Abstract: A cast grid array (CGA) package comprises shaped solder posts which may be reflowed and connected directly to a circuit board, such as mother board, or remain in a solid state with the shape allowing them to be secured within a CGA socket which, in turn, may be connected to the a board. Embodiments of the CGA allows for a lower cost socket and package combination by using solder post to interface the socket and not requiring a loading mechanism on every socket.

Abstract: An improved electronic connector with alignment features is disclosed. One or more alignment features for the connector are disposed on a removable SMT cap that attaches to an external face of the connector. Placing one or more alignment features in the SMT cap may enable fewer alignment features on the device PCB, resulting in increased space for electrical routing and other electrical components.

Abstract: A method for manufacturing a piezoelectric actuator is disclosed that includes forming a vibration plate, forming a plurality of electrodes on the vibration plate, forming a piezoelectric layer on the electrodes, and forming a common electrode on the piezoelectric layer.

Abstract: This invention is directed to bendable circuit substrate structures useful for LED mounting and interconnection.

Abstract: In a build-up step, a plurality of resin insulation layers and a plurality of conductive layers are alternately laminated in multilayer arrangement on a metal foil separably laminated on a side of a base material, thereby forming a wiring laminate portion. In a drilling step, a plurality of openings are formed in an outermost resin insulation layer through laser drilling so as to expose connection terminals. Subsequently, in a desmear step, smears from inside the openings are removed. In a base-material removing step performed after the build-up step, the base material is removed and the metal foil is exposed.

Abstract: Using side-wall conductor leads insulated by side-wall insulators to form package level conductor leads for active circuits manufactured on silicon substrate, the preferred embodiments of the present invention significantly reduces the areas of surface mount package chips. Besides area reduction, these methods also provide significant cost saving and reduction in parasitic impedance.

Abstract: An electrical interconnect system comprises: a flexible circuit having thereon a plurality of electrical contact pads; a contact strip comprising a plurality of electrical contacts aligned with respective pads on the flexible circuit; a compression member to engage the contacts with the pads; and, pierced areas on said pads to enhance the mechanical engagement between the contacts and the pads.

Abstract: A method, system, for optimizing routing layers and board space requirements for a ball grid land pattern is described. A number of required pads is determined. A land pattern to yield the required pads is selected. A number of required perimeter routing channels is determined. A size of the land pattern to yield the required perimeter routing channels is optimized. At least one perimeter edge of the land pattern is under populated. In a further aspect, a number of layers is determined when a substrate has multiple layers.

Abstract: A method for manufacturing a surface acoustic wave element that prevents curvature of a piezoelectric substrate when forming an electrode pattern includes a first step of bonding to a first principal surface of a piezoelectric substrate a support member having a linear expansion coefficient lower than a linear expansion coefficient of the piezoelectric substrate to form a composite substrate, a second step of forming a plurality of grooves in the support member of the composite substrate from a surface that is opposite to a bonding interface between the support member and the piezoelectric substrate, a third step of forming electrode patterns including at least one IDT electrode on a second principal surface of the piezoelectric substrate of the composite substrate, and a fourth step of dividing the composite substrate on which the electrode patterns are formed to form individual surface acoustic wave elements.

Abstract: This invention relates to the thermal management, extraction of light, and cost effectiveness of Light Emitting Diode, or LED, electrical circuits. An integrated circuit LED submount is described, for the packaging of high power LEDs. The LED submount provides high thermal conductivity while preserving electrical insulation. In particular, a process is described for anodizing a high thermal conductivity aluminum alloy sheet to form a porous aluminum oxide layer and a non-porous aluminum oxide layer. This anodized aluminum alloy sheet acts as a superior electrical insulator, and also provides surface morphology and mechanical properties that are useful for the fabrication of high-density and high-power multilevel electrical circuits.

Abstract: A method for forming an integrated circuit assembly comprises forming first solder bumps on a first die, and forming a first structure comprising the first die, the first solder bumps, a first flux, and a first substratum. The first die is placed upon the first substratum. The first solder bumps are between the first die and the first substratum. The first flux holds the first die substantially flat and onto the first substratum.

