Abstract: An automatic sensing wafer blade for picking up wafers that is equipped with a sensor capable of self-diagnosing potential failure conditions of the blade and a method for using the wafer blade are described. The automatic sensing wafer blade is equipped with a V-shaped seal ring on a top surface, and a sensor of either a limit switch or a capacitance sensor for sensing the presence or absence of a wafer on top of the wafer blade. The automatic sensing wafer blade is further capable of self-diagnosing any potential failure conditions of the function of the wafer blade due to contaminating particles, or contaminating liquid on the wafer surface, or due to an aged or malfunctioning seal ring on top of the wafer blade.

Abstract: A linear slide gripper assembly is provided having a linear slide assembly coupled to a gripper assembly. The linear slide assembly has extension and retraction ports in fluid communication with a fluid source to move the gripper assembly between extended and retracted positions. The gripper assembly is in fluid communication with the linear slide assembly to selectively actuate.

Abstract: A device for gripping, holding, and releasing objects of varying sizes and shapes, which comprises an elongated torus (30) enclosing a fluid material (31), an external control rod (40), and an internal control rod (38). Torus (30) may be made of a flexible membrane and able to seal in fluid material (31). Fluid material (31) can be a gas, liquid, solid particles, semisolid particles, or mixtures of these. Central channel (34) of torus (30) is collapsed due to pressure of fluid material (31) within torus (30). Both control rods are securely attached to torus (30), with rod (38) attached to the interior portion of the torus along collapsed central channel (34), and rod (40) attached to the exterior portion of the torus on outer surface (32). Gripping action is achieved by differential linear motion of control rods (38) and (40) along the longitudinal (elongated) axis of torus (30). This causes front portion (36) of the torus to slide radially inward or outward to grip objects.

Abstract: In a gripper device for manually operated or automatic handling devices, having a gripper housing, at least one base jaw displaceably seated in the gripper housing, and a drive for the base jaw, wherein the drive comprises a hydraulically or pneumatically chargeable piston displaceably seated in a cylinder and a spline hook gear, an optimal sealing of the base jaw in the gripper housing is achieved in that the base jaw has a sealed, for example circular or polygonal, cross section at least in the section extending from the gripper housing when the gripper device is opened.

Abstract: A suction control unit in a plate suction and lifting device that can suck and lift even the plate with process holes or the corrugated plate by finding the suckable flat part of the plate. A suction control unit 1 controls a plate suction and lifting device 2 for lifting a plate W by sucking the flat part of the plate W by a suction pad 4. The suction control unit 1 is equipped with a suction pressure detector 19 and a retry control unit 29. The retry control unit 29 detects the suction pressure of the suction pad 4. The retry control unit 29 sucks the plate again if the suction pressure of the suction pressure detector 19 does not reach the set pressure when the suction pad 4 sucks the plate W. This suction is implemented again by changing the flat part of the plate W sucked by the suction pad 4.

Abstract: Under pressure handling device comprising an under pressure generator, a device for controlling the under pressure and several grippers which engage on a work piece to be handled, wherein each gripper is provided with a device for controlling the under pressure, a sensor for detecting state variables on the gripper and an evaluation electronics to which the device for controlling the under pressure and the sensor are connected.

Abstract: A method and apparatus are provided for detecting contact between a wafer blade of a wafer-handling robot and a component in a wafer-handling system. The robot moves the wafer blade within the system while the wafer blade is maintained at an electrical potential, which is different from an electrical potential of the component. Contact between the wafer blade and the component is detected by sensing a change in the electrical potential of the wafer blade during the contact.

