Acoustic Wave Type Generator Or Receiver Patents (Class 310/334)
  • Patent number: 8198787
    Abstract: An ultrasonic probe, in which a thick adhesive layer is not formed directly under the piezoelectric element and the adhesive is prevented from covering an electrode portion of a side face of the piezoelectric element. The ultrasonic probe includes: a main backing material having a curved surface; a flexible auxiliary member having a first surface bonded onto the curved surface of the main backing material by using an adhesive; and an array of piezoelectric elements arranged on a second surface of the flexible auxiliary member, wherein at least one of side edges of a bonding surface between the flexible auxiliary member and the main backing material is formed with a recessed area for allowing the adhesive, which has protruded when bonding the flexible auxiliary member onto the main backing material by using the adhesive, to escape thereinto.
    Type: Grant
    Filed: July 15, 2009
    Date of Patent: June 12, 2012
    Assignee: FUJIFILM Corporation
    Inventor: Ryuichi Nakayama
  • Publication number: 20120139850
    Abstract: There is provided a haptic driving assembly capable of providing more uniform haptic feedback, and an electronic device using the same. The haptic driving assembly includes: at least one actuator; and a vibration transferring part disposed to contact at least one surface of the actuator and transferring vibrations generated in the actuator to the outside through a liquid phase medium.
    Type: Application
    Filed: June 6, 2011
    Publication date: June 7, 2012
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Boum Seock KIM, Seung Gyo JEONG, Eun Tae PARK
  • Patent number: 8188638
    Abstract: A transducer with a closed heat pipe is provided with a hot surface and a cold surface. The hot surface is in contact with the transducer interior and the cold surface is in contact with a cooler contact area. A fluid is used in the pipe which boils at the temperature of the hot surface and condenses at the temperature of the cold surface. A wick inside the heat pipe facilities the return by capillary action of the condensed fluid to the hot end. The heat pipe can be evacuated to adjust the boiling temperature of the fluid. A variant involves drilling additional holes into ceramic rings and inserting heat pipes. Increasing the heat pipe length into the tail mass and the piston increases the cool region for the fluid to condense; thereby improving the performance of the transducer.
    Type: Grant
    Filed: July 27, 2009
    Date of Patent: May 29, 2012
    Assignee: The United States of America as represented by the Secretary of the Navy
    Inventor: Anthony A. Ruffa
  • Patent number: 8183745
    Abstract: An example ultrasound device, such as a transducer array, includes a plurality of ultrasound transducers, each ultrasound transducer having a first electrode, a second electrode, a thin piezoelectric film located between the electrodes, and a substrate supporting the plurality of ultrasound transducers. In some examples, the electrode separation is less than 10 microns, facilitating lower voltage operation than conventional ultrasound transducers.
    Type: Grant
    Filed: May 8, 2007
    Date of Patent: May 22, 2012
    Assignee: The Penn State Research Foundation
    Inventors: Susan Trolier-McKinstry, Thomas N. Jackson, Kyusun Choi, Richard L. Tutwiler, In Soo Kim, Hyun Soo Kim, Sung Kyu Park, Ioanna G. Mina
  • Publication number: 20120112605
    Abstract: An ultrasound probe including a ceramic layer formed with a plurality of ceramic elements having different thicknesses and an ultrasound system using the same are disclosed. The ultrasound probe for transmitting and receiving ultrasound signals includes at least one transducer element having a ceramic layer, wherein the ceramic layer includes a plurality of ceramic elements having different thicknesses.
    Type: Application
    Filed: November 1, 2011
    Publication date: May 10, 2012
    Inventor: Jung Bae KIM
  • Publication number: 20120112604
    Abstract: A manufacturing method of an ultrasonic probe that has a signal foil made of a copper foil patterned by an additive method is provided. The manufacturing method includes preparing a base material and forming an insulating layer on a surface of the material, patterning the insulating layer by exposure, development, and peeling according to a lithographic technique, forming a cavity reaching an upper surface of the base material in the insulating layer along the patterning, forming a signal foil by performing plating in the cavity in the order of copper plating and solder plating, and demolding the formed signal foil from the cavity.
    Type: Application
    Filed: October 14, 2011
    Publication date: May 10, 2012
    Applicant: NIHON DEMPA KOGYO CO., LTD.
    Inventor: Yasunobu HASEGAWA
  • Patent number: 8172372
    Abstract: When a film containing constituent elements of a target is formed on a substrate through a vapor deposition process using plasma with placing the substrate and the target to face each other, a potential in a spatial range of at least 10 mm extending laterally from the outer circumference of the substrate is controlled to be equal to a potential on the substrate, and/or the substrate is surrounded with a wall surface having a potential controlled to be equal to the potential on the substrate.
