Tapered Patents (Class 333/34)
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Publication number: 20140077893Abstract: Disclosed is a substrate integrated waveguide coupler. The substrate integrated waveguide coupler according to the present invention includes: a substrate; an upper conducting plate applied to an upper portion of the substrate; a lower conducting plate applied to a lower portion of the substrate; two peripheral via holes disposed parallel to each other on both sides of the substrate, respectively, and being of a pipeline type electrically connecting the upper conducting plate and the lower conducting plate to each other; and an inner via hole disposed between the two peripheral via holes, and having a center thereof separated by a preset distance and forming a short slot functioning to couple input signals.Type: ApplicationFiled: December 6, 2012Publication date: March 20, 2014Applicant: Electronics And Telecommunications Research InstituteInventors: Hong Yeol LEE, Man Seok UHM, So Hyeun YUN, Chang Soo KWAK, Jang Sup CHOI, In Bok YOM
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Patent number: 8669830Abstract: Embodiments of the present invention are directed to providing an increased trace width when traversing a void in another layer in a printed circuit board or package design. By increasing the trace width or alternatively increasing the capacitance, the degradation due to the void can be reduced. This approach works for microstrip, stripline as well as other transmission lines that use a reference plane. The void can be the result of an antipad associated with a via, or any other disruption in an otherwise uniform reference plane.Type: GrantFiled: January 14, 2011Date of Patent: March 11, 2014Assignee: Broadcom CorporationInventor: Shengli Lin
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Patent number: 8669829Abstract: A multi-octave power amplifier and related method provides an impedance matching unit configured to match impedances of a pair of balanced radio frequency (RF) signals applied thereto and output a pair of impedance-matched balanced RF signals, a converting unit configured to convert the pair of the impedance-matched balanced RF signals to an unbalanced RF signal and a compensation unit configured to compensate at least one rolled-off frequency component of the unbalanced RF signal and output a compensated RF signal.Type: GrantFiled: February 27, 2012Date of Patent: March 11, 2014Assignee: Teledyne Wireless, LLCInventors: William Goumas, Yehuda Goren
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Publication number: 20140015623Abstract: Provided are coaxial transmission line microstructures formed by a sequential build process, and methods of forming such microstructures. The microstructures include a transition structure for transitioning between the coaxial transmission line and an electrical connector. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals.Type: ApplicationFiled: September 17, 2013Publication date: January 16, 2014Applicant: NUVOTRONICS, LLCInventor: David Sherrer
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Patent number: 8624693Abstract: A flexible high-frequency signal transmission line includes a dielectric body including laminated flexible dielectric layers. A signal line is provided in the dielectric body. A grounding conductor is arranged in the dielectric body to be opposed to the signal line via one of the dielectric layers. The grounding conductor is of a ladder structure including a plurality of openings and a plurality of bridges arranged alternately along the signal line. A characteristic impedance of the signal line changes between two adjacent ones of the plurality of bridges such that the characteristic impedance of the signal line rises from a minimum value to an intermediate value and to a maximum value and falls from the maximum value to the intermediate value and to the minimum value in this order.Type: GrantFiled: May 13, 2013Date of Patent: January 7, 2014Assignee: Murata Manufacturing Co., Ltd.Inventor: Noburo Kato
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Patent number: 8598961Abstract: The present invention relates to a transition arrangement comprising two surface-mountable waveguide parts and a dielectric carrier material with a metallization and a ground plane provided on a respective first main side and second main side Surface-mountable waveguide parts comprise a first wall, a second wall, and a third wall, which second and third walls are arranged to contact a part of the metallization, all the walls together essentially forming a U-shape, the surface-mountable waveguide parts also comprising respective bend parts. The metallization on the first main side is removed such that a first aperture and a second aperture are formed, the apertures being enclosed by a frame of via holes electrically connecting the ground plane with the metallization, the bend parts being fitted such that the apertures permit passage of a microwave signal propagating via the bend parts. Then the dielectric carrier material itself acts as a waveguide transition between the first aperture and the second aperture.Type: GrantFiled: April 16, 2008Date of Patent: December 3, 2013Assignee: Telefonaktiebolaget L M Ericsson (publ)Inventors: Marcus Karl Hasselblad, Per Ligander, Simone Bastioli, Uwe Rosenberg
