Abstract: There is provided a method of manufacturing piezoelectric vibrators 1. The method includes a process for through holes 35 and 36, which pass through a base substrate wafer, so that openings of the through holes are opened to the outside of the recesses for cavities C; a process for patterning a bonding layer 30, pairs of mounting layers, and pairs of extraction electrode layers 33 and 34 on the upper surface of the base substrate wafer with the same conductive material; and a process for electrically isolating the extraction electrode layers 34 in the middle by irradiating a part (area S2) of the extraction electrode layers 34, which are formed between the bonding layer and openings of through holes 36, with laser light after both the wafers are anodically bonded to each other. The bonding layer 30 surrounds the recesses, the pairs of mounting layers are in the recesses, and the pairs of extraction electrode layers 33 and 34 electrically connect the pairs of mounting layers to the bonding layer.

Abstract: A sensor senses an environmental condition. The sensor includes a film bulk acoustic resonator that includes a layer of material that causes resonant frequency and/or quality factor shifts of the film bulk acoustic resonator in response to changes in the environmental condition. The environmental condition may be relative humidity and the layer of material may be a moisture absorptive material.

Abstract: An exemplary piezoelectric vibrating device includes a piezoelectric frame that supports and surrounds a tuning-fork type piezoelectric vibrating piece having a pair of vibrating arms. The device also includes a lid and a package base that are siloxane-bonded to the frame. The lid defines at least one frequency-adjustment hole extending through the thickness dimension of the lid from an inner major surface thereof (facing the frame) to an outer major surface of the lid. The package base defines at least one through-hole electrode passing via a respective electrode through-hole through the thickness of the base from an inner major surface thereof (facing the frame) to the outer major surface thereof. The electrode is connected to the piezoelectric vibrating piece. The lid and base include external electrodes, made of an electrically conductive material, that cover the through-holes and frequency-adjustment hole(s).

Abstract: The object of the present invention is to provide a piezoelectric resonator of which vibration frequency can be accurately adjusted and the adjustment accuracy of the vibration frequency can be improved. The piezoelectric resonator of the present invention includes an vibrating arm extended from a base, and a metal film for adjusting frequency formed along the longitudinal direction from the tip of the vibrating arm, in which the metal film for adjusting frequency is provided with a block pattern divided into a plurality of blocks in compliance with the amount of frequency adjustment. Structuring as above, the frequency adjustment of the piezoelectric resonator is conducted by eliminating the blocks in compliance with the amount of frequency adjustment one by one, which makes it possible to adjust the vibration frequency with accuracy.

Abstract: A tuning-fork type piezoelectric vibrating piece (20) is comprised of a base portion (23) comprising a piezoelectric material, a pair of vibrating arms (21) extends parallel from the base portion with a first thickness, a excitation electrode film (33, 34) formed on the vibrating arms, a pair of tuning portions (28) formed at the distal ends of the vibrating arms (21) with a second thickness which is less than the first thickness; and a metal film (18) formed on at least one surface o the tuning portion.

Abstract: A filter includes a parallel resonator having first comb electrodes provided on a piezoelectric substrate and a first dielectric film that covers the first comb electrodes, and a series resonator having second comb electrodes provided on the piezoelectric substrate and a second dielectric film covers the second comb electrodes and is made of a material identical to that of the first dielectric film. The first dielectric film has a different thickness from that of the second dielectric film.

Abstract: A driving apparatus (100j) is provided with: a base portion (110); a stage portion (130) on which a driven object (12) is mounted and which can be displaced; an elastic portion (120) which connects the base portion and the stage portion and which has elasticity to displace the stage portion in one direction (Y axis); a first applying device (161, 162, 22) for applying an excitation force for displacing the stage portion such that the stage portion is resonated in the one direction at a resonance frequency determined by the stage portion and the elastic portion; and a frequency adjusting device (170) for dynamically adjusting the resonance frequency.