    Type: Grant
    Filed: November 13, 2009
    Date of Patent: May 8, 2012
    Assignee: Fujifilm Corporation
    Inventors: Takamichi Fujii, Takayuki Naono, Takami Arakawa
  • Patent number: 8169125
    Abstract: An ultrasound transducer (40,70,100) comprises a combined individual die integrated circuit (42,72,102) and an array of acoustic elements (44,74,104) coupled to the combined individual die integrated circuit via an array of flip-chip bumps (46,76,106). The combined individual die integrated circuit includes a first integrated circuit die (48,78,108) aligned with at least one additional integrated circuit die (50,80,(110,112)). In addition, the first integrated circuit die, the at least one additional die integrated circuits, and the array of acoustic elements together form a large aperture transducer array.
    Type: Grant
    Filed: August 15, 2005
    Date of Patent: May 1, 2012
    Assignee: Koninklijke Philips Electronics N.V.
    Inventors: Bernard J. Savord, Martha Grewe Wilson, Wojtek Sudol
  • Patent number: 8169122
    Abstract: Method and apparatus for sonication in connection with preparing a cellular sample containing DNA or RNA for performance of polymerase chain reaction (PCR) or for other reasons where it is important to break down the cell walls and other cellular structures to release cellular contents including DNA. The same methods and apparatus may be used to release DNA or RNA from virus for PCR or other uses. A novel apparatus which is capable of releasing cellular contents or releasing the DNA or RNA of virus without the aid of beads or chemicals is described herein. The apparatus is designed to deliver high levels of sonic energy through optimizing the geometry the apparatus and optimizing the force created by a piezoelectric transducer. The apparatus is capable of processing samples which are contained within fluid in a short amount of time between 30 seconds and two and one half minutes. The apparatus is small and can be field deployable or used in a standard molecular biology laboratory.
    Type: Grant
    Filed: September 23, 2011
    Date of Patent: May 1, 2012
    Assignee: DXNA LLC
    Inventors: Danvern R. Roberts, William D. Bickmore, Jared Hummel, Daniel Esplin, Paul Day
  • Patent number: 8169126
    Abstract: A low frequency oscillator includes a plurality of drum-shaped oscillators. Each of the drum-shaped oscillators is constructed so that a pair of disk-shaped flexural vibrators is attached on both open ends of a conductive cylinder so as to be arranged face to face. And a conductive elongated coupling member is fixed to adjacent the drum-shaped oscillators at a central portion thereof so as to electrically connect between adjacent the disk-shaped flexural vibrators and thereby coupling the drum-shaped oscillators along a central axis thereof.
    Type: Grant
    Filed: March 13, 2009
    Date of Patent: May 1, 2012
    Assignee: NEC Corporation
    Inventor: Hiroshi Shiba
  • Patent number: 8156620
    Abstract: A method of producing an ultrasonic probe may include superimposing an ultrasonic wave receiving organic piezoelectric element layer made of an organic material on an ultrasonic wave transmitting inorganic piezoelectric element layer made of an inorganic material, and polarizing the ultrasonic wave receiving organic piezoelectric element layer and the ultrasonic wave transmitting inorganic piezoelectric element layer on a condition that the ultrasonic wave receiving organic piezoelectric element layer is superimposed on the ultrasonic wave transmitting inorganic piezoelectric element layer.
    Type: Grant
    Filed: July 27, 2007
    Date of Patent: April 17, 2012
    Assignee: Konica Minolta Medical & Graphic, Inc.
    Inventors: Takeshi Habu, Takayuki Sasaki
  • Patent number: 8148877
    Abstract: A piezoelectric composite micromachined ultrasound transducer including single and multilayer 1-D and 2-D arrays having through-wafer-vias (TWVs) that significantly decreased electrical impedance per element, and hence the improved electrical impedance matching to T/R electronics and improved signal to noise ratio is disclosed. The TWVs facilitate integrated interconnection in single element transducers (positive and negative contact on the same side) and array transducers (contact pads array for integration with T/R switches and/or pre-amplifier circuits).
    Type: Grant
    Filed: April 8, 2011
    Date of Patent: April 3, 2012
    Assignee: TRS Technologies, Inc.
    Inventors: Xiaoning Jiang, Wesley S. Hackenberger, Kevin A. Snook
  • Publication number: 20120074811
    Abstract: In one aspect of the invention, an acoustic wave device includes a substrate, and at least one acoustic wave resonator having a bottom electrode adjacent to the substrate, a top electrode, a piezoelectric layer sandwiched between the bottom and top electrodes, a passivation layer formed on the top electrode, and a mass load layer sandwiched between the substrate and the bottom electrode, or between the bottom electrode and the piezoelectric layer.
    Type: Application
    Filed: September 24, 2010
    Publication date: March 29, 2012
    Inventors: Wei Pang, Hao Zhang
  • Patent number: 8143767
    Abstract: A thermoacoustic array energy converter consists of heat driven thermoacoustic prime movers in parallel coupled by means of an acoustic cavity to a piezoelectric electrical generator whose output is rectified and fed to an energy storage element. The prime movers convert heat to sound in a resonator. The sound form a phase-locked array is converted to electricity by means of the piezoelectric element. The generated electric energy is converted to DC by means of a rectifier set and it is then stored in a battery or supercapacitor. The generated electric energy can also be converted to power line frequency.
