to the first substrate, and a first flexible circuit board connected to the first substrate. A driving IC which supplies a driving signal to the display panel is mounted on the first flexible circuit board. The first substrate includes a display part covered by the second substrate and configured to include the plurality of pixels, a non-display part provided near the display part and coupled to the second substrate, a bending part configured to extend from one side of the non-display part, and bent at a certain curvature, and a pad part connected to one side of the first flexible circuit board.

Abstract: In one aspect, containment devices are provided that include a microchip element having one or more containment reservoirs that are configured to be electrically activated to open; an electronic printed circuit board (PCB) or a silicon substrate positioned adjacent to the microchip element; one or more electronic components associated with the microchip element or the PCB/silicon substrate; and a first inductive coupling device associated with the microchip element or the PCB/silicon substrate, wherein the first inductive coupling device is in operable communication with the one or more electronic components. In another aspect, implantable drug delivery devices are provided that include a body housing at least one drug payload for actively controlled release, wherein the ratio of the volume of the at least one drug payload to the total volume of the implantable drug delivery device is from about 75 ?L/cc to about 150 ?L/cc.

Abstract: A dielectric structure including a metal foil, a dielectric layer and a conductor layer provided in this order, wherein the metal foil has a thickness of from 10 to 40 ?m, the dielectric layer has a thickness of from 0.3 to 5 ?m, and the conductor layer has a thickness of from 0.3 to 10 ?m. The dielectric structure has plural vias which are separated from each other, and which penetrate through both of the dielectric layer and the conductor layer. The vias of the dielectric layer have different diameters which are in a range of from 100 to 300 ?m, a diameter of each of the vias of the conductor layer is larger than a diameter of a corresponding via of the dielectric layer by 5 to 50 ?m, and a minimum via pitch is from 100 to 350 ?m.

Abstract: Embodiments of the invention provide a method of manufacturing a printed circuit board, including: mounting a strip substrate on a fixing member; separating the strip substrate into unit substrates by performing a singulation process; attaching solder balls onto the unit substrates using a jig; and fixing the solder balls on the unit substrates by performing a reflow process. The method of manufacturing a printed circuit board is advantageous in that the solder balls can be accurately formed at the predetermined positions of the strip substrate because they are attached to the unit substrates after the warpage of the strip substrate was reduced by a singulation process.

Abstract: A charge-coupled device (CCD) image sensor includes multiple vertical charge-coupled device (VCCD) shift registers and independently-controllable gate electrodes disposed over the VCCD shift registers and arranged into physically separate and distinct sections that are non-continuous across the plurality of VCCD shift registers. The CCD image sensor can be configured to operate in two or more operating modes, including a full resolution charge multiplication mode.

Abstract: A shield can is described. In one or more implementations, a shield can includes a frame configured to be installed on a printed circuit board. The shield can also includes a lid configured to be connected to the frame after installation of the frame to form the shield can over one or more components that are installed on the PCB.

Abstract: A test socket that provides a temporary interconnect between terminals on an integrated circuit (IC) device and contact pads on a test printed circuit board (PCB). The test socket includes a compliant printed circuit and a socket housing. The compliant printed circuit includes at least one compliant layer, a plurality of first contact members located along a first major surface, a plurality of second contact members located along a second major surface, and a plurality of conductive traces electrically coupling the first and second contact members. The compliant layer is positioned to bias the first contact members against the terminals on the IC device and the second contact members against contact pads on the test PCB. The socket housing is coupled to the compliant printed circuit so the first contact members are positioned in a recess of the socket housing sized to receive the IC device.

Abstract: In accordance with an example embodiment of the present invention, an apparatus includes a substrate having a plurality of conductive traces terminating at a peripheral edge of the substrate. An active display portion is disposed on an upper surface of the substrate and electrically coupled to the conductive traces of the substrate. The peripheral edge of the substrate includes a protruding region that extends beyond a peripheral edge of the active display portion. A plurality of conductive bonding pads are affixed at the protruding region and coupled to the plurality of the conductive traces. A flexible circuit includes a plurality of conductors electrically coupled to the plurality of bonding pads at locations on or below a lower surface of the substrate.

Abstract: A method for manufacturing an electrode assembly. The method comprises: forming a comb having a plurality of electrode contacts, wherein the surface of at least one of the electrode contacts comprises a plurality of indentations such that the effective surface area per area unit of a center region of the at least one electrode contact is larger than the effective surface area per area unit of the of the region of the surface outside the center region; assembling an array of electrode contacts from the comb; molding a carrier member about the assembled array of electrode contacts, wherein a surface of the at least one electrode contact is covered by a layer of the carrier member material; and removing the layer of carrier member material on the surface of the at least one electrode contact.

Abstract: In a method for manufacturing a droplet ejection head, a structure of a substrate having an energy-generating element that imparts energy to a liquid to eject a liquid droplet from an ejection orifice and an orifice plate having the ejection orifice formed therein are laminated through a flow channel member for forming a pattern of a liquid flow channel that is a region in which the liquid flows. At least one of a plate before being laminated and the flow channel member before being laminated has a void of at least one of a through-hole other than the ejection orifice and a recess in the face to be laminated.

