Abstract: A microwave harmonic processing circuit includes (n?1) parallel open ended stubs differing in length, connected in parallel to an output terminal of a serial transmission line at a single point, and having predetermined electrical lengths corresponding to second to higher n-th (n is any integer) harmonics, respectively, the serial transmission line having an input terminal connected to an output terminal of a transistor and having a predetermined electrical length; a first strip conductor connecting the serial transmission line to two parallel open ended stubs of the (n?1) parallel open ended stubs at a single connecting point; a second strip conductor connecting the (n?3) parallel open ended stubs to each other at a single connecting point; a ground layer disposed between first strip conductor and second strip conductor; and a via electrically connecting a connecting portion of first strip conductor and a connecting portion of second strip conductor.

Abstract: A power splitter and/or combiner is described. The power splitter may be provided as a broadband, passive, divide by N power splitter that may be advantageously employed in providing power to multiple electrodes within a plasma source. The power splitter comprises a transmission line and a plurality of N secondary windings arranged about the transmission lines.

Abstract: Disclosed is a substrate integrated waveguide coupler. The substrate integrated waveguide coupler according to the present invention includes: a substrate; an upper conducting plate applied to an upper portion of the substrate; a lower conducting plate applied to a lower portion of the substrate; two peripheral via holes disposed parallel to each other on both sides of the substrate, respectively, and being of a pipeline type electrically connecting the upper conducting plate and the lower conducting plate to each other; and an inner via hole disposed between the two peripheral via holes, and having a center thereof separated by a preset distance and forming a short slot functioning to couple input signals.

Abstract: A multi-octave power amplifier and related method provides an impedance matching unit configured to match impedances of a pair of balanced radio frequency (RF) signals applied thereto and output a pair of impedance-matched balanced RF signals, a converting unit configured to convert the pair of the impedance-matched balanced RF signals to an unbalanced RF signal and a compensation unit configured to compensate at least one rolled-off frequency component of the unbalanced RF signal and output a compensated RF signal.

Abstract: An easily bendable high-frequency signal transmission line includes a dielectric body including a protection layer and dielectric sheets laminated on each other, a surface and an undersurface. A signal line is a linear conductor disposed in the dielectric body. A ground conductor is disposed in the dielectric body, faces the signal line via the dielectric sheet, and continuously extends along the signal line. A ground conductor is disposed in the dielectric body, faces the ground conductor via the signal line sandwiched therebetween, and includes a plurality of openings arranged along the signal line. The surface of the dielectric body on the side of the ground conductor with respect to the signal line is in contact with a battery pack.

Abstract: An easily bendable high-frequency signal transmission line includes a dielectric body including a protection layer and dielectric sheets laminated on each other, a surface and an undersurface. A signal line is a linear conductor disposed in the dielectric body. A ground conductor is disposed in the dielectric body, faces the signal line via the dielectric sheet, and continuously extends along the signal line. A ground conductor is disposed in the dielectric body, faces the ground conductor via the signal line sandwiched therebetween, and includes a plurality of openings arranged along the signal line. The surface of the dielectric body on the side of the ground conductor with respect to the signal line is in contact with a battery pack.

Abstract: An antenna including a conductive loop having a first top surface portion, the conductive loop having a first edge portion interrupted by a gap defining a feed point, a conductive strip having a second top surface, the conductive loop lying in a plane defined by the second top surface, the conductive strip having a second edge portion extending between first and second opposing distal ends, the second edge portion being spaced from the first edge portion, and the second edge portion extending along the first edge portion at a substantially constant distance from the first edge portion, and wherein the conductive strip is electrically isolated from the conductive loop and is structurally configured and positioned relative to the conductive loop to adjust an input impedance of the conductive loop.

Abstract: A multimode frontend circuit of the present invention comprises two transmission paths. Each of the transmission paths comprises two input/output lines, a first transmission line having one end connected to one of the input/output lines and the other end connected to the other input/output line, a second transmission line connected to the one of the input/output lines and the other end connected to the other input/output line, and one or more termination switch circuits. The termination switch circuit or circuits comprise a switch having one end connected to one of the first and second transmission lines and a termination circuit connected to the other end of the switch. Each of the transmission lines may comprise one or more short-circuiting switches. The short-circuiting switch or switches are capable of short-circuiting between the two transmission lines at positions at the same electrical length from one of the input/output lines.

