With Coating Patents (Class 29/885)
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Publication number: 20110131808Abstract: An electrode, in particular a deep brain stimulating (DBS) electrode or a deep brain lesioning electrode, a method for manufacturing an electrode and use of the electrode, and a directional electrode.Type: ApplicationFiled: February 2, 2011Publication date: June 9, 2011Applicant: MEDTRONIC, INC.Inventor: Steven Streatfield Gill
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Publication number: 20110126410Abstract: A method for manufacturing an electrode assembly. The method comprises: forming a comb having a plurality of electrode contacts, wherein the surface of at least one of the electrode contacts comprises a plurality of indentations such that the effective surface area per area unit of a center region of the at least one electrode contact is larger than the effective surface area per area unit of the of the region of the surface outside the center region; assembling an array of electrode contacts from the comb; molding a carrier member about the assembled array of electrode contacts, wherein a surface of the at least one electrode contact is covered by a layer of the carrier member material; and removing the layer of carrier member material on the surface of the at least one electrode contact.Type: ApplicationFiled: December 1, 2009Publication date: June 2, 2011Applicant: COCHLEAR LIMITEDInventors: Edmond Capcelea, Peter Gibson, Fysh Dadd
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Publication number: 20110111647Abstract: A structure and method for manufacturing the same for manufacturing a contact structure for microelectronics manufacturing including the steps of forming first and second metal sheets to form a plurality of outwardly extending bump each defining a cavity. Symmetrically mating the first and second metal sheets in opposing relation to each other to form upper and lower bumps each defining an enclosure therebetween wherein the mated first and second sheets form a contact structure. Coating the contact structure with an insulating material, and fabricating helix shaped contacts from upper and lower bumps. The helix shaped contacts having first and second portions being in mirror image relationship to each other.Type: ApplicationFiled: November 6, 2009Publication date: May 12, 2011Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Gareth Hougham, Gerard McVicker, Xiaoxiong Gu
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Publication number: 20110072659Abstract: In one embodiment, a method of fabrication of a stimulation lead comprising a plurality of segmented electrodes for stimulation of tissue of a patient, the method comprises: providing an elongated, substantially cylindrical substrate, the substrate comprising a plurality of recesses defined in an outer surface of the substrate; coating the substrate with conductive material; patterning conductive material on the substrate to form a plurality of electrode surfaces for at least the plurality of segmented electrodes and a plurality of traces connected to the plurality of electrode surfaces, wherein each electrode surface and its corresponding trace are defined in the recesses on the outer surface of the substrate and are electrically isolated from other electrode surfaces and traces; providing insulative material over at least the plurality of traces; and electrically coupling the plurality of traces to conductive wires of a lead body.Type: ApplicationFiled: September 30, 2010Publication date: March 31, 2011Inventors: John Swanson, Kevin Turner, Jerome Boogaard
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Publication number: 20110077699Abstract: In one embodiment, a method of fabrication of a stimulation lead comprising a plurality of segmented electrodes for stimulation of tissue of a patient, the method comprises: providing a substrate comprising (i) a substantially cylindrical body and (ii) a plurality of projections extending radially from the cylindrical body; coating the substrate with first conductive material; patterning the first conductive material on the cylindrical body into a plurality of traces, the plurality of traces extending along the cylindrical body and electrically contacting conductive material about the plurality of projections; providing an insulative layer over the traces; coating the insulative layer over the traces with second conductive material; patterning the second conductive material to form at least a plurality of electrode surfaces including a plurality of segmented electrodes, the segmented electrodes being in electrical contact with conductive material on projections of the plurality of projections; and electricallType: ApplicationFiled: September 30, 2010Publication date: March 31, 2011Inventors: John Swanson, Kevin Turner, Jerome Boogaard
