Abstract: A method for making a diaphragm unit of a condenser microphone includes the steps of: forming a liftoff layer on a substrate; forming an insulator diaphragm film on the liftoff layer; and removing the liftoff layer from the diaphragm film and the substrate so as to separate the diaphragm film from the substrate.

Abstract: A method of creating an electrical contact involves locating a barrier material at a location for an electrical connection, providing an electrically conductive bonding metal on the barrier material, the electrically conductive bonding metal having a diffusive mobile component, the volume of barrier material and volume of diffusive mobile component being selected such that the barrier material volume is at least 20% of the volume of the combination of the barrier material volume and diffusive mobile component volume. An electrical connection has an electrically conductive bonding metal between two contacts, a barrier material to at least one side of the electrically conductive bonding metal, and an alloy, located at an interface between the barrier material and the electrically conductive bonding metal. The alloy includes at least some of the barrier material, at least some of the bonding metal, and a mobile material.

Abstract: Connector apparatus and methods providing for “keep-out” functionality against improperly sized plugs or inserts are disclosed. In one embodiment the invention discloses a connector assembly incorporating an integrated keep-out feature associated with the housing. In one variant, the connector assembly comprises a modular jack connector, and the keep-out feature(s) is/are formed substantially within one or more the sidewall(s) of the housing, thereby simplifying its assembly and reducing its cost, as well as conserving on connector interior space. In another embodiment, the keep-out feature comprises an element disposed substantially within a plane parallel to the front face of the connector. Methods for manufacturing and using connectors with integrated keep-out features are also disclosed.

Abstract: An electric contact for high-temperature fuel cells and to methods for the production of said contacts. The aim of the invention is to enable long-term use at high operating temperatures of up to 950° C., offering high electrical conductivity and being able to be produced at low cost. The inventive electric contact is produced from a composite consisting of a metal component and a ceramic component. The metal component is, preferably, formed with at least one metal oxide.

Abstract: Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate.

Abstract: In a first aspect, a first method of manufacturing a connector for a printed circuit board (PCB) is provided. The first method includes the steps of (1) forming a housing for the connector using a material having first properties; and (2) before the housing is coupled to the PCB, annealing the connector housing to change the first properties of the material such that, after the connector is coupled to the PCB using a reflow process, warpage of a resulting connector-PCB assembly is within a predetermined tolerance. Numerous other aspects are provided.

Abstract: The objective of the invention is to present a mounting method by which mounting at higher densities and finer pitches can be handled so as to mount extremely small conductive balls. The mounting method of the present invention may be used to prepare porous base member 210 and mask set 220 with a 2-layer structure to be placed on base member 210, on which multiple through-holes 222a and 224a are created; vacuum adsorption is applied to base member 210 so as to form an adsorption surface on the surface of base member 210 that is exposed by through-holes 222a and 224a; microballs 260 are dropped into through-holes 222a and 224a of mask set 220; and microballs 260 are adsorbed by base member 210. Then, adsorbed microballs 260 are pressed against multiple terminal regions 108 that are formed on one surface of substrate 100 in order to transfer them there.

Abstract: A method for fabricating an electrical connector made up of an array of metallic contacts that act as conductive carriers, each attached to a flexible insulating sheet in one of an array of openings provided in the flexible sheet. The metallic contacts have portions disposed on opposite sides of the flexible insulating sheet that form a contact channel region that retains a rim portion surrounding an opening. The electrical connector provides a flexible carrier for the contacts to conform to irregular mating surfaces of components to be joined. For a given contact height, the electrical connector further provides a minimum electrical path length for components connected by the contacts board. In one aspect, the metallic contacts including at least one side containing elastic portions are formed from sheets of conductive material. In one aspect, circular shaped contacts are singulated after opposing conductive sheets are joined in regions within the openings of the flexible insulating sheet.

Abstract: An electrical connector has a hard base part forming at least one rearwardly and forwardly open seat and formed with a transverse passage extending across the seat generally at the rear seat end, a respective contact in the seat having a front end and a rear end, a respective wire projecting into the rear end of the seat and connected there to the rear contact end, and a soft jacket encapsulating a rear end of the base part and front ends of the wires and extending at least partially into the rear seat ends. This connector is made by fitting a flow-blocking bar through the passage into a position blocking forward flow in the seat to the front contact end. The rear end of the part and the bar are then enclosed in a cavity of a mold to be filled with hardenable resin.

