Abstract: A multilayer printed wiring board includes a mounting portion supporting a semiconductor device and a layered capacitor portion including first and second layered electrodes and a ceramic high-dielectric layer therebetween. The first layered electrode is connected to a ground line and the second layered electrode is connected to a power supply line. The ratio of number of via holes, each constituting a conducting path part electrically connecting a ground pad to the ground line of a wiring pattern and passing through the second layered electrode in non-contact, to number of ground pads is 0.05 to 0.7. The ratio of number of second rod-shaped conductors, each constituting a conducting path part electrically connecting a power supply pad to the power supply line of the wiring pattern and passing through the first layered electrode in non-contact, to number of power supply pad is 0.05 to 0.7.

Abstract: A mobile wireless communications device may include a portable housing, at least one wireless transceiver carried by the portable housing, and a satellite positioning signal receiver carried by the portable housing. An antenna may also be carried by the portable housing and connected to the satellite positioning signal receiver. Further, at least one electrically conductive director element may be carried by the portable housing in spaced apart relation from the antenna and inductively coupled thereto for directing a beam pattern thereof.

Abstract: In a chip reversing method for holding and vertically reversing a chip placed by a bonding nozzle, the chip is held on a chip holding unit disposed in a reversing member and is vertically reversed by turning the reversing member downward on an reversal shaft. After the reversed chip was received by a chip receiving unit, this chip receiving unit is lowered to a retracted position to return the reversing member to an original position. In this state, the chip receiving unit is raised to position the chip at a height level L for a chip transferring action. As a result, the reversing member does not protrude to above the height level for the chip transfer thereby to interfere with another mechanism, so that the chip mounting actions can be made efficient.

Abstract: A high-speed process includes removing chips or interposers from a carrier web having a first pitch and transferring the chips or interposers to electrical components, such as RFID antenna structures, on a moving web having a second pitch. According to one method, a transfer drum transfers chips or interposers to a moving web of electrical components by picking a chip when the transfer drum is stationary, and transferring the chip to the moving web when the transfer drum is rotating such that a tangential velocity of the transfer drum is substantially equal to the linear velocity of the moving web. According to another method, a primary drum removes chips or interposers from a carrier web having a first pitch, and transfers the chips or interposers to a variably rotating secondary drum which then places the chips or interposers onto an electrical component on a moving web having a second pitch.

Abstract: Disclosed herein is a method of positioning and placing an integrated circuit on a printed circuit board. The integrated circuit comprises first geometrical elements. The first geometrical elements are of one or more predefined shapes and are located on one or more predefined surfaces of the integrated circuit. The printed circuit board comprises second geometrical elements. The second geometrical elements are shaped to accommodate the first geometrical elements. The first geometrical elements are designed to fit into the second geometrical elements. The first geometrical elements are positioned and placed over the second geometrical elements. The first geometrical elements come in contact with the second geometrical elements at two or more points. The positioning and placement of the first geometrical elements over the second geometrical elements limits displacement of connections of the integrated circuit from the printed circuit board.

Abstract: A method of making a multi-chip electronic package which utilizes an organic, laminate chip carrier and a pair of semiconductor chips positioned on an upper surface of the carrier in a stacked orientation. The organic, laminate chip carrier is comprised of a plurality of conductive planes and dielectric layers and couples one or both of the chips to underlying conductors on the bottom surface thereof. The carrier may include a high-speed portion to assure high-frequency connection between the semiconductor chips and may also include an internal capacitor and/or thermally conductive member for enhanced operational capabilities. The first chip, e.g., an ASIC chip, is solder bonded to the carrier while the second chip, e.g., a memory chip, is secured to the first chip's upper surface and coupled to the carrier using a plurality of wirebond connections.

