Abstract: An integrated circuit includes a saw-tooth generator including a saw tooth node configured to have a saw-tooth voltage generated thereon; and a first switch having a first end connected to the saw tooth node. The integrated circuit further includes a second switch coupled between an output node and an electrical ground, wherein the first switch and the second switch are configured to operate synchronously. A first current source is connected to the saw tooth node. A second current source is connected to the output node.

Abstract: A reconfigurable number of at-speed pulses and reconfigurable dead cycles between pulses is utilized to enhance test coverage of an Integrated Circuit. A reconfigurable number of programmable at-speed phase-locked loop clock pulses without a dead cycle is emitted through an integrated circuit. Further, a plurality of programmable at-speed phase-locked loop clock pulses is emitted through the Integrated Circuit such that a reconfigurable number of dead cycles is between the plurality of programmable at-speed phase locked loop clock pulses. In addition, data associated with the reconfigurable number of programmable at-speed phase-locked loop clock pulses is capture. Finally, data associated with the reconfigurable number of dead cycles is captured.

Abstract: The present disclosure relates to radio frequency integrated circuits. More particularly, systems, devices and methods related to field programmable, software implemented, radio frequency integrated circuits are disclosed. In accordance with an exemplary embodiment, a field programmable, software implemented, radio frequency integrated circuit may comprise a high frequency IF embodiment. An input signal may be up converted to a high frequency, such as 60 GHz. Next, the amplitude and/or phase may be adjusted as desired. Subsequently, the signal may be down converted.

Abstract: A power distribution system for integrated circuits includes methods to damp resonance between a bypass capacitor network and a power/ground cavity of the printed circuit board that (a) does not require excessive quantities of bypass/damping components or (b) does not require high plane cavity capacitance or in the alternative can insure a Q of less than 1.4 at the transition from the bypass network to the plane cavity impedance cross-over.

Abstract: Through silicon vias (TSVs) in a stacked multi-die integrated circuit package are controlled to assume different connection configurations as desired during field operation of the package in its normal mission mode. TSV connections may be reconfigured to connect an affected die in a manner different from, for example, a factory default connection of that die. TSV connections to the inputs and/or outputs of a die's native circuitry may be changed. A die may be disconnected altogether from an interface that interconnects dice in the stack, or a die that was originally disconnected from such an interface may be connected to the interface.

Abstract: A logic signal isolator comprising a transformer having a primary winding and a secondary winding; a transmitter circuit which drives said primary winding in response to a received logic signal, such that in response to a first type of edge in the logic signal, a signal of a first predetermined type is supplied to the primary winding and in response to a second type of edge in the logic signal, a signal of a second predetermined type is supplied to said primary winding, the primary winding and the transmitter being referenced to a first ground; and the secondary winding being referenced to a second ground which is galvanically isolated from the first ground and said secondary winding supplying to a receiver circuit signals received in correspondence to the signals provided to the primary winding, the receiver reconstructing the received logic signal from the received signals.

Abstract: A semiconductor packaging system has a packaging substrate into which inductors and/or capacitors are partially or completely embedded. An active portion of a voltage regulator is mounted on the packaging substrate and supplies regulated voltage to a die also mounted on the packaging substrate. Alternatively, the active portion of the voltage regulator is integrated into the die the voltage regulator supplies voltage to. The voltage regulator cooperates with the inductors and/or capacitors to supply voltage to the die. The inductors may be through vias in the packaging substrate. For additional inductance, through vias in a printed circuit board on which the packaging substrate is mounted may couple to the through vias in the packaging substrate.

Abstract: A configurable processor architecture uses a common simulation database for multiple processor configurations to reduce the cost of producing customized processor configurations. An unchanging core portion is used in each processor configuration. To support different memory modules, identification signals are provided from the memory modules or an identification module to configure the core portion.

Abstract: An integrated circuit combination, comprising first and second integrated circuit dies with respective first and second control register banks, and a path for external control data, within said combination, coupling a first data interface on said first die, which receives the external control data, to the first and second control register banks.

