Abstract: An apparatus includes a first conductive loop coupled to conduct a first current and a second conductive loop coupled in parallel with the first conductive loop and further coupled to conduct a second current. A first conductive portion forms a part of the first conductive loop and the second conductive loop. The first conductive portion is coupled to conduct the first current and the second current. In at least one embodiment of the apparatus, the first conductive loop and the second conductive loop are planar inductors formed in a conductive layer on a substrate of an integrated circuit.

Abstract: The common mode filter of the instant disclosure includes a non-magnetic insulating substrate, a stacked-layer structure, an insulating layer, and a magnetic layer. The stacked-layer structure is arranged on the non-magnetic insulating substrate. The magnetic layer is covered on the stacked-layer structure by the insulating layer arranged therebetween. The stacked-layer structure comprises a first coil and second coil, wherein the first coil is coupled to the second coil to suppress the common mode noise. Specially, a width W (mm) and a length L (mm) of at least one coil in the first and second coils satisfy the relational expression of: [(14.1?fc)/6.5]2<L/W<[(16.7?fc)/4.5]2 Where fc (MHz) is the cutoff frequency of a differential-mode signal.

Abstract: A compact and low-cost radiofrequency coupler, notably for the production of radiofrequency transmitters, includes a transmission line and a measuring line, the measuring line being coupled to the transmission line by the intermediary of windings, the transmission line, the measuring line and the windings being printed on a printed circuit board, upon which is fixed, by a clip-on technique, a binocular ferrite core that is essentially planar and E-shaped and whose central branch is disposed between the transmission line and the measuring line and whose distal branches are disposed in the central region of the planar windings.

Abstract: Provided is an MCP including a plurality chips stacked therein. Each of the chips includes a plurality of inductor pads configured to transmit power or signals, and at both sides of a reference inductor pad, a first and a second inductor pads are formed to generate magnetic fluxes in different directions from each other.

Abstract: High frequency, high power density coaxial, planar and three-phase transformers for converters and inverters are disclosed. One of the coaxial transformers comprises at least one primary winding and at least one secondary winding associated with at least one magnetic core, at least one coaxial Faraday shield between and substantially coaxial with the at least one primary winding and the at least one secondary winding and a substantially planar Faraday shield at one or more ends of the at least one magnetic core.

Abstract: A balance filter packaging chip having a balun mounted therein and a manufacturing method thereof are provided. The balance filter packaging chip includes a device substrate; a balance filter mounted on the device substrate; a bonding layer stacked on a certain area of the device substrate; a packaging substrate having a cavity formed over the balance filter, and combined with the device substrate by the bonding layer; a balun located on a certain area over the packaging substrate; and an insulator layer for passivating the balun. Accordingly, the present invention can reduce an element size and simplify a manufacturing process.

Abstract: Instead of being made from one continuous piece of material, a coil includes multiple flat coil segments that are stacked together and electrically coupled in series. In many embodiments, the coil segments are U-shaped segments, and the segments are arranged so that each segment is rotated (e.g., by 270 degrees) with respect the segment it follows. The stacked coils may then be fastened together using, for example, bolts through the corners of the coil segments. The combined coil segments form a continuous coil.

Abstract: A semiconductor device, a method of manufacturing a semiconductor device and a method for transmitting a signal are disclosed. In accordance with an embodiment of the present invention, the semiconductor device comprises a first semiconductor chip comprising a first coil, a second semiconductor chip comprising a second coil inductively coupled to the first coil, and an isolating intermediate layer between the first semiconductor chip and the second semiconductor chip.

Abstract: A laminated inductor having an internal conductive wire forming region, as well as a top cover region and bottom cover region formed in a manner sandwiching the internal conductive wire forming region between top and bottom; wherein the internal conductive wire forming region has a magnetic part formed with soft magnetic alloy grains, as well as helical internal conductive wires embedded in the magnetic part and constituted by a conductor; and at least one of the top cover region and bottom cover region (or preferably both) is/are formed with soft magnetic alloy grains whose constituent elements are of the same types as those of, and whose average grain size is greater than that of, the soft magnetic alloy grains constituting the magnetic part in the internal conductive wire forming region.

Abstract: An RF impedance transformer having a parallel low-impedance access Eb and serial high-impedance access Eh and intended for connection onto a printed circuit. The transformer includes a multilayer circuit that includes a long side and at least three layers. A first outer layer is separated from a second outer layer of the same thickness by at least one inner layer having a thickness at least four times greater than the thickness of the outer layers, each outer layer comprising an electrical conductor on each surface for forming a microstrip line, the serial high-impedance access Eh and the parallel low-impedance access Eb being on the long side of the multilayer circuit and near to each other so as to limit the area for connection with the printed circuit.

