Abstract: A method is described for producing electric modules, where a power module is attached to a fastening part with an adhesive, with the adhesive first being precured in an edge area, and in another step the power module is encased in a gel. In another step, the gel and the adhesive are fully cured together in one step. This method is cost- and time-optimized for producing a compact electric module with power modules that have a high power loss and are exposed to high mechanical stresses.

Abstract: In a flip chip bonding method, polymer bumps are formed, using a bonding tool, on an IC chip, held via suction to the bonding tool. An insulating adhesive film is pressed onto the upper surface of a circuit board held via suction with a suction stage. Heat is then applied to bring the film into close contact with bond pads of the circuit board. At this point, the bonding tool is moved downward, bonding the polymer bumps to the circuit board electrodes. During the time of this downward movement, bonding of the polymer bumps to the circuit board bond pads can be achieved by piercing the insulating adhesive film with the polymer bumps, and it is found that strong bonding can be achieved with adequate reliability. This method eliminates the need for a process in which through-holes must be pierced in the insulating adhesive film to accommodate the polymer bumps.

Abstract: A method of mounting bumped electronic components without using a flux during the solder joining process, which is low in cost and offers high reliability of the assembly. Resin adhesive 4 containing filler particles 4a is applied to a board 1 formed with electrodes 2, and a bumped electronic component 5 is mounted onto the board 1 to press the bumps 7 of the electronic component 5 against the electrodes 2 of the board 1. As a result, the oxide films 7a over the surfaces of the solder bumps 7 are broken by the filler particles 4a present in a gap between the lower ends of the solder bumps 7 and the surfaces of the electrodes 2, thus exposing the solder. This process eliminates the need for using the flux when the solder bumps 7 are melted and soldered to the electrodes 2, and therefore the cleaning process after soldering is not required, assuring high reliability of the assembly.

Abstract: A simplified modular microelectronic connector having an internal component cavity and integral crimped leads, and a method of manufacturing same. One or more electrical components are located within the cavity, with their conductors being routed to the crimp leads integral to the connector body. The conductor terminations are completed via crimping or other bonding techniques. The crimped leads are deformed into the desired position to minimize connector size, and the component is sealed within the cavity using an epoxy or other electrically non-conductive material. The connector body may be further mounted to a multi-connector carrier assembly, which utilizes one or more pins to secure the individual connectors to the carrier so that they may be arranged in both vertically-stacked and horizontal (“side-by-side”) configurations, and each connector may be removed separately and replaced in the event of component failure.

Abstract: A device and process for electrically connecting two electrical components or devices to each other by means of electrical, flexible conductors, in which the electrical conductors are prefabricated and then connected by means of a welding or soldering process to corresponding electrical connections of the component. In particular, a process and a device are for fixing the conductor ends and achieving an easy-to-handle embodiment of the conductor ends for producing the connection.

Abstract: An electronic component has a substantially reduced size and is adapted to be produced at low costs without variation in superior quality of the component because of the ease of achieving electrical connection between a piezoelectric element and a electrode pattern on a substrate supporting the piezoelectric element. The piezoelectric element has a lower electrode formed on the lower surface thereof and an upper electrode formed on the upper surface thereof. The piezoelectric element is fixed to the substrate such that the lower electrode is bonded to an electrode provided on the substrate by a conductive adhesive. A conductive wire is fixed to the upper electrode of the piezoelectric element. A metallic cap is bonded to the substrate so as to cover and seal the piezoelectric element on the substrate. The cap is contacted at its inner surface by the wire, whereby an electrical connection is achieved between the cap and the upper electrode of the piezoelectric element.

Abstract: In an automatic transmission connector for interconnecting circuits provided inside and outside an automatic transmission, there are provided a plurality of terminals, a housing for receiving the terminals, and a rear holder engageable with the housing. The housing has a plurality of cavities for receiving the terminals, respectively, and the cavities are separated from one another in such a manner that the cavities communicate with one another through partially-notched wall portions. The housing has terminal passage holes into which the terminals are press-fitted, respectively. The rear holder has wall piece portions, and when the rear holder is engaged with the housing, the wall piece portions cooperate with notches, formed in the wall portions of the cavities, to separate the cavities from one another, and also retain the terminals within the respective cavities.