Abstract: A method of forming an integrated circuit includes providing a first design of the integrated circuit; analyzing the first design to identify a first flip-flop having setup/hold violations and a second flip-flop not having setup/hold violations; and replacing the first flip-flop with a third flip-flop having a substantially same cell delay as the first flip-flop to form a second design of the integrated circuit. The first flip-flop and the third flip-flop have different setup and hold windows.

Abstract: A high performance, power integrated circuit composed of two charge balanced, extended drain NMOS transistors (CBDEMOS) formed on an n-substrate. A CBDENMOS transistor with an n-type substrate source. A charge balanced channel diode (CBCD) with an n-type substrate. A process for forming a high performance, power integrated circuit composed of two CBDENMOS transistors formed on an n-substrate. A process for forming a power integrated circuit composed of one CBDENMOS transistor and one CBCD on an n-type substrate.

Abstract: A semiconductor device is provided which includes: a first semiconductor integrated circuit; a ground line and a power supply line trough which electric power is supplied to the first semiconductor integrated circuit; and a variable impedance component which is connected between the ground line and the power supply line.

Abstract: Techniques for forming a first electronic circuit including a plurality of instances of a repeatable circuit element include the steps of: obtaining a total number of instances of the repeatable circuit element in a design of an IC including the first electronic circuit and at least a second electronic circuit; and configuring at least one functional parameter of the first electronic circuit as a function of the total number of instances of the repeatable circuit element in the IC to thereby satisfy a prescribed minimum composite manufacturing yield of the IC and/or at least one specification of the IC under prescribed operating conditions.

Abstract: A field transistor is divided into a number of cells (6) and includes a separate first gate line (20) connected to first transistor cells (8) and a separate second gate line (22) connected to second transistor cells (10). A drive circuit is used to drive all the cells (6) in a normal, saturated operations state but to drive only the second cells (10) in a linear operations state to reduce the number of cells used in the linear operations state.

Abstract: An integrated circuit and a method for operating an integrated circuit is disclosed. One embodiment provides a semi-conductor component, an electronic system, and a method for operating an integrated circuit. A method for operating an integrated circuit provides applying a voltage to a line or a connection in accordance with data to be input. A current is applied to the line or the connection in accordance with data to be output.

Abstract: Embodiments may include a data receiver having input for a current signal. The data receiver may further include a current generator to generate a reference current for comparison against the input current signal. The data receiver may also include a data converter having an input coupled to an intermediate node of the data receiver, the data converter comprising a plurality of cascaded stages with intermediate nodes among the stages.

Abstract: A semiconductor device includes a substrate, a first internal terminal, a second internal terminal, a third internal terminal, and a fourth internal terminal which are placed along perimeter of the substrate, a circuit formed above the substrate and coupled to the first internal terminal, a first external terminal coupled to the second internal terminal, a second external terminal coupled to the third internal terminal, and a third external terminal coupled to the fourth internal terminal and placed beside one side of the substrate where the second external terminal is located, wherein the circuit generates a signal indicative of a connection state between the first internal terminal and the first external terminal, and wherein the first internal terminal and the second internal terminal are arranged to form two rows in a direction perpendicular to one side of the substrate beside which the first external terminal is placed.

Abstract: A circuit is constituted by a plurality of n-channel-type transistors, the circuit including: among the plurality of transistors, a transistor including a drain terminal for receiving a voltage of VDD, a source terminal, and a gate terminal for receiving an input signal; among the plurality of transistors, a transistor including a drain terminal for receiving the voltage of VDD, a source terminal connected to an output terminal, and a gate terminal connected to the source terminal of the transistor; and a capacitor provided between a node and a clock terminal for receiving a clock signal. In at least one embodiment, the clock signal inputted into the clock terminal has a frequency higher than that of an output signal outputted from the output terminal.

Abstract: A semiconductor integrated circuit has a plurality of clock tree cells arranged in a tree structure on clock signal lines transmitting a clock signal, the plurality of clock tree cells forming a clock tree. The clock tree cells include first power supply lines connected to the clock tree cells, second power supply lines connected to logic circuits receiving a clock signal supplied from the clock tree, and a plurality of power supply pads connected to the first power supply lines and the second power supply lines.

