Resistance Element And/or Terminals Printed Or Marked On Base Patents (Class 338/307)
  • Patent number: 7154373
    Abstract: A surface mounting chip network component in which a network having three or more odd number of terminals are formed on the surface of an insulating substrate and Tomb Stone Phenomenon is suppressed. Even number of network circuits are formed on the surface of the insulating substrate (2) and the same number of terminals (1) are arranged, respectively, on the opposite sides of the insulating substrate (2). Alternatively, even number of network circuits are formed on the surface of the insulating substrate (2) and the terminals (1) are arranged on the side edges of the insulating substrate (2) point-symmetrically with respect to the center of the surface of the insulating substrate (2).
    Type: Grant
    Filed: March 25, 2002
    Date of Patent: December 26, 2006
    Assignee: Minowa KOA Inc.
    Inventor: Eiji Kobayashi
  • Patent number: 7131047
    Abstract: A test system includes a device under test and a test circuit board. The device under test includes a plurality of contacts configured to provide output signals. The test circuit board may convey the output signals from the device under test to an analyzer. The test circuit board may include a dielectric layer, a via extending through the dielectric layer, a conductor formed on the dielectric layer and a resistive annular ring having a predetermined resistance value. The resistive annular ring may be formed around the via and may be electrically coupled between the via and the conductor.
    Type: Grant
    Filed: April 7, 2003
    Date of Patent: October 31, 2006
    Assignee: Sun Microsystems, Inc.
    Inventors: Edward Hugh Welbon, Roy Stuart Moore
  • Patent number: 7089652
    Abstract: The present invention provides for a method for manufacturing flip chip resistors by applying a first electrode layer to a substrate to create at least one pair of opposite electrodes, applying a resistance layer between each pair of opposite electrodes, applying a first protective layer at least partially overlaying the resistance layer, applying a second protective layer at least partially overlaying at least a portion of the resistance layer, and applying a second electrode layer overlaying the first electrode layer, a portion of the resistance layer, and at least a portion of the second protective layer. The present invention provides for higher reliability performance and enlarging the potential soldering area despite small chip size.
    Type: Grant
    Filed: May 19, 2003
    Date of Patent: August 15, 2006
    Assignee: Vishay Intertechnology, Inc.
    Inventors: Leonid Akhtman, Sakaev Matvey
  • Patent number: 7088217
    Abstract: A shunt resistor of the present invention has a configuration including a substantially planar resistor (10) having a predetermined resistance value; a first fixed terminal plate (20) that has one end portion (21) connected to an edge of the resistor (10); and a second fixed terminal plate (30) that has one end portion (31) connected to the other edge of the resistor (10), that has a portion in the vicinity of the end portion (31) which is bent substantially in the shape of the letter ā€œUā€, and that opposes at least a portion of the first fixed terminal plate (20), wherein a plurality of terminal tabs (12) for taking a voltage drop in the resistor (10) as a voltage signal is provided protrusive from a side edge of the resistor (10), and lead wires (40) are connected to the terminal tabs (12).
    Type: Grant
    Filed: January 10, 2002
    Date of Patent: August 8, 2006
    Assignee: Matsushita Electric Works, Ltd.
    Inventors: Hideki Enomoto, Riichi Uotome, Narutoshi Hoshino
  • Patent number: 7049928
    Abstract: The resistor of the present invention comprises a substrate, a pair of electrodes, and a resistor element comprising rectangular sections connected to the pair of electrodes and a S-shaped section disposed between the rectangular sections and is free of trimming portion. At least one of the rectangular sections is trimmed to adjust the resistance. According to the construction of the present invention, a compact resistor of superior surge property can be obtained.
    Type: Grant
    Filed: May 30, 2001
    Date of Patent: May 23, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hiroyuki Yamada, Takeshi Iseki, Toshifumi Suejima
  • Patent number: 7038571
    Abstract: A printed circuit polymer thick film (PTF) resistor includes tolerance control material that substantially surrounds the resistor body and significantly improves the linearity of resistance vs. resistor length, and significantly reduces resistor-to-resistor and board-to-board fabrication variances. In one embodiment, the tolerance control material is the same metallic material as the printed circuit conductors, and is formed in two finger patterns on each side of the resistor body, each finger pattern connected to one terminal pad of the resistor. A layout cell is used for fabricating the PTF resistor. A method is used for fabricating the PTF resistor.
    Type: Grant
    Filed: May 30, 2003
    Date of Patent: May 2, 2006
    Assignee: Motorola, Inc.
