Abstract: The present invention relates to an electronic circuit arrangement (10) comprising: a substrate (12) having a first surface (12a) and a second surface (12b), an electronic circuit, an electrical connection part (16) for providing an electrical connection to the electronic circuit and being arranged on the first surface (12a), and at least one electrical wire (18). The electrical wire (18) comprises at least one conductive core (20) and an isolation (22) surrounding the conductive core (20). An end portion (18a) of the electrical wire (18) is an isolation-free portion for allowing access to the conductive core (20), wherein the end portion (18a) of the electrical wire (18) is connected to the electrical connection part (16). At least one through-hole (24) extending from the first surface (12a) to the second surface (12b) is provided in the substrate (12), wherein the electrical wire (18) is arranged through the through-hole (24).

Abstract: A method of forming an electrical component is provided. The method comprises preparing a subassembly by electrically connecting an integrated circuit to a flexible circuit; and attaching the subassembly to a multilayer ceramic capacitor having a mounting surface with a curvature deviation exceeding 0.008 inches per inch.

Abstract: Disclosed herein is a method of manufacturing a noise removing filter, including preparing at least one conductive pattern, an insulating layer for covering the at least one conductive pattern, and a lower magnetic body including input/output stud terminals for electrically inputting and outputting electricity to and from the at least one conductive pattern; disposing a recognizable portion on upper surfaces of the input/output stud terminals; disposing an upper magnetic body on the recognizable portion and the insulating layer; polishing the upper magnetic body; and removing the recognizable portion such that a level of an upper surface of the upper magnetic body is higher than levels of the upper surfaces of the input/output stud terminals.

Abstract: A battery system for electrical devices, a battery, a battery loading system may be provided. The battery system may comprise a battery container with an inlet channel for a serially inserting multiple batteries with substantially identical shape into the battery container, and a battery holder with a holding mechanism to selectively hold the inserted battery. For each of the battery holders, electrical connectors for connecting the inserted batteries may be available. An ejection may be possible via an outlet channel and an ejection mechanism.

Abstract: Embodiments of the invention relate to electrostatic discharge (ESD) protection. One embodiment includes a first dissipative adhesive (DA) connected to at least a portion of multiple leads in a first plane of a flexible cable in a coverage area for providing ESD protection to at least one element of an electronic device. A common bus bar is connected to the leads in a second plane of the flexible cable. Conductivity of the common bus bar is greater than conductivity of the first DA and the first plane and the second plane are different planes of the flexible cable.

Abstract: A patch panel arrangement is disclosed having a two part cable terminating device into which a cable can enter. One part, for example, a main body has forward facing wiring contacts. The cable can pass through from the rear but has its wires terminated on the wiring contacts from the front. A front cover detachable from the main body via the front of the patch panel, exposes the front facing wiring contacts to permit wiring changes to be effected from the uncluttered front of the patch panel (rather than the crowded rear of conventional patch panels).

Abstract: An electrical stimulation lead includes a lead body having a distal end portion, a proximal end portion, and a longitudinal length; electrodes disposed along the distal end portion of the lead body; terminals disposed along the proximal end portion of the lead body; conductors electrically coupling the terminals to the electrodes; and at least one anchoring unit disposed along the distal end portion of the lead body. Each anchoring unit includes a cylindrical lead attachment element defining a central lumen within which a portion of the lead is received, and at least one anchoring element this is disposed over the lead attachment element and extends away from the lead attachment element and is configured and arranged for contact with patient tissue to anchor the lead within the patient tissue.

Abstract: An arrangement of an electronic sensor device (3) at a terminal post clamp (1) of a battery. The arrangement comprises: a terminal post clamp (1) of a battery; an electronic sensor device (3); a housing (10), which can accommodate the electronic sensor device (3); and a fastening means, which can connect the housing (10) to the terminal post clamp (1). The fastening means comprises a receptacle (13) and a fastening member (8) that can be inserted at least in sections into the receptacle (13) in a positive locking and/or non-positive locking manner.