Abstract: Matrices of multiple cast conductors, and methods for making such matrices are disclosed. Methods according to the disclosure comprise: casting a conductor matrix including a plurality of conductors joined by at least one link; applying a surface treatment to at least a portion of the matrix; finishing a contact face on at least one of the conductors; and separating the conductors from each other at the at least one link.

Abstract: A device with a pouch having a pouch wall with an inner side and an outer side, the pouch wall defining an interior of the pouch. A plurality of electrodes embedded in the pouch wall with at least one electrode partially exposed within the interior of the pouch. The plurality of electrodes generate plasma within the interior of the pouch in response to application of an voltage to the plurality of electrodes.

Abstract: Low temperature bond balls connect two structures having disparate coefficients of linear thermal expansion. An integrated circuit is made to heat the device such that the low temperature bond balls melt. After melting, the bond balls solidify, and the device is operated with the bond balls solidified. In one example, one of the two structures is a semiconductor substrate, and the other structure is a printed circuit board. The integrated circuit is a die mounted to the semiconductor substrate. The bond balls include at least five percent indium, and the integrated circuit is an FPGA loaded with a bit stream. The bit stream configures the FPGA such that the FPGA has increased power dissipation, which melts the balls. After the melting, a second bit stream is loaded into the FPGA and the FPGA is operated in a normal user-mode using the second bit stream.

Abstract: Disclosed is a substrate for flip chip bonding, in which a base solder layer is formed between a pad and a metal post, thereby increasing impact resistance and mounting reliability. A method of fabricating the substrate for flip chip bonding is also provided.

Abstract: An electrical connection assembly includes a connector and a cable. The connector includes a plug having a multitude of contacts in electrical communication with the cable wires. The connector further includes a body in which a printed circuit board is inserted. The cable wires are soldered to the bonding pads of the printed circuit board which is encapsulated by an adhesive. The connector further includes a metallic shield enclosing the body and providing a path to the ground. An inner mold encapsulates the space enclosed by the metallic shield. The metallic shield is optionally formed from a pair of metallic shields cans that are crimped and laser welded. The assembly further includes a sleeve attached at a rear face of the metallic shield, an enclosure attached to the connector body, and a pair of face plates attached between the enclosure and the body.

Abstract: Devices and methods for assembling a connector are provided herein. In one aspect, an example method of assembly includes positioning an insert frame having an applicator portion supporting electrode contacts within an enclosure; attaching the electrode contacts to a circuit board substrate within the enclosure; forming an underfill layer by injecting a hardenable fluid medium through the applicator portion to fill a semi-confined space between the insert frame and the circuit board substrate; and detaching the applicator portion and applying an overmold. The applicator portion includes one or more lumens extending from an inlet opening to one or more exit openings to facilitate flow of fluid medium to desired locations. The inlet opening may be disposed on a portion of the applicator extending above the insert frame and have a diameter substantially larger than the exit opening to allow for fluid injection using an oversized injection nozzle.

Abstract: An improved electronic connector with alignment features is disclosed. One or more alignment features for the connector are disposed on a removable SMT cap that attaches to an external face of the connector. Placing one or more alignment features in the SMT cap may enable fewer alignment features on the device PCB, resulting in increased space for electrical routing and other electrical components.

Abstract: A surface mount coaxial cable connector comprising a generally elongate block. A channel extends between the proximate and remote ends for receiving a coaxial cable and includes an upstream larger diameter channel and a downstream, smaller diameter channel for receiving with little clearance the central conductor after the shield and the outer layer have been removed. The lower surface of the block is provided with slots extending from the lower surface to the stepped channel. One slot is arranged along said central plane and aligned with the central conductor within the smaller diameter channel and two slots are offset from the central plane. A plurality of piercing blade contacts within the slot extend beyond said lower surface that have extended piercing contact portions with opposing free edges suitable for surface mounting on a printed circuit board.

