Abstract: The present invention includes electronic device workpieces, methods of semiconductor processing and methods of sensing temperature of an electronic device workpiece. In one aspect, the invention provides an electronic device workpiece including: a substrate having a surface; a temperature sensing device borne by the substrate; and an electrical interconnect formed upon the surface of the substrate, the electrical interconnect being electrically coupled with the temperature sensing device. In another aspect, a method of sensing temperature of an electronic device workpiece includes: providing an electronic device workpiece; supporting a temperature sensing device using the electronic device workpiece; providing an electrical interconnect upon a surface of the electronic device workpiece; electrically coupling the electrical interconnect with the temperature sensing device; and sensing temperature of the electronic device workpiece using the temperature sensing device.

Abstract: A supporting film is formed over an entire front surface of a base material, a heating resistor composed of a platinum film having a predetermined pattern is formed on the supporting film, and a protecting film is formed over an entire surface of the supporting film so as to cover the heating resistor. A heating structure having a diaphragm construction is constructed by forming a cavity under a region where the heating resistor is formed by removing a portion of the base material so as to extend to the supporting film from the rear surface side of the base material. The supporting film and the protecting film are each constituted by a silicon nitride film having an index of refraction of less than 2.25.

Abstract: Provided for herein is a temperature sensor and methods of making and using the same. In one embodiment, the temperature sensor comprises: a cover plate disposed at a first end of a substrate to form an interface portion; a sensing element disposed between the cover plate and the substrate to form an assembly; wherein the cover plate and substrate have relative dimensions so as to form a ledge at the first end; and wherein the cover plate is attached to the substrate at the ledge.

Abstract: A Platinum temperature sensor comprises a ceramic substrate and a platinum thin-film resistor applied to said ceramic substrate, a ceramic cover layer and a connecting layer generated from a ceramic green layer by pressure and temperature treatment. The ceramic cover layer is connected with the ceramic substrate in such a way via the connecting layer that the platinum thin-film resistor is sealingly encapsulated with regard to the environment.

Abstract: A temperature-dependent measuring resistance with low mass and thereby rapid response time has a conductor path provided with at least two connection contact pads. The conductor path is applied to a metal substrate with an insulation layer (membrane) situated thereon. A portion of the conductor path spans a recess of the substrate in a bridge-like manner. The conductor path is selectively covered by a passivation layer up to its connection contact pads.

Abstract: A temperature sensor according to the present invention includes a sensor body for sensing a temperature; a sheath pin core wire electrically connected to the sensor body; a connector electrically connecting between the sheath pin core wire and the lead wire; and a protection tube for containing the connector and the sheath pin core wire, and for protecting the connector and the sheath pin core wire. A connection portion between the sheath pin core wire and the lead wire is hardened by a ceramic material so that a molded portion is provided. A displacement limiting means is provided for limiting displacement of the molded portion exceeding a predetermined value in the protection tube. The present invention can sufficiently reduce the tension acting on a sheath pin core wire. Further, the present invention can provide an exhaust temperature sensor having a sufficiently low tension acting on the sheath pin core wire which can be effectively used in an internal combustion engine.

Abstract: A high-temperature detector comprises a temperature sensor comprising a high-temperature measuring element, a first connection and a second connection which are made of a high-temperature-stable material and which are connected to the measuring element. The high-temperature sensor is arranged in an elongate housing adjacent a first end thereof, and the housing comprises a first and a second conductor track produced from a high-temperature-stable material, the conductor tracks being connected to the first and second connections and extending in the direction of a second end of the housing. Furthermore, a connection point is provided, which is used for tapping a signal produced by the high-temperature sensor and which is arranged adjacent the second end of the housing. In order to produce such a device, the sensor is first provided and subsequently arranged in an opening of a first substrate adjacent a first end of the substrate.

Abstract: A Platinum temperature sensor comprises a ceramic substrate and a platinum thin-film resistor applied to said ceramic substrate, a ceramic cover layer and a connecting layer generated from a ceramic green layer by pressure and temperature treatment. The ceramic cover layer is connected with the ceramic substrate in such a way via the connecting layer that the platinum thin-film resistor is sealingly encapsulated with regard to the environment.

