Acoustic Wave Type Generator Or Receiver Patents (Class 310/334)
  • Publication number: 20140184026
    Abstract: The present disclosure involves a method and apparatus for attaching two electrical dies by wire bonding and then encasing the assembly in a protective casting that works by arranging two dies into a fixture conducive to wire bonding. Doped epoxy may be immediately dispensed over the assembly to form a near-net-shape protective cover, or Drive Can.
    Type: Application
    Filed: December 30, 2013
    Publication date: July 3, 2014
    Inventor: Michael Reiter
  • Patent number: 8764911
    Abstract: An ultrasonic wave generating apparatus includes: a generator including an electric power supply, a controller that generates a control signal, a liquid crystal display indicator, and a transducer drive circuit; and transducer portions. The generator includes: the controller having an internal memory or a port to which an external memory is inserted, and formed of a microcomputer to control the generator and the transducer portions; thyristor portions that are arranged respectively in the front and rear ends of the transducer portions, in which two thyristors are connected in series in the respective thyristor portions; snubber circuit portions that are connected in parallel with the respective thyristor portions; at least one transducer that is connected with the controller and is included in the transducer portions; and choke coils that are connected with one end of the respective transducers in the transducer portions.
    Type: Grant
    Filed: May 24, 2010
    Date of Patent: July 1, 2014
    Inventor: Won-churl Lee
  • Publication number: 20140180103
    Abstract: A compact, high power, dual mode, emitting and receiving ultrasound transducer and method for applying ultrasonic energy within a living subject and for monitoring the effects it induces in tissue comprises a set of piezoelectric polymeric transducer elements and a set of piezoelectric ceramic elements, bonded together. The polymeric transducer elements have electrodes enabling their use for low power diagnostic imaging interrogation of the tissue and the ceramic transducer elements have electrodes enabling their use for high power therapy applications.
    Type: Application
    Filed: February 27, 2014
    Publication date: June 26, 2014
    Applicant: MISONIX, INCORPORATED
    Inventor: YEGOR SINELNIKOV
  • Patent number: 8754574
    Abstract: Modular electronics are provided for a multi-dimensional array. The electronics are positioned perpendicular to the array in modules. The modules include frames to support the electronics and provide for electrical connection between the array and the electronics. The frames include thermally conductive material to transfer heat away from the electronics and the array. The frames form a surface to support part of the array and a single layer of flexible circuit material with pads and traces over the surface for electrical connection. The flexible circuit material allows connection to the electronics at a pitch different than the pitch of the array. The modules allow the same electronics parts to be used with different sized arrays. The traces and pads of the flexible circuit material may be changed for different arrays without having to redesign the electronics and/or modules.
    Type: Grant
    Filed: April 20, 2011
    Date of Patent: June 17, 2014
    Assignee: Siemens Medical Solutions USA, Inc.
    Inventors: Richard Lee Morris, David A. Petersen
  • Patent number: 8754573
    Abstract: An ultrasonic transducer detector having a high operating frequency is provided. The ultrasonic transducer detector comprises a substrate and an ultrasonic transducer array. The substrate has a plurality of openings, and the ultrasonic transducer array is disposed on the substrate. The ultrasonic transducer array has a plurality of resonance units, and the thickness of each resonance unit is equivalent to ½ wavelength of the operating frequency of the ultrasonic transducer. Each resonance unit comprises an oscillating element and a piezoelectric element. The oscillating element has a first surface adjacent to the substrate, and the piezoelectric element is disposed on the first surface and located in the corresponding opening.
    Type: Grant
    Filed: March 2, 2011
    Date of Patent: June 17, 2014
    Assignee: Industrial Technology Research Institute
    Inventors: Pin Chang, Feng-Chia Hsu, Di-Bao Wang, Chin-Hung Wang
  • Patent number: 8749120
    Abstract: Implementations and techniques for manufacturing flexible micro bumps operably coupled to an array of nano-piezoelectric sensors are generally disclosed. The micro bumps and coupled nano-piezoelectric device have use at least as tactile sensors. A wide variety of configurations of the micro bumps and the nano-piezoelectric device are anticipated.
    Type: Grant
    Filed: October 28, 2011
    Date of Patent: June 10, 2014
    Assignee: Xi'an Jiaotong University
    Inventors: Weihua Liu, Hongzhong Liu, Xin Li
  • Patent number: 8742646
    Abstract: An ultrasound acoustic assembly includes a number of ultrasound acoustic arrays, each array comprising an acoustic stack comprising a piezoelectric layer assembled with at least one acoustic impedance dematching layer and with a support layer. The acoustic stack defines a number of dicing kerfs and a number of acoustic elements, such that the dicing kerfs are formed between neighboring ones of the acoustic elements. The dicing kerfs extend through the piezoelectric layer and through the acoustic impedance dematching layer(s) but extend only partially through the support layer. The ultrasound acoustic assembly further includes a number of application specific integrated circuit (ASIC) die. Each ultrasound acoustic array is coupled to a respective ASIC die to form a respective acoustic-electric transducer module. Methods of manufacture are also provided.