Abstract: A method and apparatus for automatically picking up hosiery articles (20) from a container (7), e.g., socks, knee socks, and the like in which an actuator (4) comprised of a support (5), to which a grasping device (6) is suspended, picks up the hosiery articles (20) at a loading position and moves them to an unloading position. The grasping device (6) is lowered into the container until the grasping device (6) contacts the free surface of the bulk of hosiery articles (20). The actuator (4) continues to be lowered according to a brief additional stroke and the grasping device (6) delays the closure even after a first contact with the free surface of hosiery articles (20). The grasping device (6) is then detected and closed onto hosiery articles (20) grasping at least one of them. The grasping device (6) them moves to the unloading position by means of the actuator (4) where the grasping device (6) opens and releases the hosiery article (20).

Abstract: The present invention relates to a gripping and transport clamp mounted at an end of a robotic arm. The clamp has a support member mounted at the end of the robotic arm and two lower pressing plates and one upper pressing plate mounted on the support member. A sensor is used to detect a reaction force being exerted on the first pressing plate upon displacement thereof. An actuator inserts the first lower pressing plate under the object to be gripped in response to a detection of the reaction force by the sensor. The second lower pressing plate under the first pressing plate moves between a retracted position and an extended position by means of an actuator mounted between the second lower pressing plate and the support member. It is also inserted under the object to be gripped. An actuator moves the upper pressing plate towards the object for gripping it between the plates. A controller receives detection signals from the sensor and operates the actuators.

Abstract: An automatic sensing wafer blade for picking up wafers that is equipped with a sensor capable of self-diagnosing potential failure conditions of the blade and a method for using the wafer blade are described. The automatic sensing wafer blade is equipped with a V-shaped seal ring on a top surface, and a sensor of either a limit switch or a capacitance sensor for sensing the presence or absence of a wafer on top of the wafer blade. The automatic sensing wafer blade is further capable of self-diagnosing any potential failure conditions of the function of the wafer blade due to contaminating particles, or contaminating liquid on the wafer surface, or due to an aged or malfunctioning seal ring on top of the wafer blade.

Abstract: A system for handling stiff but flexible discs, particularly semiconductor wafers, including fail safe mechanisms that prevent the disc from being dropped if power to the unit is interrupted. Also, the electronics controlling operation resumes functioning at the point in the operation cycle existing when power was interrupted. A wafer hand assembly member is slipped under a wafer, or between parallel stacked but spaced wafers, and one or more fingers are rotated 90° to a position perpendicular to the plane of the stiff hand assembly member. The hand assembly also has one or more posts positioned perpendicular to the surface of the hand assembly. The finger(s) and post(s) or rear barrier constitute three upright projections or points forming the corners of a triangle with the wafer to be grasped there between.

Abstract: The invention relates to a vacuum grip system (10) for gripping at least one object (11a). The vacuum grip system (10) has a base unit (18) and at least two suction units (19, 20) affixed thereto, disposed at right angles to one another, and each having at least one suction gripper (21, 22). At least one of the suction units (19, 20) grasps the object or objects (11a) to be gripped from above, and at least one of the suction units (19,20) grasps the object or objects (11a) from one side. In order to provide The vacuum grip system (10) having maximum flexibility, it is proposed to affix the suction units (19, 20) to the base unit (18) such that, in order to grip the object (11a), the distance between the upper suction unit (19) and the lateral suction unit (20) may be varied. It is further proposed that the vacuum grip system (10) have a mechanical undergripper (25) upon which the gripped object (11a) may be laid.

Abstract: A wafer holder in a robot blade. A holder plate having a front end is provided. At least one sensor is disposed at the front end of the holder plate. A sensing circuit is connected to the sensor, wherein the sensing circuit determines the presence or absence of an obstruction positioned immediately ahead of the holder plate. Thus, the wafer holder is capable of avoiding contact with obstructions, thereby preventing system crash during semiconductor manufacturing process.

Abstract: A fluid actuated parts gripper assembly is provided. The fluid actuated parts gripper assembly has a pair of opposable pivoting jaw members, a fluid driven actuator, first and second linkage structures, a sensor target, a mounting, and a sensor. The sensor target is coupled to the second linkage structure and is movable therewith. The mounting is located adjacent the sensor target, and the sensor is mounted on the mounting such that the sensor is configured to detect the sensor target.