Abstract: A high temperature anemometer includes a pair of substrates. One of the substrates has a plurality of electrodes on a facing surface, while the other of the substrates has a sensor cavity on a facing surface. A sensor is received in the sensor cavity, wherein the sensor has a plurality of bondpads, and wherein the bond pads contact the plurality of electrodes when the facing surfaces are mated with one another. The anemometer further includes a plurality of plug-in pins, wherein the substrate with the cavity has a plurality of trenches with each one receiving a plurality of plug-in pins. The plurality of plug-in pins contact the plurality of electrodes when the substrates are mated with one another. The sensor cavity is at an end of one of the substrates such that the sensor partially extends from the substrate. The sensor and the substrates are preferably made of silicon carbide.

Abstract: A temperature sensor which features improved response characteristics and in which a thermistor element is contained in a metal enclosure in a state where a pair of electrode wires for taking out signals are connected in an exposed manner at two opposing end surfaces thereof. The temperature sensor comprises a metal enclosure 2, a thermistor element 3 contained in the metal enclosure, and a pair of electrode wires 4 connected to the two opposing end surfaces of the thermistor element in a form being exposed over the thermistor element in the metal enclosure to take out thermistor signals, wherein a distance H between the thermistor element and the metal enclosure is not smaller than 0 but is not larger than 0.3 mm.

Abstract: A method and device, employing positive-temperature-coefficient material, for sensing plural properties of a fluid, such as temperature and flow rate. Can be used in a wind gauge or in a device for sensing position of mechanical elements such as valve diaphragms. Single sensor device, with energy and ohmic resistors, produces two voltages which completely characterize temperature and flow rate of fluid under study.

Abstract: A sensor element, especially a temperature sensor (5) is proposed, having a sensitive area (11), whose electrical resistance changes under the influence of a temperature to which the sensitive area (11) is exposed. In this case, sensitive area (11) has a glass ceramic fusion (15) of a starting material containing at least one component which is furnished at least substantially with a surface metallization. The proposed temperature sensor (5) is especially suitable for use at temperatures in excess of 1000° C., at which it shows resistance characteristics like that of a platinum resistor.

Abstract: A temperature sensor is provided with a temperature-sensitive element on a surface of a monocrystalline substrate, wherein the temperature-sensitive element is made of a platinum thin-film resistor and is produced as an epitaxial layer. The monocrystalline substrate can be an electrically insulating material, preferably &agr;-Al2O3 or MgO. Alternatively, the substrate may be an electrically conducting material, such as silicon, with an electrically insulating epitaxial layer arranged between the substrate and the platinum thin-film resistor. The platinum thin-film resistor epitaxial layer is preferably deposited by physical vapor deposition (PVD), chemical vapor deposition (CVD), or molecular beam epitaxy (MBE).

Abstract: A platinum temperature sensor comprises a ceramic substrate (4) and a platinum thin-film resistor (2) applied to a main surface of said ceramic substrate. A protective intermediate layer (14, 16) comprises a ceramic layer (14) which, at least in the area of the platinum thin-film resistor (2), is evaporated on the main surface of the ceramic substrate (4) over the full area thereof, and a sintered ceramic paste layer (16) which is applied to the evaporated ceramic layer (14). A protective glaze (18) applied to the protective intermediate layer (14, 16).

Abstract: A temperature probe (10) including a cylindrical thermally conductive housing (10) and a temperature sensor (18) employing a resistive temperature element (22) mounted therein. The temperature sensor (18) is mounted at one end of the housing (12) by a thermally conductive potting material (50). Signal wires (36) electrically couple to the resistive element (22) extend through an elongated insulated member (30) and out of an end of the housing (12) opposite the sensor (18). Changes in the temperature of the housing are quickly transferred to the resistive temperature element (22) through the conductive potting material (50). In one embodiment, the probe (10) is combined with a pressure transducer (60) to provide a pressure and temperature sensing device.

Abstract: A thermistor having multiple metal layers about at least a portion of a semiconductor body. The thermistor includes a first thick film electrode layer, a reactive metal layer, a barrier metal layer and, optionally, a layer to facilitate attachment to an electrical contact. Also, a method of making the thermistor is described.