Abstract: A printed circuit board and a method of manufacturing a printed circuit board are disclosed. Using a method of manufacturing a printed circuit board, which includes: forming a multilayer board by alternately stacking circuit pattern layers and insulation layers such that a predetermined thickness of a partial area has only insulation layers stacked therein; and removing insulation layers from the partial area of the multilayer board, a printed circuit board can be manufactured that is suitable for a slim module.

Abstract: In a printing apparatus, individual positional data for positions of four object marks provided on a plurality of FPCs held on a conveyance tray are acquired by a mark position acquisition section based on an image acquired by an image acquisition unit. In a displaced mark specifying section, relative positional relations of four object marks are determined, and compared with a reference positional relation, by which a displaced object mark is specified. Then, in a reference position determining section, a reference position for a plurality of FPCs on a conveyance tray is determined based on a plurality of object marks resulting from excluding the displaced object mark out of the four object marks. Thus, a reference position in execution of printing in a printing unit can be determined with high precision.

Abstract: A method is proposed to manufacture a precise multi-pole magnetic component for using in magnetic encoders. A special layout of the circuit pattern is designed and formed on a printed circuit board (PCB). Alternate and regular magnetic field is induced according to Ampere's law after a current flowing through the circuit on the PCB. The multi-pole magnetic component with fine magnetic pole pitch is achieved by forming the high-density circuit patterns on a substrate using the PCB technology.

Abstract: A method of manufacturing a multilayer printed circuit board having interlayer insulating layers and conductor layers repeatedly formed on a substrate, via holes formed in the interlayer insulating layers, and establishing electrical connection through the via holes, including containing an electronic component in said substrate, forming a positioning mark on said substrate based on a positioning mark of said electronic component, and conducting working or formation based on the positioning mark of said substrate.

Abstract: A method of arranging a plurality of components of a circuit board for optimal heat dissipation and a circuit apparatus having a plurality of components arranged by performing the method are provided. The method includes arranging a predetermined number of the plurality of components in the order of size of the components in a heat dissipation area having a predetermined width on a virtual straight line connecting the air inlet unit and the air outlet unit.

Abstract: A high-speed machine and method for placing an RFID circuit onto an electrical component includes separating an RFID circuit from a web of RFID circuits, and placing the RFID circuit onto an electrical component with a placing device. The separating includes directing the RFID circuit onto a transfer drum of the placement device and separably coupling the RFID circuit to the transfer drum. According to one method, a separator device separates and directs chips or interposers onto a placement device. According to another method, chips or interposers are tested before being separated from a web, and if good, are separated from the web, directed onto a placement device, and placed on an electrical component. If defective, the chips or interposers are not directed onto a placement device and are removed by a scrap web removal device.

Abstract: A component placing method uses a first component image-pickup unit capable of capturing an image of a component held by a component holding member from a direction along central axes of the component holding members, and a second component image-pickup unit capable of capturing an image of the held component from a direction generally orthogonal to the central axes of the component holding members, the images of the component are captured by the first component image-pickup unit and the second component image-pickup unit from the two directions generally orthogonal to each other, and holding postures of the components are recognized on the basis of the images.

Abstract: A dual-channel optical navigation system with vertically aligned sensors. The dual-channel optical navigation system includes a circuit board, a contact navigation sensor, and a free-space navigation sensor. The circuit board mechanically supports and electrically connects multiple navigation sensors on opposing sides of the circuit board. The contact navigation sensor is coupled to a first side of the circuit board. The contact navigation sensor generates a contact navigation signal based on contact navigation images of a contact navigation surface approximately adjacent to the dual-channel optical navigation system. The free-space navigation sensor is coupled to a second side of the circuit board. The free-space navigation sensor generates a free-space navigation signal based on free-space navigation images of an operating environment of the dual-channel optical navigation system.