Abstract: An electrically/battery powered transdermal drug applicator comprising a flexible non-conductive substrate with a plurality of conductive coated areas, the conductive coated areas forming drug reservoir electrodes, and a plurality of drug reservoirs separated by occlusive adhesive dams and in electrical contact with said drug reservoir electrodes. The battery is connected to the electrodes of the drug reservoirs and said applicator including electrical current conditioning means, with a conformal cover adhesively secured to said transdermal drug applicator and with a release liner covering and protecting said plurality of drug reservoirs until use.

Abstract: A method for forming micron-sized or smaller drops of liquid, and the use of the method in fabricating micro electro mechanical and micro mechanical devices is disclosed. A micropipette is formed having an inside diameter no larger than the size of the drops to be formed. The micropipette is connected to a system capable of developing a positive and optionally negative pressure within the micropipette. The tip of the micropipette is placed in liquid. The liquid is drawn into the micropipette via capillary action or from the negative pressure developed by the system. The micropipette is then positioned to deliver liquid to an intended location on a surface. To deliver the liquid, a positive pressure is developed within the micropipette. The positive pressure forces a micron-sized or smaller drop of liquid out of the micropipette. The method can be used to form micron-sized or smaller drops of adhesive for fixing in place various structural members that form microdevices.

Abstract: Electrical devices comprising a PTC element comprised of a polymer having conductive particles dispersed therein. The PTC element is coated with a conductive layer and has electrodes with a plurality of voids affixed to opposing surfaces. The devices are made by dispersing conductive particles into a polymer to form a polymer PTC composition. The polymer PTC composition is melt-shaped to form a laminar shaped PTC element. First and second opposing surfaces of the PTC element are coated with a conductive layer. The electrodes, characterized by a plurality of voids, are brought into contact with the coated surfaces of the PTC element, and heated while applying pressure to form a laminate. The laminate is then further shaped into a plurality of PTC electrical circuit protection devices.

Abstract: A method of detachably mounting a heat sink to a lead frame and then an IC die to the heat sink including the steps of first providing a lead frame that has lead fingers and a multiplicity of tie bars extending inwardly from the lead frame, each tie bar has a fixed end integral with the lead frame and a free end equipped with an attachment means, and then providing a heat sink that has a multiplicity of receptacle means adapted to receive the attachment means on the tie bars as well as at least one opening through the thickness of the heat sink, and detachably engaging the attachment means on the tie bars to the receptacle means on the heat sink. The invention is also directed to a lead frame/heat sink assembly that may have a single IC die or a multiple of IC dies mounted on top of the heat sink. A single IC die or a multiple of IC dies that are mounted to the heat sink can be tested in a KGD or KGS test before being assembled to a lead frame.

Abstract: A method for producing an electrical circuit member includes the steps of positioning and arranging first and second electrical circuit parts having plural electrical connecting portions to be spaced and oppose each other, preparing an electrical connecting member having a plurality of electrical conductive members, each of which extends from one side of a holding member of an electrical insulating material therethrough to an opposite side of the holding member and is held in the holding member so that opposing ends of the electrical conductive member protrude from opposite sides of the holding member, and applying an adhesive to at least one side of the electrical connecting member including the electrical conductive members. The electrical connecting member with the adhesive is inserted between the first and second electrical circuit parts, and a pressing force is applied so that the first and second electrical parts contact the ends of the electrical conductive members.

Abstract: A terminal connection method of a coil comprises the steps of arranging coil terminals of a coil on lead terminals; removing insulating coats of the coil terminals to expose core wires; and applying an electric conductivity adhesive to connected portions of the coil terminals and the lead terminals. A terminal connection structure of a coil comprises coil terminals arranged on lead terminals, with insulating coats removed from the coil terminals; and an electric conductivity adhesive applied to connected portions of the coil terminals and the lead terminals.

