Resistance Element And/or Terminals Printed Or Marked On Base Patents (Class 338/307)
  • Publication number: 20020084886
    Abstract: A method of fabricating high resistivity thin film resistors. An isolation region is formed on a substrate to isolate the active regions. A polysilicon layer is formed above the substrate. A diffusion barrier layer is formed above the polysilicon layer. Lightly doped ions are implanted in the polysilicon layer. The substrate is annealed at a high temperature. The diffusion barrier layer and the polysilicon layer are patterned to form a high-resistive thin film resistor. Spacers are formed on the sidewalls of the high-resistive thin film resistor.
    Type: Application
    Filed: February 7, 2002
    Publication date: July 4, 2002
    Inventor: Bing-Chang Wu
  • Publication number: 20020079308
    Abstract: A heater for a gas sensor has a first thermistor element and a second thermistor element arranged in an electrically parallel configuration. Each thermistor element may be deposited onto a substrate such that the first thermistor element extends about a perimeter of the substrate and the second thermistor element extends across a portion of the substrate intermediate the perimeter of the substrate. The thermistor elements are preferably fabricated of materials having differing thermal coefficients of resistivity. A method of heating the gas sensor includes disposing the two thermistor elements in an electrically parallel configuration over a surface of the substrate and passing an electric current through the elements.
    Type: Application
    Filed: October 29, 2001
    Publication date: June 27, 2002
    Inventors: Paul C. Kikuchi, Lone-Wen F. Tai, Walter T. Symons
  • Patent number: 6396387
    Abstract: In thin layer resistors comprising a patch of a layer of resistive material on an insulating substrate and means at spaced apart locations on the patch, the resistive material is formed of 95 to 99.5 wt % of a zero valence metal and between 5 and 0.5 wt % of a dielectric material.
    Type: Grant
    Filed: April 13, 1999
    Date of Patent: May 28, 2002
    Assignee: MicroCoating Technologies, Inc.
    Inventors: Andrew T. Hunt, Wen-Yi Lin, Shara S. Shoup
  • Patent number: 6369690
    Abstract: A resistor card for a potentiometer to measure the fuel in a fuel tank consists of a non-conductive substrate with a plurality of elongate conductive contacts deposited thereon. The contacts have an elevation above the surface of the substrate and the contacts are oriented in parallel relationship to each other to form a wiper track across which a wiper is moveable. To reduce the rate at which the upper surfaces of the contacts are worn away by movement of the wiper, an insulating or highly resistive filler material is deposited between the conductive materials which form the lands.
    Type: Grant
    Filed: March 6, 2000
    Date of Patent: April 9, 2002
    Inventor: Jack Chen
  • Patent number: 6362723
    Abstract: A chip thermistor is produced by first preparing green sheets containing a thermistor ceramic material and an organic binder, then applying a resistor paste on one or more of these green sheets and an inner electrode paste on some others, and forming a layered structure by stacking and compressing together specified numbers of these green sheets. The layered structure is then subjected to a firing process and outer electrodes are formed on oppositely facing pair of outer end surfaces of the layered structure. The chip thermistor thus produced has a main body of a thermistor ceramic material having a specified resistance-temperature characteristic, a pair of outer electrodes on its end surfaces, at least one resistor having resistance greater than 1&OHgr;, and at least one pair of inner electrodes opposite each other and separated from each other with the thermistor ceramic material in between.
    Type: Grant
    Filed: November 13, 2000
    Date of Patent: March 26, 2002
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Masahiko Kawase
  • Patent number: 6344973
    Abstract: The invention relates to a power module with a circuit arrangement provided with active semiconductor components and passive components and with a circuit substrate, whereby at least a portion of the active semiconductor components are soldered onto a DCB substrate and at least a portion of the passive components are printed in thick film technology on at least one ceramic substrate. The upper side of the DCB substrate is structured to form track conductors and connecting surfaces for receiving the active semiconductor components and passive components of the circuit arrangement. On the ceramic substrate, for each passive component, a first print layer is printed in thick film technology and at least one contact surface as additional print layer laterally adjoining the first print layer.
    Type: Grant
    Filed: July 13, 1999
    Date of Patent: February 5, 2002
    Assignee: Alcatel
    Inventors: Hans-Peter Feustel, Friedrich Loskarn, Reinhard Rückert
  • Patent number: 6331811
    Abstract: A thin-film resistor that enables a pattern to be simply formed by means of wet etching, that has an excellent resistance temperature characteristic, and that can be easily manufactured, and a method for manufacturing this thin-film resistor, as well as a wiring substrate with this thin-film resistor formed therein. A thin resistor film according to this invention has a structure in which crystal grains deposit in the matrix of amorphous titanium nitride. The thin resistor film is formed on a substrate. The crystal grains includes at least one of crystal titanium nitride and crystal titanium. The thin resistor film can be manufactured using a simple process and can provide a wide range of resistance values with a small tolerance and a temperature coefficient of resistance close to zero.