    Type: Grant
    Filed: July 15, 2011
    Date of Patent: March 27, 2012
    Assignee: University of Utah Research Foundation
    Inventors: Orest G. Symko, Young S. Kwon
  • Patent number: 8141216
    Abstract: An ultrasound probe comprising a transmitting piezoelectric layer, an electrode layer and a receiving piezoelectric layer laminated in that order, the ultrasound probe transmitting and receiving an ultrasound, wherein a polarization treatment on the receiving piezoelectric layer is carried out by providing a peelable dielectric layer on the receiving piezoelectric layer.
    Type: Grant
    Filed: October 27, 2009
    Date of Patent: March 27, 2012
    Assignee: Konica Minolta Medical & Graphic, Inc.
    Inventors: Takeshi Habu, Takayuki Sasaki
  • Patent number: 8134280
    Abstract: An electronic radial ultrasonic probe comprising an electronic radial array which comprises a plurality of ultrasonic transducers being continuously arrayed circularly around an insertion axis as center and also for which a transmission/reception of an ultrasonic wave is controlled by electronically selecting the plurality of ultrasonic transducer, comprises: a support member equipped on the electronic radial array; a lock member featured with a cavity in which the support member is inserted and with a lock groove for locking a balloon which is mounted in a manner to cover the electronic radial array and in which an ultrasonic medium is filled; and a filler member which is constituted by an adhesive material converting from a fluid state to a solid state, and is filled in the cavity.
    Type: Grant
    Filed: October 29, 2009
    Date of Patent: March 13, 2012
    Assignees: Olympus Medical Systems Corp., Olympus Corporation
    Inventors: Yukihiko Sawada, Akiko Mizunuma, Katsuhiro Wakabayashi, Takuya Imahashi, Sunao Sato
  • Patent number: 8133182
    Abstract: The electrodes for a CMUT are split to provide separate transmit and receive bias and alternating current electrodes. The transmit electrodes of different elements are interconnected, such as rows sharing bias and columns sharing transmit alternating signals. The bias is used to select an aperture in elevation, and only a sufficient number of transmit beamformer channels to use the selected aperture are needed. On receive, the full multi-dimensional array may be used with integrated beamformer electronics.
    Type: Grant
    Filed: September 9, 2008
    Date of Patent: March 13, 2012
    Assignee: Siemens Medical Solutions USA, Inc.
    Inventor: Paul Wagner
  • Publication number: 20120056511
    Abstract: An ultrasonic transducer includes a case having a closed end in the main axis direction, a piezoelectric element located substantially at the center of the closed end of the case, and a body arranged inside the case so as to be opposed to the piezoelectric element. The body has an irregular surface opposed to and spaced from the piezoelectric element.
    Type: Application
    Filed: September 6, 2011
    Publication date: March 8, 2012
    Inventor: Hironori Sakai
  • Patent number: 8129886
    Abstract: An acoustical stack for use within an ultrasound transducer that has a center frequency has a poled piezoelectric material layer and at least one impedance matching layer. The poled piezoelectric material layer has top and bottom sides and is formed of poled piezoelectric material that has a first acoustic impedance. The poled piezoelectric material layer has a first thickness and the acoustical stack has an output electrical impedance based on the first thickness. The impedance matching layers are configured to be attached to the top and bottom sides of the poled piezoelectric material layer and have second or third thicknesses. The impedance matching layers are formed of one or more materials that have an acoustic impedance substantially similar to the first acoustic impedance. The poled piezoelectric layer and impedance matching layers form an acoustic resonance thickness. The center frequency of the transducer is based on the acoustic resonance thickness.
    Type: Grant
    Filed: February 29, 2008
    Date of Patent: March 6, 2012
    Assignee: General Electric Company
    Inventors: Jian Zhong Zhao, Alan Chi-Chung Tai, Dwayne Quatier, Kevin Mahoney
  • Publication number: 20120049693
    Abstract: An actuator and a method for using the same are provided. The actuator includes a flexible element and a photoelectric layer. The flexible element includes an elastic layer or a piezoelectric layer. The photoelectric layer is disposed on a side of the flexible element. An electrical characteristic of the photoelectric layer is determined according to an irradiation condition of the photoelectric layer.