Abstract: Electrodes in plate form can be electrocatalytically coated and secured to a current distributor, such as by welding to a base plate, and may be serviceable, e.g., as anodes, in cells electrolyzing brine. Recoating of plate electrodes can require removal from the cell, removal of old coating, application of fresh coating, then returning and securing the freshly coated electrodes to the cell. There are now provided envelopes for covering the original electrode plates. The original plates thus do not need to be separated from a base member of the cell. The envelopes can have an electrocatalytic coating on their outer surfaces. The resulting electrodes are thus a combination of an old inner plate and a new outer envelope, with an outer surface coating on the envelope. The envelopes can be secured to the inner plate and/or to a current distributor such as a base plate.

Abstract: A method for, and product of manufacturing vessel lid covers including electrically conductive pin assemblies for vessel container housings including pre-plating both the lid covers and pins in a first area and forming the pre-plated lid covers with their pin assemblies in a second area with selected portions of the lid covers being freed of plating during the process to enhance pin assembly fusing and the product formed.

Abstract: A cable connector kit is provided which may be assembled to electrically and mechanically connect a central conductor of a coaxial cable to a male or female contact. An upper and a lower insulator are provided in the kit, such insulators being attachable to each other to form an insulator body having a cavity therein. The lower insulator includes an anvil which extends into such cavity and the upper insulator includes a compressing member which extends into such cavity and mates with the anvil. When assembled, a cable connector assembly is provided wherein the central conductor overlaps a portion of the contact, the central conductor and contact portion being sandwiched between the anvil and compressing member.

Abstract: A fuse holder (2) for use in electrical apparatus includes a tubular body (6) having outer and inner ends (10, 16). A first electrical contact element (22) and a mounting flange (8) are secured to the inner and outer ends, preferably using resilient retaining rings (53, 68) engaging circular grooves (52, 20; 62, 20) formed in the opposed surfaces. A tubular second electrical contact element (32) is secured within the tubular body and preferably has a flexible electrical terminal strap (24) which extends out through an opening (23) formed in the tubular body. Fluid-tight seals are provided between the inner surface (14) of the tubular body and the outer surfaces (46, 58, 30) of the first and second electrical contact elements and the mounting flange assembly by using pairs of O-rings (38, 50 and 70); an adhesive (39) is also used to secure these elements to the body.

Abstract: Electrodes in plate form can be electrocatalytically coated and secured to a current distributor, such as by welding to a base plate, and may be serviceable, e.g., as anodes, in cells electrolyzing brine. Recoating of plate electrodes can require removal from the cell, removal of old coating, application of fresh coating, then returning and securing the freshly coated electrodes to the cell. There is now provided a covering innovation for the original electrode plates. In the covering innovation, the original plates do not need to be separated from a base member of the cell. In the method of covering, there is utilized an outer envelope member, tightly engaging the original plate electrode. The envelopes can have an electrocatalytic coating on their outer surfaces. The resulting electrodes are thus a combination of an old inner plate and a new outer envelope, with an outer surface coating on the envelope. The envelopes can be secured to the inner plate and/or to a current distributor such as a base plate.

Abstract: The invention provides a method for making an electrical circuit device as well as a resulting device itself. The method includes the steps of forming a base or substrate of conductive metal and then securing an electrically conductive masking element to the substrate. The resulting product is coated with a layer of fusible particles of a dielectric or resistive material that is repelled by the surface of the masking element. The coated product is then heated to fuse the particles and provide a hard dielectric or resistive layer over surface portions of the base. The masking element provides an exposed conductive path to the base metal or substrate. A section of conductive metal foil may be bonded to the masking element to provide a continuous conductive bus on the substrate.

Abstract: An electrical connector having a metallic housing about an insulative insert is hermetically sealed. Both the seal area of the housing and the seal surface of the insulative insert are roughened and cleaned. The seal area of the housing is primed with a primer which is dried prior to assembly of the insert and the electrically conductive contacts within the housing. The assembled connector is pre-heated, and a sealant is applied to the seal area of the housing and the seal surface of the insulative insert around the electrically conductive pins. The preferred sealant is an alumina-filled or aluminum nitride-filled epoxy based resin, mixed with a catalyst and a reactive diluent and degassed in a vacuum. The sealant is applied to the connector and allowed to set-up prior to curing at an elevated temperature.