Abstract: A high speed electrical connector includes a plurality of substantially planar signal transmission bodies (SPSTB), an insulative housing that retains the plurality of SPSTBs, and a plurality of self-adjusting surface-mount attachment structures (SASMAS). Each SASMAS is confined in its own guide with respect to an associated SPSTB. During the connector-to-printed circuit board (PCB) attachment process, the connector is heated so that solder within the connector that holds the SASMAS structures in place melts. As the connector settles with respect to the PCB, the SASMAS structures slide in their respective guides varying amounts to accommodate non-planarity of the upper surface of the PCB. In one example, each SPSTB is a printed circuit that has a plurality of signal conductors. Each conductor terminates in planar sliding surface. A SASMAS is self-adjustably soldered to each such sliding surface.

Abstract: The invention relates to a method for manufacturing a USB electronic key, whereby a chip is cut out of a tape, provided with a plurality of chips, each chip defining contact pads in USB format and supporting an electronic component, connected to the pads. A thickness adjustment step is directly carried out on the chip to give a thickness conforming to the USB standard, at least in the area of the contact pads.

Abstract: Disclosed is a heat staking process using a configuration to join two conductive yarn traces or pads by piercing them with a thermo plastic stud shaped somewhat like a rivet with a pointed post to pierce the fabrics. A properly designed tool can be lowered to meet the pointed tip of the stud and by using the proper heat and proper compression will join the two fabric pieces mechanically and electrically. The heat and compression formed stud 50 will provide mechanical strength and actually seal the connection if so required.

Abstract: General purpose methods for the fabrication of integrated circuits from flexible membranes formed of very thin low stress dielectric materials, such as silicon dioxide or silicon nitride, and semiconductor layers. Semiconductor devices are formed in a semiconductor layer of the membrane. The semiconductor membrane layer is initially formed from a substrate of standard thickness, and all but a thin surface layer of the substrate is then etched or polished away. In another version, the flexible membrane is used as support and electrical interconnect for conventional integrated circuit die bonded thereto, with the interconnect formed in multiple layers in the membrane. Multiple die can be connected to one such membrane, which is then packaged as a multi-chip module. Other applications are based on (circuit) membrane processing for bipolar and MOSFET transistor fabrication, low impedance conductor interconnecting fabrication, flat panel displays, maskless (direct write) lithography, and 3D IC fabrication.

Abstract: A circuit provides energy to a plurality of piezoelectric diaphragm structures formed in a two-dimensional array. Each piezoelectric diaphragm structure includes a piezoelectric element in operational contact with at least a first side electrode and a second side electrode. A switching system includes a first connection for a first power source, for application of power to the first side electrode and a second connection for a second power source, for application of power to the second side electrode. In a first state, power appropriate for performing a poling operation of the piezoelectric material is available for application to the first electrode, and the second electrode, and in a second state, power appropriate to activate the piezoelectric material to cause operational movement of the poled piezoelectric diaphragm structure is available for application to the first electrode and the second electrode.

Abstract: An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member having an intrinsic stress profile. The intrinsic stress profile biases a free portion away from the substrate forming a loop winding. An anchor portion remains fixed to the substrate. The free portion end becomes a second anchor portion which may be connected to the substrate via soldering or plating. A series of individual coil structures can be joined via their anchor portions to form inductors and transformers.

Abstract: A contact sheet is provided including two insulative base sheets having a plurality of through-holes formed therethrough in an array pattern and a plurality of conductive contacts interposed between the insulative base sheets. Each contact includes a fixed part bonded to an end of a respective through-hole and an integral moving part contiguous with the fixed part. The moving part includes a contact portion formed as an elastic cantilever. Part of the moving part protrudes from one side of the base sheet inside the through-hole and the contact portion elastically extends from the other side of the base sheet. The total area of the through-hole and the fixed part of the contact is greater than a unit grid area formed by an arrangement of the terminals of an electronic device, and the length of the moving part, including the contact portion, substantially corresponds to the overall length of the through-hole.