    Type: Grant
    Filed: June 7, 1999
    Date of Patent: December 18, 2001
    Assignee: NEC Corporation
    Inventors: Akinobu Shibuya, Koji Matsui
  • Patent number: 6329899
    Abstract: A method is provided for forming a patterned layer of resistive material in electrical contact with a layer of electrically conducting material. A three-layer structure is formed which comprises a metal conductive layer, an intermediate layer formed of material which is degradable by a chemical etchant, and a layer of resistive material of sufficient porosity such that the chemical etchant for said intermediate layer may seep through the resistive material and chemically degrade said intermediate layer so that the resistive material may be ablated from said conductive layer wherever the intermediate layer is chemically degraded. A patterned photoresist layer is formed on the resistive material layer. The resistive material layer is exposed to the chemical etchant for said intermediate layer so that the etchant seeps through the porous resistive material layer and degrades the intermediate layer. Then, portions of the resistive material layer are ablated away wherever the intermediate layer has been degraded.
    Type: Grant
    Filed: November 24, 1998
    Date of Patent: December 11, 2001
    Assignee: Microcoating Technologies, Inc.
    Inventors: Andrew T. Hunt, Wen-Yi Lin, Shara S. Shoup, Richard W. Carpenter, Stephen E. Bottomley, Tzyy Jiuan Hwang, Michelle Hendrick
  • Patent number: 6316752
    Abstract: For producing a heating element with a high heat-up rate and a predetermined resistance value for igniting airbag systems, a base member made of an aluminum oxide ceramic material is provided with a glass or glass ceramic coating. A layer of AuPd resinate is applied by screen printing over a large area of the ceramic coating which, if necessary, can be lapped and polished. The resinate layer is subsequently etched to form a resistive path having area-wise constrictions. The ends of the resistive path are subsequently contacted by a AgPd thick-film conductive paste, wherein the Pd content of a conductive paste determines the desired resistance value. After the thick-film conductive paste is dried and fired, the coated base member is subjected to a thermal treatment at temperatures in the range of 850-950° C. until the palladium in the resistor layer is uniformly distributed and the resistance value is stable.
    Type: Grant
    Filed: May 10, 2000
    Date of Patent: November 13, 2001
    Assignee: Schaffler & Co., Gesellschaft mbH
    Inventors: Walter Smetana, Karl Ochsenhofer
  • Patent number: 6317024
    Abstract: A resistor 1 is used in high-fidelity amplifiers for audio equipment. The resistor 1 includes a cylindrical resistor body 2, a tubular sheath 3 into which the resistor body 2 is coaxially inserted, and a conductive film portion 31a formed on the inside surface 3a of the sheath 3. The conductive film portion 31a faces to a resistance film 22 covering the surface of the resistor body 2 with an annular space 6. An insulating slit 32 is formed at a central point along the resistor axis 1a, separating the conductive film 31 into left and right parts that are electrically isolated from each other. The sheath covering the resistor body 2 prevents distortion of signals in the resistance film 22 caused by extraneous electrostatic induction charges.
    Type: Grant
    Filed: August 11, 2000
    Date of Patent: November 13, 2001
    Assignee: Takman Electronics Co., Ltd.
    Inventor: Taiko Orii
  • Patent number: 6310536
    Abstract: A printed circuit board having resistors formed therein. A conductive layer composed of two different metals is provided on top of an insulating layer in a printed circuit board. The first metal layer is highly conductive and the second metal layer is highly resistive. For a major portion of the layer, both layers are connected electrically in parallel so that they provide a highly conductive path. At selected locations throughout the printed circuit board, the highly conductive metal is removed providing only the high resistivity metal to act as a resistor between selected locations in the conductive layer. Many resistors are formed at the same time, thus providing ease of fabrication and precision in resistor values across the entire printed circuit board. Following the formation of the resistor, additional insulating and conductive layers are formed to complete the printed circuit board.
    Type: Grant
    Filed: December 23, 1998
    Date of Patent: October 30, 2001
    Assignee: Cray Inc.
    Inventor: Steven V. R. Hellriegel
  • Patent number: 6304167
    Abstract: A resistor for use in high density printed circuit board, having low current noise and improved resistance accuracy, and a method of manufacturing the resistor. A resistor of the present invention includes a substrate, a pair of upper-surface electrode layers formed on the end sections of the upper surface of said substrate, a resistor layer formed so that the layer is connected electrically to said upper-surface electrode layers, a first trimming groove formed by cutting said resistor layer, a resistance restoring layer which is formed to cover at least said first trimming groove, a second trimming groove formed by cutting the resistance layer and resistance restoring layer, and a protective layer provided to cover at least the resistance layer and second trimming groove. In this way, the resistors having a superior property in both the current noise characteristic and the resistance accuracy are obtained.