Abstract: Systems, apparatuses and methods are described herein for precision insertion. In various embodiments, a feeder device may be configured to feed an object such as wire from a wire source into a wire path. In various embodiments, a guidance device with a channel that at least partially defines the wire path may receive the wire fed from the feeder device. In various embodiments, a base may be provided for mounting at least one of a first substrate having a first aperture and a second substrate having a second aperture so that the first aperture of the first substrate is aligned with the second aperture of the second substrate. In various embodiments, the base may be configured to be movable relative to the guidance device to position the first substrate or second substrate so that the first or second aperture is aligned with the wire path.

Abstract: An automated assembly sensor cable has a generally wide and flat elongated body and a registration feature generally traversing the length of the body so as to identify the relative locations of conductors within the body. This cable configuration facilitates the automated attachment of the cable to an optical sensor circuit and corresponding connector. In various embodiments, the automated assembly sensor cable has a conductor set of insulated wires, a conductive inner jacket generally surrounding the conductor set, an outer jacket generally surrounding the inner jacket and a registration feature disposed along the surface of the outer jacket and a conductive drain line is embedded within the inner jacket. A strength member may be embedded within the inner jacket.

Abstract: A protective element for manufacturing platines is provided, where conductors are fastened to the contacts of the conductors. The protective element includes recesses which are configured for arranging a conductor each, and the protective element can be arranged adjacent a support. The recesses of the protective element are arranged in a first position in alignment with the recesses of the support and in a second position at an angle relative to the recesses of the support. Preferably, the protective element has at least one hinge section which is configured for interacting with a complimentary hinge section of a support which can be mounted against the protective element, where pivoting of the protective element against the support about the pivoting axis of: the interacting hinge sections moves the protective element on the support from the first position into the second position.

Abstract: A printed circuit board 100 for forming a diplexer circuit 200 comprising a first connector 110 for connecting a first filter 112 and second connector 120 for connecting a second filter 122, wherein the first connector 110 and the second connector 120 are located on opposite sides of the printed circuit board 100.

Abstract: An electrical connector and method assembling the same. A device may comprise a connector frame, a flexible printed circuit board connected to the connector frame, a filter mounted to the flexible printed circuit board; and at least one terminal mounted to the flexible printed circuit board and in electrical communication with the filter. A method to assemble an electrical connector may comprise: providing a flexible printed circuit board having two conductive pads and a filter in electrical communication with the two conductive pads; connecting each conductive pad to a corresponding terminal; inserting each terminal into corresponding holders in a connector frame; placing the flexible printed circuit board in a curved pathway of the connector frame to form a connector subassembly; and inserting the connector subassembly into a connector housing.

Abstract: An inline connector is coupled to a first substrate and operable to receive at least one prong. A second receptacle is coupled to a second substrate and operable to receive the prong. A plug having an elongated prong that, when inserted through the first receptacle and into the second receptacle operates to provide electrical connections between the substrates. The substrates may be circuit boards and the receptacle may be mounted along the edges of the circuit board to allow for easier installation. Some embodiments may provide for identical receptacle providing for lower costs and easier installation.

Abstract: An electrical interconnect has an adhesive layer in which is formed an array of apertures, the apertures being of non-circular shape. An electrical circuit apparatus has a first circuit having at least one electrical contact, a second circuit having at least one electrical contact aligned to the electrical contact of the first circuit, and a standoff structure between the first and second circuits having at least one aperture aligned to one electrical contact of the first and second circuits, the aperture being of a non-circular shape.

Abstract: Embodiments of the present description relate to the field of fabricating microelectronic substrates. The microelectronic substrate may include a trace routing structure disposed between opposing glass layers. The trace routing structure may comprise one or more dielectric layers having conductive traces formed thereon and therethrough. Also disclosed are embodiments of a microelectronic package including a microelectronic device disposed proximate one glass layer of the microelectronic substrate and coupled with the microelectronic substrate by a plurality of interconnects.