Abstract: A semiconductor device includes: a first transistor having a control electrode coupled to an input node receiving a signal synchronized with a clock, a first conductive electrode coupled to an output node, and a second conductive electrode; a second transistor having a control electrode coupled to the input node, a first conductive electrode coupled to the output node, and a second conductive electrode coupled to a power supply node; and a first switch element connected between the power supply node and the second conductive electrode of the second transistor and turned on and off based on a first control signal indicating a detection result of a frequency of the clock.

Abstract: Radio frequency identification (RFID) tags and processes for manufacturing the same. The RFID device generally includes (1) a metal antenna and/or inductor; (2) a dielectric layer thereon, to support and insulate integrated circuitry from the metal antenna and/or inductor; (3) a plurality of diodes and a plurality of transistors on the dielectric layer, the diodes having at least one layer in common with the transistors; and (4) a plurality of capacitors in electrical communication with the metal antenna and/or inductor and at least some of the diodes, the plurality of capacitors having at least one layer in common with the plurality of diodes and/or with contacts to the diodes and transistors. The method preferably integrates liquid silicon-containing ink deposition into a cost effective, integrated manufacturing process for the manufacture of RFID circuits. Furthermore, the present RFID tags generally provide higher performance (e.g.

Abstract: A logic signal isolator including a micro-transformer with a primary winding and a secondary winding. A transmitter circuit drives the primary winding in response to a received input logic signal such that, in response to a first type of edge in the logic signal, at least a first amplitude signal is supplied to the primary winding and, in response to a second type of edge in the logic signal, a second different amplitude signal is supplied to the primary winding. A receiver circuit receives corresponding first amplitude and second amplitude signals from the secondary winding and reconstructs the received logic input signal from the received signals.

Abstract: An integrated circuit is partitioned into two or more sub-circuits, each sub-circuit including two supply terminals across which to receive supply voltage. The sub-circuits are connected in series with the first sub-circuit receiving input voltage at its first supply terminal, and the voltage level output at the second supply terminal of the first sub-circuit being used as input voltage level in a second sub-circuit. Further, a control-circuit is configured to balance voltage drops across the sub-circuits and to maintain constant voltage-drops over the sub-circuits. The control-circuit includes two buffer capacitors, each coupled in parallel over one of the two sub-circuits respectively. The control-circuit also includes at least one bucket capacitor alternately coupled in parallel over the first and the second buffer capacitor through a switching system controlled by a toggling signal.

Abstract: In a fingerprint apparatus, fingerprint sensing members disposed on a silicon substrate detect skin textures of a finger placed thereon to generate electric signals. A set of integrated circuits formed on the substrate processes the electric signals. First bonding pads are disposed on the substrate and electrically connected to the set of integrated circuits. A first insulating layer is disposed below the first bonding pads. Metal plugs penetrating through the substrate are respectively electrically connected to the first bonding pads. A second insulating layer is formed on the substrate and between the metal plugs and the substrate. Second bonding pads are formed on a rear side of the second insulating layer, and are respectively electrically connected to the first bonding pads through the metal plugs. The protection layer is disposed on the substrate and covers the sensing members to form a flat touch surface to be touched by the finger.

Abstract: A logic signal isolator comprising a transformer having a primary winding and a secondary winding; a transmitter circuit which drives said primary winding in response to a received logic signal, such that in response to a first type of edge in the logic signal, a signal of a first predetermined type is supplied to the primary winding and in response to a second type of edge in the logic signal, a signal of a second predetermined type is supplied to said primary winding, the primary winding and the transmitter being referenced to a first ground; and the secondary winding being referenced to a second ground which is galvanically isolated from the first ground and said secondary winding supplying to a receiver circuit signals received in correspondence to the signals provided to the primary winding, the receiver reconstructing the received logic signal from the received signals.

Abstract: An object is to provide a semiconductor device which operates normally even when the communication distance is extremely short, while the maximum communication distance is maintained, and which can make amplitude of a response waveform large even when a large amount of electric power is supplied to the semiconductor device and a protection circuit operates. The object is achieved with a semiconductor device including a first modulation circuit and a second modulation circuit each of which performs load modulation by an input signal, a detection circuit which determines an output signal by electric power supplied externally, a protection circuit which is controlled by the output signal of the detection circuit, and a modulation selecting circuit which switches the first modulation circuit and the second modulation circuit depending on the output signal of the detection circuit.