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Publication number: 20110071596Abstract: A electrode array for a medical and in particular cochlear implant and a method of manufacturing such an array is described in which carbon nanotubes are deposited onto electrode contacts at temperatures below the service temperature of a carrier material supporting the electrode contacts. This allows the carrier material, which may be a polymer like silicone, to be molded about the electrode contacts before they are coated with carbon nanotubes to allow for the provision of smaller and more highly concentrated electrodes.Type: ApplicationFiled: July 22, 2010Publication date: March 24, 2011Inventors: Sule Kara, Martin Svehla, James G.E. Smith, Edmond D. Capcelea
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Publication number: 20110067238Abstract: A method of forming a seal about an electrically conductive core of a cable having an insulative outer cover and a terminal includes the steps of providing a lead of the core extending beyond an axial edge of the insulative outer cover; spraying a conformal coating onto the lead; crimping the terminal onto the cable while the conformal coating is still wet to displace the conformal coating from between the lead and the abutting contact surfaces of the terminal and to cover and seal remaining portions of the lead not in direct contact with the terminal with the conformal coating and curing the conformal coating over the remaining portions of the lead.Type: ApplicationFiled: October 8, 2009Publication date: March 24, 2011Applicant: DELPHI TECHNOLOGIES, INC.Inventor: FRANCIS D. MARTAUZ
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Publication number: 20110067239Abstract: A method of forming a seal about an electrically conductive core of a cable having an insulative outer cover and a terminal includes the steps of providing a lead of the core extending beyond an axial edge of the insulative outer cover; applying a conformal coating onto the lead; crimping the terminal onto the cable while the conformal coating is still wet to displace the conformal coating from between the lead and the abutting contact surfaces of the terminal and to cover and seal remaining portions of the lead not in direct contact with the terminal with the conformal coating and curing the conformal coating over the remaining portions of the lead.Type: ApplicationFiled: October 20, 2009Publication date: March 24, 2011Applicant: DELPHI TECHNOLOGIES, INC.Inventors: FRANCIS D. MARTAUZ, MARK A. SCHEEL
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Publication number: 20110045713Abstract: Provided is a crimp terminal designed to be crimped onto an end portion of an electric wire to form a terminal-equipped electric wire, achieving both of ensuring mechanical strength of the terminal-equipped electric wire and reducing a contact resistance between the electric wire and the crimp terminal. The crimp terminal comprises an electric contact section and an electric-wire crimp section to be crimped onto a conductor in the end portion of the electric wire, the crimp terminal being formed of a metal plate which has a copper-containing plate body and a tin-plating layer covering a surface of the plate body. In the crimp terminal, the tin-plating layer has a smaller thickness in a crimp surface region where the electric-wire crimp section is to make contact with the end portion of the electric wire is less than that in an electrical contact surface region where the electric contact section is to make contact with a counterpart terminal.Type: ApplicationFiled: June 29, 2009Publication date: February 24, 2011Applicants: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Junichi Ono, Hiroki Hirai, Tetsuji Tanaka, Hiroki Shimoda, Takuji Otsuka
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Patent number: 7887380Abstract: A cable or a cable receptacle and a method of forming same are disclosed. The cable lug or cable receptacle has a flat part and a tube portion integrally formed together as one piece. The flat part has opposing surfaces which abut against each other. The flat part and the tube portion are plated with tin such that an integral bond is established between the abutting surfaces of the flat part.Type: GrantFiled: January 14, 2008Date of Patent: February 15, 2011Assignee: Gustav Klauke GmbHInventor: Harald Ross
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Patent number: 7884006Abstract: Resilient spring contacts for use in wafer test probing are provided that can be manufactured with a very fine pitch spacing and precisely located on a support substrate. The resilient contact structures are adapted for wire bonding to an electrical circuit on a space transformer substrate. The support substrates with attached spring contacts can be manufactured together in large numbers and diced up and tested before attachment to a space transformer substrate to improve yield. The resilient spring contacts are manufactured using photolithographic techniques to form the contacts on a release layer, before the spring contacts are epoxied to the support substrate and the release layer removed. The support substrate can be transparent to allow alignment of the contacts and testing of optical components beneath. The support substrate can include a ground plane provided beneath the spring contacts for improved impedance matching.Type: GrantFiled: December 2, 2008Date of Patent: February 8, 2011Assignee: FormFactor, Inc.Inventors: Benjamin N. Eldridge, Bruce Jeffrey Barbara