Abstract: Electrical apparatus for connecting a radio frequency power-supply having two outputs to a load includes two radio frequency transmission-lines, each one connected to a corresponding power-supply output. A transformer arrangement connects the two transmission-lines to the load. Each transmission-line includes a series-connected pair of twelfth-wave transmission-line sections. The series-connection between the twelfth wave transmission-line sections in one transmission line is connected to the series-connection between the twelfth-wave transmission-line sections in the other by a device having an adjustable impedance.

Abstract: A signal transmission medium for transmitting EHF band signals from a first point to a second point, including: a first end at which a signal exchange with the first point takes place; a second end at which a signal exchange with the second point takes place; and a transmission line portion which is flexible and connects the first end and the second end. The transmission line portion includes: strip conductors which are formed substantially down a center of a flexible printed circuit board to establish electrical connection between a signal line at the first end and a signal line at the second end; and a pair of grounding sheets which are arranged in parallel to each other at a substantially constant gap from the flexible printed circuit board in 180-degree opposite directions. The cavities are formed between the pair of grounding sheets and the strip conductors.

Abstract: Discussed herein is a semiconductor package and a method of overcoming multiple reflections while transmitting high speed broadband signals through the semiconductor package. The semiconductor package includes at least one trace having a first terminal that is configured to receive a broadband signal and a second terminal configured to output the broadband signal. The semiconductor package includes a stub which is positioned along a longitudinal length of the trace and is configured to reduce broadband reflections in the trace by causing multi-frequency reflections to destructively interfere with at least some broadband reflections in the trace that occur due to impedance discontinuities. The stub parameters such as stub length, stub impedance and the location of the stub along the trace can be determined to minimize signal degradation.

Abstract: A transmission line is provided in which a first portion of the transmission line is configured to be connected to a source, and a second portion of the transmission line is configured to be connected to a load. A capacitive element is coupled to the transmission line and is configured to compensate for an impedance difference between the load and at least one of the source or the transmission line, at a frequency within a frequency bandwidth of the load. A difference between an internal capacitance of the first portion of the transmission line and the second portion of the transmission line substantially matches the capacitance of the capacitive element.

Abstract: Unwanted radiation is reduced in a high-frequency signal transmission line that includes a ground conductor provided with an opening that overlaps a signal line. A dielectric element assembly has a relative dielectric constant ?1 and has a first principal surface and a second principal surface. A signal line is provided in the dielectric element assembly. A ground conductor is provided in the dielectric element assembly and on the first principal surface side with respect to the signal line, faces the signal line, and is provided with an opening that overlaps the signal line. A high dielectric constant layer has a relative dielectric constant ?2 higher than the relative dielectric constant ?1 and is provided on the first principal surface so as to overlap the opening.

Abstract: A stripline includes a first ground plane; a second ground plane; a first signal trace located between the first ground plane and the second ground plane; and a center via that extends through the stripline and is in electrical contact with the first ground plane and the first signal trace.

Abstract: A high frequency band pass filter with a coupled surface mount transition is provided, including a filter substrate, circuit connection elements defining input and an output elements provided on a surface of the filter substrate, electronic filter components provided on the first surface of the filter substrate, and impedance matching structures provided on the first surface of the filter substrate between the electronic filter components and the respective input and output elements. Signal connection structures are provided on an opposed surface of the filter substrate, in locations that positionally correspond to respective positions of the input and output elements.

Abstract: A high-frequency substrate in which a coplanar line including a signal line which transmits a signal and a pair of front ground patterns disposed in parallel with the signal line interposed therebetween is formed on one surface of a dielectric substrate, a back ground pattern is formed to cover the other surface of the dielectric substrate, and a plurality of conductive vias which connect the front ground patterns to the back ground pattern are arranged at a predetermined interval, the high-frequency substrate including: a signal line breaking portion which breaks the signal line; a substantially rectangular parallelepiped signal-line capacitor which is formed to connect the breaking ends of the signal line to each other; and ground pattern breaking portions which are disposed on both sides of the signal line breaking portion of the signal line to break the front ground patterns.

Abstract: A tunable delay line for radiofrequency or microwave frequency applications consists of at least one ridge waveguide in which the ridge is movable in the waveguide body so as to vary the width of an air gap defined between the longitudinal end surface of the ridge and a confronting member of the waveguide. The ridge is moved by an actuator external to the waveguide body.