Abstract: An integrated circuit with a rectifier element. One embodiment provides a signal source, an electronic circuit and a rectifier element with a copper layer and a cuprous oxide layer adjacent to and in direct contact with the copper layer. The signal source is configured to drive a signal on a signal output terminal that is electrically coupled to the copper layer. The electronic circuit is electrically coupled to the cuprous oxide layer. The rectifier element may be formed between wiring layers of an integrated circuit.

Abstract: A logic signal isolator comprising a transformer having a primary winding and a secondary winding; a transmitter circuit which drives said primary winding in response to a received logic signal, such that in response to a first type of edge in the logic signal, a signal of a first predetermined type is supplied to the primary winding and in response to a second type of edge in the logic signal, a signal of a second predetermined type is supplied to said primary winding, the primary winding and the transmitter being referenced to a first ground; and the secondary winding being referenced to a second ground which is galvanically isolated from the first ground and said secondary winding supplying to a receiver circuit signals received in correspondence to the signals provided to the primary winding, the receiver reconstructing the received logic signal from the received signals.

Abstract: Disclosed is a semiconductor device in which a circuit in the semiconductor chip is divided into a plurality of sub-circuits. The semiconductor device includes switches between the respective sub-circuits and a power supply, and a circuit that variably controls on-resistances of the switches 111 to 11N.

Abstract: The invention is directed to a method for clock distribution and VLSI circuits include a clock distribution network. In a method of the invention, a transmission lines are patterned as to connect a clock tree and a periodic waveform clock, preferably a sine waveform, is used to control clock skew, even at frequencies extending into the gigahertz range. In an exemplary embodiment of the invention, an overlay includes differential pairs of transmission lines that connect the drivers of a clock distribution tree. In preferred embodiments of the invention, an H-tree clock distribution scheme is overlayed with a spiral of transmission lines, each realized by a differential conductors and driven using a sinusoidal standing wave to distribute global clock signals into local regions of the chip. Each transmission line connects drivers in the H-tree that are at the same level of the H-tree.

Abstract: A circuit and a method for adjusting the performance of an integrated circuit, the method includes: comprising: (a) measuring the performance of a first monitor circuit having at least one field effect transistor (FET) of a first set of FETs, each FET of the first set of FETs having a designed first threshold voltage; (b) measuring the performance of a second monitor circuit having at least one field effect transistor (FET) of a second set of FETs, each FET of the second set of FETs having a designed second threshold voltage, the second threshold voltage different from the first threshold voltage; and (c) applying a bias voltage to wells of the FETs of the second set of FETs based on comparing a measured performance of the first and second monitor circuits to specified performances of the first and second monitor circuits.

Abstract: A semiconductor device includes a first pad, a second pad and a third pad. The first pad and the third pad are electrically connected to each other. The first pad and the second pad are used for bonding. The second pad and the third pad are used for probing. According to this structure, Small size semiconductor device having high reliability even after a probing test can be provided.

Abstract: In an embodiment, a circuit is disclosed comprising a circuit portion coupled to a terminal and a calibration circuit portion coupled to said terminal.

Abstract: A semiconductor integrated circuit includes a first input terminal configured to input a baseband signal, a second input terminal configured to input a local oscillation signal, an output terminal configured to output a modulating signal, a first amplifier circuit configured to receive the baseband signal through the first input terminal and to output a first amplified signal of the baseband signal, a 2-multiplying circuit configured to receive the local oscillation signal through the second input terminal and to output a 2-multiplied signal of the local oscillation signal, an adder configured to add the 2-multiplied signal and the first amplified signal and to output an addition signal, a second amplifier circuit configured to receive the addition signal and to output a second amplified signal of the addition signal, and a mixer configured to multiply the second amplified signal and the local oscillation signal and to output the modulating signal to the output terminal.

Abstract: A structure and method for reducing the effects of chip-package resonance in an integrated circuit assembly is described. A series RLC circuit is employed to reduce the output impedance of the power delivery system at the resonance frequency.