    Type: Grant
    Filed: April 13, 2000
    Date of Patent: October 16, 2001
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventor: Shogo Nakayama
  • Patent number: 6292091
    Abstract: A resistor includes an insulating substrate, a resistive layer formed on the substrate, and first and second terminal electrodes connected to the resistive layer. The resistive layer is divided into at least a first portion of greater resistance and a second portion of smaller resistance. The first portion is closer to the first terminal electrode than the second portion is. A trimming groove is formed in the second portion for adjustment of the resistance of the resistor.
    Type: Grant
    Filed: July 21, 2000
    Date of Patent: September 18, 2001
    Assignee: Rohm Co., Ltd.
    Inventors: Shigeru Kambara, Toshihiro Teramae
  • Patent number: 6246312
    Abstract: A resistor network for terminating active electronic circuits such as stub series terminated logic and emitter coupled logic circuits. The network has a substrate with top and bottom surfaces and a common via extending through the substrate. Several resistor pairs are located on the first surface surrounding the common via. Each resistor pair has first and second vias. Resistors are connected between the first and second vias. Several solder spheres are located on the bottom surface. Each of the solder spheres are electrically connected to one of the first, second or common vias.
    Type: Grant
    Filed: July 20, 2000
    Date of Patent: June 12, 2001
    Assignee: CTS Corporation
    Inventors: David L. Poole, Robert L. Reinhard, Richard O. Cooper, Richard S. DeMars
  • Patent number: 6242999
    Abstract: A pair of upper electrode layers 12, connected to resistor layer 14, is formed with a gold system electro-conductive material containing glass frit on the side portion towards the edge of the upper surface of substrate 11. The adhesive strength of which electrode layer to the substrate 11 is strong enough and the electrode layer withstands a thermal stress and a corrosive environment. A resistor thus manufactured maintains its superior electrical characteristics with a high operational reliability even in the harsh operating environment where there is a thermal amplitude lasting for a long term, in a corrosive atmosphere, etc.
    Type: Grant
    Filed: January 20, 1999
    Date of Patent: June 5, 2001
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Shogo Nakayama, Seiji Tsuda, Akio Fukuoka
  • Patent number: 6238992
    Abstract: A method for manufacturing resistors comprising the steps of forming a top electrode layer on a top face of a substrate, a resistance pattern connected to the top electrode layer, a protective layer covering the resistance pattern, a thin metal film side electrode layer on a side face of the substrate which is electrically connected to the top electrode layer, and a concavity by removing a part of the side electrode layer and substrate.
    Type: Grant
    Filed: January 11, 1999
    Date of Patent: May 29, 2001
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventor: Hiroyuki Yamada
  • Patent number: 6237411
    Abstract: A limit-level sensor for measuring level of a liquid has a resistance element which has an electric resistance which suddenly varies a transition temperature which lies above the maximum liquid temperature. The resistance element is first heated by electric current. Thereupon, the electric resistance of the resistance element is measured. When the resistance element is covered with liquid, the heat generated by the electric current is led away so that the temperature of the resistance element is less than its transition temperature. If the resistance element is not covered by liquid, this heat is scarcely led away, so that the temperature of the resistance element remains above the transition temperature.
    Type: Grant
    Filed: December 11, 1997
    Date of Patent: May 29, 2001
    Assignee: Mannesmann VDO AG
    Inventors: Ralf Schimmel, Stefan Lipfert, Joachim Acht, Werner Wallrafen
  • Patent number: 6232869
    Abstract: An FBT (fly-back transformer), its bleeder resistor (installed on the top of the FBT), and a device for coupling the bleeder resistor are disclosed. The bleeder resistor 100 is accommodated within a resistor case 180, and the resistor case 180 is installed on the top of an FBT case 110. A resistor pattern 140 is printed on the substrate 130 of the bleeder resistor 100. Openings 150 are formed within the wavy portions of the resistor pattern 140, and the resistor case 180 has a plurality of isolating sheets 160 within its interior 170, so that the isolating sheets 160 can be inserted into the openings 150. When manufacturing the bleeder resistor, the glass coating, the baking, the epoxy resin dipping are eliminated, but the voltage breakdown resisting property is improved. Further, the manufacturing cost is lowered owing to the simplification of the process.