    Type: Grant
    Filed: March 29, 2012
    Date of Patent: June 3, 2014
    Assignee: General Electric Company
    Inventors: Robert Gideon Wodnicki, Charles Edward Baumgartner, David Martin Mills, Kevin Matthew Durocher, William Hullinger Huber, George Charles Sogoian, Christopher James Kapusta
  • Patent number: 8740800
    Abstract: An ultrasonic transducer according to the invention includes a flexible sheet, a rigid body portion including a lower electrode made of at least a thin-film conductive material on a surface of the flexible sheet, a dividing portion which divides the rigid body portion into segments, and a plurality of transducer elements including the divided rigid body portion, has at least one transducer cell composed of one of the segments, an insulating partition portion bonded to the segment, an air gap portion surrounded by the partition portion, an upper electrode opposed to the lower electrode extending to the partition portion to sandwich the air gap portion therebetween, and an upper insulating layer formed on the upper electrode, and includes an upper protection film which continuously covers a surface portion of the transducer elements and the dividing portion.
    Type: Grant
    Filed: October 24, 2007
    Date of Patent: June 3, 2014
    Assignees: Olympus Medical Systems Corp., Olympus Corporation
    Inventors: Katsuhiro Wakabayashi, Hideo Adachi, Mamoru Hasegawa, Kazuya Matsumoto, Ryo Ohta
  • Publication number: 20140139072
    Abstract: The present invention relates to an ultrasound transducer assembly (100) comprising ultrasound transducer elements (175, 175a) for transmitting ultrasound waves in a general transmission direction (A). Each of or each of part of the ultrasound transducer elements (175, 175a) comprises a piezoelectric layer (110, 110a) having a top surface, a bottom surface and a side surface with respect to the general transmission direction (A), as well as a bottom electrode layer (111, 111a) and a top electrode layer (112, 112a). A conductive layer (125) is applied at least partly on the side surface of at least one specific one (110a) of the piezoelectric layers, such that the conductive layer (125) is connected to the top electrode layer (112a) and the bottom electrode layer (111a) of said specific piezoelectric layer (110a).
    Type: Application
    Filed: June 26, 2012
    Publication date: May 22, 2014
    Applicant: KONINKLIJKE PHILIPS ELECTRONICS N.V.
    Inventor: Wojtek Sudol
  • Patent number: 8729982
    Abstract: The elementary filter of the HBAR type includes two resonators (20, 22) of the HBAR type which are each formed by a transducer (8) and a substrate (12) which are coupled in a suitable manner by electroacoustic waves. The first resonator (20), the second resonator (22) and the coupling element (28) by way of evanescent waves include the same monobloc acoustic substrate (12) which is arranged facing and coupled to the piezoelectric transducer (8) by waves having the same longitudinal or transverse vibration mode through the same reference electrode (10).
    Type: Grant
    Filed: November 5, 2009
    Date of Patent: May 20, 2014
    Assignees: Centre National de la Recherche Scientifique (C.N.R.S.), Universite de Franche-Comte
    Inventors: Dorian Gachon, Sylvain Ballandras
  • Publication number: 20140130607
    Abstract: Provided are an acoustic matching member with a fixed density, an ultrasonic transmitter/receiver unit with a high sensitivity, and an ultrasonic flow meter device which attains stable and high-accurate flow measurement. An acoustic matching member comprises hollow elements and a binding agent. The acoustic matching member is created by removing hollow elements having higher densities, hollow elements having cracks, etc., from hollow elements before sorting-out. Since the hollow elements having higher densities, the hollow elements having cracks, etc., are removed from hollow elements before sorting-out, it becomes possible to provide an acoustic matching member having fixed characteristics without being affected by a manufacturing lot and a transportation process of the hollow elements. An ultrasonic transmitter/receiver unit created using the acoustic matching member has fixed characteristics and is able to perform high-accurate flow measurement.
    Type: Application
    Filed: July 12, 2012
    Publication date: May 15, 2014
    Applicant: PANASONIC CORPORATION
    Inventors: Makoto Nakano, Masato Satou, Akihisa Adachi, Satoru Nishida, Takashi Nakashita, Yoshikazu Tanigaki
  • Publication number: 20140128741
    Abstract: An ultrasound element includes a silicon substrate, a lower electrode layer that has a plurality of lower electrode sections, and a plurality of lower wiring sections, and is connected to a lower electrode terminal to which a drive signal and a bias signal are applied, a lower insulating layer, an upper insulating layer in which a plurality of cavities smaller than the respective lower electrode sections are formed, an upper electrode layer that has a plurality of upper electrode sections that are disposed to face the respective lower electrode sections via the respective cavities, and are smaller than the lower electrode sections and larger than the cavities, and a plurality of upper wiring sections, and is connected to an upper electrode terminal at a ground potential that detects a capacitance signal, and a protection layer.
    Type: Application
    Filed: January 10, 2014
    Publication date: May 8, 2014
    Applicants: OLYMPUS CORPORATION, OLYMPUS MEDICAL SYSTEMS CORP.