Abstract: A printed wiring board includes a first terminal array and a second terminal array comprising a plurality of terminals, a first differential signal line connecting a first terminal of the first terminal array to a predetermined number of terminals including a second terminal of the second terminal array, a second differential signal line connecting a third terminal of the first terminal array to a number of terminals including a fourth terminal of the second terminal array, which is bigger than the predetermined number of terminals wherein at least one of a line width and a line interval of one pair signal lines configuring the first differential signal line and the second differential signal line is determined so that differential impedance of the second differential signal line becomes higher compared with differential impedance of the first differential signal line.

Abstract: An easily bendable high-frequency signal transmission line includes a dielectric body including a protection layer and dielectric sheets laminated on each other, a surface and an undersurface. A signal line is a linear conductor disposed in the dielectric body. A ground conductor is disposed in the dielectric body, faces the signal line via the dielectric sheet, and continuously extends along the signal line. A ground conductor is disposed in the dielectric body, faces the ground conductor via the signal line sandwiched therebetween, and includes a plurality of openings arranged along the signal line. The surface of the dielectric body on the side of the ground conductor with respect to the signal line is in contact with a battery pack.

Abstract: An easily bendable high-frequency signal transmission line includes a dielectric body including a protection layer and dielectric sheets laminated on each other, a surface and an undersurface. A signal line is a linear conductor disposed in the dielectric body. A ground conductor is disposed in the dielectric body, faces the signal line via the dielectric sheet, and continuously extends along the signal line. A ground conductor is disposed in the dielectric body, faces the ground conductor via the signal line sandwiched therebetween, and includes a plurality of openings arranged along the signal line. The surface of the dielectric body on the side of the ground conductor with respect to the signal line is in contact with a battery pack.

Abstract: The present invention is directed to an interface for connecting a waveguide manifold of a transition to a stripline manifold of the transition. The interface may include a plurality of metamaterial layers, each including a metamaterial(s). The interface may further include a ground plane layer which may be connected to both the plurality of metamaterial layers and to the stripline manifold. Further, the interface may include a plurality of ground vias which may form channels through each of the layers of the interface and through the stripline manifold for providing a ground structure for the interface. The interface is further configured for forming a resonant structure which provides a low-loss, broadband conversion between a stripline mode and a waveguide mode for electromagnetic energy traversing through the interface between the waveguide manifold and the stripline manifold.

Abstract: Disclosed herein is a variable capacitor module, including a variable capacitor circuit part including a first capacitor unit, a second capacitor unit connected in parallel with the first capacitor unit, and first and second switch units connected between the first and second capacitor units, and selecting at least one capacitor unit according to operations of the first and second switch units, wherein the variable capacitor circuit part is present in plural, and the plural variable capacitor parts are connected in parallel with each other, and thus, an asymmetric phenomenon where the RF terminal has directivity by gate resistance of the switch can be removed.

Abstract: An impedance transformer includes a first transmission line having a first impedance and provided over a first substrate having a first permittivity; a second transmission line and a third transmission line having an impedance lower than the first impedance and provided over a second substrate having a permittivity higher than the first permittivity, the second transmission line and the third transmission line being electrically coupled to the first transmission line; and a resistor coupled between the second transmission line and the third transmission line.

Abstract: A circuit device includes a multilayer circuit carrier, a first signal transmission line, a second signal transmission line, a signal line transition element, a first impedance transformer, and a second impedance transformer. The multilayer circuit carrier includes a first layer and a second layer. The first signal transmission line is on the surface of the first layer. The second signal transmission line is on the surface of the second layer. The signal line transition element passes through the first layer and the second layer, and has a first signal terminal and a second signal terminal. The first impedance transformer is on the surface of the first layer and electrically connected between the first signal transmission line and the first signal terminal. The second impedance transformer is on the surface of the second layer and electrically connected between the second signal transmission line and the second signal terminal.

Abstract: A high-frequency line structure includes a multi-layered resin substrate in which insulating layers of a resin are laminated. A high-frequency-signal input part is arranged on the resin substrate to input a high-frequency signal and supply the high-frequency signal to the resin substrate. A high-frequency-signal output part is arranged in the resin substrate to receive the high-frequency signal from the input part and output the received high-frequency signal. A first metal layer is arranged to encircle the input and output pads and electrically insulated from the input and output parts. A second metal layer is arranged on the resin substrate. A plurality of penetration vias are arranged in the resin substrate to encircle the input part and the output part, and each penetration via being connected to the first and second metal layers.