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Patent number: 8586873Abstract: A circuit board includes a pair of differential signal lines and a pair of test point pads, one test point pad coupled to one of the signal lines and another of the test point pads coupled to another of the signal lines. The two test point pads are staggered relative to each other and the two signal lines. The circuit board includes a plurality of conductive layers and a plurality of insulating layers. The conductive layers can be etched into conductive patterns, or traces, for connecting the electronic components, which are soldered to the circuit board. The conductive layers may be selectively connected together by vias. One or more of the conductive layers may be a metal plane for providing a ground plane and/or a power plane. To minimize or eliminate the capacitance generated between the test point pad and an underlying ground plane and/or power plane, portions of the ground plane and/or the portion of the power plane directly aligned with each test point pad are removed.Type: GrantFiled: February 23, 2010Date of Patent: November 19, 2013Assignee: Flextronics AP, LLCInventor: Leon Wu
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Publication number: 20130271235Abstract: Provided is a coaxial waveguide converter and a ridge waveguide that are insusceptible to manufacturing variances over a broad bandwidth. The coaxial waveguide converter includes a ridge waveguide (10) including a ridge (11) and a coaxial line (20). A projection (12) projecting toward a side of a waveguide space (13) is provided in the ridge (11), an amount of projection of the projection (12) decreases gradually from an end surface of the ridge waveguide (10) on a side of the coaxial line along a waveguide direction and an inner conductor (21) of the coaxial line (20) is inserted in the through-hole (14) at a position displaced from a center of the ridge waveguide (10) in a direction perpendicular to a direction in which the projection (12) projects in the end surface of the ridge waveguide (10) on the side of the coaxial line.Type: ApplicationFiled: November 28, 2011Publication date: October 17, 2013Applicant: NEC CORPORATIONInventor: Takafumi Kai
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Patent number: 8552813Abstract: Embodiments of the invention are directed toward a novel printed antenna that provides a low-loss transition into waveguide. The antenna is integrated with a heat spreader and the interconnection between the antenna and the output device (such as a power amplifier) is a simple conductive connection, such as (but not limited to), a wirebond. Integrating the antenna with the heat spreader in accordance with the concepts, circuits, and techniques described herein drastically shortens the distance from the output device to the waveguide, thus reducing losses and increasing bandwidth. The transition and technique described herein may be easily scaled for both higher and lower frequencies. Embodiments of the present apparatus also eliminate the complexity of the prior art circuit boards and transitions and enable the use of a wider range of substrates while greatly simplifying assembly.Type: GrantFiled: November 23, 2011Date of Patent: October 8, 2013Assignee: Raytheon CompanyInventors: Darin M. Gritters, Kenneth W. Brown, Andrew K. Brown, Michael A. Moore, Patrick J. Kocurek, Thomas A. Hanft
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Patent number: 8542079Abstract: Provided are coaxial transmission line microstructures formed by a sequential build process, and methods of forming such microstructures. The microstructures include a transition structure for transitioning between the coaxial transmission line and an electrical connector. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals.Type: GrantFiled: January 28, 2011Date of Patent: September 24, 2013Assignee: Nuvotronics, LLCInventors: David W. Sherrer, Jean-Marc Rollin
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Patent number: 8536955Abstract: A microwave waveguide, and a system and method related to a microwave waveguide, is described. One embodiment includes an integrated microwave waveguide comprising a waveguide block, a first waveguide section in the waveguide block, a second waveguide section in the waveguide block, a first impedance transition section integrated with the first waveguide section in the waveguide block, wherein the first impedance section comprises a first conduit with a first end and a second end, wherein the first conduit is tapered from the first end to the second end, and a second impedance transition section integrated with the second waveguide section in the waveguide block, wherein the second impedance section comprises a second conduit with a third end and a fourth end, wherein the second conduit is tapered from the third end to the fourth end, and wherein the second end of the first impedance transition section and the fourth end of the second impedance transition section are connected at an antenna stub.Type: GrantFiled: January 30, 2008Date of Patent: September 17, 2013Assignee: Applied Materials, Inc.Inventors: Michael W. Stowell, Harald Gaertner
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Patent number: 8497749Abstract: A low attenuation surface wave transmission line system for launching surface waves on a bare and unconditioned conductor, such as are found in abundance in the power transmission lines of the existing power grids. The conductors within the power grid typically lack dielectric and special conditioning. Accordingly, the present invention includes a first launcher, preferably including a mode converter and an adapter, for receiving an incident wave of electromagnetic energy and propagating a surface wave longitudinally on the power lines. The system includes at least one other launcher, and more likely a number of other launchers, spaced apart from one another along the constellation of transmission lines. The system and associated electric fields along any given conductor are radially and longitudinally symmetrical.Type: GrantFiled: July 27, 2009Date of Patent: July 30, 2013Assignee: Corridor Systems, Inc.Inventor: Glenn E. Elmore