    Type: Application
    Filed: August 15, 2011
    Publication date: March 1, 2012
    Applicants: YEN TJING LING INDUSTRIAL RESEARCH INSTITUTE, NATIONAL TAIWAN UNIVERSITY, INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chih-Kung Lee, Chin-Kai Chang, Kuan-Ting Chen, Hui-Lung Kuo, Wen-Jong Wu
  • Patent number: 8110963
    Abstract: An ultrasonic transducer is configured to transmit or receive ultrasonic waves. The ultrasonic transducer includes a vibrating member and a piezoelectric member coupled to the vibrating member. The piezoelectric member includes a first piezoelectric part configured and arranged to be deformed by applied voltage to vibrate the vibrating member or configured and arranged to be deformed by vibration of the vibrating member to produce a potential difference, and a second piezoelectric part configured and arranged to be deformed by applied voltage to statically deflect the vibrating member.
    Type: Grant
    Filed: December 15, 2009
    Date of Patent: February 7, 2012
    Assignee: Seiko Epson Corporation
    Inventors: Tsukasa Funasaka, Tomoaki Nakamura
  • Publication number: 20120013222
    Abstract: An ultrasonic sensor for detecting and/or scanning an object includes a substrate and a piezoelectric sensor unit arranged on or at this substrate and/or connected to this substrate. The rear side of the substrate facing away from the piezoelectric sensor unit has a surface structure including a plurality of elevated portions and recesses, with this surface structure being configured so that a diffuse scattering of ultrasonic waves incident on the rear side from the direction of the sensor unit takes place by it; and/or in that its elevated portions and/or recesses have a mean lateral extent in the range of 0.05 ?m to 1 mm, preferably from 0.1 ?m to 200 ?m, preferably from 0.2 ?m to 20 ?m, and/or a mean lateral extent which is smaller than or equal to the wavelength of an ultrasonic wave which can be produced by the piezoelectric sensor unit.
    Type: Application
    Filed: January 10, 2011
    Publication date: January 19, 2012
    Inventors: Thomas Herzog, Henning Heuer
  • Patent number: 8098000
    Abstract: An ultrasonic sensor for detecting an object includes: a piezoelectric element having a piezoelectric body and first and second electrodes for sandwiching the piezoelectric body; an acoustic matching element having a reception surface, which receives an ultrasonic wave reflected by the object; and a circuit electrically coupled with the piezoelectric element via a wire. The piezoelectric element is embedded in the acoustic matching element so that the acoustic matching element covers at least the first electrode, a part of a sidewall of the piezoelectric element and a part of the wire between the circuit and the piezoelectric element, and the sidewall of the piezoelectric element is adjacent to the first electrode.
    Type: Grant
    Filed: August 21, 2008
    Date of Patent: January 17, 2012
    Assignee: DENSO CORPORATION
    Inventors: Yasuyuki Okuda, Makiko Sugiura, Kenji Fukumura, Takahiko Yoshida, Tetsuo Fujii
  • Publication number: 20120007471
    Abstract: Ultrasound transducers and methods of making ultrasound transducers with improved thermal characteristics are provided. An ultrasound transducer can include: a backing, a piezoelectric element attached to the backing, a first matching layer attached to the piezoelectric element, and a second matching layer attached to the first matching layer. The first matching layer can comprise metal and can have a thermal conductivity of about greater than 30 W/mK. The second matching layer can have a thermal conductivity of about 0.5-300 W/mK. The first matching layer can have an acoustic impedance of about 10-20 MRayl, and the second matching layer can have a lower acoustic impedance. The first matching layer can be thicker than the second matching layer. The ultrasound transducer can include a lens and a matching layer disposed between the piezoelectric element and the lens can be configured to conduct heat from the piezoelectric element to the backing.
    Type: Application
    Filed: July 9, 2010
    Publication date: January 12, 2012
    Applicant: GENERAL ELECTRIC COMPANY
    Inventor: Alan Chi-Chung Tai
  • Publication number: 20120004555
    Abstract: Provided is a stretching method of an organic piezoelectric material which sequentially performs a primary stretching step for carrying out primary stretching of an organic piezoelectric material which has not been stretched, a heat treatment step for heat treating the organic piezoelectric material subjected to primary stretching, and a cooling step for carrying out secondary stretching of the heat treated organic piezoelectric material while the organic piezoelectric material is cooled down to the room temperature, and is characterized in that tension is applied continuously to the organic piezoelectric material from the primary stretching step to the cooling step without releasing the tension, and heat treatment is carried out while keeping the tension in a range of 0.1-500 kPa.
    Type: Application
    Filed: March 5, 2010
    Publication date: January 5, 2012
    Applicant: Konica Minolta Medical & Graphic, Inc.
    Inventors: Kenji Ohnuma, Hiromi Akahori, Yuichi Nishikubo
  • Patent number: 8089198
    Abstract: A full range loudspeaker, comprising a frame with a membrane secured onto said frame and a piezoelectric actuator attached on said membrane and able to be driven over the full audible frequency range.
    Type: Grant
    Filed: April 4, 2007
    Date of Patent: January 3, 2012
    Assignee: Vibration-X, Inc.