Abstract: A part cartridge for a mounter device used in a mounting process for mounting electronic parts on a substrate by heating the substrate to a predetermined temperature after the electronic parts are mounted on the substrate put on a conveying carrier by the mounter device, comprising holding part holding the substrate in the state of being fitted to the conveying carrier, and a guide tape holding the holding part. The holding member is stored in the state of being wound together with the guide tape so that the holding part can be mounted on the conveying carrier by the mounter device. By this, a method of holding and carrying the substrate for mounting the holding part on the conveying carrier by using the mounter device can be adopted in the mounting process. The deflection of the substrate in reflow can be securely prevented while suppressing cost by effectively utilizing the existing mounting line and devices.

Abstract: The invention relates to a method for applying an electronic component (24), which is provided with terminal faces (34, 35), to a substrate (33), which is provided with terminal faces (31, 32), wherein the component is removed from a feeding device by means of an application device (27), the component is subsequently positioned on the substrate by means of the application device in such a manner that the component terminal faces extending from a contact side (37) of the component up to a component rear side (38) and the substrate terminal faces are in an overlapping position and the terminal faces are subsequently contacted by means of a direct application of laser energy to the component terminal faces.

Abstract: The shape of a crotch portion of a tuning fork of a quartz piece is controlled such that main surfaces of two sheets of original plates, which are made of quartz crystal and the main surfaces thereof are orthogonal to the direction of the Z axis, which is a crystal axis, are bonded so that the plus/minus directions of the X axis, which is another crystal axis, are made in a reverse relation to each other to form a quartz substrate, and masks for forming the outer shape, through which the surfaces of the quartz substrate are exposed, are formed on both front and back surfaces of the quartz substrate in a manner that the mask follows along the outer shape of the quartz piece and the width direction of the outer shape agrees with the X axis, and the quartz substrate is etched to form the outer shape of the quartz piece.

Abstract: A multilayer printed wiring board and method for manufacturing a multilayer printed wiring board. One method include a method for manufacturing a multilayer printed wiring board having an electronic component housed therein. The method includes forming a conduction circuit on a core substrate and forming an alignment mark on the core substrate separate from the conduction circuit. Also included is forming a concavity in the core substrate, the concavity being formed in an area of the core substrate not including the conductor circuit and alignment mark, and inserting the electronic component into the concavity in the core substrate by using the alignment mark on the core substrate to align the electronic component with the concavity.

Abstract: A composite electronic component includes a multilayer wiring block having a plurality of insulating layers and a wiring pattern, and a chip-type electronic component built-in multilayer block having a plurality of insulating payers and a wiring pattern and including a first chip-type electronic component. The multilayer wiring block and the chip-type electronic component built-in multilayer block are electrically interconnected and arranged on substantially the same plane.

Abstract: The specification discloses an apparatus comprising an alignment plate having a plurality of depressions therein, each depression being sized to receive a packaging cap therein and to prevent its movement, and a force applicator to apply a force to press the packaging caps and a substrate firmly together. Also disclosed is a process comprising inserting a plurality of packaging caps in a plurality of depressions on an alignment plate, each depression being sized to receive a packaging cap and prevent its movement, aligning the plurality of packaging caps with individual devices on a substrate, placing the substrate in contact with the packaging caps, and applying a force to press the caps against the substrate. Other embodiments are disclosed and claimed.

Abstract: The present invention, which aims at providing a component mounting method and a mounter capable of correcting, with high accuracy, a mounting position of a component, includes: a mounting head (105); a recognition unit (108) including a shutter camera (111b) and instructing it to start taking an image of a component (103a) when the mounting head (105) arrives at a predetermined position; and a main control unit (160) (i) correcting a position of the component shown in the image taken by the shutter camera (111b), based on a first distance over which the mounting head (105) moves during a time period from when the instruction to start taking the image is given to when camera exposure by the shutter camera (111b) is performed, (ii) correcting the mounting position at which the mounting head (105) is to mount the component (103a), based on the corrected component position, and (iii) controlling the mounting head (105) so that it mounts the component (103a) at the corrected mounting position.