    Type: Grant
    Filed: October 27, 1999
    Date of Patent: May 15, 2001
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventor: Dae Sung Choi
  • Patent number: 6232867
    Abstract: A method of fabricating a monolithic chip varistor includes the steps of preparing a varistor body including a plurality of varistor layers and at least one pair of internal electrodes; forming a first layer for each of a pair of external electrodes by applying a metal component and a glass component to an exterior portion of the varistor body, followed by heat treatment; forming a second layer for the external electrode on the first layer by applying a glass component, followed by heat treatment; forming a third layer for the external electrode on the second layer by applying a glass component that is different from the glass component used for forming the second layer, followed by heat treatment; forming a fourth layer for the external electrode on the third layer by applying a metal component that is different from the metal component used for forming the first layer, followed by heat treatment under the same heat treatment conditions as those used for the formation of the first layer; and forming a fifth
    Type: Grant
    Filed: August 22, 2000
    Date of Patent: May 15, 2001
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Yoshikazu Yoshida, Toru Tominaga, Tadashi Morimoto
  • Patent number: 6225608
    Abstract: A range cook top is provided with circular heating zones having a layer of resistive thin film thereon. Slots in the cook top separate the heating zones from the surrounding areas of the cook top. The heating zone includes a resistive layer elements formed by a rectangular layer surrounded by annular arcuate segments. Power supply bus bars are disposed around edges of the resistive layer elements. A dual heater has separately controlled rectangular and annular resistive elements. Temperature sensors are also provided.
    Type: Grant
    Filed: November 30, 1999
    Date of Patent: May 1, 2001
    Assignee: White Consolidated Industries, Inc.
    Inventor: Johan Källgren
  • Patent number: 6194990
    Abstract: A thin-film metal resistor (44) suitable for a multilayer printed circuit board (12), and a method for its fabrication. The resistor (44) generally has a multilayer construction, with the individual layers (34, 38) of the resistor (44) being self-aligned with each other so that a negative mutual inductance is produced that very nearly cancels out the self-inductance of each resistor layer (34, 38). As a result, the resistor (44) has a very low net parasitic inductance. In addition, the multilayer construction of the resistor (44) reduces the area of the circuit board (12) required to accommodate the resistor (44), and as a result reduces the problem of parasitic interactions with other circuit elements on other layers of the circuit board (12).
    Type: Grant
    Filed: March 16, 1999
    Date of Patent: February 27, 2001
    Assignee: Motorola, Inc.
    Inventors: Tien Lee, Lawrence Lach, Gregory J. Dunn
  • Patent number: 6172591
    Abstract: A conductive polymer device has three or more conductive polymer layers sandwiched between two external electrodes and two or more internal electrodes. The electrodes are staggered to create a first set of electrodes, in contact with a first terminal, alternating with a second set of electrodes in contact with a second terminal.
    Type: Grant
    Filed: March 5, 1998
    Date of Patent: January 9, 2001
    Assignee: Bourns, Inc.
    Inventor: Andrew Brian Barrett
  • Patent number: 6137086
    Abstract: A vehicle window assembly includes one or more resistance heating lines for electrically heating a section of the window area corresponding to a window wiper rest area. An opaque obscuration band is formed so as to define one or more elongate, relatively narrow wiper alignment apertures along a portion of the window at the wiper rest area. The aperture(s) defined by the obscuration band are positioned so as to be aligned with at least a portion of a heating line. In this manner, at least a portion of the heating line is visible from the exterior of the vehicle through the outer surface of the window.
    Type: Grant
    Filed: October 11, 1999
    Date of Patent: October 24, 2000
    Assignee: Libbey-Owens-Ford Co.
    Inventor: Archie J. Williams, Jr.
  • Patent number: 6130601
    Abstract: A thick-film resistor and a process for forming the resistor to have accurate dimensions, thereby yielding a precise resistance value. The resistor generally includes an electrically resistive layer and a pair of terminals, a first of which is surrounded by the second terminal, so as to form a region therebetween that surrounds the first terminal and separates the first and second terminals. The terminals are preferably concentric, with the second terminal and the region therebetween being annular-shaped. The resistive layer electrically connects the first and second terminals to complete the resistor. Each of the terminals has a surface that is substantially parallel to an upper and/or lower surface of the resistive layer and contacts the resistive layer. The surfaces of the terminals may be embedded in the resistive layer by printing the resistive material over the terminals, or may contact the upper or lower surface of the resistive layer by locating the terminals above or below the resistive layer.
    Type: Grant
    Filed: October 19, 1999
    Date of Patent: October 10, 2000
    Assignee: Motorola, Inc.
    Inventors: Vernon L. Brown, Gregory J. Dunn, Lawrence E. Lach
  • Patent number: 6114658
    Abstract: An encapsulating device having a material encapsulated therein comprises a asic body provided with a recess for receiving therein the material and formed by microsystem technology in such a way that the material is fully arranged within the recess. A diaphragm extends across the basic body and is implemented in microsystem or thin-film technology. The diaphragm is used for encapsulating the material in the recess of the basic body in such a way that the diaphragm extends in spaced relationship with the material. An electrically actuable heating means is provided for destroying the diaphragm so as to expose the material.