Abstract: In one implementation, flash memory chips are provided with an operating power supply voltage to substantially match a power supply voltage expected at an edge connector of a dual inline memory module. The one or more of the flash memory chips and a memory support application integrated circuit (ASIC) may be mounted together into a multi-chip package for integrated circuits. The one or more flash memory chips and the memory support ASIC may be electrically coupled together by routing one or more conductors between each in the multi-chip package. The multi-chip package may be mounted onto a printed circuit board (PCB) of a flash memory DIMM to reduce the number of packages mounted thereto and reduce the height of the flash memory DIMM. The number of printed circuit board layers may also be reduced, such as by integrating address functions into the memory support ASIC.

Abstract: When performing the device type changing operation with the change of the board type to undergo mounting, the component mounting device, which has a first mounting lane and a second mounting lane and which is structured so as to be able to select either an independent mounting mode or an alternate mounting mode, moves a mounting head of the mounting lane to and thereafter positions and fixes to a previously-set predetermined withdraw position [P] where entry of a portion of a body of an operator by way of an opening (19) formed in a protective cover (18a) can be prevented and where safety of the operator is not impaired even if a mounting head of a mounting lane on the other side has undergone collision.

Abstract: A process for installing electrical box, wiring, and receptacles or switch simultaneously that allows electricians to perform all 3 tasks at one time without the need to return to install receptacles or switch after wallboard is installed comprises: Housing with built-in laser guide and attached magnetic spacers for metal studs or wooden studs that allow for correct alignment of receptacle or switch for applicable wallboard thickness used.

Abstract: This is directed to methods and apparatus for shielding a circuitry region of an electronic device from interference (e.g., EMI). A conductive dam may be formed about a periphery of the circuitry region. A non-conductive or electrically insulating fill may then be applied to the circuitry region within the dam. Next, a conductive cover may be applied above the fill. The cover may be electrically coupled to the dam. The dam may include two or more layers of conductive material stacked on top of one another. In some embodiments, the conductive cover may be pad printed or screen printed above the fill. In other embodiments, the conductive cover may be a conductive tablet that is melted above the fill.

Abstract: In a component mounting device (1) which includes a first mounting lane (L1) and a second mounting lane (L2) and for which an independence mounting mode and an alternation mounting mode are selectable, a first limited movable area (R1A) and a first limited movable area (R1B) in which the movements in the horizontal direction of a first mounting head (13A) and a second mounting head (13B) of the mounting lanes are permitted in the independence mounting mode, are set as areas different from second limited movable areas in the alternation mounting mode, to prevent the mounting head of the mounting lane which is continuously operating from entering into the area of the mounting lanes for which the device type changing operation is being performed.

Abstract: The device (100) for assembling capacitors (200) is intended for an electronic converter with a plurality of arms provided with transistors. The device comprises a bus bar (11) with positive polarity and a bus bar (12) with negative polarity. The bus bar with positive polarity and the bus bar with negative polarity are superposed one on top of the other without electrical contact. Preferably, the bus bar with positive polarity comprises a width (L1) smaller than the width (L2) of the bus bar with negative polarity. The device further comprises a support part (13) for insulating and indexing, arranged between the bus bar with positive polarity and the bus bar with negative polarity. The support part for insulating and indexing is typically formed from PBT plastic material reinforced with fibreglass.

Abstract: A lighting fixture includes a first housing portion and a second housing portion. The first housing portion includes a base and a wall extending outwardly from substantially the perimeter of the base. A top portion of the wall includes one or more hinges extending outwardly therefrom. The second housing portion includes a front panel and a side panel extending outwardly from substantially the perimeter of the front panel. A top portion of the front panel includes at least one slot. The second housing is coupled to the first housing in an open position when the hinge is inserted into the slot and the front panel is disposed elevationally above the base. The second housing is coupled to the first housing in an operational position when the hinge is inserted into the slot and the front panel covers the base.

Abstract: Microelectronic packages with leadframes, including leadframes configured for stacked die packages, and associated systems and methods are disclosed. A system in accordance with one embodiment includes a support member having first package bond sites electrically coupled to leadframe bond sites. A microelectronic die can be carried by the support member and electrically coupled to the first packaged bond sites. A leadframe can be attached to the leadframe bond sites so as to extend adjacent to the microelectronic die, with the die positioned between the leadframe and the support member. The leadframe can include second package bond sites facing away from the first package bond sites. An encapsulant can at least partially surround the leadframe and the microelectronic die, with the first and second package bond sites accessible from outside the encapsulant.