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Patent number: 8487711Abstract: The present invention relates to a transmission line to waveguide transition arrangement comprising a dielectric carrier material arrangement having a first main side and a second main side, the arrangement comprising a transition portion with an opening, having at least one edge and an electrically conducting border which follows the opening and is electrically connected to a ground metalization on the second main side. A transmission line conductor extends in the dielectric carrier material arrangement towards the border. The arrangement further comprises a transitional part with a border contact section having an outer circumference that essentially follows the border's shape except for a gap dividing the border contact section. The transitional part further comprises a conductor contact section which protrudes from the border contact section through the gap, contacting the end of the transmission line conductor and extending into the opening.Type: GrantFiled: November 30, 2007Date of Patent: July 16, 2013Assignee: Telefonaktiebolaget LM Ericsson (Publ)Inventors: Per Ligander, Marcus Hasselblad
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Publication number: 20130154759Abstract: A waveguide includes: a waveguide portion including a first surface and a second surface that are opposed to each other; a first transmission line provided on the first surface of the waveguide portion; a second transmission line provided on the second surface of the waveguide portion; and a first conversion structure inputting a signal from the first transmission line to the waveguide portion and converting the signal.Type: ApplicationFiled: November 29, 2012Publication date: June 20, 2013Applicant: SONY CORPORATIONInventor: SONY CORPORATION
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Patent number: 8461943Abstract: A flexible high-frequency signal transmission line includes a dielectric body including laminated flexible dielectric layers. A signal line is provided in the dielectric body. A grounding conductor is arranged in the dielectric body to be opposed to the signal line via one of the dielectric layers. The grounding conductor is of a ladder structure including a plurality of openings and a plurality of bridges arranged alternately along the signal line. A characteristic impedance of the signal line changes between two adjacent ones of the plurality of bridges such that the characteristic impedance of the signal line rises from a minimum value to an intermediate value and to a maximum value and falls from the maximum value to the intermediate value and to the minimum value in this order.Type: GrantFiled: June 29, 2012Date of Patent: June 11, 2013Assignee: Murata Manufacturing Co., Ltd.Inventor: Noboru Kato
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Patent number: 8456253Abstract: The invention relates to a microstrip coupler for coupling a radio frequency, RF, wave into a waveguide. The microstrip coupler comprises a conductive microstrip line having a broadened end portion, and a non-conductive slot (105) following the broadened end portion to form an antenna for irradiating the RF wave.Type: GrantFiled: February 23, 2012Date of Patent: June 4, 2013Assignee: Huawei Technologies Co., Ltd.Inventor: Fabio Morgia
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Patent number: 8410863Abstract: There is provided a low loss slow wave transmission line that can be miniaturized. A slow wave transmission line of the present invention has a configuration which includes a repeated arrangement of a low impedance line and a high impedance line and in which the high impedance line is longer than the low impedance line in terms of a line length.Type: GrantFiled: July 15, 2009Date of Patent: April 2, 2013Assignee: Panasonic CorporationInventors: Junji Satou, Shigeru Kobayashi, Michiaki Matsuo
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Patent number: 8397566Abstract: An apparatus for the transfer of broadband, high-frequency signals of a center wavelength (?c), including a conductor structure, which includes at least one signal path and two reference paths arranged symmetrically to the signal path. Together the conductor structure and the two reference paths form a coplanar line, with the conductor structure being arranged on two oppositely lying sides of at least one dielectric substrate layer of a predetermined thickness in such a manner that the conductor structure overlaps in predetermined coupling regions, whereby the coupling region of the conductor structure transfers the high-frequency signals by an electromagnetic coupling, wherein the thickness of the substrate layer (18) is smaller than ?c/4, and wherein multiple electromagnetic couplings are arranged serially one after the other. The apparatus enables a galvanic isolation having good transfer properties in the case of frequencies greater than 6 GHz.Type: GrantFiled: July 7, 2005Date of Patent: March 19, 2013Assignee: Endress + Hauser GmbH + Co. KGInventors: Bernhard Michalski, Qi Chen
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Patent number: 8368485Abstract: Embodiments are directed to a RF combiner/splitter having a first port separated from a second port and a third port by a generally tapering microstrip section. The second and third ports are separated by a generally rectangular bridge bar having a width selected to match the impedance of devices to be connected to the second and third ports and a length selected to provide a separation between the second and third ports of approximately quarter wavelength at a center point of an operational frequency of the devices. In a first embodiment, a horizontal RF choke joint is positioned between the first port and the tapering section. In a second embodiment, one choke joint is positioned between the second port and the bridge bar and a second choke joint is positioned between the third port and the bridge bar.Type: GrantFiled: April 13, 2011Date of Patent: February 5, 2013Assignee: Dockon AGInventor: Forrest James Brown