Abstract: A dual mode piezoelectric filter includes a piezoelectric material layer composed of a piezoelectric thin film of the high-cut type formed on a substrate, a first electrode and a second electrode formed on one of the major surfaces of the piezoelectric material layer with a gap provided therebetween, a third electrode formed on the other major surface of the piezoelectric material layer opposite to the first electrode, the second electrode, and the gap, and an interelectrode mass load element formed in the gap or at a position opposite to the gap on a surface of the piezoelectric material layer. The relationships (?1×h1)?(?a×ha) and (?2×h2)?(?a×ha) are satisfied, where h1 is the thickness and ?1 is the density of the first electrode, h2 is the thickness and ?2 is the density of the second electrode, and ha is the thickness and ?a is the density of the interelectrode mass load element. A filter characteristic with a smooth passband and low losses is obtained.

Abstract: An oscillating body apparatus comprises an oscillating plate oscillatably supported around a torsion axis by a support portion for a fixing portion and driving the oscillating plate around the torsion axis by a resonance frequency, the oscillating plate having a region forming a groove portion for adjusting a mass of the oscillating plate, and, the resonance frequency being configured to be adjustable by the formation of the groove portion in the region.

Abstract: Three or more piezoelectric resonators having resonance frequencies different from one another are realized on the same substrate. First through third frequency adjustment layers of first through third piezoelectric resonators, respectively, provided on the same substrate 101 are formed by varying, among the frequency adjustment layers, the ratio of area (depressions 109 and 110) to be etched to area not to be etched.

Abstract: Piezoelectric vibrators provided with an electrode that includes a drive electrode and adjustment electrodes formed in advance on part of the electrode; the drive electrode and adjustment electrodes that are initially electrically connected to each other are electrically cutoff and insulated from each other by cutting conductive parts between the drive electrode and adjustment electrodes, or the mutually insulated drive electrode and adjustment electrodes are electrically connected using solder, a wire, or another electrically conductive member, whereby the characteristic frequencies are adjusted.

Abstract: In a sensor device and a sensing method capable of simultaneously extracting plural pieces of information including information about the presence/absence, distribution, and so on, of targets, in case of measuring changes in nature of a detecting portion (11) upon coupling with targets (a and b), information about changes in quantities of the targets (a and b) with time is extracted in addition to information about the presence/absence, distribution, and so on, of the targets (a and b) from geometrical structures of the detecting portion (11), such as locations and/or shapes of bonding sites (A and B) for selectively coupling with the targets (a and b), respectively.

Abstract: A piezoelectric resonator includes a laminated thin film having a first thin film portion supported by a substrate and a second thin film portion spaced apart from a first main surface of the substrate and acoustically isolated from the substrate. The second thin film portion of the laminated thin film includes a piezoelectric thin film, a first electrode disposed on the upper surface of the piezoelectric thin film, and a second electrode disposed on the lower surface of the piezoelectric thin film and being larger and thicker than the first electrode. The piezoelectric resonator further includes a mass adding film disposed around the first electrode and on at least one portion of a region extending outward from the periphery of a piezoelectric vibrating portion at which the first and second electrodes overlap each other with the piezoelectric thin film disposed therebetween.

Abstract: The present invention is a method for adjusting the resonant frequency of a mechanical resonator whose frequency is dependent on the overall resonator thickness. Alternating selective etching is used to remove distinct adjustment layers from a top electrode. One of the electrodes is structured with a plurality of stacked adjustment layers, each of which has distinct etching properties from any adjacent adjustment layers. Also as part of the same invention is a resonator structure in which at least one electrode has a plurality of stacked layers of a material having different etching properties from any adjacent adjustment layers, and each layer has a thickness corresponding to a calculated frequency increment in the resonant frequency of the resonator.

Abstract: There is provided a piezoelectric thin film device with its frequency impedance characteristic unsusceptible to spuriousness. A film bulk acoustic resonator has a configuration where an adhesive layer, a lower electrode, a piezoelectric thin film, and an upper electrode are laminated in this order on a support substrate. A drive section of the upper electrode and a drive section of the lower electrode are opposed to each other with the piezoelectric thin film interposed therebetween. The respective drive section has a slender two-dimensional shape, with magnitude in its longitudinal direction being not less than twice, more desirably four times, and further desirably ten times, as large as magnitude in its widthwise direction.