Abstract: A material regression sensor and a method of measuring the regression of a material in which the regression sensor includes spaced electrically conductive legs, and electrically conductive sensor element position between the legs and measurement leads electrically connected with the first and second legs.

Abstract: A sensor can be configured to generally include a flow channel block having a flow channel formed therein, and a sensor chip for sensing fluid flow, wherein a fluid in the flow channel surrounds the sensor chip. Alternatively, the sensor chip can be fastened at one side to a substrate and on another side of the substrate to a core tube inserted into the flow channel. This core tube provides electrical insulation and corrosion protection to the sensor chip, reduces flow noise, (and by the non-intrusive nature of the measurement) essentially eliminates the risk of fluid leakage, and maintains the fluid super-clean and contamination-free while improving structural integrity for the thermal measurements derived from the sensor chip. The use of such a core tube configuration also can protect the sensor from corrosion, radioactive or bacterial contamination, overheating, or freeze-ups.

Abstract: A robust sensor that incorporates the necessary physical structure and thermal characteristics is capable of measuring fluid flow and properties under harsh environmental conditions. The sensor die is made of a material with thermal conductivity tailored to provide the thermal transmission characteristics necessary to avoid saturation of the sensor, thus enabling the measurement of high mass flux airflow and liquid properties under high pressure and often harsh environments not previously available for silicon based sensors. The robust sensor further has internal vias for back-side electrical connection, thus avoiding electrical and mechanical interference with the measurements. All of these features come together to provide a microsensor which is capable of reliable, i.e. stable, wide dynamic range and rapid-response operation under harsh environments.

Abstract: The present invention discloses a temperature probe. The temperature probe includes a temperature-sensing chip contained in a ceramic holder. The temperature probe further includes a pair of high-temperature sustainable conductive lines connected to the temperature-sensing chip. The temperature probe further includes an electrical insulation layer wrapping over the ceramic holder and high-temperature sustainable conductive lines.

Abstract: A temperature probe (10) including a cylindrical thermally conductive housing (10) and a temperature sensor (18) employing a resistive temperature element (22) mounted therein. The temperature sensor (18) is mounted at one end of the housing (12) by a thermally conductive potting material (50). Signal wires (36) electrically couple to the resistive element (22) extend through an elongated insulated member (30) and out of an end of the housing (12) opposite the sensor (18). Changes in the temperature of the housing are quickly transferred to the resistive temperature element (22) through the conductive potting material (50). In one embodiment, the probe (10) is combined with a pressure transducer (60) to provide a pressure and temperature sensing device.

Abstract: In a thin film thermistor with a cutting portion of a metallic pattern for resistance adjustment, initially, the resistance is roughly adjusted by adjusting the film thickness of a second heat-sensitive film, and secondly finely adjusted by trimming the cutting portion by laser irradiation. Thus, the thin film thermistor with a resistance adjusted accurately can be produced.

Abstract: A sensor and associated circuitry for sensing and reacting to the presence of a fluid or other material having heat capacity. A positive-temperature-coefficient device initiates a switching step when the amount of heat-capacity material reaches a certain level, or is totally absent. The switching step may trigger an alarm or control circuit to rectify the fluid level.

Abstract: A sensing and measuring circuit, employing a positive-temperature-coefficient sensing device, for detecting the presence and approximately measuring the quantity or concentration of heat-absorptive substances such as water. May be used for sensing a quantity of rainfall or irrigation water, or for detecting and giving an alarm or initiating remediation for leakage of water, oil, or other fluids from confinement to an unauthorized location.

Abstract: A resistant based thermal probe including a nanometer sized four-leg filament integrated with a piezoresistive AFM type cantilever is created by depositing the filament structure onto the cantilever by a chemical vapor deposition technique where the cantilever is exposed to the flux of precursor gas. An incident electron beam causes a fragmentation of the gas molecules leaving a deposit behind which leads to a conductive deposit shaped as a multi-leg filament structure for thermal measurements of a sample. A deposited four leg filament structure has a mechanical rigidity, high spatial resolution, low thermal conductivity and thermal capacitance, fast response time, and in combination with a four point resistant measurement and lock-in technique, eliminates resistivity for increasing both the temperature sensitivity and the signal-to-noise ratio of the thermal probe.