    Type: Grant
    Filed: January 4, 1999
    Date of Patent: September 5, 2000
    Assignee: Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
    Inventors: Mathias Roth, Hanns-Erik Endres, Hans-Rolf Trankler
  • Patent number: 6084502
    Abstract: The present invention is directed towards a resistor which has higher load-, surge-, and pulse-resistant characteristics and is capable of having a resistance adjusted at a higher rate of precision. A pair of electrodes 12 and a main resistance path 13 between the two electrodes 12 are mounted on a substrate 11. The main resistance path 13 is joined to a set of first rungs 14 which extend parallel to the main resistance path 13 and are joined with two first connecting paths 15 to form a first ladder-like resistance path for rough adjustment of the resistance which is connected to a part of the main resistance path 13. Also, a second ladder-like resistance path for fine adjustment of the resistance which comprises a set of second rungs 16 extending vertically from the main resistance path 13 and two second connecting paths 17 joining the second rungs 16 together is formed and connected to a part of the main resistance path 13.
    Type: Grant
    Filed: October 8, 1998
    Date of Patent: July 4, 2000
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Shuji Ariga, Takeshi Iseki
  • Patent number: 6046438
    Abstract: A heating element 2 comprises a substantially planar substrate 4 having a heating track or tracks 8 and a thermal sensor 10, in the form of a track or discrete component, disposed on one side of the substrate 4. The thermal sensor 10 is separated from the heating track 8 by a locally thinner portion 12 of the substrate 4. The sensor 10 may be located in, or surrounded by, the thinner portion 12.
    Type: Grant
    Filed: May 29, 1998
    Date of Patent: April 4, 2000
    Assignee: U.S. Philips Corporation
    Inventor: Sander Slegt
  • Patent number: 6034411
    Abstract: An integrated circuit inverted thin film resistor structure and method of manufacture having interconnect defining resistor contacts and leads resident within and coplanar with a supporting layer, resistive material uniformly overlaying the supporting layer and contacts, the resistive material diffused into the resistor/interconnect contact region.
    Type: Grant
    Filed: October 29, 1997
    Date of Patent: March 7, 2000
    Assignee: Intersil Corporation
    Inventors: William R. Wade, Jack Linn
  • Patent number: 6025772
    Abstract: A resistor card for a potentiometer to measure the fuel in a fuel tank consists of a non-conductive substrate with a plurality of elongate conductive contacts deposited. The contacts have an elevation above the surface of the substrate and the contacts are oriented in parallel relationship to each other to form a wiper track across which a wiper is movable. To reduce the rate at which the upper surfaces of the contacts are worn away by movement of the wiper, a non-conductive filler is deposited between the conductive materials which form the lands.
    Type: Grant
    Filed: July 8, 1998
    Date of Patent: February 15, 2000
    Inventor: Jack Chen
  • Patent number: 6023217
    Abstract: A resistor comprising a substrate, a pair of first top electrode layers disposed at least on the top face of the substrate, a resistance layer disposed so as to electrically connect with the first top electrode layers, a protective layer disposed so as to cover at least the resistance layer, and a pair of second top electrode layers disposed at least on the top faces of the pair of first top electrode layers. At least one of the pairs of first top electrode layers or second top electrode layers partially extends to the substrate side faces.
    Type: Grant
    Filed: January 7, 1999
    Date of Patent: February 8, 2000
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hiroyuki Yamada, Masato Hashimoto, Seiji Tsuda
  • Patent number: 5999080
    Abstract: A frequency dependent resistor in which the length of the current path across the resistor varies as a function of the frequency of the electrical signals being passed therethrough. The resistor uses the principal known as skin effect to direct relatively higher frequency signals through a longer path through the resistor than is experienced by signals having a relatively low frequency.
    Type: Grant
    Filed: February 9, 1999
    Date of Patent: December 7, 1999
    Assignee: Intersil Corporation
    Inventor: James P. Furino, Jr.
  • Patent number: 5994997
    Abstract: A thick-film resistor and a process for forming the resistor to have accurate dimensions, thereby yielding a precise resistance value. The resistor generally includes an electrically resistive layer and a pair of terminals, a first of which is surrounded by the second terminal, so as to form a region therebetween that surrounds the first terminal and separates the first and second terminals. The terminals are preferably concentric, with the second terminal and the region therebetween being annular-shaped. The resistive layer electrically connects the first and second terminals to complete the resistor. Each of the terminals has a surface that is substantially parallel to an upper and/or lower surface of the resistive layer and contacts the resistive layer. The surfaces of the terminals may be embedded in the resistive layer by printing the resistive material over the terminals, or may contact the upper or lower surface of the resistive layer by locating the terminals above or below the resistive layer.