Abstract: During the positioning of a control device for controlling an electromechanical drive, contact elements, which are connected to the control device in a fixed manner, are positioned in relation to one or more openings in a connector collar. To position the control device, the latter is displaced into a predetermined position. The predetermined position is defined, for example, by a guide or a stop. The contact elements are a component of an electric and/or optical junction which connects the drive device to other functional units, for example to a door control device or a motor vehicle battery. To position the contact elements in the connector collar of a connecting element which lies on the side of the drive device in the junction, the contact elements are positioned in relation to openings in the connector collar by being displaced together with the control device into the predetermined position.

Abstract: A plurality of electrical interconnections may be formed in an electrical device including a first component having a plurality of contact pads and a second component having a plurality of contact pads. The two components are placed in a confronting spaced relationship such that each contact pad of the first component locationally corresponds to one of the contact pads of the second component. The contact pads of the second component are further arranged such that at least two of the contact pads are laterally offset relative to their locationally corresponding contact pads on the first component with one of the at least two contact pads being offset in a first direction while the other is offset in another direction. A mass of conductive material is disposed between each contact pad of the first component and its corresponding contact pad of the second component.

Abstract: A method for fabricating an anisotropic conductive substrate is disclosed. A back holder has metal pins on a surface thereof. A liquid compound is formed on the surface of the back holder with metal pins. The liquid compound is pressed to deform the metal pins into electrodes in the liquid compound. The thickness between upper surface and lower surface of the liquid compound is between 25 ?m and 250 ?m. The electrodes have upper ends and lower ends exposed from upper surface and lower surface of the liquid compound to provide electrical contact of anisotropic conduction.

Abstract: A probe card assembly includes a probe card, a space transformer having resilient contact structures (probe elements) mounted directly to (i.e., without the need for additional connecting wires or the like) and extending from terminals on a surface thereof, and an interposer disposed between the space transformer and the probe card. The space transformer and interposer are “stacked up” so that the orientation of the space transformer, hence the orientation of the tips of the probe elements, can be adjusted without changing the orientation of the probe card. Suitable mechanisms for adjusting the orientation of the space transformer, and for determining what adjustments to make, are disclosed. The interposer has resilient contact structures extending from both the top and bottom surfaces thereof, and ensures that electrical connections are maintained between the space transformer and the probe card throughout the space transformer's range of adjustment, by virtue of the interposer's inherent compliance.

Abstract: A method of manufacturing a ribbon cable, comprising providing a set of insulated wires and aligning said insulated wires in a predetermined arrangement. The insulated wires are warmed sufficiently for said insulation to be become soft and adhesive, are pressed together so that they adhere to one another and allowed to cool, to form a ribbon cable.

Abstract: A method of fabricating a large area, multi-element contactor. A segmented contactor is provided for testing semiconductor devices on a wafer that comprises a plurality of contactor units mounted to a substrate. The contactor units are formed, tested, and assembled to a backing substrate. The contactor units may include leads extending laterally for connection to an external instrument such as a burn-in board. The contactor units include conductive areas such as pads that are placed into contact with conductive terminals on devices under test.

Abstract: Techniques for self assembly of macro-scale objects, optionally defining electrical circuitry, are described, as well as articles formed by self assembly. Components can be joined, during self-assembly by minimization of free energy, capillary attraction, or a combination.

Abstract: A copper welding rod is used in an arc-welding operation to form a bead that joins a copper starter sheet and a stainless steel hanger bar. The amperage level of the arc-welding equipment is set to generate heat at the weld site which is above the melting point of copper and below the melting point of stainless steel. This results in a welded joint between the copper bead and the hanger bar and a brazed joint between the copper bead and the starter sheet. Since brazing produces little or no fusion, the area of contact between the two dissimilar metals is limited to the interface between them, which significantly reduces the damaging effects of galvanic corrosion. Another improvement lies in the application of a corrosion-resistant metallic coating on the joint between the hanger bar and the starter sheet using a high velocity oxygen fuel flame spray technique.

Abstract: An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member having an intrinsic stress profile. The intrinsic stress profile biases a free portion away from the substrate forming a loop winding. An anchor portion remains fixed to the substrate. The free portion end becomes a second anchor portion which may be connected to the substrate via soldering or plating. A series of individual coil structures can be joined via their anchor portions to form inductors and transformers.