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Patent number: 8334730Abstract: A connection method includes the step of connecting, using a line on a dielectric element, two points through which a signal flows, the two points having different heights and the widths of the line at the positions of the two points having been adjusted on the basis of the thickness of the dielectric element.Type: GrantFiled: March 27, 2012Date of Patent: December 18, 2012Assignee: Sony CorporationInventors: Masato Kikuchi, Shunsuke Mochizuki, Masahiro Yoshioka, Ryosuke Araki, Masaki Handa, Takashi Nakanishi, Hiroshi Ichiki, Tetsujiro Kondo
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Patent number: 8274307Abstract: The present disclosure provides for a circuit package that can include a signal input port that receives an electronic signal that includes multiple frequency components and a signal output port that outputs the electronic signal. The circuit package can include a trace having multiple portions that have a portion-dependent impedance. The trace can transfer the electronic signal from the signal input port to the signal output port. The present disclosure provides an apparatus to compensate a package trace parasitics, such as parasitic capacitance, to improve signal fidelity over a predetermined frequency range. The apparatus can provide a broadband impedance matching structure that matches the impedance of an I/O cell to the impedance of a printed circuit board and can compensate for the parasitic effects of both the I/O cell, terminals, and other discontinuities that may be present within the package.Type: GrantFiled: June 17, 2008Date of Patent: September 25, 2012Assignee: Marvell Israel (M.I.S.L.) Ltd.Inventor: Liav Ben Artsi
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Publication number: 20120193771Abstract: A transmission line includes two tapered lines having a tapered planar shape and arranged in parallel, opposite lines provided in opposition to the narrower width sides of the two tapered lines, and a bonding wire for connecting the narrower width sides of the two tapered lines and the opposite lines, wherein the width between two outer edges on the narrower width sides of the two tapered lines arranged in parallel is greater than the width between outer edges on the opposite side of the opposite lines in opposition to the narrower width sides of the two tapered lines.Type: ApplicationFiled: November 29, 2011Publication date: August 2, 2012Applicant: FUJITSU LIMITEDInventor: Satoshi MASUDA
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Publication number: 20120182083Abstract: A connection method includes the step of connecting, using a line on a dielectric element, two points through which a signal flows, the two points having different heights and the widths of the line at the positions of the two points having been adjusted on the basis of the thickness of the dielectric element.Type: ApplicationFiled: March 27, 2012Publication date: July 19, 2012Applicant: SONY CORPORATIONInventors: Masato KIKUCHI, Shunsuke MOCHIZUKI, Masahiro YOSHIOKA, Ryosuke ARAKI, Masaki HANDA, Takashi NAKANISHI, Hiroshi ICHIKI, Tetsujiro KONDO
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Patent number: 8222977Abstract: A waveguide circuit is provided, in which fixing a metal cover to a waveguide body with screws can prevent radiowave leakage suitably without any application of the conductive adhesive, solder and braze as a material for the radiowave leakage prevention. A metal plate is provided at the end of an aperture of a waveguide body in a radiowave traveling direction and overlaps with the end of a metal cover.Type: GrantFiled: March 5, 2008Date of Patent: July 17, 2012Assignee: NEC CorporationInventors: Takayuki Oyama, Naotsugu Watanabe
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Patent number: 8183955Abstract: In a circuit (1) comprising first and second transmission lines (11,12) with first and second line widths, the transmission lines (11,12) are coupled to each other via a coupling (13,14) with first and second coupling widths at its ends, such that a smaller one of the line widths and a larger one of the coupling widths are combined, and such that a larger one of the line widths and a smaller one of the coupling widths are combined. Such a coupling (13,14) introduces relatively small reflection coefficients, for example for distances between ends of the transmission lines (11,12) smaller than a wavelength of frequency signals to be exchanged via the transmission lines (11,12) and the coupling (13,14). The circuit (1) can then become more compact. The coupling (13,14) may comprise one single taper or may comprise a first taper (13) with a first, larger coupling width and a second taper (14) with a second, smaller coupling width.Type: GrantFiled: July 3, 2007Date of Patent: May 22, 2012Assignee: NXP B.V.Inventor: Wilhelmus M. C. Dolmans
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Patent number: 8173943Abstract: The invention relates to a microwave waveguide element for matching a standard waveguide input port to an enlarged waveguide output port. In the waveguide element, a plurality of intermediate waveguide segments is cascaded in the propagation direction of the microwave energy to first split the waveguide element into two symmetrical waveguide branches and then combine the branches at the output port. Thus, the width of the waveguide element is gradually enlarged and the input port is matched to the output port. The intermediate waveguide segments are preferably dimensioned such that respective characteristic impedances are approximately matched with each other for the fundamental mode.Type: GrantFiled: September 14, 2009Date of Patent: May 8, 2012Assignee: Raute OyjInventors: Pete Ristola, Jaakko Vilo, Jerzy Piotrowski