Abstract: A method of depositing a thin metal film using photolithography is disclosed. The method includes the deposition of a sacrificial metal layer on a substrate. Photolithography processing forms a pattern on the sacrificial metal layer that is removed prior to sputter deposition of the thin metal film.

Abstract: A sensor element, especially a temperature sensor (5) is proposed, having a sensitive area (11), whose electrical resistance changes under the influence of a temperature to which the sensitive area (11) is exposed. In this case, sensitive area (11) has a glass ceramic fusion (15) of a starting material containing at least one component which is furnished at least substantially with a surface metallization. The proposed temperature sensor (5) is especially suitable for use at temperatures in excess of 1000° C., at which it shows resistance characteristics like that of a platinum resistor.

Abstract: Proposed is a passive, high-temperature-resistant resistor element for measuring temperature, the resistor element having an essentially interior insulating layer (9; 10) and two exterior conducting layers (8) of a ceramic composite structure; the conducting layers being connected to one another at the tip (11) of the resistor element; and the ceramic composite structure including trisilicon tetranitride, a metal silicide, and yttrium oxide or trisilicon tetranitride, a metal silicide, and a matrix phase of SixOyCzNw, where x signifies 1-2, y signifies 0-2, and w signifies 0-2. Further proposed is a combination element (3) of this resistor element and a sheathed type glow plug, for example.

Abstract: The present invention provides a thermistor-type temperature sensor equipped with a thermistor element having a thermistor section and electrode wires for acquiring thermistor signals that prevent breakage of electrode wires caused by high-frequency vibrations. Thermistor element (10) is equipped with thermistor section (11) and electrode wires (12) and (13) made of a dispersion-strengthened material having for its main component platinum or platinum alloy, and is insulated and held in cylindrical metal case (40) having opening (42) on one end by means of insulating powder (50). A bottomed, cylindrical metal protective tube (60) houses metal case (40) so that its bottom (61) covers opening (42). Heat-resistant adhesive (70) is juxtaposed in a gap between metal case (40) and protective tube (60) so as to seal opening (42) to-prevent insulting powder (50) from spilling into this gap from opening (42).

Abstract: Novel multilaminated nano-engineered devices and methods of forming multi-layer devices that exhibit quantum-confinement effects are disclosed. Benefits of multi-layer sensing, piezoelectric, photonic, biomedical, and thermal devices based on nanomaterials are disclosed. Quantum-confined device layer thickness can be in the range of 1 nm to 10 cm, a preferred thickness being less than 10 microns, and a most preferred thickness being less than 1 micron. Devices can be built using chalcogenides, oxides, nitrides, borides, phosphides, halides, silicates, hydrides, oxynitrides, oxycarbides, and other complex compositions. Sensors for monitoring environmental variables such as chemical composition are disclosed. These low-cost sensors comprise multiple layers in a laminated stack. Very high numbers of sensing layers (e.g., 500) may be incorporated into a single laminated sensor device. The sensors may be produced from nanostructured materials.

Abstract: A winding body has a winding area for receiving a winding, which winding area is formed by a winding carrier and two legs which define the winding area in axial direction and are connected with the winding carrier. A temperature sensor for measuring the temperature in the winding is arranged in the area of the winding carrier.

Abstract: A sensor with a planar effective sensor surface, for direct contact with the measuring medium. To achieve the effect that the sensor surfaces or the surfaces of the passivation layer applied to them are much less susceptible to dirt, the sensor surface is coated with a nanostructured surface, or a passivation layer, of reduced adhesiveness, structured in a way similar to the surface of a lotus leaf.

Abstract: In a temperature sensor including a pair of electrode wires for signal lead-out, bonded to both opposing end faces of a thermistor device, this invention aims at preventing peeling, of bond portions, between the electrode wires and the thermistor device. This object can be accomplished by sealing the thermistor device 3 and the bond portions between the thermistor device 3 and the electrode wires 4 by using an electrically insulating glass member 6, and holding the pair of electrode wires 4 by using a holding member 8 made of an electrically insulating ceramic while a gap is kept between them.