    Inventors: Gregory J. Dunn, Jovica Savic, Remy J. Chelini
  • Patent number: 7034653
    Abstract: A semiconductor resistor comprises a resistor body formed on a semiconductor substrate and first and second conductive terminals electrically connected to the resistor body at opposite ends thereof. The semiconductor resistor further includes at least first and second conductive paths between at least one of the first and second conductive terminals and the resistor body. The at least one conductive terminal is configured such that a resistance of the at least one conductive terminal between the at least first and second conductive paths is substantially matched to a resistance of the resistor body between the at least first and second conductive paths. In this manner, a current distribution between the at least first and second conductive paths is substantially matched.
    Type: Grant
    Filed: January 30, 2004
    Date of Patent: April 25, 2006
    Assignee: Agere Systems Inc.
    Inventors: Dipankar Bhattacharya, John Christopher Kriz, Stefan Allen Siegel, Joseph E. Simko, Yehuda Smooha
  • Patent number: 6995984
    Abstract: The invention relates to an electronic assembly, in particular for low power consumption electric switching devices such as low power contactors, time relays or the like. In order to provide protection against input current pulses, an ohmic resistor (6) is provided in the form of a resistive layer that is applied by pressing.
    Type: Grant
    Filed: June 30, 2001
    Date of Patent: February 7, 2006
    Assignee: Moeller GmbH
    Inventor: Gerd Schmitz
  • Patent number: 6963054
    Abstract: A device for heating air, fluids and materials, in dry or wet environments powered in low voltage current or alternating or direct very safe allowable voltage, by increasing the temperature of any type of surface, whether flat or embossed, solid or open-work. The device includes electrodes coated with a layer of electrically resistant fluid or pasty substance. The assembly of devices is very thin, and is particularly designed for heating premises, swimming pools, pipes exposed to freezing, and container for warm food.
    Type: Grant
    Filed: December 14, 2000
    Date of Patent: November 8, 2005
    Inventor: Jean-Claude Couraud
  • Patent number: 6900718
    Abstract: The present invention relates to a resistive superconducting current limiter with a meandering shape. This current limiter avoids current density peaks at the turning points (12) or corners of the conductor track (10, 11) in that the central path of the fault current when limiting occurs is artificially increased by appropriate design of the turning points. For this purpose, conductor material is removed in the region of the inner edge of the turning points (13), or the electrical bypass is reinforced at its outer edge (14).
    Type: Grant
    Filed: October 29, 2002
    Date of Patent: May 31, 2005
    Assignee: ABB Research LTD
    Inventors: Makan Chen, Willi Paul, Martin Lakner, Jakob Rhyner
  • Patent number: 6880233
    Abstract: A fast heat rise resistor comprising a substrate, a foil bridge on the surface of the substrate, the foil bridge having an elevated portion and a contact portion, the elevated portion above the substrate, the contact portion in contact with the substrate, a conductive layer attached to the contact portion of said foil bridge. The activation energy and/or response time is reduced as the foil bridge is suspended over the substrate. Another aspect of the invention include a method of manufacturing the foil bridge and application to autoignition vehicle airbags.
    Type: Grant
    Filed: February 20, 2002
    Date of Patent: April 19, 2005
    Assignee: Vishay Intertechnology, Inc.
    Inventors: George V. Gerber, Anthony E. Troianello, Haim Goldberger
  • Patent number: 6882265
    Abstract: On a surface of a transfer sheet, a resistor paste is first patterned, and a binder resin thereof is then heat-cured to form resistor layers. Next, an electrode paste containing a binder resin, which has a thermosetting temperature lower than a thermosetting temperature and a glass transition temperature of the binder resin of the resistor layers, is patterned on surfaces of the resistor layers and is then heat-cured, thereby forming electrode layers. By the steps described above, powdered silver contained in the electrode layers is unlikely to ooze into the resistor layers.
    Type: Grant
    Filed: July 10, 2003
    Date of Patent: April 19, 2005
    Assignee: Alps Electric Co., Ltd.
    Inventors: Yoshihiro Taguchi, Shunetsu Satou
  • Patent number: 6876291
    Abstract: The present invention relates to an electrical resistor (1), in particular for measuring alternating currents of high frequency, comprising connectors (2, 3) for feeding the current to be measured and connectors (4, 5) for tapping the voltage to be measured and having a layered structure including at least one resistive layer (10), a return conducting layer (11) and any possibly provided insulating layers (7, 12, 21, 22, 24). To obtain a measuring resistance having a particularly good frequency response, a high long-term stability and an efficient cooling and which, moreover, is inexpensive to produce, it is provided for the resistive layer (10) together with the return conducting layer (11) and the possible insulating layers (7, 12, 21, 22, 24) to be part of a multilayered printed circuit board and to comprise a plurality of conductive tracks (14) extending from a central region of the resistive layer (10) towards outside.