Abstract: A semiconductor device which may be used as an ID chip and data may be rewritten only one time. In addition, a semiconductor device may be used as an ID chip and data may be written except when manufacturing the chip. The invention has a modulating circuit, a demodulating circuit, a logic circuit, a memory circuit, and an antenna circuit over an insulating substrate. The modulating circuit and the demodulating circuit are electrically connected to an antenna circuit, the demodulating circuit is connected to the logic circuit, the memory circuit stores an output signal of the logic circuit, and the memory circuit is a fuse memory circuit using a fuse element.

Abstract: A method replaces a delay amount measurement in which an initially set value of a counter is determined by a technique which replaces measurement of a delay amount, whereby a time required for calibration of a delay circuit can be reduced. One counter set value of a plurality of counter set values is loaded, a delay lock loop circuit is switched to a lock mode, and a sequence circuit of a cycle slip detection circuit is reset. Thereafter, a cycle slip detection signal output from the sequence circuit is read, and on the basis of this cycle slip detection signal, it is judged whether or not an output signal of a delay circuit causes cycle slip. If the cycle slip is caused, the counter set value is switched. On the other hand, if any cycle slip is not caused, the counter set value is locked, thereby terminating the process.

Abstract: An integrated circuit arrangement is disclosed. In one embodiment, the integrated circuit arrangement includes an output circuit having at least one first output connection which can provide a data signal, at least one first data output connection; and at least one first inductance connected between the at least one first output connection and the at least one data output connection.

Abstract: In order to prevent a signal of a signal wiring from receiving a bad influence due to a power supply capacitor, provided is a semiconductor including a high reference potential terminal and a low reference potential terminal composing power supply voltage terminals; a first MOS capacitor in which a gate of a p-channel MOS field effect transistor is connected to the low reference potential terminal, and a source and a drain are connected to the high reference potential terminal; and a first signal wiring connected to the gate via a parasitic capacitor and a signal in the low reference potential is supplied at the time of starting the power supply.

Abstract: An integrated circuit for feeding data acquisition circuits is provided. The integrated circuit including an inverter application having a half-bridge driver for driving high and low side switches connected in a half bridge, a data acquisition circuit formed in monolithic high voltage technology, and a Low Voltage Floating Supply (LVFS) circuit for providing voltage to the data acquisition circuit, the LVFS circuit being formed in a floating n-epi pocket biased with a voltage that is lower than a maximum value of a voltage present in the n-epi pocket.

Abstract: A scan chain configuration and a control method for the same are provided, which are optimized for the leakage current reduction technique by a vector input in SoC in which many functional blocks are mounted. The semiconductor integrated circuit includes: plural power domains (Area1-AreaN) which have plural functional blocks; power switches (PSW1-PSWN) which can supply a power source for operation to the power domains; a scan chain provided for every power domain, and a memory unit (VEC) which supplies, to a scan chain, a vector to enable shifting to a low-leakage state. By re-coupling the scan chain only to a non-operating functional block, it is possible to perform shifting to a low-leakage state for a short time.

Abstract: A large-scale integrated circuit according to the present invention includes a plurality of functional blocks for independently performing a signal processing operation, and a selection controlling circuit for generating a first control signal to select one of the plurality of functional blocks, in which the selection controlling circuit includes a control signal generating circuit for generating a second control signal for stopping the operation of its circuit, and the selection controlling circuit generates the first and the second control signals by a command from a different control circuit.

Abstract: This invention relates to adaptively compensating for variations in integrated chip circuitry due to delays caused by multiple thresholds. The multi-threshold adaptive dynamic scaling system disclosed compensates for normal on-chip variations which affect system process and voltage variability, as well as overall performance. This system regulates a voltage control and provides high voltage thresholds, regular voltage thresholds, and low voltage thresholds to compensate for threshold voltage variations.

Abstract: Multi-chip package includes first through Nth semiconductor chips, each of which includes an input/output pad, an input/output driver coupled to the input/output pad, and an internal circuit. Each of the first through Nth semiconductor chips includes an internal pad for coupling the internal input/output driver and the internal circuit. The internal pads of the first through Nth semiconductor chips are coupled to each other such as via a common pad installed at a substrate. The input/output pad of the first semiconductor chip directly receives an input/output signal transmitted via a corresponding pin of the multi-chip package. The second through Nth semiconductor chips indirectly receive the input/output signal via the internal pads coupled to each other. The multi-chip package can improve signal compatibility by maintaining a parasitic load of a pin to at least the level of a single chip, when a signal is transmitted to the pin at high speed.