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Publication number: 20110024103Abstract: Embodiments of the present invention generally relate to a method and apparatus for providing a conductor in a tubular. In one embodiment, a coiled tubing string for use in a wellbore includes: a tubular; a conductor extending at least essentially a length of the tubular; and a tubular coating extending at least essentially the length of the tubular and bonding the conductor to an inner surface of the tubular.Type: ApplicationFiled: August 21, 2009Publication date: February 3, 2011Inventors: Bruce H. Storm, JR., Eugene Andrew Murphy, Haoshi Song
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Patent number: 7856712Abstract: A method for manufacturing a female electrical terminal includes, according to one embodiment, blanking of strip of conductive material and forming a wire connecting portion to receive an electrical wire. The blank may include a contact arm extending into an area adjacent the wire connecting portion. The contact arm extends into this area from a terminal connecting portion at a predetermined angle. The contact arm may be straightened and folded prior to bending the terminal connecting portion into a tubular member for receiving the tab of a male terminal. The step of straightening the contact arm can be performed using a special coining process that applies pressure to the conductive material around the shoulder causing the conductive material to flow within a confined area allowing the contact arm to be straightened.Type: GrantFiled: March 19, 2009Date of Patent: December 28, 2010Assignee: Lear CorporationInventors: Rainer Busies, Dirk Placzko
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Publication number: 20100301884Abstract: A semiconductor chip inspection apparatus largely reduces occurrence of damage due to foreign matter in an inspection process and improves durability at the same time of miniaturization is provided. As to a highly accurate thin-film probe sheet which performs: a contact to electrode pads arranged at a narrow pitch and a high density along with integration of semiconductor chip; and an inspection of semiconductor chips, by providing two layers of metal films selectively removable in a step-like shape in a periphery region of fine contact terminal having sharp tips and arranged at a high density and a narrow pitch at the same level as electrode pads, an upper periphery of the contact terminals is covered with an insulating film, and a large space region is formed.Type: ApplicationFiled: May 26, 2010Publication date: December 2, 2010Inventors: Etsuko Takane, Yasunori Narizuka, Akira Yabushita, Kenji Kawakami, Akio Hasebe
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Patent number: 7829793Abstract: An additive process disk drive suspension interconnect, and method therefor is provided. The interconnect has a metal grounding layer of typically stainless steel or copper metallized stainless steel, a metal conductive layer and an insulative layer between the metal grounding layer and the conductive metal layer. A circuit component such as a slider is electrically connected to the conductive layer along a grounding path from the circuit component and the conductive layer to the metal grounding layer through an aperture in the insulative layer. For improved electrical connection a tie layer is provided through the insulative layer onto the grounding layer in bonding relation with the ground layer. A conductor is deposited onto both the conductive metal layer and the tie layer in conductive metal layer and tie layer bonding relation, and the circuit component is thus bonded to the grounding layer by the conductor.Type: GrantFiled: July 13, 2006Date of Patent: November 9, 2010Assignee: Magnecomp CorporationInventors: Christopher Schreiber, Christopher Dunn
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Patent number: 7810233Abstract: An image is captured or otherwise converted into a signal in an artificial vision system. The signal is transmitted to the retina utilizing an implant. The implant consists of a polymer substrate made of a compliant material such as poly(dimethylsiloxane) or PDMS. The polymer substrate is conformable to the shape of the retina. Electrodes and conductive leads are embedded in the polymer substrate. The conductive leads and the electrodes transmit the signal representing the image to the cells in the retina. The signal representing the image stimulates cells in the retina.Type: GrantFiled: October 10, 2006Date of Patent: October 12, 2010Assignee: Lawrence Livermore National Security, LLCInventors: Peter Krulevitch, Dennis L. Polla, Mariam N. Maghribi, Julie Hamilton, Mark S. Humayun, James D. Weiland