    Type: Grant
    Filed: November 24, 1997
    Date of Patent: November 30, 1999
    Assignee: Motorola, Inc.
    Inventors: Vernon L. Brown, Gregory J. Dunn, Lawrence E. Lach
  • Patent number: 5966067
    Abstract: A thick film resistor assembly comprising: (a) an insulation substrate, (b) a resistor layer being formed on surface of the insulation substrate, (c) a pair of conductor pads comprising a first Ag conductor layer comprising Ag powder and palladium or platinum or mixtures thereof, disposed on the insulation substrate with predetermined spaces from the resistor layer to sandwich the resistor layer in a direction of its conductive resistance path; and (d) a second Ag conductor layer comprising a Ag conductor composition devoid palladium or platinum or mixtures thereof, disposed over the resistor layer and conductor pads at their respective edges to connect electrically the resistor layer to the conductor pads forming a conductive resistance path.
    Type: Grant
    Filed: December 14, 1998
    Date of Patent: October 12, 1999
    Assignee: E. I. du Pont de Nemours and Company
    Inventors: Mamoru Murakami, Hisashi Matsuno, Keiichiro Hayakwa
  • Patent number: 5917403
    Abstract: The present invention minimizes the deviations of desired fuse time in the resistors with fuse function, and this is made of a resistor layer 21 consisting of fine electro-conductive particles, fine glass particles having a melting temperature higher than the forming temperature of the fine electro-conductive particles, a solvent dispersing these particles uniformly, and metal caps 23 connecting resistor film 21 at the ends of substrate 22.
    Type: Grant
    Filed: March 7, 1997
    Date of Patent: June 29, 1999
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Masato Hashimoto, Akio Fukuoka
  • Patent number: 5914559
    Abstract: A resistance element which is formed on a substrate by resistors and which divides and supplies high voltage to an electron gun of a cathode ray tube, wherein part or all of the substrate is covered by a high resistance conductive material layer as a topmost layer, and a cathode ray tube having the same.
    Type: Grant
    Filed: May 16, 1997
    Date of Patent: June 22, 1999
    Assignee: Sony Corporation
    Inventors: Tsuneo Muchi, Kenichi Ozawa, Tsunenari Saito
  • Patent number: 5898360
    Abstract: A ceramic heater for a gas sensor has a heater substrate, a laminating substrate made of the same material as the heater substrate, and an electrode made of platinum and at least one lanthanide oxide disposed between the heater substrate and the laminating substrates. The ceramic heater exhibits improved durability without migration patterns, is free of cracks on the substrate, is free of short circuits in the heat electrode and is low in production cost.
    Type: Grant
    Filed: June 10, 1997
    Date of Patent: April 27, 1999
    Assignee: Samsung Electro Mechanics, Co., Ltd.
    Inventor: Chang-bin Lim
  • Patent number: 5889261
    Abstract: An electrically resistive heating element for liquids and a method of fabricating same. The heating element comprises a substrate formed of an electrically insulating material or formed of an electrically conductive material provided with an electrically insulating coating, whereby in both cases the substrate presents an electrically non-conductive surface on at least one side. First and second laterally spaced contact areas are disposed over the electrically non-conductive surface and a thermally sprayed resistive oxide layer is applied to the electrically non-conductive surface and disposed over or under parts of the contact areas to enable an electric current to be passed through the resistive oxide layer via these first and second contact areas.
    Type: Grant
    Filed: March 2, 1998
    Date of Patent: March 30, 1999
    Assignee: Deeman Product Development Limited
    Inventor: Jeffery Boardman
  • Patent number: 5867808
    Abstract: A force transducer includes an elongated lever arm attached to a substrate having a central portion and substantially planar tab regions that project outwardly from the central portion along first and second orthogonal force-detecting axes. The substrate undergoes localized strain approximately at the junctions of the tab regions and the central portion when an external force is applied to the free end of the lever arm. A thick film strain gauge material is screen printed directly onto the substrate in at least a first location and a second location and conductive pads on the substrate are electrically coupled to the thick film strain gauge material at each location to define a first strain gauge oriented along the first force detecting axis and a second strain gauge oriented along the second force detecting axis. The lever arm can be of a compliant construction to provide proprioreceptive feedback to a user.
    Type: Grant
    Filed: August 6, 1996
    Date of Patent: February 2, 1999
    Assignee: International Business Machines Corporation
    Inventors: Edwin J. Selker, Barton A. Smith, Boris Kamentser
  • Patent number: 5859407
    Abstract: A connecting board to be interposed between a base plate and a mounting board for bonding or joining them together is provided. A connecting board has a heating wire disposed inside a substrate thereof, a plurality of soft metal bodies which are easily deformable, and a first solder layer and a second solder layer formed on a first surface side protruded portion and a second surface side protruded portion of each of the soft metal bodies. By energizing the heating wire and melting the first and second solder layers, the connecting board can be bonded on a first surface side of the substrate to the base plate and on a second surface side of the substrate to the mounting board all at once. By energizing the heating wire, the base plate and/or mounting board can be separated from the connecting board with ease.