Abstract: To provide a method for manufacturing a piezoelectric thin film resonator with excellent characteristics. A method for manufacturing a piezoelectric thin film resonator in accordance with the present invention includes a step of forming a laminated body by successively laminating, above a first substrate, a piezoelectric thin film and a first electrode, a step of bonding a second substrate and the laminated body, a step of separating the first substrate from the laminated body, a step of forming a second electrode above the piezoelectric thin film, and a step of patterning the second electrode, the piezoelectric thin film and the first electrode.

Abstract: An electronic part includes a substrate, a comb-shaped electrode having a plurality of electrode fingers arranged parallel to one another on the upper surface of the substrate, and a protective film formed on the upper surface of the substrate so as to cover the comb-shaped electrode. The protective film has convex portions and concave portions. The convex portions are upwardly convex at the positions corresponding to the electrode fingers, and the concave portions are downwardly concave between the convex portions. The cross section of the protective film in the direction orthogonal to the extending direction of the electrode fingers has a downward convex curve between apex portions of the convex portions.

Abstract: A piezoelectric device, includes: a package; a piezoelectric resonator element housed in the package; a lid made of metal and bonded to the package by seam welding to seal the package air-tightly; a metal film for frequency adjustment that is provided to the piezoelectric resonator element; and a window part provided to the lid and enabling a light to transmit therethrough.

Abstract: A piezoelectric element suitable for use as a sensor element in a hydrophone. In a preferred embodiment, the sensor element comprises a ceramic lead zirconate titanate substrate defining opposed ends and including at least first and second conductive strip electrodes on opposed top and bottom faces thereof. In accordance with the invention, at least one of the strip electrodes, and preferably at least the end of one of the strip electrodes disposed adjacent one of the opposed ends of the substrate, includes one or more spaced-apart laser cuts created during the manufacture of the sensor element for presetting the capacitance of the sensor element.

Abstract: An ohmic electrode is formed by stacking a lower Ti layer, a diffusion preventing layer, an upper Ti layers and a metallic (Au) layer on a p-type GaAs layer. The diffusion preventing layer includes tantalum (Ta) or niobium (Nb). Thus, interdiffusion of Ga and As in the p-type GaAs layer and Au in the metallic layer can be prevented, and variation in resistivity of the ohmic electrode in a high-temperature, high-humidity environment can be suppressed.

Abstract: A piezoelectric microspeaker using microelectromechanical systems (MEMS) and a method of manufacturing the same are provided. The piezoelectric microspeaker includes a piezoelectric layer disposed on an elastic thin layer, and a resonance change unit patterned on one of a bottom surface of the elastic thin layer and a top surface of the piezoelectric layer.

Abstract: An actuator for moving a tool is disclosed, comprising a housing in which a tappet carrying a tool holder is guided axially movable, wherein the tappet is movable by means of a fast drive, e.g. by a piezo drive or by a nanotube drive, which is biased against a restoring force and which is dampened by a dampening element. Herein the fast drive may at least partially be received within a recess of the tappet which leads to a very compact design, in particular in combination with a coaxial dampening element. For guiding the tappet in axial direction alternatively a roller guide may be used (FIG. 3).

Abstract: Tuning fork and method in which a pair of elongated tines having front and rear surfaces are disposed symmetrically about an axis, and balancing masses on the front surface of one tine and on the rear surface of the other tine are trimmed to reduce quadrature error and also to maintain mass balance between the tines.

Abstract: An electro-acoustic resonator (1, 8, 17) of the membrane or FBAR type (1) or the solidly-mounted or SBAR type (8), with electrodes comprising a single conducting layer or multiple conducting layers, i.e. sandwich construction (17) with an optimum coupling factor kr and thus an improved filter bandwidth. The optimum coupling factor kr is achieved by the arrangement that the top electrode (6, 15, 25) is thinner than the bottom electrode (4, 13, 23). The coupling factor is independent of the resonator's layout defined by the mask.