    Type: Grant
    Filed: January 4, 2002
    Date of Patent: April 5, 2005
    Assignee: Lem Norma GmbH
    Inventor: Wolfram Teppan
  • Patent number: 6836207
    Abstract: A strip conductor comprises a first layer with at least one curved section. At least one region of the curved section provided with an additional layer having a smaller resistivity than the first layer. The at least one region is constructed such that resistance on tracks of different radii of curvature is approximately equalized.
    Type: Grant
    Filed: November 28, 2003
    Date of Patent: December 28, 2004
    Assignee: Tyco Electronics Amp GmbH
    Inventors: Rainer Nothhelfer, Thorsten Lange
  • Publication number: 20040239474
    Abstract: A printed circuit polymer thick film (PTF) resistor includes tolerance control material that substantially surrounds the resistor body and significantly improves the linearity of resistance vs. resistor length, and significantly reduces resistor-to-resistor and board-to-board fabrication variances. In one embodiment, the tolerance control material is the same metallic material as the printed circuit conductors, and is formed in two finger patterns on each side of the resistor body, each finger pattern connected to one terminal pad of the resistor. A layout cell is used for fabricating the PTF resistor. A method is used for fabricating the PTF resistor.
    Type: Application
    Filed: May 30, 2003
    Publication date: December 2, 2004
    Inventors: Gregory J. Dunn, Jovica Savic, Remy J. Chelini
  • Publication number: 20040227614
    Abstract: In one embodiment, an integrated circuit includes a thin film resistor, which includes a resistor material that has been deposited on a substrate surface within a channel defined by opposing first and second portions of a stencil structure formed on the substrate surface, the resistor material having an initial width determined by a width of the channel. The stencil structure has been adapted to receive a planarizing material that protects against reduction of the initial width of the resistor material during subsequent process steps for removing the stencil structure. A head mask overlays an end portion of the thin film resistor and a dielectric overlays the head mask, the dielectric defining a via formed in the dielectric above a portion of the head mask. A conductive material has been deposited in the via, coupled to the portion of the head mask and electrically connecting the thin film resistor to other components of the integrated circuit.
    Type: Application
    Filed: June 24, 2004
    Publication date: November 18, 2004
    Inventors: Siang Ping Kwok, Eric W. Beach, Philipp Steinmann
  • Patent number: 6816056
    Abstract: The present invention relates to the resistors used for detecting current in a current-carrying circuit as a voltage, and aims to provides a resistor which assures highly accurate measurement of resistance even if the measuring point is not precisely placed. To obtain the above purpose, the resistor of the present invention comprises a sheet metal resistor element (11) and separate metal terminals (12),(13) electrically connected to both ends of the sheet resistor element(11). These terminals (12),(13) are made of metal having the same or greater electrical conductivity than that of the resistor element (11). With the above configuration, resistance of the terminals can be made smaller than that of the resistor element. This enables to reduce the proportion of resistance of the terminals in the entire resistor, allowing to ignore its effect on fluctuation of resistance due to deviation in measuring points of a resistance measuring terminal.
    Type: Grant
    Filed: April 21, 2003
    Date of Patent: November 9, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Koichi Ikemoto, Yasuhiro Shindo, Norimitsu Chinomi
  • Patent number: 6801118
    Abstract: The present invention relates to the resistors used for detecting current in a current-carrying circuit as a voltage, and aims to provides a resistor which assures highly accurate measurement of resistance even if the measuring point is not precisely placed. To obtain the above purpose, the resistor of the present invention comprises a sheet metal resistor element (11) and separate metal terminals (12),(13) electrically connected to both ends of the sheet resistor element(11). These terminals (12),(13) are made of metal having the same or greater electrical conductivity than that of the resistor element (11). With the above configuration, resistance of the terminals can be made smaller than that of the resistor element. This enables to reduce the proportion of resistance of the terminals in the entire resistor, allowing to ignore its effect on fluctuation of resistance due to deviation in measuring points of a resistance measuring terminal.
    Type: Grant
    Filed: July 20, 2000
    Date of Patent: October 5, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Koichi Ikemoto, Yasuhiro Shindo, Norimitsu Chinomi
  • Patent number: 6791066
    Abstract: A transparency, e.g. a laminated windshield has a pair of spaced bus bars on an electric conductive member e.g. an electric conductive coating on a glass sheet. The perimeter of the coating is spaced from the peripheral edge of the sheet to provide a non-conductive strip. Ends the bus bars extend into the non-conductive strip to minimize/eliminate hot spots at the end portions of the bus bars. An additional feature to reduce hot spots includes bus bars having different lengths with portions of the coating between the bus bars not extending beyond the ends of the longer bus bar. In another, the windshield has a vision area, a bus bar between the top edge of the coating and the top edge of the vision area and a bus bar between the bottom edge of the coating and bottom edge of the vision area.