Abstract: A method and system for improving alignment precision of MEMS parts during manufacturing are disclosed. According to the invention at least one of the MEMS parts comprises a cavity wherein a sphere or bearing is centered and preferably temporary blocked with a temperature dissipative material. When MEMS parts are in contact of the sphere or bearing, the temperature dissipative material is evaporated, offering a very low friction against two facing MEMS parts moving in different directions, enabling a very precise positioning.

Abstract: A printed wiring board is manufactured by a method in which a base substrate having a first insulation layer, a second insulation layer, and a conductive film is provided. An electronic component is placed on the first insulation layer at a position determined based on an alignment mark. After the electronic component is enclosed inside an opening of the second insulation layer, a via hole exposing a terminal of the electronic component is formed at a position determined based on the alignment mark, which is used to determine the position of the electronic component. A via conductor is formed in the via hole, and a conductive layer is formed on the conductive film and patterned to form a conductive circuit connected to the via conductor.

Abstract: A component verification method for a mounter (100) that is capable of performing component verification with less labor. The method includes a position specification step (S12A) of specifying a placement position in the mounter (100) where a component tape is placed; a read step (S13) of reading component information from an IC tag (426b) that is attached to the component tape or a reel (426); and a verification step (S14) of verifying the component information and the placement position against component arrangement data that indicates components that should be mounted onto the board as well a position where the component tape should be placed.

Abstract: An apparatus for replacing a defective PCB unit formed on a PCB panel includes a location correcting table on which a nondefective PCB unit for replacing the defective PCB unit is disposed, a panel seating table, on which a PCB panel where the defective PCB unit is removed is disposed, a seating table support on which the panel seating table is detachable installed by a fastener, a location correcting driver for driving the location correcting table relative to the panel seating table to correct location of the nondefective PCB unit with respect to the PCB panel, a vision camera for reading location of specific points on the nondefective PCB unit and the PCB panel respectively disposed on the location correcting table and the panel seating table, a reading location varying driver for sequentially moving the specific potions read by the vision camera below the vision camera, and a controller for controlling the location correcting driver and the reading location varying driver, receiving operation results of t

Abstract: A method and apparatus for mounting a light emitting element, enabling positioning on an object with precision with reference to the optic axis of a light emitting element, and mounting the element.

Abstract: The invention is directed to increased stabilization of a pickup operation by reducing a reaction against disturbance by reducing a feedback value when a pickup rate is improved. A positional shifting amount of an electronic component on a suction nozzle before the electronic component is mounted on a printed board is stored in a RAM each time the component is picked up at a component feeding unit until a pickup count number reaches a predetermined pickup number, and a CPU calculates an average of the positional shifting amounts. When the pickup count number reaches the predetermined pickup number, the CPU obtains a temporary coefficient by adding an initial value to a value obtained by multiplying a negative coefficient by the pickup count number, and calculates a feedback value by multiplying the temporary coefficient by the average.

Abstract: In an electronic apparatus comprising a digital display portion and first and second oscillators comprising first and second oscillating circuits, each of the first and second oscillating circuits having a resonator, an amplifier, a plurality of capacitors, and at least one resistor, a mode of vibration of the resonator of the first oscillating circuit being the same as that of the resonator of the second oscillating circuit, an output signal being output from each of the first and second oscillating circuits, the output signal of one of the first and second oscillating circuits being a clock signal for use in operation of the electronic apparatus to display time information at the digital display portion.

Abstract: In an electronic component placement method in which electronic components are picked up from a plurality of component supply sections which supply electronic components using a plurality of mounting heads which are provided corresponding to the respective component supply sections, and the electronic components are transferred and mounted on a substrate in a same placing stage, in performing the component transferring and mounting operations, head interference areas which constitute exclusive operating regions to which only the specified mounting heads are allowed to access are set for every placing turn. Due to such a constitution, in the component placement operation, it is possible to rationally set the accessible region without causing the interference of one mounting head with another mounting head thus shortening a placing tact time by excluding wasteful standby times of the mounting heads.