Abstract: A stimulation system includes an implantable pulse generator having a sealed chamber and an electronic subassembly disposed in the sealed chamber. Feed through pins are coupled to the electronic subassembly and extend out of the sealed chamber. Feed through interconnects are coupled to the electronic subassembly via the feed through pins. At least one tab is disposed on at least one feed through interconnect. The tab(s) are configured and arranged to flex away from the feed through interconnect and against a side of the feed through pin. A feed through interconnect assembly includes an assembly frame; feed through interconnects extending from the assembly frame; a first contact pad and a second contact pad disposed on at least one of the feed through interconnects; and a tab formed on a first contact pad of at least one of the feed through interconnects.

Abstract: Electrode cabling, including a core and n wires coiled on the core in an arrangement topologically equivalent to an n-start thread configuration, wherein n is an integer greater than one. The cabling also includes a sheath covering the n wires and an electrode attached through the sheath to a given wire selected from the n wires.

Abstract: An electronic device includes: a support member including a first terminal, a second terminal, and a support portion extending from the first terminal and coupling the first terminal with the second terminal; an electronic component; and a bonding member connecting the first terminal with the electronic component. In a plan view along a direction in which the first terminal and the electronic component overlap each other, a portion of the first terminal is adjacent to the support portion with a notch portion therebetween and protrudes toward the extending direction side of the support portion. The support portion is bent at a portion adjacent to the protruding portion of the first terminal along the overlapping direction.

Abstract: A robust and waterproof wires-to-meter connection that provides an apparatus for conducting signals from several signal-carrying, bundled wires to a circuit member that is mounted within the interior of a sealed case, and in particular an assembly for conducting the signals while providing a robust, compact and water-resistant connection between the internal main circuit and the entry wires.

Abstract: A device and method for using a screw to connect wires to an electrical component, without the need for additional tools, to manipulate the wire around the screw. The device is a screw with a body, head, and hole perpendicular to the rotational axis of the body and adjacent to the screw head. A wire is connected to the electrical component by inserting the end of an exposed wire into the hole through the screw and then tightening the screw, causing the exposed wire to loop around the screw and become secured between the screw and electrical component in a secure manner. For larger holes, a section with a larger diameter than the screw body may be disposed between the screw body and screw head.

Abstract: Multiple high-voltage side and low-voltage side electric conductors are formed from one sheet of a conductive plate in such a way that the multiple electric conductors are arranged in parallel to one another across an initial gap between the high-voltage side and the low-voltage side electric conductors. The multiple electric conductors are connected to one another via connecting portions. An intermediate portion of the connecting portion is deformed so as to reduce the initial gap to a smaller adjusted gap. Portions of the electric conductors as well as switching devices mounted to the electric conductors are sealed by sealing material. The connecting portions are cut away so that the electric conductors are finally separated from one another.

Abstract: A plug-in overhead light is shown with an overhead female type, twist lock, electrical plug. The plug-in overhead light has a male type, twist lock, electrical plug. Upon plugging in the overhead light and twisting to lock, additional structural support for the overhead light is provided. Other than just the twist lock, electrical plug, the junction box is anchored to a ceiling joist and supports the overhead light projecting there below. A decorative cover extends over the junction box and may be used to hold the light globe in position. The male type, twist lock, electrical plug has a bulb socket on the end opposite the electrical plug.

Abstract: An electrical bushing for use in a housing of an implantable medical device is proposed. The electrical bushing includes at least one electrically insulating base body and at least one electrical conducting element. The conducting element establishes, through the base body, at least one electrically conductive connection between an internal space of the housing and an external space. The conducting element is hermetically sealed with respect to the base body, at least in part. The at least one conducting element includes at least one cermet. The electrical bushing includes at least one head part. The head part includes at least one plug connector element that enables electrical connection of at least one plug element from the external space to the plug connector element.

Abstract: A well-logging tool for geological formation has a borehole. A housing that is to be positioned within the borehole includes an opening. An electrically conductive winding is carried by the housing. A feedthrough assembly includes an elongate electrical conductor having opposing first and second ends and a medial portion extending therebetween. The first end is coupled to the electrically conductive winding. An integrally formed, monolithic, dielectric layer sounds the elongate electrical conductor and includes a first enlarged diameter end portion surrounding the first end of the elongate electrical conductor and is positioned within the opening. A reduced diameter portion surrounds the medial portion of the elongate electrical conductor.