Abstract: A crystal resonator comprises an AT-cut crystal vibrating element that is driven by a thickness-shear mode and is in the shape of a rectangular plate. A pair of excitation electrodes is formed, facing front and rear surfaces of the crystal vibrating element. Each of the excitation electrodes is formed in the shape of a quadrangle as viewed from the top, and mass adjustment portions are formed at least two opposite sides of each of the excitation electrodes formed on the front and rear surfaces.

Abstract: At least one support tine, disposed generally in parallel to the force sensing tines of a DETF, is added to increase the stiffness of the structure for resisting various strains during assembly. Once the bonding operation is complete, the support tine(s) are cut or broken away from the structure to leave the remaining structure relatively strain free for operation.

Abstract: An object of the present invention is to provide an inexpensive thin film piezoelectric bulk acoustic wave resonator that allows fine-tuning of a resonant frequency. Another object is to provide an inexpensive filter with dramatically improved frequency characteristics, using thin film piezoelectric bulk acoustic wave resonators that can be formed on one substrate.

Abstract: A piezoelectric resonator includes a laminated thin film having a first thin film portion supported by a substrate and a second thin film portion spaced apart from a first main surface of the substrate and acoustically isolated from the substrate. The second thin film portion of the laminated thin film includes a piezoelectric thin film, a first electrode disposed on the upper surface of the piezoelectric thin film, and a second electrode disposed on the lower surface of the piezoelectric thin film and being larger and thicker than the first electrode. The piezoelectric resonator further includes a mass adding film disposed around the first electrode and on at least one portion of a region extending outward from the periphery of a piezoelectric vibrating portion at which the first and second electrodes overlap each other with the piezoelectric thin film disposed therebetween.

Abstract: Thickness of a piezoelectric layer 31 is measured and widths of individual electrodes 32 are determined based on an amount of deviation of the measured thickness of the piezoelectric layer 31 from a predetermined reference thickness set in advance for the piezoelectric layer 31. Individual electrodes 32 of the determined widths are then formed on a side opposite to pressure chambers 14 of the piezoelectric layer 31. It is therefore possible to easily compensate for fluctuation in the thickness of the piezoelectric layer 31 with the widths of individual electrodes 32. As a result, it is possible to provide a piezoelectric actuator for liquid transporting apparatus, and a method for manufacturing a piezoelectric actuator or the like which is capable of compensating for the fluctuation in thickness of the piezoelectric layer with electrode width.

Abstract: A piezoelectric vibration element is provided which includes a piezoelectric substrate formed of a thickness slip based piezoelectric material and a metal layer formed on a surface of the piezoelectric substrate. In the piezoelectric vibration element, a surface of the metal layer is covered by a layer formed by chemical absorption with a material having a nonbonding electron pair.

Abstract: A film bulk acoustic resonator includes a substrate having a cavity at a surface of the substrate; a bottom electrode provided on the surface of the substrate so as to extend over the cavity; a piezoelectric film disposed on the bottom electrode; a top electrode disposed on the piezoelectric film so as to face the bottom electrode and extending over the surface of the substrate; and a seal member configured to seal a capacitor defined by the bottom electrode, the piezoelectric film and the top electrode, and to provide an opening portion of the cavity outside the seal member at the surface of the substrate.

Abstract: Provided is an angular velocity sensor which is thin, requires no individual adjustment and can control the generation of signals that are unnecessary to the angular velocity sensor and are generated on the sensing electrodes when the tuning fork is made to vibrate in the X-axis direction, and a method for manufacturing the angular velocity sensor. Centers (8d) and (9d) of top electrodes (8c) and (9c) as components of detection units are shifted by ?W from centers (10) and (11) of main surfaces (3a) and (3b) of arms (1a) and (1b) of the tuning fork vibrator towards side surfaces (3c) and (3e) adjacent to main surfaces (3a) and (3b), respectively.

Abstract: A piezoelectric element comprises a piezoelectric ceramic wafer bonded to a substrate, with a surface profile of the substrate being non-uniformly configured to affect the spring rate of the piezoelectric element. For example, in one example embodiment the substrate has its profile configured so that its stiffness is modified or non-uniform along at least one axis of the substrate. The nature of the non-uniform surface profile can acquire various configurations or patterns.