Abstract: An electronic assembly comprises a generally planar substrate. An electronic component is mounted to the substrate and has a projecting portion projecting above a surface of the substrate. An enclosure has at least one side with indentations. One of the indentations is positioned to receive the projecting portion of the electronic component with a clearance gap. A thermally-conductive material is inserted between the projecting portion and the enclosure within the clearance gap.

Abstract: A component fixing device includes a holding portion for holding a component with a hollow portion while restricting a movement of the component; and a fixed portion elastically connected to the holding portion and to be fixed to an object. The holding portion is inserted into the hollow portion of the component for holding the component. The holding portion may have a center holding portion abutting against an outer surface of the component and a pair of arm portions disposed at both sides of the center holding portion and capable of bending relative to the center holding portion, so that the center holding portion and the arm portions sandwich the component.

Abstract: A method of controlling contact load in an apparatus for mounting electronic components on a substrate, in which a head is lowered at high speed to slow down starting position where there is no risk that the electronic component makes contact with the substrate (S1), and from there the head is lowered at low speed until a predetermined target contact load is detected. The process of lowering the head at low speed includes the steps of moving down the head a predetermined distance (S3), measuring load after the step of moving down the head (S5), and determining whether the measured contact load has reached the target contact load (S9). The steps of moving down the head (S3) and measuring the load (S5) are repeated until the measured load reaches the target contact load. The actual load is precisely controlled to be close to a very small set level of target contact load. Accordingly, electronic components using low dielectric constant material are mounted without the risk of damage.

Abstract: A high-speed process includes removing chips or interposers from a carrier web having a first pitch and transferring the chips or interposers to electrical components, such as RFID antenna structures, on a moving web having a second pitch. According to one method, a transfer drum transfers chips or interposers to a moving web of electrical components by picking a chip when the transfer drum is stationary, and transferring the chip to the moving web when the transfer drum is rotating such that a tangential velocity of the transfer drum is substantially equal to the linear velocity of the moving web. According to another method, a primary drum removes chips or interposers from a carrier web having a first pitch, and transfers the chips or interposers to a variably rotating secondary drum which then places the chips or interposers onto an electrical component on a moving web having a second pitch.

Abstract: [Problem] To improve productivity and reliability in mounting an electronic component. [Means for Solving Problems] At least one of an electrode terminal of an electronic component and a connecting terminal of a wiring substrate is provided with solder beforehand, one of the wiring substrate and the electronic component is secured, and the electrode terminal of the electronic component and the connecting terminal of the wiring substrate are made to abut each other in a state where one of the wiring substrate and the electronic component, whichever is not secured, is held. Then, the electronic component is heated so that the solder is melted, and the solder is solidified while the electronic component is held, so that the electrode terminal and the connecting terminal are bonded to each other by means of the solder.

Abstract: Provided are a tape feeder for use in chip mounters that can reduce a chip feeding duration and prevent chips from being turned over or assuming wrong postures to feed the chips stably, and a chip mounting method. The tape feeder includes a second link having one end linked to a link shaft through which a first link and a pivot lever are combined and the other end in which a slot curved at a predetermined inclination is formed. The velocity at which a carrier tape is fed changes according to the inclination of the curve of the slot with respect to the moving direction of the first link, the curve contacting the contact unit upon the movement of the first link in a direction helping to rotate a ratchet gear.

Abstract: The present disclosure relates to a lead frame package comprising a die attach pad and two or more electrical interconnections, wherein at least one of the two or more interconnections is affixed to the die attach pad for electrically grounding the lead frame package. The present disclosure further relates to a method for providing a lead frame package. The lead frame package comprises two or more electrical interconnections and a die attach pad. At least one electrical interconnection is affixed to the die attach pad to ground the lead frame package and at least one of the electrical interconnections is an RF signal interconnection. At least one of the die attach pad and the at least one grounding electrical interconnection is connected to a grounding contact of a circuit-board. The at least one RF signal electrical interconnection is connected to an RF signal contact on the circuit-board, thereby forming a mounted semi-conductor circuit.