Abstract: An impedance matching ground plane step, in conjunction with a quarter wave transformer section, in a printed circuit board provides a broadband microwave matching transition from board connectors or other elements that require thin substrates to thick substrate (>quarter wavelength) broadband microwave (millimeter wave) devices.

Abstract: Millimeter wave radio-frequency integrated circuit device comprises a housing and a millimeter wave radio frequency integrated circuit, the housing comprising a plurality of layers laminated together and two cavities defined by apertures within the layers which are positioned to correspond as the layers are laminated together. The radio frequency integrated circuit is located within the first cavity, and the second cavity serves as a radiating cavity. The RFIC is bonded to a transmission line which connects to the radiating cavity.

Abstract: An easily bendable high-frequency signal transmission line includes a dielectric body including a protection layer and dielectric sheets laminated on each other, a surface and an undersurface. A signal line is a linear conductor disposed in the dielectric body. A ground conductor is disposed in the dielectric body, faces the signal line via the dielectric sheet, and continuously extends along the signal line. A ground conductor is disposed in the dielectric body, faces the ground conductor via the signal line sandwiched therebetween, and includes a plurality of openings arranged along the signal line. The surface of the dielectric body on the side of the ground conductor with respect to the signal line is in contact with a battery pack.

Abstract: An electronic circuit includes a first transmission line connected to a DC power source, a second transmission line having one end connected to the first transmission line at a connecting node, a narrow portion formed in the second transmission line and provided at a position that is away from a specific position by equal to or greater than ? wavelength of a signal, the specific position being away from the connecting node at a distance equal to ¼ wavelength, and a capacitor having one end connected to the other end of the second transmission line and the other end connected to a reference potential.

Abstract: A high-frequency signal transmission line includes a body; a signal line including a first line portion provided to a first layer of the body, a second line portion provided to a second layer of the body alternately being connected; and a first ground conductor provided to the first layer or a third layer positioned on an opposite side of the second layer relative to the first layer, and also overlaid with a plurality of second line portions in planar view from a normal direction of a principal surface of the body, and also not overlaid with a plurality of the first line portions. A property impedance of the first line portion and a property impedance of the second line portion are different from each other.

Abstract: An adjustable impedance matching network includes a first terminal, a second terminal, a reference potential terminal, a transmission line transformer with a first inductor path and a second inductor path. A semiconductor switching element is configured to bridge a sub-section of the first inductor path or the second inductor path to thereby adjust an inductance of the first inductor path or the second inductor path. According to an alternative embodiment, the impedance matching network includes a selector switch to selectively connect one of a plurality of inductor nodes with at least one of the first terminal and the second terminal. Further embodiments relate to an integrated circuit for adjustable impedance matching with a transmission line transformer formed by first and second inductor paths that are implemented as conductive paths at or in a substrate of the integrated circuit.

Abstract: A design structure, structure, and method for providing an on-chip variable delay transmission line with a fixed characteristic impedance. A method of manufacturing a transmission line structure includes forming a signal line of the transmission line structure, forming a first ground return structure that causes a first delay and a first characteristic impedance in the transmission line structure, and forming a second ground return structure that causes a second delay and a second characteristic impedance in the transmission line structure. The first delay is different from the second delay, and the first characteristic impedance is substantially the same as the second characteristic impedance.

Abstract: A transmission line with a structure which is capable of forming a passive equalizer and an electrical apparatus using the same are illustrated. The transmission line has a substrate, a ground plane, a defect ground structure, a pair of transmission conducting lines, and at least one stub. The substrate has a plurality of surfaces. The ground plane is located on at least one of the surfaces. The defect ground structure is formed on the ground plane. The pair of transmission conducting lines is located on one of the surfaces, and stretching over the defect ground structure. The at least one stub is located above a plane of the defect ground structure, extending along with at least one side of two sides of the pair of the transmission conducting lines, and electrically coupled to the pair of the transmission conducting lines and the ground plane.

Abstract: A multiband matching circuit includes a first matching unit for converting an impedance in a signal path to Z0 in a first frequency band, and a second matching unit formed of a series matching section connected at one end in series with the first matching unit in the signal path, which is a transmission line whose characteristic impedance is equal to the matching impedance Z0 or a circuit equivalent to the transmission line at least in the first frequency band, and a parallel matching section connected at one end to the signal path at the other end of the series matching section and grounded at the other end. The parallel matching section is configured to open in impedance the connection point to the signal path in the first frequency band. The series matching section and the parallel matching section are designed to match an impedance in a second frequency band with Z0.

