Abstract: An apparatus for performing a test on an integrated circuit device is provided. The apparatus includes a processor, at least one mounting portion configured to accommodate at least one integrated circuit device to be tested, and an interface configured to connect the processor to the at least one integrated circuit device to allow data transmission and reception therebetween. The processor is configured to transfer a heating traffic data pattern, which is configured to raise a temperature of the at least one integrated circuit device to a target temperature according to heating test conditions, to the at least one integrated circuit device via the interface.

Abstract: An electronic component handling apparatus that handles a DUT having a temperature detection circuit and presses the DUT against a socket electrically connected to a tester is provided. The electronic component includes: a temperature adjuster that adjusts a temperature of the DUT; a first receiver that receives a first signal from the tester, the first signal indicating a junction temperature of the DUT; a second receiver that receives a second signal from the tester, the second signal indicating a detection value of the temperature detection circuit; a first calculator that calculates the temperature of the DUT by using the first signal and the second signal; and a temperature controller that controls the temperature adjuster on the basis of a calculation result of the first calculator.

Abstract: A semiconductor manufacturing device has an upper cover configured to be arranged above top surface of unshielded semiconductor device which are mounted on a tray placed on a carrier to go through electromagnetic shielding, and a displacement detector configured to detect an abnormality when the upper cover is raised by at least one of the semiconductor device which is brought into contact with a bottom surface of the upper cover.

Abstract: Provided is a handler apparatus that conveys a device under test to a test socket, including: a socket fitting unit which the test socket fits, prior to fitting of a device holder holding the device under test to the test socket; a test-socket position detecting section that detects a relative position of the socket fitting unit with respect to the test socket in a state in which the socket fitting unit fits the test socket; an actuator that adjusts a position of the device under test on the device holder, based on the detected relative position of the socket fitting unit; and a conveyer that conveys the device holder in which the position of the device under test has been adjusted, to fit the test socket.

Abstract: A handler for conveying DUTs to a socket for a test that can reduce a test time includes: a test section including the socket; a heat applying section into which a tray having plural DUTs placed on its surface is conveyed and that controls the temperature of the DUTs to a predetermined test temperature and conveys the tray into the test section; and a device image capturing section that includes imaging elements arranged along a first direction the number of which is equal to DUTs arranged along the first direction and that in the heat applying section, captures images of the DUTs by moving the imaging elements relative to the surface of the tray in a second direction non-parallel with the first direction; and a position adjusting section that adjusts the positions of the DUTs relative to the socket based on their images captured by the device image capturing section.

Abstract: A semiconductor package transferring apparatus is disclosed. The apparatus includes a tray that includes a front side and a rear side opposite the front side, the rear side including a plurality of package covering portions that each correspond to the shape of a semiconductor package and that are arranged to align with corresponding package loading portions on a front side of another tray. Each package covering portion has a surface configured to cover a semiconductor chip disposed below the surface. The apparatus further includes an anti-attachment portion disposed on the surface of one or more of the package covering portions. For each package covering portion on which an anti-attachment portion is disposed, the anti-attachment portion protrudes beyond the surface of the package covering portion.

Abstract: An electronic component testing device includes a first imaging device for imaging an upper-surface electrode of an electronic component before the electronic component is held by a holding part, a second imaging device for imaging a contact terminal provided to a testing head, a third imaging device for imaging a lower-surface electrode of the electronic component held by the holding part, and a fourth imaging device for imaging a testing socket. A control device controls the position adjustment part of the testing head to adjust the position of the holding part, and thereby controlling, based on images captured by the first and second imaging devices, a holding orientation when the holding part holds the electronic component, and controlling, based on the images captured by the third and fourth imaging devices, a holding orientation of the holding part in relation to the testing socket.

Abstract: An electronic protection module adapted for an electronic device to protection information read and stored in a signal reading element. The electronic protection module includes a circuit board, a first loop, a cover, a first flexible circuit board with a second loop, a second flexible circuit board with a third loop, electrical conductor(s) and conductive element(s). When one of the first loop, second loop and the third loop is disconnected, the signal reading element will be disconnected and lose the information, thereby preventing information leak from the electronic device. The electronic device may be a card reader capable of reading a barcode type, magnetic strip type or chip type of a financial card, credit card or personal identity card.