Abstract: A printed circuit board has a conductor path applied to a substrate having an electrically insulating surface, the conductor path preferably being constructed in the shape of a meander and containing connection areas with holes to which small contact plates are applied for the purpose of later bonding with connection leads. The small contact plates are applied in a hard soldering process with the aid of solder paste to the connection areas of the conductor paths and to the surface area of the substrate surface which is made of ceramic and exposed by the holes. It is consequently possible, dispensing with so-called bonding wires, to directly connect connection leads or bonding lugs electrically with the conductor path and mechanically with the printed circuit board. The printed circuit board is preferably designed as a measuring resistor, wherein the conductor path is applied as a resistance layer of platinum or platinum group metal in a thin film process to a small ceramic plate of aluminum oxide.

Abstract: A temperature sensor has a sensing element (13) consisting of a thermistor (11) and leads (12) and a sheath pin (15) containing core wires (14), to accurately detect temperature. A method of manufacturing such a temperature sensor includes the steps of connecting the leads to the core wires, arranging an insulator (130) around the sensing element, filling the insulator with an inorganic adhesive (135) to fix the sensing element in the insulator, arranging a metal cover (16) around the insulator, and joining an end of the metal cover to an end of the sheath pin.

Abstract: A sensor for temperature measurements has a temperature-dependent measuring element, which is arranged in one end of a quartz glass tube facing the measurement, wherein a connection line of the measuring element is guided to the outside through the other end of the quartz glass tube. The quartz glass tube is itself surrounded by a protective tube made of stainless steel, which is closed off at its end facing the measurement by a rotationally symmetric formed body, preferably a sphere made of stainless steel. A spacer made of electrically insulating material, preferably mica, is provided between the formed body or sphere and the measuring element.

Abstract: A temperature sensor includes a temperature detection element, a band-like flexible printed wiring board, and a thin, elongated protection pipe. The temperature detection element has a temperature detection metal foil resistor. The temperature detection element is attached to a distal end of the flexible printed wiring board. The protection pipe accommodates the flexible printed wiring board and the temperature detection element.

Abstract: An insulator 6 for holding electrode wires 4 is provided between a thermistor element 3 and a sheathed pin 5 which is a wiring, and the electrode wires 4, which are inserted into hole portions 6a of the insulator 6, are held therein not bonded to the insulator, whereby the vibration resistance of the electrode wires of the thermistor element is improved so that breaking of the electrode wires is prevented.

Abstract: A high-temperature detector comprises a temperature sensor comprising a high-temperature measuring element, a first connection and a second connection which are made of a high-temperature-stable material and which are connected to the measuring element. The high-temperature sensor is arranged in an elongate housing adjacent a first end thereof, and the housing comprises a first and a second conductor track produced from a high-temperature-stable material, the conductor tracks being connected to the first and second connections and extending in the direction of a second end of the housing. Furthermore, a connection point is provided, which is used for tapping a signal produced by the high-temperature sensor and which is arranged adjacent the second end of the housing. In order to produce such a device, the sensor is first provided and subsequently arranged in an opening of a first substrate adjacent a first end of the substrate.

Abstract: A temperature sensor, of the type including a body (2) holding flat pin connection terminals (3, 3′) connected to a sensitive element (4), which body is compound-filled in a cup (1), characterized in that the sensitive element is embedded in a thermal paste (5) that acts as a stop wall for the compound-filling material forming the body.

Abstract: For manufacturing of sensors, especially temperature sensors, respectively two connection bridges spaced in the grid of a continuous carrier strip with contact pads for later electrical and mechanical connection with respectively one sensor element in the continuous carrier strip are at least partially injection molded around with plastic, such that on the connection bridges at least two plastic bodies arise arranged at a distance to each other. Between plastic bodies of respectively adjacent connection bridges, spacer elements made of plastic are formed in the same injection operation, while contact pads and ends of the connection bridges remain free of plastic. In connection with the injection operation, the edges of the carrier strip are separated from the connection bridges by punching.