Abstract: A coil filter includes a core member having two end members extended from two end portions, the left end member includes a front protrusion, a rear protrusion, and a middle protrusion extended upwardly beyond the core member, the front protrusion includes a width (W) greater than that of the rear protrusion and the middle protrusion, the second end member includes a rear projection, a front projection, and a middle projection extended upwardly beyond the core member, the rear projection includes a width (T) greater than the width (t) of the front projection and the middle projection, and a coil member wound onto the core member and disposed between the end members without wasting the spaces of the core member.

Abstract: A coil assembly includes at least one insulated wire and an electromagnetic interference shielding layer. The insulated wire is wound into a winding coil part. The winding coil part includes a first wire-outlet segment, a second wire-outlet segment and a central through-hole. The electromagnetic interference shielding layer is formed on the winding coil part for shielding the insulated wire. The electromagnetic interference shielding layer has lateral projection profile on the winding coil part. The electromagnetic interference shielding layer has a radial gap such that the electromagnetic interference shielding layer is a non-conducting loop.

Abstract: There is provided a chip-type coil component, including: a body formed by laminating a plurality of magnetic layers, and having a lower surface provided as a mounting area, an upper surface corresponding thereto, two end surfaces, and two lateral surfaces; conductor patterns formed on the magnetic layers, respectively, and connected to each other to have a coil structure; and external electrodes formed on at least one external surface of the body, and electrically connected to the conductor patterns, the external electrodes each being formed on the lower surface and spaced apart from edges thereof. Short circuits between electronic components may be prevented and sticking strength between the chip-type coil component and a substrate may be increased.

Abstract: Disclosed is a laminated inductor that has good direct current superimposition characteristics, does not cause a variation in temperature characteristics, suppresses the occurrence of delamination, and can be stably manufactured. Also disclosed are a method for manufacturing the laminated inductor and a laminated choke coil. A laminated inductor (10) for use as a choke coil in a power supply circuit includes a rectangular parallelepiped-shaped laminated chip (1) and at least one pair of external electrodes (8) that are provided at the end of the laminated chip (1) and are conductively connected to the end of a coil. The laminated chip (1) includes a plurality of magnetic material layers (3) formed of an Ni—Zn—Cu ferrite, a plurality of conductive layers (2), which are laminated through the magnetic material layers (3) to constitute a coil, and at least one nonmagnetic layer (4) formed of a Ti—Ni—Cu—Mn—Zr—Ag-base dielectric material and formed in contact with a plurality of the magnetic material layers (3).

Abstract: Disclosed herein is a multilayer type power inductor including: a plurality of body layers including internal electrodes and having magnetic material layers stacked therein; and a plurality of gap layers, wherein the gap layer has an asymmetrical structure. In the multilayer type power inductor, portions that are in contact with the body layers have, a non-porous structure, which is a dense structure, and portions that are not in contact with the body layers have a porous structure, such that the gap layer has the asymmetrical structure. Therefore, a magnetic flux propagation path in a coil is dispersed to suppress magnetization at a high current, thereby making it possible to improve a change in inductance (L) value according to the application of current.

Abstract: A low cost, reduced form factor, high performance electronic device for use in electronic circuits and methods. In one exemplary embodiment, the device includes a unitary header assembly construction that ensures device coplanarity and also includes vertically oriented terminal pins. The device utilizes preconfigured flat coil windings that are disposed directly within a planar core. The flat coil windings further include features that are configured to mate with the header assembly terminal pins which substantially simplify the manufacturing process. Methods for manufacturing the device are also disclosed.

Abstract: A super high power transformer includes a base, a plurality of plate bodies, and a plurality of isolating bodies. The base further includes a main core part, a plurality of opening slots, and a plurality of side wing parts. The main core part has a penetrating hole at the center thereof. Each of the plate bodies has an open hole for slipping on the main core part and a guided slot that has a pole lead on both sides thereof. Each of the isolating bodies has a through hole for slipping on the main core part and a guided slot. There is also a pole lead positioned on both sides of the guided slot. To be slipped on the main core part, the plurality of plate bodies and the insulating bodies are alternately stacked up with the plate bodies staggering in turning a 90-degree angle apart sequentially.