Abstract: A high bandwidth circuit is segmented into a plurality of portions, each portion for implementation on a corresponding semiconductor chip, an arrangement of one or more die bond pads for each corresponding chip is generated, and a chip location for each corresponding chip is generated, given package and given package I/O arrangement is generated, the generation of the die bond arrangements and the chip position being relative to given chip package parameters, and being generated to establish bond wire lengths meeting given characteristic impedance parameters. Boundary parameters for generating the segmenting are provided, including a bound on the number of portions and optionally a including bound on the area parameters of the corresponding semiconductor chips.

Abstract: A design structure, structure, and method for providing an on-chip variable delay transmission line with a fixed characteristic impedance. A method of manufacturing a transmission line structure includes forming a signal line of the transmission line structure, forming a first ground return structure that causes a first delay and a first characteristic impedance in the transmission line structure, and forming a second ground return structure that causes a second delay and a second characteristic impedance in the transmission line structure. The first delay is different from the second delay, and the first characteristic impedance is substantially the same as the second characteristic impedance.

Abstract: An impedance matching circuit is provided. The present impedance matching circuit is able to match impedance using a transformer which is arranged inside a dielectric substrate and arranged to overlap with a bonding pad area and an end of a transmission line, thereby enabling transmitting signals at a desired frequency with a minimum insertion loss without using a very thin transmission line which is several to dozens of ?m wide or specially designed antennas in order to compensate for inductance. Thus, the present impedance matching circuit may be applied to various millimeter bands.

Abstract: The invention relates to a method and a device for pseudo-differential transmission in interconnections used for sending a plurality of electrical signals. The ends of an interconnection having 4 transmission conductors and a return conductor distinct from the reference conductor are each connected to a termination circuit. Three damping circuits are connected between the return conductor and the reference conductor. The transmitting circuits receive at their inputs the signals from the 4 channels of the two sources, and are connected to the conductors of the interconnection. A transmitting circuit in the activated state produces natural electrical variables, each natural electrical variable being allocated to one and only one channel.

Abstract: A printed circuit board includes an insulation layer and a signal layer attached to the insulation layer. The signal layer includes a pair of differential transmission lines. Width W of each of the differential transmission lines is changed according to change of space S between the differential transmission lines, based on the following formula: W = C ? ? 1 × H × ( C ? ? 2 × H 0.8 ? W 0 + T ) C ? ? 3 × ? C ? ? 4 × S 0 H - 1 1 - C ? ? 3 × ? C ? ? 4 × S H - 1.25 ? T In above formula, C1=7.475, C2=5.98, C3=0.48, C4=?0.96, H is a thickness of the insulation layer, W0 is an original width of each of the differential transmission lines, and S0 is an original space between the differential transmission lines, and T is a thickness of each of the differential transmission lines.

Abstract: Impedance between an antenna and a power amplifier in a cell phone is dynamically matched by selectively increasing the potential difference between a bias electrode and a top plate to move the top plate to a down position for a number of varactors needed to change the capacitance and bring about the match. Each varactor has a capacitor bottom plate formed on the substrate to include the bias electrode, a ground electrode and an RF signal line electrode. A capacitor top plate is suspended by mechanical spring action above the bottom plate for movement between an up position and a down position relative to dielectric material covering the bottom plate. The potential difference applied between the bias electrode and the top plate can be selectively increased to overcome the spring action and move the top plate to the down position, shunting an RF signal applied at the RF signal line electrode to ground through the top plate.

Abstract: Disclosed herein are an asymmetrical multilayer substrate, an RF module, and a method for manufacturing the asymmetrical multilayer substrate. The asymmetrical multilayer substrate includes a core layer, a first pattern layer formed on one side of the core layer and including a first signal line pattern, a second pattern layer formed on the other side and including a second metal plate and a second routing line pattern, a first insulating layer thinner than the core layer formed on the second pattern layer and including a first via, and a third pattern layer formed on the first insulating layer and including a third signal line pattern, wherein an impedance transformation circuit including an impedance load and a parasitic capacitance load on the transmission line is formed for impedance matching in signal transmission between the signal line patterns formed in the upper and lower side directions of the core layer.

Abstract: A monolithic microwave integrated circuit (MMIC) compatible broadside-coupled transformer including (i) a first transmission line, (ii) a second transmission line, and (iii) a third transmission line. The first and the second transmission lines generally form the broadside-coupled transformer. The third transmission line is generally connected in series with the broadside-coupled transmission line forming a ground return path of the broadside-coupled transformer.