Abstract: The present invention discloses a temperature sensor. The temperature sensor includes an aluminum oxide substrate and a thin-film resistor having a specific temperature coefficient of resistance (TCR) disposed over the substrate. The temperature sensor further includes an aluminum oxide stress-relief layer covering the thin film resistor. The temperature sensor further includes a passivation layer covering the aluminum oxide stress-relief layer. The aluminum oxide stress-relief layer further has at least one resistor-trimming trench formed by removing a portion of the aluminum oxide stress-relief layer and thin-film resistor therefrom and the resistor-trimming trench is filled with a material of the passivation layer. In a preferred embodiment, the temperature sensor further includes a set of dummy pads for resistance-trimming measurement disconnected from the thin film resistor disposed on the substrate near the thin film resistor covered by the passivation layer.

Abstract: An electrical resistor has a resistance layer containing platinum or a platinum group metal, which is applied to an electrically insulating surface of a substrate, wherein the resistance layer is constructed as a thin layer element and is made of a physical mixture of finely dispersed ceramic and metal. Preferably, the ratio of finely dispersed ceramic to metal lies in a range of about 5 to 50% by weight. Preferably, the finely dispersed ceramic is selected from SiO, Sio2, Ta2O5, MgO, Al2O3, and mixtures thereof. The resistor is used as a reference resistor in a sensor (temperature sensor) together with a temperature-dependent measuring resistor, wherein both resistors are arranged on a common substrate.

Abstract: A thermistor element has a pair of electrodes formed in ohmic contact with and mutually opposite to each other on one of the surfaces of a thermistor body. These electrodes each have a thin-film contact layer and an external electrode layer which is formed either directly or indirectly over the contact layer and only on the surface on which these electrodes are formed opposite each other and is of a metallic material such as Au, Ag, Pd, Pt, Sn and their alloys.

Abstract: A temperature sensor is provided which includes a measurement element, which changes its electrical resistance when the temperature changes. The measurement element is located in a protective sleeve, which may be provided with openings. A terminal-side area of the measurement element including its terminals and the surrounding area of the protective sleeve is potted in a temperature-resistant, electrically nonconductive material. The terminals are connected directly to two conductors within a jacketed tube.

Abstract: The present invention provides a thermistor-type temperature sensor equipped with a thermistor element having a thermistor section and electrode wires for acquiring thermistor signals that prevent breakage of electrode wires caused by high-frequency vibrations.

Abstract: A method for producing a platinum-containing resistor, configured as a temperature sensor, includes applying a resistive coat to a ceramic support having a surface of electrically insulating material, covering an outer surface of the resistive coat with at least one layer of an electrically insulating material, which is preferably applied as a diffusion barrier in the form of an intermediate layer, and forming an electrode on the side of the resistive coat facing away from the substrate surface and spaced therefrom, using a thick-film technique. This electrode, comprising a layer of platinum, is covered by a glass passivation layer and is therefore surrounded by the electrically insulating material of the diffusion barrier and the glass passivation layer. The electrode is negatively electrically biased in relation to at least one connection of the resistive layer or the measuring resistor.

Abstract: A method and device, employing positive-temperature-coefficient material, for sensing plural properties of a fluid, such as temperature and flow rate. Can be used in a wind gauge or in a device for sensing position of mechanical elements such as valve diaphragms. Single sensor device, with energy and ohmic resistors, produces two voltages which completely characterize temperature and flow rate of fluid under study.

Abstract: A temperature sensor including a thermosensitive element and a ceramic body having a hollow section which surrounds the thermosensitive element airtightly. The thermosensitive element is formed on a heat-sensing surface side of the ceramic body having the hollow section. The hollow section is formed at a position which is shifted to the heat-sensing surface side with respect to the center of the temperature sensor. The ceramic body includes a heat-sensing surface side ceramic layer (1) having the thermosensitive element (4) disposed thereon, a spacer ceramic layer (3) having an aperture, and a substrate ceramic layer (2) serving as a substrate.

Abstract: An electrical resistor having an electrically insulating substrate has a planar conductor path, which is electrically and mechanically firmly connected to the substrate by at least two spaced-apart base portions arranged on the substrate, and the conductor path is provided at its ends with connection contact fields in the respective areas of the base portions. The electrical resistor is preferably used as a temperature-dependent measuring resistor having rapid responsiveness for measurement of through-flow gas streams in motor vehicle engine applications.