Abstract: An end-effector includes multiple vortex chucks for supporting a wafer. Vortex chucks are located along the periphery of the end-effector to help prevent a flexible wafer from curling. The end-effector has limiters to restrict the lateral movement of a supported wafer. In one example, the end-effector has a detector for detecting the presence of a wafer. The detector is mounted at a shallow angle to allow the end-effector to be positioned close to a wafer to be picked-up, thereby allowing detection of deformed wafers contained in a wafer cassette. The shallow angle of the detector also minimizes the thickness of the end-effector. Also disclosed is a wafer station with features similar to that of the end-effector.

Abstract: A substrate-handling robot comprises an arm drive mechanism with a first arm connected to it. A multiple substrate batch loader is connected to the first arm. The multiple substrate batch loader includes a set of vertically stacked substrate-handling paddles. A control circuit is connected to the arm drive mechanism. A vacuum control system is connected to the multiple substrate batch loader and the control circuit. The vacuum control system includes a set of vacuum control valves corresponding to the set of vertically stacked substrate-handling paddles. The set of vacuum control valves includes a selected vacuum control valve for a selected substrate-handling paddle. A set of vacuum sensors is connected to the set of vacuum control valves. The set of vacuum sensors includes a selected vacuum sensor corresponding to the selected vacuum control valve. The selected vacuum sensor provides a substrate-absent signal when a substrate is not present at the selected substrate-handling paddle.

Abstract: A robot which incorporates a body, arms with a hand grip, legs, several sensors, light elements, an audio system, and a video system. The sensors allows the robot to interact with objects in the room, and prevents the robot from traveling off an edge or bumping into obstacles. The light elements allow the robot to express moods. The audio system allows the robot to detect and transmit sounds. The video system allows a user to remotely view the area in front of the robot. Additionally, the robot may operate in a plurality of modes, including modes that allow the robot to operate autonomously. The robot may operate autonomously in an automatic mode, a security mode, a greet mode, and a monitor mode. Further, the robot is manipulated remotely.

Abstract: A clamping element for a flat work piece, with a first clamping jaw with a first clamping surface and a second clamping jaw with a second clamping surface has an optical sensor for the measurement of the distance between the two clamping surfaces. The optical sensor is partially integrated into the clamping jaws. The optical sensor comprises an opto-transmitter, a first light guide and a second light guide and at least one photosensor. The first clamping jaw has a drill hole which accommodates an end of the first light guide and the second clamping jaw has a drill hole which accommodates an end of the second light guide.

Abstract: The present invention provides a substrate holder for holding and transferring a thin substrate, comprising a substrate support member having a recessed area for placing a thin substrate therein and substrate mount portions formed in the recessed area in the vicinity of a circumferential edge thereof. The substrate mount portions is adapted to be engaged with an outer circumferential portion of a backside of the substrate placed in the recessed area. The substrate holder further comprises a substrate detector for detecting presence or absence of the substrate in the recessed area.

Abstract: End-effectors may be used to grasp microelectronic workpieces for handling by automated transport devices. One such end-effector includes a plurality of abutments and a detector adapted to detect engagement of the edge of the workpiece by at least one of the abutments.

Abstract: A wafer blade for picking up or delivering wafers from or to a wafer cassette or a process tool is described. The wafer blade carries a wafer on a top surface of the blade, and is capable of detecting any undesirable contact with wafers on a bottom surface of the blade. The wafer blade is constructed by a blade body of generally elongated shape that has a top surface and a bottom surface parallel to each other, and a strain sensor such as a piezoelectric thin film sensor mounted on and at least partially cover the bottom surface of the blade body for detecting any contact with the wafer and for sending an alarm signal to a central process controller when such contact or scratch of a wafer has occurred.