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Patent number: 8174336Abstract: A first transmission line is formed on a first surface of a substrate. A first end of the first transmission line is connected to a transmission line of an unbalanced line. A second end is connected to a first transmission line of a balanced line. A second transmission line extends from a first end of the unbalanced line, alongside the first transmission line and spaced therefrom, and is connected to a second of the transmission lines of the balanced line. A ground plane is formed on a second surface of the substrate, extends from a first end of the balanced line, and is formed along the second transmission line to which the ground plane is connected through one or more vias. A width of a portion of the ground plane adjacent to the unbalanced line is greater than a portion thereof adjacent to the balanced line.Type: GrantFiled: March 18, 2008Date of Patent: May 8, 2012Assignee: EM-Wise Communications CompanyInventors: Young Gon Kim, Hyun Park
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Patent number: 8134424Abstract: A connector for transmitting signals using electrostatic coupling, comprises an inner first conductor portion and an outer first conductor portion respectively connected to two signal lines, an inner electrode portion having a facing area larger than the cross-sectional area of the inner first conductor portion in the direction perpendicular to the direction of the common axis, an outer electrode portion outside it, an inner second conductor portion for electrically connecting between the inner first conductor portion and the inner electrode portion, and an outer second conductor portion outside it, wherein the ratio of outer diameter of the inner second conductor portion to inner diameter of the outer second conductor portion is set to provide substantially fixed characteristic impedance at every position along the direction of the common axis.Type: GrantFiled: October 24, 2008Date of Patent: March 13, 2012Assignees: Olympus Corporation, Olympus Medical Systems Corp.Inventors: Shuichi Kato, Susumu Kawata, Makoto Honda
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Patent number: 8120449Abstract: The invention relates to a magnetically tunable filter having a filter housing and having two tunable resonator spheres which comprise magnetizable material and are arranged next to one another in two filter branches. Each filter branch comprises a coplanar line arranged on a substrate layer and extending in the direction of an electrical connection, as well as a common coupling opening so that the two filter branches are connected to one another. A resonator sphere is respectively positioned on each side of the coupling opening inside the two filter branches.Type: GrantFiled: July 4, 2007Date of Patent: February 21, 2012Assignee: Rohde & Schwarz GmbH & Co. KGInventors: Michael Aigle, Claus Tremmel, Dirk Schneiderbanger, Robert Rehner, Michael Sterns, Lorenz-Peter Schmidt, Sigfried Martius
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Patent number: 8115565Abstract: A waveguide arrangement having a longitudinal extension, along which an electromagnetic wave may propagate, and comprising at least one waveguide part and a feeding arrangement which is arranged for feeding said waveguide part with a first polarization and a second polarization, said polarizations being mutually orthogonal. The feeding arrangement comprises a dielectric carrier material comprising a first feeding conductor, feeding the first polarization and a second feeding conductor, feeding the second polarization, where the first polarization is excited by means of first excitation means fed by said first feeding conductor and the second polarization is excited by means of second excitation means fed by said second feeding conductor, where at least one excitation means is a symmetrical structure with respect to the longitudinal extension.Type: GrantFiled: December 21, 2006Date of Patent: February 14, 2012Assignee: Telefonaktiebolaget L M Ericsson (Publ)Inventors: Per Ligander, Lars Josefsson, Bengt Svensson
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Patent number: 8085112Abstract: According to one embodiment, a broadband transition to joint a via structure and a planar transmission line in a multilayer substrate is formed as an intermediate connection between the signal via pad and the planar transmission line disposed at the same conductor layer. The transverse dimensions of the transition are equal to the via pad diameter at the one end and strip width at another end; the length of the transition can be equal to the characteristic dimensions of the clearance hole in the direction of the planar transmission line or defined as providing the minimal excess inductive reactance in time-domain according to numerical diagrams obtained by three-dimensional full-wave simulations.Type: GrantFiled: July 21, 2011Date of Patent: December 27, 2011Assignees: NEC Corporation, Renesas Electronics CorporationInventors: Taras Kushta, Kaoru Narita, Tomoyuki Kaneko, Shin-ichi Ogou