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Publication number: 20100227471Abstract: A method and apparatus are described for fabricating an ultra low-k interconnect structure by depositing and curing a first via layer (43) of ultra low dielectric constant (ULK) material, depositing a second uncured trench layer (51) of the same ULK material, selectively etching a via opening (62) and trench opening (72) with a dual damascene etch process which uses a trench etch end point signal from the chemical differences between uncured trench layer (51) and the underlying cured via layer (43), and then curing the second trench layer (83) before forming an interconnect structure (91) by filling the trench opening (72) and via opening (62) with an interconnection material so that there is no additional interface or higher dielectric constant material left behind.Type: ApplicationFiled: March 6, 2009Publication date: September 9, 2010Inventors: Pak K. Leung, Terry G. Sparks, David V. Horak, Steven M. Gates
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Publication number: 20100224236Abstract: Nanohole electrodes useful in opto-electronic devices, and in particular, organic photovoltaics devices incorporating nanohole electrodes, are disclosed. An exemplary embodiment includes a photovoltaic device with a first electrode comprising a nanohole film, a second electrode, and an active layer located between the electrodes. Methods of producing a nanostructured electrode are also provided.Type: ApplicationFiled: March 3, 2009Publication date: September 9, 2010Applicant: Alliance for Sustainable Energy, LLCInventors: Thomas H. Reilly, III, Jao van de Lagemaat, Robert C. Tenent
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Patent number: 7788800Abstract: A semiconductor device has a leadframe with a structure made of a base metal (105), wherein the structure consists of a chip mount pad (402) and a plurality of lead segments (403). Covering the base metal are, consecutively, a nickel layer (301) on the base metal, and a continuous layer of noble metal, which consists of a gold layer (201) on the nickel layer, and an outermost palladium layer (202) on the gold layer. A semiconductor chip (410) is attached to the chip mount pad and conductive connections (412) span from the chip to the lead segments. Polymeric encapsulation compound (420) covers the chip, the connections, and portions of the lead segments. In QFN devices with straight sides (501), the compound forms a surface (421) coplanar with the outermost palladium layer (202) on the un-encapsulated leadframe surfaces.Type: GrantFiled: November 7, 2007Date of Patent: September 7, 2010Assignee: Texas Instruments IncorporatedInventor: Donald C Abbott
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Publication number: 20100206612Abstract: One aspect is a coil including a laminate having metal layers. The coil is configured for the electrical connection of stimulation electrodes. One of the metal layers exhibits good electrical conductivity and another metal layer great mechanical strength.Type: ApplicationFiled: February 18, 2010Publication date: August 19, 2010Applicant: W. C. HERAEUS GMBHInventor: Herwig Schiefer
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Publication number: 20100205804Abstract: A method of manufacturing a plurality of thick conducting lines for display devices by means of plating method whereby low resistivity for fabricated conductors and at the same time low manufacturing cost are realized. Plating method can be electroplating, electroless plating or combination of both. Substrate in displays can be flat or can have predefined grooves therein. Over this substrate, a thick layer of conductor is applied by means of plating method. The instant invention can reduce row resistance to more than one fourth of original value and in the same time reduce total cost of completed panel.Type: ApplicationFiled: December 31, 2009Publication date: August 19, 2010Inventor: Alireza Ousati Ashtiani
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Patent number: 7774931Abstract: Intraocular retinal prosthesis devices and methods for fabricating the same. A prosthesis device includes a cable region that connects an electrode array region with a power and data management region. The electrode array region includes one or more arrays of exposed electrodes, and the power and data management region includes various power and control elements. The power and data management elements, in one aspect, include an RF coil or coils and circuit arrangements and/or chips configured to provide drive signals to the electrodes via a cable and receive power and signals from the RF coil or coils. Each region includes elements fabricated on or in a single polymer layer during the same fabrication process.Type: GrantFiled: April 28, 2006Date of Patent: August 17, 2010Assignees: California Institute of Technology, University of Southern CaliforniaInventors: Yu-Chong Tai, Damien C. Rodger, Wen Li, Mark Humayun, James D. Weiland, Hossein Ameri, Armand R. Tanguay, Jr.