Abstract: An end-effector includes multiple vortex chucks for supporting a wafer. Vortex chucks are located along the periphery of the end-effector to help prevent a flexible wafer from curling. The end-effector has limiters to restrict the lateral movement of a supported wafer. In one example, the end-effector has a detector for detecting the presence of a wafer. The detector is mounted at a shallow angle to allow the end-effector to be positioned close to a wafer to be picked-up, thereby allowing detection of deformed wafers contained in a wafer cassette. The shallow angle of the detector also minimizes the thickness of the end-effector. Also disclosed is a wafer station with features similar to that of the end-effector.

Abstract: A parts gripper having a continuity switch to determine the presence of a part or workpiece held between the jaws of a parts gripper comprising a parts gripper having a yoke, a pair of jaw members, a pivot pin, a cover plate, a side impact plate, and an electrical lead conductively connected to the first attachment portion of the pivot pin. The pivot pin is conductively connected to the jaw members and connects the jaw members to the yoke of the gripper body. The pivot pin includes a shaft, a neck portion, a stepped portion, and a first attachment portion. The shaft connects the jaw members to the yoke. The cover plate has a keyed through-hole for mating with the neck portion of the pivot pin. The side impact plate has a slot for mating with the stepped portion of the pivot pin to prevent the pivot pin from rotating.

Abstract: A controlled material transport system (MTS) for carrying materials to and from workstations, test equipment, and processing and assembly tools in a common facility. The present invention includes a rigid robot vehicle mountable to a passive track system, which can be routed to service all processing tools on the factory floor. The robot vehicle includes a hoist assembly and gripper assembly, which together perform such functions as picking up magazines, placing magazines, and loading magazines into the processing tools. The hoist assembly is capable of functioning in an operational envelope, which includes any target location within a 3-axis Cartesian coordinate system, to the extent of the range of motion of the hoist assembly. The hoist assembly also provides rigid and controlled z-axis travel, while being compact when retracted. The gripper assembly facilitates loading of the magazines, especially chute style magazines, which are commonly found on many existing processing tools.

Abstract: Under pressure handling device comprising an under pressure generator, a means for controlling the under pressure and several grippers which engage on a work piece to be handled, wherein each gripper is provided with a means for controlling the under pressure, a sensor for detecting state variables on said gripper and an evaluation electronics to which the means for controlling the under pressure and the sensor are connected.

Abstract: An electrically driven gripper has a housing, a gearmotor attached to the housing, a cam engaged to the gearmotor, a pair of opposing jaws slidingly mounted to the housing, a cam follower secured to one of the jaws and in sliding contact with the cam; and a spring configured to impart a force to the jaws such that the jaws are pulled toward each other. The gearmotor drives the cam to force the jaws to a maximum open position. Continued rotation of the cam allows the spring to pull the jaws closed to grasp an object with the jaws. Sensors mounted to the housing determine whether the jaws are in an open or closed state. A simple circuit on a printed circuit board mounted to the housing is used to control the electric gearmotor.

Abstract: A preferred embodiment of a fluid powered apparatus has a housing, a piston and an off-axis member to deter piston rod rotation relative to the housing. In a further aspect of the present invention, an off-center pin actuates one or more sensors while also deterring rotation of a piston rod relative to a housing. An additional aspect of the present invention provides for complete retention and sealing of a sensor within a housing.

Abstract: The present invention relates to a gripper system which can be secured to a hand of a robot and has at least two mutually independent gripper elements; each gripper element is provided with at least one force sensor for ascertaining a force in a predetermined direction. With this gripper system, it is possible to grasp components more reliably.

Abstract: A picker for a module IC handler includes a plurality of grippers. Each gripper includes first and second jaws, and one or more cylinders or other actuators for driving the first and second jaws. Each gripper also includes a damping device that damps movements of the jaws to reduce an impact that can occur as the jaws grip a module IC. The grippers may also include one or more sensors for sensing when the jaws have grasped a module IC, or for sensing the position of the gripper relative to the module IC.