Abstract: The present invention relates to a method for providing a reflective coating (114) to a substrate (104) for a light-emitting device (112), comprising the steps of: providing (201) a substrate (104) having a first surface portion (116) with a first surface material and a second surface portion (106, 108) with a second surface material different from the first surface material; applying (202) a reflective compound (401) configured to attach to said first surface material to form a bond with the substrate (104) in the first surface portion (116) that is stronger than a bond between the reflective compound (401) and the substrate (104) in the second surface portion (106, 108); curing (203) said reflective compound (401) to form a reflective coating (114) having said bond between the reflective coating (114) and the substrate (104) in the first surface portion (116); and subjecting said substrate (104) to a mechanical treatment with such an intensity as to remove (205) said reflective coating (114) from said secon

Abstract: An electronic component includes a frame-shaped supporting body including a heat-curable resin and surrounding a functional unit on one main surface of a substrate and so as to be separated from a periphery of the substrate on an inner side and in which a lid member is fixed to the supporting body such that an opening of the frame-shaped supporting body is sealed. The frame-shaped supporting body includes a frame-shaped supporting body main body, a first protrusion that protrudes toward an inside from the supporting body main body and a second protrusion that protrudes toward an outside from the supporting body main body at a portion where the supporting body main body and the first protrusion are continuous with each other.

Abstract: A wiring circuit substrate, comprising: a metal support layer; an insulating layer formed on the metal support layer; a conductive layer for wiring formed on the insulating layer; and an opening formed so as to open at a same location in the insulating layer and the conductive layer for wiring, wherein the metal support layer includes: a support section that supports the insulating layer and the conductive layer for wiring, and a terminal section that extends from one edge side to the other edge side of the opening, the terminal section being separated from the support section; and the conductive layer for wiring includes a wiring that is connected to the terminal section by a connecting section.

Abstract: An electrical accessory for a vehicle includes a housing having a connector portion having a connector cavity therein, and a plurality of terminals that electrically connect at a circuit element in the housing and that protrude at least partially into the connector cavity. The housing has at least one fill port and at least one channel for receiving a sealant material through the fill port, whereby the sealant material flows along the at least one channel and at and around at least one terminal to substantially seal the at least one terminal relative to the housing. The fill port is accessible from outside of the housing after the electrical accessory is assembled.

Abstract: A method for mounting connection pins in respective through-holes. Each pin having an anchoring part for insertion into said through-hole, a contact part to extend outside said through-hole and having a contact end for contact with the surface of another module of the electronic assembly, and a flange part to abut against said component carrier and located between said anchoring part and said contact part. A die tool has several similar recesses all adapted to receive a contact end of the contact part of a connection pin. The anchoring part of the pin is inserted in a through-hole of the component carrier, and the pin is anchored in the component carrier by exerting a force on a free end of the anchoring part of the pin while an end surface of the contact end abuts the bottom surface of similar recesses in the die tool.

Abstract: A circuit board is provided which includes a plurality of signal pairs of connectors. The signal pairs of connectors are disposed in a triangular grouping of three signal pairs of connectors such that a first connector of each signal pair is located at a vertex of the triangular grouping. A second connector of each signal pair is located at a side of the triangular grouping adjacent to the vertex of the first connector. The signal pairs may be differential pairs.

Abstract: A method for providing and connecting a first contact area to at least one second contact area on a substrate, in particular in the case of a semiconductor component, which includes providing at least one insulation layer on the substrate, forming an opening in the at least one insulation layer over at least one insulation trench of a first contact area, applying at least one metal layer to the insulation layer, forming the first and second contact areas in the at least one metal layer and at least one printed conductor between the two contact areas, and forming the insulation trench.

Abstract: An electrical interconnect providing an interconnect between contacts on an IC device and contact pads on a printed circuit board (PCB). The electrical interconnect includes a resilient substrate with a plurality of through holes extending from a first surface to a second surface. A resilient material is located in the through holes. The resilient material includes an opening extending from the first surface to the second surface. A plurality of discrete, free-flowing conductive nano-particles are located in the openings of the resilient material. The conductive particles are substantially free of non-conductive materials. A plurality of first contact members are located in the through holes adjacent the first surface and a plurality of second contact members are located in the through holes adjacent the second surface. The first and second contact members are electrically coupled to the nano-particles.