Abstract: A process of preparing clad contact material comprises forming a contact belt-like member by bonding an Au or Au alloy tape to the surface of an Ag or Ag alloy tape, thermally treating that contact member for forming an Au diffusion layer, and cladding that contact member having the Au diffusion layer to a base belt-like member made of Cu or a Cu alloy. Since, according to the process, the thermal diffusion treatment is carried out before the contact belt-like member is set in the base belt-like member, the thermal diffusion treatment of the contact belt-like member can be performed in the most suitable conditions for obtaining an Au diffusion layer with excellent characteristics, and no dissolution may occur at the interface between the two belt-like members.

Abstract: Electrical connector components, for example, a pin terminal constructed from a solid wire pin and a formed metal body, are attached to a web carrier and fed through an inductive heating station, thereby bonding the components together. The components are pre-treated with a conductive bonding material which can be cured, flowed, or set by applying heat. The web carrier may be wound on a first spool, fed through the inductive heating station, and wound onto a second spool, for ready feed to and from successive production steps. The temperature of the heating operation may be controlled by varying the speed of the web feed and the strength of the inductive field, so as to ensure repeatable, uniform heating, at a high economical speed. In addition, the tip of the pin can be cooled during the heating operation, to prevent heat damage or contamination of the pin.

Abstract: The useful life of electrical contacts is extended by a cryogenic treatment. An electrical contact is exposed to a low temperature, such as below 172 K for a selected period of time. The low temperature may be obtained via a controlled rate of cooling. After the contact has been exposed to the low temperature, the contact may be returned to ambient temperature at a controlled rate. The cryogenic treatment results in extended useful life of contacts made of materials such as copper and of composite contacts incorporating silver, refractory metals, and metal oxides such as cadmium oxide and tin oxide.

Abstract: An electronic component carrier for mounting an electronic component such as a semiconductor element, IC chip or the like comprises a printed wiring substrate having conductor pattern and thorugh-hole, an adhesive layer formed on the substrate, a lead frame joined to the substrate through the adhesive layer and comprised of plural leads for external connection, and a solder layer formed in the through-hole for electrical connection to the conductor pattern of the substrate.

Abstract: An electrical circuit (101) that is disposed on a substrate (103) employs a method and apparatus for providing electromagnetic shielding of the electrical circuit (101). One or more compressible, electrically conductive contacts (107), each of which includes a substantially planar portion (201), are coupled at their respective planar portions (201) to a receptacle area (105) on the substrate (103) that substantially encircles the electrical circuit (101). A shielding enclosure (109) having a top portion (110) and a plurality of side portions (111) is positioned upon the compressible, electrically conductive contacts (107) such that the side portions (111) compress at least some of the compressible, electrically conductive contacts (107) to substantially enclose the electrical circuit (101).

Abstract: The specification discloses a medical electrode particularly well suited for use as a diagnostic or monitoring electrode wherein conductive elements comprising a gel layer and a conductive bridge are intimately mounted on the adhesive top surface of a carrier layer, which includes an opening of dimensions similar to but smaller than the gel layer. A top layer, of at least equal surface area, is also affixed to the adhesive top surface of the carrier layer, sandwiching the indicated conductive elements between the top layer and the carrier layer such that the gel layer is exposed to a patient's skin but cannot be removed from the electrode. An electrically conductive contact means is provided to connect the conductive bridge to the desired monitoring/diagnostic apparatus. The carrier layer also includes an adhesively coated undersurface, which attaches to a patient's skin.

Abstract: The micropin array is comprised of a plurality of micropins having a given diameter and being aligned in parallel to one another at a given pitch, insulating tubular coatings disposed to cover individual micropins, and an adhesive provided to fill spacings among the insulating tubular coatings. This micropin array is produced by the steps of preparing a plurality of coated wire materials composed of a metal core having a given diameter and an insulating tubular coating of a given thickness formed around the metal core, aligning closely and successively the coated wire materials to form a bundle thereof, fixing the bundle of the coated wire materials by means of an adhesive, and cutting the fixed bundle of the coated wire materials by a given length to form a micropin array.

Abstract: An electric contact is provided on at least one of a pair of conductors and includes a surface which is coated with a ceramic layer comprising at least one material selected from the group consisting of nitrides, carbides and borides of high melting point metals, this electric contact having a low contact resistance and good reliability.