Abstract: A mounting method for a circuit board. The circuit board is formed with pilot holes that are placed onto pilot pins of a tool such that the pilot pins protrude through and beyond the circuit board. Then the tool is displaced toward a circuit board holder of the housing whereupon the pilot pins engage with a form fit in corresponding centering holes of the circuit board holder. After fixing the circuit board in the housing, the tool is withdrawn by detaching the pilot pins from the pilot holes, the circuit board remaining in the circuit board holder. The tool has an upper plate with associated pilot pins and a lower plate with a housing holder for positioning the housing. The circuit board, with the pilot pins engaging the pilot holes, is displaced by moving the upper plate toward the lower plate.

Abstract: A diplexer includes a substrate having a set of through substrate vias. The diplexer also includes a first set of traces on a first surface of the substrate. The first traces are coupled to the through substrate vias. The diplexer further includes a second set of traces on a second surface of the substrate that is opposite the first surface. The second traces are coupled to opposite ends of the set of through substrate vias. The through substrate vias and the traces also operate as a 3D inductor. The diplexer also includes a capacitor supported by the substrate.

Abstract: A method for manufacturing a sensor insole includes connecting wires of force sensors to a printed circuit board. The printed circuit board and the force sensors are positioned on a felt layer in a predetermined configuration, and placed in the mold. A urethane foam is then injected into the planar internal cavity of the mold to form a sensor sheet that includes a urethane layer, the felt layer, and the printed circuit board and the force sensors positioned therebetween.

Abstract: A sensor includes a sensor element configured to measure a physical variable. At least one elastic damping element is configured to damp external interfering vibrations. The at least one elastic damping element is configured to electrically and/or mechanically contact the sensor element.

Abstract: A holding member and system including a first holding member and a second holding member, wherein each of the first holding member and the second holding member are coupled to opposite sides of a load plate of a socket. A holding member includes a body including a pair of arms extending from a first side of the body and spaced to accommodate a portion of an integrated circuit chip package therebetween and at least one clip extending from a second side opposite the first side. Also, a method including coupling an integrated circuit chip package to a first holding member and a second holding member, wherein the first holding member is coupled to a first side of a load plate of a socket and the second holding member is coupled to a second side of the load plate; and inserting the package into a socket of a printed circuit board.

Abstract: An interconnection component includes a first support portion has a plurality of first conductive vias extending therethrough substantially perpendicular to surfaces thereof such that each via has a first end adjacent a first surface and a second end adjacent a second surface. A second support portion has a plurality of second conductive vias extending therethrough substantially perpendicular to surfaces thereof such that each via has a first end adjacent the first surface and a second end adjacent the second surface. A redistribution layer is disposed between the second surfaces of the first and second support portions, electrically connecting at least some of the first vias with at least some of the second vias. The first and second support portions can have a coefficient of thermal expansion (“CTE”) of less than 12 parts per million per degree, Celsius (“ppm/° C.”).

Abstract: A method of manufacturing a terminal block for a telecommunication cable, which includes providing a housing having a front side and a back side and positioning multiple pairs of electrical connectors in the housing such that one end of each of the electrical connectors is exposed on the front side of the housing and one end of the connector is exposed on the back side of the housing. Each of electrical connectors having an insulation displacement contact terminal on the end exposed on the back side of the housing, and connecting multiple pairs of insulated electrical wires to the connectors on the back side of the housing. A dielectric material is pressure molded on the back side of the housing to encapsulate the connections of the wires and the connectors on the back side of the housing.

Abstract: A method of manufacturing a piezoelectric thin film resonator which can reduce variations in resonant frequency and resonant resistance by uniformly planarizing a structural film. The method of manufacturing the piezoelectric thin film resonator includes the steps of forming sacrifice layer patterns on an upper surface of a mother substrate; forming a dielectric film on the sacrifice layer patterns; processing a surface of the dielectric film by a plasma treatment; forming vibration portions on the dielectric film, the vibration portions each being composed of two excitation electrodes and a piezoelectric thin film provided therebetween; etching the sacrifice layer patterns; and cutting the mother substrate into separate piezoelectric thin film resonators.

Abstract: A method for implementing an electrical system architecture capable of providing fixed or modular components, for example, interface connectors, is provided. Fixed components allow product cost to be minimized. Modular components provide flexible configurability of products. In accordance with at least one embodiment of the present invention, an electrical system architecture capable of providing fixed or modular components minimizes costs such as design, production, and customer support costs while being able to provide a range of product variants.