Abstract: A piezoelectric oscillator includes: a piezoelectric substrate having at least a vibrating part and a base part; an excitation electrode formed on the vibrating part; and an oscillation circuit formed on the base part. In the piezoelectric oscillator, the oscillation circuit includes a thin film transistor made of one of polysilicon and monocrystalline silicon and is coupled to the excitation electrode.

Abstract: Aspects of the invention can provide a method capable of easily realizing immobilization with the optimum density derived from a concentration control and without phase separation in coadsorption of a number of molecules. The immobilization method can include the step of dissolving a plurality of molecules to be immobilized to a solid phase substrate with a solvent to obtain a solution of the plurality of molecules, and the step of incubating the solution and the solid phase substrate in touch therewith. Each of the molecules can include a solid phase substrate joint portion having a jointing property to the solid phase substrate, a functional portion having a specific function, and a linker portion positioned between the solid phase substrate joint portion and the functional portion.

Abstract: An integrated circuit chip has a substrate, an acoustic wave sensor, and a trimming element. The acoustic wave sensor is formed on the substrate, the trimming element is formed on the substrate, and the trimming element is coupled to the acoustic wave sensor so as to trim the acoustic wave sensor when the trimming element is adjusted. The trimming element, for example, may be a trimming capacitor.

Abstract: An acoustic resonator that includes a substrate, a first electrode, a layer of piezoelectric material, a second electrode, and a fill region. The first electrode is adjacent the substrate, and the first electrode has an outer perimeter. The piezoelectric layer is adjacent the first electrode. The second electrode is adjacent the piezoelectric layer and the second electrode has an outer perimeter. The fill region is in one of the first and second electrodes.

Abstract: A manufacturing method for an electronic component includes a process of forming a lower electrode and a dummy electrode, which are electrically connected to each other, on a substrate, and a process of forming a piezoelectric thin film on the dummy electrode and the lower electrode while a predetermined bias potential is applied to the lower electrode via the dummy electrode. In this method, the piezoelectric thin film is formed on the lower electrode by stabilizing the potential of the lower electrode, thereby decreasing the surface roughness of the piezoelectric thin film. It is thus possible to manufacture an electronic component that exhibits excellent piezoelectric characteristics, in which the electromechanical coupling coefficient and the quality factor of a resonator are increased.

Abstract: A micromechanical component and a method for producing the component are provided. The micromechanical component includes a substrate and a micromechanical functional layer of a first material provided over the substrate. The functional layer has a first and second regions, which are connected by a third region of a second material, and at least one of the regions is part of a movable structure, which is suspended over the substrate.

Abstract: The resonator comprises a piezoelectric layer arranged between two electrodes. An electrical heating resistor is arranged in thermal contact with at least one of the electrodes. Temporary heating of the electrode enables the material constituting the electrode to be partially evaporated, so as to thin the electrode and thus adjust the resonance frequency. Measurement of the resonance frequency in the course of evaporation enables the heating to be interrupted when the required resonance frequency is obtained. One of the electrodes can be arranged on a substrate formed by an acoustic Bragg grating. The resonator can comprise a substrate comprising a cavity whereon one of the electrodes is at least partially arranged.

Abstract: A method for modifying the resonance frequency of a micro-mechanical resonator, and resonators on which the method is practiced. A packaged resonator is trimmed by directing electromagnetic energy to the resonator through a transparent portion of the package. The removal of mass (by the energy) affects the resonance frequency of the resonator in a predictable manner. In some embodiments, the energy is sourced from a femtosecond laser. In some variations of the illustrative embodiment, the amount of mass to be removed is determined as a function of its location on the resonator. A mass-trimming map is developed that identifies a plurality of potential mass-trimming sites on the resonator. A site can be classified as a fine-tuning site or a coarse-tuning site as a function of the degree to which mass removal at those sites affects the resonance frequency. The sites can also be characterized as a function of their position relative to features of the resonator (e.g., nodal lines, etc.).