Abstract: A probing apparatus includes a rotating device having a plurality of platforms for supporting DUTs, a probe device having a lifting stage movable between first and second positions, and a heating device mounted to the lifting stage so as to move along with it. The platforms are synchronously revolvable in a way that the platforms move to a test position sequentially The heating device is configured in a manner that when the lifting stage moves to the first position, the heating device is located away from the platform at the test position, and when the lifting stage moves to the second position, the heating device contacts and heats the platform at the test position. Therefore, the heating device and the probe device are movable simultaneously for heating up the platform and testing the DUT respectively.

Abstract: A handling system for testing electronic components comprises a rotary turret and pick heads mounted on the rotary turret, each pick head being configured to hold a respective electronic component provided by a supply source. A carrier system which is positionable adjacent to the rotary turret is configured to carry a plurality of electronic components. The carrier system is receivable by a testing station that is operative to simultaneously test a plurality of the electronic components which have been arranged on the carrier system. The pick heads or other transfer mechanism may transfer the electronic components onto the carrier system prior to testing the same at the testing station and remove electronic components from the carrier system after testing the same at the testing station.

Abstract: A semiconductor package test apparatus having a test head and a test handler is provided. The semiconductor package test apparatus may include an insert in which a plurality of semiconductor packages are stacked and received in an offset fashion. Further, the semiconductor package test apparatus may include a plurality of sockets located adjacent to the insert and each of the inserts may have a plurality of socket pins. The sockets have different surface levels and are aligned with the semiconductor packages.

Abstract: A handler for conveying DUTs to a socket for a test that can reduce a test time includes: a test section including the socket; a heat applying section into which a tray having plural DUTs placed on its surface is conveyed and that controls the temperature of the DUTs to a predetermined test temperature and conveys the tray into the test section; and a device image capturing section that includes imaging elements arranged along a first direction the number of which is equal to DUTs arranged along the first direction and that in the heat applying section, captures images of the DUTs by moving the imaging elements relative to the surface of the tray in a second direction non-parallel with the first direction; and a position adjusting section that adjusts the positions of the DUTs relative to the socket based on their images captured by the device image capturing section.

Abstract: The invention provides a handler and a method for testing the same. The handler comprises a sorter and a testing module. The testing module further comprises a signal generator, a sensor, and a signal comparator. The signal generator generates and sends out a first handling signal. The sorter receives the first handling signal and correspondingly places a first electronic component on a first region according to the first handling signal. The sensor senses the first electronic component on the first region, and then correspondingly generates and sends out a second handling signal. The signal comparator is electrically connected to the sensor and the signal generator, and receives the first handling signal and the second handling signal. The signal comparator determines whether the first handling signal is equivalent to the second handling signal, and correspondingly sends out a comparing signal.

Abstract: In a side-docking type test handler, a descending mechanism lowers a horizontally postured test tray, which has been transferred into a soak chamber, down to a descent finish position and a vertical posture changing mechanism changes the posture of the test tray, which has been lowered to the descent finish position, from the horizontal state to a vertical state, to transfer the test tray into a test chamber. Further, a horizontal posture changing mechanism changes the posture of the test tray in the test chamber from the vertical state to the horizontal state while transferring the test tray to an ascent start position in a desoak chamber.

Abstract: A handler for electronic components, in particular IC's, for controlling the temperature of the components and supplying and removing said components to and from a test device has circulating units that can be moved along a circulating track. Each unit has at least one retaining unit for retaining a component. In addition, the circulating units have temperature-control chambers containing components that are retained by the retaining units, so that the temperature of the components can be controlled during transport from the charging station to the test station.

Abstract: When a test handler loads semiconductor devices of user trays onto a test tray, the test handler adjusts a front/rear pitch or a right/left pitch between the semiconductor devices, adjusts the right/left pitch or the front/rear pitch, and loads the semiconductor devices. The test handler can sequentially adjust individually the front/rear pitch and the right/left pitch between the semiconductor devices, thereby reducing the apparatus weight and the loading time.