Abstract: A method of fabricating a touch panel is provided. A substrate having a touch-sensing region and a peripheral region is provided. A touch-sensing circuit layer including first sensing series, and second meshed metal sensing pads is formed on the touch-sensing region of the substrate. An insulating layer having first contact windows is formed on the substrate to cover the touch-sensing circuit layer. The first contact windows expose a portion of the second meshed metal sensing pads. A plurality of second transparent bridge lines are formed on the insulating layer located in the touch-sensing region. Each second transparent bridge line is electrically connected to two adjacent second meshed metal sensing pads through two first contact windows. The second transparent bridge lines completely cover the portion of the second meshed metal sensing pads exposed by the first contact windows.

Abstract: A pressure-sensitive cover installer includes a base, a fixing body defining a recessed portion for receiving a main body, a support portion, an air cylinder movably connected to the support portion, a positioning fixture defining a number of through holes therein, and for receiving a number of covers, a controller, a motor for controlling movement of the air cylinder, a pressure sensing member fixed below the air cylinder, and a display. The air cylinder is forced by the motor to drive the pressure sensing member to press the covers onto the main body; the main body resists the pressure sensing member to generate a pressure of a resistance. The pressure sensing member senses the pressure of the resistance to generate a pressure signal to the controller. The controller analyzes the pressure signal to generate a pressure value to be displayed on the display.

Abstract: In a display apparatus, a display panel displays an image, and a driver is electrically connected to the display panel and applies a control signal to the display panel to control an operation of the display panel. A first cover member includes a nonmetal material and covers the display panel. An opening is defined in the first cover member and exposes a display area of the display panel. A heat discharge member is coupled to the first cover member and contacts the driver to discharge a heat generated by the driver.

Abstract: A textile-type electronic component package includes a textile base; a textile-type electronic component and a plurality of conductive patterns having end contact points formed on the top surface of the textile base; a thermoplastic adhesive formed on the bottom surface of the textile base; a plurality of mounting pads formed on the thermoplastic adhesive and facing the conductive patterns, respectively; and a plurality of via-hole-type coupling parts penetrating end contact points of the conductive patterns, the textile base, and the thermoplastic adhesive, and electrically coupling the mounting pads and the conductive patterns, wherein the via-hole-type coupling parts includes a bunch of via-holes filled with a conductive polymer.

Abstract: An object of the invention is to provide a method for fabricating a printed wiring board that can suppress warping of the printed wiring board and can improve the yield of semiconductor chip mounting and enhance the reliability of a semiconductor package. The printed wiring board fabrication method according to the invention is a method for fabricating a printed wiring board having a through-hole in a core layer, wherein the printed wiring board fabrication method includes the step of applying a laser from one side of the core layer to a position where the through-hole is to be formed in the core layer and the step of applying a laser to the same position from the opposite side of the core layer.

Abstract: An environmental sensitive electronic device package including a first substrate, a second substrate, an environmental sensitive electronic device, a side wall barrier structure, a first adhesive, and a second adhesive is provided. The environmental sensitive electronic device is located on the first substrate. The first adhesive is located on the first substrate. The side wall barrier structure is located on the first adhesive, and the side wall barrier structure is adhered to the first substrate through the first adhesive. The second adhesive is located on the side wall barrier structure. The side wall barrier structure is adhered to the second substrate through the second adhesive, and the side wall barrier structure, the first adhesive, and the second adhesive are located between the first substrate and the second substrate. A manufacturing method of an environmental sensitive electronic device package is also provided.

Abstract: Provided is a multi-channel optical module and a manufacturing method of the same. The optical module includes a base block having a cavity on one edge(?) of the base block; a substrate arranged on the other side of the base block that faces the cavity; an integrated circuit (IC) chip mounted on the substrate; a platform arranged in the cavity; electrical contacts connected to the IC chip, wherein the electrical contacts are formed on the platform; an optical device array block arranged in the platform, wherein the optical device array block is connected to the electrical contacts; a plurality of optical fiber cores aligned with the optical device array block; and an optical fiber array block fixing the plurality of optical fiber cores, wherein the optical fiber array block is bonded to the platform and to the optical device array block and is fixed in the cavity.

Abstract: A probe core includes a frame, a wire guide connected to the frame, a probe tile, and a plurality of probe wires supported by the wire guide and probe tile. Each probe wire includes an end configured to probe a device, such as a semiconductor wafer. Each probe wire includes a signal transmitting portion and a guard portion. The probe core further includes a lock mechanism supported by the frame. The lock mechanism is configured to allow the probe core to be connected and disconnected to another test equipment or component, such as a circuit board. As one example, the probe core is configured to connect and disconnect from the test equipment or component in a rotatable lock and unlock operation or twist lock/unlock operation, where the frame is rotated relative to remainder of the core to lock/unlock the probe core.

Abstract: An apparatus for equalizing voltage across an electrical lighting system, particularly in low voltage landscape lighting systems. The apparatus consists of a plastic cylinder having open ends and containing two or more connectors for connecting a homerun wire from a transformer to wire leads from the various light fixtures in the lighting system. The wire leads are of uniform length to ensure that each light fixture is ecu equally distant from the transformer.