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Patent number: 8081044Abstract: A surface-mountable waveguide arrangement comprising a dielectric carrier material having a first main side and a second main side, the second side comprising a ground plane, and the first side being arranged to form a microwave circuit layout by means of metallization patterns on the respective sides. The microwave circuit layout comprises a footprint for a surface-mountable waveguide part, the waveguide part comprising an open side, a part of the footprint constituting a closing wall arranged for closing the open side. The waveguide part is arranged for being mounted to a footprint solder area comprised in the footprint, having an outer contour and corresponding to a solderable contact area on the waveguide part. A solderstop line is formed on the footprint, at least partly defining a border between the closing wall and the footprint solder area. The present invention also relates to a dielectric carrier.Type: GrantFiled: June 19, 2007Date of Patent: December 20, 2011Assignee: Telefonaktiebolaget L M Ericsson (Publ)Inventor: Per Ligander
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Publication number: 20110273241Abstract: Provided are coaxial transmission line microstructures formed by a sequential build process, and methods of forming such microstructures. The microstructures include a transition structure for transitioning between the coaxial transmission line and an electrical connector. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals.Type: ApplicationFiled: January 28, 2011Publication date: November 10, 2011Inventors: David W. Sherrer, Jean-Marc Rollin
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Patent number: 8054142Abstract: Long-side length a1 to a5 of rectangular waveguide tubes in a long-side direction (magnetic field direction) become greater, the shorter a line length is (the closer a rectangular waveguide tube is to the center). ai and Li are set such that line lengths L1 to L5 of each rectangular waveguide tube is Li=m?gi (i=1 to 5, and m is a positive integer number), with guide wavelengths of each rectangular waveguide tube, determined by the length a1 to a5, as ?g1 to ?g5. Hence, the line length Li of each rectangular waveguide tube can be arbitrarily set, while maintaining a phase relationship between high frequency signals transmitted by each rectangular waveguide tube. When a difference in line lengths between rectangular waveguide tubes is set to be shorter, the degree of freedom in arrangement of the rectangular waveguide tubes can be improved while suppressing the degradation of propagation characteristics caused by temperature change.Type: GrantFiled: March 6, 2009Date of Patent: November 8, 2011Assignee: Denso CorporationInventor: Akihisa Fujita
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Patent number: 8044746Abstract: A high speed flexible interconnect cable for an electronic assembly includes a number of conductive layers and a number of dielectric layers. Conductive signal traces, located on the conductive layers, combine with the dielectric layers to form one or more high speed electrical transmission line structures. The cable can be coupled to electronic components using a variety of connection techniques. The cable can also be terminated with any number of known or standardized connector packages.Type: GrantFiled: April 16, 2010Date of Patent: October 25, 2011Assignee: QUALCOMM IncorporatedInventors: James Leroy Blair, Oswin M. Schreiber, Jeffrey Thomas Smith
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Patent number: 8040204Abstract: Disclosed is a radio-frequency divider comprising: an input port; and two output ports, separated by a bridge bar, wherein the divider is arranged in microstrip form and the microstrip structure takes the form of a generally tapering section connecting the input port to the bridge bar such that the input port is positioned at the relatively thinner end of the tapering section and the bridge bar is positioned at the relatively wider end of the tapering section. Also disclosed is a corresponding method. The divider is able to operate equally as a combiner.Type: GrantFiled: May 28, 2009Date of Patent: October 18, 2011Assignee: DockOn AGInventor: Forrest James Brown
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Patent number: 8031014Abstract: A nonlinear solid-state device useful for frequency conversion of electromagnetic radiation and in particular for harmonic generation, comprising a waveguiding electromagnetically distributed structure (WEDS) which includes monolithically a synthetic nonlinear material (SNM). Input radiation coupled into the WEDS is converted into a higher frequency output radiation through a constricted oscillatory motion of charge carriers and phase matched harmonic frequency generation of radiation which builds up coherently over an interaction length many time larger than the radiation wavelengths. In one embodiment, microwave radiation is converted into terahertz radiation. In other embodiments, SNM based WEDS devices are adapted for frequency mixing and parametric oscillation.Type: GrantFiled: September 23, 2009Date of Patent: October 4, 2011Inventors: Avraham Gover, Menachem Nathan, Yotam Schatzberg
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Patent number: 8022784Abstract: A wireless communication module includes a plurality of monolithic millimeter-wave integrated circuits (MMICs) for signal processing attached to the top surface of a multi-layer low temperature co-fired ceramic substrate; a planar transmission line formed on the top surface of the multi-layer substrate for communications between the MMICs; a metal base attached to the bottom surface of the multi-layer substrate and having an opening to which an antenna is attached; a plurality of vias for connecting the metal base and the planar transmission line within the multi-layer substrate to establish a uniform potential on a ground plane of the multi-layer substrate; an embedded waveguide formed in the opening surrounded with the vias within the multi-layer substrate; and a planar transmission line-to-waveguide transition apparatus for the transition of waves between the planar transmission line and the embedded waveguide.Type: GrantFiled: April 30, 2009Date of Patent: September 20, 2011Assignee: Korea Advanced Institute of Science and Technology (KAIST)Inventors: Jae Jin Lee, Chul Soon Park, Dong Yun Jung, Ki Chan Eun