Abstract: Presented is an end-effector for grasping integrated circuit wafers with a talon-like device that effectively grips an arcuate peripheral “free zone” of the wafer-without effecting contact of the wafer in a manner to contaminate it.

Abstract: A lifting device for handling of loads by suspension, especially maritime containers, includes:

Abstract: A fluid power load-clamping system includes at least one fluid valve for variably regulating the maximum fluid pressure causing closure of the clamp. Preferably the valve increases the maximum fluid pressure automatically in relation to the measured magnitude of the weight of the load to regulate the load-gripping force. A controller causes the valve to permit a relatively high maximum fluid pressure as the clamp closes toward the load to enable high initial clamp closure speed. Thereafter the valve automatically reduces the maximum pressure as the clamping surfaces close into a predetermined relationship with the load, and then increases the maximum pressure to regulate the gripping force. Other preferable features include continuous weight-responsive automatic regulation of the gripping pressure while the load is supported by the clamp, and compensation of the weight measurement for the longitudinally-extensible position of the lifting mechanism, to maximize the accuracy of the load-weight measurement.

Abstract: Substrate handling apparatus and methods are described. In one aspect, the substrate handling apparatus includes a clamping member having an extended condition wherein substrate movement relative to the transfer arm is substantially restricted and a retracted condition wherein substrate movement relative to the transfer arm is substantially free. The substrate handling apparatus further includes a sense mechanism (e.g., a vacuum sensor) constructed to determine whether a substrate is properly positioned on the support arm and to trigger the mode of operation of the clamping member between extended and retracted conditions. The sense mechanism also provides information relating to the operating condition of the clamping member.

Abstract: A placement force sensor for pick-and-place devices for picking and placing components onto substrates includes a component gripper arranged on a holder. A force sensor is further arranged between the holder and the component gripper), so that the placement force with which the component is placed onto the substrate can be sensed directly by the force sensor. Very small moving masses achieve high measuring accuracy and reliability of the placement force sensor. The provision of a spring in the flux of force between the component gripper and the holder allows the accuracy to be increased even further.

Abstract: A fluid power load-clamping system includes at least one fluid valve for variably regulating the maximum fluid pressure causing closure of the clamp. Preferably the valve increases the maximum fluid pressure automatically in relation to the measured magnitude of the weight of the load to regulate the load-gripping force. A controller causes the valve to permit a relatively high maximum fluid pressure as the clamp closes toward the load to enable high initial clamp closure speed. Thereafter the valve automatically reduces the maximum pressure as the clamping surfaces close into a predetermined relationship with the load, and then increases the maximum pressure to regulate the gripping force. Other preferable features include continuous weight-responsive automatic regulation of the gripping pressure while the load is supported by the clamp, and compensation of the weight measurement for the longitudinally-extensible position of the lifting mechanism, to maximize the accuracy of the load-weight measurement.

Abstract: Improved variable-pitch pick and place devices may include one or more improvements such as a mechanical linkage such as pantograph linkage, the linkage itself linked to a plurality of device-gripping mechanisms arranged in a row so as to keep uniform, though variable, spacing between the device-gripping mechanisms, with the number of such mechanisms being increased relative to the number of parts in the linkage for reduced tolerance stack-up and improved positioning accuracy. The horizontal position of the linkage may be fixed at a position not at an end thereof, and desirably within the middle third or at the middle thereof. The linkage may be controlled at three points. These points may include a vertically flexible but horizontally fixed link to a supporting structure at the middle of the pantograph, a link at one end of the pantograph to one side of an endless loop of timing belt, and a link at the other end of the pantograph to the other side of the endless loop of timing belt.