Abstract: A method for making an integrated circuit substrate having laminated laser-embedded circuit layers provides a multi-layer high-density mounting and interconnect structure for integrated circuits. A prepared substrate, which may be a rigid double-sided dielectric or film dielectric with conductive patterns plated, etched or printed on one or both sides is laminated with a thin-film dielectric on one or both sides. The thin-film is laser-ablated to form channels and via apertures and conductive material is plated or paste screened into the channels and apertures, forming a conductive interconnect pattern that is isolated by the channel sides and vias through to the conductive patterns on the prepared substrate. An integrated circuit die and external terminals can then be attached to the substrate, providing an integrated circuit having a high-density interconnect.

Abstract: A fixture having a cylindrical body, said body having an internal cavity extending from a first end to a second end, and said body having an exterior threaded portion, a flange affixed to the first end of the body, a portion of said flange extending past the circumference of the cylindrical body, said flange formed for receiving an electrical component, and a fastener complementary to the threaded portion, wherein the fastener and the flange are operable to secure the cylindrical body to a structure. An electrical component such as a luminaire, a switch or an electrical receptacle may be mounted into the flange portion of the fixture. A retainer may also be employed to distribute the load on the cylindrical body when positioned over the body and secured by the fastener.

Abstract: Disclosed herein are various embodiments of circuits and methods for capacitively coupling touchscreen electrode terminals to terminals of a flex circuit, printed circuit or printed circuit board, without physically attaching the touchscreen electrode terminals to the flex circuit, printed circuit or printed circuit board terminals by means of conventional electrical connection bonding materials or agents such as anisotropic conductive film or solder. The flex circuit, printed circuit or printed circuit board terminals are spaced apart from, or placed in physical contact with, corresponding ones of the touchscreen electrode terminals, but are not soldered or otherwise physically attached to the touchscreen electrode terminals by conventional electrical connection bonding materials or agents such as anisotropic conductive film or solder.

Abstract: Embodiments of the invention provide a method of manufacturing a printed circuit board, including: mounting a strip substrate on a fixing member; separating the strip substrate into unit substrates by performing a singulation process; attaching solder balls onto the unit substrates using a jig; and fixing the solder balls on the unit substrates by performing a reflow process. The method of manufacturing a printed circuit board is advantageous in that the solder balls can be accurately formed at the predetermined positions of the strip substrate because they are attached to the unit substrates after the warpage of the strip substrate was reduced by a singulation process.

Abstract: Techniques for efficient split wire routing of wires and electrical components within a device are disclosed. A split wire routing is discussed with a common start and end point but allows divergent paths for individual and/or groups of wires. A wire can be routed, for example, in the space between two battery cells (or other components/structures) with the use of a bracket inserted between the cells to provide structural support. The electrical tape surrounding a battery may be cut or otherwise breached in order to expose the cavity between distinct battery cells. In some embodiments, multiple brackets may be inserted between the battery cells, creating a trough through which a wire or other component may be routed. After routing a wire through the trough, another electrical part or housing may be fixed above the battery cells.

Abstract: A pre-array temporary placement area A2 and a post-return temporary placement area A3 are set along with a lower receiving area A1. Temporary placement positions TP for lower receiving pins 22 in the pre-array temporary placement area A2 and the post-return temporary placement area A3 are previously assigned in consideration of requirements for preventing occurrence of interference between the lower receiving pins 22, which would otherwise occur during transfer of the lower receiving pins 22, and in accordance with array positions AP of the lower receiving pins 22 in the lower receiving area A1. Further, a transfer sequence is set in accordance with array positions AP.

Abstract: Techniques for efficient routing of wires and electrical components within a cavity of a device are disclosed. A wire or group of wires can be routed in a split wire configuration, for example, in the space between two battery cells (or other components/structures). One example embodiment includes exposing a cavity between at least two electrical parts within an electrical device, and routing a first electrical component through the cavity and routing a second electrical. component in a divergent path to the first electrical component, wherein the first and second electrical component have a common start and end point. In some cases, the first and second electrical components are wires. Numerous such split wire configurations will be apparent in light of this disclosure.