Abstract: A laminar transformer having double-face secondary winding includes a primary winding part and a secondary winding part. The primary winding part further includes an isolating body seat and a plurality of coil sets. The secondary winding part further includes two plate-body set, each being positioned in the containing channel has a plurality of plate bodies and a plurality of insulating bodies. Each of the plate bodies has an opening for containing the central column and a guided channel that being positioned on a side of the opening has on both side thereof a pole lead respectively. The insulating bodies being a ring-shaped structure and being positioned in-between the plate bodies has a through hole for containing the central column. The plurality of plate bodies are laminated alternately and positioned in the central column making each of the plate-body sets form the one with four pole leads.

Abstract: A coil component 100 is provided with a substrate 11, a thin-film coil layer 12 provided on the substrate 11, first and second bump electrodes 13a, 13b provided on a surface of the thin-film coil layer 12, a first lead conductor 20 provided on the surface of the thin-film coil layer 12 together with the first and second bump electrodes 13a, 13b and formed integrally with the first bump electrode 13a, and an insulator layer 14 provided between the first bump electrode 13a and the second bump electrode 13b. The thin-film coil layer 12 contains a first spiral conductor 16 which is a plane coil pattern. The first bump electrode 13a is connected to an internal peripheral end of the first spiral conductor 16 via the first lead conductor 20. The second bump electrode 13b is connected to an external peripheral end of the first spiral conductor 16.

Abstract: Provided is a laminated inductor having a magnetic body, a conductor part covered in a manner directly contacting the magnetic body, and external terminals provided on the outside of the magnetic body and conducting to the conductor part; wherein the magnetic body is a laminate constituted by layers containing soft magnetic alloy grains, and the soft magnetic alloy grain contacting the conductor part is flattened on the conductor part side.

Abstract: In accordance with an embodiment, a transformer includes a first coil disposed in a first conductive layer on a first side of a first dielectric layer, and a second coil disposed in a second conductive layer on a second side of the first dielectric layer. Each coil has a first end disposed inside its respective coil and a second end disposed at an outer perimeter of its respective coil. A first crossover disposed in the second conductive layer is directly connected to the first end of the first coil and extends past the outer perimeter of the first coil. In addition, a second crossover disposed in the first conductive layer is directly connected to the first end of the second coil and extends past the outer perimeter of the second coil.

Abstract: A transformer device includes a glass substrate having a first side and a second side arranged opposite the first side. A first recess is formed at the first side of the glass substrate. A second recess is formed at the second side of the glass substrate. The first and second recesses are arranged opposite to each other. A first coil is arranged in the first recess and a second coil is arranged in the second recess.

Abstract: Ceramic inductors are made from stacked sheets of co-fired ceramic. At least one of the ceramic sheets has a slot with a conductor disposed in the slot. The conductor has a thickness equal to a thickness of the ceramic sheet containing the slot. The conductor has a large thickness (compared to prior art co-fired ceramic inductors) and therefore can carry large currents. The present ceramic inductor can be used in power electronics applications due to the ability to carry large currents. The present ceramic inductor preferably has an inductance that decreases with increasing current. A decreasing inductance characteristic tends to increase energy efficiency in a voltage regulator when the inductor is used as an output inductor. Specifically, the variable inductance tends to substantially increase energy efficiency at low current loads without adversely affecting efficiency at high loads.

Abstract: A multilayered miniature coil component, comprising a plurality of coil layers and insulating layers, the plurality of coil layers and insulating layers being alternately overlapped on each other. Each of the plurality of coil layers includes a plurality of coils and wires, each of the coils has a first and a second end, and a plurality of first conductive portions is disposed on each of the coil layers, at least one second conductive portion is disposed on at least one of the coil layers, and each of the plurality of insulating layers has a plurality of conductive through holes disposed correspondingly to the first conductive portions and the second conductive portions, thus through the plurality of wires, the first and the second conductive portions and the conductive through holes, the plurality of coils in each of the coil layers are composed as a circuit loop.

Abstract: A transformer having a structure in which first and second substrates are vertically laminated, including: a plurality of input conductive lines disposed on the first substrate along a circumference thereof; a single output conductive line disposed co-planarly with the plurality of input conductive lines, and having one end connected to a ground; and an air bridge including a pair of conductive via holes formed in any one conductive line in an overlapped area in which the input and output conductive lines are intersected with each other to penetrate through the first substrate and a single piece of conductive line connecting the pair of conductive via holes to each other and disposed on the second substrate, thereby preventing a short-circuit between the input and output conductive lines.