    Type: Grant
    Filed: July 15, 1997
    Date of Patent: January 12, 1999
    Assignee: NGK Spark Plug Co., Ltd.
    Inventors: Hajime Saiki, Kozo Yamasaki
  • Patent number: 5814366
    Abstract: In a method of manufacturing a multilayered ceramic substrate, a capacitor layer is formed on a green sheet of a low temperature co-firable ceramic by means of printing. The green sheet with the capacitor layer and a plurality of other green sheets are laminated together into a substrate laminate. Two release green sheets of alumina system each unsintered below 1,000.degree. C. are further laminated to the top and the bottom of the substrate laminate respectively. The obtained laminate is fired at a temperature ranging between 800.degree. and 1,000.degree. C. under pressure ranging between 2 and 20 kgf/cm.sup.2. The release green sheets adherent to the side surfaces of the substrate are removed after the firing. Subsequently, a wiring pattern is printed on the substrate, which is then fired at a temperature ranging between 800.degree. and 1,000.degree. C.
    Type: Grant
    Filed: July 17, 1996
    Date of Patent: September 29, 1998
    Assignees: Sumitomo Metal Electronics Devices Inc., Sumitomo Metal Industries, Ltd.
    Inventors: Junzo Fukuta, Koji Shibata, Nozomi Tanifuji, Masaya Hashimoto, Yoshiaki Yamade, Hidenori Kataura
  • Patent number: 5757076
    Abstract: A chip type electronic component is provided which includes a chip substrate having an opposite pair of end edges and an opposite pair of side edges between the pair of end edges. An opposite pair of first electrodes is formed in a layer on the chip substrate to extend from the end edges toward each other. Each first electrode has a narrower root portion closer to a corresponding end edge of the chip substrate and a wider head portion spaced from the corresponding end edge. An electronic element is formed in another layer on the chip substrate in electrical conduction with both of the first electrodes, and an insulating protective coating is formed on the chip substrate to entirely cover the electronic element together with the entire wider head portion of each electrode.
    Type: Grant
    Filed: October 14, 1997
    Date of Patent: May 26, 1998
    Assignee: Rohm Co., Ltd.
    Inventor: Shigeru Kambara
  • Patent number: 5754092
    Abstract: A resistor trimming method includes the steps of: forming a first slit from an edge of a resistor interconnecting first and second electrodes provided on an insulating substrate in the proximity of and parallel to the first electrode; forming a second slit as a continuation of the first slit toward to the second electrode perpendicularly to the first slit; forming a third slit from a point of the edge of the resistor and parallel to the first electrode, the point being shifted from the first slit toward the second electrode, the third slit having a greater length than the first slit in a direction along the first electrode; and forming a fourth slit as a continuation of the third slit toward to the second electrodes perpendicularly to the first slit.
    Type: Grant
    Filed: April 9, 1996
    Date of Patent: May 19, 1998
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Koichi Ishida, Masao Yonezawa, Mitsuhiro Hoshii
  • Patent number: 5640137
    Abstract: The present invention involves adding additional structures to a polysilicon resistor which do not significantly affect the resistance of the polysilicon resistor. These additional structures add to the area of the polysilicon resistor, and therefore reduce the self-induced temperature change caused by the voltage across the resistor. Since the resistance of the polysilicon resistor depends on its temperature, the reduction of the self-induced temperature change lowers the variation in the resistance value at different voltages.
    Type: Grant
    Filed: January 24, 1995
    Date of Patent: June 17, 1997
    Assignee: Zilog, Inc.
    Inventor: Bhaskar L. Mantha
  • Patent number: 5600296
    Abstract: A thermistor type temperature sensor having a substrate made from an electrically insulating ceramic plate. A thin or thick film detecting resistor is printed on the substratum. A thick or thin film pull-up resistor may also be printed on the substratum, and trimming of the resistors is possible. The ratio of B-constant values for the detecting resistor and the pull-up resistor may be selected so that it is locate between 0.4 to 0.9 or 1.1 to 1.5. The detecting resistor may be constructed from thermistor sections of the same composition and the sections may be connected in parallel or in series. The thermistor sensor can be connected to the pipe through which a gas passes. When the sensor is connected to the pipe, the angle of the measuring plane may be adjusted, so that a precise measurement can be obtained.
    Type: Grant
    Filed: October 14, 1994
    Date of Patent: February 4, 1997
    Assignee: Nippondenso Co., Ltd.