Abstract: A method for tuning an electro-mechanical device such as a MEMS device is disclosed. The method comprises operating a MEMS device in a depressurized system and using FIB micromachining to remove a portion of the MEMS device. Additionally, a method for tuning a plurality of MEMS devices by depositing an active layer and then removing a portion of the active layer using FIB micromachining. Also, a method for tuning a MEMS device and vacuum packaging the MEMS device in situ are provided.

Abstract: A vibration wave linear motor is a vibration wave linear motor that can drive a plurality of driving targets with a simple and small configuration. In the linear motor, two guide members sandwich two vibrators, which are individually and electrically connected to a driving circuit by a flexible board and an electrode connecting part, and individually driven with an independent operation. Two lens frames are individually driven by the two vibrators via a pin member, a board spring, and an engagement protruding part. For example, in a lens apparatus, one of the two lens frames holds a lens unit in the third group, which is involved in focus achievement, whereas the other lens frame holds a lens unit in the second group, which is involved in zooming.

Abstract: The invention relates to a microbeam oscillator. Tuning of the oscillator is carried out by addition or subtraction of material to an oscillator member in order to change the mass of the oscillator member.

Abstract: A film bulk acoustic resonator includes a first electrode, a piezoelectric film disposed on the first electrode, a second electrode disposed on the piezoelectric film or disposed above the piezoelectric film, and an additional film disposed on and abutting the piezoelectric film. The additional film has at least one pair of opposite sides which are non-parallel with each other. The additional film includes a plurality of stripe-shaped openings.

Abstract: This invention relates to methods of depositing piezoelectric films such as in part of a stack including depositing a piezoelectric layer, measuring the thickness of the layer and depositing a further film or films such that the combined thickness is substantially equal to the target thickness.

Abstract: The film acoustic wave devices (12a, 12b and 12c) having the same properties are obtained by changing at least one of the followings: the length and/or the width of upper electrode (18a and 18b); the distance between the upper electrodes (18a and 18b); the length and/or the width of connecting patterns (19a and 19b); areas of bonding pads (20a and 20b); and the pattern shape for the film acoustic wave device (12a and 12b) such as the area of capacitor electrode connected electrically to the bonding pads (20a and 20b); the property variations of film acoustic wave devices (12a, 12b and 12c) caused from the positioning at wafer 11 is compensated.

Abstract: The subject invention pertains to a method for determining the affinity between binding partners, or a property of one of the binding partners dependent on the affinity, comprising the steps of: (i) contacting the binding partners, one of which is immobilised on a surface; (ii) oscillating the surface at increasing amplitude; and (iii) detecting a dissociation event. An analogous method can be used to separate a target analyte from a composition. The subject invention also pertains to an apparatus for determining the affinity between binding partners, and comprises: a surface (10) having one binding partner (16) immobilised thereon; means for oscillating the surface at increasing amplitude; and means (14, 15) for detecting a dissociation event.

Abstract: A piezoelectric vibrator comprising: a thin rectangular piezoelectric plate formed of a material having a Young's modulus having two short edge surfaces and two long edge surfaces and two large planar face surfaces which plate has transverse resonant vibration modes parallel to its short edges and longitudinal resonant vibration modes parallel to its long edges and is formed with at least one cavity; and at least one electrode on each of the planar surfaces that is electrifiable to excite at least one vibration mode of the plate, wherein the at least one cavity is not filled with a material having a Young's modulus substantially equal to the Young's modulus of the material from which the plate is formed, such that the presence of the at least one cavity shifts a resonant frequency of at least one vibration mode of the plate with respect to the resonant frequency that characterizes the at least one vibration mode in the absence of the at least one cavity.

Abstract: An electronic component (1) includes a substrate (2) and at least two piezoelectric resonators (3, 4) each having an active element (6, 9), a lower electrode (5, 8) and an upper electrode (7, 10). The lower electrode (5) of the first resonator (3) is made of a material that is different from that of the lower electrode (8) of the second resonator (4) such that the resonators exhibit different resonance frequencies.