Abstract: An apparatus for feeding components from a packaged component band includes a stand defining a platform allowing the packaged component band passing therealong, a first guiding unit installable to the stand beside the platform, and a second guiding unit installable to the stand next to the another end of the platform. The first guiding unit is urged to remove a package from the packaged component band to expose components at one end of the platform and guides the package toward another end of the platform. The second guiding unit accepts the package from the first guiding unit and accelerates movement of the package passing therethrough. The second guiding unit includes a first friction pulley urged to rotate, and a second friction pulley rotatably movable together with the first friction pulley and engagable with the package when the package engagably passes therethrough.

Abstract: Carriers (10) holding parts (50) for assembling complex MEMS devices are transported to a central assembly location. The parts are stacked in a pre-assigned order and later released from their carriers. Alternatively, they are positioned over the appropriate location and released so as to fall into position as needed. The assembly area (100) includes a cavity below the plane of the carriers such that the parts held within the carrier drop into the cavity. Heating elements are integrated into the cavity to assist in the release of the parts. The cavity is supplied with parts by one or more carriers which are move around by any number of MEMS drive systems (200, 250). The cavity and some of the MEMS assembled therein deliver with precision amounts of materials as required suitable for biomedical applications, or may be processed in-situ, as in an on-chip laboratory.

Abstract: The productivity of an IC card is to be improved. In a memory card of the type in which a memory body having a wiring substrate and a semiconductor chip mounted on a main surface of the wiring substrate is held so as to be sandwiched in between a first case and a second case, a planar outline of the memory body is smaller than half of a planar outline of the memory card. The memory body is disposed so as to be positioned closer to a first end side as one short side of the memory card with respect to a midline between the first end side and a second end side as an opposite short side of the memory card positioned on the side opposite to the first end side. The other area than the memory body-disposed area in the first and the second case is used as another functional area.

Abstract: In an electronic part mounting apparatus provided with first, second and third beam members 31, 32 and 33, all supported by a common Y-axis frame at both ends thereof, holding a chip 6 by suction from an electronic part feeding unit 2 by means of a mounting head attached to the first beam member 31, and mounting the chip onto a substrate held by first and second substrate-holding units 10A and 10B, a supporting mechanism for the substrate-holding unit (an SHU-supporting mechanism) 10 is provided which supports a slide table 50, on which the first and second substrate-holding unit 10A and 10B are arranged, in such a manner that the slide table is movable between an operating position P1 and a maintenance position P2. With such configuration, the slide table 50 can be moved to the maintenance position P2 easily accessible for maintenance, leading to the improvement of working efficiency.

Abstract: An exemplary method for surface mounting an electronic component onto a pad of a printed circuit board is provided. The electronic component and the printed circuit board are located onto a platform. An outline image of the electronic component is captured using a first image sensing device. Coordinates of a geometrical center of the electronic component are determined using a central processing device. An outline image of the pad is captured using a second image sensing device. Coordinates of a geometrical center of the pad are determined using the central processing device. The electronic component is moved onto the pad using a picking-up/placing device according to the coordinate of the geometrical center of the electronic component and the coordinate of the geometrical center of the pad. The electronic component can be registered with the pad exactly using the method.

Abstract: To provide an electronic component pickup method, an electronic component mounting method and an electronic component mounting device capable of stably picking up, with high productivity, an electronic component adhered and held to a carrier. An electronic component pickup method for picking up a chip 6 adhered and held to a sheet 5 with an adhesive layer 5a by way of a support tool 20 uses an adhesive containing a compound that generates a gas by radiation of light. In the pickup operation, the support tool 20 is brought into contact with the top surface of the chip 6 and a light radiating part 8 is positioned below the chip 6. Then ultraviolet light is radiated from the bottom surface of the sheet 5 onto the adhesive layer 5a positioned on the rear surface of the chip 6. When a nitrogen gas generated from the adhesive layer 5a has formed a gas layer G at the adhesive interface between the rear surface of the chip 6 and the adhesive layer 5a, the support tool 20 is lifted to pick up the chip 6.