    Type: Grant
    Filed: July 24, 2002
    Date of Patent: September 14, 2004
    Assignee: PPG Industries Ohio, Inc.
    Inventor: Allen R. Hawk
  • Patent number: 6788187
    Abstract: The invention relates to an electric resistance element, which can be electromechanically regulated. A layer of a predeterminable width and thickness, consisting of an electrically conductive material with a constant specific electric resistance, is located on a substrate. At least one electric contact connection is also provided and an electric contact element can be displaced mechanically along the surface of said layer. The aim of the invention is to provide an appropriate resistance element that can be produced cost-effectively, with reproducible electric characteristics and a high resistance to wear, without a requirement for additional lubrication. To achieve this, according to the invention, a wear-resistant layer of uniform thickness is configured on the electrically condutive layer situated on the substrate. Said layer consists exclusively of a carbon similar to diamond and has a higher specific electric resistance than that of the layer.
    Type: Grant
    Filed: June 5, 2003
    Date of Patent: September 7, 2004
    Assignee: Fraunhofer-Gesellschaft zur Forderung der Angewandten Forschung E.V.
    Inventors: Carl-Friedrich Meyer, Hans-Joachim Scheibe
  • Patent number: 6781506
    Abstract: Disclosed is a resistor structure for embedding in a dielectric material including a thin film resistive material disposed on a surface of a conductive layer wherein the surface has an isotropic surface roughness having a Rz (din) value of 3 to 10 &mgr;m and a peak-to-peak wavelength of 2 to 20 &mgr;m.
    Type: Grant
    Filed: January 13, 2003
    Date of Patent: August 24, 2004
    Assignee: Shipley Company, L.L.C.
    Inventors: John Schemenaur, Rajan Hariharan, Marc Langlois, Craig S. Allen
  • Publication number: 20040130433
    Abstract: An arrangement of several resistors jointly positioned in one and the same well of a semiconductor device, as well as to a semiconductor device including at least one such arrangement of resistors, wherein the resistors, when viewed in a longitudinal direction of the resistors, are displaced in relation to one another.
    Type: Application
    Filed: September 16, 2003
    Publication date: July 8, 2004
    Inventors: Joachim Schnabel, Andre Schaefer, Xaver Obergrussberger, Sebastian Mosler
  • Publication number: 20040130436
    Abstract: A laser system and method for cleanly trimming or severing resistive links fabricated on an undoped gallium arsenide substrate without damaging or affecting adjacent circuit structures or the underlying or surrounding substrate is disclosed. The system comprises a laser source adapted to generate an output at a wavelength within the range of 0.9 to 1.5 &mgr;m, a resistive film structure formed on an undoped gallium arsenide substrate, and a beam positioner and alignment system to align the laser source with the target structure. The method comprises generating a laser output at a wavelength in a range of about 0.9 to 1.5 &mgr;m and directing the laser output to illuminate a resistive thin-film structure fabricated on a gallium arsenide substrate. The resistive film structure comprises a first layer of protective dielectric and a layer of resistive thin-film material. Preferably, a second layer of protective dielectric lies upon the layer of resistive thin-film material.
    Type: Application
    Filed: December 15, 2003
    Publication date: July 8, 2004
    Applicant: Anadigics, Inc.
    Inventors: Mark Steven Wilbur, Sheo Kumar Khetan
  • Publication number: 20040080397
    Abstract: A method of protecting a thick film resistor, including the steps of: providing a substrate having a plurality of conductive elements thereon; applying an electrically resistive material to a surface of the substrate, thereby forming the thick film resistor, the resistive material being electrically connected to at least one corresponding conductive element; curing the resistive material; and applying a coating over at least a substantial portion of the resistive material.
    Type: Application
    Filed: October 25, 2002
    Publication date: April 29, 2004
    Inventors: Mike Cubon, Jose A. Martinez, Ksawera Saletnik
  • Patent number: 6728479
    Abstract: The object of this invention is to provide a panel-type heating element having an excellent durability and high effectiveness in power saving. To attain this object, the present invention provides a panel-type heating element consisting of a base which a thin film containing zinc oxide and tin oxide can form a layer upon. The panel-type heating element is advantageously manufactured by a method comprising spraying a solution containing a zinc compound and a tin compound on a base. The solution then oxidizes by heating the base in a high temperature reaction chamber to form a thin film consisting of sediment containing zinc oxide and tin oxide on the surface of the base. As a result, the thin film gives the base excellent acid, water and chemical resistance, and heats quickly.