Abstract: Microelectronic contacts, such as flexible, tab-like, cantilever contacts, are provided with asperities disposed in a regular pattern. Each asperity has a sharp feature at its tip remote from the surface of the contact. As mating microelectronic elements are engaged with the contacts, a wiping action causes the sharp features of the asperities to scrape the mating element, so as to provide effective electrical interconnection and, optionally, effective metallurgical bonding between the contact and the mating element upon activation of a bonding material.

Abstract: A interconnect structure is inexpensively manufactured and easily insertable into a socket. The interconnect structure is manufactured by forming a sacrificial substrate with cavities that is covered by a masking material having openings corresponding to the cavities. A first plating process is performed by depositing conductive material, followed by coupling wires within the openings and performing another plating process by depositing more conductive material. The interconnect structure is completed by first removing the masking material and sacrificial substrate. Ends of the wires are coupled opposite now-formed contact structures to a board. To complete the socket, a support device is coupled to the board to hold a tested integrated circuit.

Abstract: A method for restricting travel of a moving contact in a lighting contactor is provided. The lighting contactor includes the moving contact and a contact carrier. The method includes the steps of providing a spacer, and a biasing member and positioning the biasing member though the spacer. The method also includes installing the biasing member and the spacer in the contact carrier.

Abstract: A connecting method for pins and tin balls of an electric connector. Pins of the electric connector elastically resist against tin balls so as to position the pins. The lower ends of the pins store elastic energy due to the elastically resisting contact. During welding by blowing heated air, the elastic energy is released to push the melting tin balls so that the lower ends of the pins of the electric connector is tightly combined with the PC board.

Abstract: An electronic component having connection terminals on one side thereof is bonded to a circuit board via an adhesive sheet having through-holes. The connection terminals on the electronic component are connected to electrode pads provided on the circuit board via a conductive adhesive in the through-holes. Thus, an electronic circuit device is formed. Using a polymeric resin film sheet for the circuit board and mounting an electronic component, e.g. an LSI, onto the circuit board can provide a small, light, thin, and inexpensive electronic circuit device.

Abstract: A method of making electrical connecting elements includes a metallic thin film 15 is formed on a mold 11 having protrusions 12 complementary in shape to a conductor pattern to be formed; a substrate 17 having a transfer layer 16 of adherent (or adhesive) material applied to one side surface thereof is provided; and the transfer layer 16 side of the substrate is brought into intimate contact with the metallic thin film 15 laid over the protrusions 12, followed by pulling the transfer layer apart from the mold so as to transfer the metallic thin film 15 covering the protrusions 12 onto the transfer layer 16 to thereby form the conductor pattern 18 on the transfer layer 16.

Abstract: A resist pattern in accordance with a predetermined pattern is formed on a substrate. Next, a bump resist mixed with a micro metallic powder is made thicker than the resist pattern and formed on the substrate formed with the resist pattern. Continuously, the bump resist on the resist pattern is removed in the bump resist. Next, the resist pattern is removed. As a result, a bump resist pattern corresponding to the predetermined pattern remains on the substrate. Furthermore, the resist component in this bump resist pattern is removed, thereby forming a micro bump (micro projecting electrode) 8 consisting of the micro metallic powder on the substrate.

Abstract: A preheat device is installed, thereby executing before forming bumps to electrode parts a pre formation temperature control for bonding promotion to promote bonding between the electrode parts and the bumps during a bump formation. Metal particles of the electrode parts can be changed to an appropriate state before the bump formation. Phenomenally, a bonding state between the electrode parts and the bumps can be improved as compared with the conventional art. In a further arrangement of the present invention, semiconductor components with bumps formed can be heated under a bonding strength improvement condition by a bonding stage through controlling the heating by a controller.

Abstract: A connecting pin (10) for an anode contact (11) (shown more completely in FIG. 2). The pin (10) has a body (12) with a longitudinal axis (14). A contact head (16) is formed at a proximal portion of the body (12) and a base (18) is formed at a distal portion of body (12). An intermediate shank (20) connects the head (16) and the base (18). The head (16), base (18) and intermediate shank (20) are all symmetrically arrayed about the longitudinal axis (14). The shank (20) has a first diameter (D,) and the contact head (16) has at least one lateral dimension (D2) that is greater than the shank diameter (D). The base (18) has a diameter (D3) that is greater than the shank diameter (D) and has a surface (22) that is planar and substantially orthogonal to the longitudinal axis (14).