Abstract: An object manipulator robot device includes a pick-up member made from a thermally conductive material and having at least one surface of contact with the object to be picked up, a system for cooling the pick-up member to freeze the interface between the member and the object, thereby fastening them together, including a local system for cooling the pick-up member directly and a peripheral system for cooling the local system, a system for heating the member to liquefy the interface, thereby releasing the object, and a control system for the cooling and heating systems. The local cooling system includes a pair of local cooling elements mounted on respective opposite sides of the pick-up member and the peripheral cooling system includes a pair of peripheral cooling elements connected to the local cooling elements by arms made from a material of high thermal conductivity, such as copper.

Abstract: A plurality of jaw members 3, 3 for gripping a work piece on a casing 2, to be opened or closed freely, a driving part 4 having a driving rod 9 to be moved linearly, reciprocally, a converting mechanism 7 for converting the linear reciprocal motion of the driving rod 9 into the opening or closing operation of the jaw members 3, 3, a position detecting part 5 capable of detecting the operating position of the jaw members 3, 3 for all the stroke, comprising a scale 33 displaced synchronous with the driving rod 9, and a reader 34 for reading the calibration engraved on the scale 33, and a linear guide mechanism 6 for guiding the linear reciprocal movement of the scale 33.

Abstract: The invention provides a robotic gripper mechanism having a thin, protrusion-free profile for maneuvering through tight areas, which mechanism includes a finger assembly mounted at the distal end of a gripper arm, which arm extends from a movable housing. The finger assembly is normally biased to a retracted position, but may be moved to an extended operative position by a drive member operating on a slide in the arm through suitable intermediary components. The invention also includes a mechanism for permitting retraction of the arm when an obstacle is encountered during vertical downward movement of the gripper mechanism so as to protect the arm and the finger assembly from damage.

Abstract: The invention relates to a lid gripping device for automated handling lids of sample vessels, the lids comprising a spigot to be grasped by the lid gripping device, and the lid gripping device is provided with a collet chuck for grasping the spigot of a lid. The lid gripping device comprises a positioning element for actively actuating the collet chuck, resulting in only minor forces needing to be applied for actuating the lid gripping device, thus permitting application more particularly in robotic devices.

Abstract: An apparatus and method are provided for picking up an integrated circuit and for facilitating the optical testing thereof. The apparatus comprises a pick-up mechanism that includes a vacuum chamber. The vacuum chamber is defined by an upper portion, an expandable member, and a lower portion. The lower portion defines a suction orifice that is moveable with a movement of the expandable member. An optical pathway is defined by the vacuum chamber, the optical pathway passing through the suction orifice and onto an integrated circuit that is held against the suction orifice via a vacuum pressure applied to the vacuum chamber.

Abstract: A fluid power load-clamping system includes at least one fluid valve for variably regulating the maximum fluid pressure causing closure of the clamp. Preferably the valve increases the maximum fluid pressure automatically in relation to the measured magnitude of the weight of the load to regulate the load-gripping force. A controller causes the valve to permit a relatively high maximum fluid pressure as the clamp closes toward the load to enable high initial clamp closure speed. Thereafter the valve automatically reduces the maximum pressure as the clamping surfaces close into a predetermined relationship with the load, and then increases the maximum pressure to regulate the gripping force. Other preferable features include continuous weight-responsive automatic regulation of the gripping pressure while the load is supported by the clamp, and compensation of the weight measurement for the longitudinally-extensible position of the lifting mechanism, to maximize the accuracy of the load-weight measurement.

Abstract: An apparatus and method are provided for picking up an integrated circuit and for facilitating the optical testing thereof. The apparatus comprises a pick-up mechanism that includes a vacuum chamber. The vacuum chamber is defined by an upper portion, an expandable member, and a lower portion. The lower portion defines a suction orifice that is moveable with a movement of the expandable member. An optical pathway is defined by the vacuum chamber, the optical pathway passing through the suction orifice and onto an integrated circuit that is held against the suction orifice via a vacuum pressure applied to the vacuum chamber.