Abstract: A laminated inductor having a laminate structure constituted by magnetic layers and internal conductive wire-forming layers, wherein the magnetic layer is formed by soft magnetic alloy grains, the internal conductive wire-forming layer has an internal conductive wire and a reverse pattern portion around it, and the reverse pattern portion is formed by soft magnetic alloy grains whose constituent elements are of the same types as those of, and whose average grain size is greater than that of, the soft magnetic alloy grains constituting the magnetic layer.

Abstract: A docking station is provided for a computing device. The docking station may be used by, for example, a mobile computing device, such as a cellular or wireless telephony/messaging device. The docking station includes a housing comprising a receiving surface top receive and retain the mobile computing device. An inductive signal transfer interface is included with the housing to inductively signal at least one of power or data to the mobile computing device. The docking station further provides an output component and processing resources. The processing resources are configured to detect placement of the mobile computing device on the receiving surface. The data is received from the mobile computing device, and an output is signaled to the output component based on the received data.

Abstract: An enhanced multi-layered structure is disclosed including an N number of inductor layers (N is an integer greater than one). Each inductor layer includes a substrate and at least one spiral inductors situated on the substrate. The inductor layers may be stacked and aligned with each other so that the electromagnetic fields of the spiral inductors on different inductor layers overlap (at least partially). The spiral inductors on the various inductor layers may be electrically coupled to each other so as to act at an overall inductor. The substrates may be very thin to reduce losses, increase the inductance, and lower the resistance of the overall inductor. The enhanced structure may further include ground planes disposed on top of and below the N inductor layers to provide shielding for the inductor layers. This enhanced structure enables a low loss, high Q inductor to be implemented in a high-performance circuit.

Abstract: A switchable transformer architecture is disclosed. The switchable transformer includes a primary winding, a secondary winding, and a tertiary winding, in which either the secondary winding or the tertiary winding establish a signal path to the primary winding, based on the position of switches, enabling transmission to either of two blocks sharing the transformer. The transformer architecture achieves high isolation between sharing blocks and low loss on the signal path.

Abstract: Integrated high frequency balanced-to-unbalanced transformers and inductors suitable for operation in high frequencies, such as radio frequencies. Embodiments disclosed give consideration to issues related to the layout of the top and bottom inductors for the minimization of capacitive effects between layers and methods of manufacturing thereof. The manufacturing process comprises forming of a first winding in a first metal layer; forming an insulating layer over at least the first metal layer; forming of a second winding in a second metal layer such that the second winding path has both a vertical and a horizontal displacement to the first conductive path, preferably with an overlap that is less than a full overlap; and forming shunts to ensure continuity of each of the first and second windings.

Abstract: A transformer in this invention comprises substrates constructing a primary winding, substrates constructing the secondary winding, and a core member disposed around the substrates. The substrates defining the primary winding are provided with insertion holes for passing a middle leg portion of the core member, and patterned conductors having one turn. The transformer further comprises an interlayer connection member. The interlayer connection member is located inwardly of the patterned conductors of the substrates defining the primary winding. The interlayer connection member is located on the same side of the patterned conductors defining the primary winding. The interlayer connection member is configured to establish the electrical connection of the patterned conductors defining the primary winding.

Abstract: There are is a planar transformer and a method of manufacturing the same that can prevent resin being coated from being separated from a conductor during the manufacturing of a transformer by forming a dummy pattern on a board. A planar transformer according to an aspect of the invention may include: a core part having a pair of cores electromagnetically coupled to each other; a board part having a plurality of boards disposed between the pair of cores and stacked upon one another; a pattern part having a power transmission pattern provided on at least one board of the plurality of boards of the board part and transmitting power being input, and a dummy pattern provided on the same board having the power transmission pattern thereon and separated from the power transmission pattern by a predetermined interval; and a resin part being coated over the at least one board of the plurality of boards, the at least one board having the pattern part thereon.

Abstract: Embodiments of the invention include transmission line transformers. According to one aspect, a multilayer transmission line transformer (TLT) includes a first set of two conductors forming a first clockwise spiral. The TLT includes a second set of two conductors forming a second counterclockwise spiral that is substantially coaxial with the first spiral.

Abstract: The chip-type coil component includes: a body; conductive patterns connected to each other so as to have a coil structure; and external electrodes formed on the bottom surface and the two surfaces in the length direction; wherein a height of the external electrodes in a thickness direction of the body is greater than a height from the bottom surface to a farthest conductive pattern therefrom among the conductive patterns and is less than a height from the bottom surface of the body to the top surface thereof. According to embodiments of the present invention, even in a case in which a chip-type coil component set contacts a metal can, interference such as short-circuits does not occur, and as a result, a chip-type coil component having excellent reliability can be acquired.