    Inventors: Kazuya MATSUMOTO, Kazuhisa KARAKI, Mamoru HASEGAWA, Katsuhiro WAKABAYASHI
  • Publication number: 20140117814
    Abstract: An impedance conversion layer useful for medical imaging ultrasonic transducers comprises a low impedance polymer layer and a high impedance metal layer. These layers are combined with corresponding thicknesses adapted to provide a function of converting from a specific high impedance to specific low impedance, wherein the polymer layer is at the high impedance side and the metal layer is at the low impedance side. The effective acoustic impedance of the polymer and metal layer combination may be adapted to configure an impedance converter in the same way as a quarter wavelength impedance converter, converting from low impedance to high impedance (metal to polymer) or from a high impedance to low impedance (polymer to metal). This structure may be used for front matching with the propagation medium and back matching with an absorber for ultrasonic transducers.
    Type: Application
    Filed: December 9, 2013
    Publication date: May 1, 2014
    Applicant: Measurement Specialties, Inc.
    Inventors: Minoru Toda, Mitchell L. Thompson
  • Patent number: 8710717
    Abstract: Methods are provided for creating a metal or other electrically-conductive member extending from an air-backed cavity of a piezoelectric ultrasonic transducer (pMUT) apparatus defining such an air-backed cavity, through a substrate layer disposed adjacent to the transducer device of the pMUT device, and into electrically-conductive engagement with a first electrode of the pMUT device, such that the electrically-conductive member provides an electrically-conductive engagement between the first electrode and a conformal electrically-conductive layer deposited in the air-backed cavity of the pMUT device. Associated apparatuses are also provided.
    Type: Grant
    Filed: January 27, 2011
    Date of Patent: April 29, 2014
    Assignee: Research Triangle Institute
    Inventor: David Edward Dausch
  • Publication number: 20140103782
    Abstract: An aspect of one embodiment, there is provided an ultrasonic transducer including a plurality of oscillators, each of the oscillator having a convex portion, a printed wiring board provided to be opposed to the convex portion and electrically connected to the convex portion, a resin provided between the oscillator and the printed wiring board, the resin covering at least the convex portion and a portion of the printed wiring board.
    Type: Application
    Filed: December 20, 2013
    Publication date: April 17, 2014
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Takashi TOGASAKI, Takeshi Miyagi, Satoru Asagiri, Michiko Ooishi
  • Publication number: 20140103781
    Abstract: An ultrasonic transducer device includes a substrate on which a plurality of openings are arranged; a plurality of ultrasonic transducer elements, each of the ultrasonic transducer elements being provided to each of the openings of the plurality of openings, on a first surface of the substrate; and a member fixed to a second surface of the substrate, which is a surface on the opposite side of the first surface of the substrate. Provided to the member are a plurality of first groove sections, and a second groove section for bundling together the plurality of the first groove sections.
    Type: Application
    Filed: October 11, 2013
    Publication date: April 17, 2014
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Tomoaki NAKAMURA, Yasunori ONISHI, Kazuki YOSHIDA, Kogo ENDO
  • Patent number: 8698377
    Abstract: A compact, high power, dual mode, emitting and receiving ultrasound transducer and method for applying ultrasonic energy within a living subject and for monitoring the effects it induces in tissue comprises a set of piezoelectric polymeric transducer elements and a set of piezoelectric ceramic elements, bonded together. The polymeric transducer elements have electrodes enabling their use for low power diagnostic imaging interrogation of the tissue and the ceramic transducer elements have electrodes enabling their use for high power therapy applications.
    Type: Grant
    Filed: May 20, 2011
    Date of Patent: April 15, 2014
    Assignee: Misonix, Incorporated
    Inventor: Yegor Sinelnikov
  • Publication number: 20140097724
    Abstract: A liquid-ejecting head includes a pressure-generating chamber communicating with a nozzle opening, and a piezoelectric element. The piezoelectric layer contains a perovskite complex oxide containing Bi, La, Fe, and Mn and is ferroelectric.
    Type: Application
    Filed: December 10, 2013
    Publication date: April 10, 2014
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Takayuki YONEMURA, Hiromu MIYAZAWA
  • Patent number: 8692441
    Abstract: A method is provided for forming a piezoelectric ultrasonic transducer apparatus having a first electrode deposited on a dielectric layer disposed on a primary substrate. A piezoelectric material is deposited between the first electrode and a second electrode, to form a transducer device. At least the piezoelectric material is patterned such that a portion of the first electrode extends laterally outward therefrom. The primary substrate and the dielectric layer are etched to form a first via extending to the laterally outward portion of the first electrode, and a first conductive material is deposited to substantially fill the first via and form an electrically-conductive engagement with the laterally outward portion of the first electrode. The primary substrate is etched to define a second via extending therethrough, wherein the second via is laterally spaced apart from the first via. An associated method and apparatus are also provided.