Abstract: A gripper for the picking apparatus of a module IC handler including a gripper body, first to third supports vertically formed at a lower part of the gripper body, a cylinder for driving a jaw located between first and second supports and second and third supports, a pair of jaws movably connected at a lower part of the cylinder, for picking the module IC, a damping mechanism for reducing an impact occurred upon picking the module IC by the jaw, and a module IC sensor for sensing the module IC upon moving the jaw. The present invention reduces damage of the module ICs with the damping mechanism upon picking the module ICs. Also, the gripper easily and exactly grips the module ICs, thus accomplishing the working performance.

Abstract: A robotic arm has a pair of gripper fingers designed to grip a variety of containers, including capped and uncapped test tubes as well as containers having unique gripping means. The fingers each have upper and lower projections separated by a groove, the respective projections facing each other when mounted to grippers on the robotic arm. The projections and groove serve to firmly hold the containers as well as self-align the unique gripping means on initially unaligned containers within the fingers as the fingers close around the containers. The fingers have clearance to avoid contact with caps on capped test tubes. Stops are provided at the top of each finger to engage one another and prevent fully closed fingers from deforming. The robotic arm may be transported along a rail mounted above the instrument and a gripper assembly, having a gripper arm, mounted to the robotic arm may be rotated above the instrument to move the container to various locations within the instrument.

Abstract: The invention relates to a gripper system which can be secured to a robot hand and has at least two mutually independent gripper elements; each gripper element is provided with at least one force sensor for ascertaining a force in a predetermined direction. With this gripper system, it is possible to grasp components more reliably.

Abstract: An improved conveyor system for transporting a microelectronic workpiece within a processing tool is set forth. The conveyor system includes a transport unit slidably guided on a conveyor rail for transporting and manipulating the workpieces. The transport unit includes a vertical member which is connected to a base end of a two section robot arm. The robot arm includes an end effector at a distal end thereof which is actuated to grip a surrounding edge of a workpiece. A first rotary actuator is arranged to rotate the vertical member about its axis to rotate the entire robot arm. A second rotary actuator is positioned to rotate the second section of the robot arm, via a belt, with respect to the first section of the robot arm. A third rotary actuator is arranged to rotate the end effector about its horizontal axis. The third rotary actuator permits the end effector to flip the microelectronic workpiece between a face up and a face down orientation.

Abstract: A suction mechanism for an IC, in which a hollow shaft incorporating a suction pad at its lower end part is supported by a holder so as to be vertically slidable, and the suction pad is made into resilient contact with an IC accommodated in a recess on a tray when the holder is lowered. A stopper formed therein with a step part projected downward so as to laterally cover the suction pad is attached to the lower end part of the hollow shaft; the lower end of the step part is located above an IC contact surface of the suction pad, the lower surface of the stopper has at least a width with which the stopper is prevented from sinking into the recess on the tray, and a distance between the lower surface of the stopper to the IC contact surface of the suction pad is shorter than the depth of the recess on the tray.

Abstract: A system and method for holding a semiconductor wafer substantially flat on a chuck and for cooling the chuck is provided. The system for securing a wafer on a chuck includes first and second conduits, first and second valves, and a first sensor. The first and second conduits each fluidly connect a first plurality of holes in the chuck to a vacuum source. The first and second valves are disposed within the first and second conduits respectively. The first sensor is in fluid communication with one of the first and second valves. The first sensor measures a first vacuum level applied to one of the first and second valves. In operation, one of the first and second valves opens to induce a vacuum force between the first plurality of holes in the chuck and a wafer disposed on the chuck. When the first vacuum level applied to one of the first and second valves is greater than a predetermined vacuum level, the wafer has been partially pulled down against the chuck.

Abstract: A gripping device including a suction tube connected to a suction source and a tublar nozzle which surrounds a portion of this tube so as to be movable along the tube while delimiting therewith a tubular calibrated gap which generates a laminat effect moving the nozzle towards an external stop position where no object is gripped by the nozzle so as to be deteced by an opto-electronic fork.