    Type: Grant
    Filed: June 7, 2002
    Date of Patent: April 27, 2004
    Assignee: Aoyagi (H.K.) Ltd.
    Inventor: Mizuho Tanaka
  • Publication number: 20040075528
    Abstract: A printed circuit heater and process for forming a printed circuit heater are described. The printed circuit heater is formed by depositing a thin metal layer onto a surface of a metal carrier foil, forming a composite. The thin metal layer has a thickness of about 0.1 &mgr;m to about 2 &mgr;m. The composite is attached to a substrate such that the thin metal layer is in contact with the substrate, forming a laminate. At least a portion of the metal carrier foil is selectively removed from portions of the laminate. The thin metal layer is patterned and etched such that the etched thin metal layer has a heat density of from about 0.5 watts/in2 to about 20 watts/in2 at working voltages from about 3 volts to about 600 volts. The remaining portions of the metal carrier foil, if any, can be selectively removed to thereby provide low resistance busses within the circuit, thus eliminating the need for multiple external connections, and to facilitate evenness of heat distribution.
    Type: Application
    Filed: October 22, 2002
    Publication date: April 22, 2004
    Applicant: OAK-MITSUI, Inc.
    Inventors: Derek C. Carbin, Jeffrey T. Gray, John A. Andresakis
  • Patent number: 6696916
    Abstract: The high-voltage resistor is of the vertical type, and is formed in a chip which includes a high-voltage region and a low-voltage region superimposed on the high-voltage region, both having a first conductivity type. An isolation region, at least partially buried, extends between the high-voltage region and the low-voltage region, and delimits a vertical resistive region connecting the high-voltage region to the low-voltage region.
    Type: Grant
    Filed: December 22, 2000
    Date of Patent: February 24, 2004
    Assignee: STMicroelectronics S.r.l.
    Inventors: Delfo Sanfilippo, Davide Patti
  • Publication number: 20040012479
    Abstract: The resistor of the present invention comprises a substrate, a pair of electrodes, and a resistor element comprising rectangular sections connected to the pair of electrodes and a S-shaped section disposed between the rectangular sections and is free of trimming portion. At least one of the rectangular sections is trimmed to adjust the resistance. According to the construction of the present invention, a compact resistor of superior surge property can be obtained.
    Type: Application
    Filed: May 30, 2001
    Publication date: January 22, 2004
    Inventors: Hiroyuki Yamada, Takeshi Iseki, Toshifumi Suejima
  • Patent number: 6680668
    Abstract: A fast heat rise resistor comprising a substrate, a foil bridge on the surface of the substrate, the foil bridge having an elevated portion and a contact portion, the elevated portion above the substrate, the contact portion in contact with the substrate, a conductive layer attached to the contact portion of said foil bridge. The activation energy and/or response time is reduced as the foil bridge is suspended over the substrate. Another aspect of the invention include a method of manufacturing the foil bridge and application to autoignition vehicle airbags.
    Type: Grant
    Filed: January 19, 2001
    Date of Patent: January 20, 2004
    Assignee: Vishay Intertechnology, Inc.
    Inventors: George V. Gerber, Anthony E. Troianello, Haim Goldberger
  • Patent number: 6677850
    Abstract: An electrical current sensor and utility electricity meter, the current sensor comprising a &pgr; resistor shunt configuration, wherein the resistors comprise layered conductors at substantially equal temperatures to provide a zero temperature coefficient sensor. A fiscal electricity meter is described together with a four-layered current sensor fabricated using PCB techniques.
    Type: Grant
    Filed: December 22, 2000
    Date of Patent: January 13, 2004
    Assignee: Sentec Ltd.
    Inventor: Andrew Nicholas Dames
  • Patent number: 6642835
    Abstract: A ceramic composite having at least one electrical resistor run integrated into the ceramic composite, with the composite including at least one layer that covers the resistor run toward the outside. The layer covering the resistor run has at least one opening through which the resistor run can be trimmed.
    Type: Grant
    Filed: August 30, 2000
    Date of Patent: November 4, 2003
    Assignee: Robert Bosch GmbH
    Inventor: Olaf Jach
  • Patent number: 6622374
    Abstract: A method of manufacturing a resistor foil, comprised of a copper layer having a first side and a second side. A tiecoat metal layer having a thickness of between 5 Å and 70 Å is disposed on the first side of the copper layer. A first layer of a first resistor metal having a thickness of between 100 Å and 500 Å is disposed on the tiecoat metal layer, and a second layer of a second resistor metal having a thickness of between 100 Å and 500 Å is disposed on the first layer of the first resistor metal. The first resistor metal has a resistance different from the second resistor metal.