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Patent number: 8013685Abstract: According to one embodiment, a broadband transition to joint a via structure and a planar transmission line in a multilayer substrate is formed as an intermediate connection between the signal via pad and the planar transmission line disposed at the same conductor layer. The transverse dimensions of the transition are equal to the via pad diameter at the one end and strip width at another end; The length of the transition can be equal to the characteristic dimensions of the clearance hole in the direction of the planar transmission line or defined as providing the minimal excess inductive reactance in time-domain according to numerical diagrams obtained by three-dimensional full-wave simulations.Type: GrantFiled: March 2, 2007Date of Patent: September 6, 2011Assignees: Renesas Electronics Corporation, NEC CorporationInventors: Taras Kushta, Kaoru Narita, Tomoyuki Kaneko, Shin-ichi Ogou
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Publication number: 20110204993Abstract: A transmission line having a plurality of branch lines that respectively include a first end part and a second end part and have a same line length, in which at least part of the plurality of branch lines includes bent shapes, the first end parts of the plurality of branch lines are connected to a common terminal, and the second end parts of the plurality of branch lines are connected to a common terminal. The plurality of branch lines may include two micro strip lines that are formed on substrates having the same dielectric constant and have bent shapes in symmetry with each other with respect to a straight line.Type: ApplicationFiled: February 1, 2011Publication date: August 25, 2011Applicant: FUJITSU LIMITEDInventor: Satoshi MASUDA
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Patent number: 7994874Abstract: Disclosed is a tapered double balun for use with rotationally-symmetrical, frequency-independent antennas that are fed using spiral-mode number 2. The tapered double balun may be used to provide a four-terminal line, where all terminals carry the same voltage, but adjacent terminals are out of phase and opposite terminals are in phase. The antennas may be spirals, sinuous, or other four-arm antennas. The tapered double balun is a stripline device comprising two outer ground planes and a center conductor that is dielectrically separated from the ground planes. The outer ground planes each taper from a wide dimension at the connector end of the device to a narrow dimension at the antenna end of the device. The narrow opposing strips comprising the ground planes are configured to connect to two opposed arms of the antenna.Type: GrantFiled: June 5, 2009Date of Patent: August 9, 2011Assignee: Georgia Tech Research CorporationInventor: Victor K. Tripp
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Patent number: 7990237Abstract: An apparatus including a liquid crystal polymer substrate having a top surface and a bottom surface, a coplanar waveguide formed on the top surface of the liquid crystal polymer substrate, the coplanar waveguide having a 90 degree bend with a mitered edge, an inner via positioned adjacent to an inner corner of the 90 degree bend, and an outer via positioned adjacent to the mitered edge of the 90 degree bend, the inner and outer vias positioned along a first plane that is perpendicular to a second plane defined by the mitered edge.Type: GrantFiled: January 16, 2009Date of Patent: August 2, 2011Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.Inventors: Alexandros Margomenos, Amin Rida
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Publication number: 20110140801Abstract: A signal converter includes: a dielectric substrate; a first conductor layer disposed on one of opposite sides of the dielectric substrate, while including an input section receiving high-frequency signals inputted thereto; a second conductor layer disposed on the other of the opposite sides of the dielectric substrate; and plural first conducting sections penetrating the dielectric substrate for electrically connecting the first and second conductor layers, while forming a waveguide in the inside of the dielectric substrate with the first and second conductor layers. The first conductor layer is disposed on the dielectric substrate without occupying a separator section disposed on the dielectric substrate. The separator section includes first and second sections extend from the input section towards the waveguide. The first and second sections are separated away from each other for gradually increasing their interval in proportion to a distance away from the input section towards the waveguide.Type: ApplicationFiled: December 7, 2010Publication date: June 16, 2011Applicant: FUJITSU LIMITEDInventors: Toshihiro SHIMURA, Yoji Ohashi