Abstract: A method of manufacturing a terminal block for a telecommunication cable, which includes providing a housing having a front side and a back side and positioning multiple pairs of electrical connectors in the housing such that one end of each of the electrical connectors is exposed on the front side of the housing and one end of the connector is exposed on the back side of the housing. Each of electrical connectors having an insulation displacement contact terminal on the end exposed on the back side of the housing, and connecting multiple pairs of insulated electrical wires to the connectors on the back side of the housing. A dielectric material is pressure molded on the back side of the housing to encapsulate the connections of the wires and the connectors on the back side of the housing.

Abstract: A method of fabricating a plurality of ultrasound transducer assemblies is provided. The method includes applying one or more layers of patternable material to at least a portion of a surface of a wafer comprising a number of die. The method further includes patterning the patternable material to define a plurality of openings, where each of the openings is aligned with a respective one of the die, disposing ultrasound acoustic arrays in respective ones of the openings, coupling the ultrasound acoustic arrays to the respective die to form the respective ultrasound transducer assemblies, and separating the ultrasound transducer assemblies to form individual ultrasound transducer assemblies.

Abstract: A part mounting method of mounting first mounting parts and a second mounting part to a board includes taking an image of a configuration of the second mounting part and performing an image-recognition, mounting the first mounting parts to the board based on a result of the image-recognition of the configuration of the second mounting part, and mounting the second mounting part to the board based on a result of an image-recognition of the first mounting parts mounted to the board.

Abstract: A sensing and responsive fabric is described. In one example the fabric has a sensor formed of a fiber of the fabric, a transducer formed of a fiber of the fabric, and a processor coupled to the sensor to measure a sensor characteristic and to the transducer to apply power to the transducer based on the sensor measurement.

Abstract: A vehicular camera system includes an imager assembly that can include an imager disposed on an imager circuit board and a lens positioned to direct light to the imager. A main circuit board is operatively connected to the imager circuit board. The main circuit board can include at least one processor for processing images captured by the imager. The main circuit board has an opening, and at least a portion of the imager assembly extends through the opening.

Abstract: Systems and methods of coupling digitizing sensors to a structure are disclosed. A particular method includes applying one or more communication traces and one or more power traces to a structure using at least one direct-write technique. The method may also include coupling the one or more communication traces to at least one digitizing sensor. The method may also include coupling the one or more power traces to the at least one digitizing sensor.

Abstract: Microelectronic devices and methods for manufacturing microelectronic devices are disclosed herein. An embodiment of one such method includes forming a plurality of through holes in a substrate with the through holes arranged in arrays, and attaching a plurality of singulated microelectronic dies to the substrate with an active side of the individual dies facing toward the substrate and with a plurality of terminals on the active side of the individual dies aligned with corresponding holes in the substrate. The singulated dies are attached to the substrate after forming the holes in the substrate.

Abstract: In one embodiment, a method of fabricating an implantable pulse generator, comprises: providing a lead body including a plurality of conductors; providing a feedthrough component comprising a plurality of feedthrough pins; hermetically enclosing pulse generating circuitry and switching circuitry within a housing, the feedthrough component being welded to the housing; laser machining each of the plurality of feedthrough pins to comprise a slot along a surface of the respective feedthrough pin; placing a respective conductor from the lead body in the respective slot of each of the plurality of feedthrough pins; and performing welding operations to connect the plurality of conductors of the lead body with the plurality of feedthrough pins of the feedthrough component.

Abstract: Present embodiments include a remanufactured bandage-type medical sensor having an optical assembly with an emitter adapted to transmit one or more wavelengths of light and a photodetector adapted to receive the one or more wavelengths of light transmitted by the emitter. The sensor also includes a laminate assembly having an electrically conductive adhesive transfer tape (ECATT) layer disposed over the photodetector, and the ECATT layer is adapted to shield the photodetector from electromagnetic interference (EMI). A nonconductive layer supports the emitter, the photodetector, and the ECATT layer within the sensor. At least a portion of the optical assembly is from a used bandage-type medical sensor, and at least a portion of the laminate assembly is new.

Abstract: A field-replaceable printed circuit board (“PCB”) cable assembly comprises at least one field-replaceable PCB, at least one cable, a connector with a plurality of beams, and top and bottom hood portions. A first end of the at least one field-replaceable PCB is attached to the at least one cable, and a second end of the at least one field-replaceable PCB is attached to the plurality of beams. The at least one field-replaceable PCB can be replaced by disassembling the hood portions, detaching the at least one field-replaceable PCB from the plurality of beams, and attaching at least one new field-replaceable PCB.