    Type: Grant
    Filed: September 22, 2000
    Date of Patent: September 23, 2003
    Assignee: Gould Electronics Inc.
    Inventors: Jiangtao Wang, Michael A. Centanni, Sidney J. Clouser
  • Patent number: 6609292
    Abstract: A method of making a small chip resistor properly and efficiently is provided. This method makes chip resistors each of which comprises a unit substrate which is rectangular as viewed in plan and has a predetermined thickness, a resistor element provided on an upper surface of the substrate, and electrodes provided at opposite ends of the unit substrate.
    Type: Grant
    Filed: August 9, 2001
    Date of Patent: August 26, 2003
    Assignee: Rohm Co., Ltd.
    Inventor: Yoshio Kurita
  • Patent number: 6573521
    Abstract: Radiation source for emitting radiation in pulses with a duration and at intervals within chosen ranges, comprising at least one plate-shaped radiant element (1), and at least two electrical conductors coupled to the element(s). The source also includes at least one plate-shaped surrounding, thermally conductive element (2) being thermally coupled to a radiation element at its inner edge, and being thermally coupled to a cooling device (3) at its outer surface.
    Type: Grant
    Filed: December 22, 2000
    Date of Patent: June 3, 2003
    Assignee: Simrad Optronics ASA
    Inventor: Steinar Lind
  • Patent number: 6563214
    Abstract: An electronic component having a substrate on which one or more grooves are formed on its opposing side faces; electrodes formed on the groove and top and bottom faces of the substrate at a portion adjacent to the groove; and a circuit element formed between the electrodes. An electrode is also formed on the opposing side faces of said substrate at a portion other than the grooves. This structure enables to improve the reliability of a soldered portion even for small electronic components with about 10 &mgr;m thick electrodes such as chip resistors, chip capacitors, and chip inductors.
    Type: Grant
    Filed: July 27, 2001
    Date of Patent: May 13, 2003
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hiroyuki Yamada, Takeshi Iseki, Yasuharu Kinoshita
  • Patent number: 6535105
    Abstract: An electronic device and process of making the device is disclosed. The device includes a multi-sided body defined by a plurality of electrode plates arranged in a stack. A resin layer is applied to both conductive and semiconductive regions of the device, and metal is plated upon terminals to create a conductive element. The device may be a varistor, thermistor, resistor, or other microelectronic component having a multi-sided body and terminal structures that are capable of receiving a resin coating. The multi-sided body has a resin coating on at least a portion of an exterior surface, the resin coating substantially preventing plating of metal onto the exterior surface of the body. One suitable resin coating that may be employed is a thermoset resin comprising a B-staged divinylsiloxane-bis(benzocyclobutene)(i.e. “BCB”) resin dissolved in mesitylene solvent.
    Type: Grant
    Filed: March 16, 2001
    Date of Patent: March 18, 2003
    Assignee: AVX Corporation
    Inventors: Robert H. Heistand, II, John L. Galvagni, Jeffrey P. Mevissen, Robert Moffatt Kennedy, III
  • Patent number: 6529115
    Abstract: A precision surface mounted foil resistor has a substrate having top and bottom planar surfaces. A resistance foil is secured to the bottom surface of the substrate and extends over the bottom. A bending protector plate of non-conductive material is superimposed over the resistance foil. A solder material is located at two areas of the foil to provide electrical contact with the PCB. The bending protector element is thicker than the solder contact areas and is provided between the solder material.
    Type: Grant
    Filed: March 16, 2001
    Date of Patent: March 4, 2003
    Assignee: Vishay Israel Ltd.
    Inventors: Joseph Szwarc, Ilya Aronson
  • Patent number: 6529116
    Abstract: The passive component (1) has a first part (22) of a material with a first resistance value, which value can be lowered to a second value by laser trimming. The second value is at most one tenth of the first value and preferably less. The material crystallizes in a laser trimming process, which locally heats the material to at least a transition temperature. The material contains at least two different elements, which are preferably aluminum and germanium. The passive component (1) may be, for example, a resistor or a capacitor and may be part of a thin-film network of resistors, capacitors and/or inductors. In a resistor, it is preferred to have a second part (4) which contains a different resistance material with a resistance value lower than the first value and preferably higher than the second value.
    Type: Grant
    Filed: May 30, 2001
    Date of Patent: March 4, 2003
    Assignee: Koninklijke Philips Electronics N.V.