Abstract: An inkjet head including: a head chip having; driving walls composed of piezoelectric element, wherein shear deformation is caused by applying voltage so as to jet ink, ink containing channels arranged alongside the driving walls alternatively, outlet and inlet ports respectively provided on a front and rear surface of the head chip for each channel, driving electrodes formed on surfaces of the driving walls to apply voltage to the driving walls, and connection electrodes formed on the rear surface of the head chip to connect the driving electrodes electrically; a wiring substrate, wherein wiring electrodes are formed to apply voltage to the driving electrode through the connection electrode, bonded on the rear surface of the head chip to protrude from the head chip in a direction perpendicular to a direction of a channel array exposing all the channels at the rear surface of the head chip.

Abstract: A module for use with a monitoring system is provided. The module includes a circuit board that includes a plurality of ground planes. At least two of the plurality of ground planes are coupled using a plurality of vias. The module further includes a copper pour coupled to the circuit board adjacent to the plurality of vias. The module further includes a housing that includes a dam wall that is coupled to the copper pour.

Abstract: A method of fixing reflowable elements on electrical contacts. The method includes providing a strip having a number of electrical contacts, each contact including a contact body and a tail portion extending away from the contact body. The tail portions of the contacts are then disposed adjacent an elongate reflowable member. The elongate reflowable member is pushed onto the tail portions of the plurality of contacts. Subsequently, the elongate reflowable member is cut into a plurality of separate reflowable elements, each reflowable element corresponding to one of the tail portions. The electrical contacts with the reflowable element attached thereto are separated from the strip.

Abstract: An ablation probe and method of manufacturing the ablation probe are provided. The probe comprises a probe shaft and a unibody electrode element. The unibody electrode element comprises a common electrode base located at the distal end of the shaft, and a plurality of electrode tines distally extending from the electrode base. The electrode element may be created by forming divisions (such as slits or slots) from a first end of an electrically conductive elongate member towards an opposing second end of the elongate member. Alternatively, the divisions can be formed from a first end of an electrically conductive sheet towards an opposing second end of the sheet, and then bent or rolled to form the elongate member. In either case, the common electrode base can either be separately mounted to a probe shaft, or the probe shaft can be formed from the elongate member, in which case, the electrode base will be integrated with the probe shaft as a unibody structure. The electrode tines can be optionally shaped, e.g.

Abstract: Plating stub resonance in a circuit board may be mitigated by increasing surface roughness of the plating stub conductor. Roughening the plating stub increases its resistance due to the skin effect at higher frequencies, which decreases the quality factor of the transmission line and consequently increases the damping factor, to reduce any resonance that would occur in the plating stub as formed prior to roughening. The surface roughness can be increased in a variety of ways, including chemical processes, by selectively applying a laser beam, or by applying an etch-resistance material in selected locations.

Abstract: A printed circuit board assembly is disclosed, including a printed circuit board including at least one opening, and a system in package assembly, wherein the system in package assembly includes a system in package module and a lead frame bonded to the system in package module. The lead frame includes a plurality of pins.

Abstract: A printed circuit board having a connection terminal which includes: an insulating substrate including first and second surfaces, and an end surface along an outline normal to an insertion direction of the connection terminal; at least one lead wiring layer formed on the first surface of the insulating substrate; an insulating protection film covering the lead wiring layer; at least one lead terminal layer constituting an end portion of the lead wiring layer, the lead terminal layer being formed into a strip, and having an end surface along the outline; a reinforcement body adhered on the second surface of the insulating substrate at a backside position of the lead terminal layer; wherein a distance between an outer surface of the lead terminal layer and an outer surface of the reinforcement body on the outline side is smaller than a distance therebetween on the lead wiring layer side.

Abstract: An electrical connector (10) adapted for being mounted onto a printed circuit board (PCB) including a number of vias. The electrical connector includes an insulative housing (200) having a board mounting surface (12), a contact module (400) assembled to the insulating housing (200) and including a number of conductive terminals (403), and a positioning fixer (300) mounting to the conductive terminals. Each of the conductive terminals includes a pin end extending beyond the mounting surface for being inserted into one of the PCB vias. The position fixer (300) has a plurality of through holes (301) each retaining to a corresponding pin end (405) prior to the position fixer (300) being moved up to the mounting surface when the electrical connector is mounted to the PCB.