Abstract: A component mounter includes a board transfer rail for positioning a board at a predetermined position on a base, and a transfer head for picking up a component supplied and mounting it on the board positioned by the board transfer rail. The component mounter further includes multiple dish-like members inserted to the base for supplying components placed on them to a movement area of the transfer head. These dish-like members are independently removable from the base.

Abstract: A method for manufacturing a multi media card comprises the steps of: providing a substrate, mounting a first flash memory chip and a controller chip for controlling the flash memory chip over a front surface of the substrate, molding the first flash memory chip and the controller chip by a resin, providing a case having a main surface and a back surface, wherein the back surface of the case has a first recess and a second recess, and, covering the resin and the front surface of the substrate by the case. The depth of the first recess is deeper than the depth of the second recess. The resin is fitted in the first recess. An edge portion of the substrate is fitted in the second recess. The substrate warps so that a central portion of the substrate projects in a direction away from the case.

Abstract: A method of fabricating a plurality of inkjet nozzles on a substrate. The method comprises the steps of: (a) providing a substrate having a plurality of trenches corresponding to ink inlets; (b) depositing sacrificial material so as fill the trenches and form a scaffold on the substrate; (c) defining openings in the sacrificial material; (d) depositing roof material over the sacrificial material to form nozzle chambers and filter structures simultaneously; (e) etching nozzle apertures through the roof material; and (f) removing the sacrificial material.

Abstract: A method of making a printed circuit board in which at least two circuitized substrates are aligned and bonded together (e.g., using lamination). A gasket is provided on one of these and a facing circuitized portion on the other. The gasket forms an effective seal about the circuitized portion to prevent heated dielectric material from contacting the circuitry. After bonding, parts of the bonded structure, including the gasket, are removed to leave a projecting edge portion having circuitry thereon. This edge portion is then adapted for being positioned within an edge connector.

Abstract: Alignment precision enhancement of electronic component process on flexible substrate device and method thereof the same is proposed. The process step of a flexible substrate is put on a substrate holder, wherein the flexible substrate is fixed by a polymer tape. A plural of alignment marks is making for lithography process. An unstressed cut is separated the flexible substrate and substrate holder when the electronic component is made.

Abstract: A component placement machine includes: a transport device for transporting PCBs in an X-direction; first and a second feeder areas; at least one Y-slide beam that is drivable in the X-direction; and at least two placement heads on each Y-slide beam, which placement heads are independently drivable in the Y-direction and dependently drivable in the X-direction. Each feeder area includes at least one feeder for storing components. Such a machine enables a number of actions to be performed simultaneously. For example, within a certain period of time, a plurality of placement heads can simultaneously pick up components from a feeder, while other placement heads, which previously picked up components, may be moved to desired X-Y positions of the PCB which the previously picked up components may be placed, thereby resulting in an improved output.

Abstract: Reference marks arranged at specified intervals on a glass board are recognized, and from its recognition results, offset values for individual areas matching the board size are determined as numerical values for correction use, and further corresponding offset values for individual movement positions of a component placing head are reflected as numerical values for correction use in operation of placing position correction, mark recognition correction, or measurement of placing position offset values, respectively. Thus, high-accuracy placing is achieved. Moreover, correction of positional displacement of a component holding member due to an inclination of the component placing head is performed.

Abstract: A component-mounting apparatus and a component-positioning unit for positioning a component, having a simple structure with reduced manufacturing cost and a significantly higher component-mounting speed. The component-mounting apparatus includes a holding device that holds a component and moves horizontally and a positioning device having a sloped portion for positioning the component held by the holding device when the component comes into contact with the sloped portion.