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Publication number: 20100136856Abstract: An electrical connector is disclosed. The electrical connector has a plug and a receptacle that are connectable in a mated position. At least one of the plug and the receptacle have a body and an electrically conductive layer applied directly to the body.Type: ApplicationFiled: December 3, 2008Publication date: June 3, 2010Applicant: TYCO ELECTRONICS CORPORATIONInventors: Kenneth R. Gleason, Navin Kanjibhai Patel, Mark A. Hippert, Valentino Girolamo, Laurence A. Daane
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Patent number: 7725996Abstract: A method for producing an actuator device, comprising the steps of: forming a vibration plate on a substrate; and forming a piezoelectric element composed of a lower electrode, a piezoelectric layer, and an upper electrode on the vibration plate, wherein in the step of forming the piezoelectric element, the upper electrode is formed on the piezoelectric layer by sputtering, a temperature of 25 to 250 (° C.) and a pressure of 0.4 to 1.5 (Pa) are used during the sputtering, and upon the sputtering, the upper electrode having a thickness of 30 to 100 (nm), stress of 0.3 to 2.0 (GPa), and specific resistance of 2.0 (×10?7 ?·m) or less is formed.Type: GrantFiled: August 9, 2006Date of Patent: June 1, 2010Assignee: Seiko Epson CorporationInventors: Xin-Shan Li, Tsutomu Nishiwaki
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Publication number: 20100112874Abstract: An electrical conductor, e.g., a terminal pin, includes a conductor body, a first layer at least partially applied to the conductor body, and a second layer at least partially applied to the first layer, the material of the second layer containing thiol, and the material of the first layer containing nickel.Type: ApplicationFiled: September 14, 2009Publication date: May 6, 2010Inventor: Ronny Ludwig
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Publication number: 20100088888Abstract: A method of forming an interconnection, including a spring contact element, by lithographic techniques. In one embodiment, the method includes applying a masking material over a first portion of a substrate, the masking material having an opening which will define a first portion of a spring structure, depositing a structure material (e.g., conductive material) in the opening, and overfilling the opening with the structure material, removing a portion of the structure material, and removing a first portion of the masking material. In this embodiment, at least a portion of the first portion of the spring structure is freed of masking material. In one aspect of the invention, the method includes planarizing the masking material layer and structure material to remove a portion of the structure material. In another aspect, the spring structure formed includes one of a post portion, a beam portion, and a tip structure portion.Type: ApplicationFiled: July 7, 2009Publication date: April 15, 2010Inventors: Gaetan L. Mathieu, Benjamin N. Eldridge, Gary W. Grube
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Publication number: 20100089616Abstract: The present invention relates to a compliant deformable conductor and a method for producing the same, comprising a wire or a tube made of an electrically insulating material and one or more electrical leads applied on said wire or tube, wherein one or more of said leads comprise a plurality of islets of conductive material, forming an electrically conductive layer providing electrical conduction and/or electrical percolation.Type: ApplicationFiled: April 2, 2007Publication date: April 15, 2010Inventors: Michel Troosters, Stephane Befahy, Sami Yunus, Patrick Bertrand
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Patent number: 7685706Abstract: A manufacturing method of a wiring board and a semiconductor device at low cost and by a simple process, without performing complicated steps many times is proposed. Furthermore, a manufacturing method of a wiring board at low cost and with fewer adverse effects on the environment, and a manufacturing method of a semiconductor device using the wiring board are proposed. A pattern of a conductive material is formed over a first substrate, a conductive film is formed over the pattern by an electrolytic plating process, the pattern and the conductive film are separated, an IC chip including at least one thin film transistor is formed over a second substrate, and the conductive film is electrically connected to the IC chip.Type: GrantFiled: June 27, 2006Date of Patent: March 30, 2010Assignee: Semiconductor Energy Laboratory Co., LtdInventors: Junya Maruyama, Tomoyuki Aoki
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Publication number: 20100064513Abstract: An improved method of making sealant containing twist-on wire connectors from a batch of components, wherein some of the components may be preassembled through automated equipment and at least one or more of the steps performed in the making of a sealant containing twist-on wire connector is performed manually at a station where an operator can simultaneously perform one or more steps to enhance the formation of a twist-on wire connector containing a sealant while at the same time eliminating upfront investments costs for a work station as well as costs for maintenance of a work station.Type: ApplicationFiled: September 18, 2008Publication date: March 18, 2010Inventors: Llyod Herbert King, JR., James C. Keeven