Abstract: In a disc-type coil that enables assuring a sufficiently high value of a flowing current to increase an output and comprises: a discoid insulating substrate 1; a conductor pattern 2 that is provided on each of both surfaces of the insulating substrate 1 so that through hole lands 22 and 23 are position on the outer circumferential side and the inner circumferential side of the insulating substrate 1, and that is arranged to be alternately folded back on both the surfaces of the insulating substrate 1; and through holes that are formed in the insulating substrate 1 and connect the through hole lands 22 and 23 of the conductor pattern 2, the plurality of through holes 6 are aligned and arranged in a radial direction c in each through hole land 23 on the inner circumferential side.

Abstract: A coil component is provided with a magnetic substrate made of magnetic ceramic material, a thin-film coil layer containing a coil conductor formed on one principal surface of the magnetic substrate, a plurality of bump electrodes formed on the principal surface of the thin-film coil layer, and an insulating resin layer formed on the principal surface of the thin-film coil layer excluding formation positions of the bump electrodes. Each bump electrode has an exposure surface on a bottom surface and on two side surfaces of a layered product composed of the magnetic substrate, the thin-film coil layer and the insulating resin layer. A corner of the each bump electrode has a notch portion. The insulating resin layer includes a center resin portion provided in a center of the principal surface of the thin-film coil layer and a plurality of corner resin portions provided in the notch portion of each bump electrode.

Abstract: A scalable MEMS inductor is formed on the top surface of a semiconductor die. The MEMS inductor includes a plurality of magnetic lower laminations, a circular trace that lies over and spaced apart from the magnetic lower laminations, and a plurality of upper laminations that lie over and spaced apart from the circular trace.

Abstract: An integrated magnetic element includes a conductive base, a bobbin, a winding coil, a first magnetic core assembly and a second magnetic core assembly. The conductive base includes a first conductive unit including a plurality of first conductive winding parts, a second conductive unit including at least one second conductive winding part, and a connecting part. The bobbin includes a bobbin body, a winding section, a channel and a plurality of insertion slots. The first conductive winding parts are inserted into corresponding insertion slots of the bobbin. The first magnetic core assembly is sheathed around the bobbin and partially embedded into the channel of the bobbin and the first holes of the first conductive winding parts. The second magnetic core assembly is sheathed around the second conductive unit of the conductive base and partially embedded into the second hole of the second conductive winding part.

Abstract: A stacked inductor with different metal thickness and metal width. The stacked inductor comprises top and bottom metal traces which are aligned with each other. The thickness and width of the top and bottom metal traces are different. The top and bottom metal traces are connected at the end of metal trace with via holes. The inductance is increased with the use of the mutual inductance between top and bottom metal layers The parasitic resistor is reduced due to the difference of the top and bottom metal widths.

Abstract: The invention is directed to inter-helix inductor devices. The inter-helix inductor device includes a dielectric substrate. An input end is disposed on the first surface of the dielectric substrate. A clockwise winding coil has one end connecting to the input end and at least one winding turn through the dielectric substrate. A counter clockwise winding coil includes at least one winding turn through the dielectric substrate, wherein the clockwise and counter clockwise winding coils are connected by an interconnection. An output end is disposed on the dielectric substrate, connects one end of the counter clockwise winding coil, and is adjacent to the input end.

Abstract: A multilayer inductor comprising a coil embedded in a magnetic portion, and a magnetic gap formed by a non-magnetic portion in part of a magnetic path, the magnetic portion being made of Ni ferrite, whose relative temperature coefficient ??ir of initial permeability at a frequency of 1 MHz is more than +10 ppm/° C. and +40 ppm/° C. or less between ?40° C. and +80° C., the non-magnetic portion being made of Zn ferrite containing more Zn than in the magnetic portion and having a Curie temperature Tc of ?50° C. or lower, and the Zn content changing continuously in boundary regions between the non-magnetic portion and the magnetic portion, whereby the thickness of the magnetic gap changes with the temperature.

Abstract: The wireless charging apparatus according to the preferred embodiment of the present invention includes a control unit performing a general control of a wireless charging process; a driving unit connected to the control unit to generate a wireless power signal to be transmitted according to the control of the control unit; a transmission coil unit connected to the driving unit as a coil structure in a dumbbel form and transmitting wireless power according to the wireless power signal, the turn loop having a major-axis side of which one side is longer than the other side and at least one area is formed in a form depressed inwardly; and a sensing unit connected between the transmission coil unit and the control unit to detect whether the wireless charging receiver is positioned corresponding to the transmission coil unit and transfer the detected state to the control unit.