    Type: Grant
    Filed: May 31, 2013
    Date of Patent: April 8, 2014
    Assignee: Research Triangle Institute
    Inventors: David Dausch, Scott H. Goodwin
  • Patent number: 8689416
    Abstract: A method for manufacturing a surface acoustic wave element that prevents curvature of a piezoelectric substrate when forming an electrode pattern includes a first step of bonding to a first principal surface of a piezoelectric substrate a support member having a linear expansion coefficient lower than a linear expansion coefficient of the piezoelectric substrate to form a composite substrate, a second step of forming a plurality of grooves in the support member of the composite substrate from a surface that is opposite to a bonding interface between the support member and the piezoelectric substrate, a third step of forming electrode patterns including at least one IDT electrode on a second principal surface of the piezoelectric substrate of the composite substrate, and a fourth step of dividing the composite substrate on which the electrode patterns are formed to form individual surface acoustic wave elements.
    Type: Grant
    Filed: July 29, 2010
    Date of Patent: April 8, 2014
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Yoshiki Ryu, Masashi Omura
  • Patent number: 8689639
    Abstract: An ultrasonic transducer for determining and/or monitoring flow of a measured medium through a measuring tube, which includes at least one piezoelectric element, at least one coupling element and at least one adapting, or matching, layer between the piezoelectric element and coupling element. The adapting, or matching, layer has a thickness smaller than a fourth of an uneven integer multiple of a wavelength of an ultrasonic signal being used.
    Type: Grant
    Filed: December 9, 2008
    Date of Patent: April 8, 2014
    Assignee: Endress + Hauser Flowtec AG
    Inventors: Andreas Berger, Michal Bezdek, Frank Wandeler, Achim Wiest
  • Patent number: 8680747
    Abstract: An ultrasonic transducer device component changes a transducer with another one having the same frequency or a different frequency without adjustment inside a generator main body or a change of the generator main body. The ultrasonic transducer device component includes a connection unit for use in applying ultrasonic transducer to cleaning fluid for cleaning objects, and for connection with a generator main body that generates an ultrasonic vibration signal; and a transducer connected to a connection unit. The connection unit includes an output transformer for adjusting an output of the ultrasonic vibration signal; a coil capacitor electrically connected to the output transformer; and a current detector electrically connected to the coil capacitor.
    Type: Grant
    Filed: September 12, 2013
    Date of Patent: March 25, 2014
    Assignee: Kaijo Corporation
    Inventors: Hiroshi Hasegawa, Takahiko Ishizuka, Satoshi Domon
  • Patent number: 8680745
    Abstract: A piezoelectric sensing device is described for measuring material thickness of targets such as pipes, tubes, and other conduits that carry fluids. The piezoelectric sensing device includes a piezoelectric element mounted to a flexible circuit with glass reinforced polyimide C-stage cover layers surrounding a pure polyimide C-stage core.
    Type: Grant
    Filed: December 27, 2011
    Date of Patent: March 25, 2014
    Assignee: General Electric Company
    Inventors: Fred Timothy Matthews, Paul Aloysius Meyer, Matthew Harvey Krohn, Nathan John Smith, Adeodato Maria Vigano
  • Patent number: 8680931
    Abstract: A periodic signal generator is configured to generate high frequency signals characterized by relatively low temperature coefficients of frequency (TCF). This generator may include an oscillator containing a pair of equivalent MEMs resonators therein, which are configured to support bulk acoustic wave and surface wave modes of operation at different resonance frequencies. Each resonator includes a stack of layers including a semiconductor resonator body (e.g., Si-body), a piezoelectric layer (e.g., AIN layer) on the resonator body and interdigitated drive and sense electrodes on the piezoelectric layer. The oscillator is configured to support the generation of first and second periodic signals having unequal first and second frequencies (f1, f2) from first and second resonators within the pair. These first and second periodic signals are characterized by respective first and second temperature coefficients of frequency (TCf1, TCf2), which may differ by at least about 10 ppm/° C.
    Type: Grant
    Filed: March 30, 2012
    Date of Patent: March 25, 2014
    Assignee: Integrated Device Technology Inc.
    Inventor: Wanling Pan
  • Patent number: 8674587
    Abstract: An aspect of one embodiment, there is provided an ultrasonic transducer including a plurality of oscillators, each of the oscillator having a convex portion, a printed wiring board provided to be opposed to the convex portion, an adhesive material including at least a portion of the convex portion, the adhesive material joining the oscillator and the printed wiring board, and a resin provided between the oscillator and the printed wiring board, the resin covering the convex portion and the adhesive material.
    Type: Grant
    Filed: June 23, 2011
    Date of Patent: March 18, 2014
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Takashi Togasaki, Takeshi Miyagi, Satoru Asagiri, Michiko Ooishi
  • Publication number: 20140070668
    Abstract: The purpose is to provide an ultrasonic transducer and ultrasonic probe without the complexity of the manufacturing process of a non-conductive acoustic matching layer while ensuring the conductive path. In the non-conductive acoustic matching layer comprising the first surface of the electrode side and the second surface of the opposite side of the piezoelectrics, a plurality of first grooves leading up to the mid-way point between the first surface and the second surface are arranged on each of the first surfaces of the non-conductive acoustic matching later in response to the arrangement of sound elements. Moreover, each of the second surfaces is provided with the plurality of second grooves leading up to at least the mid-way point from the second surface, intersecting the first grooves.