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Publication number: 20100041284Abstract: The invention relates to a holder for an electric lamp (1, 1?) with contact pins (7, 8; 7?, 8?) extending to the outside for making electrical contact with the lamp (1, 1?), wherein the contact pins (7, 8; 7?, 8?) at least in some regions are coated with a layer (11) that is electrically conductive and/or that protects the contact pins (7, 8; 7?, 8?) from corrosion. The invention also relates to a method for the production of a holder for an electric lamp.Type: ApplicationFiled: January 11, 2008Publication date: February 18, 2010Inventors: Martin Beck, Robert Menzinger
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Patent number: 7648857Abstract: The present invention provides a process for manufacturing an integrated circuit (IC) package and an integrated circuit (IC) package. The process, without limitation, includes providing an integrated circuit chip having a configuration, and forming a layer of overcoat material over the integrated circuit chip based upon the configuration.Type: GrantFiled: August 11, 2006Date of Patent: January 19, 2010Assignee: Texas Instruments IncorporatedInventors: Sean M. Malolepszy, Rex W. Pirkle
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Publication number: 20090325809Abstract: A method for successfully heat treating magnet coils of braided Bi2Sr2Ca1Cu2Ox (Bi-2212) strand. The Bi-2212 coil is fabricated using standard round wire powder-in-tube techniques, and braided with a ceramic-glass braid with integrated carbonaceous binder. The coil is heated in an atmosphere controlled furnace below the high current density phase reaction sequence to burn off the carbonaceous binder and evacuated to remove unwanted gases from the inner windings. The oxygen environment is then reintroduced and the coil is heat treated to the high Jc reaction temperature and then processed as normal. As the local atmosphere around the surface of the wire, particularly the concentration of oxygen, is critical to a successful reaction sequence, high current Bi-2212 coils can thereby be obtained.Type: ApplicationFiled: June 26, 2008Publication date: December 31, 2009Inventors: Seung Hong, Hanping Maio, Huang Yibing, Maarten Meinesz, Michael Field
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Patent number: 7638721Abstract: A contact surface. for electrical contacts may include an Ag layer deposited on a copper-based substrate using galvanic methods. The Ag layer includes finely dispersed graphite particles in a quantity of, e.g., 1 to 3 weight % of the Ag layer, the graphite particles having a length in the range of, e.g., 0.5 to 20 ?m.Type: GrantFiled: August 3, 2004Date of Patent: December 29, 2009Assignee: Robert Bosch GmbHInventors: Peter Rehbein, Volker Haas
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Publication number: 20090306753Abstract: Defibrillator lead designs and methods for manufacturing a lead having a fibrosis-limiting material covering, a shocking coil electrode, and an implantable lead body are disclosed herein. The shocking coil electrode includes at least one laser welded portion.Type: ApplicationFiled: May 7, 2009Publication date: December 10, 2009Inventors: Mark C. Lynn, Luis J. Morales Cardona, Peter Hall
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Publication number: 20090288809Abstract: An object of the present invention is to provide an electrical discharge surface treatment-purpose electrode that stabilizes properties and a film-forming rate of a coating made by surface treatment that uses the electrode showing a narrow distribution in physical properties such as a composition and resistance. A method of manufacturing an electrical discharge surface treatment-purpose electrode according to the present invention is identified as a method of manufacturing an electrical discharge surface treatment-purpose electrode formed of a green compact made of a metal powder subjected to compression molding, characterized in that the method includes the step of forming a nitride coating by nitriding a surface of the metal powder, and the step of forming a green compact by subjecting the metal powder having its surface nitrided to compression molding.Type: ApplicationFiled: April 13, 2009Publication date: November 26, 2009Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Kazuhiro SHIGYO, Yoshikazu Nakano
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Publication number: 20090151159Abstract: The present invention relates to a method for arranging a plurality of connecting elements corresponding to a plurality of electronic components which is required to be subject to an electric test for inspecting a fault. The method for arranging a plurality of connecting elements on electronic substrates such that the connecting elements may simultaneously contact with a plurality of electronic components comprises the steps of fabricating each connecting element to have the first extending region at one end extended in a certain direction with a regular width and the second extending region at the other end extended in a certain direction with a regular width; and coupling the first extending region of each connecting element to a fixing post formed in a pre-determined region of the electronic substrate in order to be parallel with the second extending region of each connecting element, wherein each of the second extending region extends at the same length.Type: ApplicationFiled: April 16, 2008Publication date: June 18, 2009Applicant: PHICOM CorporationInventor: Oug-Ki LEE