Abstract: A printed circuit board (7) is electrically connected to an electroluminescent display by applying the circuit board (7) to the display so that metal tracks (8) on the underside of the circuit bard (7) make electrical contact with conductive tracks (6) on the display. While the tracks (6, 8) are in electrical contact and electrically insulating adhesive (10) is applied between the lower surface of the circuit board (7) and the upper surface of the display to bond the circuit board (7) to the display. The thickness of the tracks (6, 8) spaces the circuit board (7) from the display to define a void to receive the adhesive (10). The connection method has the advantage that the operation of the assembled circuit board (7) and display can be tested before the adhesive is applied.

Abstract: Methods are disclosed for fabricating spring structures in which a passive, conductive coating is deposited onto the spring structure before release. A release layer is deposited on a substrate and then a spring metal layer is formed thereon. A first mask is used to form a spring metal finger from these layers. A second mask defines a window exposing a tip of the finger. The release layer under the tip is etched through the window, and then a passive-conductive coating material (which may also have spring characteristics) is deposited on the tip. The second mask and residual coating material are then lifted off, and a third (release) mask is formed that is used to release a free end of the spring metal finger. The release mask is then stripped. When the passive-conductive coating includes spring characteristics, the stress variations of the coating help to lift the free end if the finger during release.

Abstract: An electronic device connecting method according to a first aspect of the present invention includes: mounting an electronic device having at least one electrode portion on a sheet-like porous member having a hole therein so that the electrode portion is close to the porous member; selectively irradiating a predetermined region of the porous member, on which the electronic device is mounted, with energy lines to form a latent image in an irradiated or non-irradiated portion of the porous member, the predetermined region including a portion close to the electrode portion; after irradiating with the energy lines, filling a conductive material in a hole of the latent image of the porous member to form a conductive portion; and bonding and integrating the porous member, in which the conductive portion is formed, to and with the electronic device.

Abstract: A process for producing a semiconductor wafer having an adhesive film, by adhering an adhesive film onto a bump-formed surface of a semiconductor wafer having formed thereon bumps with a predetermined arrangement, which comprises: determining a particular arrangement axis direction in which intervals between adjacent linear arrangement axes connecting the bumps becomes the shortest; and adhering the adhesive film in the direction substantially at a right angle with the determined arrangement axis direction, so as to markedly reduce voids included in the adhesion surface upon adhering an adhesive film such as underfill onto a semiconductor wafer.

Abstract: A method for efficiently producing low resistance electrical contacts between stainless steel and conductive layers in integrated lead suspensions and components. The method includes applying an amount of current for a period of time which is effective to reduce the resistance to a desired level. One embodiment of the invention includes applying a 100 mA current for 16 msec to a contact formed by thermosetting conductive epoxy. Resistance levels below 1 ohm can be achieved.

Abstract: A layered anisotropically conductive element, a resistant element, and a feed element constitute an electrode for discharge machining. The layered anisotropically conductive element includes high conductivity layers and low conductivity layers alternately laminated on each other, the high conductivity layers and the low conductivity layers being made of thin metallic plates coated with an insulating film. The layered anisotropically conductive element has an anisotropic conductivity, in which the conductivity in a direction parallel to the low conductivity layers is much higher than that in a direction perpendicular to the low conductivity layers. The resistant element is connected to one of end surfaces of the layered anisotropically conductive element perpendicular to the layers. The feed element is connected to the resistant element.

Abstract: A sensor utilizing a non-leachable or diffusible redox mediator is described. The sensor includes a sample chamber to hold a sample in electrolytic contact with a working electrode, and in at least some instances, the sensor also contains a non-leachable or a diffusible second electron transfer agent. The sensor and/or the methods used produce a sensor signal in response to the analyte that can be distinguished from a background signal caused by the mediator. The invention can be used to determine the concentration of a biomolecule, such as glucose or lactate, in a biological fluid, such as blood or serum, using techniques such as coulometry, amperometry, and potentiometry. An enzyme capable of catalyzing the electrooxidation or electroreduction of the biomolecule is typically provided as a second electron transfer agent.