    Type: Application
    Filed: May 18, 2012
    Publication date: March 13, 2014
    Applicants: TOSHIBA MEDICAL SYSTEMS CORPORATION, KABUSHIKI KAISHA TOSHIBA
    Inventor: Yasuhiro Ona
  • Patent number: 8669690
    Abstract: Provided is a piezoelectric sound generating device capable of obtaining a stable connection state of lead-out conductors constituted of a conductive resin layer. A piezoelectric sound generating device 10, wherein lead-out conductors 18a, 18b are so flatly formed as to extend from surface electrodes 11a, 11b1 of a piezoelectric element 11 exposed to first openings 13a1, 13b1 to terminal electrodes 15a, 15b of a terminal portion 15 exposed to second openings 13a2, 13b2 on one main surface side of a diaphragm 12, respectively. As a result, the surface electrode 11a1 of the piezoelectric element 11 and the terminal electrode 15a of the terminal portion 15, and also the surface electrode 11b1 and a surface electrode 11c of the piezoelectric element 11, and the terminal electrode 15b of the terminal portion 15 are conductively connected. Hence, poor connection caused by cracks or the like is not likely to occur in the lead-out conductors.
    Type: Grant
    Filed: January 26, 2010
    Date of Patent: March 11, 2014
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Shigeo Ishii, Norikazu Sashida, Yoshiyuki Watanabe
  • Publication number: 20140062261
    Abstract: According to one embodiment, an ultrasonic probe includes a single crystal piezoelectric body with first and second planes facing each other and having a crystal orientation of [100], first and second electrodes on the respective first and second plane of the piezoelectric body, an acoustic matching layer on the first electrode, and a backing member under the second electrode, wherein the piezoelectric body is polarized along a first direction passing through the piezoelectric body and first and second electrodes, a fracture surface of the piezoelectric body that includes the first direction has a multilayer shape along one of the first and second electrodes, and a thickness of each layer of the multilayer shape is not less than 0.5 ?m and not more than 5 ?m.
    Type: Application
    Filed: August 26, 2013
    Publication date: March 6, 2014
    Applicants: Toshiba Medical Systems Corporation, Kabushiki Kaisha Toshiba
    Inventors: Noriko YAMAMOTO, Yohachi YAMASHITA, Yasuharu HOSONO, Kazuhiro ITSUMI, Kazuhiko HIGUCHI
  • Publication number: 20140062260
    Abstract: An ultrasonic sensor device includes a housing, a transducer, a securing unit and a circuit board. The housing has an enclosing portion formed with first and second openings. The transducer is mounted to the enclosing portion at the second opening, and includes an electrically conductive surrounding wall and a piezoelectric member. The securing unit includes a securing component that secures the transducer on the enclosing portion, and a connecting pin set including two pins each having an end connected electrically to a respective one of the surrounding wall and the piezoelectric member. The circuit board is disposed at the first opening of the enclosing portion for electrical connection with the connecting pin set.
    Type: Application
    Filed: January 31, 2013
    Publication date: March 6, 2014
    Applicant: TUNG THIH ELECTRONIC CO., LTD.
    Inventors: Tzu-Chin Tsai, Chiun-Hua Chang, Shih-Feng Lee
  • Publication number: 20140062259
    Abstract: A piezoceramic pulse-echo acoustic transducer includes protection layers for the piezoceramic that are tuned to the piezoceramic so as to optimize pulse-echo signal response (i.e. greater output signal bandwidth and increased return signal sensitivity). The protection layers are tuned to the piezoceramic via material selection and thickness. The acoustic transducer has a backing, a piezoceramic adjacent the backing, an intermediate protection layer adjacent the piezoceramic, and a front protection layer adjacent the intermediate protection layer and opposite the piezoceramic. The front and intermediate protection layers are tuned to the piezoceramic via their acoustic impedance such that the acoustic impedance of the intermediate layer is greater than the acoustic impedance of the piezoceramic and of the front protection layer. The acoustic impedance of the front protection layer is less than the acoustic impedance of the piezoceramic.
    Type: Application
    Filed: January 30, 2013
    Publication date: March 6, 2014
    Inventors: Frans LAUTZENHISER, Mahesh MATAM
  • Patent number: 8664830
    Abstract: An ultrasonic device is configured to transmit ultrasonic waves and includes a substrate, a diaphragm, a piezoelectric member and a control unit. The substrate has an opening. The diaphragm covers the opening of the substrate. The piezoelectric member is coupled to the diaphragm, and includes a first piezoelectric part and a second piezoelectric part. The control unit controls a voltage applied to the first piezoelectric part to be a vibration voltage and controls a voltage applied to the second piezoelectric part to be a constant voltage when the ultrasonic device transmits the ultrasonic waves.