    Inventor: Emanuele Bianchini
  • Publication number: 20110316387
    Abstract: An aspect of one embodiment, there is provided an ultrasonic transducer including a plurality of oscillators, each of the oscillator having a convex portion, a printed wiring board provided to be opposed to the convex portion, an adhesive material including at least a portion of the convex portion, the adhesive material joining the oscillator and the printed wiring board, and a resin provided between the oscillator and the printed wiring board, the resin covering the convex portion and the adhesive material.
    Type: Application
    Filed: June 23, 2011
    Publication date: December 29, 2011
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Takashi TOGASAKI, Takeshi Miyagi, Satoru Asagiri, Michiko Ooishi
  • Publication number: 20110316388
    Abstract: An ultrasonic sensor is disclosed. The ultrasonic sensor includes a piezoelectric element and an acoustic matching member. The piezoelectric element is configured to detect ultrasonic wave transmitted from a transmitter and reflected by a detection target object located in a detection target space. The acoustic matching member is configured to conduct the received ultrasonic wave to the piezoelectric element. The piezo electric element is covered with the acoustic matching member including a principal oscillation portion and a supplement oscillation portion. Thickness of a part of the supplement oscillation portion, the part covering the piezoelectric element, is smaller than a predetermined thickness threshold.
    Type: Application
    Filed: June 28, 2011
    Publication date: December 29, 2011
    Applicants: NIPPON SOKEN, INC., DENSO CORPORATION
    Inventors: Keiko Akiyama, Mitsuyasu Matsuura, Toshiki Isogai, Makiko Sugiura
  • Patent number: 8084922
    Abstract: A technology is disclosed which provides an array scanning type ultrasound probe capable of preventing a diminution of ultrasound of a piezoelectric device at the time of transmission and at the time of reception due to its damage and thereby reducing a sensitivity deterioration of a diagnostic image. According to the technology, included are an electroacoustic conversion unit formed by arranging multiple piezoelectric devices and multiple acoustic matching layers in a predetermined direction, each of the multiple piezoelectric devices being an electroacoustic conversion device, the multiple acoustic matching layers being respectively stacked on the multiple piezoelectric devices; and a signal flexible board transferring electric signals to be transmitted to and received from the multiple piezoelectric devices.
    Type: Grant
    Filed: July 31, 2008
    Date of Patent: December 27, 2011
    Assignee: Panasonic Corporation
    Inventors: Hirokazu Fukase, Kouji Ooura
  • Patent number: 8084923
    Abstract: An ultrasound transducer includes an array of PZT elements mounted on a non-recessed distal surface of a backing block. Between each element and the backing block is a conductive region formed as a portion of a metallic layer sputtered onto the distal surface. Traces on a longitudinally extending circuit board—preferably, a substantially rigid printed circuit board, which may be embedded within the block—connect the conductive region, and thus the PZT element, with any conventional external ultrasound imaging system. A substantially “T” or “inverted-L” shaped electrode is thereby formed for each element, with no need for soldering. At least one longitudinally extending metallic member mounted on a respective lateral surface of the backing block forms a heat sink and a common electrical ground. A thermally and electrically conductive layer, such as of foil, transfers heat from at least one matching layer mounted on the elements to the metallic member.
    Type: Grant
    Filed: September 7, 2010
    Date of Patent: December 27, 2011
    Assignee: MR Holdings (HK) Limited
    Inventor: Xiaocong Guo
  • Patent number: 8076824
    Abstract: An electronic radial ultrasonic probe comprising an electronic radial array which comprises a plurality of ultrasonic transducers being continuously arrayed circularly around an insertion axis as center and also for which a transmission/reception of an ultrasonic wave is controlled by electronically selecting the plurality of ultrasonic transducer, comprises: a support member equipped on the electronic radial array; a lock member featured with a cavity in which the support member is inserted and with a lock groove for locking a balloon which is mounted in a manner to cover the electronic radial array and in which an ultrasonic medium is filled; and a filler member which is constituted by an adhesive material converting from a fluid state to a solid state, and is filled in the cavity.
    Type: Grant
    Filed: May 18, 2011
    Date of Patent: December 13, 2011
    Assignee: Olympus Medical Systems Corp.
    Inventors: Yukihiko Sawada, Akiko Mizunuma, Katsuhiro Wakabayashi, Takuya Imahashi, Sunao Sato
  • Publication number: 20110291525
    Abstract: A vibration element includes a substrate, a piezoelectric element including a piezoelectric layer and an electrode layer, and a bonding layer provided between the piezoelectric element and the substrate and comprising ceramic containing melted glass powder, wherein the vibration element causes the substrate to vibrate by vibration energy of the piezoelectric element to output the vibration energy of the substrate, and the piezoelectric element is fixed to the substrate via the bonding layer.