    Inventors: Kaoru Kuzuoka, Sotoo Takahashi, Masamichi Shibata, Susumu Shibayama
  • Patent number: 5592276
    Abstract: A heater includes a base plate, and a resistor, extending in a longitudinal direction of the base plate, for generating heat when a power supply is applied thereto. A recess, such as a hole or groove, is formed in the base plate in a longitudinal portion of the resistor, to bias the base plate to break at the longitudinal portion and to open a circuit including the power supply and the resistor, to safely prevent overheating or smoking of the heater.
    Type: Grant
    Filed: June 3, 1994
    Date of Patent: January 7, 1997
    Assignee: Canon Kabushiki Kaisha
    Inventors: Yasumasa Ohtsuka, Shunji Nakamura, Kouichi Okuda, Yohji Tomoyuki, Akira Hayakawa, Daizo Fukuzawa
  • Patent number: 5563572
    Abstract: A resistor of SMD (Surface Mounted Device) construction includes a film of a resistive alloy as a resistive track on two electrically separated carrier plate elements of copper, which are constructed as contact elements solderable to the terminals of a printed circuit board to thereby ensure good heat dissipation into a printed circuit board. In order to manufacture such resistors, a resistive film sufficient for a plurality of individual resistors is adhered to but electrically isolated from a large copper plate and the laminate formed thereby is split into the individual resistors after producing the individual resistive tracks and their electrical connections to the copper plate and after producing gaps between the plate elements for each track.
    Type: Grant
    Filed: May 23, 1994
    Date of Patent: October 8, 1996
    Assignee: Isabellenhutte Heusler GmbH KG
    Inventor: Ullrich Hetzler
  • Patent number: 5560851
    Abstract: A process for producing an electric heating element is disclosed whereby metallic heating conductors are embedded between ceramic insulating layers, and, as power supply leads and power outlet leads, contact recesses in the ceramic insulating layers are filled with an electrically conductive composition. The heating conductors, the power supply leads and the power outlet leads are applied to the ceramic layers in the green state as metallizing paste containing from 60 to 95% by weight of metal particles and from 5 to 40% by weight of inorganic powder, based on the total solids content of the paste. The ceramic layers with the applied metallizing pastes are then stacked on top of one another and then sintered.
    Type: Grant
    Filed: November 9, 1994
    Date of Patent: October 1, 1996
    Assignee: Hoechst CeramTec Aktiengesellschaft
    Inventors: Alfred Thimm, Heinz Groschwitz, Peter Besold
  • Patent number: 5557704
    Abstract: A kettle which includes a vessel that provides a chamber for holding water, a pouring spout for dispensing water from the chamber, and a handle for lifting and tilting the vessel during pouring, also includes an electric heating element in the form of a conductive track of a thick film printed circuit on a metal substrate that forms a heated portion of the vessel, the electric heating element being located externally of the chamber.
    Type: Grant
    Filed: December 2, 1994
    Date of Patent: September 17, 1996
    Assignee: Pifco Limited
    Inventors: Michael E. Dennis, David Huddart
  • Patent number: 5548268
    Abstract: Electrical resistors and resistor networks are provided on an insulative substrate with designated conductive terminations by direct and continuous writing of resistive lines in fine-line patterns between and over each two of neighboring terminations from heterogeneous resistive thick film compositions. The resistive lines of line width w and total length l between conductive terminations can be directly written by suitable writing apparatus to have a high aspect ratio n=l/w, thereby providing resistors and resistor networks of high resistance values on an overall substrate area significantly smaller than required for conventional thick film resistors of comparable resistance value and comparable operational characteristics.
    Type: Grant
    Filed: June 2, 1995
    Date of Patent: August 20, 1996
    Inventor: Franklyn M. Collins
  • Patent number: 5530418
    Abstract: A polysilicon resistor structure and a method by which the polysilicon resistor structure may be formed. A polysilicon resistor is formed upon the surface of a semiconductor substrate. A pair of dummy polysilicon layers is formed along opposite edges and separated from the polysilicon resistor. A pair of metal sidewalls is then formed upon the upper surfaces of the pair of dummy polysilicon layers, and a top metal layer is formed bridging the upper surfaces of the pair of metal sidewalls. The pair of dummy polysilicon layers, the pair of metal sidewalls and the top metal layer form an open ended cavity upon the semiconductor substrate within which structure the polysilicon resistor resides. The polysilicon resistor is separated from the structure by an insulating material which is not susceptible to outgassing of hydrogen.
    Type: Grant
    Filed: July 26, 1995
    Date of Patent: June 25, 1996
    Assignee: Taiwan Semiconductor Manufacturing Company
    Inventors: Shun-Liang Hsu, Han-Liang Tseng, Mou-Shiung Lin