    Type: Grant
    Filed: November 26, 2012
    Date of Patent: March 4, 2014
    Assignee: Seiko Epson Corporation
    Inventors: Tsukasa Funasaka, Tomoaki Nakamura
  • Patent number: 8660786
    Abstract: A positioning device includes a magnetometer configured to detect and provide heading information, a motion sensor configured to detect and provide motion information, a microcontroller coupled to the magnetometer and the motion sensor and configured to generate position data based on the heading information and the motion information, a transmitter coupled to the microcontroller and configured to wirelessly transmit a signal including the position data, and a piezoelectric power source configured to supply power to at least one of the microcontroller, the magnetometer, the motion sensor and the transmitter.
    Type: Grant
    Filed: August 17, 2011
    Date of Patent: February 25, 2014
    Assignee: Raytheon Company
    Inventors: William T. Bengtson, Keith T. Hayata
  • Patent number: 8656578
    Abstract: An ultrasound transducer includes an array of PZT elements mounted on a non-recessed distal surface of a backing block. Between each element and the backing block is a conductive region formed as a portion of a metallic layer sputtered onto the distal surface. Traces on a longitudinally extending circuit board—preferably, a substantially rigid printed circuit board, which may be embedded within the block—connect the conductive region, and thus the PZT element, with any conventional external ultrasound imaging system. A substantially “T” or “inverted-L” shaped electrode is thereby formed for each element, with no need for soldering. At least one longitudinally extending metallic member mounted on a respective lateral surface of the backing block forms a heat sink and a common electrical ground. A thermally and electrically conductive layer, such as of foil, transfers heat from at least one matching layer mounted on the elements to the metallic member.
    Type: Grant
    Filed: January 8, 2013
    Date of Patent: February 25, 2014
    Assignee: MR Holdings (HK) Limited
    Inventor: Xiacong Guo
  • Patent number: 8659212
    Abstract: An ultrasound transducer includes an array of acoustic elements, an integrated circuit, and an interposer. The interposer includes conductive elements that electrically connect the array of acoustic elements to the integrated circuit. An electrically conductive adhesive is engaged with the conductive elements of the interposer to electrically connect the interposer to at least one of the integrated circuit or the array of acoustic elements. The electrically conductive adhesive is anisotropically conductive.
    Type: Grant
    Filed: February 16, 2012
    Date of Patent: February 25, 2014
    Assignee: General Electric Company
    Inventors: Trym Eggen, Charles Edward Baumgartner, David A Chartrand, Bjornar Sten-Nilsen, Rolf Johannessen, Jessica Abraham
  • Patent number: 8637945
    Abstract: A component having a robust, but acoustically sensitive microphone structure is provided and a simple and cost-effective method for its production. This microphone structure includes an acoustically active diaphragm, which functions as deflectable electrode of a microphone capacitor, a stationary, acoustically permeable counter element, which functions as counter electrode of the microphone capacitor, and an arrangement for detecting and analyzing the capacitance changes of the microphone capacitor. The diaphragm is realized in a diaphragm layer above the semiconductor substrate of the component and covers a sound opening in the substrate rear. The counter element is developed in a further layer above the diaphragm. This further layer generally extends across the entire component surface and compensates level differences, so that the entire component surface is largely planar according to this additional layer.
    Type: Grant
    Filed: April 7, 2010
    Date of Patent: January 28, 2014
    Assignee: Robert Bosch GmbH
    Inventors: Frank Reichenbach, Thomas Buck, Jochen Zoellin, Franz Laermer, Ulrike Scholz, Kathrin van Teeffelen, Christina Leinenbach
  • Publication number: 20140011240
    Abstract: A system having improved trapping force for acoustophoresis is described where the trapping force is improved by manipulation of the frequency of the ultrasonic transducer. The transducer includes a ceramic crystal. The crystal may be directly exposed to fluid flow. The crystal may be air backed, resulting in a higher Q factor.
    Type: Application
    Filed: September 13, 2013
    Publication date: January 9, 2014
    Applicant: FLODESIGN SONICS, INC.
    Inventors: Bart Lipkens, Jason Dionne, Walter M. Presz, Jr., Thomas J. Kennedy, III
  • Patent number: 8624469
    Abstract: A method and associated apparatus directed to a piezoelectric micromachined ultrasonic transducer (pMUT) defining an air-backed cavity are provided. A first via defined by a device substrate and associated dielectric layer, and extending to the first electrode, is substantially filled with a first conductive material. A support member engaged with the device substrate defines a second via extending to the first conductive material. The second via has a second conductive material disposed thereon, forms an electrically-conductive engagement with the first conductive material, and extends outwardly of the second via to be accessible externally to the support member.
    Type: Grant
    Filed: April 22, 2011
    Date of Patent: January 7, 2014
    Assignee: Research Triangle Institute
    Inventors: David Dausch, Jim Carlson, Christopher Brewer Sanders, Scott H. Goodwin
  • Publication number: 20130342079
    Abstract: The invention relates to an electronic component having a layer sequence, which comprises at least a first electrode (10), a second electrode (20) and an active region (30) and contains monoatomic carbon layers at least in sub-regions.