Abstract: Provided is a method for manufacturing an in-plane switching mode liquid crystal display, which can prevent the problem of bubble generation caused by an Ag dot during the attachment process of a liquid crystal panel and a cover substrate, and improve the yield of an Ag dot process. A method for manufacturing an in-plane switching mode liquid crystal display according to an embodiment of the present invention may comprise: forming a liquid crystal panel by interposing a liquid crystal layer between a color filter substrate and a TFT array substrate; attaching a polarizer, with a protective film attached thereon, on the color filter substrate; forming an Ag dot to be in contact with an edge of the protective film, the color filter substrate, and the TFT array substrate; removing part of the Ag dot by removing the protective film; and attaching a cover substrate on the color filter substrate.

Abstract: An assembly method for first and second articles is disclosed. A first substrate with a plurality of first articles and a second substrate with a plurality of second articles are selected. The articles on the flexible substrate webs with different pitches are assembled together by displacing portions between the first articles of one web out of plane to move the first articles on that web to the same shorter pitch as the second articles on the other web, aligning the two webs to register corresponding first and second articles on the two webs, and assembling the corresponding articles together. The assembly may be used for example in the making of RFID tags, labels and inlays.

Abstract: A network and method of laying network cables in water supply pipes is disclosed. A building is situated near a roadway along which is laid a trunk cable. A water supply pipe branches off the water main to enter the building. A water supply pipe is provided at the time of construction of the building and is an underground pipe. It is conventional to provide a dedicated (and usually underground) conduit for a branch cable, which is expensive and disruptive. In the present invention the branch cable is laid along water supply pipe, enabling the cable to cross between the trunk cable and the building with minimal disturbance of the ground therebetween. This is achieved by introducing cable to pipe by use of a suitable Y-junction at location and removing the cable from the pipe by use of a second such Y-junction at location.

Abstract: A mechanism is described for facilitating a dynamic electro-mechanical interconnect capable of being employed in a test system according to one embodiment. A method of embodiments of the invention may include separating, via a cavity, a first conductor of an interconnect from a second conductor of the interconnect, and isolating, via the cavity serving as a buffer, a first electrical path provided through the first conductor from a second electrical path provided through the second conductor.

Abstract: Method for stacking microelectronic devices using two or more carriers, each holding microelectronic devices in an array so they may be registered. Each device is releasably held by its edges in a carrier to allow access to top and bottom surfaces of the device for joining. Arrays of devices held in two or more carriers are juxtaposed and joined to form an array of stacked devices. A resulting stacked device is released from the juxtaposed carriers holding each device by releasing forces of the corresponding carrier urging upon edges of the device, thereby permitting removal of the stacked device.

Abstract: The invention discloses methods for transferring a tactile signal through an inert piece of material. In some embodiments, clear, impact resistant covers are employed with devices including touch-sensitive screens. The instant invention, in some embodiments, describes a method for employing a plurality of magnets to allow a user to input information on a touch-sensitive screen through the inert cover. Contact of a magnet pair above the cover may allow for a signal to be delivered to the touch-sensitive display via a second magnet pair that includes a stylus adapted to activate the surface of the display.

Abstract: Low temperature bond balls connect two structures having disparate coefficients of linear thermal expansion. An integrated circuit is made to heat the device such that the low temperature bond balls melt. After melting, the bond balls solidify, and the device is operated with the bond balls solidified. In one example, one of the two structures is a semiconductor substrate, and the other structure is a printed circuit board. The integrated circuit is a die mounted to the semiconductor substrate. The bond balls include at least five percent indium, and the integrated circuit is an FPGA loaded with a bit stream. The bit stream configures the FPGA such that the FPGA has increased power dissipation, which melts the balls. After the melting, a second bit stream is loaded into the FPGA and the FPGA is operated in a normal user-mode using the second bit stream.

Abstract: A capture pad structure includes a lower dielectric layer, a capture pad embedded within the lower dielectric layer, the capture pad comprising a plurality of linear segments. To form the capture pad, a focused laser beam is moved linearly to form linear channels in the dielectric layer. These channels are filled with an electrically conductive material to form the capture pad.