Abstract: A TV tuner consisting of a least one low-noise amplifier, one mixer and one variable-gain amplifier plus two band-pass filters, the first of which is placed after low-noise amplifier and before the mixer, and the second of which is placed after mixer and before variable-gain amplifier. The filters are on-chip active devices equipped with on-chip frequency- and Q-tuning systems. The first band-pass filter is a real filter, such that its frequency response is symmetrical for positive and negative frequencies. The second band-pass filter is a complex filter, such that its frequency response has transmission for positive frequencies, but blocks negative frequencies. The low-noise amplifier includes gain control. The mixer is a complex-mixer consisting of two identical mixers driven by two local oscillator signals in quadrature.

Abstract: Techniques are disclosed to select functional parameters and/or operating modes of a circuit based on a time measurement are disclosed. One example integrated circuit includes a threshold detection and timing circuit that is coupled to measure a signal during an initialization period of the integrated circuit from a multifunction capacitor that is to be coupled to a first terminal of the integrated circuit. A selection circuit is coupled to the threshold detection and timing circuit to select a parameter/mode of the integrated circuit in response to the measured signal from the multifunction capacitor during the initialization period of the integrated circuit. The multifunction capacitor is coupled to provide an additional function for the integrated circuit after the initialization period of the integrated circuit is complete.

Abstract: The invention provides a semiconductor integrated circuit of which malfunction caused by noise from outside is reduced. The semiconductor integrated circuit has a power supply terminal, a ground terminal, internal circuits supplied with a power supply potential and a ground potential from the power supply terminal and the ground terminal, output circuits, an exclusive ground wiring extending from the ground terminal, a first capacitor connected between the exclusive ground wiring and a power supply wiring, an exclusive power supply wiring extending from the power supply terminal, and a second capacitor connected between the exclusive power supply wiring and a ground wiring.

Abstract: In a functional mode, the functional core logic of a die is connected to the input and output pads and the die performs its intended function. In a bypass mode, the input and output buffers of the functional core logic are disabled and pad sites of corresponding position between a first set of opposite sides and between a second set of opposite sides are electrically connected. In bypass mode the die is transformed into a simple interconnect structure between the first sides and between the second sides. The interconnect structure includes plural conductors extending substantially parallel to one another between the first sides and further plural conductors extending substantially parallel to one another between the second sides. While in bypass mode, signals from a tester apparatus can flow through the conductors between the first sides and between the second sides to access and test a selected die on a wafer.

Abstract: There is provided a circuit for preventing latch-up in a DC-DC. The circuit for preventing a latch-up phenomenon in a DC-DC converter, the DC-DC converter having a first and a second DC-DC converters coupled with each other in one chip for receiving an input voltage to generate a positive voltage and a negative voltage, respectively, in which a parasitic block with a PNP transistor and an NPN transistor causing a latch-up phenomenon is embedded, the circuit includes a first pathway for controlling an input current flowing to the first DC-DC converter from an input terminal receiving the input voltage in order that the PNP transistor is turned on and the NPN transistor is not turned on; and a second pathway for supplying the input current to the first DC-DC converter intactly at a timing that both the positive and negative voltages reach target voltages.

Abstract: Method for wireless data interchange between circuit units within a package, and circuit arrangement for performing the method. The invention provides a circuit arrangement having circuit units (101a-101n) which are arranged in a package (100), a connecting device (200) for connecting the circuit units (101a-101n) to one another and for data interchange between the circuit units (101a-101n), and connection units (203) for connecting the circuit units to external circuit units and for supplying electrical power to the circuit arrangement, where data interchange between the circuit units (101a-101n) arranged within the package (100) is performed using electromagnetic waves which are transmitted by transmission units (201a-201n) and are received by reception units (202a-202n). The circuit units (101a-101n) arranged in the package (100) are in this case respectively equipped with the transmission units (201a-201n) and the reception units (202a-202n).