    Type: Application
    Filed: November 22, 2011
    Publication date: December 26, 2013
    Applicant: EPCOS AG
    Inventors: Edgar Schmidhammer, Gudrun Henn
  • Publication number: 20130327139
    Abstract: A device includes a piezoelectric transducer. The transducer has N independent transducer regions. N is an integer. Each of the N independent transducer regions has a thickness. Each of the N independent transducer regions has an acoustic impedance AIT. Each of the N independent transducer regions is independently excitable to oscillate in the thickness mode when electrically excited by a potential difference applied across the thickness. The device further includes a first impedance matching layer having an acoustic impedance AI1 and AIT and a borehole fluid acoustic impedance AIBF. The first impedance matching layer is situated such that an acoustic signal emitted by the piezoelectric transducer will pass through the second impedance matching layer. The device further includes a second impedance matching layer having an acoustic impedance AI2 between AI1 and AIBF.
    Type: Application
    Filed: February 15, 2011
    Publication date: December 12, 2013
    Applicant: HALLIBURTON ENERGY SERVICES, INC.
    Inventors: George David Goodman, Voldi E. Maki
  • Patent number: 8604671
    Abstract: In the ultrasound transducer of the present embodiment, front surface electrodes and rear surface electrodes are provided for a plurality of ultrasound vibrators. A circuit board is disposed on the rear surface side of the ultrasound vibrators, and connected to the rear surface electrodes. An electronic circuit is connected to the surface opposite to that of the rear surface electrodes side on the circuit board, and has signal paths to each ultrasound vibrator through the circuit board. A backing material is disposed on the rear surface side of the ultrasound vibrators, and is provided so as to sandwich between it and the ultrasound vibrators the circuit board and the electronic circuit.
    Type: Grant
    Filed: January 13, 2011
    Date of Patent: December 10, 2013
    Assignees: Kabushiki Kaisha Toshiba, Toshiba Medical Systems Corporation
    Inventor: Hiroyuki Shikata
  • Patent number: 8604672
    Abstract: An impedance conversion layer useful for medical imaging ultrasonic transducers comprises a low impedance polymer layer and a high impedance metal layer. These layers are combined with corresponding thicknesses adapted to provide a function of converting from a specific high impedance to specific low impedance, wherein the polymer layer is at the high impedance side and the metal layer is at the low impedance side. The effective acoustic impedance of the polymer and metal layer combination may be adapted to configure an impedance converter in the same way as a quarter wavelength impedance converter, converting from low impedance to high impedance (metal to polymer) or from a high impedance to low impedance (polymer to metal). This structure may be used for front matching with the propagation medium and back matching with an absorber for ultrasonic transducers.
    Type: Grant
    Filed: September 11, 2012
    Date of Patent: December 10, 2013
    Assignee: Measurement Specialties, Inc.
    Inventors: Minoru Toda, Mitchell L. Thompson
  • Patent number: 8587391
    Abstract: In accordance with a representative embodiment, a bulk acoustic wave (BAW) resonator structure, comprises: a first BAW resonator comprising a first lower electrode, a first upper electrode and a first piezoelectric layer disposed between the first lower electrode and the first upper electrode; a second BAW resonator comprising a second lower electrode, a second upper electrode and a second piezoelectric layer disposed between the second lower electrode and the second upper electrode; and a single-material acoustic coupling layer disposed between the first and second BAW resonators, the acoustic coupling layer having an acoustic impedance less than approximately 6.0 MRayls and an acoustic attenuation less than approximately 1000 dB/cm.
    Type: Grant
    Filed: February 23, 2010
    Date of Patent: November 19, 2013
    Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
    Inventors: Steve Gilbert, Rick Snyder, John D. Larson, III, Phil Nikkel
  • Patent number: 8581472
    Abstract: A manufacturing method of an ultrasonic probe that has a signal foil made of a copper foil patterned by an additive method is provided. The manufacturing method includes preparing a base material and forming an insulating layer on a surface of the material, patterning the insulating layer by exposure, development, and peeling according to a lithographic technique, forming a cavity reaching an upper surface of the base material in the insulating layer along the patterning, forming a signal foil by performing plating in the cavity in the order of copper plating and solder plating, and demolding the formed signal foil from the cavity.
    Type: Grant
    Filed: October 14, 2011
    Date of Patent: November 12, 2013
    Assignee: Nihon Dempa Kogyo Co., Ltd.
    Inventor: Yasunobu Hasegawa
  • Publication number: 20130294201
    Abstract: Wide bandwidth piezoelectric micromachined ultrasonic transducers (pMUTs), pMUT arrays and systems having wide bandwidth pMUT arrays are described herein. For example, a piezoelectric micromachined ultrasonic transducer (pMUT) includes a piezoelectric membrane disposed on a substrate. A reference electrode is coupled to the membrane. First and second drive/sense electrodes are coupled to the membrane to drive or sense a first and second mode of vibration in the membrane.