Abstract: An encapsulated electronic device includes a magnetically permeable core structure which is exposed within and coplanar with a flat top surface of the device. A bottom surface of the core may be exposed within the bottom surface of the device. The bottom core surface may be recessed beneath, coplanar with, or protruding from the bottom surface of the device. Alternatively the bottom surface may be encapsulated within the device. A method for manufacturing the exposed core package includes positioning a first component relative to a second component before encapsulating the device. An improved planar magnetic core structure includes internal bevels having a radius greater than or equal to 15% and preferably 25%, 35%, or as much as 50% of the core thickness to reduce concentration of the magnetic field around the internal corners.

Abstract: Disclosed herein are various embodiments of widebody coil isolators containing multiple coil transducers, where integrated circuits are not stacked vertically over the coil transducers. The disclosed coil isolators provide high voltage isolation and high voltage breakdown performance characteristics in small packages that provide a high degree of functionality at a low price.

Abstract: An encapsulated electronic device includes a magnetically permeable core structure which is exposed within and coplanar with a flat top surface of the device. A bottom surface of the core may be exposed within the bottom surface of the device. The bottom core surface may be recessed beneath, coplanar with, or protruding from the bottom surface of the device. Alternatively the bottom surface may be encapsulated within the device. A method for manufacturing the exposed core package includes positioning a first component relative to a second component before encapsulating the device. An improved planar magnetic core structure includes internal bevels having a radius greater than or equal to 15% and preferably 25%, 35%, or as much as 50% of the core thickness to reduce concentration of the magnetic field around the internal corners.

Abstract: A multi-layered structure is disclosed for implementing an inductor. A first spiral inductor is situated on a first substrate layer, and one or more additional spiral inductors are situated on one or more additional substrate layers. The substrate layers are positioned such that they are substantially in parallel with each other and the spiral inductors on the various layers are aligned with each other. The spiral inductors are electrically coupled to each other by coupling structures to enable them to act as a single overall inductor. Such an overall inductor exhibits improved characteristics, such as a higher Q factor. Other components may be incorporated with and coupled to the overall inductor; thus, this multi-layered structure may be used to construct almost any circuit in which an inductor is implemented.

Abstract: An inductor including a primary coil coaxially arranged and operated in parallel with isolated secondary coils each including at least one loop winding with two open-circuited ports. At least one phase shifting device is arranged between open-circuited ports of at least one secondary coil. A method to operate an inductor by combining primary and secondary coils with phase shifting devices to get a wide tuning range is also provided. The method includes the step of phase shifting open-circuited ports of at least one secondary coil.

Abstract: According to a first aspect, a secondary side of contactless power transmission apparatus includes: a holding member which is physically separated from a primary side; a magnetic layer; a shield layer for shielding electromagnetic noise; and a heat insulation layer. The secondary coil is a planar coil and supported by the holding member, and at least the magnetic layer is laminated on one side of the planar coil and unified with the planar coil. According to a second aspect, the secondary side of the apparatus includes a plurality of magnetic layers. Each permeability of the magnetic layers is different from each other, and each of the magnetic layers forms a magnetic path with the primary side.

Abstract: A multi-phase coupled inductor includes a powder core material magnetic core and first, second, third, and fourth terminals. The coupled inductor further includes a first winding at least partially embedded in the core and a second winding at least partially embedded in the core. The first winding is electrically coupled between the first and second terminals, and the second winding electrically is coupled between the third and fourth terminals. The second winding is at least partially physically separated from the first winding within the magnetic core. The multi-phase coupled inductor is, for example, used in a power supply.

Abstract: An electronic component includes overlapping coils in a rectangular laminate to form a substantially annular orbit. The orbit passes about an intersection of diagonal lines of an insulator layer of the laminate and is divided into a first orbit portion and a second orbit portion by a straight line parallel to a short side of the insulator layer. When an orbit obtained by the axisymmetric movement of the first orbit portion relative to the straight line is defined as a third orbit portion, a part of the second orbit portion overlaps with a part of the third orbit portion, and the non overlapped portion of the second orbit portion is positioned closer to the intersection than the non overlapped portion of the third orbit portion. A via hole conductor is provided in a region outboard an outer side of the non overlapping portion of the second orbit portion and inboard an outer side of the non overlapping portion of the third orbit portion.