Abstract: In a ferrite phase shifter, a temperature rise at ferrites can be suppressed to maintain the characteristics of the frites even when used at high power. Thus, the phase shifter can stably demonstrate high performance. The ferrite phase shifter includes a rectangular waveguide, substantially sheet-like ferrites disposed to face each other with respective mounting surfaces kept in tight contact with inner walls of wide surfaces of the rectangular waveguide facing each other, and a coil which is wound around the periphery of the rectangular waveguide in a position substantially corresponding to the position of the ferrites and through which a current is passed.

Abstract: A flexible printed circuit board including: a base substrate; a pad formed on one surface side of the base substrate; and a ground plane layer formed on the other surface side of the base substrate, the ground plane layer including a ground-removed portion, the ground-removed portion being formed at a position facing the pad via the base substrate so as to be of similar shape to the pad and have an outer shape extended 100±50 ?m outwardly from an outer shape of the pad.

Abstract: A microstripline transmission line arrangement carries a signal having a fundamental frequency. The arrangement includes a first microstripline transmission line, a second microstripline transmission line, and a coaxial electrically conductive conduit interconnecting the first transmission line and the second transmission line. The conduit includes a signal conductor and an electrically grounded shield substantially surrounding the signal conductor. The conductor and the shield are positioned relative to each other to thereby comprise a means for lowpass filtering the signal. A cutoff frequency of the lowpass filtering is less than a third harmonic of the fundamental frequency.

Abstract: The present invention provides a high-frequency circuit capable of acquiring the original transmission characteristics of a filter by preventing capacitive coupling between input and output terminals of the filter externally attached to the integrated circuit and effectively using a mounting space. The high-frequency circuit includes a rectangular integrated circuit 10 having two long sides 10a and 10b and two short sides 10c and 10d and a SAW filter 15, disposed to be adjacent to the short side 10d of the integrated circuit 10, having input terminals 24a and 24b disposed on the long side 10a side and output terminals 28a and 28b disposed on the other long side 10b side.

Abstract: A feed structure for a wearable antenna incorporates a microstrip transmission line designed for mounting on opposite sides of a fabric. The transmission line has a perforated ground plane which reduces capacitance and offers an appropriate impedance, even when the fabric is thin, and allows the use of a relatively robust line conductor having a width of 3 mm or 5 mm or more. The ground plane can be extended to provide the ground plane of a balun and the material of that ground plane can in turn be extended to provide the wearable antenna.

Abstract: A microstrip to airstrip transition is provided. The microstrip to airstrip transition includes a ground plane, a printed circuit board, a microstrip, a solder mask, and an airstrip. The ground plane has first and second sides. The printed circuit board has first and second sides and is disposed on the first side of the ground plane. The microstrip is disposed on a portion of the first side of the printed circuit board, and the solder mask is disposed over at least a portion of the microstrip. The airstrip is disposed over the at least portion of the solder mask, and the solder mask prevents direct contact between the microstrip and the airstrip.

Abstract: In one example embodiment, a coplanar waveguide signal transition element transitions high-speed signals between vertically stacked coplanar waveguide transmission lines. The signal transition element comprises one or more dielectric layers and a plurality of electrically conductive vias extending through at least a portion of the one or more dielectric layers. The vias include one or more signal vias and one or more ground vias that are configured to transition signals between the vertically stacked coplanar waveguide transmission lines. The signal transition element also comprises a ground plane disposed within the one or more dielectric layers and electrically coupled to the one or more ground vias. The ground plane has one or more openings through which the one or more signal vias respectively pass.

Abstract: An apparatus for the transfer of broadband, high-frequency signals of a center wavelength (?c), including a conductor structure, which includes at least one signal path and two reference paths arranged symmetrically to the signal path. Together the conductor structure and the two reference paths form a coplanar line, with the conductor structure being arranged on two oppositely lying sides of at least one dielectric substrate layer of a predetermined thickness in such a manner that the conductor structure overlaps in predetermined coupling regions, whereby the coupling region of the conductor structure transfers the high-frequency signals by an electromagnetic coupling, wherein the thickness of the substrate layer (18) is smaller than ?c/4, and wherein multiple electromagnetic couplings are arranged serially one after the other. The apparatus enables a galvanic isolation having good transfer properties in the case of frequencies greater than 6 GHz.