    Type: Application
    Filed: March 14, 2013
    Publication date: November 7, 2013
    Inventor: Arman Hajati
  • Publication number: 20130293065
    Abstract: Piezoelectric micromachined ultrasonic transducer (pMUT) arrays and systems comprising pMUT arrays are described. In an embodiment, coupling strength within a population of transducer elements provides degenerate mode shapes that split for wide bandwidth total response while less coupling strength between adjacent element populations provides adequately low crosstalk between the element populations. In an embodiment, differing membrane sizes within a population of transducer elements provides differing frequency response for wide bandwidth total response while layout of the differing membrane sizes between adjacent element populations provides adequately low crosstalk between the element populations. In an embodiment, close packing of membranes within a population of transducer elements provides improved efficiency for the wide bandwidth embodiments.
    Type: Application
    Filed: October 9, 2012
    Publication date: November 7, 2013
    Inventors: Arman HAJATI, Mats OTTOSSON
  • Publication number: 20130293066
    Abstract: The purpose is to provide an ultrasound transducer and ultrasound probe without the complexity of the manufacturing process of the non-conductive acoustic matching layer while ensuring the electric conductive path. Pluralities of two-dimensionally arranged piezoelectrics are comprised in the ultrasound transducer. Electrodes are provided for each piezoelectric. Furthermore, the non-conductive acoustic matching layer with the first surface on the electrode side and the second surface on the opposite side of the first surface is comprised in the ultrasound transducer, and moreover, the electric conductive acoustic matching layer arranged on the second surface side of the non-conductive acoustic matching layer is comprised in the ultrasound transducer. Moreover, the substrate arranged on the opposite side of the non-conductive acoustic matching layer is arranged with respect to the electric conductive acoustic matching layer.
    Type: Application
    Filed: January 27, 2012
    Publication date: November 7, 2013
    Applicants: TOSHIBA MEDICAL SYSTEMS CORPORATION, KABUSHIKI KAISHA TOSHIBA
    Inventors: Kentaro Tsuzuki, Takashi Kubota, Yutaka Oonuki, Yasuhisa Makita
  • Patent number: 8574159
    Abstract: The present invention relates to an ultrasonic probe provided with a piezoelectric element for ultrasonic generation that has drive electrodes formed on two main surfaces thereof; an acoustic matching layer formed on the first main surface side of the piezoelectric element; a backing member attached to the second main surface side of the piezoelectric element; a base for heat dissipation provided on a lower surface of the backing member; and a thin metal plate for heat transfer that is thermally bonded between at least one of the main surfaces of the piezoelectric element and the base for heat dissipation; wherein the thin metal plate for heat transfer is surface-bonded to extend from one end of the piezoelectric element over the center thereof toward the other end. This configuration ensures that heat generated by the electrical-mechanical conversion of the piezoelectric element is transferred away in a satisfactory manner, enabling suppression of any temperature rise in the piezoelectric element.
    Type: Grant
    Filed: July 9, 2007
    Date of Patent: November 5, 2013
    Assignee: Nihon Dempa Kogyo Co., Ltd.
    Inventor: Takashi Kondoh
  • Patent number: 8564177
    Abstract: Matching layers improve the performance of ultrasonic transducers. Such layers have traditionally required significant effort and expense to be added to ultrasonic transducers. The present invention discloses a method of producing ultrasonic transducers with a matching layer, specifically for ultrasonic transducers utilizing piezopolymer transducer materials. Rather than the conventional method of forming the piezopolymer on a substrate and then attaching a matching layer through which the transducer emits its ultrasound energy, we teach depositing the piezopolymer on a substrate that also serves as a matching layer through which the ultrasound is emitted. Methods of how to select materials and modify their ultrasonic characteristics are also discussed.
    Type: Grant
    Filed: August 24, 2012
    Date of Patent: October 22, 2013
    Assignee: DVX, LLC
    Inventors: David Vilkomerson, Thomas A Chilipka
  • Patent number: 8562534
    Abstract: Provided is an ultrasonic probe, which can be improved in quality, which can acquire characteristics of a high sensitivity and a wide band and which can acquire an ultrasonic image of a high resolution. In this ultrasonic probe, grooves (160) are formed and utilized to form piezoelectric elements (110) and first acoustic matching layers (121) in a curved shape thereby to converge ultrasonic waves without any acoustic lens. Moreover, signal conductors (150) are disposed on the signal electrode faces of the piezoelectric elements (110).
    Type: Grant
    Filed: April 27, 2007
    Date of Patent: October 22, 2013
    Assignee: Panasonic Corporation
    Inventor: Koetsu Saito
  • Patent number: 8561270
    Abstract: A composite ceramic structure such as, for example, a PZT ceramic structure including, in one embodiment, a plurality of ceramic elements encapsulated in a layer of epoxy material. Each of the ceramic elements includes opposed first and second ends terminating in opposed respective top and bottom surfaces of the composite ceramic structure. A layer of conductive material on the top surface of the composite ceramic structure covers only the respective first ends of the ceramic elements to isolate the same from each other. A layer of conductive material covers the entire bottom surface of the composite ceramic structure to ground the opposed second ends of the plurality of ceramic elements to each other. A method of making the composite ceramic structure described above is also disclosed.
    Type: Grant
    Filed: February 16, 2011
    Date of Patent: October 22, 2013
    Assignee: CTS Corporation
    Inventors: Marshall Suarez, Steve Kear