Abstract: A device for producing a micro connection element 24, 30, the device comprising a cylindrical outer sleeve 1, a cylindrical central element 2 arranged coaxially in the outer sleeve 1, a plurality of cylindrical spacers 3 arranged between the outer sleeve 1 and the central element 2; the spacers 3 respectively arranged between two neighboring assembly elements 4 which are in contact with the neighboring spacers 3, the central element 2 and the outer sleeve 1; the assembly elements 4 can be microplug pins having a length such that they extend out of the arrangement comprising outer sleeve 1, central element 2 and spacers 3 so that the pins can support sleeves for making a microcoupling or female connection element, or the assembly elements 4 can be bushes into which microplug pins can be inserted, with a sleeve being joined to the outer end of each pin for receiving an electric wire, to thereby make a microplug or male connector; the microcoupling and microplug can be used on the ends of an electric supply lead

Abstract: A charging member for charging a body to be charged includes a blade member, a supporting member which supports the blade member, and an electrode layer which is provided on the blade member and is connected to the supporting member. The electrode layer is formed after connecting the blade member to the supporting member. A charging device uses the charging member. A process unit including the charging device is detachable relative to an image forming apparatus.

Abstract: An apparatus for producing a living body leading electrode includes a first substrate 10 to which first boards 1 are fixed in a plurality of rows. A plurality of skin adhering members 101 with openings 102 are bonded to the first boards. A second substrate 20 is provided to which second boards 2 are fixed in a plurality of rows corresponding to the first boards 1. A plurality of electrode elements 103 are placed on the second boards 2. A pouring means 30 is provided for pouring a solution of electrolyte 100 into the upper portions of the openings 102 formed on the skin adhering members 101. A hardening device 40 for hardening the poured solution of electrolyte 100, thereby fixing the side faces 100A of the electrolyte 100 to the side walls 102A of the openings 102, which first substrate 10 and second substrate 20 may be superposed on each other.

Abstract: A method and apparatus for interconnecting cables to improve electrical characteristics of the connected cables. The apparatus comprises a terminal having clamping pieces integrally formed respectively on opposite sides of a base portion of the terminal. The conductor wires of the cables are arranged in layers on the base portion, and the clamping pieces are press-clamped in the direction in which the conductor wires are layered. The method comprises the steps of placing conductor wires of one cable on a base portion of a terminal having clamping pieces integrally formed respectively on opposite sides of said base portion; compressing the conductor wires so as to form a surface of the conductor wires into a flattened configuration; placing conductor wires of another cable on the surface in a layered manner; and press-clamping the clamping pieces in the direction in which the conductor wires of the two cables as layered one upon the other.

Abstract: Conductive copper areas of printed circuits, such as through-holes, pads and lands, to which electronic components can thereafter be electrically connected by, e.g., wave soldering, are provided with a coating of nickel or cobalt, such as by electroless deposition from nickel-or cobalt-boron and nickel-or cobalt-phosphorous plating baths, or entirely or partly electrolytically, followed by a coating of a protective material which protects the nickel or cobalt coating from oxidation prior to the subsequent solder connection operation, is wettable by solder in the subsequent solder connection operation, and substantially dissolves in the solder in the subsequent solder connection operation without adverse effect on the solder joint between the electronic component and the through-hole, pad or land. A particular preferred protective material is gold, such as applied by deposition from immersion or electroless gold plating baths.

Abstract: A method and apparatus for interconnecting electronic circuit boards through the use of twisted wire jumpers which are formed from multifilament wire and which have enlarged bird cages formed along the pins. The pins are drawn through a stack of circuit boards to position the cages in contact with interconnection apertures located in the printed circuit boards. The frictional engagement of the cages in the apertures provides both electrical inter connection of, and mechanical coupling between the printed circuit boards.

Abstract: The present invention improves the quality and productivity in a coating peeling-off process in which the coating at an intermediate portion along the length of a wire is peeled off in order to expose a conductor inside the coated wire, while enabling coatings at intermediate portions along the length of multicore wires or small-diameter wires to be peeled off.In a primary process, a heating jig 16 is brought into press contact with the upper half portion of the coating of the peeling-off designated portion at an intermediate portion along the length of coated wires 1 so as to press down the coating downwardly relative to the transverse direction of the wires, whereby a coating peeled-off portion 20 in which a part of conductors 2 is exposed is formed.