    Type: Application
    Filed: May 27, 2011
    Publication date: December 1, 2011
    Applicant: CANON KABUSHIKI KAISHA
    Inventor: Yutaka Maruyama
  • Patent number: 8067877
    Abstract: An anti-EMI ultrasonic transducer has a conductive casing, a piezoelectric ceramic board having an opening, a conductive shelter, a first and second wires and an encapsulation. A first electrode face of the piezoelectric ceramic board faces to the opening and a second electrode face is mounted inside the conductive casing. The conductive shelter is mounted inside the conductive casing or covered to the opening, so the piezoelectric ceramic board is encapsulated in the conductive shelter and the conductive casing. Since the second signal wire is connected to the conductive shelter mounted inside the conductive casing, the conductive shelter and the conductive casing and the second electrode face of the piezoelectric ceramic board are commonly electronically connected to a voltage signal transmitted by the second signal wire. Therefore, the conductive shelter and the conductive casing are constituted to an EMI shelter for the piezoelectric ceramic board to resist external EMI signal.
    Type: Grant
    Filed: November 12, 2009
    Date of Patent: November 29, 2011
    Inventor: Shih-Hsiung Li
  • Publication number: 20110285249
    Abstract: Provided is a piezoelectric sound generating device capable of obtaining a stable connection state of lead-out conductors constituted of a conductive resin layer. A piezoelectric sound generating device 10, wherein lead-out conductors 18a, 18b are so flatly formed as to extend from surface electrodes 11a, 11b1 of a piezoelectric element 11 exposed to first openings 13a1, 13b1 to terminal electrodes 15a, 15b of a terminal portion 15 exposed to second openings 13a2, 13b2 on one main surface side of a diaphragm 12, respectively. As a result, the surface electrode 11a1 of the piezoelectric element 11 and the terminal electrode 15a of the terminal portion 15, and also the surface electrode 11b1 and a surface electrode 11c of the piezoelectric element 11, and the terminal electrode 15b of the terminal portion 15 are conductively connected. Hence, poor connection caused by cracks or the like is not likely to occur in the lead-out conductors.
    Type: Application
    Filed: January 26, 2010
    Publication date: November 24, 2011
    Applicant: TAIYO YUDEN CO., LTD.
    Inventors: Shigeo Ishii, Norikazu Sashida, Yoshiyuki Watanabe
  • Patent number: 8063540
    Abstract: A design and a manufacturing method of ultrasound transducers based on films of ferro-electric ceramic material is presented, the transducers being particularly useful for operating at frequencies above 10 MHz. The manufacturing technique can involve tape-casting of the ceramic films, deposition of the ceramic films onto a substrate with thick film printing, sol-gel, or other deposition techniques, where manufacturing methods for load matching layers and composite ceramic layers are described. The designs also involve acoustic load matching layers that provide particularly wide bandwidth of the transducers, and also multi-band operation of the transducers. The basic designs can be used for elements in a transducer array, that provides the frequency characteristics of the single element transducers, for array steering of the focus and possibly also direction of a pulsed ultrasound beam at high frequencies and multi-band frequencies.
    Type: Grant
    Filed: March 8, 2005
    Date of Patent: November 22, 2011
    Assignee: Emantec AS
    Inventors: Bjørn A. J. Angelsen, Tonni F. Johansen, Helge Kristiansen
  • Patent number: 8058776
    Abstract: A system for use in material testing which can be used on non-planar shapes and which is simple and inexpensive in construction. The system includes a layer of piezoelectric material sandwiched between and connected to a unified electrode and a plurality of excitable electrodes; and a structure, such as a Faraday structure-like unit which prevents electric or static fields from getting into or out of the structure and controls voltage potentials contained therein to be uniform, enclosing the ultrasonic transducer unit, and functions by maintaining a voltage potential on the electrodes and the piezoelectric material then pulling to the reference potential selected electrodes to generate a signal which excites the piezoelectric material so it generates a corresponding signal and then measuring the return signal generated by the piezoelectric material in response to a return signal from material being tested in response to the signal generated by the piezoelectric material.
    Type: Grant
    Filed: April 17, 2008
    Date of Patent: November 15, 2011
    Inventors: William Gordon Gibson, Curtis M. Figley, Darin Hunt
  • Publication number: 20110273059
    Abstract: A transducer with triangular cross-sectional shaped pillars is described for suppressing lateral modes within a composite, and a method for producing the same. According to one aspect of the present application, a plurality of triangular cross-sectional shaped pillars extends outwardly from a substrate and form an array of pillars. The resulting array of pillars is configured to suppress the lateral modes of the transducer at higher operating frequencies, such as, at or above 15 MHz, at or above 20 MHz, or at or above 30 MHz.