    Inventors: Jan Johannes Van Den Broek, Arjen Boogaard, Richard Antonius Fransiscus Van Der Rijt, Martinus Hermanus Wilhelmus Maria Van Delden, Willem Reindert De Wild, Andreas Hubertus Montree
  • Publication number: 20030016117
    Abstract: Resistive materials having resistivities that are axis dependent are provided. Such resistive materials having a resistivity in a first direction and a very different resistivity in an orthogonal direction. These resistive materials are particularly suitable for use as resistors embedded in printed wiring boards.
    Type: Application
    Filed: May 17, 2002
    Publication date: January 23, 2003
    Applicant: Shipley Company, L.L.C.
    Inventors: David D. Senk, John Schemenaur, Wen-Yi Lin, Andrew T. Hunt
  • Patent number: 6492896
    Abstract: There are provided a pair of upper surface electrodes 21, 31 at both end sections, which are opposed to each other, of the insulating substrate 1 made of alumina. There is provided a resistor body 4 on the substrate 1 so that the upper surface electrode 21 and both the end sections can be electrically connected with each other. On the pair of upper surface electrodes 21, 31, there are provided a pair of upper surface auxiliary electrodes 24, 34 made of material, the heat-resistance with respect to solder of which is superior to that of the upper surface electrodes 21, 31, so that the exposed sections of the upper surface electrodes 21, 31 can be completely covered with the pair of upper surface auxiliary electrodes 24, 34, wherein the pair of upper surface auxiliary electrodes 24, 34 are not directly connected with the resistor body 4. On the surface of the resistor body 4, there is provided a protective film 5 (a first protective film 51 to a third protective film 53).
    Type: Grant
    Filed: July 9, 2001
    Date of Patent: December 10, 2002
    Assignee: Rohm Co., Ltd.
    Inventor: Masaki Yoneda
  • Patent number: 6489882
    Abstract: A resistance layer, a buffering layer and a protective layer are formed in a predetermined area of a dielectric layer. An insulating layer is formed on the semiconductor wafer to cover the upper and side surfaces of the protective layer, the side surfaces of the buffering layer and the resistance layer, and the surface of the dielectric layer outside of the predetermined area. Two openings extending down to the protective layer are formed by performing a dry-etching process on the insulating layer. Two openings extending down to the buffering layer are formed by performing a first wet-etching process on the protective layer below the two openings of the insulating layer. Two openings extending down to the resistance layer are formed by performing a second wet-etching process on the buffering layer below the two openings of the protective layer.
    Type: Grant
    Filed: March 8, 2001
    Date of Patent: December 3, 2002
    Assignee: United Microelectronics Corp.
    Inventor: Jia-Sheng Lee
  • Patent number: 6489881
    Abstract: A low resistance high current sense resistor is formed on a semiconductor die using conventional semiconductor processing techniques. The resistor die has one or two resistive layers which are photolithographically divided into a plurality of series and parallel resistor sections connected to first and second main terminals. First and second sense terminals are connected across one or a pattern of plural ones of the resistors to produce an output related to the current between the main terminals. Fusible links permit the trimming of the final resistance value.
    Type: Grant
    Filed: October 27, 2000
    Date of Patent: December 3, 2002
    Assignee: International Rectifier Corporation
    Inventors: Jonas Aleksandravicius, Gene Pranauskiene, Algirdas Kaskonas, Aldo Torti
  • Publication number: 20020153367
    Abstract: A temperature control device comprising a heater element and a power source. The heater element having a conductive ink affixed to a substrate. The power source connected to the conductive ink to supply power to said conductive ink, thereby heating the heater element.
    Type: Application
    Filed: April 3, 2002
    Publication date: October 24, 2002
    Inventors: William S. Haas, William J. Haas
  • Patent number: 6469279
    Abstract: An image heating device includes a heater; a film having a surface in slidable contact with said heater and an opposite surface contactable to a recording material carrying an image; wherein the image on the recording material is heated by heat from said heater through said film; wherein said heater includes an elongated base material, a plurality of resistor extended in a longitudinal direction on said base material, and a temperature detecting element provided on said base material: wherein a resistance of a first portion of said resistor which is opposed to said temperature detecting element in the longitudinal direction of said resistor, has a resistance value higher than that in said second portion.