Abstract: Connectors for optical cables in ribbon form and a process for making such connectors in which metal plates for the enclosing the cable ends are made by cold, plastic flow forming of grooves in the plates with a punch having ridges produced by a process which produces grooves which hold the positions of the optical fibers between the plates within narrow tolerances. In the process, a punch body with partially formed ridges is mounted on a head rotatable about the axis of the body and movable toward a grinding wheel which is movable in a path perpendicular to the direction of movement of the head toward the grinding wheel. After two opposite passes of the grinding wheel along the side of a ridge, the punch body is rotated 180 degrees, and the side of a corresponding ridge on the opposite side of the punch body axis is ground. The process is repeated with movement of the head toward the grinding wheel, which is measured, until the sides of all ridges are ground.

Abstract: A method of forming bump electrodes, which is characterized in that conductive pastes are applied to a surface on which bump electrodes are to be formed, metal balls are made to adhere to the applied conductive pastes utilizing the viscosity of the conductive pastes before the conductive pastes are dried, and the conductive pastes and the metal balls are cofired.

Abstract: An interconnect or circuit device having coplanar contact bumps, and the method of manufacture thereof are presented. The coplanar contact bumps are formed against a flat reference surface whereby the resulting bumps have coplanar means.

Abstract: A method of forming a conductive lamina for use with and to form a bio-medical electrode device comprising the steps of providing a non-conductive base structure, providing a mixture of an electrically conductive substance and a media component, depositing the mixture onto the base structure, and curing the mixture. The method further comprises the step of mixing the electrical conductant and the media component in a closed cell, positive pressure kinetic mixer. The method further comprises the steps of combining a urethane base and a polyhydric alcohol to form the media component and delaying the mixing of the media component and the electrical conductant for a predetermined time period. In another embodiment, the method comprises the steps of combining a photo-initiator, a cross-linking agent, and low pH acrylic monomers to form a precomponent, and mixing the precomponent with the glycol to form the media component.

Abstract: A method of fabricating an electrical contact formed at least in part of a precious metal which defines a contact surface on the electrical contact. In this method, an initial discrete deformation of the precious metal extends a projection of the precious metal to a first preselected height beyond the contact surface. Thereafter a further discrete deformation of at least the precious metal projection forms it into a preselected configuration and also alters the extension of the precious metal projection to another preselected height beyond the contact surface different than the first preselected height.

Abstract: An electrical connector utilizing a crimpable ferrule with an electrical insulation sleeve thereover, and a transparent outer sleeve surrounding the ferrule and insulation sleeve, with the transparent outer sleeve formed of coextruded, multi-layer material with at least one layer being oriented and heat-shrinkable, and with the inner layer being a heat-activable adhesive. A portion of the outer sleeve is preshrunk to aid in the use thereof. The electrical connector in accordance with this invention is produced by placing a crimpable ferrule having an insulation sleeve thereon upon a first support, with the outer sleeve upon a second support, with both vertically oriented and coaxially arranged, and with the support for the outer sleeve at a lower elevation than the other support. The arrangement is passed through a heating zone to partially shrink a portion of the outer sleeve about the insulating sleeve, and to activate an inner adhesive layer on said outer sleeve into adhesion with the insulating sleeve.

Abstract: The invention is a fine line electrical cable with two ends having a plurality of first conductor lines in a plane. The lines of the cable are embedded in an insulating laminate material, are closely spaced at one end to be compatible with the closely spaced contacts from IC chips and are fanned out along the length of the cable to the other end where the lines are spaced somewhat apart and compatible with conventional electrical connectors. Contact posts extent from each line end so that external connections may be made with the IC chips and the conventional connectors. At least one second conductor line may be embedded within the other side of the laminate material and appropriate contact posts extend from the line ends so that external connections may also be made at these locations. A method for fabricating the fine line elecrical cable is also disclosed.

Abstract: A crimp contact for providing a secure mechanical and electrical contact between wire conductors and a contact portion, includes a moisture-impermeable cross-linking adhesive filling the gaps between the crimp portion of the crimp contact and the wire conductors, and between adjacent wire conductors. The adhesive is cross-linked subsequent to filling the gaps, thereby hardening the adhesive.