Abstract: A method for manufacturing a contract arrangement for a vacuum switching tube having a contact carrier and a contact piece joined to the contact carrier in a vacuum using soldering material. The contact carrier is made of electrically highly conductive material, for example, copper, and the contact piece is made of a flame-resistant sintering material containing copper. The contact piece is pressed flat directly onto the contact carrier, generating a gap along the contact surface, and the soldering material is arranged on areas directly bordering the gap of the contact surface between the contact piece and the contact carrier. Subsequently, in a vacuum through the application of heat, the soldering material is brought to the melting point, and the molten soldering material penetrates into the gap of the contact surfaces between the contact carrier and the contact piece.

Abstract: A method of peeling off a coating of an elliptical cross sectional insulated conductive wire has a groove forming process of forming a groove nearly perpendicular to a longitudinal direction of the insulated conductive wire at given positions within a peeling region thereof, a first peeling process of peeling off the coating by moving a pair of first cutting edges in a longitudinal direction of the insulated conductive wire and perpendicularly to a longer diameter direction of the cross section thereof toward the groove from opposite ends of the peeling region, and a second peeling process of peeling off the coating at the peeling region by moving a pair of second cutting edges in a direction perpendicular to the longitudinal direction and in parallel with the longer diameter direction of the cross section thereof. As a result, the coating all around the outer circumference of the insulated conductive wire at the peeling region may be completely peeled off.

Abstract: A method for producing contact jacks for electric plug-in connectors.

Abstract: A method of forming an electrical connector including providing a metallic sheet having a multitude of connector blanks formed therein, each of the connector blanks having a base portion, a contact portion and a singulation arm; forming each of the connector blanks into a connector having a predetermined shape wherein each of the connectors remain connected to the metallic sheet by their respective singulation arms and wherein the singulation arms are nonplanar with respect to the metallic sheet; joining the base of each of the connectors to a first substrate; and severing the singulation arms to separate each of the connectors from the metallic sheet wherein the base of each of the connectors is joined to the first substrate. In a preferred embodiment, the contact portion contacts a second substrate.

Abstract: A sealant is applied to electric wires which comprise a wire harness at a location where a portion of this wire harness passes through a narrow diameter cylindrical member 6a of a grommet 6. An outer circumference of this portion to which the sealant has been applied is covered by a sheet 11. Both open ends along a length-wise direction of this sheet are bound by tape 13 and 14, the bound portions of this tape preventing the sealant from escaping to the exterior. In the portion between the tapes, the sealant is forced to permeate into the cross-sectionally central portion of the wire harness. The tapes 13, 14 also act as a positioning aid.

Abstract: Flexible leads for making electrical connection in microelectronic components includes two metallic layers. The structural or core layer of the lead is formed having a hardness greater than the hardness of the second layer. The relative hardness between the first and second layers is achieved by controlling the grain size during deposition of the respective layers from an electroless or electroplating bath.

Abstract: The present invention provides a carrier that provides improved retention to the individual contact elements resulting in LGA interposer connectors with improved manufacturability, reliability and more uniform mechanical and electrical performance. In one embodiment, the carrier, which includes upper and lower sections of dielectric material with an adhesive layer in between, includes a plurality of openings, each of which may contain an individual contact element. During assembly of the connector, once the contact elements are inserted, the adhesive layer is reflowed, thereby allowing the carrier to capture the location of the contact elements both with respect to each other as well as to the carrier. Alternately, the carrier may be implemented in a fashion that, while not including an adhesive layer to be reflowed, still provides improved retention of the individual contact elements. These embodiments may by easier to assemble, and less expensive to manufacture, especially in high volumes.

Abstract: A linkage terminal for a joint connector is provided by stacking two terminal elements, welding their carriers intermittently, and cutting the carriers corresponding to the number of unit accommodation grooves of a corresponding housing.

Abstract: A method is described having the steps of providing a surface having a plurality of wire bondable locations; wire bonding a wire to each of the wire bondable locations using a wire capillary tool; controlling the position of the capillary tool with respect to the substrate; after forming a wire bond of the wire to the wire bondable location moving the capillary tool relative to the surface as the capillary tool is moved away from the surface to form a wire having a predetermined shape.