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Publication number: 20090144975Abstract: A method of producing a flexible circuit according to an embodiment herein include supplying a substrate layer film and supplying a cover layer film. A conductive ink is printed on at least a portion of the substrate layer film using an ink jet printing technique. The cover layer film is then laminated over the substrate layer film to provide the flexible circuit. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.Type: ApplicationFiled: February 17, 2009Publication date: June 11, 2009Inventor: Norman P. Gagne
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Publication number: 20090133908Abstract: An interconnect structure for a microelectronic device includes an electrically conductive material (130, 730, 930) adjacent to a metallization layer (120, 320, 920). The electrically conductive material has a base (131, 931) and a body (132, 932). The base is wider than the body. The base and the body form a single monolithic structure having no internal interface. The interconnect structure may be manufactured by providing a substrate (110, 310, 910) to which the metallization layer is applied, forming a sacrificial layer (410) adjacent to the metallization layer and a resist layer (510) adjacent to the sacrificial layer, patterning the resist layer to form an opening (610) (thereby removing a portion of the sacrificial layer), placing the electrically conductive material in the opening, and removing the resist layer, the sacrificial layer, and a portion of the metallization layer.Type: ApplicationFiled: November 28, 2007Publication date: May 28, 2009Inventors: Michael D. Goodner, Kevin J. Lee
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Patent number: 7523539Abstract: In a probe manufacturing method, after a metal material for a probe is deposited on a base table, the probe can be detached from the base table relatively easily without damaging the probe. A recess corresponding to a flat surface shape of a probe is formed by a resist mask on a sacrificial layer on a base table, and a probe is formed by depositing a probe material in the recess. Thereafter, the resist mask is removed, and further the sacrificial layer is removed by an etching process with a part of the sacrificial layer remaining. For the purpose of forming an opening for control of the remaining part of the sacrificial layer in the etching process in the probe so as to let the opening pass through the probe in its plate thickness direction, a hole-forming portion for the opening is formed in the resist mask. Etching of the sacrificial layer in the etching process is promoted from an edge of the opening formed in the probe by this hole-forming portion.Type: GrantFiled: November 5, 2007Date of Patent: April 28, 2009Assignee: Kabushiki Kaisha Nihon MicronicsInventors: Takayuki Hayashizaki, Hideki Hirakawa, Akira Soma, Shinji Kuniyoshi
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Patent number: 7521687Abstract: A substrate processing apparatus which irradiates a substrate under processing with an electron beam and processes the substrate with the electron beam is disclosed. The substrate processing apparatus includes an electron beam generation mechanism which generates the electron beam, first area having a plurality of first static electricity deflecting devices whose thicknesses gradually increase in a traveling direction of the electron beam, and a second area disposed on a downstream side of the electron beam of the first area and having a plurality of second static electricity deflecting devices whose thicknesses are nearly same in the traveling direction of the electron beam. The substrate processing apparatus may further include a plurality of lenses whose thicknesses gradually decrease in the traveling direction of the electron beam, at least one of the plurality of lenses being disposed in each of the first area and the second area.Type: GrantFiled: December 22, 2006Date of Patent: April 21, 2009Assignee: Tokyo Electron LimitedInventors: Takashi Fuse, Tadashi Kotsugi, Kyo Tsuboi, Koji Takeya
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Publication number: 20090081906Abstract: This invention is directed to systems and methods for providing a port in an electronic device housing that is electrically isolated from a conductive portion of a connector inserted in the port without the use of a nonconductive trim in the port. In some embodiments, the connector may include a non-conductive flange or ring operative to contact the housing and the portions of the housing within the port. In some embodiments, a thin layer of non-conductive material may be applied to the portions of the housing within the port to prevent conductive portions of the connector from coming into contact with the housing (e.g., and grounding the conductive portion. This invention may be of particular interest when the conductive portion that may come into contact with the housing is not used to ground the connector.Type: ApplicationFiled: August 8, 2008Publication date: March 26, 2009Applicant: Apple Inc.Inventors: Stephen Brian Lynch, Emery Sanford, Cameron Frazier
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Publication number: 20090067796Abstract: A polymer optical waveguide includes: an optical waveguide portion that includes a core and a cladding each formed of polymer material; and a conductive line that is installed along the core integrally with the optical waveguide portion, and that has an electrode surface for external connection exposed on a surface different from an end surface of the optical waveguide portion.Type: ApplicationFiled: March 27, 2008Publication date: March 12, 2009Applicant: FUJI XEROX CO., LTD.Inventors: Akira FUJII, Keishi SHIMIZU, Shigemi OHTSU, Kazutoshi YATSUDA, Toshihiko SUZUKI, Eiichi AKUTSU