Abstract: This invention pertains to a lamp socket assembly for use in automotive applications and the like. The assembly includes a housing, a contact insert, and a body. The contact insert is captured in the cavity of the housing by the body. The body is welded to the housing. Lugs on the body secure the assembly to a panel. A seal is placed between a flange on the housing and the panel to seal the assembly to the panel. Contacts are retained in the contact insert by engagement of U-shaped portions in slots of the contact inserts. Blade terminals are inserted through windows in the housing, contact insert, and contacts to interlock the terminals with the contacts and to keep the contacts secured in their positions. A socket connector is sealingly secured to the housing and prevents moisture from entering the housing. In an alternative embodiment, no socket connector is provided but the blade terminals are crimped to wires for connecting the socket assembly to a source of electric power.

Abstract: The invention is a method of forming a solder bump on an under bump metallurgy in which a contact pad on a substrate material is partially covered by a passivation layer upon the substrate material which is non-wettable by solder and in which the under bump metallurgy covers the portions of the contact pad which are not covered by the passivation layer and in which the under bump metallurgy overlaps from the contact pad to cover portions of the passivation layer.

Abstract: Provided herein are novel layered elastomeric connectors, housings therefor and methods of manufacture for the connectors which includes alternating fused layers of a dielectric elastomer and electrically conductive fibrous mats coextensive with a cross section of the conductor to provide a multiplicity of conductive pathways between two electrically conductive surfaces. In order to promote a more mechanically stable connector, the fibrous mats can be exposed to a coupling agent for enhanced bonding. To enhance the electrical characteristics, the fibrous mats can be electroplated with an electrically conductive metal.

Abstract: Applicators for the electrophoretic and/or electroosmotic deposition of a medicament across the skin and into the blood stream. The applicator includes a plurality of drug reservoir electrodes, a battery, a plurality of folded members each having an electrically conductive coating on a flexible, non-conductive substrate in electrical contact with the battery and the drug reservoir electrodes, electrical current conditioning means, and a cover adhesively secured to the applicator.

Abstract: An improved electrical connector which has improved durability and stability when exposed to low temperature the connector comprises alternating layers of electrically conductive and non-conductive material. The electrically conductive and non-conductive layers each include a silicone-containing material of the formula: ##STR1## wherein R.sub.1 is methyl, vinyl, or phenyl, R.sub.2 is methyl or vinyl, and X+Y+Z equals 0 to about 2 million.

Abstract: This invention employs a carrier upon which a thin conductive film has been applied. The conductive film is of a metallic material which exhibits a surface energy such that it is not readily wetted by solder. A patterned mask is disposed on the conductive film, with the mask having openings which expose selected areas of the conductive film. Solder is deposited in the mask openings and is weakly adherent to the exposed areas of the conductive film. The carrier is then disposed over and in registration with conductive land areas of a circuit carrier, such that the solder in the mask openings is aligned with the land areas of the circuit carrier. Subsequently, the carrier and circuit land areas are brought into contact, heated, the solder bonded to the lands, and the carrier is lifted away for subsequent reuse.In another species of the invention, a thin film layer of solder is directly deposited on and weakly adherent to a flexible base layer.

Abstract: An electrical connector utilizing a crimpable ferrule with an electrical insulation sleeve thereover, and a transparent outer sleeve surrounding the ferrule and insulation sleeve, with the transparent outer sleeve formed of coextruded, multi-layer material with at least one layer being oriented and heat-shrinkable, and with the inner layer being a heat-activatable adhesive. A portion of the outer sleeve is preshrunk to aid in the use thereof. The electrical connector in accordance with this invention is produced by placing a crimpable ferrule having an insulation sleeve thereon upon a first support, with the outer sleeve upon a second support, with both vertically oriented and coaxially arranged, and with the support for the outer sleeve at a lower elevation than the outer support. The arrangement is passed through a heating zone to partially shrink a portion of the outer sleeve about the insulating sleeve, and to activate an inner adhesive layer on said outer sleeve into adhesion with the insulating sleeve.