    Type: Application
    Filed: December 8, 2010
    Publication date: November 10, 2011
    Inventors: Jeremy Brown, F. Stuart Foster, Jianhua Yin
  • Patent number: 8035277
    Abstract: According to an exemplary embodiment, a method of forming a multi-layer electrode for growing a piezoelectric layer thereon includes a step of forming a high conductivity metal layer over a substrate. The method further includes a step of forming a seed layer over the high conductivity metal layer. The method further includes a step of forming a high density metal layer over the seed layer. The method further includes a step of forming a piezoelectric layer over the high density metal layer. The high conductivity metal layer, the seed layer, and the high density metal layer form the multi-layer electrode on which the piezoelectric layer is grown.
    Type: Grant
    Filed: August 1, 2008
    Date of Patent: October 11, 2011
    Assignee: Avago Technologies Wireless IP (Singapore) Pte.Ltd.
    Inventors: Bradley P. Barber, Craig E. Carpenter, Paul P. Gehlert, Christopher F. Shepard
  • Patent number: 8035278
    Abstract: A plurality of piezoelectric elements are arrayed two-dimensionally. A plurality of electrodes are respectively formed on the plurality of piezoelectric elements. A plurality of non-conductive members have columnar shape and are arranged on the plurality of electrodes. A plurality of internal metal layers are respectively provided for the plurality of non-conductive members. The internal metal layers reach from arrangement surfaces of the non-conductive members to other surfaces of the non-conductive members. The arrangement surfaces are opposite to the other surfaces.
    Type: Grant
    Filed: November 20, 2008
    Date of Patent: October 11, 2011
    Assignees: Kabushiki Kaisha Toshiba, Toshiba Medical Systems Corporation
    Inventors: Hiroyuki Shikata, Takashi Takeuchi
  • Patent number: 8030824
    Abstract: A third matching layer (140) affording wide bandwidth for an ultrasound matrix probe is made of polyethylene, and may extend downwardly to surround the array (S360) and attach to the housing to seal the array (S370).
    Type: Grant
    Filed: July 19, 2006
    Date of Patent: October 4, 2011
    Assignee: Koninklijke Philips Electronics N.V.
    Inventors: Heather Knowles, William Ossmann, Martha Wilson
  • Patent number: 8022595
    Abstract: A composite acoustic wave device provides improved protection from environmental factors while maintaining high electrical characteristics and dynamic range is provided. The device comprises a rigid protector plate having high quality acoustical characteristics and a thickness which is a multiple of half wavelength of the resonant frequency. A piezoelectric plate is coupled to the protector plate, is supported therefrom, and forms an energy interface therewith. The piezoelectric and protector plates are dimensioned such that a wave of resonant frequency traveling between the excitation face and the loaded/sensing face, forms a substantially continuous-phase wave, at substantially peak amplitude, at the energy interface. By doing so the device decouples the electrical thickness of the wave device from the mechanical thickness thereof.
    Type: Grant
    Filed: September 2, 2008
    Date of Patent: September 20, 2011
    Assignee: Delaware Capital Formation, Inc.
    Inventors: Jeffrey C Andle, Reichl B Haskell
  • Publication number: 20110221308
    Abstract: A method for gluing components is provided, forming an adhesive layer which is capable of functioning, at least in a temperature range of ?100° C. to ?160° C., wherein the adhesive layer is obtained from a curable reactive resin system. The reactive resin system includes an epoxy resin component and polymer particles dispersed in the epoxy resin component, the dispersed polymer particles furthermore including addition-crosslinked silicone elastomer. Also provided is the use of a reactive resin system for gluing piezoelectric ceramics and/or permanent magnets including rare earth elements and a component configuration including a piezoelectric ceramic, an impedance matching layer and an adhesive layer in contact with the piezoelectric ceramic and the impedance matching layer.
    Type: Application
    Filed: August 21, 2009
    Publication date: September 15, 2011
    Inventors: Roland Mueller, Irene Jennrich, Gerhard Hueftle, Patrick Stihler
  • Publication number: 20110218594
    Abstract: A piezoelectric element within an external ultrasonic transducer assembly can be used for wireless communication of data between an implantable device and the external ultrasonic transducer assembly such as using ultrasonic energy coupled to a flexible portion of a housing of the transducer assembly. The flexible portion can be configured to contact skin of a body containing the implantable device. The transducer assembly can be configured to respectively transmit or receive ultrasonic energy using at least partially overlapping respective ranges of resonant frequencies.
    Type: Application
    Filed: March 2, 2011
    Publication date: September 8, 2011
    Inventors: Eyal Doron, Bin Mi, Abhi V. Chavan, Keith R. Maile
  • Publication number: 20110215677
    Abstract: A piezoelectric composite micromachined ultrasound transducer including single and multilayer 1-D and 2-D arrays having through-wafer-vias (TWVs) that significantly decreased electrical impedance per element, and hence the improved electrical impedance matching to T/R electronics and improved signal to noise ratio is disclosed. The TWVs facilitate integrated interconnection in single element transducers (positive and negative contact on the same side) and array transducers (contact pads array for integration with T/R switches and/or pre-amplifier circuits).