    Type: Grant
    Filed: March 7, 1997
    Date of Patent: October 22, 2002
    Assignee: Canon Kabushiki Kaisha
    Inventor: Yasumasa Ohtsuka
  • Patent number: 6469613
    Abstract: A resistive element includes a resistive film disposed on an insulating film, a current collector disposed apart from the resistive film at a given space, and an electrode conductive to the resistive film and the collector respectively. The insulating board is punched to form slits which split the electrode. The slits allow the resistive element to maintain creepage distances between the electrode. The resistive element accommodates downsizing requirement while restraining silver migration for eliminating shorts between the electrodes. As a result, a highly reliable resistive element is obtainable.
    Type: Grant
    Filed: August 20, 2001
    Date of Patent: October 22, 2002
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventor: Seiki Miura
  • Publication number: 20020125986
    Abstract: A high density resistor structure and a method for forming the structure are disclosed. The high density resistor structure can be constructed by an electrically insulative substrate; a refractory metal-silicon-nitrogen layer deposited on the top surface; and at least one resistor element patterned in the refractory metal-silicon-nitrogen layer in a plane parallel to the top surface. The method can be carried out by first providing the electrically insulative semiconductor substrate or a glass substrate, then sputter-depositing a TaSiN layer having a thickness between 200 Å and 2000 Å on top of the substrate; and then forming by a reactive ion etching technique at least one resistor element in the TaSiN film in a plane that is parallel to the top surface of the substrate.
    Type: Application
    Filed: January 12, 2001
    Publication date: September 12, 2002
    Applicant: International Business Machines Corporation
    Inventors: Cyril Cabral, Lawrence Clevenger, Louis Lu-Chen Hsu, Keith Kwong Hon Wong
  • Patent number: 6444960
    Abstract: A method and apparatus for heating a charging unit to an appropriate temperature in a uniform manner is provided. In accordance with one example embodiment of the present invention, a heater for use in a charger includes a base. First and second contacts are disposed on the base. A heating element couples the first contact and the second contact. The heating element has an energy density that increases approximately exponentially from a first energy density at locations distal from the first and second heat sink locations to a relatively higher second energy density at locations proximal to the first and second heat sink locations. The heater, according to further embodiments of the present invention, is disposed on an opposite side of the substrate layer from the AC electrode layer, and underneath the charger.
    Type: Grant
    Filed: January 11, 2002
    Date of Patent: September 3, 2002
    Assignee: Xerox Corporation
    Inventors: Alberto Rodriguez, John Stephen Facci, Heiko Rommelmann, Scott Weber, Joseph David La Russa, Jing Quing Song, Chris Snelling, Kenneth W. Pietrowski
  • Publication number: 20020105408
    Abstract: A resistor includes a mixture of at least one of a metal conductive oxide and a transition metal material with an insulating oxide. A method for producing such a resistor includes the steps of forming an electrode on one of an alumina substrate, a glass substrate and a glass tube; and flame-spraying a mixture of at least one of a metal conductive oxide and a transition metal material with an insulating oxide, thereby depositing the mixture on the one of the alumina substrate, the glass substrate and the glass tube.
    Type: Application
    Filed: January 25, 2002
    Publication date: August 8, 2002
    Inventors: Masaki Aoki, Mitsuhiro Ohtani, Shigeo Suzuki, Hideki Ashida
  • Patent number: 6429533
    Abstract: An electronic device includes a first conductive polymer layer sandwiched between a first external metal foil electrode and a first internal metal foil electrode, a second conductive polymer layer sandwiched between a second internal metal foil electrode and a second external metal foil electrode, a layer of fiber-reinforced epoxy resin bonding the first and second internal electrodes together, a first terminal providing electrical contact between the first internal electrode and the second external electrode, and a second terminal providing electrical contact between the second internal electrode and the first external electrode. In a preferred embodiment, the polymer layers exhibit PTC behavior, and the terminals are formed by a solder layer applied over a plated layer of conductive metal. Insulative layers are preferably provided on the external electrodes, and located so as to insulate the first and second terminals from each other.
    Type: Grant
    Filed: November 23, 1999
    Date of Patent: August 6, 2002
    Assignee: Bourns Inc.
    Inventors: Wen Been Li, Kun Ming Yang
  • Publication number: 20020097137
    Abstract: A fast heat rise resistor comprising a substrate, a foil bridge on the surface of the substrate, the foil bridge having an elevated portion and a contact portion, the elevated portion above the substrate, the contact portion in contact with the substrate, a conductive layer attached to the contact portion of said foil bridge. The activation energy and/or response time is reduced as the foil bridge is suspended over the substrate. Another aspect of the invention include a method of manufacturing the foil bridge and application to autoignition vehicle airbags.
    Type: Application
    Filed: January 19, 2001
    Publication date: July 25, 2002
    Inventors: George V. Gerber, Anthony E. Troianello, Haim Goldberger