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Publication number: 20090032943Abstract: A substrate for fixing an integrated circuit (IC) element comprises: a substrate for fixing an integrated circuit element includes: a plurality of metal posts that are aligned in a longitudinal direction and a lateral direction in plan view, each of the plurality of metal posts having a first surface and a second surface facing an opposite direction to the first surface, the plurality of metal posts being configured identically; and a joining section that joins each of the plurality of metal posts together at a portion of each of the plurality of metal posts between the first surface and the second surface.Type: ApplicationFiled: July 10, 2008Publication date: February 5, 2009Applicant: SEIKO EPSON CORPORATIONInventors: Masanobu SHOJI, Toru FUJITA
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Publication number: 20090008133Abstract: Provided are patterned circuits with accurately aligned raised features. Also provided are methods for making the circuits using photoresist-on-photoresist patterning.Type: ApplicationFiled: December 27, 2004Publication date: January 8, 2009Inventors: Jeffrey W. Bullard, Dennis M. Brunner, Paul M. Harvey, Hideo Yamazaki, Hiroki Satoh, Hisayuki Nagai
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Publication number: 20080316721Abstract: An electrode structure body of the present invention is composed of a metal electrode, and a solder alloy layer (a tin/nickel alloy layer) formed on a surface of the metal electrode. The solder alloy layer is obtained by reflow-heating the solder layer formed on the metal electrode and then removing the solder layer. This electrode structure body can be applied to an external connection electrode of an electronic component or a mounting substrate.Type: ApplicationFiled: April 30, 2008Publication date: December 25, 2008Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventor: Keigo MAKI
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Publication number: 20080311285Abstract: A method for forming a contact hole includes forming a lyophobic area by applying a liquid droplet of a lyophobic material on a region for forming a contact hole on a wiring, the lyophobic material being lyophobic to a liquid that contains an insulating layer forming material; and forming an insulating layer by applying a droplet of the liquid containing the insulating layer forming material so as to cover the wiring except for the lyophobic area, wherein the contact hole formed penetrates through the insulating layer to be connected to the wiring covered by the insulating layer.Type: ApplicationFiled: June 12, 2008Publication date: December 18, 2008Applicant: Seiko Epson CorporationInventors: Toshimitsu Hirai, Yasushi Takano
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Publication number: 20080298038Abstract: A wiring board has predetermined numbers of wiring layers and insulating layers among the respective wiring layers. The wiring board has an external connecting pad and a surface plating layer for connecting to an external circuit is arranged on the external connecting pad. An area of an external connecting pad is smaller than an area of a surface plating layer thereof.Type: ApplicationFiled: May 23, 2008Publication date: December 4, 2008Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventor: Kentaro Kaneko
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Patent number: 7437819Abstract: A method for sealing an electrical connector having a transition end and a cable. A protective coating is applied to the transition end of the connector. The connector, transition end and cable are positioned within halves of a mold. An annular resilient seal is positioned about the transition end within the mold. When the mold is filed with castable material the annular resilient seal compresses against the connector, preventing leakage of the castable material along the connector. The mold can then be separated leaving a waterproof boot formed on the transition end of the connector. The invention also provides a mold and sealing means for this process.Type: GrantFiled: October 19, 2006Date of Patent: October 21, 2008Assignee: The United States of America as represented by the Secretary of the NavyInventor: Rudolph B. Escobedo
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Publication number: 20080254670Abstract: Electrical connectors are generally discussed herein having a housing having a bore and a groove having a canted coil spring positioned therein. A pin is inserted through the bore and is electrically connected with the canted coil spring. The canted coil spring may be coated with a noble metal and the housing and the pin may be made from non-noble metals.Type: ApplicationFiled: April 14, 2008Publication date: October 16, 2008Inventors: Peter J. Balsells, Robbie J. Sjostedt, Farshid Dilmaghanian
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Publication number: 20080253165Abstract: In one embodiment of the present invention, a method of fabricating a memory device includes: providing a composite structure including a resistivity changing layer and a first conductive layer disposed on or above the resistivity changing layer, forming a second conductive layer on or above the first conductive layer, and patterning the second conductive layer such that at least a part of the patterned second conductive layer is usable as a via for contacting the first conductive layer.Type: ApplicationFiled: April 10, 2007Publication date: October 16, 2008Inventor: Philippe Blanchard