    Type: Application
    Filed: April 8, 2011
    Publication date: September 8, 2011
    Applicant: TRS TECHNOLOGIES, INC.
    Inventors: Xiaoning JIANG, Wesley S. HACKENBERGER, Kevin A. SNOOK
  • Patent number: 8014231
    Abstract: A capacitive membrane is used as a digital sensor. Membranes act as binary devices, such as being in a collapsed or non-collapsed state. By providing drum heads (membranes and associated gaps) with different response characteristics, the drum heads of an element digitally indicate the amplitude of the acoustic force by which of the drum heads are triggered or change states. The digital transducer may be used for different types of sensors, such as a CMUT, an air pressure, a temperature, a humidity, a chemical or biological stimulus or other sensor.
    Type: Grant
    Filed: September 25, 2008
    Date of Patent: September 6, 2011
    Assignee: Siemens Medical Solutions USA, Inc.
    Inventors: Nelson H. Oliver, Worth B. Walters
  • Patent number: 8006358
    Abstract: A method for manufacturing a piezoelectric actuator, the method comprising: co-extruding alternating strips of a high permittivity material and a low permittivity material to form a green tape comprising said alternating strips of said high permittivity material and said low permittivity material; cutting said green tape to form a plurality of sheets, each sheet comprising a high permittivity region and at least two low permittivity regions adjacent to the high permittivity region; applying at least one conductive region to each one of two or more of the sheets to overly the high permittivity region and to leave exposed at least one low permittivity region; and stacking a plurality of sheets to form an actuator stack comprising adjacent sheets, wherein the or each conductive region on each sheet is offset with respect to a conductive region on a different sheet within the actuator stack.
    Type: Grant
    Filed: January 30, 2008
    Date of Patent: August 30, 2011
    Assignee: Delphi Technologies Holding S.arl
    Inventors: Michael Peter Cooke, Christopher Andrew Goat
  • Patent number: 8008842
    Abstract: A piezoelectric composite micromachined ultrasound transducer including single and multilayer 1-D and 2-D arrays having through-wafer-vias (TWVs) that significantly decreased electrical impedance per element, and hence the improved electrical impedance matching to T/R electronics and improved signal to noise ratio is disclosed. The TWVs facilitate integrated interconnection in single element transducers (positive and negative contact on the same side) and array transducers (contact pads array for integration with T/R switches and/or pre-amplifier circuits).
    Type: Grant
    Filed: October 27, 2008
    Date of Patent: August 30, 2011
    Assignee: TRS Technologies, Inc.
    Inventors: Xiaoning Jiang, Wesley S. Hackenberger, Kevin A. Snook
  • Patent number: 8004156
    Abstract: A thermoacoustic array energy converter consists of heat driven thermoacoustic prime movers in parallel coupled by means of an acoustic cavity to a piezoelectric electrical generator whose output is rectified and fed to an energy storage element. The prime movers convert heat to sound in a resonator. The sound form a phase-locked array is converted to electricity by means of the piezoelectric element. The generated electric energy is converted to DC by means of a rectifier set and it is then stored in a battery or supercapacitor. The generated electric energy can also be converted to power line frequency.
    Type: Grant
    Filed: January 23, 2008
    Date of Patent: August 23, 2011
    Assignee: University of Utah Research Foundation
    Inventors: Orest G. Symko, Young S. Kwon
  • Publication number: 20110198968
    Abstract: An array-type ultrasonic vibrator according to the present invention has an acoustic matching layer that has a plate-like body made of a material having a lower acoustic impedance than a plurality of piezoelectric elements. Signal wiring is formed on the plate-like body of the acoustic matching layer. Accordingly, for this array-type ultrasonic vibrator, the signal wiring can be easily formed without using additional components.
    Type: Application
    Filed: August 21, 2009
    Publication date: August 18, 2011
    Applicant: Konica Minolta Medical & Graphic, Inc.
    Inventors: Kazuchika Sato, Satoru Hirose, Masaki Asano
  • Patent number: 7998072
    Abstract: Methods, systems and probes communicate signals from a transducer for imaging or connection with an imaging system. Beamforming-related electronics are positioned in the connector housing of the transducer probe assembly. For example, analog-to-digital converters are positioned in the connector housing. Power is provided through connection with the ultrasound imaging system. Fans or other heat-dissipating structures are also positioned within the connector housing. Other beamformer electronics, such as delays and sums, are positioned in the imaging system, partly in the connector housing or entirely in the connector housing. Since the analog-to-digital converters are provided in the connector housing, partial digital beam forming may be provided in the transducer probe assembly. The length of the transducer cables is held constant to avoid interference and transmission line effects due to line-length variation.
    Type: Grant
    Filed: December 19, 2003
    Date of Patent: August 16, 2011
    Assignee: Siemens Medical Solutions USA, Inc.
    Inventors: Robert N. Phelps, John C. Lazenby, David A. Petersen