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Patent number: 7924121Abstract: A dispersion-free radial transmission line (“DFRTL”) preferably for linear accelerators, having two plane conductors each with a central hole, and an electromagnetically permeable material (“EPM”) between the two conductors and surrounding a channel connecting the two holes. At least one of the material parameters of relative magnetic permeability, relative dielectric permittivity, and axial width of the EPM is varied as a function of radius, so that the characteristic impedance of the DFRTL is held substantially constant, and pulse transmission therethrough is substantially dispersion-free. Preferably, the EPM is divided into concentric radial sections, with the varied material parameters held constant in each respective section but stepwise varied between sections as a step function of the radius.Type: GrantFiled: June 23, 2008Date of Patent: April 12, 2011Assignee: Lawrence Livermore National Security, LLCInventors: George J. Caporaso, Scott D. Nelson
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Patent number: 7911288Abstract: To reduce cross-talk, an integrated circuit may include a uniform signal trace for a first signal; and a pair of non-uniform signal traces forming a differential pair for a differential signal. The pair of non-uniform signal traces near the uniform signal trace.Type: GrantFiled: June 30, 2008Date of Patent: March 22, 2011Assignee: Cadence Design Systems, Inc.Inventor: Syed Assadulla Bokhari
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Patent number: 7898357Abstract: An impedance adapter with body and cap portions coupled together encloses a cavity with a printed circuit board (PCB). The PCB is provided with a trace on a first side and a ground plane on a second side. The trace is coupled to a first contact at a first end of the PCB and a second contact at a second end of the PCB. The trace has a sinuous path between the first contact and the second contact, the path longer than a longitudinal axis length of the PCB. The first and second contacts are supported coaxial within the inner conductor bore of the respective cap portion and body portion by first and second end insulators. The ground plane coupled to the body portion and the cap portion. A method of manufacture for the adapter includes steps of pre-assembling the PCB, contacts and insulators before insertion into the cavity.Type: GrantFiled: April 15, 2009Date of Patent: March 1, 2011Assignee: Andrew LLCInventors: Pratibha Chaulagai Phuyal, Kendrick Van Swearingen, Albert Cox, Jeffrey D. Paynter
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Patent number: 7898356Abstract: Provided are coaxial transmission line microstructures formed by a sequential build process, and methods of forming such microstructures. The microstructures include a transition structure for transitioning between the coaxial transmission line and an electrical connector. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals.Type: GrantFiled: March 20, 2008Date of Patent: March 1, 2011Assignee: Nuvotronics, LLCInventors: David W. Sherrer, Jean-Marc Rollin
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Patent number: 7884682Abstract: When a microstrip line is connected with a waveguide, there is a limit to reducing the connection loss by using only a matching box. We have discovered that in a transmission mode line transducer for converting between the TEM waves of the microstrip line and the TE01 waves of the waveguide, if the cross-sections of the microstrip line and the waveguide are substantially the same size, in the case of a 50? microstrip line when the characteristic impedance of the waveguide is about 80%, i.e., 40?, the line conversion loss can be optimized. Therefore, according to the present invention, the microstrip line is connected with the waveguide using a ?/4 matching box by means of a ridged waveguide having a low impedance and a length of ?/16 or less.Type: GrantFiled: November 27, 2007Date of Patent: February 8, 2011Assignee: Hitachi, Ltd.Inventors: Hideyuki Nagaishi, Hiroshi Shinoda
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Publication number: 20110025429Abstract: The present invention provides a transmission line portion for a circuit board including a conductive strip and a pad portion including a conductive pad connected to the conductive strip, wherein an impedance discontinuity or mismatch between the transmission line portion and the pad portion is reduced or controlled. Impedance discontinuity or mismatch may be controlled by controlling the dimensions of the pad portion, for example the pad width or distance between pad and ground. A ground pad associated with the pad portion may be provided on a different layer than a ground plane of the transmission line portion. The ground pad and ground plane may be connected by vias. The ground pad may comprise a patterned conductive region, the pattern configured so as to desirably configure impedance of the pad portion. Also provided are a method, circuit board layout, and the like, related to the above.Type: ApplicationFiled: July 21, 2010Publication date: February 3, 2011Applicant: SIERRA WIRELESS, INC.Inventor: Ashish Syal
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Patent number: 7855614Abstract: Integrated circuit transmission lines are designed to match elements at opposing ends of the transmission line over a frequency range of interest. By modifying characteristics of the transmission line over the length of the transmission line, from a first end coupled to a first external element to a second end coupled to a second external element, return loss is improved. In various embodiments one or more of the width of the conductors and the distance between adjacent edges of the conductors are modified across the length of the transmission line. In an alternative embodiment, the conductors of the transmission line are segmented with each segment having a length and a width across the segment.Type: GrantFiled: May 16, 2008Date of Patent: December 21, 2010Assignee: Avago Technologies ECBU IP (Singapore) Pte. Ltd.Inventors: Minh Van Quach, Nurwati S. Devnani, Wang Lin, Hyacinth Tok