Abstract: According to one embodiment, a wiring board device is provided in which even if the temperature of a ceramic board becomes high, the influence on a connector can be reduced and the occurrence of defects due to heat can be prevented. The wiring board device includes a common member. The ceramic board and the connector are placed on the common member. A wiring pattern of the ceramic board and the connector are electrically connected by wiring.

Abstract: An interposer including stress-engineered nonplanar microsprings may provide interconnection of bonding pads of electronic structures disposed above and below the interposer. The lateral offset between an anchor portion of a microspring disposed for contact at a bottom surface of the interposer and the tip of the microspring located in a free portion of the microspring for contact and deflection over a top surface of the interposer permits the interconnection of devices having different bonding pad pitches. Microspring contacts at the free portion permit temporary interconnection of devices, while solder applied over the free portion permit permanent connection of devices to the interposer.

Abstract: A wiring board including a core insulation layer having a connection conductor formed in a hole of the core layer, and an interlayer insulation layer laminated on one side of the core layer. The conductor of the core layer includes plating filling the hole of the core layer. The interlayer layer has a connection conductor formed in a hole of the interlayer layer. The conductor of the interlayer layer includes plating filling the hole of the interlayer layer. The conductor of the interlayer layer is stacked on the conductor of the core insulation layer. The conductors of the core and interlayer layers have lands formed on the core and interlayer layers and including metal foils and plating on the foils. The foil of the land on the core layer has a thickness which is thicker than a thickness of the foil of the land on the interlayer layer.

Abstract: For inserting terminals into each connector housing and reducing working area in processes by eliminating rearrangement of wires with terminals, a manufacturing method for wiring harnesses, including the steps of: picking up both ends of a wire at a predetermined position in a transferring direction from a transferring device by a pair of chucks, each chuck picking up one of the both ends of the wire; chucking the both ends of the wire with terminals fed through the pair of chucks, each end of the wire being fed through one of the pair of chucks, by a pair of terminal inserting heads as the terminal inserting device, the pair of terminal inserting heads moving freely independently of each other at least in a direction of a row of a connector housings; and inserting the terminals at the both ends simultaneously into each of the connector housings.

Abstract: A printed wiring board includes a board body that includes a signal line embedded at a predetermined wiring position and a through hole electrically connected to the signal line, and a connector that includes a connector plate including a connection terminal electrically connected to the signal line via the through hole, and electrically connects the connection terminal to the signal line by insertion of the connection terminal of the connector plate into the through hole in a direction of one of a front surface and a rear surface of the board body according to a wiring position of the signal line so that a transmission path of the connection terminal on a stub side is shorter than a transmission path of the connection terminal on an input and output side.

Abstract: A surface mount electrical interconnect is disclosed that provides an interface between a PCB and solder balls of a BGA device. The electrical interconnect includes a socket substrate and a plurality of electrically conductive contact members. The socket substrate has a first layer with a plurality of openings configured to receive solder balls of the BGA device and has a second layer with a plurality of slots defined therethrough that correspond to the plurality of openings. The contact members may be disposed in the openings in the first layer and through the plurality of slots of the second layer of the socket substrate. The contact members can be configured to engage a top portion, a center diameter, and a lower portion of the solder ball of the BGA device. Each contact member electrically couples a solder ball on the BGA device to the PCB.

Abstract: A method of manufacturing a printed circuit board includes stacking a solder resist layer on one side of a carrier; forming a first circuit pattern, which includes a first electrode pad, on the solder resist layer; forming a conductive post on the first electrode pad; stacking and pressing the carrier onto an insulation layer stacked in an inner substrate, such that the conductive post faces the insulation layer; and removing the carrier. As the conductive posts are pressed into the insulation layers to implement interlayer connections, certain drilling processes for forming via holes may be omitted, so that the degree of freedom can be increased in designing the circuits, and the circuits can be made to have greater densities. As the circuit patterns are buried in the insulation layers, the board can be made thinner, and the attachment areas can be increased, to allow greater adhesion.